Torsion structure of scanning galvanometer, scanning galvanometer and manufacturing method thereof

Abstract

A scanning galvanometer torsion structure, a scanning galvanometer, and a manufacturing method thereof. In the scanning galvanometer, a first separator, a torsion structure, a separator, and a reflector are sequentially stacked on a substrate and secured by welding. The stacked structure secured by welding enables complex structures with different hierarchical requirements to be realized in the off-plane direction, thereby improving the processing capability of large-scale off-plane structures of the scanning galvanometer to meet the design requirements of the scanning galvanometer. This makes the scanning galvanometer more compact and smaller overall, while also avoiding the use of MEMS processes to effectively control process costs.

Description

Technical Field

[0001] The present invention relates to the field of laser detection, and in particular to a torsion structure of a scanning galvanometer, a scanning galvanometer and a manufacturing method thereof. Background Art

[0002] With the rise of autonomous vehicle technology, lidar (LiDAR) is gaining increasing attention as a key detection component. As the name suggests, lidar is a radar system that uses laser beams to detect target characteristics such as position and speed.

[0003] LiDAR operates by transmitting a detection signal (a laser beam) toward a target. It then compares the received signal reflected from the target (the target echo) with the transmitted signal. After appropriate processing, it can obtain relevant target characteristics, such as range, direction, altitude, speed, attitude, and even shape. LiDAR can detect, track, and identify targets such as aircraft and missiles.

[0004] LiDARs are categorized into mechanical, hybrid solid-state, and pure solid-state. In solid-state LiDARs, to reduce costs and eliminate the mechanical rotating structure, one approach is to use MEMS galvanometers to integrate all mechanical components into a single chip, produced using semiconductor technology.

[0005] However, existing scanning galvanometers often have problems such as the mirror size being too small or the processing being too difficult. Summary of the Invention

[0006] The problem solved by the present invention is how to form a scanning galvanometer with a large mirror size without increasing the difficulty of the process.

[0007] In order to solve the above problems, the present invention provides a torsion structure of a scanning galvanometer, comprising: at least one torsion beam, wherein the at least one torsion beam is stacked and arranged on a partition.

[0008] Optionally, the at least one torsion beam and the partition are fixed by welding.

[0009] Optionally, the torsion structure includes: a first torsion beam and a second torsion beam, and an extension direction of the second torsion beam intersects with an extension direction of the first torsion beam.

[0010] Optionally, the first torsion beam and the second torsion beam are stacked in sequence, with the stacking direction being perpendicular to the extension direction of the first torsion beam and the stacking direction being perpendicular to the extension direction of the second torsion beam.

[0011] Correspondingly, the present invention also provides a method for forming a torsion structure of a scanning galvanometer, comprising: arranging at least one torsion beam stacked on a separator; and performing welding to fix the at least one torsion beam and the separator.

[0012] Optionally, the step of setting the at least one torsion beam includes: sequentially stacking a first torsion beam and a second torsion beam with intersecting extension directions on the partition, the stacking direction being perpendicular to the extension direction of the first torsion beam, and the stacking direction being perpendicular to the extension direction of the second torsion beam.

[0013] The present invention provides a scanning galvanometer, comprising: a substrate; a torsion structure, the torsion structure being stacked on the substrate and suitable for providing a torsion moment; a first spacer, the first spacer being located between the substrate and the torsion structure; a reflector, the reflector being stacked on the torsion structure; and a second spacer, the second spacer being located between the reflector and the torsion structure.

[0014] Optionally, the base, the torsion structure, the reflector, the first spacer and the second spacer are fixed by welding.

[0015] Optionally, the method further includes: solder, wherein the solder is located between the substrate, the torsion structure, the reflector, the first spacer, and the second spacer.

[0016] Optionally, the reflector is made of a non-weldable material; the assembly surface of the reflector is provided with a connection layer, and the connection layer is made of a weldable material.

[0017] Correspondingly, the present invention also provides a method for manufacturing a scanning galvanometer, comprising: providing a substrate; stacking a first partition on the substrate; stacking a torsion structure on the first partition; stacking a second partition on the torsion structure; stacking a reflector on the second partition; and performing welding to fix the substrate, the first partition, the torsion structure, the second partition and the reflector.

[0018] Optionally, between any two of the steps of providing a substrate, setting a first spacer, setting a torsion structure, setting a second spacer, and setting a reflector, the manufacturing method further includes: setting solder.

[0019] Optionally, before performing the welding step, the method further includes: fixing a stacking assembly by a clamp, wherein the stacking assembly includes the base, the first spacer, the torsion structure, the second spacer and the reflector.

[0020] Optionally, welding is performed after the first spacer, the torsion structure, the second spacer and the reflector are sequentially arranged on the substrate.

[0021] Optionally, the reflector is made of a non-weldable material; and before the step of stacking the reflector, the step further includes: forming a connection layer on the assembly surface of the reflector, wherein the connection layer is made of a weldable material.

[0022] Optionally, the material of the reflector is a weldable material; and before the step of stacking the reflectors, the step further includes: polishing the assembly surface of the reflector.

[0023] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0024] In the technical solution of the present invention, the first spacer, torsion structure, spacer, and reflector are sequentially stacked on a substrate and secured by welding. This stacked structure, secured by welding, enables the realization of complex, multi-layered structures in the off-plane direction, thereby improving the processing capability of off-plane structures to meet the design requirements of the scanning galvanometer. This makes the scanning galvanometer structure more compact and smaller overall, while also avoiding the use of MEMS processes to effectively control process costs.

[0025] In an optional embodiment of the present invention, solder is disposed between the base, the torsion structure, the reflector, the first spacer, and the second spacer. The choice of solder allows for controllable soldering process temperature. This controllable process temperature effectively minimizes deformation of the components, thereby improving the accuracy of the scanning galvanometer.

[0026] In an optional solution of the present invention, before welding, the stacking assembly can be fixed by a clamp. The stacking assembly may include a base, the first partition, the torsion structure, the second partition and the reflector. That is to say, after all structural components are stacked, the components are fixed by welding once, which not only simplifies the process and reduces the process steps, but also effectively improves the uniformity of the welding process between the components, balances the stress on the components, and reduces the possibility of deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figures 1 to 6 Schematic diagram of the structure corresponding to each step of an embodiment of a method for manufacturing a scanning galvanometer mirror of the present invention;

[0028] Figure 7 It is a structural schematic diagram corresponding to the steps of another embodiment of the method for manufacturing a scanning galvanometer of the present invention;

[0029] Figure 8It is a structural schematic diagram corresponding to another embodiment of the scanning galvanometer manufacturing method of the present invention. DETAILED DESCRIPTION

[0030] As can be seen from the background technology, the scanning galvanometer in the prior art has the problems of small mirror size and great processing difficulty.

[0031] From an optical perspective, small and micro-sized galvanometers can lead to insufficient light reflection, thus reducing the detection effectiveness of LiDAR. Therefore, some LiDAR products require galvanometers with large mirrors. However, the use of large mirrors makes the already limited space inside the LiDAR even more cramped.

[0032] Furthermore, existing scanning galvanometers are typically manufactured using MEMS technology. However, when the structural components are too large, the strength of the components cannot be guaranteed using MEMS technology. Furthermore, the processing cost of MEMS technology is too high, resulting in a cost disadvantage.

[0033] Furthermore, while existing metal-based scanning galvanometers can achieve complex structures within a single layer, they lack the ability to achieve multi-layered, off-plane structures. For example, while complex mirror surfaces can be machined, the simultaneous machining of different scanning galvanometer components is impossible, which increases the number of process steps and increases time and effort.

[0034] In order to solve the above technical problems, the present invention provides a method for processing a scanning galvanometer, comprising:

[0035] A substrate is provided; a first spacer is stacked on the substrate; a torsion structure is stacked on the first spacer; a second spacer is stacked on the torsion structure; a reflector is stacked on the second spacer; and welding is performed to fix the substrate, the first spacer, the torsion structure, the second spacer and the reflector.

[0036] In the technical solution of the present invention, the first spacer, torsion structure, spacer, and reflector are sequentially stacked on a substrate and secured by welding. This stacked structure, secured by welding, enables the realization of complex, multi-layered structures in the off-plane direction, thereby improving the processing capability of off-plane structures to meet the design requirements of the scanning galvanometer. This makes the scanning galvanometer structure more compact and smaller overall, while also avoiding the use of MEMS processes to effectively control process costs.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0038] refer to Figures 1 to 6The figure shows the structural schematic diagram corresponding to each step of an embodiment of a method for manufacturing a scanning galvanometer mirror of the present invention.

[0039] refer to Figure 1 and Figure 2 ,in Figure 2 yes Figure 1 A view of the structure in box 010 along direction A provides a substrate 110 .

[0040] The substrate 110 serves as a base of the scanning galvanometer, can provide a foundation for the manufacture and assembly of the scanning galvanometer, and also provide mechanical support for other structural components of the scanning galvanometer.

[0041] In some embodiments of the present invention, in the step of providing the substrate 110, the substrate 110 is disposed on the processing jig 100. Figure 1 As shown, a plurality of substrates 110 are provided on the processing jig 100. Specifically, M×N substrates 110 are provided on the processing jig 100. At the same time, the scanning galvanometer is manufactured based on the M×N substrates 110, and finally, M×N finished scanning galvanometers can be obtained at the same time. This approach can realize batch processing of scanning galvanometers. In addition, in other embodiments of the present invention, multiple substrates can also be arranged in sequence on a flow production line to realize batch processing of scanning galvanometers.

[0042] like Figure 1 As shown, in this embodiment, the base 110 is rectangular. In other embodiments of the present invention, the base may also be in other shapes such as a frame or a circle.

[0043] Afterwards, refer to Figure 3 A first separator 112 is stacked on the base 110 ; and a torsion structure 120 is stacked on the first separator 112 .

[0044] It should be noted that Figures 3 to 5 All are related to Figure 2 The corresponding view.

[0045] The torsion structure 120 is used to support the reflector and provide torque for the reciprocating motion of the reflector; the first separator 112 is used to support and fix the torsion structure 120 on the base 110, and occupy space between the torsion structure 120 and the base 110 to form a gap, thereby providing a margin for the vibration of the torsion structure 120 and the reflector.

[0046] In some embodiments of the present invention, between any two steps of the step of providing the substrate 110, the step of setting the first separator 112, and the step of setting the torsion structure 120, the manufacturing method further includes: setting solder. By selecting the solder, the temperature of the subsequent welding process can be controlled. The controllable process temperature can effectively reduce the deformation of each component, which is beneficial to improving the accuracy of the formed scanning galvanometer. Among them, the selection of the solder is based on the material of the welding surface, considering the feasibility, convenience and cost of the process operation. For example, if the welding surface is copper, nickel, etc., the solder can be selected as solder. On the one hand, solder is cheap, and solder can weld copper and nickel very firmly. On the other hand, soldering does not require too high a welding temperature, which is very friendly to precision parts such as galvanometers.

[0047] It should be noted that the type and thickness of the solder are related to the process parameters of the subsequent welding process, such as the process temperature and process time. Therefore, it is necessary to set the thickness of the solder based on the design requirements of the scanning galvanometer and the comprehensive consideration of the process parameters of the welding process. In general, the thickness of the solder needs to be set so that each stacked component remains parallel. Each stacked component is obtained by linear cutting or etching, and it is difficult to keep the thickness consistent at each location. For example, Figure 6 As shown, in this embodiment, the thickness of the substrate 110 and the first separator 112 are inconsistent, resulting in a distance D between one end of the first separator 112 and the surface of the substrate 110, and a distance d between the other end and the surface of the substrate 110. The thickness of the solder can be set to achieve thickness compensation, that is, to make up for the difference between the distance D and the distance d. Similarly, this situation will also occur between other stacked components. Then the solder can play the role of thickness compensation, and after the stacked components are combined together, they are made parallel to each other, improving the quality of the finished galvanometer, and can more accurately reflect lasers in lidar.

[0048] Specifically, such as Figure 3 As shown, after the base 110 is set on the processing jig 100 and fixed, the solder 111a is set above the base 110; the first separator 112 is set above the solder 111a; then the solder 111b is set above the first separator 112; and the torsion structure 120 is set above the solder 111b.

[0049] In some embodiments of the present invention, before performing the welding step, the manufacturing method further includes: fixing a stacking assembly by a clamp, wherein the stacking assembly at least includes the base 110 and the first separator 112 .

[0050] Specifically, after the solder 111 a , the first separator 112 , the solder 111 b , and the torsion structure 120 are provided, jigs or other auxiliary fixtures may be used to fix and align the various structural components.

[0051] It should be noted that the location of the solder 111a / 111b is determined based on the specific structure of the scanning galvanometer. The solder 111a is used to achieve a fixed connection between the first separator 112 and the substrate 110, and the solder 111b is used to achieve a fixed connection between the torsion structure 120 and the first separator 112. Therefore, the location of the solder 111a corresponds to the position of the first separator 112 on the substrate 110, and the location of the solder 112b corresponds to the contact position between the torsion structure 120 and the first separator 112.

[0052] In some embodiments of the present invention, the torsion structure 120 includes: at least one torsion beam, and the at least one torsion beam is stacked on the partition. Figure 3 and Figure 4 As shown, in this embodiment, the torsion structure 120 includes: a first torsion beam 121 and a second torsion beam 122 located on the first partition 112, and the extension direction of the second torsion beam 122 intersects with the extension direction of the first torsion beam 121. Specifically, the extension direction of the second torsion beam 122 is perpendicular to the extension direction of the first torsion beam 121. Figure 4 yes Figure 3 A view of the intermediate torsion structure 120 along direction B.

[0053] Combined with reference Figure 5 A second spacer 123 is stacked on the torsion structure 120 ; and a reflector 130 is stacked on the second spacer 123 .

[0054] The reflector 130 is used to reflect light; the second separator 123 is used to support and fix the reflector 130 on the torsion structure 120, and occupies space between the reflector 130 and the torsion structure 120 to form a gap, thereby providing a margin space for the vibration of the reflector 130.

[0055] In some embodiments of the present invention, the reflector 130 includes a reflective surface 132 and an assembly surface 131 disposed opposite to each other. The reflective surface 132 facing away from the substrate 110 is suitable for reflecting light, and the assembly surface 131 facing the substrate 110 is suitable for welding and installation.

[0056] It should be noted that if Figure 5As shown, in this embodiment, the reflector 130 is made of a non-weldable material; therefore, before stacking the reflector 130, the manufacturing method further includes forming a connecting layer 133 on the assembly surface 131 of the reflector 130, wherein the connecting layer 133 is made of a weldable material. Non-weldable materials refer to materials that cannot be welded, such as glass, quartz, sapphire, and silicon carbide, or iron-based metals that cannot be welded, such as stainless steel and cast iron, or metals that cannot be welded, such as aluminum. Weldable materials refer to materials that can be welded, such as weldable metals such as copper, gold, and silver.

[0057] It should also be noted that the step of forming the connecting layer 133 includes: forming the connecting layer 133 by electroplating or melt coating, that is, the connecting layer 133 is a plating layer or coating. In this embodiment, the connecting layer 113 adopts a standard coating process, such as evaporation or sputtering. Specifically, in this embodiment, the connecting layer 113 is formed by a standard evaporation coating process, that is, after successively undergoing the steps of pre-plating preparation, vacuuming, ion bombardment, baking, pre-melting, evaporation, removal, and film surface treatment, the connecting layer 113 is formed. In other embodiments of the present invention, the connecting layer is formed by a standard sputtering process, wherein the sputtering process includes at least one of ion sputtering and cathode sputtering.

[0058] In some embodiments of the present invention, between any two steps of the steps of providing the torsion structure 120 , providing the second spacer 123 , and providing the reflector 130 , the manufacturing method further includes: providing solder.

[0059] Specifically, such as Figure 5 As shown, after the torsion structure 120 is set, solder 124a is set above the torsion structure 120; the second partition 123 is set above the solder 124a; then solder 124b is set above the second partition 123; and the reflector 130 is set above the solder 124b.

[0060] In addition, in some embodiments, before performing the welding step, the manufacturing method further includes: fixing the stack assembly by a clamp, and the stack assembly may further include the torsion structure 120 , the second partition 123 and the reflector 130 .

[0061] Specifically, after the solder 124 a , the second separator 123 , the solder 124 b , and the reflector 130 are provided, jigs or other auxiliary fixtures may be used to fix and align the various structural components.

[0062] It should be noted that, in this embodiment, each time a component (such as the first separator 112, the torsion structure 120, the second separator 123, the reflector 130 or the solder 111a / 111b / 124a / 124b) is set, the various structural components are fixed and aligned with each other by a jig or other auxiliary fixtures. In other embodiments of the present invention, after the reflector is set, the stacking assembly can be fixed by a jig or other auxiliary fixture, and the stacking assembly includes the base, the first separator, the torsion structure, the second separator and the reflector. That is to say, after the various structural components are stacked, the stacking assembly is uniformly fixed by a jig or other auxiliary fixture, and the various structural components are aligned with each other.

[0063] It should also be noted that the location of the solder 124a / 124b is determined based on the specific structure of the scanning galvanometer. The solder 124a is used to securely connect the second partition 123 to the torsion structure 120, while the solder 124b is used to securely connect the second partition 123 to the reflector 130. Therefore, the location of the solder 124a corresponds to the position of the second partition 123 on the torsion structure 120, while the location of the solder 124b corresponds to the contact point between the second partition 123 and the reflector 130.

[0064] Combined with reference Figure 5 A welding process 140 is performed to fix the base 110 , the first spacer 112 , the torsion structure 120 , the second spacer 123 and the reflector 130 .

[0065] In some embodiments of the present invention, after the first spacer 112, the torsion structure 120, the second spacer 123 and the reflector 130 are sequentially arranged on the base 110, a welding process 140 is performed. That is, after all the structural components are stacked, the components are fixed by welding once, which not only simplifies the process and reduces the process steps, but also effectively improves the uniformity of the welding process between the components, balances the stress on the components, and reduces the possibility of deformation.

[0066] Specifically, the welding process 140 may be performed by using a welding furnace or a welding machine to complete the fixation between the various structural components of the scanning galvanometer.

[0067] It should be noted that in some embodiments of the present invention, after the welding process is performed to secure the various structural components, the manufacturing method further includes post-welding processing. Specifically, the post-welding processing includes removing the fixing fixtures and jigs, trimming burrs and scraps, and other processes to obtain the finished scanning galvanometer.

[0068] refer to Figure 7 A structural schematic diagram corresponding to the steps of another embodiment of the method for manufacturing a scanning galvanometer mirror of the present invention is shown.

[0069] The present invention will not further elaborate on the similarities between this embodiment and the previous embodiment. This embodiment differs from the previous embodiment in that the reflector 230 is made of a weldable material. Therefore, before stacking the reflectors 230, the manufacturing method further includes polishing the assembly surface 231 of the reflector 230. This polishing process improves the assembly flatness of the assembly surface 231, thereby improving assembly quality.

[0070] In addition, in other embodiments of the present invention, the scanning galvanometer includes not only the base 310, the first torsion beam 321, the second torsion beam 322 and the reflector 330, but also other structural components (such as the mirror mounting frame 331, the anchor area (not shown in the figure) Figure 8 The present invention will not be described in detail here.

[0071] Accordingly, the present invention provides a scanning galvanometer, specifically referring to Figure 5 , shows a side view of an embodiment of the scanning galvanometer of the present invention.

[0072] The scanning galvanometer includes: a base 110; a torsion structure 120, the torsion structure 120 is stacked on the base 110 and is suitable for providing a torsional moment; a first separator 112, the first separator 112 is located between the base 110 and the torsion structure 120; a reflector 130, the reflector 130 is stacked on the torsion structure 120; a second separator 123, the second separator 123 is located between the reflector 130 and the torsion structure 120; the base 110, the torsion structure 120, the reflector 130, the first separator 112 and the second separator 123 are fixed by welding.

[0073] The substrate 110 serves as a base of the scanning galvanometer, can provide a foundation for the manufacture and assembly of the scanning galvanometer, and also provide mechanical support for other structural components of the scanning galvanometer.

[0074] like Figure 5 As shown, in this embodiment, the base 110 is rectangular. In other embodiments of the present invention, the base may also be in other shapes such as a frame or a circle.

[0075] The torsion structure 120 is used to support the reflector and provide torque for the reciprocating motion of the reflector; the first separator 112 is used to support and fix the torsion structure 120 on the base 110, and occupy space between the torsion structure 120 and the base 110 to form a gap, thereby providing a margin for the vibration of the torsion structure 120 and the reflector.

[0076] In some embodiments of the present invention, the torsion structure 120 includes: at least one torsion beam, and the at least one torsion beam is stacked on the partition. Figure 5 As shown, in this embodiment, the torsion structure 120 includes: a first torsion beam 121 and a second torsion beam 122 located above the first partition 112, and the extension direction of the second torsion beam 122 intersects with the extension direction of the first torsion beam 121. Specifically, the extension direction of the second torsion beam 122 is perpendicular to the extension direction of the first torsion beam 121. Figure 4 yes Figure 3 A view of the intermediate torsion structure 120 along direction B.

[0077] The reflector 130 is used to reflect light; the second separator 123 is used to support and fix the reflector 130 on the torsion structure 120, and occupies space between the reflector 130 and the torsion structure 120 to form a gap, thereby providing a margin space for the vibration of the reflector 130.

[0078] In some embodiments of the present invention, the reflector 130 includes a reflective surface 132 and an assembly surface 131 disposed opposite to each other. The reflective surface 132 facing away from the substrate 110 is suitable for reflecting light, and the assembly surface 131 facing the substrate 110 is suitable for welding and installation.

[0079] like Figure 5 As shown, in this embodiment, the reflector 130 is made of a non-weldable material; a connecting layer 133 is provided on the mounting surface 131 of the reflector 130. This connecting layer 133 is made of a weldable material. Weldable materials include materials that cannot be welded, such as glass, quartz, sapphire, and silicon carbide, or iron-based metals that cannot be welded, such as stainless steel and cast iron, or non-weldable metals such as aluminum. Weldable materials include materials that can be welded, such as weldable metals such as copper, gold, and silver. The connecting layer 133 is a plating or coating.

[0080] It should be noted that in some embodiments of the present invention, the scanning galvanometer further comprises solder, which is located between the base, the torsion structure, the reflector, the first spacer, and the second spacer. The type and thickness of the solder are related to process parameters such as the temperature and time of the soldering process. Therefore, the thickness of the solder needs to be determined based on the design requirements of the scanning galvanometer and the comprehensive consideration of the soldering process parameters.

[0081] Specifically, such as Figure 5 As shown, the solder 111a is located above the substrate 110; the first partition 112 is located above the solder 111a; the solder 111b is located above the first partition 112; the torsion structure 120 is located on the solder 111b; the torsion structure 120 is located on the solder 111b; the solder 124a is located above the torsion structure 120; the second partition 123 is located above the solder 124a; the solder 124b is located above the second partition 123; and the reflector 130 is located above the solder 124b.

[0082] Furthermore, before fabricating a scanning galvanometer using the technical solution of the present invention, the various structural components of the scanning galvanometer must be fabricated. Therefore, the present invention also provides a method for forming a torsion structure of a scanning galvanometer, specifically comprising: stacking at least one torsion beam on a separator; and performing a welding process to secure the at least one torsion beam to the separator.

[0083] Specifically, refer to Figure 7 , showing a side view of an embodiment of a method for forming a torsional structure of a scanning galvanometer provided by the present invention.

[0084] First, at least one torsion beam is stacked on the separator. In this embodiment, the separator is a first separator 212 stacked on the base 210 .

[0085] like Figure 7 As shown, in some embodiments of the present invention, the step of setting the torsion beam includes: stacking a first torsion beam 221 and a second torsion beam 222 with intersecting extension directions in sequence on the partition 212, the stacking direction z being perpendicular to the extension direction x of the first torsion beam 221, and the stacking direction z being perpendicular to the extension direction y of the second torsion beam 222.

[0086] In this embodiment, the base 210 is disposed on the surface of the jig 200, the first torsion beam 221 extends along the x-direction parallel to the surface of the base 210, and the second torsion beam 222 extends along the y-direction parallel to the surface of the base 210. Therefore, the second torsion beam 222 and the first torsion beam 221 are stacked along the z-direction away from the base 210, that is, the stacking direction z is perpendicular to the surface of the base 210, and the first torsion beam 221 is stacked above the second torsion beam 222.

[0087] After the at least one torsion beam is provided, a welding process 240 is performed to fix the at least one torsion beam and the partition.

[0088] In this embodiment, the welding process 240 is performed after the reflector 230 is installed. In other embodiments of the present invention, the welding process 240 may also be performed after the second torsion beam 222 is installed.

[0089] In some embodiments of the present invention, before performing the welding process 240, the forming method further includes: providing solder. Furthermore, in this embodiment, the step of providing the torsion beam includes: sequentially stacking the first torsion beam 221 and the second torsion beam 222. Therefore, between the steps of providing the first torsion beam 221 and providing the second torsion beam 222, the forming method further includes: providing solder.

[0090] Specifically, such as Figure 7 As shown, before the first torsion beam 221 is set, solder 223a is set above the first partition 212; the first torsion beam 221 is set above the solder 223a; solder 223b is set on the first torsion beam 221; and the second torsion beam 222 is set on the solder 223b.

[0091] Correspondingly, the present invention also provides a torsion structure of a scanning galvanometer. Figure 7 , showing a side view of an embodiment of the torsional structure of the scanning galvanometer of the present invention.

[0092] The torsion structure includes: at least one torsion beam, which is stacked on a separator; the at least one torsion beam and the separator are fixed by welding.

[0093] like Figure 7 As shown, in this embodiment, the separator is a first separator 212 stacked and disposed on a substrate 210 .

[0094] In addition, in some embodiments of the present invention, the torsion structure includes: a first torsion beam 221 and a second torsion beam 222 , and an extension direction of the second torsion beam 222 intersects with an extension direction of the first torsion beam 221 .

[0095] In this embodiment, the first torsion beam 221 and the second torsion beam 222 are stacked in sequence, with the stacking direction perpendicular to the extension direction of the first torsion beam 221 and the stacking direction perpendicular to the extension direction of the second torsion beam 222 .

[0096] Specifically, the base 210 is located on the surface of the jig 200; the first torsion beam 221 located above the first separator 221 extends in the x direction parallel to the surface of the base 210; the second torsion beam 222 extends in the y direction parallel to the surface of the base 210, so the second torsion beam 222 and the first torsion beam 221 are stacked in the z direction away from the base 210, that is, the stacking direction z is perpendicular to the surface of the base 210, and the first torsion beam 221 is stacked above the second torsion beam 222.

[0097] In summary, in the technical solution of the present invention, the first separator, torsion structure, separator, and reflector are sequentially stacked on the substrate and secured by welding. This stacked structure secured by welding allows for complex structures with varying requirements in the off-plane direction, thereby improving the processing capability of the off-plane structure to meet the design requirements of the scanning galvanometer. This makes the scanning galvanometer structure more compact and smaller overall, while also avoiding the use of MEMS processes to effectively control process costs.

[0098] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A scanning galvanometer, characterized in that: include: substrate; a first separator, the first separator being stacked on the substrate; a torsion structure, the torsion structure being stacked on the base and adapted to provide a torsion moment, the torsion structure comprising: at least one torsion beam, the at least one torsion beam being stacked on the first partition, the torsion structure and the first partition being fixed by welding, the torsion structure comprising: a first torsion beam and a second torsion beam, the extension direction of the second torsion beam intersecting with the extension direction of the first torsion beam; The scanning galvanometer further includes: a solder material, the solder material being located between the torsion structure and the first spacer for thickness compensation; a reflector, the reflector being stacked on the torsion structure; A second spacer is located between the reflector and the torsion structure.

2. The scanning galvanometer according to claim 1, wherein: The first torsion beam and the second torsion beam are stacked in sequence, with a stacking direction perpendicular to an extension direction of the first torsion beam and a stacking direction perpendicular to an extension direction of the second torsion beam.

3. The scanning galvanometer according to claim 1, wherein: The base, the torsion structure, the reflector, the first spacer and the second spacer are fixed by welding.

4. The scanning galvanometer according to claim 3, wherein: The solder is located between each of the substrate, the torsion structure, the reflector, the first spacer, and the second spacer.

5. The scanning galvanometer according to claim 1, wherein: The reflector is made of a non-weldable material; a connection layer is provided on the assembly surface of the reflector, and the connection layer is made of a weldable material.

6. A method for forming a torsional structure of a scanning galvanometer according to any one of claims 1 to 5, characterized in that: include: At least one torsion beam is stacked on the separator, wherein the step of arranging the at least one torsion beam comprises: sequentially stacking a first torsion beam and a second torsion beam on the separator, wherein the stacking direction is perpendicular to the extending direction of the first torsion beam and the stacking direction is perpendicular to the extending direction of the second torsion beam; A welding process is performed to fix the at least one torsion beam and the partition with a solder therebetween.

7. A method for manufacturing a scanning galvanometer, characterized in that: include: providing a substrate; Laminating a first separator on the substrate; A torsion structure is stacked on the first partition, the torsion structure comprising: at least one torsion beam, the at least one torsion beam is stacked on the first partition, the torsion structure comprising: a first torsion beam and a second torsion beam, the extension direction of the second torsion beam intersecting with the extension direction of the first torsion beam; Laminating a second separator on the torsion structure; stacking a reflector on the second partition; performing a welding process to fix the base, the first spacer, the torsion structure, the second spacer, and the reflector; After the step of setting the first separator and before the step of setting the torsion structure, the manufacturing method further includes: setting solder.

8. The method for manufacturing a scanning galvanometer according to claim 7, wherein: Between any two of the steps of providing a substrate, setting a first spacer, setting a torsion structure, setting a second spacer, and setting a reflector, the manufacturing method further includes: setting solder.

9. The method for manufacturing a scanning galvanometer according to claim 7, wherein: Before performing the welding step, the method further includes: fixing a stacking assembly by a clamp, wherein the stacking assembly includes the base, the first spacer, the torsion structure, the second spacer and the reflector.

10. The method for manufacturing a scanning galvanometer according to claim 7, wherein: After the first spacer, the torsion structure, the second spacer and the reflector are sequentially arranged on the substrate, a welding process is performed.

11. The method for manufacturing a scanning galvanometer according to claim 7, wherein: The material of the reflector is a non-weldable material; before the step of stacking the reflector, the step further includes: forming a connection layer on the assembly surface of the reflector, and the connection layer is a weldable material.

12. The method for manufacturing a scanning galvanometer according to claim 7, wherein: The material of the reflector is a weldable material; before the step of stacking the reflectors, the step further includes: polishing the assembly surface of the reflector.

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