Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a substrate holding section, a nozzle (8), a first supply pipe (114), a first opening / closing section (111), a first flow rate adjusting section (112), a second supply pipe (124), and a flow rate control section (200). The second supply pipe supplies a processing liquid to the nozzle. The flow rate control section controls the first opening / closing section and the first flow rate adjusting section. The flow rate control section performs feedback control of an opening degree of the first flow rate adjusting section in a state where the first supply pipe is opened, during a first period, and determines the opening degree of the first flow rate adjusting section to be a first opening degree. The flow rate control section opens and closes the first supply pipe without performing feedback control of the opening degree of the first flow rate adjusting section, in a state where the opening degree of the first flow rate adjusting section is set to the first opening degree, during a second period. The first period is a period before the second period.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] In the manufacturing process of semiconductor devices, various processes are performed on semiconductor wafers using substrate processing apparatus. For example, as a substrate processing apparatus, an etching apparatus is known that sets the film thickness of the film to be processed contained in the semiconductor wafer as a target film thickness (see, for example, Patent Document 1). For example, the etching apparatus supplies etching solution to the semiconductor wafer from a supply tube, thereby etching the semiconductor wafer.

[0003] In addition, the spray volume of processing fluids, such as etching solutions, needs to be varied depending on the specific process. Therefore, a regulating valve is installed in the supply pipe to adjust the flow rate of the processing fluid.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-85174 Summary of the Invention

[0007] Typically, PID control (feedback control) is used to precisely spray a specified amount of processing fluid onto the substrate. Additionally, the amount of processing fluid sprayed needs to be adjusted based on the position on the semiconductor wafer. However, because PID control is applied to the valve opening, there is a time or hunting process required to adjust the spray volume to the specified amount, preventing the rapid spraying of the specified amount of processing fluid onto the semiconductor wafer.

[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method that can spray a specified amount of processing liquid into a nozzle more quickly.

[0009] The substrate processing apparatus of the present invention includes a substrate holding section, a nozzle, a first supply pipe, a first opening and closing section, a first flow rate regulating section, a second supply pipe, and a flow control section. The substrate holding section holds a substrate. The nozzle supplies processing liquid to the substrate. The first supply pipe supplies the processing liquid to the nozzle. The first opening and closing section opens and closes the first supply pipe. The first flow rate regulating section regulates the flow rate of the processing liquid flowing in the first supply pipe. The second supply pipe supplies the processing liquid to the nozzle. The flow control section controls the first opening and closing section and the first flow rate regulating section. During a first period, while the first supply pipe is open, the flow control section performs feedback control on the opening degree of the first flow rate regulating section, determining the opening degree of the first flow rate regulating section as a first opening degree. During a second period, while the opening degree of the first flow rate regulating section is set to the first opening degree, the flow control section opens and closes the first supply pipe without performing feedback control on the opening degree of the first flow rate regulating section. The first period is the period preceding the second period.

[0010] In one embodiment, a flow meter is further included to measure the flow rate of the processed liquid flowing in the first supply pipe. The flow control unit outputs an opening / closing signal to the first opening / closing unit and an opening degree signal to the first flow regulating unit. The opening / closing signal indicates one of the open or closed states of the first supply pipe. The opening degree signal indicates the opening degree of the first flow regulating unit. The feedback control includes proportional control, integral control, and derivative control based on the detection results of the flow meter.

[0011] In one embodiment, during the second period, the nozzle sprays a first amount of the processing liquid towards the periphery of the substrate and a second amount of the processing liquid, exceeding the first amount, towards the center of the substrate. The first amount of the processing liquid is supplied from the second supply pipe. The second amount of the processing liquid consists of both the processing liquid supplied from the first supply pipe and the processing liquid supplied from the second supply pipe.

[0012] In one embodiment, a substrate rotating section is further included to rotate the substrate about a rotation axis extending in the vertical direction. During the second period, the substrate is rotated relative to the nozzle.

[0013] In one embodiment, a drive unit is further included to move the nozzle relative to the substrate during the second period.

[0014] In one embodiment, a detection unit is further included to detect the driving state of the driving unit. During the second period, the flow control unit opens and closes the first supply pipe based on the detection result of the detection unit.

[0015] In one embodiment, the drive unit is capable of changing the moving speed of the nozzle. When the flow control unit opens or closes the first supply pipe, it slows down the moving speed of the nozzle.

[0016] In one embodiment, the system further includes a second opening / closing section for opening and closing the second supply pipe, and a second flow regulating section for regulating the flow rate of the processing liquid flowing in the second supply pipe. During a third period, the flow regulating section performs feedback control on the opening degree of the second flow regulating section while the second supply pipe is open, determining the opening degree of the second flow regulating section to be a second opening degree. During the second period, while the opening degree of the second flow regulating section is set to the second opening degree, the second supply pipe is opened and closed without feedback control on the opening degree of the second flow regulating section. The third period is the period preceding the second period.

[0017] The substrate processing method of the present invention includes: a step of holding a substrate; a step of spraying a processing liquid from a nozzle onto the substrate; a step of supplying the processing liquid from a first supply pipe to the nozzle; a step of adjusting the flow rate of the processing liquid flowing in the first supply pipe using a first flow rate regulating unit; a step of supplying the processing liquid from a second supply pipe to the nozzle; a step of performing feedback control on the opening degree of the first flow rate regulating unit while the first supply pipe is open, and determining the opening degree of the first flow rate regulating unit as a first opening degree; and a step of opening and closing the first supply pipe without performing feedback control on the opening degree of the first flow rate regulating unit while the opening degree of the first flow rate regulating unit is set to the first opening degree.

[0018] In one embodiment, the process further includes rotating the substrate about a rotation axis extending in the vertical direction.

[0019] In one embodiment, the process further includes moving the nozzle relative to the substrate.

[0020] Invention Effects

[0021] According to the substrate processing apparatus and substrate processing method of the present invention, a predetermined amount of processing liquid can be sprayed onto the substrate more quickly. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the substrate processing apparatus according to Embodiment 1 of the present invention.

[0023] Figure 2 This is a schematic diagram of the processing unit included in the substrate processing apparatus of Embodiment 1.

[0024] Figure 3(a) is a top view showing the nozzle movement process, and (b) is a top view showing the substrate rotation process.

[0025] Figure 4 This is a schematic diagram showing the flushing fluid supply unit of Embodiment 1.

[0026] Figure 5 This is a schematic diagram showing the flushing fluid supply unit of Embodiment 1.

[0027] Figure 6 This is a schematic diagram showing the flushing fluid supply unit of Embodiment 1.

[0028] Figure 7 This is a schematic diagram showing the flushing fluid supply unit of Embodiment 1.

[0029] Figure 8 This is a graph illustrating an example of the relationship between the amount of flushing fluid ejected from the nozzle and time.

[0030] Figure 9 This is a flowchart illustrating the processing performed by the control unit and flow control unit included in the substrate processing apparatus of Embodiment 1.

[0031] Figure 10 This is a flowchart illustrating the processing performed by the control unit and flow control unit included in the substrate processing apparatus of Embodiment 1.

[0032] Figure 11 This is a schematic diagram showing the flushing fluid supply unit according to Embodiment 3 of the present invention.

[0033] Explanation of reference numerals in the attached figures

[0034] 8: Nozzle

[0035] 9: Nozzle moving mechanism

[0036] 100: Substrate processing apparatus

[0037] 101: Control device

[0038] 102: Control Department

[0039] 103: Storage Department

[0040] 111: First on / off valve (first on / off section)

[0041] 112: First regulating valve (first flow regulating unit)

[0042] 114: First Supply Pipe

[0043] 121: Second on / off valve (second on / off section)

[0044] 122: Second regulating valve (second flow regulating unit)

[0045] 124: Second Supply Pipe

[0046] 200: Flow Control Department Detailed Implementation

[0047] The following refers to the attached diagram ( Figures 1 to 11 The following description will be used to illustrate embodiments of the present invention. However, the present invention is not limited to the following embodiments. Furthermore, descriptions that are repeated are sometimes appropriately omitted. In addition, the same or equivalent parts in the figures are labeled with the same reference numerals and are not described again.

[0048] The substrate to be processed by the substrate processing apparatus and substrate processing method of the present invention is applicable to various substrates such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disc substrates, magnetic disk substrates, and magneto-optical disk substrates. Hereinafter, this embodiment will be described primarily using a disc-shaped semiconductor wafer as an example, but the substrate processing apparatus and substrate processing method of the present invention are also applicable to various substrates other than semiconductor wafers. Furthermore, the shape of the substrate is not limited to a disc shape; the substrate processing apparatus and substrate processing method of the present invention are applicable to substrates of various shapes.

[0049] [Implementation Method 1]

[0050] The following is for reference Figures 1-10 To illustrate Embodiment 1 of the present invention. First, refer to... Figure 1 The substrate processing apparatus 100 of this embodiment will be described below. Figure 1 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. In detail, Figure 1 This is a schematic top view of the substrate processing apparatus 100. The substrate processing apparatus 100 processes substrates W. More specifically, the substrate processing apparatus 100 is a single-sheet (leaf-type) apparatus that processes substrates W one by one.

[0051] like Figure 1 As shown, the substrate processing apparatus 100 includes multiple processing units 1, a fluid cabinet 100A, multiple fluid tanks 100B, multiple load ports LP, an indexing robot IR, a central robot CR, and a control device 101.

[0052] Each loading port LP houses multiple substrates W in a stacked manner. An indexing robot IR transfers substrates W between the loading port LP and the central robot CR. The central robot CR transfers substrates W between the indexing robot IR and the processing unit 1. Alternatively, the device structure can be configured such that a platform (channel) is provided between the indexing robot IR and the central robot CR to temporarily hold substrates W, allowing indirect transfer of substrates W between the indexing robot IR and the central robot CR via the platform.

[0053] Multiple processing units 1 form multiple towers TW (in view of the central robot CR) configured to surround the central robot CR when viewed from above. Figure 1 The middle section consists of four towers (TW). Each tower (TW) includes multiple processing units 1 stacked on top of each other (in... Figure 1 There are three processing units 1). Each processing unit 1 supplies processing liquid to the substrate W to process the substrate W.

[0054] Fluid tank 100A contains the processing liquid. Fluid tank 100B corresponds to one of the multiple towers TW. The processing liquid in fluid tank 100A is supplied to all processing units 1 of the tower TW corresponding to a certain fluid tank 100B via a certain fluid tank 100B.

[0055] In this embodiment, the processing solutions include an etching solution, a rinsing solution, SC1, and SC2. The etching solution etches the substrate W. Examples of the etching solution include hydrofluoric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), or phosphoric acid (H3PO4). The rinsing solution rinses the substrate W. Specifically, the rinsing solution is used to rinse away any remaining etching solution on the substrate W. Examples of the rinsing solution include deionized water, carbonated water, electrolyzed ionized water, hydrogen water, ozone water, or hydrochloric acid diluted to a concentration of approximately 10 ppm to 100 ppm. SC1 and SC2 clean the substrate W respectively. SC1 is, for example, a mixture containing NH4OH and H2O2. The processing solution is not particularly limited; the following description in Embodiment 1 illustrates the case where the processing solution is a rinsing solution.

[0056] Next, the control device 101 will be described. The control device 101 controls the operation of each part of the substrate processing apparatus 100. For example, the control device 101 controls the loading port LP, the indexing robot IR, and the central robot CR. The control device 101 includes a control unit 102 and a storage unit 103.

[0057] The control unit 102 has a processor. The control unit 102 may have, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 102 may also have a general-purpose computer.

[0058] Storage unit 103 stores data and computer programs. The data includes process data (recipe data). The process data contains information representing multiple processes. Each process specifies the processing content and steps for the substrate W.

[0059] Storage unit 103 has a main storage device. The main storage device is, for example, a semiconductor memory. Storage unit 103 may also have an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. Storage unit 103 may also include a removable medium. Control unit 102 controls the operation of each part of the board processing apparatus 100 based on the computer programs and data stored in storage unit 103.

[0060] Next, refer to Figure 1 and Figure 2 The substrate processing apparatus 100 of this embodiment will be further described. Figure 2 This is a schematic diagram of the processing unit 1 included in the substrate processing apparatus 100 of this embodiment. In detail, Figure 2 This is a schematic cross-sectional view of processing unit 1.

[0061] like Figure 2 As shown, the processing unit 1 includes a chamber 2, a rotary chuck 3, a rotary motor 5, a nozzle 8, a nozzle moving mechanism 9, and a protective cover 10. Additionally, the fluid tank 100B of the substrate processing apparatus 100 includes a rinsing fluid supply unit 4. The control unit 101 (control unit 102) controls the rotary chuck 3, the rotary motor 5, and the nozzle moving mechanism 9.

[0062] The chamber 2 has a generally box-shaped form. The chamber 2 houses the base plate W, the rotary chuck 3, the rotary motor 5, the protective cover 10, the nozzle 8, the nozzle moving mechanism 9, and a part of the flushing fluid supply unit 4.

[0063] The rotary chuck 3 holds the substrate W horizontally. The rotary chuck 3 is an example of a "substrate holding section." Specifically, the rotary chuck 3 has multiple chuck components 32 and a rotating base 33. The multiple chuck components 32 are disposed on the rotating base 33 along the periphery of the substrate W. The multiple chuck components 32 hold the substrate W in a horizontal position. The rotating base 33 is generally circular and supports the multiple chuck components 32 in a horizontal position.

[0064] The rotary motor unit 5 rotates the substrate W and the rotary chuck 3 together about a first rotation axis AX1. The first rotation axis AX1 extends in the vertical direction. In this embodiment, the first rotation axis AX1 extends in a generally vertical direction. The first rotation axis AX1 is an example of a central axis, and the rotary motor unit 5 is an example of a "substrate rotation unit". Specifically, the rotary motor unit 5 rotates the rotating base 33 about the first rotation axis AX1. Therefore, the rotating base 33 rotates about the first rotation axis AX1. As a result, the substrate W held by the rotary chuck 3 rotates about the first rotation axis AX1.

[0065] Specifically, the rotary motor unit 5 includes a motor body 51, a shaft 53, and an encoder 55. The shaft 53 is coupled to a rotating base 33. The motor body 51 rotates the shaft 53. As a result, the rotating base 33 rotates.

[0066] The encoder 55 detects the rotational position of the substrate W and outputs a signal indicating the rotational position of the substrate W to the control device 101 (control unit 102). Hereinafter, the signal indicating the rotational position of the substrate W will be referred to as the "rotational position signal". The control unit 102 calculates the rotational speed or rotational speed [rpm] of the substrate W based on the rotational position signal.

[0067] The nozzle 8 sprays rinsing fluid from above the substrate W onto the substrate W. Specifically, the nozzle 8 sprays rinsing fluid onto the rotating substrate W.

[0068] The shield 10 has a generally cylindrical shape. The shield 10 catches the rinsing fluid discharged from the substrate W.

[0069] The nozzle moving mechanism 9 moves the nozzle 8 in a generally horizontal direction. More specifically, the nozzle moving mechanism 9 moves the nozzle 8 circumferentially around a second rotation axis AX2 in a generally vertical direction.

[0070] Specifically, the nozzle moving mechanism 9 includes a nozzle arm 91, a first rotating shaft 93, a drive unit 95, and an encoder 94. The nozzle arm 91 extends in a generally horizontal direction. A nozzle 8 is disposed at the front end of the nozzle arm 91. The nozzle arm 91 is coupled to the first rotating shaft 93. The first rotating shaft 93 extends in a generally vertical direction.

[0071] The drive unit 95 rotates the first rotation axis 93 about the second rotation axis AX2, causing the nozzle arm 91 to rotate about the first rotation axis 93 along a generally horizontal plane. As a result, the nozzle 81 moves along a generally horizontal plane. Specifically, the nozzle 81 moves circumferentially about the first rotation axis 93 about the second rotation axis AX2. The drive unit 95 may include, for example, a stepper motor. Alternatively, the drive unit 95 may also include a motor and a reducer.

[0072] The encoder 94 detects the driving state of the drive unit 95. The encoder 94 is an example of a "detection unit". Specifically, the encoder 94 detects the rotation state of the drive unit 95 and outputs a signal representing the amount of rotation of the drive unit 95 to the control device 101 (control unit 102). Hereinafter, the signal representing the amount of rotation of the drive unit 95 will be described as the "drive unit rotation amount signal". The drive unit rotation amount signal is, for example, a pulse signal. The control unit 102 calculates the position of the nozzle 8 relative to the substrate W and the moving speed of the nozzle 8 based on the drive unit rotation amount signal.

[0073] Next, refer to Figure 3 (a) and Figure 3 (b) illustrates the nozzle movement process and the substrate rotation process. Figure 3 (a) is a top view showing the nozzle movement process. Figure 3 (b) is a top view showing the substrate rotation process. First, refer to... Figure 3 (a) illustrates the nozzle movement process. The nozzle movement process refers to the process of moving nozzle 8. (See reference...) Figure 1 The control unit 102 described herein controls the nozzle moving mechanism 9 to move the nozzle 8.

[0074] like Figure 3 As shown in (a), the nozzle moving mechanism 9 enables the nozzle 8 to move along a trajectory TJ1 that is arc-shaped when viewed from above. The trajectory TJ1 passes through the edge portion EG of the substrate W, the center portion CT of the substrate W, and the outer portion PO of the substrate W. The edge portion EG represents the periphery of the substrate W.

[0075] Next, refer to Figure 3 (b) will be used to explain the substrate rotation process. The substrate rotation process refers to the process of rotating the substrate W. For example... Figure 3 As shown in (b), the nozzle 8 is positioned at processing position P during the substrate rotation process. Processing position P indicates the position where the substrate W is processed. Furthermore, the nozzle 8 sprays rinsing fluid towards processing position P during the substrate rotation process. Therefore, the nozzle 8 sprays rinsing fluid towards processing position P along the circumferential direction CD of the substrate W.

[0076] In embodiment 1, the nozzle moving mechanism 9 moves the nozzle 8 along the trajectory TJ1 between the center portion CT and the edge portion EG, and simultaneously sprays rinsing liquid onto the rotating substrate W.

[0077] Next, refer to Figure 4 Let's explain the flushing fluid supply section 4. Figure 4 This is a schematic diagram showing the flushing fluid supply unit 4 in Embodiment 1. (As shown...) Figure 4 As shown, the flushing fluid supply unit 4 includes a first supply unit 110, a second supply unit 120, and a flow control unit 200.

[0078] First, the first supply unit 110 will be described. The first supply unit 110 includes a first supply pipe 114, a first flow meter 113, a first regulating valve 112, and a first on / off valve 111. The first flow meter 113, the first regulating valve 112, and the first on / off valve 111 are arranged in the first supply pipe 114 in this order from downstream to upstream. The first regulating valve 112 is an example of a "first flow regulating unit." The first on / off valve 111 is an example of a "first on / off unit."

[0079] The first supply pipe 114 supplies flushing fluid to the nozzle 8. Specifically, the flushing fluid is supplied from the container 210 of the fluid tank 100A to the nozzle 8 via the first supply pipe 114. The first supply pipe 114 is a tubular component for the flow of flushing fluid.

[0080] The first on / off valve 111 opens and closes the first supply pipe 114. That is, the first on / off valve 111 switches the supply of flushing fluid from the first supply pipe 114 to the nozzle 8 and stops the supply.

[0081] The first regulating valve 112 regulates the flow rate of the flushing fluid flowing in the first supply pipe 114. "Flow rate" refers, for example, to the flow rate of flushing fluid passing through a unit area per unit time. The first regulating valve 112 adjusts its opening to regulate the flow rate of the flushing fluid flowing in the first supply pipe 114. The first regulating valve 112 is, for example, a motor needle valve. Specifically, the first regulating valve 112 includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0082] The first flow meter 113 measures the flow rate of the flushing fluid flowing in the first supply pipe 114. The first flow meter 113 outputs a signal indicating the flow rate to the flow control unit 200. The signal indicating the flow rate is an example of a "detection result," representing the flow rate of the flushing fluid flowing in the first supply pipe 114. Hereinafter, the signal indicating the flow rate will be referred to as "first flow signal FA."

[0083] Next, the second supply unit 120 will be described. The second supply unit 120 includes a second supply pipe 124, a second flow meter 123, a second regulating valve 122, and a second on / off valve 121. The second flow meter 123, the second regulating valve 122, and the second on / off valve 121 are arranged in the second supply pipe 124 in this order from downstream to upstream. The second regulating valve 122 is an example of a "second flow regulating unit." The second on / off valve 121 is an example of a "second on / off unit."

[0084] The second supply pipe 124 supplies flushing fluid to the nozzle 8. Specifically, the flushing fluid is supplied from the container 210 to the nozzle 8 via the second supply pipe 124. The second supply pipe 124 is a tubular component for the flow of flushing fluid.

[0085] The second on / off valve 121 opens and closes the second supply pipe 124. That is, the second on / off valve 121 switches the supply of flushing fluid from the second supply pipe 124 to the nozzle 8 and stops the supply.

[0086] The second regulating valve 122 regulates the flow rate of the flushing fluid flowing in the second supply pipe 124. The second regulating valve 122 adjusts its opening to regulate the flow rate of the flushing fluid flowing in the second supply pipe 124. The second regulating valve 122 is, for example, a motor needle valve. Specifically, the second regulating valve 122 includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0087] The second flow meter 123 measures the flow rate of the flushing fluid flowing in the second supply pipe 124. The second flow meter 123 outputs a signal indicating the flow rate to the flow control unit 200. The signal indicating the flow rate represents the flow rate of the flushing fluid flowing in the second supply pipe 124. Hereinafter, the signal indicating the flow rate will be referred to as "second flow signal FB".

[0088] Next, the flow control unit 200 will be described. The flow control unit 200 controls each structure of the flushing fluid supply unit 4. The flow control unit 200 has a processor. The flow control unit 200 may have, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). For example, the flow control unit 200 controls the first on / off valve 111, the first regulating valve 112, the second on / off valve 121, and the second regulating valve 122.

[0089] First, the control method of the first supply unit 110 will be described. The flow control unit 200 outputs an on / off signal SNA to the first on / off valve 111. The on / off signal SNA indicates either the open or closed state of the first supply pipe 114. Specifically, the flow control unit 200 outputs the on / off signal SNA, indicating the open state, to the first on / off valve 111, thereby opening the first supply pipe 114. On the other hand, the flow control unit 200 outputs the on / off signal SNA, indicating the closed state, to the first on / off valve 111, thereby closing the first supply pipe 114.

[0090] Additionally, the flow control unit 200 outputs an opening signal SMA to the first regulating valve 112. The opening signal SMA indicates the opening degree of the first regulating valve 112. For example, when performing a process in which the nozzle 8 sprays a first predetermined flow rate of rinsing fluid to the substrate W, the opening signal SMA includes a first predetermined opening amount for opening the first regulating valve 112 in such a way that the flow rate of the rinsing fluid flowing in the first supply pipe 114 becomes the first predetermined flow rate. In detail, the flow control unit 200 outputs an opening signal AMA including the first predetermined opening amount to the first regulating valve 112, thereby opening the first regulating valve 112 by the first predetermined opening amount.

[0091] Furthermore, the flow control unit 200 is capable of feedback control of the opening degree of the first regulating valve 112. Specifically, the flow control unit 200 receives a first flow signal FA from the first flow meter 113. When the flow rate indicated by the first flow signal FA is greater than a first predetermined flow rate, the flow control unit 200 outputs an opening signal AMA, indicating an opening degree smaller than the first predetermined opening degree, to the first regulating valve 112. Conversely, when the flow rate indicated by the first flow signal FA is less than the first predetermined flow rate, the flow control unit 200 outputs an opening signal AMA, indicating an opening degree larger than the first predetermined opening degree, to the first regulating valve 112. As a result, the flow control unit 200 compares the flow rate indicated by the first flow signal FA with the first predetermined flow rate, and the flow rate of the flushing fluid flowing in the first supply pipe 114 becomes the first predetermined flow rate.

[0092] More specifically, the feedback control includes proportional control, integral control, and derivative control based on the first flow signal FA. The flow control unit 200 performs proportional control, integral control, and derivative control based on the flow rate represented by the first flow signal FA, and outputs an opening signal AMA, representing the opening degree after performing proportional control, integral control, and derivative control, to the first regulating valve 112. The feedback control is, for example, PID control.

[0093] Furthermore, when performing the process of spraying a second predetermined flow rate of rinsing fluid, different from the first predetermined flow rate, onto the substrate W through nozzle 8, the opening signal SMA includes a second predetermined opening amount for opening the first regulating valve 112 in such a way that the flow rate of the rinsing fluid flowing in the first supply pipe 114 becomes the second predetermined flow rate. Specifically, the flow control unit 200 outputs an opening signal AMA containing the second predetermined opening amount to the first regulating valve 112, thereby opening the first regulating valve 112 at the second predetermined opening amount. Moreover, the flow control unit 200 performs feedback control on the opening of the first regulating valve 112. As a result, the flow control unit 200 compares the flow rate represented by the first flow rate signal FA with the second predetermined flow rate, and the flow rate of the rinsing fluid flowing in the first supply pipe 114 becomes the second predetermined flow rate.

[0094] Next, the control method of the second supply unit 120 will be described. The flow control unit 200 outputs an on / off signal SNB to the second on / off valve 121. The on / off signal SNB indicates one of the open or closed states of the second supply pipe 124. Specifically, the flow control unit 200 outputs the on / off signal SNB, indicating the open state, to the second on / off valve 121, thereby opening the second supply pipe 124. On the other hand, the flow control unit 200 outputs the on / off signal SNB, indicating the closed state, to the second on / off valve 121, thereby closing the second supply pipe 124.

[0095] Additionally, the flow control unit 200 outputs an opening signal SMB to the second regulating valve 122. The opening signal SMB indicates the opening degree of the second regulating valve 122. For example, when performing a process in which the nozzle 8 sprays a third predetermined flow rate of rinsing fluid onto the substrate W, the opening signal SMB includes a third predetermined opening amount for opening the second regulating valve 122 in such a way that the flow rate of the rinsing fluid flowing in the second supply pipe 124 becomes the third predetermined flow rate. In detail, the flow control unit 200 outputs the opening signal AMB, which includes the third predetermined opening amount, to the second regulating valve 122, thereby opening the second regulating valve 122 at the second predetermined opening amount. Moreover, the flow control unit 200 is able to perform feedback control on the opening degree of the second regulating valve 122. As a result, the flow control unit 200 compares the flow rate indicated by the second flow signal FB with the third predetermined flow rate, and the flow rate of the rinsing fluid flowing in the second supply pipe 124 becomes the third predetermined flow rate.

[0096] Next, refer to Figure 5 To explain the “first substrate processing (mode 1)” performed by the substrate processing apparatus 100. Figure 5 This is a schematic diagram showing the flushing fluid supply unit 4 in Embodiment 1. Furthermore, Figure 5 This diagram illustrates the state in which the flow control unit 200 performs "first substrate processing." "First substrate processing" refers to the nozzle 8 spraying a first predetermined flow rate of rinsing fluid onto the upper surface of the substrate W. Additionally, white indicates an open valve, and black indicates a closed valve.

[0097] In the "first substrate processing", the control unit 102 positions the nozzle 8 at the center CT of the substrate W. Furthermore, the flow control unit 200 outputs an on / off signal SNB, indicating a closed state, to the second on / off valve 121, thereby closing the second supply pipe 124. Conversely, the flow control unit 200 outputs an on / off signal SNA, indicating an open state, to the first on / off valve 111, thereby opening the first supply pipe 114. In other words, the second supply unit 120 is not used in the "first substrate processing".

[0098] Furthermore, the flow control unit 200 outputs an opening signal AMA, representing a first predetermined opening degree, to the first regulating valve 112, thereby opening the first regulating valve 112 to the first predetermined opening degree. The flow control unit 200 receives a first flow signal FA from the first flow meter 113. The flow control unit 200 compares the flow rate represented by the first flow signal FA with the first predetermined flow rate, and determines that the flow rate of the flushing fluid flowing in the first supply pipe 114 becomes the first predetermined flow rate. When the flow rate of the flushing fluid flowing in the first supply pipe 114 becomes the first predetermined flow rate, the flow control unit 200 stops outputting the opening signal AMA to the first regulating valve 112. As a result, the nozzle 8 continuously sprays a flushing fluid of the first predetermined flow rate onto the upper surface of the substrate W. Moreover, the nozzle moving mechanism 9 moves the nozzle 8 along the trajectory TJ1 between the center portion CT and the edge portion EG.

[0099] Next, refer to Figure 3 (a) to Figure 7 Let us now describe the "second substrate processing (mode 2)," which differs from the "first substrate processing (mode 1)." The "second substrate processing" refers to a process in which nozzle 8 sprays a first amount of rinsing liquid onto the peripheral region of the upper surface of substrate W, including the edge portion EG, and also sprays a second amount of rinsing liquid onto the central region of the upper surface of substrate W, including the center portion CT. The peripheral region of the upper surface of substrate W, including the edge portion EG, is an example of a "peripheral portion of the substrate." Specifically, the peripheral region of the upper surface of substrate W, including the edge portion EG, is, for example, an edge side of substrate W with a radial direction greater than a predetermined value. The central region of the upper surface of substrate W, including the center portion CT, is an example of a "central portion of the substrate." In other words, the state of spraying a first amount of rinsing liquid is switched to the state of spraying a second amount of rinsing liquid. The second spray amount is greater than the first spray amount. As a result, it is possible to prevent the rinsing liquid from flowing around to the back side of substrate W. The first spray amount is, for example, 500 ml / min, and the second spray amount is, for example, 2000 ml / min.

[0100] In Implementation 1, a "first preparation process" is performed during a first period in order to perform a "second substrate process" during a second period. The first period is the period preceding the second period.

[0101] The first period is not specifically defined; it is the period before the "second substrate processing" is to be performed.

[0102] Refer again Figure 3 (a) and Figure 5 To explain the "first preparatory treatment," we need to understand that the "first preparatory treatment" refers to the process of adjusting the flow rate of the flushing fluid flowing in the first supply pipe 114 beforehand. Figure 5In the “first substrate processing” shown, the nozzle 8 is disposed at the center CT of the substrate W, but in the “first preparation processing”, the nozzle 8 is disposed at a predetermined position (HOME position). The predetermined position is not particularly limited, for example, it is the outer PO of the substrate W.

[0103] In the "first preparation process," the control unit 102 positions the nozzle 8 on the outer surface PO of the substrate W. Furthermore, the flow control unit 200 outputs an on / off signal SNB, indicating a closed state, to the second on / off valve 121, thereby closing the second supply pipe 124. Conversely, the flow control unit 200 outputs an on / off signal SNA, indicating an open state, to the first on / off valve 111, thereby opening the first supply pipe 114.

[0104] Furthermore, the flow control unit 200 outputs an opening signal AMA to the first regulating valve 112, which includes a first opening measure for opening the first regulating valve 112 in such a way that the flow rate of the flushing fluid flowing in the first supply pipe 114 becomes the first flow rate. The first flow rate is the difference between the first spray volume and the second spray volume. For example, the first flow rate is 1500 ml / min.

[0105] The flow control unit 200 receives a first flow signal FA from the first flow meter 113. The flow control unit 200 compares the flow rate indicated by the first flow signal with the first flow rate, and determines the flow rate of the rinsing fluid flowing in the first supply pipe 114 as the first flow rate. As a result, the nozzle 8 ejects rinsing fluid at the first flow rate to the external PO. At this time, the opening degree of the first regulating valve 112 is the first opening degree. In other words, the first opening degree represents the opening degree of the first regulating valve 112 used to allow the rinsing fluid at the first flow rate to flow in the first supply pipe 114. Furthermore, the flow control unit 200 determines the opening degree of the first regulating valve 112 during the "second substrate processing" as the first opening degree.

[0106] After the flow control unit 200 determines the opening degree of the first regulating valve 112 as the first opening degree, the flow control unit 200 outputs an opening / closing signal SNA indicating a closed state to the first opening / closing valve 111, thereby closing the first supply pipe 114. As a result, the flow rate of the flushing fluid flowing in the first supply pipe 114 becomes 0.

[0107] Next, refer to Figure 6 and Figure 7 To explain the "second substrate processing". Figure 6 and Figure 7 This is a schematic diagram showing the flushing fluid supply unit 4 in Embodiment 1. Furthermore, Figure 6 This diagram shows the state in which the nozzle 8 sprays a first amount of rinsing liquid onto the peripheral region, including the edge portion EG, on the upper surface of the substrate W. Additionally, Figure 7 This diagram shows the state in which the nozzle 8 sprays a second amount of rinsing liquid onto the central region of the upper surface of the substrate W, including the central portion CT.

[0108] like Figure 6 As shown, the flow control unit 200 outputs an on / off signal SNB, indicating an open state, to the second on / off valve 121, thereby opening the second supply pipe 124. Additionally, the flow control unit 200 outputs an opening degree signal SMB, indicating a second opening degree for opening the second regulating valve 122 to make the flow rate of the flushing fluid flowing in the second supply pipe 124 a second flow rate, to the second regulating valve 122. The flushing fluid at the second flow rate flows in the second supply pipe 124. The second flow rate is the first ejection volume.

[0109] The flow control unit 200 outputs an opening signal SMA indicating a first opening degree to the first regulating valve 112. Additionally, the flow control unit 200 outputs an opening / closing signal SNA indicating a closed state to the first opening / closing valve 111, thereby closing the first supply pipe 114. In other words, while the opening degree of the first regulating valve 112 is set to the first opening degree, the flow control unit 200 outputs an opening / closing signal indicating a closed state to the first opening / closing valve 111. As a result, the nozzle 8 sprays a first amount of rinsing fluid onto the substrate W.

[0110] On the other hand, such as Figure 7 As shown, the flow control unit 200 outputs an on / off signal SNB, indicating an open state, to the second on / off valve 121, thereby opening the second supply pipe 124. Additionally, the flow control unit 200 outputs an opening degree signal SMB, indicating a second opening degree for opening the second regulating valve 122 to make the flow rate of the flushing fluid flowing in the second supply pipe 124 a second flow rate, to the second regulating valve 122. The flushing fluid at the second flow rate flows in the second supply pipe 124.

[0111] Furthermore, the flow control unit 200 outputs an opening signal SMA indicating a first opening degree to the first regulating valve 112 in advance. Additionally, the flow control unit 200 outputs an on / off signal SNA indicating an open state to the first on / off valve 111, thereby opening the first supply pipe 114. In other words, the flow control unit 200 outputs an on / off signal indicating an open state to the first on / off valve 111 when the opening degree of the first regulating valve 112 is set to the first opening degree. As a result, the nozzle 8 sprays a second amount of rinsing liquid onto the substrate W.

[0112] Here, refer to Figure 8 The switching between the state of spraying a first spray volume of flushing fluid and the state of spraying a second spray volume of flushing fluid is explained. Figure 8This is an example graph (chart) showing the relationship between the amount of flushing fluid ejected from nozzle 8 and time. For example... Figure 8 As shown, the horizontal axis represents time, and the vertical axis represents the ejection volume.

[0113] Time T1 represents the time when the flow control unit 200 outputs the open / close signal SNA, indicating the open state, to the first open / close valve 111. Time T2 represents the time when the flow control unit 200 outputs the open / close signal SNA, indicating the closed state, to the first open / close valve 111. Time T3 represents the time when the flow control unit 200 outputs the open / close signal SNB, indicating the closed state, to the second open / close valve 121.

[0114] Additionally, the first spray volume X1 is, for example, 500 ml / min. The second spray volume X2 is, for example, 2000 ml / min.

[0115] Within a short time interval ΔT (e.g., less than 1 second) starting from time T1, the flushing fluid discharge rate changes from a first discharge rate X1 to a second discharge rate X2. Furthermore, the flushing fluid discharge rate changes smoothly from the first discharge rate X1 to the second discharge rate X2 without fluctuation. Fluctuation, for example, refers to the repeated occurrence of the flushing fluid discharge rate increasing or decreasing compared to the second discharge rate X2. In other words, fluctuation means that the discharge rate becomes unstable.

[0116] The above describes Embodiment 1 of the present invention. According to Embodiment 1, during the second period (“second substrate processing”), the flow control unit 200, while setting the opening degree of the first regulating valve 112 to the first opening degree, outputs an opening / closing signal indicating the open state to the first opening / closing valve 111 without feedback control of the opening degree of the first regulating valve 112. As a result, compared to when feedback control is performed on the opening degree of the first regulating valve 112, the rinsing liquid of the second spray volume X2 can be supplied to the substrate W more quickly. In addition, compared to when feedback control is performed on the opening degree of the first regulating valve 112, the rinsing liquid of the second spray volume X2 can be supplied to the substrate W without fluctuation.

[0117] Furthermore, since the feedback control includes proportional control, integral control, and derivative control based on the first flow signal FA, the flow control unit 200 is able to determine the opening degree of the first regulating valve 112 as a first opening degree with higher accuracy.

[0118] Furthermore, the rinsing liquid with the first spray volume X1 is supplied from the second supply pipe 124, and the rinsing liquid with the second spray volume X2 is supplied from the first supply pipe 114 and the rinsing liquid supplied from the second supply pipe 124. Therefore, during the second period, it is possible to switch more quickly between spraying the rinsing liquid with the first spray volume X1 onto the peripheral region of the upper surface of the substrate W, which includes the edge portion EG, and spraying the rinsing liquid with the second spray volume X2 onto the central region of the upper surface of the substrate W, which includes the center portion CT, while suppressing fluctuations.

[0119] Furthermore, when the rotary motor unit 5 rotates the substrate W and the rotary chuck 3 together, a second spray volume X2 of rinsing liquid can be sprayed more quickly to the desired position on the substrate W. Additionally, when the nozzle moving mechanism 9 moves the nozzle 8, a second spray volume X2 of rinsing liquid can be sprayed more quickly to the desired position on the substrate W.

[0120] More specifically, the encoder 94 outputs a drive rotation signal to the control device 101 and the flow control unit 200. The flow control unit 200 opens and closes the first supply pipe 114 based on the drive rotation signal from the encoder 94 during a second period. For example, when the rotation amount indicated by the drive rotation signal is less than a predetermined rotation amount, an open / close signal SNA indicating a closed state is output to the first open / close valve 111. Specifically, when the number of pulses indicated by the drive rotation signal is less than a threshold, the open / close signal SNA indicating an open state is not output to the first open / close valve 111. As a result, the nozzle 8 sprays a first spray volume X1 of rinsing fluid into the peripheral region of the substrate W, including the edge portion EG.

[0121] On the other hand, when the rotation amount indicated by the drive unit rotation amount signal is greater than or equal to a predetermined rotation amount, an on / off signal SNA indicating an open state is output to the first on / off valve 111. Specifically, when the number of pulses indicated by the drive unit rotation amount signal is greater than or equal to a threshold, an on / off signal SNA indicating an open state is output to the first on / off valve 111. In other words, when the nozzle 8 is positioned above the central region of the substrate W including the central portion CT, an on / off signal SNA indicating an open state is output to the first on / off valve 111. As a result, the nozzle 8 sprays a second spray amount X2 of rinsing liquid into the central region of the substrate W including the central portion CT. Therefore, the flow control unit 200 does not receive control signals from the control unit 102 (a computer that controls the operation of each part of the substrate processing apparatus 100) and can control the first on / off valve 111 based on the drive unit rotation amount signal.

[0122] Furthermore, when transitioning from the first period to the second period, the system switches from a state of feedback control of the opening of the first regulating valve 112 to a state of no feedback control. The timing for this switch could be, for example, a timing after a certain period has elapsed since the first period, or a timing when the nozzle 8 moves to a predetermined position (processing start position). The specific timing for moving to the predetermined position could be, for example, […]. Figure 3 The nozzle 8 in (a) is positioned from the outer PO of the substrate W to the center CT for timing.

[0123] Next, refer to Figure 9 and Figure 10 The substrate processing method of this embodiment will be explained below. The substrate processing method of this embodiment is based on the reference... Figures 1 to 7 The substrate processing apparatus 100 described herein is used. Figure 9 and Figure 10 This is a flowchart illustrating the processing performed by the control unit 102 and the flow control unit 200 included in the substrate processing apparatus 100 of this embodiment.

[0124] First, the flow control unit 200 outputs an on / off signal SNA, indicating a closed state, to the first on / off valve 111, causing the first on / off valve 111 to close the first supply pipe 114. Then, the flow control unit 200 outputs an on / off signal SNB, indicating a closed state, to the second on / off valve 121, causing the second on / off valve 121 to close the second supply pipe 124 (step S101).

[0125] Next, the control unit 102 controls the nozzle moving mechanism 9 to move the nozzle 8 to a predetermined position (step S102). The predetermined position is, for example, the outer PO of the substrate W.

[0126] Next, the flow control unit 200 outputs an on / off signal SNB indicating the on state to the first on / off valve 111, thereby causing the first on / off valve 111 to open the first supply pipe 114 (step S103).

[0127] Next, the flow control unit 200 receives the first flow signal FA from the first flow meter 113 (step S104).

[0128] Next, the flow control unit 200 determines whether the difference between the flow rate represented by the first flow signal FA and the first flow rate is greater than or equal to a threshold (step S105). If the control unit 102 determines that the difference between the flow rate represented by the first flow signal FA and the first flow rate is greater than or equal to the threshold (yes in step S105), the flow control unit 200 performs proportional control, integral control, and derivative control based on the flow rate represented by the first flow signal FA, and outputs an opening degree signal AMA, which represents the opening degree after performing proportional control, integral control, and derivative control, to the first regulating valve 112 (step S106).

[0129] On the other hand, if the control unit 102 determines that the difference between the flow rate indicated by the first flow signal FA and the first flow rate is not above a threshold (No in step S105), the flow control unit 200 closes the first supply pipe 114 by outputting an on / off signal SNA indicating a closed state to the first on / off valve 111. Additionally, the flow control unit 200 opens the second supply pipe 124 by outputting an on / off signal SNB indicating an open state to the second on / off valve 121 (step S107). In other words, the flow control unit 200 determines the opening degree of the first regulating valve 112 during the "second substrate processing" as the first opening degree.

[0130] Furthermore, during the execution of the "second substrate processing", the flow control unit 200 determines whether the position of the nozzle 8 is in the central region of the substrate W, including the central portion CT (step S108). If the flow control unit 200 determines that the position of the nozzle 8 is in the central region of the substrate W, including the central portion CT (yes in step S108), the flow control unit 200 outputs an on / off signal SNA indicating an on state to the first on / off valve 111, thereby opening the first supply pipe 114 (step S109). As a result, the nozzle 8 sprays a second spray volume X2 of rinsing liquid onto the substrate W.

[0131] On the other hand, if the flow control unit 200 determines that the position of the nozzle 8 is not in the central region of the substrate W including the center portion CT (No in step S108), the flow control unit 200 outputs an on / off signal SNA indicating a closed state to the first on / off valve 111, thereby causing the first on / off valve 111 to close the first supply pipe 114 (step S110). As a result, the nozzle 8 sprays a first spray volume X1 of rinsing liquid onto the substrate W.

[0132] [Implementation Method 2]

[0133] Refer again Figure 4Embodiment 2 of the present invention will be described. However, matters that differ from Embodiment 1 will be described, while matters that are the same as those in Embodiment 1 will be omitted. Embodiment 2 differs from Embodiment 1 in that the spray volume of the rinsing liquid is switched between four types: 0, a first spray volume, a second spray volume, and a third spray volume.

[0134] In Implementation 2, a "second preparation process" is performed in a third period in order to perform a "second substrate process" during a second period. The third period is the period preceding the second period.

[0135] The third period can be the same as the first period.

[0136] The "second preparation process" is a process in which the flow rate of the flushing fluid flowing in the second supply pipe 124 is adjusted in advance. In the "second preparation process," for example, the nozzle 8 is positioned in a predetermined position.

[0137] In the "second preparation process," the control unit 102 positions the nozzle 8 on the outer surface PO of the substrate W. Furthermore, the flow control unit 200 outputs an on / off signal SNA, indicating a closed state, to the first on / off valve 111, causing the first on / off valve 111 to close the first supply pipe 114. Conversely, the flow control unit 200 outputs an on / off signal SNB, indicating an open state, to the second on / off valve 121, causing the second on / off valve 121 to open the second supply pipe 124.

[0138] Furthermore, the flow control unit 200 outputs an opening signal AMB, which includes a second opening degree for opening the second regulating valve 122 in a manner that allows the flow rate of the flushing fluid flowing in the second supply pipe 124 to become the second flow rate, to the second regulating valve 122, thereby opening the second regulating valve 122 to the second opening degree. The flow control unit 200 receives a second flow signal FB from the second flow meter 123. The flow control unit 200 compares the flow rate represented by the second flow signal FB with the second flow rate, and determines that the flow rate of the flushing fluid flowing in the second supply pipe 124 becomes the second flow rate. As a result, the nozzle 8 sprays flushing fluid of the second flow rate to the external PO. At this time, the opening degree of the second regulating valve 122 is the second opening degree. In other words, the second opening degree represents the opening degree of the second regulating valve 122 for allowing the flushing fluid of the second flow rate to flow in the second supply pipe 124. The flow control unit 200 determines the opening degree of the second regulating valve 122 as the second opening degree.

[0139] During the second period, the flow control unit 200 outputs an opening signal SMB indicating the second opening degree to the second regulating valve 122. Additionally, the flow control unit 200 causes the second on / off valve 121 to open and close the second supply pipe 124 by outputting an on / off signal SNB to the second on / off valve 121. In other words, during the second period, the flow control unit 200 outputs an on / off signal to the second on / off valve 121 while the opening degree of the second regulating valve 122 is set to the second opening degree.

[0140] The above describes Embodiment 2 of the present invention. According to Embodiment 2, during the second period (“second substrate processing”), the flow control unit 200 outputs an on / off signal indicating an open state to the first on / off valve 111 and the second on / off valve 121 while the opening degree of the first regulating valve 112 is set to the first opening degree and the opening degree of the second regulating valve 122 is set to the second opening degree. As a result, the rinsing liquid with four spray amounts—0, the first spray amount, the second spray amount, and the third spray amount—can be supplied to the substrate W more quickly.

[0141] [Implementation Method 3]

[0142] Next, refer to Figure 11 Embodiment 3 of the present invention will be described. Figure 11 This is a schematic diagram showing the flushing fluid supply unit 4 of Embodiment 3. However, the differences from Embodiment 2 will be explained, while the similarities with Embodiment 2 will be omitted. Embodiment 3 differs from Embodiment 2 in that the flushing fluid supply unit 4 also includes a third supply unit 130.

[0143] Specifically, the third supply section 130 includes a third supply pipe 134, a third flow meter 133, a third regulating valve 132, and a third on / off valve 131. The third flow meter 133, the third regulating valve 132, and the third on / off valve 131 are arranged in the third supply pipe 134 from downstream to upstream in this order.

[0144] The third supply pipe 134 supplies flushing fluid to the nozzle 8. Specifically, the flushing fluid is supplied from the container 210 to the nozzle 8 via the third supply pipe 134. The third supply pipe 134 is a tubular component for the flow of flushing fluid.

[0145] The third on / off valve 131 opens and closes the third supply pipe 134. That is, the third on / off valve 131 switches the supply of flushing fluid from the third supply pipe 134 to the nozzle 8 and stops the supply.

[0146] The third regulating valve 132 regulates the flow rate of the flushing fluid flowing in the third supply pipe 134. The third regulating valve 132 adjusts its opening to regulate the flow rate of the flushing fluid flowing in the third supply pipe 134. The third regulating valve 132 is, for example, a motor needle valve. Specifically, the third regulating valve 132 includes a valve body (not shown) with an internal valve seat, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between an open position and a closed position.

[0147] The third flow meter 133 measures the flow rate of the flushing fluid flowing in the third supply pipe 134. The third flow meter 133 outputs a signal indicating the flow rate to the flow control unit 200. The signal indicating the flow rate represents the flow rate of the flushing fluid flowing in the third supply pipe 134. Hereinafter, the signal indicating the flow rate will be referred to as the "third flow signal".

[0148] The flow control unit 200 also controls the third on / off valve 131 and the third regulating valve 132.

[0149] The present invention, Embodiment 3, has been described above. According to Embodiment 3, rinsing liquid with seven different ejection rates—0, a first ejection amount, a second ejection amount, a third ejection amount, a fourth ejection amount, a fifth ejection amount, and a sixth ejection amount—can be supplied to the substrate W more rapidly. The 0, first ejection amount, second ejection amount, third ejection amount, fourth ejection amount, fifth ejection amount, and sixth ejection amount are all different. As a result, detailed control over the ejection amount is possible.

[0150] The above is with reference to the attached diagram ( Figures 1 to 11 The embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments and can be implemented in various ways without departing from its spirit. In addition, the various constituent elements disclosed in the above embodiments can be appropriately modified. For example, one of the constituent elements shown in one embodiment can be added to the constituent elements of other embodiments, or several constituent elements shown in one embodiment can be deleted from the embodiment.

[0151] To facilitate understanding of the invention, the accompanying drawings schematically represent the various constituent elements as the main body. The thickness, length, number, spacing, etc., of each constituent element shown in the drawings may sometimes differ from the actual dimensions due to the nature of the drawings. Furthermore, the structure of each constituent element shown in the above embodiment is an example and is not particularly limited. Of course, various modifications can be made without substantially departing from the effects of the invention.

[0152] (1) For example, refer to Figure 3The nozzle 8 described moves at a constant speed around the first rotation axis 93 in the circumferential direction centered on the second rotation axis AX2, but is not particularly limited. The nozzle moving mechanism 9 (drive unit 95) may also be capable of changing the moving speed of the nozzle 8. For example, when the flow control unit 200 opens or closes the first supply pipe 114, the nozzle moving mechanism 9 (drive unit 95) may also slow down the moving speed of the nozzle 8. As a result, the rinsing liquid can be sprayed with higher precision to the desired position on the substrate W.

[0153] (2) For example, the flow control unit 200 detects the position of the nozzle 8 based on the rotation signal of the drive unit from the encoder 94, but it can also detect the position of the nozzle 8 based on the drive time of the drive unit 95.

[0154] (3) For example, refer to Figure 2 The rotary chuck 3 described is a clamping chuck that brings multiple chuck components 32 into contact with the peripheral end face of the substrate W. However, the method of holding the substrate W is not particularly limited as long as it can keep the substrate W horizontal. For example, the rotary chuck 3 can also be a vacuum chuck or a Bernoulli chuck.

[0155] Industrial applicability

[0156] This invention can be used in the field of substrate processing.

Claims

1. A substrate processing apparatus, characterized in that, have: A substrate holding section that holds a substrate; A nozzle that sprays a treatment liquid onto the substrate; A first supply pipe supplies the treatment liquid to the nozzle; The first opening and closing section opens and closes the first supply pipe; A first flow regulating unit regulates the flow rate of the treatment liquid flowing in the first supply pipe. A second supply pipe supplies the treatment liquid to the nozzle; and The flow control unit controls the first opening / closing unit and the first flow regulation unit. During the first period, the flow control unit performs feedback control on the opening degree of the first flow regulating unit while the first supply pipe is open, and determines the opening degree of the first flow regulating unit as the first opening degree. During the second period, while the opening degree of the first flow regulating unit is set to the first opening degree, the flow control unit opens and closes the first supply pipe without feedback control of the opening degree of the first flow regulating unit. The first period is the period preceding the second period.

2. The substrate processing apparatus according to claim 1, characterized in that, It also includes a flow meter for measuring the flow rate of the treatment liquid flowing in the first supply pipe. The flow control unit outputs an opening / closing signal to the first opening / closing unit and an opening degree signal to the first flow regulation unit. The opening / closing signal indicates one of the open or closed states of the first supply pipe. The opening signal indicates the opening degree of the first flow regulation section. The feedback control includes proportional control, integral control, and derivative control based on the detection results of the flow meter.

3. The substrate processing apparatus according to claim 1 or 2, characterized in that, During the second period, the nozzle sprays a first amount of the processing liquid onto the substrate, and then sprays a second amount of the processing liquid onto the substrate, which is greater than the first amount. The first spray volume of the treatment liquid is the treatment liquid supplied from the second supply pipe. The second spray volume of the treatment liquid is the treatment liquid supplied from the first supply pipe and the treatment liquid supplied from the second supply pipe.

4. The substrate processing apparatus according to claim 3, characterized in that, It also includes a substrate rotating part that allows the substrate to rotate about a rotation axis extending in the vertical direction. During the second period, the substrate is rotated relative to the nozzle.

5. The substrate processing apparatus according to claim 3, characterized in that, It also includes a drive unit that moves the nozzle relative to the substrate during the second period.

6. The substrate processing apparatus according to claim 5, characterized in that, It also includes a detection unit for detecting the driving state of the driving unit. During the second period, the flow control unit opens and closes the first supply pipe based on the detection result of the detection unit.

7. The substrate processing apparatus according to claim 6, characterized in that, The drive unit can change the moving speed of the nozzle. When the flow control unit opens or closes the first supply pipe, it slows down the movement speed of the nozzle.

8. The substrate processing apparatus according to claim 1 or 2, characterized in that, It also includes: a second opening and closing section, which opens and closes the second supply pipe; and The second flow regulating unit regulates the flow rate of the treatment liquid flowing in the second supply pipe. During the third period, the flow control unit performs feedback control on the opening degree of the second flow regulating unit while the second supply pipe is open, and determines the opening degree of the second flow regulating unit as the second opening degree. During the second period, the flow control unit, while setting the opening degree of the second flow regulating unit to the second opening degree, opens and closes the second supply pipe without feedback control of the opening degree of the second flow regulating unit. The third period is the period preceding the second period.

9. A substrate processing method, characterized in that, include: The process of holding the substrate; The process of spraying the processing liquid from the nozzle onto the substrate; The process of supplying the treatment fluid from the first supply pipe to the nozzle; A process of adjusting the flow rate of the processing liquid flowing in the first supply pipe using a first flow rate regulating unit; The process of supplying the treatment fluid from the second supply pipe to the nozzle; The process of feedback control of the opening degree of the first flow regulating unit in the state of opening the first supply pipe, and determining the opening degree of the first flow regulating unit as the first opening degree; as well as The process of opening and closing the first supply pipe without feedback control of the opening of the first flow regulating section when the opening of the first flow regulating section is set to the first opening.

10. The substrate processing method according to claim 9, characterized in that, It also includes a process of rotating the substrate about a rotation axis extending in the vertical direction.

11. The substrate processing method according to claim 9 or 10, characterized in that, It also includes a step of moving the nozzle relative to the substrate.

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