Heating device and semiconductor cleaning apparatus

Abstract

This invention provides a heating device and a semiconductor cleaning equipment. The heating device includes a housing, a metal heat-conducting block, and a heating component. The housing is connected to the surface of a process tank and forms a receiving space with the surface of the process tank. The metal heat-conducting block and the heating component are disposed in the receiving space. The heating component is connected to the metal heat-conducting block for heating the metal heat-conducting block. The metal heat-conducting block is in contact with the surface of the process tank to transfer heat to the process tank, thereby improving the heating effect of the process tank by utilizing the thermal conductivity of metal while ensuring explosion protection.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a heating device and a semiconductor cleaning apparatus. Background Technology

[0002] In the semiconductor manufacturing industry, cleaning equipment is widely used to clean wafers and metal parts. Specifically, cleaning equipment typically uses organic chemicals to perform overflow cleaning of the parts to be cleaned, removing special media adhering to the wafer surface and etching adhesive adhering to the metal parts. Cleaning machines usually use organic chemicals such as EKC270, NMP, and ST250. These types of organic chemicals are generally flammable and explosive. Therefore, during the cleaning process, the internal environment of the cleaning equipment is filled with the volatile gases of the organic chemicals, creating a flammable and explosive gas environment inside the equipment. The cleaning equipment includes a process tank for holding the aforementioned organic chemicals and a heater for heating the process tank. The heater is electrically connected to an external power supply and controller via cables. These cables are exposed to a flammable and explosive gas environment, posing a risk of electrical sparking, which could ignite the volatile gases of the organic chemicals, leading to a serious safety accident.

[0003] Furthermore, to ensure effective heating, the heater cannot be too far from the process tank. Therefore, how to ensure effective heating of the process tank while preventing explosions has become a pressing problem in this field. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a heating device and semiconductor cleaning equipment that can ensure the heating effect of the process tank while being explosion-proof.

[0005] To achieve the purpose of this invention, a heating device is provided for heating a process tank in a semiconductor cleaning equipment, and is disposed outside the process tank; the heating device includes: a housing, a metal heat-conducting block, and a heating component; wherein,

[0006] The housing is connected to the surface of the process tank and can form a receiving space with the surface of the process tank; the metal heat-conducting block and the heating component are disposed in the receiving space;

[0007] The heating component is connected to the metal heat-conducting block and is used to heat the metal heat-conducting block; the metal heat-conducting block is in contact with the surface of the process tank to transfer heat to the process tank.

[0008] Optionally, the heating element includes at least one heating rod;

[0009] The metal heat-conducting block has multiple mounting holes, and the number of mounting holes is the same as the number of heating rods; the heating rods are inserted into the mounting holes one by one.

[0010] There is a preset hole gap between the inner circumferential surface of the mounting hole and the outer circumferential surface of the heating rod. The preset hole gap ensures that the heat transfer efficiency between the heating rod and the metal heat-conducting block meets the process requirements.

[0011] Optionally, the preset orifice gap is the corresponding value of the target temperature of the metal heat-conducting block and the heating power density of the heating rod in a pre-acquired set of curves; wherein, the set of curves includes multiple orifice gap-power density relationship curves at different target temperatures.

[0012] Optionally, all of the mounting holes are formed on the side surface of the metal heat-conducting block away from the opening of the process tank, and extend along the height direction of the process tank.

[0013] The plurality of mounting holes are symmetrically distributed with the central axis in the width direction of the process groove as the axis of symmetry.

[0014] Optionally, the heating component further includes cables that correspond one-to-one with the heating rods; one end of the cable is connected to the end of the corresponding heating rod that is not inserted into the mounting hole, and the other end of the cable is used to connect to an external power source.

[0015] The housing is also provided with wiring holes; the wiring holes are located on the side surface of the housing away from the opening of the process groove;

[0016] The cable is led out from the wiring hole.

[0017] Optionally, an air inlet is provided on the housing;

[0018] The air inlet is used to connect with an external purge air source so as to purge the internal components of the housing using the purge gas;

[0019] The wiring hole also serves as an air outlet for the housing to discharge the purging gas.

[0020] Optionally, the heating rod includes a main body and a connecting part;

[0021] The main body is cylindrical;

[0022] The connecting part is an annular body that protrudes outward from the outer periphery of the main body; the connecting part is used to connect with the surface near the opening of the mounting hole.

[0023] Optionally, the metal heat-conducting block material includes aluminum or stainless steel.

[0024] Optionally, the enclosure includes a main body and a cover.

[0025] The main body of the box surrounds the metal heat-conducting block and the heating component; the main body of the box has a first opening and a second opening on each side; the edge of the first opening is sealed to the outer surface of the process tank;

[0026] The cover plate is disposed on the second opening and is sealed to the second opening.

[0027] Optionally, the heating device further includes a temperature measuring component connected to the metal heat-conducting block for detecting the temperature of the metal heat-conducting block.

[0028] As another technical solution, the present invention also provides a semiconductor cleaning device, which includes a process tank and at least two heating devices as described in the above embodiments. The process tank stores cleaning liquid for cleaning the workpiece to be cleaned; the at least two heating devices are respectively arranged on opposite sides of the process tank.

[0029] The present invention has the following beneficial effects:

[0030] The heating device provided in this embodiment of the invention is used to heat the process tank of a semiconductor cleaning equipment. The heating device includes a metal heat-conducting block and a heating component, wherein the heating component is connected to the metal heat-conducting block, and the surface of the metal heat-conducting block is in contact with the outer surface of the process tank. This utilizes the good thermal conductivity of the metal heat-conducting block to efficiently transfer the heat output by the heating component to the process tank. The heating device also includes a housing, which, together with the surface of the process tank, forms a space to accommodate the metal heat-conducting block and the heating component, thereby isolating the metal heat-conducting block and the heating component from the flammable and explosive gas environment inside the semiconductor cleaning equipment to a certain extent. Therefore, the heating device provided in this embodiment of the invention, by combining the housing, the metal heat-conducting block, and the heating component, can both ensure the effective heating of the process tank and reduce the risk of explosion inside the semiconductor cleaning equipment.

[0031] The semiconductor cleaning equipment provided in this embodiment of the invention uses the heating device described in the above embodiment to heat the process tank, so as to ensure that the chemical solution in the process tank can reach a sufficient process temperature and reduce the occurrence of explosion accidents. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of an existing heating device.

[0033] Figure 2 This is a schematic diagram of the heating device provided in an embodiment of the present invention;

[0034] Figure 3A side view of the heating device and process tank provided in an embodiment of the present invention;

[0035] Figure 4 A bottom view of the metal heat-conducting block and heating rod provided in an embodiment of the present invention;

[0036] Figure 5 This is a partial enlarged view of the mating area between the heating rod and the mounting hole provided in an embodiment of the present invention;

[0037] Figure 6 This is a graph showing the relationship between multiple hole gaps and power densities, fitted using the hole gap size design method provided in this embodiment of the invention.

[0038] Figure 7 This is a schematic diagram of the structure of a semiconductor cleaning device provided in an embodiment of the present invention. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions of the present invention, the heating device and semiconductor cleaning equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0040] like Figure 1 As shown, the heating device of traditional semiconductor cleaning equipment typically includes multiple heating elements 01. Since the surface of the heating elements 01 is usually uneven, the plasticity of thermally conductive adhesive is used to attach the heating elements 01 to the flat surface of the process tank. However, the process conditions for attaching the thermally conductive adhesive are quite stringent, specifically including: the thermally conductive adhesive needs to be evenly coated on the surface of the process tank; the thermally conductive adhesive must not contain pores; low-temperature drying is required; and the thermally conductive adhesive must be completely dried before use. Moreover, the thermally conductive adhesive has low thermal conductivity, which leads to a long heating time before the cleaning process begins, and may even result in a low temperature of the cleaning liquid during the cleaning process, thus reducing the cleaning effect.

[0041] To address this technical problem, this embodiment provides a heating device for heating the process tank of a semiconductor cleaning equipment, located outside the process tank. Specifically, the process tank includes an inner tank and an outer tank, with the inner tank situated within the outer tank. The outer wall of the outer tank serves as the outer wall of the process tank. Correspondingly, the heating device is fixed to both sides of the outer wall of the outer tank to heat the cleaning liquid in both the outer and inner tanks. The inner tank is used for the cleaning process and contains flammable and explosive cleaning liquid. The outer tank is used to recover the cleaning liquid overflowing from the inner tank, so it also contains flammable and explosive cleaning liquid. Therefore, when the process tank opening is opened, the cleaning liquid evaporates and mixes with the air inside the semiconductor cleaning equipment to form a flammable and explosive gaseous environment.

[0042] like Figure 2As shown, the heating device includes a housing 2, a metal heat-conducting block 3, and a heating component 4. The housing 2 is connected to the surface of the process tank 1, and the housing 2 and the surface of the process tank 1 form a receiving space. The metal heat-conducting block 3 and the heating component 4 are disposed within this receiving space, so that the housing 2 and the surface of the process tank 1 can, to a certain extent, isolate the flammable and explosive gas environment inside the semiconductor cleaning equipment, thereby reducing the contact between the metal heat-conducting block 3 and the heating component 4 and the flammable and explosive gases.

[0043] It should be noted that, due to the inevitable gaps between the housing 2 and the process tank 1 caused by processing errors during the manufacturing and installation process, and the need to provide some openings on the surface of the housing 2 for the internal cables 42 to be led out, the aforementioned containment space is not a completely sealed space. Therefore, the "to a certain extent of isolation" mentioned above refers to incomplete isolation. However, in actual production, the housing 2 can block most of the gas emitted by the cleaning liquid.

[0044] The heating element 4 in the heating device is connected to the metal heat-conducting block 3. The surface of the metal heat-conducting block 3 facing the process tank 1 is in contact with the surface of the process tank 1 so that the heating element 4 heats the metal heat-conducting block 3. Then the metal heat-conducting block 3 transfers the heat to the process tank 1. Thus, by utilizing the good thermal conductivity of the metal heat-conducting block 3, the heat output by the heating element 4 is efficiently transferred to the process tank 1.

[0045] Compared to the heating device of the traditional semiconductor cleaning equipment mentioned above, the processing and installation method of the metal heat-conducting block 3 in this embodiment is simpler. It only requires cutting or milling to make the surface of the metal heat-conducting block 3 facing the process tank 1 flat, so that it can fit with the flat outer surface of the process tank 1. Moreover, since the material of the metal heat-conducting block 3 is metal, its thermal conductivity is higher than that of thermally conductive putty. Therefore, the heating device in this embodiment heats the process tank 1 faster and can ensure that the temperature of the cleaning liquid is sufficient to clean the parts to be cleaned.

[0046] In some embodiments, the metal heat-conducting block 3 is made of aluminum or stainless steel. Aluminum has a thermal conductivity of approximately 237 W / mK, exhibiting excellent thermal conductivity. Furthermore, pure aluminum has relatively low hardness and strength, making it easy to machine the surface of the aluminum heat-conducting block flat, allowing it to conform to the flat outer surface of the process tank. Stainless steel alloys, on the other hand, have higher strength and hardness, making them more difficult to process; however, stainless steel alloys have high wear resistance, resulting in a longer service life for stainless steel heat-conducting blocks.

[0047] In some embodiments, such as Figure 2 and Figure 3As shown, the heating component 4 includes at least one heating rod 41. Correspondingly, the metal heat-conducting block 3 has multiple mounting holes 31, and the number of mounting holes 31 is the same as the number of heating rods 41, so that the heating rods 41 can be inserted into the mounting holes 31 one by one. Moreover, by installing the heating rods 41 in the metal heat-conducting block 3 by insertion, the metal heat-conducting block 3 body can further isolate the heating rods 41 from the external gas environment, so as to prevent the high-temperature surface of the heating rods 41 from contacting flammable and explosive gases, thereby preventing the ignition of the gas environment.

[0048] Furthermore, a pre-set gap exists between the inner circumferential surface of the mounting hole 31 and the outer circumferential surface of the heating rod 41. Based on the principle of heat conduction, the closer the inner surface of the mounting hole 31 is to the outer circumferential surface of the heating rod 41, the higher the heat transfer efficiency. Therefore, ideally, the inner surface of the mounting hole 31 should be as close as possible to the outer circumferential surface of the heating rod 41 to maximize the heat transfer efficiency between the heating rod 41 and the metal heat-conducting block 3. However, during actual heating, the metal heat-conducting block 3 undergoes thermal deformation under high temperatures, causing the inner diameter of the mounting hole 31 in the metal heat-conducting block to decrease, bringing the inner circumferential surface of the mounting hole 31 closer to the outer circumferential surface of the heating rod 41. This can easily cause the heating rod to be crushed. Therefore, during actual installation, if... Figure 5 As shown, the inner diameter of the mounting hole 31 at room temperature needs to be slightly larger than the outer diameter of the heating rod 41, so that there is a preset hole gap L between the inner circumferential surface of the mounting hole 31 and the outer circumferential surface of the heating rod 41. This prevents the heating rod 41 from being damaged during heating and ensures that the heat transfer rate between the heating rod 41 and the metal heat-conducting block 3 meets the process requirements after the mounting hole 31 undergoes thermal deformation. Moreover, in actual production, the required heat transfer rate is usually as high as possible. Therefore, the size of the preset hole gap L should neither be too small nor too large.

[0049] To improve the heat transfer efficiency between the heating rod and the metal heat-conducting block, this embodiment also provides a method for designing the preset hole gap size between the mounting hole and the heating rod, specifically including the following steps:

[0050] S1: Obtain n metal heat-conducting blocks and arrange them into numbers 1 to n; where n is an integer greater than or equal to 2; specifically, n is, for example, 10;

[0051] S2: Machining mounting holes on metal heat-conducting blocks 1 to n, with the inner diameter of the mounting holes on metal heat-conducting blocks 1 to n increasing by a specified difference amount in sequence, i.e., the inner diameter of the mounting holes on metal heat-conducting blocks 1 to n increases arithmetically; specifically, the specified difference amount is, for example, 0.03 mm.

[0052] S3: Insert multiple heating rods of the same specification into the mounting holes on n metal heat-conducting blocks respectively, and heat the n metal heat-conducting blocks for the same duration with different power densities so that the metal heat-conducting blocks reach multiple different target temperatures. Based on multiple power densities and multiple hole gap values, fit multiple hole gap-power density relationship curves at different target temperatures.

[0053] S4: Based on the actual heating requirements, find the corresponding hole gap in the pre-fitted hole gap-power density relationship curve and use it as the preset hole gap L.

[0054] Based on the above method, the inventors conducted multiple experiments, taking 10 aluminum metal heat-conducting blocks and the mounting hole inner diameter on aluminum metal heat-conducting blocks No. 1 to No. 10 increasing by 0.03 mm in sequence as an example, and obtained the following results. Figure 6 The figure shows six pore gap-power density curves corresponding to six target temperatures, where the horizontal axis represents power density in W / in. 2 (Watts per square inch), the vertical axis represents the hole clearance L between the inner circumferential surface of the mounting hole and the outer circumferential surface of the heating rod, i.e., the difference between the inner radius of the mounting hole and the outer radius of the heating rod, in inches. Taking a target temperature of 200°C as an example, under this condition, if the power density of the heating rod is 350W / in 2 Then you can Figure 6 Find the value of 350W / in on the curve corresponding to 204℃. 2 The corresponding point is used to determine the corresponding hole clearance, which is approximately 0.005 inches, and this is taken as the design value for the hole clearance.

[0055] It should also be noted that since the metal heat-conducting block 3 is attached to the outer surface of the process tank 1, rather than directly contacting the cleaning liquid in the process tank 1, a certain amount of heat loss will inevitably occur during the heat conduction process from the process tank 1 to the cleaning liquid in the tank. Therefore, the above target temperature should be higher than the temperature required for the cleaning process. For example, if the temperature required for the cleaning process is 70°C, then the above target temperature is 200°C.

[0056] To further improve the heat transfer efficiency between the heating rod 41 and the metal heat-conducting block 3, the mounting hole 31 on the metal heat-conducting block 3 needs to be precision machined. Preferably, the tolerance of the hole diameter is controlled within ±0.001in.

[0057] In some embodiments, such as Figure 2As shown, all mounting holes 31 are formed on the surface of the metal heat-conducting block 3 on the side away from the opening of the process tank 1, and extend along the height direction of the process tank. The multiple mounting holes are symmetrically distributed about the central axis of the process tank's width direction. Correspondingly, the heating rods 41 can also be symmetrically distributed about the central axis of the process tank, thereby ensuring uniform heating of the process tank. Figure 2 Taking the heating device shown as an example, there are 4 heating rods; correspondingly, there are 4 mounting holes 31 in the metal heat-conducting block 3, and the 4 mounting holes 31 are divided into two pairs, and the two pairs of mounting holes 31 are symmetrically distributed with respect to the central axis of the metal heat-conducting block 3.

[0058] In some embodiments, the heating component 4 further includes cables 42 corresponding to the heating rods 41 for supplying power to the heating rods 41. One end of the cable 42 is connected to one end of the corresponding heating rod 41, and the other end is connected to an external power source. Specifically, one end of the unconnected cable 42 of all heating rods 41 is inserted into the corresponding mounting hole 31, that is, the cable 42 can be connected to the lower end of the heating rod 41, so that the cable 42 is located away from the opening of the process tank 1, thereby greatly reducing the possibility of the cable 42 coming into contact with flammable and explosive gases, and thus reducing the risk of the cable 42 igniting the gas environment due to electric spark. Moreover, since the cable 42 is located below the metal heat-conducting block 3 and away from the surface of the metal heat-conducting block 3, the cable 42 can be prevented from coming into contact with the high-temperature metal heat-conducting block 3, thereby preventing damage to the cable 42 and preventing the ignition of the gas environment.

[0059] Furthermore, wiring holes are provided on the housing 2; these holes are located on the surface of the housing 2 away from the opening of the process tank 1, allowing the cable 42 to be led out through them. Moreover, the cable 42 located below the heating rod 41 can be integrated and threaded through one or more wiring holes to prevent the cable 42 from tangling and maintain a neat layout within the housing 2. Figure 2 Taking the heating device shown as an example, there are two wiring holes, and the two wiring holes are also symmetrically distributed with respect to the central axis of the metal heat-conducting block 3, so as to lead out the cables 42 of the corresponding pair of heating rods 41 respectively.

[0060] In some embodiments, the housing 2 is provided with an air inlet 21, which is used to communicate with an external purge gas source to purge the internal components of the housing 2 using purge gas. Specifically, during the heating process of the heating device, the purge gas source continuously introduces purge gas into the housing 2 to purge the internal components of the housing 2 to provide positive pressure protection. This not only isolates the flammable and explosive gas environment, but also allows the purge gas to remove the heat from the metal heat-conducting block 3, so as to prevent the metal heat-conducting block 3 from overheating and igniting the gas environment.

[0061] Furthermore, the aforementioned wiring holes also serve as vents for the housing 2 to discharge purge gas, thereby creating a gas flow field inside the housing 2 that can cover the surface of the components. Moreover, reusing the wiring holes as vents for the housing 2 also allows the purge gas to prevent flammable and explosive gases from entering the housing 2 through the wiring holes.

[0062] In some embodiments, such as Figure 3 As shown, the heating rod 41 includes a main body and a connecting part. The main body is cylindrical; the connecting part is an annular body protruding outward from the outer periphery of the main body; the connecting part is used to connect with the surface near the opening of the mounting hole 31. Specifically, as... Figure 4 As shown, the connecting part can be fixed to the bottom of the metal heat-conducting block 3 using screws.

[0063] In some embodiments, such as Figure 2 and Figure 3 As shown, the housing 2 includes a main body 22 and a cover plate 23. The main body 22 surrounds the metal heat-conducting block 3 and the heating component 4. The main body 22 has a first opening and a second opening on each side. The edge of the first opening is sealed to the outer surface of the process tank 1. The cover plate 23 is disposed on the second opening and is sealed to it. Furthermore, since the first and second openings are located on opposite sides of the main body 22, removing the cover plate 23 from the second opening exposes the internal components of the housing 2, facilitating disassembly, assembly, or maintenance by operators. Specifically, the cover plate 23 can be fixed to the main body 22 or the process tank 1 using screws.

[0064] In some preferred embodiments, the housing also includes a baffle plate for preventing dripping or splashing cleaning liquid from falling. The baffle plate is positioned above the housing 2 and perpendicular to the outer wall of the cleaning tank to provide vertical protection; thus, the housing body 22 and the baffle plate work together to create a double barrier against flammable and explosive gases in a direction parallel to the opening of the process tank 1, thereby further preventing the housing from coming into contact with the cleaning liquid.

[0065] In some embodiments, both the main body 22 and the cover plate 23 are made of stainless steel.

[0066] In some embodiments, the heating device further includes a temperature measuring component 5, which is connected to the metal heat-conducting block 3 and is used to detect the temperature of the metal heat-conducting block 3 so that the operator or an external control unit can monitor the temperature of the metal heat-conducting block 3 and prevent the temperature of the metal heat-conducting block 3 from becoming too high.

[0067] In some preferred embodiments, the temperature sensing element 5 is a thermocouple, such as a J-type thermocouple. A temperature sensing hole is provided on the side of the metal heat-conducting block 3 so that the temperature sensing end of the thermocouple can be inserted into the temperature sensing hole; correspondingly, such as... Figure 2 As shown, the side of the housing 2 has lead holes corresponding to the position of the temperature measuring component 5, so as to lead out the signal output terminal of the thermocouple and connect it to an external control unit or temperature display device.

[0068] In some embodiments, such as Figure 2 As shown, the metal heat-conducting block 3 has multiple connecting holes, each extending perpendicularly to the surface of the process tank 1. The surface of the process tank 1 has multiple outwardly protruding studs, and the multiple connecting holes on the metal heat-conducting block 3 correspond one-to-one with the positions of the studs. This ensures that when the metal heat-conducting block 3 is attached to a designated position on the surface of the process tank 1, each stud can pass through the corresponding connecting hole, allowing multiple nuts to be installed on the studs. This stud-nut connection method is used to connect and fix the metal heat-conducting block 3 to the process tank 1. Figure 2 Taking the heating device shown as an example, there are 8 connection holes. Four of them are set at the four corners of the metal heat-conducting block 3, and the other four are set at the central axis of the metal heat-conducting block 3. That is, four connection holes are set at the four corners of the left and right parts of the metal heat-conducting block 3, and the two pairs of heating rods 41 are respectively connected to four connection holes, so that the metal heat-conducting block 3 is subjected to uniform force.

[0069] Furthermore, as mentioned above, the heating device of conventional semiconductor cleaning equipment typically includes multiple heating elements 01, which are attached to the surface of the process tank 1 by thermally conductive adhesive. To ensure the heating elements 01 are securely mounted on the process tank 1, the surface of the process tank 1 is typically provided with multiple studs for connecting to the heating elements 01. Therefore, the connection holes on the metal heat-conducting block 3 in this embodiment can connect with the studs already present on the surface of the process tank 1. Thus, when replacing the conventional heating device with the heating device of this embodiment, no modifications to the surface of the process tank 1 are required; only the original heating elements 01 and the thermally conductive adhesive need to be removed. Moreover, if the heating effect is required to be the same as before the heating device replacement, the surface dimension of the metal heat-conducting block 3 in contact with the process tank 1 can be machined to approximately the contact area between the original heating elements 01 and the process tank 1.

[0070] In some preferred embodiments, a connecting groove 32 is provided on the surface of the metal heat-conducting block 3 corresponding to each connecting hole position to accommodate the nut. This allows the metal heat-conducting block 3 to be fixed to the process groove 1 using a stud-nut connection method, without causing interference between the nut and the cover plate 23.

[0071] As another technical solution, such as Figure 3As shown, this embodiment also provides a semiconductor cleaning apparatus, which includes a process tank 1 and at least two heating devices as described in the above embodiments. The process tank stores cleaning liquid for cleaning the workpiece to be cleaned; the at least two heating devices are respectively arranged on opposite sides of the process tank to uniformly heat the cleaning liquid inside the process tank. Figure 7 As shown, the semiconductor cleaning equipment also includes a first circulation pipe 5, a second circulation pipe 6, and a circulation pump 7. The inlet of the first circulation pipe 5 is connected to the outer tank of the cleaning tank, and the outlet is connected to the circulation pump 7. The outlet of the second circulation pipe 6 is located at the bottom of the inner tank of the cleaning tank and connected thereto, while the inlet is connected to the circulation pump 7. During the cleaning process, the circulation pump 7 drives the cleaning liquid inside the second circulation pipe 6 to continuously flow into the inner tank, and the cleaning liquid in the inner tank continuously overflows from the top opening into the outer tank. The circulation pump 7 also drives the cleaning liquid inside the first circulation pipe 5 to continuously flow into the circulation pump 7, so that the cleaning liquid in the outer tank continuously flows out and can flow back into the first circulation pipe 5 through the circulation pump 7. This achieves a "inner tank-outer tank-circulation pump-inner tank" circulation flow of the cleaning liquid, thereby realizing the recycling of the cleaning liquid. Furthermore, the first circulation pipe 5 and the second circulation pipe 6 are also equipped with on / off valves 8 to control the opening and closing of the pipes.

[0072] The heating device provided in this embodiment is used to heat the process tank of a semiconductor cleaning equipment. The heating device includes a metal heat-conducting block and a heating element. The heating element is connected to the metal heat-conducting block, and the surface of the metal heat-conducting block is in contact with the outer surface of the process tank. This utilizes the good thermal conductivity of the metal heat-conducting block to efficiently transfer the heat output from the heating element to the process tank. The heating device also includes a housing, which, together with the surface of the process tank, forms a space to accommodate the metal heat-conducting block and the heating element, thereby isolating them to a certain extent from the flammable and explosive gas environment inside the semiconductor cleaning equipment. Therefore, the heating device provided in this embodiment, by combining the housing, the metal heat-conducting block, and the heating element, can both ensure the effective heating of the process tank and reduce the risk of explosion inside the semiconductor cleaning equipment.

[0073] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A heating device for heating a process tank in a semiconductor cleaning equipment, disposed outside the process tank; characterized in that, The heating device includes: a housing, a metal heat-conducting block, and heating components; wherein... The housing is connected to the surface of the process tank and can form a receiving space with the surface of the process tank; the metal heat-conducting block and the heating component are disposed in the receiving space; The heating component is connected to the metal heat-conducting block and is used to heat the metal heat-conducting block; the metal heat-conducting block is in contact with the surface of the process tank to transfer heat to the process tank; The heating element includes at least one heating rod; The metal heat-conducting block has multiple mounting holes, and the number of mounting holes is the same as the number of heating rods; the heating rods are inserted into the mounting holes one by one; all the mounting holes are opened on the side surface of the metal heat-conducting block away from the opening of the process tank, and extend along the height direction of the process tank. There is a preset hole gap between the inner circumferential surface of the mounting hole and the outer circumferential surface of the heating rod. The preset hole gap ensures that the heat transfer efficiency between the heating rod and the metal heat-conducting block meets the process requirements.

2. The heating device according to claim 1, characterized in that, The preset orifice gap is the corresponding value of the target temperature of the metal heat-conducting block and the heating power density of the heating rod in a pre-acquired set of curves; wherein, the set of curves includes multiple orifice gap-power density relationship curves at different target temperatures.

3. The heating device according to claim 1, characterized in that, The plurality of mounting holes are symmetrically distributed with the central axis in the width direction of the process groove as the axis of symmetry.

4. The heating device according to claim 1, characterized in that, The heating component also includes cables that correspond one-to-one with the heating rods; one end of the cable is connected to the end of the corresponding heating rod that is not inserted into the mounting hole, and the other end of the cable is used to connect to an external power source. The housing is also provided with wiring holes; the wiring holes are located on the side surface of the housing away from the opening of the process groove; The cable is led out from the wiring hole.

5. The heating device according to claim 4, characterized in that, An air inlet is provided on the box body; The air inlet is used to connect with an external purge air source so as to purge the internal components of the housing using the purge gas; The wiring hole also serves as an air outlet for the housing to discharge the purging gas.

6. The heating device according to claim 1, characterized in that, The heating rod includes a main body and a connecting part; The main body is cylindrical; The connecting part is an annular body that protrudes outward from the outer periphery of the main body; the connecting part is used to connect with the surface near the opening of the mounting hole.

7. The heating device according to claim 1, characterized in that, The metal heat-conducting block material includes aluminum or stainless steel.

8. The heating device according to claim 1, characterized in that, The enclosure includes a main body and a cover plate; The main body of the box surrounds the metal heat-conducting block and the heating component; the main body of the box has a first opening and a second opening on each side; the edge of the first opening is sealed to the outer surface of the process tank; The cover plate is disposed on the second opening and is sealed to the second opening.

9. The heating device according to claim 1, characterized in that, The heating device also includes a temperature measuring component, which is connected to the metal heat-conducting block and is used to detect the temperature of the metal heat-conducting block.

10. A semiconductor cleaning device, characterized in that, It includes a process tank and at least two heating devices as described in any one of claims 1-9, wherein the process tank stores cleaning liquid for cleaning the workpiece to be cleaned; At least two of the heating devices are respectively disposed on opposite sides of the process tank.

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