heat dissipating device

Abstract

The application provides a heat dissipation device for dissipating heat of an electronic device, wherein the electronic device comprises a heat generating element. The heat dissipation device comprises a base, a first heat dissipation mechanism, a second heat dissipation mechanism and a lifting mechanism. The base is in thermal conduction connection with the heat generating element. The first heat dissipation mechanism and the second heat dissipation mechanism are arranged in interval and are arranged on the side of the base away from the heat generating element. The lifting mechanism is connected with the first heat dissipation mechanism and the second heat dissipation mechanism and is used to drive the first heat dissipation mechanism and the second heat dissipation mechanism to move towards different directions relative to the base, so that one of the first heat dissipation mechanism and the second heat dissipation mechanism is relatively close to the base and the other is relatively far away from the base, thereby carrying away the heat conducted from the heat generating element to the base and dissipating the heat into the air.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a heat dissipation device. Background Technology

[0002] With the development of electronic devices, they are required to perform more and more functions, resulting in greater power consumption and increasingly serious heat generation problems. Overheating can not only cause system instability but also lead to device crashes, restarts, and data loss. Summary of the Invention

[0003] This invention provides a heat dissipation device to solve the heat dissipation problem of electronic devices.

[0004] This invention provides a heat dissipation device. The heat dissipation device is used to dissipate heat from an electronic device, which includes a heat-generating element. The heat dissipation device includes a base, a first heat dissipation mechanism, a second heat dissipation mechanism, and a lifting mechanism. The base is thermally connected to the heat-generating element. The first heat dissipation mechanism and the second heat dissipation mechanism are spaced apart and both are located on the side of the base away from the heat-generating element. The lifting mechanism is connected to the first heat dissipation mechanism and the second heat dissipation mechanism and is used to drive the first heat dissipation mechanism and the second heat dissipation mechanism to move in different directions relative to the base, so that one of the first heat dissipation mechanism and the second heat dissipation mechanism is relatively closer to the base, and the other is relatively farther away from the base.

[0005] The heat dissipation device provided by this invention uses a lifting mechanism to alternately move a first heat dissipation mechanism and a second heat dissipation mechanism closer to and further away from the base, so as to remove the heat conducted by the heating element to the base from the base and dissipate it into the air. During the movement of the first and second heat dissipation mechanisms closer to or further away from the base, convection currents are formed with the air, thereby dissipating the heat from the first and second heat dissipation mechanisms into the air more quickly. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 This is a schematic diagram of the heat dissipation device provided in the first embodiment of the present invention.

[0008] Figure 2 yes Figure 1 A schematic diagram of the heat dissipation device in one state after removing part of its structure.

[0009] Figure 3 yes Figure 1 A schematic diagram of the heat dissipation device in another state after part of its structure has been removed.

[0010] Figure 4 This is a schematic diagram of the heat dissipation device provided in the second embodiment of the present invention.

[0011] Figure 5 yes Figure 4 Exploded view of the heat dissipation device.

[0012] Figure 6 This is a schematic diagram of the heat dissipation device provided in the third embodiment of the present invention.

[0013] Figure 7 This is a schematic diagram of the heat dissipation device provided in the fourth embodiment of the present invention.

[0014] Figure 8 yes Figure 7 The heat dissipation device is shown in a cross-sectional view along line AA after part of its structure has been removed.

[0015] Explanation of main component symbols

[0016] Heat dissipation devices 10a, 10b, 10c, 10d

[0017] Base 100

[0018] Support structure 110

[0019] First support shaft 111

[0020] Second support shaft 112

[0021] 120 heat dissipation rail

[0022] baffle 130

[0023] First support plate 131

[0024] Second support plate 132

[0025] First heat dissipation mechanism 200

[0026] First elastic element 210

[0027] First guide rod 220

[0028] First rack 221

[0029] First fixing part 222

[0030] First heat sink 230

[0031] Second heat dissipation mechanism 300

[0032] Second elastic element 310

[0033] Second guide rod 320

[0034] Second rack 321

[0035] Second fixing part 322

[0036] Second heat sink 330

[0037] Lifting mechanism 400

[0038] First Drive Unit 410

[0039] First rotating wheel 411a, 411b

[0040] First connecting strip 412

[0041] First support 413

[0042] Second drive unit 420

[0043] Second rotor 421a, 421b

[0044] Second connecting strip 422

[0045] Second support 423

[0046] Connecting part 430

[0047] 431 transmission belt

[0048] First arc portion 431a

[0049] Second arc portion 431b

[0050] First straight section 431c

[0051] Second straight section 431d

[0052] Connecting wheel 432

[0053] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0054] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0055] It should be understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0056] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set on" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0057] Please see Figure 1 , Figure 1 This is a schematic diagram of the heat dissipation device 10a provided in the first embodiment of the present invention. The heat dissipation device 10a is used to dissipate heat from electronic devices to prevent the electronic devices from overheating. The heat dissipation device 10a includes a base 100, a first heat dissipation mechanism 200, a second heat dissipation mechanism 300, and a lifting mechanism 400. The base 100 is thermally connected to the heat-generating element in the electronic device so that the base 100 absorbs the heat emitted by the heat-generating element. The first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 are spaced apart and are both located on the side of the base 100 away from the heat-generating element. The lifting mechanism 400 is connected to the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 and is used to drive the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 to move in different directions relative to the base 100, so that one of the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 is relatively closer to the base 100 and the other is relatively farther away from the base 100, thereby removing the heat conducted from the heat-generating element to the base 100 and dissipating it into the air.

[0058] The first heat dissipation mechanism 200 includes a first elastic element 210 connected to the lifting mechanism 400, and the second heat dissipation mechanism 300 includes a second elastic element 310 connected to the lifting mechanism 400. Both the first elastic element 210 and the second elastic element 310 possess two-way shape memory capability, exhibiting different shapes under different triggering conditions. Preferably, the first elastic element 210 and the second elastic element 310 are constructed as springs made of a two-way shape memory alloy material. A two-way shape memory alloy is a smart material capable of remembering two inherent shapes. When the temperature of the two-way shape memory alloy is above its first phase transition temperature, it is in the first inherent shape; when the temperature of the two-way shape memory alloy is below its second phase transition temperature, it is in the second inherent shape. Changing the ratio of the metal components in the two-way shape memory alloy can alter its first and second phase transition temperatures. The two inherent shapes of the two-way shape memory alloy can be manually set as needed. In this embodiment, the first inherent shape of the first elastic element 210 and the second elastic element 310 is set to the shape when the spring is in an extended state, and the second inherent shape is set to the shape when the spring is in a compressed state. When the first elastic element 210 and the second elastic element 310 are near the base 100, they are heated to a temperature above their first phase transition temperature and spontaneously deform into a compressed state; when they are away from the base 100, they are cooled to a temperature below their second phase transition temperature and spontaneously deform into an extended state. In some embodiments, the first elastic element 210 and the second elastic element 310 may be made of other materials with shape memory capabilities, such as shape memory polymers. In some embodiments, the two inherent shapes of the first elastic element 210 and the second elastic element 310 can be specifically set according to actual needs, and are not specifically limited in this invention.

[0059] The first heat dissipation mechanism 200 further includes a first guide rod 220 and a first heat dissipation component 230, and the second heat dissipation mechanism 300 further includes a second guide rod 320 and a second heat dissipation component 330. The first guide rod 220 and the second guide rod 320 are respectively connected to the lifting mechanism 400. A first elastic member 210 is movably sleeved on the first guide rod 220. The end of the first elastic member 210 near the lifting mechanism 400 is fixed relative to the first guide rod 220, and the end away from the lifting mechanism 400 is a free end, which is movable relative to the first guide rod 220. A second elastic member 310 is movably sleeved on the second guide rod 320. The end of the second elastic member 310 near the lifting mechanism 400 is fixed relative to the second guide rod 320, and the end away from the lifting mechanism 400 is a free end, which is movable relative to the second guide rod 320.

[0060] The first heat sink 230 is movably mounted on the first guide rod 220 and fixedly connected to the free end of the first elastic member 210. The second heat sink 330 is movably mounted on the second guide rod 320 and fixedly connected to the free end of the second elastic member 310. The lifting mechanism 400 is used to make the first guide rod 220 and the second guide rod 320 alternately approach and move away from the base 100, so that the first elastic member 210 and the second elastic member 310 alternately absorb and dissipate heat, thereby causing the first heat sink 230 and the second heat sink 330 to move in different directions to alternately approach and move away from the lifting mechanism 400. Preferably, the first heat sink 230 and the second heat sink 330 are made of a material with good thermal conductivity. The side of the first heat sink 230 and the second heat sink 330 facing away from the base 100 is provided with a fin structure to increase the heat dissipation area of ​​the first heat sink 230 and the second heat sink 330, thereby removing the heat from the base 100 more quickly. Preferably, the first heat sink 230 and the second heat sink 330 are provided with grooves, and the free ends of the first elastic element 210 and the second elastic element 310 are disposed in the grooves, so that the first heat sink 230 and the second heat sink 330 cover the free ends of the first elastic element 210 and the second elastic element 310, thereby heating or cooling the first elastic element 210 and the second elastic element 310 more quickly and reducing the deformation time of the first elastic element 210 and the second elastic element 310.

[0061] In this embodiment, the first heat sink 230 and the second heat sink 330 are provided with through holes, and the first heat sink 230 and the second heat sink 330 are respectively passed through the first guide rod 220 and the second guide rod 320. Preferably, the first guide rod 220 and the second guide rod 320 are provided with guide structures in the axial direction, and the first heat sink 230 and the second heat sink 330 are provided with mating structures that cooperate with the guide structures. The guide structures and the mating structures are used to prevent the first heat sink 230 from rotating relative to the first guide rod 220 and the second heat sink 330 from rotating relative to the second guide rod 320. For example, the guide structure can be configured as a guide groove formed on the first guide rod 220 and the second guide rod 320, and the mating structure can be configured as a guide slider that cooperates with the guide groove, so that the first heat sink 230 and the second heat sink 330 will not rotate when sliding along the first guide rod 220 and the second guide rod 320. In some embodiments, the first guide rod 220 and the second guide rod 320 can be constructed as prism structures. Preferably, a baffle is provided at the end of the first guide rod 220 and the second guide rod 320 facing away from the lifting mechanism 400 to prevent the first heat sink 230 and the second heat sink 330 from sliding off the first guide rod 220 and the second guide rod 320. In some embodiments, multiple first guide rods 220 and multiple second guide rods 320 may be provided. The multiple first guide rods 220 are arranged in parallel, and the first heat sink 230 is movably disposed on the side of the multiple first guide rods 220 facing away from the base 100; the multiple second guide rods 320 are arranged in parallel, and the second heat sink 330 is movably disposed on the side of the multiple second guide rods 320 facing away from the base 100. Preferably, the multiple first guide rods 220 are arranged side-by-side with respect to the base 100, each first guide rod 220 being spaced equidistant from the base 100; the multiple second guide rods 320 are arranged side-by-side with respect to the base 100, each second guide rod 320 being spaced equidistant from the base 100.

[0062] A heat dissipation guiding structure is provided on the base 100, and a heat dissipation mating structure is provided on the first heat dissipation component 230 and the second heat dissipation component 330 to cooperate with the heat dissipation guiding structure. In this embodiment, the heat dissipation guiding structure is configured as a heat dissipation guide rail 120 protruding from the base 100, and the heat dissipation mating structure is configured as a heat dissipation groove formed on the first heat dissipation component 230 and the second heat dissipation component 330 to cooperate with the heat dissipation guide rail 120. When the first heat dissipation component 230 and the second heat dissipation component 330 alternately approach the base 100, they alternately abut against the base 100. When the first heat dissipation component 230 and the second heat dissipation component 330 abut against the base 100, the heat dissipation groove and the heat dissipation guide rail 120 interlock and interweave, and the inner wall of the heat dissipation groove is in contact with the outer wall of the heat dissipation guide rail 120, thereby greatly increasing the contact area between the first heat dissipation component 230 and the second heat dissipation component 330 and the base 100, and thus improving the heat conduction efficiency between the first heat dissipation component 230, the second heat dissipation component 330 and the base 100. In some embodiments, the first heat sink 230 and the second heat sink 330 are provided with protruding heat dissipation guide rails, and the base 100 is provided with heat dissipation grooves that cooperate with the heat dissipation guide rails. In some embodiments, when the first heat sink 230 and the second heat sink 330 are positioned close to the base 100, they can be spaced at a preset distance from the base 100, that is, the first heat sink 230 and the second heat sink 330 do not contact the base 100 when they are close to it, so as to avoid impact between the first heat sink 230 and the second heat sink 330 and the base 100 when they are close to it, thereby improving the stability of the heat dissipation device 10a during operation. The preset distance can be specifically set according to the actual heat dissipation requirements, and is not specifically limited in this invention. In some embodiments, the base 100 may also be provided with heat dissipation fins to increase the overall heat dissipation capacity of the heat dissipation device 10a.

[0063] The lifting mechanism 400 includes a first drive unit 410, a second drive unit 420, and a connecting unit 430. The first drive unit 410 and the second drive unit 420 are connected via the connecting unit 430, and both the first drive unit 410 and the second drive unit 420 are rotatably connected to the base 100. The first drive unit 410 is connected to the first heat dissipation mechanism 200, allowing the first heat dissipation mechanism 200 to move closer to or further away from the base 100; the second drive unit 420 is connected to the second heat dissipation mechanism 300, allowing the second heat dissipation mechanism 300 to move closer to or further away from the base 100.

[0064] In this embodiment, the first driving unit 410 includes a first rotating wheel 411a, and the second driving unit 420 includes a second rotating wheel 421a. A support structure 110 for supporting the first driving unit 410 and the second driving unit 420 is provided on the base 100. The support structure 110 includes a first support shaft 111 and a second support shaft 112 arranged in parallel, with the first support shaft 111 located between the second support shaft 112 and the base 100. The first rotating wheel 411a is rotatably mounted on the first support shaft 111, and the second rotating wheel 421a is rotatably mounted on the second support shaft 112. The connecting part 430 is configured as a transmission belt 431, which is mounted on the first rotating wheel 411a and the second rotating wheel 421a. The transmission belt 431 is configured as a flexible structure, and when rotating, it can drive the first rotating wheel 411a and the second rotating wheel 421a to rotate. The transmission belt 431 is constructed as an elongated circular loop structure, comprising a first arcuate portion 431a and a second arcuate portion 431b at its two ends, and a first straight portion 431c and a second straight portion 431d located between the two arcuate portions. The first arcuate portion 431a covers the first pulley 411a, and the second arcuate portion 431b covers the second pulley 421a. The first straight portion 431c and the second straight portion 431d are arranged opposite to each other.

[0065] The first rotating wheel 411a and the second rotating wheel 421a are constructed as spur gears. The transmission belt 431 is constructed as a belt. The belt structure has toothed grooves for meshing with the spur gears. The first rotating wheel 411a and the second rotating wheel 421a rotate synchronously via the belt structure. In some embodiments, the first rotating wheel 411a and the second rotating wheel 421a can be constructed as sprockets, pulleys, synchronous pulleys, etc., and the transmission belt 431 can be correspondingly constructed as a chain, belt, synchronous belt, etc.

[0066] The first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 are disposed on opposite sides of the lifting mechanism 400. The first heat dissipation mechanism 200 is fixedly connected to the side of the first straight portion 431c opposite to the second straight portion 431d, and the second heat dissipation mechanism 300 is fixedly connected to the side of the second straight portion 431d opposite to the first straight portion 431c. The first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 are connected by a transmission belt 431. When the first heat dissipation mechanism 200 approaches the base 100, it drives the transmission belt 431 to rotate, causing the second heat dissipation mechanism 300 to move away from the base 100; conversely, when the second heat dissipation mechanism 300 approaches the base 100, it drives the transmission belt 431 to rotate, causing the first heat dissipation mechanism 200 to move away from the base 100.

[0067] A first rack 221 is provided at one end of the first guide rod 220 near the first straight portion 431c, and the first straight portion 431c has a toothed structure that engages with the first rack 221. A second rack 321 is provided at one end of the second guide rod 320 near the second straight portion 431d, and the second straight portion 431d has a toothed structure that engages with the second rack 321. A baffle 130 for supporting the first rack 221 and the second rack 321 is provided on the base 100. The baffle 130 includes a first support plate 131 and a second support plate 132. The first support plate 131 is disposed on the side of the first rack 221 opposite to the first straight portion 431c, so that the first rack 221 is engaged with the first straight portion 431c, thereby fixing the first guide rod 220 relative to the first straight portion 431c. The second support plate 132 is disposed on the side of the second rack 321 opposite to the second straight portion 431d, so that the second rack 321 and the second straight portion 431d are engaged, thereby fixing the second guide rod 320 relative to the second straight portion 431d. The extension direction of the first guide rod 220 is perpendicular to the extension direction of the first straight portion 431c, and the extension direction of the second guide rod 320 is perpendicular to the extension direction of the second straight portion 431d. In some embodiments, the first guide rod 220 and the second guide rod 320 can be fixedly connected to the first straight portion 431c and the second straight portion 431d respectively by means of welding, bonding, snap-fitting, etc.

[0068] The heat dissipation device 10a includes a first heat dissipation process and a second heat dissipation process. During the first heat dissipation process, the first heat dissipation mechanism 200 is positioned close to the base 100 and is in a heat absorption state. At this time, the connection between the first rack 221 and the first straight portion 431c is located at the end of the first straight portion 431c near the first rotating wheel 411a. The first heat dissipation element 230 abuts against the base 100, and the heat dissipation grooves on the first heat dissipation element 230 interlock with the heat dissipation guide rail 120 on the base 100. The first elastic element 210 and the first heat dissipation element 230 continuously absorb heat from the base 100, causing their own temperatures to rise continuously. After the temperature of the first elastic element 210 exceeds its first phase transition temperature, the first elastic element 210 deforms from its original elongated state to a compressed state, and drives the first heat dissipation element 230 to move closer to the lifting mechanism 400 along the first guide rod 220, so that the center of gravity of the first heat dissipation mechanism 200 moves closer to the lifting mechanism 400.

[0069] The second heat dissipation mechanism 300 is located away from the base 100 and is in a heat dissipation state. At this time, the connection between the second rack 321 and the second straight portion 431d is located at the end of the second straight portion 431d near the second rotating wheel 421a. The second heat dissipation component 330 is separated from the base 100. The second elastic component 310 and the second heat dissipation component 330 continuously dissipate their own heat into the air, causing their own temperature to drop continuously. After the temperature of the second elastic component 310 is lower than its second phase transition temperature, the second elastic component 310 will deform from its original compressed state to an elongated state, and push the second heat dissipation component 330 away from the lifting mechanism 400 along the second guide rod 320, so that the center of gravity of the second heat dissipation mechanism 300 is away from the lifting mechanism 400.

[0070] Please see Figure 2 , Figure 2 The length of the lever arm L1 is the distance between the center of gravity of the first heat dissipation mechanism 200 and the rotation center of the first rotating wheel 411a; the length of the lever arm L2 is the distance between the center of gravity of the second heat dissipation mechanism 300 and the rotation center of the second rotating wheel 421a. After the first heat dissipation component 230 and the second heat dissipation component 330 move to a point where the length of lever arm L1 is less than the length of lever arm L2, under the action of gravity, the torque formed by the second heat dissipation mechanism 300 on the second rotating wheel 421a will be greater than the torque formed by the first heat dissipation mechanism 200 on the first rotating wheel 411a. Therefore, the rotation tendency of the second rotating wheel 421a will be greater than that of the first rotating wheel 411a. Thus, the first rotating wheel 411a and the second rotating wheel 421a will rotate along... Figure 2 Rotating in the D1 direction causes the first heat dissipation mechanism 200 to move away from the base 100 and the second heat dissipation mechanism 300 to move closer to the base 100. The first and second heat dissipation mechanisms 200 and 300 will continue to move under inertia until the second heat dissipation component 330 on the second heat dissipation mechanism 300 moves to contact the base 100. At this point, the first and second heat dissipation mechanisms 200 and 300 will temporarily stop moving, and the first heat dissipation process will end.

[0071] Subsequently, the heat dissipation device 10a will perform a second heat dissipation process. During the second heat dissipation process, the first heat dissipation mechanism 200 is located away from the base 100 and is in a heat dissipation state. At this time, the first elastic member 210 and the first heat dissipation member 230 continuously dissipate their own heat into the air, causing their own temperature to drop continuously. After the temperature of the first elastic member 210 is lower than its second phase transition temperature, the first elastic member 210 will deform from its original compressed state to an elongated state and push the first heat dissipation member 230 away from the lifting mechanism 400 along the first guide rod 220, so that the center of gravity of the first heat dissipation mechanism 200 is away from the lifting mechanism 400.

[0072] The second heat dissipation mechanism 300 is located near the base 100 and is in a heat absorption state. At this time, the second elastic element 310 and the second heat dissipation element 330 will continuously absorb heat from the base 100, causing their own temperature to rise continuously. After the temperature of the second elastic element 310 exceeds its first phase transition temperature, the second elastic element 310 will deform from its original elongated state to a compressed state, and drive the second heat dissipation element 330 to move closer to the lifting mechanism 400 along the second guide rod 320, so that the center of gravity of the second heat dissipation mechanism 300 moves closer to the lifting mechanism 400.

[0073] like Figure 3 As shown, after the first heat sink 230 and the second heat sink 330 move to a point where the length of lever arm L1 is greater than the length of lever arm L2, under the action of gravity, the torque formed by the first heat dissipation mechanism 200 on the second rotating wheel 421a will be greater than the torque formed by the second heat dissipation mechanism 300 on the first rotating wheel 411a. Therefore, the rotational tendency of the second rotating wheel 421a will be greater than that of the first rotating wheel 411a. Thus, the first rotating wheel 411a and the second rotating wheel 421a will move along... Figure 3 Rotating in the D2 direction causes the first heat dissipation mechanism 200 to move closer to the base 100, and the second heat dissipation mechanism 300 to move away from the base 100. Figure 2 The D1 direction and Figure 3 The directions of D2 in the middle are opposite. The first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 will continue to move under the action of inertia until the first heat dissipation component 230 on the first heat dissipation mechanism 200 moves to abut against the base 100. Then the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 will temporarily stop moving, the second heat dissipation process ends, and then the heat dissipation device 10a will continue to carry out the first heat dissipation process.

[0074] Thus, the first and second heat dissipation processes will automatically alternate, with the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 alternately actively removing heat from the base 100 and dissipating it into the air. The heat dissipation device 10a in this invention actively dissipates heat through the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300. This not only allows the base 100 to have a larger heat dissipation area, but also allows the first and second heat dissipation mechanisms 200 and 300 to form convection currents with the air as they move closer to or away from the base 100, enabling the heat on the first and second heat dissipation mechanisms 200 and 300 to dissipate into the air more quickly, thereby greatly improving the heat dissipation efficiency of the heat dissipation device 10a. Furthermore, the heat dissipation device 10a utilizes the temperature difference between the base 100 and the ambient air, converting the temperature difference energy into mechanical energy through the first elastic element 210 and the second elastic element 310. This allows the first and second heat dissipation mechanisms 200 and 300 to autonomously and alternately move closer to and away from the base 100, thus eliminating the need for additional active drive structures on the heat dissipation device 10a.

[0075] Please see Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of the heat dissipation device 10b provided in the second embodiment of the present invention. Figure 5 This is an exploded view of the heat dissipation device 10b provided in the second embodiment of the present invention. The heat dissipation device 10b provided in the second embodiment of the present invention has a similar structure to the heat dissipation device 10a in the first embodiment, except that the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 are disposed on the same side of the lifting mechanism 400.

[0076] Specifically, the first drive unit 410 includes a first rotating wheel 411a and a first rotating wheel 411b, and the second drive unit 420 includes a second rotating wheel 421a and a second rotating wheel 421b. The connecting part 430 is configured as a connecting rotating wheel 432 that cooperates with the first rotating wheel 411a and the second rotating wheel 421a. The first rotating wheel 411a and the second rotating wheel 421a are respectively sleeved on both ends of the first support shaft 111, and the first rotating wheel 411b and the second rotating wheel 421b are respectively sleeved on both ends of the second support shaft 112. The first rotating wheel 411a and the first rotating wheel 411b are located on the same side of the first support shaft 111 and the second support shaft 112, and the second rotating wheel 421a and the second rotating wheel 421b are also located on the same side of the first support shaft 111 and the second support shaft 112.

[0077] A first connecting belt 412 is fitted onto the outer sides of the first rotating wheels 411a and 411b. The first connecting belt 412 has a ring-shaped structure and is elongated oval after being fitted onto the first rotating wheels 411a and 411b. The two arc-shaped sections on the first connecting belt 412 correspond to the first rotating wheels 411a and 411b, respectively, and there is a straight section between the two arc-shaped sections. The first heat dissipation mechanism 200 is fixedly connected to the straight section on the first connecting belt 412. When the first rotating wheels 411a and 411b rotate, they will drive the first connecting belt 412 to rotate, so that the first heat dissipation mechanism 200 moves closer to or further away from the base 100.

[0078] A second connecting belt 422 is fitted onto the outer side of the second rotating wheel 421a and the second rotating wheel 421b. The second connecting belt 422 has a ring-shaped structure and is elongated oval after being fitted onto the second rotating wheel 421a and the second rotating wheel 421b. The two arc-shaped sections on the second connecting belt 422 correspond to the second rotating wheel 421a and the second rotating wheel 421b, respectively, and there is a straight section between the two arc-shaped sections. The second heat dissipation mechanism 300 is fixedly connected to the straight section on the second connecting belt 422. When the second rotating wheel 421a and the second rotating wheel 421b rotate, they will drive the second connecting belt 422 to rotate, so that the second heat dissipation mechanism 300 moves closer to or further away from the base 100.

[0079] The first rotating wheel 411a, the first rotating wheel 411b, the second rotating wheel 421a, and the second rotating wheel 421b are constructed as spur gears. The first connecting belt 412 and the second connecting belt 422 are constructed as belts. The belts have toothed grooves for meshing with the spur gears. The connecting wheel 432 is constructed as a bevel gear. A bevel gear for meshing with the connecting wheel 432 is provided on the side of the first rotating wheel 411a facing the second rotating wheel 421a, and a bevel gear for meshing with the connecting wheel 432 is provided on the side of the second rotating wheel 421a facing the first rotating wheel 411a. Preferably, the central axis of the connecting wheel 432 is perpendicular to the central axes of the first rotating wheel 411a and the second rotating wheel 421a. The connecting wheel 432 is used to reverse the rotation directions of the first wheel 411a and the second wheel 421a, and thus reverse the rotation directions of the first connecting belt 412 and the second connecting belt 422, thereby causing the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 to move in different directions relative to the base 100. In some embodiments, the first wheel 411a, the first wheel 411b, the second wheel 421a and the second wheel 421b can be constructed as a sprocket structure, a pulley structure, a synchronous belt structure, etc., and the first connecting belt 412 and the second connecting belt 422 can be correspondingly constructed as a chain structure, a belt structure, a synchronous belt structure, etc.

[0080] In some embodiments, the connecting portion 430 can be configured as a flexible connecting rope, one end of which is wound around the first rotating wheel 411a in a first direction, and the other end of which is wound around the second rotating wheel 421a in a second direction. The first and second directions are opposite in direction. When the first rotating wheel 411a rotates in the second direction, more of the connecting rope is wound around it, causing the second rotating wheel 421a to rotate and release the connecting rope wound on it. When the second rotating wheel 421a rotates in the first direction, more of the connecting rope is wound around it, causing the first rotating wheel 411a to rotate and release the connecting rope wound on it. Thus, the connecting rope allows the first and second rotating wheels 411a to rotate in opposite directions.

[0081] In the second embodiment, the connecting wheel 432 is used to conduct the torque exerted by the first heat dissipation mechanism 200 on the first wheel 411a and the torque exerted by the second heat dissipation mechanism 300 on the second wheel 421a. During the first heat dissipation process of the heat dissipation device 10b, the second heat dissipation mechanism 300 is located away from the base 100. After the second elastic member 310 deforms from a compressed state to an extended state, the second heat dissipation member 330 will be located away from the second drive unit 420. The first heat dissipation mechanism 200 is located away from the base 100, and after the first elastic member 210 deforms from an extended state to a compressed state, the first heat dissipation member 230 will be located away from the first drive unit 410. Therefore, the torque exerted by the second heat dissipation mechanism 300 on the second wheel 421a is greater than the torque exerted by the first heat dissipation mechanism 200 on the first wheel 411a. Under the conduction of the connecting wheel 432, the second wheel 421a will drive the first wheel 411a to rotate through the connecting wheel 432. The second heat dissipation mechanism 300 will move closer to the base 100, while the first heat dissipation mechanism 200 will move further away from the base 100. During the second heat dissipation process of the heat dissipation device 10b, the torque exerted by the first heat dissipation mechanism 200 on the first rotating wheel 411a is greater than the torque exerted by the second heat dissipation mechanism 300 on the second rotating wheel 421a. The first rotating wheel 411a will drive the second rotating wheel 421a to rotate via the connecting wheel 432. By connecting the wheel 432, the heat dissipation device 10b changes the direction of torque transmission between the first and second rotating wheels 411a without altering the magnitude of the torque exerted on them. This results in the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 being arranged side-by-side on the same side of the lifting mechanism 400, thereby reducing the overall length of the heat dissipation device 10b and making its structure more compact.

[0082] Please see Figure 6 , Figure 6This is a schematic diagram of the structure of the heat dissipation device 10c provided in the third embodiment of the present invention. The heat dissipation device 10c provided in the third embodiment of the present invention is similar in structure to the heat dissipation device 10a in the first embodiment, except that the first driving part 410 is configured as a first bracket 413, the second driving part 420 is configured as a second bracket 423, and the first bracket 413 and the second bracket 423 are disposed on two opposite sides of the connecting part 430.

[0083] In this embodiment, one first bracket 413 and one second bracket 423 are each provided. The support structure 110 is constructed as a support shaft, and the connecting part 430 passes through the support shaft and is rotatable relative to the support shaft. The first bracket 413 and the second bracket 423 are connected together by the connecting part 430, and the relative positions of the first bracket 413 and the second bracket 423 remain relatively fixed. The end of the first bracket 413 facing away from the connecting part 430 is connected to the first heat dissipation mechanism 200, and the end of the second bracket 423 facing away from the connecting part 430 is connected to the second heat dissipation mechanism 300. The first heat dissipation mechanism 200 and the second heat dissipation mechanism 300 are arranged on two opposite sides of the connecting part 430, so that the first heat dissipation mechanism 200, the second heat dissipation mechanism 300 and the lifting mechanism 400 form a seesaw-like structure. Among them, the first guide rod 220 is fixedly connected to the end of the first bracket 413 facing away from the connecting part 430, and the second guide rod 320 is fixedly connected to the end of the second bracket 423 facing away from the connecting part 430. Preferably, the first guide rod 220 and the second guide rod 320 are arranged in parallel.

[0084] During the first heat dissipation process of the heat dissipation device 10c, the first heat sink 230 abuts against the base 100, and the base 100 conducts heat to the first elastic element 210 and the first heat sink 230. When the temperature of the first elastic element 210 exceeds its first phase transition temperature, the first elastic element 210 deforms from its elongated state to a compressed state, and moves the first heat sink 230 closer to the connecting portion 430, thus reducing the torque exerted by the first heat dissipation mechanism 200 on the connecting portion 430. The second heat sink 330 is located away from the base 100, and the second elastic element 310 and the second heat sink 330 dissipate their own heat into the air. When the temperature of the second elastic element 310 falls below its second phase transition temperature, the second elastic element 310 deforms from its compressed state to an elongated state, and pushes the second heat sink 330 away from the connecting portion 430, thus increasing the torque exerted by the second heat dissipation mechanism 300 on the connecting portion 430. When the torque exerted by the first heat dissipation mechanism 200 on the connecting portion 430 is less than the torque exerted by the second heat dissipation mechanism 300 on the connecting portion 430, the unbalanced torque on both sides of the connecting portion 430 will drive the connecting portion 430 to rotate, causing the first heat dissipation mechanism 200 to move away from the base 100 and the second heat dissipation mechanism 300 to move closer to the base 100. After the second heat dissipation component 330 abuts against the base 100, the connecting portion 430 will stop rotating, and at this time, the heat dissipation device 10c will begin the second heat dissipation process. The second heat dissipation process of the heat dissipation device 10c is similar to its first heat dissipation process. When the torque exerted by the first heat dissipation mechanism 200 on the connecting portion 430 is greater than the torque exerted by the second heat dissipation mechanism 300 on the connecting portion 430, the connecting portion 430 will rotate, causing the first heat dissipation mechanism 200 to move closer to the base 100 and the second heat dissipation mechanism 300 to move away from the base 100. In the heat dissipation device 10c, the first heat dissipation mechanism 200, the second heat dissipation mechanism 300 and the lifting mechanism 400 are configured as a seesaw-like structure, which greatly simplifies the structure of the lifting mechanism 400 and makes the manufacturing and assembly of the lifting mechanism 400 easier.

[0085] Please see Figure 7 , Figure 7This is a schematic diagram of the structure of the heat dissipation device 10d provided in the fourth embodiment of the present invention. The heat dissipation device 10d provided in the fourth embodiment of the present invention is similar in structure to the heat dissipation device 10c in the third embodiment, except that there are two first supports 413 and two second supports 423. The two first supports 413 are arranged parallel to each other, with one of the two first supports 413 located between the other and the base 100. The two second supports 423 are also arranged parallel to each other, with one of the two second supports 423 located between the other and the base 100. The first guide rod 220 has a first fixing part 222, which has two through holes, and the two first supports 413 are respectively inserted into the two through holes. The second guide rod 320 has a second fixing part 322, which also has two through holes, and the two second supports 423 are respectively inserted into the two through holes. Preferably, the extension directions of the main body of the first guide rod 220 and the second guide rod 320 are perpendicular to the extension directions of the first fixing part 222 and the second fixing part 322, respectively. In the fourth embodiment, two first guide rods 220 and two second guide rods 320 are provided. The two first guide rods 220 are arranged in parallel, and the first heat sink 230 passes through the two first guide rods 220. The two second guide rods 320 are arranged in parallel, and the second heat sink 330 passes through the two second guide rods 320.

[0086] Please see Figure 8 , Figure 8 yes Figure 7 The heat dissipation device 10d is shown in cross-section along line AA after removing part of its structure. The first fixing part 222, the second fixing part 322, the two first supports 413, the two second supports 423, and the connecting part 430 together constitute a parallelogram linkage mechanism. This parallelogram linkage mechanism maintains its parallelogram shape during rotation, ensuring that opposite sides remain parallel. In this embodiment, the extension directions of the first fixing part 222 and the second fixing part 322 are set perpendicular to the base 100, so that the first fixing part 222 and the second fixing part 322 remain perpendicular to the base 100 during the rotation of the two first supports 413 and the two second supports 423 around the connecting part 430. This ensures that the first guide rod 220 and the second guide rod 320 remain parallel to the base 100 during movement. In this way, the contact area of ​​the first heat sink 230 and the second heat sink 330 when they come into contact with the base 100 can be maximized, thereby improving the heat conduction efficiency between the first heat sink 230 and the second heat sink 330 and the base 100.

[0087] In some embodiments, multiple first supports 413 and multiple second supports 423 may be provided, with the multiple first supports 413 arranged in parallel and the multiple second supports 423 arranged in parallel. Preferably, the number of first supports 413 and multiple second supports 423 is set to be the same.

[0088] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A heat dissipation device applied to an electronic device, the electronic device including a heat-generating element, characterized in that, include: The base is thermally connected to the heating element; First heat dissipation mechanism; The second heat dissipation mechanism is provided, with the first heat dissipation mechanism and the second heat dissipation mechanism arranged at intervals, and both are located on the side of the base away from the heat-generating element; as well as A lifting mechanism is connected to the first heat dissipation mechanism and the second heat dissipation mechanism, and is used to drive the first heat dissipation mechanism and the second heat dissipation mechanism to move in different directions relative to the base, so that one of the first heat dissipation mechanism and the second heat dissipation mechanism is relatively close to the base, and the other is relatively far away from the base, so as to dissipate the heat conducted by the heating element to the base into the air. The first heat dissipation mechanism includes a first elastic element and a first guide rod. The first elastic element is connected to the lifting mechanism. The first elastic element is movably sleeved on the first guide rod. A first heat dissipation element is fixedly connected to the end of the first elastic element away from the lifting mechanism. The first heat dissipation element is movably disposed on the first guide rod. The second heat dissipation mechanism includes a second elastic element and a second guide rod. The second elastic element is connected to the lifting mechanism and is movably sleeved on the second guide rod. A second heat dissipation element is fixedly connected to the end of the second elastic element away from the lifting mechanism. The second heat dissipation element is movably disposed on the second guide rod. The first elastic element and the second elastic element have two-way shape memory capability. The first elastic element and the second elastic element alternately absorb and dissipate heat, so that the first heat dissipation element and the second heat dissipation element move in different directions.

2. The heat dissipation device according to claim 1, characterized in that, The first heat dissipation mechanism and the second heat dissipation mechanism are located on the same side of the lifting mechanism; or, they are located on opposite sides of the lifting mechanism.

3. The heat dissipation device according to claim 1, characterized in that, The first heat dissipation mechanism and the second heat dissipation mechanism can alternately abut against the base.

4. The heat dissipation device according to claim 1, characterized in that, The base is provided with a heat dissipation guiding structure, and the first heat dissipation mechanism and the second heat dissipation mechanism are provided with heat dissipation cooperating structures that cooperate with the heat dissipation guiding structure.

5. The heat dissipation device according to claim 1, characterized in that, The lifting mechanism includes a first driving part, a second driving part, and a connecting part; the first driving part and the second driving part are connected by transmission through the connecting part, and both the first driving part and the second driving part are rotatably connected to the base; the first driving part is connected to the first heat dissipation mechanism so that the first heat dissipation mechanism is close to or far away from the base, and the second driving part is connected to the second heat dissipation mechanism so that the second heat dissipation mechanism is far away from or close to the base.

6. The heat dissipation device according to claim 5, characterized in that, The first drive unit includes a first rotating wheel, and the second drive unit includes a second rotating wheel; The connecting portion is configured as a transmission belt, which is sleeved on the first and second rotating wheels so that the first and second rotating wheels rotate in the same direction. The transmission belt is sandwiched between the first and second heat dissipation mechanisms; or... The connecting part is configured as a connecting wheel, and the first wheel is rotatably connected to the second wheel through the connecting wheel so that the first wheel and the second wheel rotate in opposite directions; the first wheel is covered with a first connecting belt, and the first heat dissipation mechanism is connected to the first connecting belt; the second wheel is covered with a second connecting belt, and the second heat dissipation mechanism is connected to the second connecting belt.

7. The heat dissipation device according to claim 5, characterized in that, The first driving part is configured as a first bracket, and the second driving part is configured as a second bracket. The first bracket and the second bracket are disposed on two opposite sides of the connecting part. The end of the first bracket away from the connecting part is connected to the first heat dissipation mechanism, and the end of the second bracket away from the connecting part is connected to the second heat dissipation mechanism. The first support and the second support are configured as one or more; when the first support and the second support are configured as multiple, the multiple first supports are arranged in parallel with each other, and the multiple second supports are arranged in parallel with each other.

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