Semiconductor device transfer apparatus

Abstract

The application discloses a semiconductor equipment conveying device, which comprises a wafer conveying bearing platform, and a plurality of ceramic pieces with annular and inclined bottom edges are movably arranged on the wafer conveying bearing platform. The semiconductor equipment conveying device is different from the prior art, and the protruding length of the ceramic piece protruding points can be adjusted by using an adjusting mechanism, so that the use requirement of different production conditions can be met, and the application range is wide. In addition, the plurality of ceramic pieces and the ceramic piece protruding points thereon can be disassembled on the wafer conveying bearing platform according to different production conditions by using a clamping mechanism, so that the production requirement of products can be met without replacing a new wafer conveying bearing platform under some production conditions, and the problem that the process defects are caused by the abnormal number of particles is avoided, and the semiconductor equipment conveying device is convenient to use.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of particle improvement devices, in particular to a semiconductor equipment conveying device. BACKGROUND

[0002] In the prior art, the wafer conveying bearing platform contacts the back of the wafer, and in some production cases, the wafer edge contacts the ceramic protrusion of the platform itself due to the error of the mechanical transmission arm, which causes abnormal particle quantity and process defects. However, in other production cases, the existence of the ceramic protrusion of the platform itself does not cause abnormal particle quantity and process defects.

[0003] At present, the ceramic pieces on the existing wafer conveying bearing platform are generally fixed on the wafer conveying bearing platform and cannot be switched, disassembled and used according to different use cases. In some production cases, a new wafer conveying bearing platform needs to be replaced to ensure that abnormal particle quantity does not cause process defects, which is inconvenient to use. In addition, the protruding length of the ceramic protrusion is not convenient to adjust, so it cannot be adjusted and used according to the actual production situation, and the application range is limited. Therefore, we propose a semiconductor equipment conveying device. SUMMARY

[0004] The present application aims to provide a semiconductor equipment conveying device to solve the problems in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a semiconductor equipment conveying device, comprising a wafer conveying bearing platform, a plurality of ceramic pieces with a ring-shaped inclined edge at the bottom end are movably inserted into the wafer conveying bearing platform, the wafer conveying bearing platform is provided with a plurality of insertion cavities matched with the ceramic pieces, the interior of the ceramic piece is slidably connected with a ceramic protrusion, the interior of the ceramic piece is provided with an expansion cavity matched with the ceramic protrusion, the ceramic protrusion is installed between the corresponding ceramic piece, and the ceramic piece is installed between the wafer conveying bearing platform and the clamping mechanism.

[0006] The side wall of the ceramic protrusion is fixed with a sliding block one, the side wall of the expansion cavity is provided with a sliding groove one matched with the corresponding sliding block one, and the bottom end of the ceramic protrusion is connected with the inner bottom wall of the corresponding expansion cavity through a spring one.

[0007] As a preferred embodiment, the adjusting mechanism comprises a moving rod slidably connected in the corresponding expansion cavity, and the two ends of the moving rod are fixed with sliding blocks two.

[0008] As preferred, the two sides of the telescopic cavity are provided with two sliding grooves matched with the two sliding blocks, and one end of each of the two sliding blocks is connected with the inner wall of one side of the corresponding sliding groove through a spring.

[0009] As preferred, the side wall of the moving rod towards the protrusion of the ceramic piece is fixed with a plurality of equidistantly arranged triangular blocks, the side wall of the protrusion of the ceramic piece is fixed with a trapezoidal block matched with the triangular blocks, a hand screw is screwed on the ceramic piece, and one end of the hand screw abuts against the side wall of the moving rod.

[0010] As preferred, the clamping mechanism comprises a clamping block slidingly connected in the wafer conveying bearing platform, one end of the clamping block is provided in an inclined manner, the wafer conveying bearing platform is internally provided with a movable cavity matched with the clamping block, the other end of the clamping block is connected with the inner wall of one side of the movable cavity through a spring three, and the side wall of the ceramic piece is provided with a clamping groove matched with the clamping block.

[0011] As preferred, the bottom end of the clamping block is fixed with a sliding block three, the inner bottom wall of the movable cavity is provided with a sliding groove three matched with the sliding block three, the top end of the clamping block is fixed with a push column, and the wafer conveying bearing platform is provided with a pushing groove matched with the push column, and the pushing groove is communicated with the movable cavity.

[0012] Compared with the prior art, the present application has the following advantages:

[0013] The present application is different from the prior art, and the adjusting mechanism can adjust the extension length of the protrusion of the ceramic piece to meet the use requirements of different production conditions, and has a wide application range. In addition, the clamping mechanism can disassemble and assemble the plurality of ceramic pieces and the protrusions of the ceramic pieces on the wafer conveying bearing platform according to different production conditions, so that the wafer conveying bearing platform does not need to be replaced to meet the production requirements of the product under some production conditions, thereby ensuring that the problem of abnormal particle number causing process defects will not occur, and the use is more convenient. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a schematic structural view of the whole application;

[0015] Figure 2 It is a schematic structural view of the side view of the application;

[0016] Figure 3 It is a schematic structural view of the enlarged structure at A;

[0017] Figure 4 It is a schematic plan view of each component of the adjusting mechanism and the clamping mechanism of the application.

[0018] In the figure: 1, wafer conveying bearing platform; 2, ceramic piece; 21, ceramic piece protruding point; 22, sliding block one; 23, spring one; 3, adjusting mechanism; 301, moving rod; 302, sliding block two; 303, triangular block; 304, spring two; 305, hand screw; 306, trapezoidal block; 4, insertion cavity; 5, clamping mechanism; 501, clamping block; 502, sliding block three; 503, spring three; 504, push column; 505, push groove. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0020] Please refer to Figures 1-4 The present application provides a technical solution: a semiconductor equipment conveying device, comprising a wafer conveying bearing platform 1, a plurality of ceramic pieces 2 with annular inclined edges at the bottom are movably inserted on the wafer conveying bearing platform 1, the wafer conveying bearing platform 1 is provided with insertion cavities 4 matched with the ceramic pieces 2, the ceramic pieces 2 are internally slidably connected with ceramic piece protruding points 21, and the ceramic pieces 2 are internally provided with expansion cavities matched with the ceramic piece protruding points 21.

[0021] One side wall of the ceramic piece protruding point 21 is fixed with a sliding block one 22, a sliding groove one matched with the corresponding sliding block one 22 is formed in one side wall of the expansion cavity, the bottom end of the ceramic piece protruding point 21 is connected with the inner bottom wall of the corresponding expansion cavity through a spring one 23, the spring one 23 can make the moving rod 301 drive the plurality of triangular blocks 303 to move away from the trapezoidal blocks 306, and then automatically reset the ceramic piece protruding point 21, and the cross section of the sliding block one 22 is T-shaped.

[0022] Further, the ceramic part protrusion 21 is provided with an adjusting mechanism 3 between the ceramic part 2, the adjusting mechanism 3 comprises a moving rod 301 slidably connected in the corresponding telescopic cavity, both ends of the moving rod 301 are fixed with a sliding block two 302, both sides of the inner wall of the telescopic cavity are provided with a sliding groove two matched with the sliding block two 302, one end of the sliding block two 302 is connected with a spring two 304 between one side of the inner wall of the corresponding sliding groove two, a plurality of equidistantly arranged triangular blocks 303 are fixed on one side wall of the moving rod 301 facing the ceramic part protrusion 21, a trapezoidal block 306 matched with the plurality of triangular blocks 303 is fixed on one side wall of the ceramic part protrusion 21, a hand screw 305 is screw-connected on the ceramic part 2, one end of the hand screw 305 abuts against one side wall of the moving rod 301, the hand screw 305 is arranged to fix the position of the moving rod 301 and prevent loosening, the vertical section of the sliding block two 302 is T-shaped or inverted T-shaped.

[0023] Further, the ceramic part 2 is provided with a clamping mechanism 5 between the wafer conveying bearing platform 1, the clamping mechanism 5 comprises a clamping block 501 slidably connected in the wafer conveying bearing platform 1, one end of the clamping block 501 is arranged in an inclined manner, the inside of the wafer conveying bearing platform 1 is provided with a movable cavity matched with the clamping block 501, the other end of the clamping block 501 is connected with a spring three 503 between one side of the inner wall of the movable cavity, one side wall of the ceramic part 2 is provided with a clamping groove matched with the clamping block 501, the bottom end of the clamping block 501 is fixed with a sliding block three 502, the inner bottom wall of the movable cavity is provided with a sliding groove three matched with the sliding block three 502, the top end of the clamping block 501 is fixed with a push column 504, the wafer conveying bearing platform 1 is provided with a pushing groove 505 matched with the push column 504, the pushing groove 505 is communicated with the movable cavity, the vertical section of the sliding block three 502 is inverted T-shaped.

[0024] In use, when the extension length of the ceramic part protrusion 21 needs to be adjusted, the hand screw 305 is loosened, the ceramic part protrusion 21 is continuously pressed, the trapezoidal block 306 on one side wall of the ceramic part protrusion 21 extrudes the triangular block 303 below, the moving rod 301 moves through the two sliding block two 302, and the spring two 304 is compressed, after adjustment, the hand screw 305 is locked to fix the ceramic part protrusion 21 after adjustment, which ensures that it can be used according to different production conditions of the existing equipment, secondly, when the number of particles needs to be reduced, the ceramic part 2 can be removed from the wafer conveying bearing platform one by one, so that the needle-shaped tool is inserted into the pushing groove 505 and moves the push column 504, then drives the clamping block 501 to move and make the clamping block 501 separate from the clamping groove on the side wall of the ceramic part 2, so that the ceramic part 2 is conveniently removed, which can reduce the number of particles, and can be switched and adjusted according to actual production conditions, and has wide application range.

[0025] It has to be noted that, in the present document, the terms "first", "second", etc. merely serve to identify different entities or actions from each other, without necessarily requiring or implying any actual relationship or order between these entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0026] While embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, changes, and alterations can be made by those skilled in the art without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device transfer apparatus comprising a wafer transfer carrier platform (1), characterized in that: The wafer conveying bearing platform (1) is movably inserted with a plurality of ceramic pieces (2) with annular inclined edges, the wafer conveying bearing platform (1) is provided with a plurality of insertion cavities (4) matched with the ceramic pieces (2), the ceramic pieces (2) are slidably connected with ceramic piece protrusions (21), the ceramic pieces (2) are provided with expansion cavities matched with the ceramic piece protrusions (21), the ceramic piece protrusions (21) are provided with adjusting mechanisms (3) matched with the corresponding ceramic pieces (2), and the ceramic pieces (2) are provided with clamping mechanisms (5) matched with the wafer conveying bearing platform (1). The ceramic piece protrusions (21) are provided with sliding blocks (22) on one side wall, the expansion cavities are provided with sliding grooves (1) matched with the corresponding sliding blocks (22) on one side wall, and the ceramic piece protrusions (21) are connected with the inner bottom walls of the corresponding expansion cavities through springs (23). The adjusting mechanism (3) comprises a moving rod (301) slidably connected in the corresponding expansion cavity, and the moving rod (301) is provided with sliding blocks (302) on both ends. The moving rod (301) is provided with a plurality of equidistantly arranged triangular blocks (303) on one side wall facing the ceramic piece protrusions (21), the ceramic piece protrusions (21) are provided with trapezoidal blocks (306) matched with the triangular blocks (303), the ceramic pieces (2) are screw-connected with hand screws (305), and one end of the hand screw (305) abuts against one side wall of the moving rod (301). The clamping mechanism (5) comprises a clamping block (501) slidably connected in the wafer conveying bearing platform (1), one end of the clamping block (501) is provided in an inclined manner, the wafer conveying bearing platform (1) is provided with a movable cavity matched with the clamping block (501), the other end of the clamping block (501) is connected with one side inner wall of the movable cavity through a spring (503), and one side wall of the ceramic piece (2) is provided with a clamping groove matched with the clamping block (501).

2. A semiconductor device transfer apparatus according to claim 1, wherein: The expansion cavities are provided with sliding grooves (2) matched with the sliding blocks (302) on both side inner walls, and the sliding blocks (302) are connected with one side inner walls of the corresponding sliding grooves (2) through springs (304).

3. The semiconductor device transfer apparatus according to claim 1, wherein: The clamping block (501) is provided with a sliding block (502) at the bottom, the inner bottom wall of the movable cavity is provided with a sliding groove (3) matched with the sliding block (502), the clamping block (501) is provided with a pushing column (504) at the top, the wafer conveying bearing platform (1) is provided with a pushing groove (505) matched with the pushing column (504), and the pushing groove (505) is communicated with the movable cavity.

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