A multifunctional patch device and patch method thereof

Abstract

The present invention provides a multifunctional chip mounting device and a chip mounting method thereof, the method comprising: a welding arm assembly picking up and adsorbing the chip to be mounted from a material box; a dual-field vision assembly moving into the lower surface of the chip to be mounted and aligning the chip to be mounted; a coarse motion mechanism moving the chip mounting substrate into the field of view of the dual-field vision assembly and fixing the position of the wafer stage; a double-sided imaging lens simultaneously collecting alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; a fine adjustment mechanism moving and adjusting the position of the chip mounting substrate in three dimensions according to the alignment results of the dual-field vision assembly to ensure that the positions of the chip to be mounted and the chip mounting substrate overlap; when the alignment calibration process is completed, the dual-field vision assembly horizontally moves out of the mounting area of ​​the chip to be mounted; and a dispensing assembly moves vertically with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate. Therefore, the present invention improves the chip mounting accuracy while being able to accommodate a large mounting force.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit chip packaging, and in particular to a multifunctional patch device and a patch method thereof. Background Art

[0002] With the emerging development of industries such as big data, optical communications, artificial intelligence and lasers, higher requirements are placed on the computing speed, volume and bandwidth of semiconductor chips. In addition, performance such as low power consumption, low heat generation and large storage capacity also need to be taken into consideration.

[0003] In addition, as the requirements for chip manufacturing precision become increasingly higher, higher requirements are also placed on the integrated interconnection of chips. Those skilled in the art are aware that the integrated interconnection technology of chips has gone through traditional packaging and advanced packaging processes. In other words, eutectic flip-chip, 2.5D packaging and 3D packaging technologies are increasingly valued by major packaging and testing manufacturers, especially the research and development of high-bandwidth communications and high-power semiconductor lasers in various colleges and scientific research institutions, which has spawned a variety of experimental equipment for chip integrated packaging. Among them, placement machines (eutectic welders and pressure welders) are important equipment for packaging and interconnection applications.

[0004] In chip packaging and interconnection technology, there are often multiple mounting processes due to different integration processes and uses. For example, according to the placement method, it is divided into face-up and flip-down methods. According to the connection formation process, it is divided into dispensing process, eutectic welding process, ultrasonic welding, hot pressing welding and laser welding.

[0005] According to functional requirements, the placement device is generally equipped with an adsorption module for transporting the chips to be mounted, a wafer table for placing materials such as chips or substrates, an alignment and registration module for chips or chips and substrates, and other auxiliary modules.

[0006] Due to the diversity of chip placement processes, chip placement equipment must be able to adapt to a wide range of sizes, high pressure, high precision, and rapid heating, while also maintaining low cost. Existing chip placement equipment typically uses a suction component that uses a horizontal rotating arm to transfer and transport chips, or a vertical flip arm to transport chips. During the chip placement process, insufficient placement force is often applied.

[0007] In order to exert a larger bonding force, the industry currently uses an up and down moving rotating arm to transfer and transport chips. The chip alignment module in the above-mentioned bonding device usually needs to adopt multiple visual alignment units. For example, a group of visual alignment units are arranged above and below, and the alignment of the chip and the substrate is achieved according to the coordinate conversion relationship of each visual alignment unit.

[0008] However, since the above solution introduces multiple reference and calibration links, the implementation mechanism is relatively complicated. In addition, if the alignment vision unit is replaced by a microscope and placed above or on the side of the bonding arm, only the edge of the chip can be observed. In the flip-chip process, the bottom features of the chip, such as bumps, cannot be collected, resulting in poor patch accuracy.

[0009] Therefore, how to improve the patch accuracy while reducing the manufacturing cost and volume of the patch device is an urgent problem that the industry needs to solve. Summary of the Invention

[0010] The purpose of the present invention is to provide a multifunctional patch device and a patch method thereof, so that they can be compatible with a larger patch force and improve the patch accuracy in the research and development, manufacturing and small-batch production processes of chip packaging.

[0011] To achieve the above object, the technical solution of the present invention is as follows:

[0012] A multifunctional patch device, comprising:

[0013] A welding arm assembly that moves vertically up and down, including a clamping member, a suction member mounted on the clamping member, and a drive assembly that controls the vertical movement of the clamping member. The suction member has a set of vacuum inner holes for picking up and placing the chips to be mounted, and moves vertically with the clamping member.

[0014] A dispensing assembly is mounted on the welding arm assembly and moves vertically with the welding arm assembly; wherein the dispensing assembly includes a dispensing rail and a dispensing head that reciprocates on the axis of the dispensing rail, the axis of the dispensing rail and the vertical axis of movement of the welding arm assembly being arranged at an angle θ; when the dispensing head moves to the lowest end, it coincides with the axis of the welding arm assembly;

[0015] A horizontally movable dual-field vision component is positioned between the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate during alignment calibration; the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly; and when the alignment calibration is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted;

[0016] A wafer stage, comprising a mounting platform; the mounting platform is used to carry the chip mounting substrate, and during alignment calibration, the coarse adjustment mechanism and the fine adjustment mechanism move and adjust the position of the mounting platform in three dimensions according to the calibration results of the dual-field vision component;

[0017] The double-sided imaging lens simultaneously captures the alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate, and transmits them to the control component. The control component adjusts the position of the chip mounting substrate so that the chip to be mounted is accurately attached to the chip mounting substrate.

[0018] Furthermore, the multifunctional chip placement device further includes a set of side-view auxiliary sensing components, located on the left and right sides of the welding arm assembly, for real-time side-viewing of process issues during the placement process. The side-view auxiliary sensing components include a variable-focus lens, a lens holder, a slide rail for adjusting the lens position, and a fixture that rotates around the lens holder. Furthermore, during the placement process, when the chip to be placed approaches the substrate, the edge features of the chip to be placed assist in verifying chip alignment.

[0019] Furthermore, the driving component is a first motor, which drives the clamping member to move linearly to achieve the picking and placement of the chip to be mounted and provide chip mounting force, and the force direction of the chip mounting force and the force point of the chip are on the same axis.

[0020] Furthermore, the driving component also includes a second motor for driving rotation, a force measuring unit, a buffer unit and an adsorption tool. According to the detection result of the force measuring unit, the buffer unit makes the patch force provided by the adsorption tool a predetermined value to ensure that the chip to be mounted is smooth and without impact, and without position displacement.

[0021] Furthermore, the wafer stage also includes a coarse movement mechanism, a fine adjustment mechanism and a locking mechanism; the coarse movement mechanism is a group of air flotation units including multiple air flotation pads, the fine adjustment mechanism is arranged on the coarse movement stage, and is used for aligning the chip to be mounted and the chip mounting substrate, and the locking stage is located between the air flotation unit and the support stage; when the coarse movement mechanism is moved into position, the coarse movement mechanism is fixed by opening the vacuum adsorption unit or the electromagnetic adsorption unit on the locking stage.

[0022] Furthermore, a heating unit is arranged in the mounting platform for heating the chip to be mounted or the chip mounting substrate.

[0023] Furthermore, the variable-focus lens is a double-sided imaging lens, and the dual-field visual component also includes an image acquisition unit and a GUI monitoring interface; the GUI monitoring interface receives the image captured by the image acquisition unit and visually presents the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.

[0024] Furthermore, during face-down mounting, the distance between the alignment point on the chip to be mounted and the alignment point on the chip mounting substrate is δ.

[0025] Furthermore, during flip-chip mounting, the position of the chip mounting substrate is adjusted by a fine adjustment mechanism, and the bumps of the flip-chip to be mounted and all the bumps of the chip mounting substrate are observed in real-time imaging to see whether they overlap.

[0026] To achieve the above object, another technical solution of the present invention is as follows:

[0027] A multifunctional patch method, which uses the multifunctional patch device described above, comprises:

[0028] Step S1: Before starting the patch process, the soldering arm assembly picks up and absorbs the chip to be mounted from the magazine; wherein the chip to be mounted is a flip-chip chip to be mounted or a normal-mounted chip to be mounted;

[0029] Step S2: the dual-field vision component is moved onto the lower surface of the chip to be mounted and aligned with the chip to be mounted; wherein the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly;

[0030] Step S3: the coarse motion mechanism moves the substrate carrying the chip mounting into the field of view of the dual-field vision component and fixes the position of the wafer stage; when flipping, the double-sided imaging lens simultaneously collects the alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; when mounting upright, the double-sided imaging lens preferentially collects the chip front information in step S1 and records the position of the front mark of the chip to be mounted in the visual interface. In the step, the alignment mark on the upper surface of the chip mounting substrate is set through the visual interface; the fine adjustment mechanism moves and adjusts the position of the chip mounting substrate in the three-dimensional direction according to the alignment result of the dual-field vision component to ensure that the positions of the chip to be mounted and the chip mounting substrate overlap;

[0031] Step S4: After the alignment calibration process is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted;

[0032] Step S5: the dispensing assembly moves vertically together with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.

[0033] It can be seen from the above technical solutions that the multifunctional patch device and patch method provided by the present invention have the following beneficial technical effects:

[0034] ①. It can meet the multifunctional mounting processes such as face-up and flip-chip, as well as the mounting methods such as dispensing, eutectic and hot pressing under this process, and can achieve a mounting accuracy of 1 to 3 μm;

[0035] ②. It supports high pressure and large size range patch, simple alignment operation, flexible patch method, compact equipment structure, small footprint, suitable for chip packaging R&D, manufacturing and small batch production;

[0036] ③. It can adapt to a larger substrate size range and a larger pressure range, while meeting the placement requirements for high-precision positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 Shown is a schematic diagram of the multifunctional patch device of the present invention

[0038] Figure 2 Shown is a schematic diagram of a dual-view alignment component in an embodiment of the present invention

[0039] Figure 3 Shown is a schematic diagram of the patch and glue layout mechanism in an embodiment of the present invention

[0040] Figure 4 The figure shows a schematic diagram of the axonometric mechanism of the wafer table in an embodiment of the present invention.

[0041] Figure 5 The figure shows a flow chart of the multifunctional patch method in an embodiment of the present invention.

[0042] Figure 6 Shown is a schematic diagram of the mounting mode of the face-up and flip-up mounting in an embodiment of the present invention

[0043] Figure 7 The figure shows the process flow of flip chip hot pressing welding in the embodiment of the present invention.

[0044] Figure 8 The figure shows the process flow of the positive mounting dispensing patch in the embodiment of the present invention.

[0045] 1. Dual-view vision assembly 2. Welding arm assembly 3. Glue dispensing assembly 4. Side view auxiliary observation system

[0046] 5 Wafer stage assembly 6 Support platform 11 Chip to be mounted 12 Substrate 13 Dual field of view lens

[0047] 14 Detection camera 15 Chip mark 16 Substrate mark 17 Dual field of view optical axis

[0048] 21 adsorption support part 22 adsorption part 23 welding arm axis 31 dispensing head 32 dispensing guide rail

[0049] 33 dispensing guide axis 51 mounting table 52 feeding table 53 rotating table 54 air flotation component

[0050] 541 air flotation hole 55 tilting table 551 preloaded part 552 precision screw

[0051] 56 X-axis adjustment table 57 Y-axis adjustment table 58 Z-axis adjustment table 6 Support platform

[0052] 71 flip chip 710 flip chip bump 72 flip substrate 720 flip substrate bump

[0053] 73 Forward-mounted chip 730 Forward-mounted chip alignment point 74 Forward-mounted substrate

[0054] 740 Formal substrate alignment point 75GUI monitoring interface 750 Formal chip marking line

[0055] 751 standard baseboard DETAILED DESCRIPTION

[0056] The following is combined with Figure 1-8 , the specific implementation methods of the present invention are further described in detail.

[0057] See also Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a multifunctional patch device according to the present invention. Figure 1 As shown, the multifunctional patch device includes a horizontally moving dual-field vision component 1, a vertically moving up and down welding arm component 2, a dispensing component 3, a side-view auxiliary sensing component 4, a wafer stage 5 including coarse and fine movement, and a control component (not shown in the figure).

[0058] During the alignment calibration process, the dual-field vision component is located between the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly; when the alignment calibration process is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted.

[0059] Specifically, the dual-field vision component includes a set of double-sided imaging lenses, a lens bracket and a slide rail for adjusting the lens position, a fixture that rotates around the lens bracket, an image acquisition unit and a GUI monitoring interface; the GUI monitoring interface receives the image captured by the image acquisition unit and visually presents the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.

[0060] See also Figure 2 , Figure 2 The figure shows a schematic diagram of a dual field of view alignment component in an embodiment of the present invention. Figure 2 As shown, the dual-field vision component 1 includes a set of dual-field lenses 11 for double-sided imaging and a detection camera 14 for imaging. In addition to being able to move in the X direction to the bottom of the welding arm assembly 2 to complete the alignment function, the dual-field lens 13 can also achieve high-precision movement in the X and Y directions, thereby expanding the observation alignment range of the visual system in the horizontal direction.

[0061] like Figure 2 As shown, the component marked 11 is the chip to be mounted, and the component marked 12 is the chip mounting substrate, which has a mark or outline pattern for alignment, such as Figure 2 As shown in the mark 15 and mark 16 in the figure, the mark is directly imaged on the detection camera 14, which can observe the positions of the two marks in real time and display the misalignment of the upper and lower marks.

[0062] In order to achieve high-precision alignment, the dual-view lens 13 itself generally has a small field of view and can be moved in the X and Y directions to find more alignment points to observe whether the position to be mounted and the posture of the chip overlap, including horizontal displacement and rotation angle.

[0063] In an embodiment of the present invention, a welding arm assembly that moves vertically up and down may include a clamping member, an adsorption member mounted on the clamping member, and a driving assembly that controls the vertical movement of the clamping member. The adsorption member has a group of vacuum inner holes for picking up and placing the chip to be mounted, and moves vertically with the clamping member.

[0064] The dispensing assembly is installed on the welding arm assembly and moves vertically with the welding arm assembly; wherein, the dispensing assembly includes a dispensing slide rail and a dispensing head that reciprocates on the axis of the dispensing slide rail, and the axis of the dispensing slide rail and the vertical movement axis of the welding arm assembly are arranged at an angle θ; when the dispensing head moves to the lowermost end, it coincides with the axis of the welding arm assembly.

[0065] See also Figure 3 , Figure 3 The figure shows a schematic diagram of the patch and glue dispensing layout mechanism in an embodiment of the present invention. Figure 3 As shown, the welding arm assembly 2 includes a clamping member 21 and a suction member 22. The suction member 22 is a component with a set of vacuum inner holes for picking up and placing chips. It is installed on the clamping member 22 and moves vertically with the clamping member 21. Figure 3 The dispensing assembly 3 is mounted on the welding arm assembly 2 and moves vertically with the welding arm assembly 2.

[0066] In an embodiment of the present invention, the dispensing assembly 2 includes a dispensing head 31 and a dispensing slide 32. The axis 33 of the slide is arranged at an angle θ to the vertical movement axis 23 of the welding arm assembly 2. The vertical movement axis 23 of the welding arm is coaxial with the optical axis 17 of the dual-view visual assembly, and the dispensing head 31 can reciprocate on the slide axis 33. When it moves to the lower end, it coincides with the welding arm axis 23. The size of the angle θ is based on the non-interference between the tilting movement of the dispensing head 31 and the adsorption member 22. This layout ensures that after the chip alignment on the adsorption member 22 of the welding arm is completed, the dispensing head 31 can move directly to the lower end and move vertically with the welding arm to complete the dispensing action. After the dispensing is completed, the dispensing head returns to its original initial position, and the chip in front of the adsorption member 22 ( Figure 3 (not shown) can be mounted directly onto the dispensed substrate.

[0067] The advantage of the above layout is that it can achieve precise dispensing. For example, for chips with a size of only a few hundred microns or even tens of microns, the position of the dispensing head 31 can be observed by the dual-field lens 1 before dispensing to ensure that it coincides with the position to be dispensed. At the same time, it also ensures that the moving end of the dispensing head 31 coincides with the vertical movement axis 23 of the welding arm, thereby ensuring that the chip placement and dispensing alignment are completed simultaneously, saving placement and alignment time. Furthermore, the dispensing head 31 on the dispensing assembly 3 can be replaced with a UV curing head to achieve UV curing after dispensing, which is not shown in the figure.

[0068] In an embodiment of the present invention, the vertical movement support of the welding arm assembly 2 can be an independent support column or a gantry bracket. The driving assembly includes a first motor, which can be a rotating motor that can achieve high pressure or a direct drive motor that can start and stop at high speed. The first motor drives the clamping member 21 to move linearly to realize the picking and placement of the chip to be mounted, and provide chip mounting force, and the force direction of the chip mounting force and the force point of the chip are on the same axis.

[0069] In addition, the driving component may also include a second motor for driving rotation, a force measuring unit, a buffer unit and an adsorption tool. According to the detection result of the force measuring unit, the buffer unit makes the patch force provided by the adsorption tool a predetermined value to ensure that the chip to be mounted is smooth, without impact and position displacement.

[0070] In some preferred embodiments of the present invention, the welding arm assembly 2 may further include the following units ( Figure 3(Unlabeled in the figure): a unit for setting the rotation of the suction member 22 around the welding arm axis 23 (i.e., a second motor); a force measuring unit for measuring the placement force; a heating unit for heating the suction member; a lifting unit for vertical movement of the welding arm assembly 2; and a buffer unit for chip suction, which reduces chip displacement deviation caused by the suction tool impacting the chip. In other words, these components can cooperate to complete processes such as chip rotation adjustment and hot press bonding.

[0071] In some preferred embodiments of the present invention, a group of side-view auxiliary sensing components 4 may also be included, which are arranged on the left and right sides of the welding arm component 2, and are used to observe process problems in the chip mounting process in real time from the side. The side-view auxiliary sensing components include a group of variable-focus lenses, lens holders, and slide rails for adjusting the lens position, and a fixture that rotates around the lens holder; and when the chip to be mounted approaches the substrate, the edge features of the chip to be mounted can be used to assist in completing the chip alignment and verification.

[0072] Specifically, the side-view auxiliary sensing component has two functions. One is to observe process problems in the mounting process in real time from the side, such as the melting process of solder and other solders, and the overflow of glue during chip mounting; the other is to assist in completing the chip alignment review function through the edge features of the chip to be mounted when the chip approaches the substrate during the mounting process.

[0073] See also Figure 4 ,like Figure 4 As shown, the wafer stage 5 includes a coarse adjustment mechanism, a fine adjustment mechanism, a material supply table 52 and a mounting table 51. The coarse adjustment table can mainly include a group of flotation components 54, and a plurality of air holes 541 are provided on the flotation component 54 for passing compressed gas or vacuum; wherein, the compressed gas is used for the flotation support of the wafer stage 5. When the position of the wafer stage 5 needs to be adjusted over a large range, or operations such as loading are required, a large range of rapid movement in the X direction and / or Y direction can be achieved; and when the coarse adjustment is in place, it is switched to the vacuum channel, and after the vacuum is passed, the flotation component 54 can be fixed on the support platform 6 (such as Figure 1 As shown), after the wafer stage 5 is adjusted into place, vacuum adsorption is performed to fix and lock the wafer stage 5.

[0074] The fine-adjustment mechanism comprises, from bottom to top, a tilt adjustment stage 55, an X-axis adjustment stage 56, a Y-axis adjustment stage 57, a Z-axis adjustment stage 58, and a θz-axis rotation stage 53. The tilt adjustment stage 55 is equipped with multiple sets of preload elements 551 and precision screws 552 for adjusting the horizontality of the wafer stage 5. This, in conjunction with other fine-adjustment functions, allows for precise adjustment of the degrees of freedom of the support platform 6.

[0075] The feeding table 52 and the mounting table 51 are arranged on the top of the wafer stage 5 to realize material supply and chip mounting. A substrate adsorption plate and a substrate heating unit (not shown) are arranged inside the mounting table 51.

[0076] In addition, the drive of the above-mentioned fine adjustment mechanism can adopt the high-precision micrometer head device shown in this embodiment, but is not limited to this. It can also be implemented using an electric fine adjustment mechanism. Moreover, in the coarse locking function in this embodiment, in addition to the vacuum adsorption mentioned above, the electromagnetic adsorption function can also be adopted. The electromagnet is arranged at the bottom of the air flotation component 54 or in the supporting platform 6 thereunder, and the corresponding magnetic core is arranged at the corresponding position.

[0077] See also Figure 1 The support platform 6 is a platform for mounting and placing other components. It can be set to a larger platform size according to the maximum size of the chip mounting substrate, such as supporting 4-inch, 6-inch, or 8-inch materials. To ensure smooth operation of the air flotation assembly 54 on the wafer stage 5, the upper surface of the support platform 6 needs to be finely ground. Stable marble platforms, cast iron platforms, and stainless steel platforms can be used.

[0078] In an embodiment of the present invention, the control component can be implemented using control hardware and / or control software (not shown in the figure), and in conjunction with the above-mentioned mechanism, various functions such as upright and flip-up mounting of the chip can be realized. Among them, in the upright mounting process, the control software interface can make scale marking lines within the field of view of the visual system, which are used to pre-set the position of the chip to be mounted. Specifically, the spacing between the alignment points on the chip to be mounted and the alignment points on the chip mounting substrate is δ. When the chip is to be mounted, the substrate can be moved to the scribed line position through the dual-field vision component 1 to realize the upright mounting function. In the flip-up mounting process, multiple bumps on the lower surface of the chip and the upper surface of the substrate are directly observed at the same time to realize the chip after alignment.

[0079] See also Figure 5 , Figure 5 FIG. 1 is a flow chart of a multifunctional patch method according to an embodiment of the present invention. Figure 5 As shown, the patch method specifically includes the following steps:

[0080] Step S1: Before starting the patch process, the soldering arm assembly picks up and absorbs the chip to be mounted from the magazine; wherein the chip to be mounted is a flip-chip chip to be mounted or a normal-mounted chip to be mounted;

[0081] Step S2: the dual-field vision component is moved onto the lower surface of the chip to be mounted and aligned with the chip to be mounted; wherein the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly;

[0082] Step S3: The coarse motion mechanism moves the chip mounting substrate into the field of view of the dual-field vision component and fixes the position of the wafer stage; the double-sided imaging lens simultaneously captures the alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; the fine adjustment mechanism moves and adjusts the position of the chip mounting substrate in three dimensions based on the alignment results of the dual-field vision component to ensure that the chip to be mounted and the chip mounting substrate overlap;

[0083] Step S4: After the alignment calibration process is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted;

[0084] Step S5: the dispensing assembly moves vertically together with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.

[0085] See also Figure 6 , Figure 6 The figure shows the schematic diagram of the mounting mode of the face-up and flip-up mounting in the embodiment of the present invention. Figure 6 As shown, the "upright package" refers to the packaging with the front side of the chip and the front side of the substrate fitted together, and the "flip package" refers to the packaging with the back side of the chip and the front side of the substrate fitted together.

[0086] The following describes in detail the processes of the present invention in the "upright mounting" mounting process and the "flip-chip" mounting process through Example 1 and Example 2 respectively.

[0087] Example 1

[0088] Please combine Figure 6 See Figure 7 , Figure 7 FIG. 1 is a schematic diagram of the process of flip-chip hot pressing welding in an embodiment of the present invention. Figure 7 As shown, the chip flip-chip hot pressing welding method of the present invention specifically includes the following steps:

[0089] Step S11: adsorbing the flip chip 71 inverted in the material box onto the welding arm assembly;

[0090] Step S12: move the dual-field vision component 1 in and align it with the bottom surface of the flip chip 71;

[0091] Step S13: The chip mounting substrate is quickly moved into the field of view of the dual-view vision component by the coarse motion mechanism under the wafer stage 5, and the coarse motion mechanism is switched to a vacuum adsorption stage to fix the position of the wafer stage 5;

[0092] Step S14: adjusting the position of the chip mounting substrate by the fine adjustment mechanism on the wafer stage 5, and observing whether the flip chip bumps 710 and the flip chip mounting substrate bumps 720 in the real-time imaging are overlapped;

[0093] Step S15: Move the dual-view visual component 1 horizontally left and right and front and back to find more upper and lower bump alignments, and at the same time, fine-tune the mechanism to adjust the position overlap of the chip and the chip mounting substrate, as well as the horizontal misalignment and angular rotation to reach the set value.

[0094] Step S16: When the images overlap, remove the dual-view visual component 1;

[0095] Step S17: driving the welding arm assembly to mount the inverted chip onto the chip mounting substrate. Simultaneously, during the contact process between the inverted chip and the chip mounting substrate, the side-view auxiliary sensing assembly 4 is used to observe and increase pressure, while simultaneously turning on the upper and lower heating functions to weld the chip and the chip mounting substrate.

[0096] Step S18: Recording the temperature and pressure values, and when the threshold is reached, removing the welding arm assembly;

[0097] Step S19: The dual-field vision component 1 observes the effect after placement again and ends the placement.

[0098] Example 2

[0099] Please combine Figure 6 See Figure 8 , Figure 8 The figure shows a schematic diagram of the process of mounting the adhesive patch in the embodiment of the present invention. Figure 8 As shown, Figure 8 Describe the placement process of front-mount dispensing. Since the front-mount dispensing cannot simultaneously observe the front side of the chip and the front side of the chip mounting substrate through dual fields of view, it is necessary to use the mark line on the GUI monitoring interface for alignment. Figure 5 As shown in the schematic diagram of the mounting, the placement target is that after the chip is mounted, the distance between the alignment point 730 on the chip and the alignment point 740 on the chip mounting substrate is δ, and the chip is fixed with glue. The specific placement steps are as follows:

[0100] Step S21: Move the dual-view visual component 1 into the mounting station; move the chip 73 placed upright to the bottom of the dual-view visual component 1;

[0101] Step S22: by moving the mounting platform 51, aligning the alignment point 730 on the mounting chip 73 and the mounting mark alignment line 750 on the GUI monitoring interface 75;

[0102] Step S23: Remove the dual-field system 1, and the welding arm assembly 2 absorbs the chip to be mounted; place the chip mounting substrate 74 on the wafer stage, and move the dual-field system 1 into the working position to ensure that the position of the chip mounting substrate to be mounted is within the field of view;

[0103] Step S24: setting a chip mounting substrate alignment mark 751 in the GUI monitoring interface 75 to ensure that the distance between the mark and the chip mounting substrate alignment line is δ;

[0104] Step S25: Observe the GUI monitoring interface 75 and move the translation stage to ensure that the chip mounting substrate alignment point 740 is moved into alignment with the chip mounting substrate alignment mark 751;

[0105] Step S26: Remove the dual-field vision component 1; the dispensing device 3 moves downward along the angle θ from the initial position until it coincides with the axis of the welding arm component, and moves downward together with the welding arm component 2 to the chip mounting substrate for dispensing, and then returns to the initial position after completion;

[0106] Step S27: The chip on the welding arm assembly 2 moves downward following the welding arm assembly to be mounted, and stops after reaching a preset mounting force;

[0107] Step S28: the auxiliary alignment observation system 4 observes the glue bonding condition during the placement process;

[0108] Step S29: The welding arm assembly 2 is reset, and the dual-view visual assembly 1 observes the result after placement again, and the placement is completed.

[0109] In summary, the multifunctional chip placement device and its method utilize dual-field vision components to precisely align flip-chip and upright-mount chips. This also addresses the issue of a single X- and Y-axis motion stage for the chip stage. This allows for both long travel and high-precision positioning during chip station transfer and placement offset adjustment. The tilt of the motion stage can also be easily adjusted, addressing issues such as chip placement warping and low post-placement yield. Furthermore, the present invention meets the volume requirements of the multifunctional chip placement device, resulting in simple control of the entire device and a low-cost structure.

[0110] The above descriptions are merely preferred embodiments of the present invention, and the embodiments are not intended to limit the scope of patent protection of the present invention. Therefore, any equivalent structural changes made using the description and drawings of the present invention should also be included in the scope of protection of the present invention.

Claims

1. A multifunctional patch device, characterized in that: include: A welding arm assembly that moves vertically up and down, including a clamping member, a suction member mounted on the clamping member, and a drive assembly that controls the vertical movement of the clamping member. The suction member has a set of vacuum inner holes for picking up and placing the chips to be mounted, and moves vertically with the clamping member. A dispensing assembly is mounted on the welding arm assembly and moves vertically with the welding arm assembly; wherein the dispensing assembly includes a dispensing rail and a dispensing head that reciprocates on the axis of the dispensing rail, the axis of the dispensing rail and the vertical axis of movement of the welding arm assembly being arranged at an angle θ; when the dispensing head moves to the lowest end, it coincides with the axis of the welding arm assembly; A horizontally movable dual-field vision component is positioned between the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate during alignment calibration; the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly; and when the alignment calibration is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted; A wafer stage, comprising a mounting platform; the mounting platform is used to carry the chip mounting substrate, and during alignment calibration, a coarse adjustment mechanism and a fine adjustment mechanism move and adjust the position of the mounting platform in three dimensions according to the calibration results of the dual-field vision component; The dual-field vision component simultaneously collects alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate, and transmits them to the control component. The control component adjusts the position of the chip mounting substrate so that the chip to be mounted is accurately attached to the chip mounting substrate. The wafer stage further includes a coarse movement mechanism, a fine adjustment mechanism, and a locking mechanism; the coarse movement mechanism is a group of air flotation units including a plurality of air flotation pads; the fine adjustment mechanism is arranged on the coarse movement mechanism and is used for aligning the chip to be mounted and the chip mounting substrate; the locking mechanism is located between the air flotation unit and the support platform; when the coarse movement mechanism is moved into position, the coarse movement mechanism is fixed by opening the vacuum adsorption unit or the electromagnetic adsorption unit on the locking mechanism; The dual-field vision component also includes an image acquisition unit and a GUI monitoring interface; the GUI monitoring interface receives the image acquired by the image acquisition unit and visually presents the alignment and offset measurement marks of the chip to be mounted and the chip mounting substrate.

2. The multifunctional patch device according to claim 1, wherein: It also includes a set of side-view auxiliary sensing components, which are arranged on the left and right sides of the welding arm assembly, and are used to observe process problems in the mounting process in real time from the side. The side-view auxiliary sensing components include a set of variable-focus lenses, lens brackets, and slide rails for adjusting the lens position, and a fixture that rotates around the lens bracket. In addition, during the mounting process, when the chip to be mounted approaches the substrate, the edge features of the chip to be mounted are used to assist in completing the chip alignment verification function.

3. The multifunctional patch device according to claim 1, wherein: The driving component is a first motor, which drives the clamping member to move linearly to pick up and place the chip to be mounted and provide chip mounting force, and the force direction of the chip mounting force and the force point of the chip are on the same axis.

4. The multifunctional patch device according to claim 2, wherein: The driving assembly also includes a second motor for driving rotation, a force measuring unit, a buffer unit and an adsorption tool. According to the detection result of the force measuring unit, the buffer unit makes the patch force provided by the adsorption tool a predetermined value to ensure that the chip to be mounted is smooth and without impact and position displacement.

5. The multifunctional patch device according to claim 1, wherein: A heating unit is arranged in the mounting platform for heating the chip to be mounted or the chip mounting substrate.

6. The multifunctional patch device according to claim 1, wherein: During face-up mounting, the distance between the alignment point on the chip to be mounted and the alignment point on the chip mounting substrate is δ.

7. The multifunctional patch device according to claim 1, wherein: During flip-chip mounting, the position of the chip mounting substrate is adjusted by a fine adjustment mechanism, and the bumps of the flip-chip to be mounted and all the bumps of the chip mounting substrate are observed in real-time imaging to see whether they overlap.

8. A multifunctional patch method, which uses the multifunctional patch device according to any one of claims 1 to 7, characterized in that: include: Step S1: Before starting the patch process, the soldering arm assembly picks up and absorbs the chip to be mounted from the magazine; wherein the chip to be mounted is a flip-chip chip to be mounted or a normal-mounted chip to be mounted; Step S2: the dual-field vision component is moved onto the lower surface of the chip to be mounted and aligned with the chip to be mounted; wherein the optical axis of the dual-field vision component is coaxial with the axis of the welding arm assembly; Step S3: the coarse motion mechanism moves the substrate carrying the chip mounting into the field of view of the dual-field vision component and fixes the position of the wafer stage; during flip-flop mounting, the dual-field vision component simultaneously collects the alignment marks on the lower surface of the chip to be mounted and the upper surface of the chip mounting substrate; during face-up mounting, the dual-field vision component prioritizes collecting chip front information in step S1 and records the position of the front mark of the chip to be mounted in the visual interface. In the step, the alignment mark on the upper surface of the chip mounting substrate is set through the visual interface; the fine adjustment mechanism moves and adjusts the position of the chip mounting substrate in the three-dimensional direction according to the alignment result of the dual-field vision component to ensure that the positions of the chip to be mounted and the chip mounting substrate overlap; Step S4: After the alignment calibration process is completed, the dual-field vision component is horizontally moved out of the mounting area of ​​the chip to be mounted; Step S5: the dispensing assembly moves vertically together with the welding arm assembly to mount the chip to be mounted on the chip mounting substrate.

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