Printed circuit board arrangement and method for manufacturing a printed circuit board arrangement

Abstract

The invention relates to a printed circuit board arrangement (100) and to a method for producing a printed circuit board arrangement (100) for a device for determining the filling level and / or quality and the temperature of a fluid (12) of an internal combustion engine. The printed circuit board arrangement (100) has a first region (110) on which the electronics (112) of the device are mounted, and a second region (120) which is plate-shaped and which is arranged at a predetermined angle (150) relative to the first region (110), on which a temperature sensor (122) for determining the temperature of the fluid (12) is mounted, and a support element (140) which is connected to the first region (110) and to the second region (120) and which is configured to fix the first region (110) and the second region (120) at the predetermined angle (150) relative to one another.

Description

Technical Field

[0001] The present invention relates to a method for producing an ultrasonic sensor and an ultrasonic sensor, in particular to a method for producing an ultrasonic sensor for ascertaining the fill level and / or temperature of a fluid used in an internal combustion engine, such as, for example, motor oil or an aqueous urea solution. Background Art

[0002] Ultrasonic sensors are used, for example, to determine the oil fill level and / or quality, as well as the temperature, in the oil pan of an internal combustion engine. To detect the fill level, the ultrasonic sensor emits ultrasonic waves and determines the fill level based on the sound waves reflected at the oil surface and their travel time. For this purpose, the ultrasonic sensor includes an ultrasonic transmitter and a receiver. Furthermore, a temperature sensor is provided to determine the oil temperature, thereby enabling the speed of sound to be correlated with the fluid quality.

[0003] The electronics of an ultrasonic transducer, for example, including a piezoelectric element and an integrated switching circuit, such as an application-specific integrated circuit, are typically arranged in a hollow housing after electrical connection and fixed there in a fixed position, for example, by means of an adhesive. In alternative designs, it is known to positionally attach such electronics in the housing in another manner, for example, by locking or screwing, using suitable devices.

[0004] Furthermore, DE 10 2012 014 307 A1 discloses a method and a sensor device for detecting a fluid level in a vehicle. The disclosed sensor device comprises a fluid level sensor and a position sensor. The fluid level sensor and the position sensor are arranged in the sensor device such that they have a defined spatial relationship, so that the position detected by the position sensor also determines the position of the fluid level sensor. The sensor device is designed to take this spatial relationship into account when determining the fluid level.

[0005] DE 10 2006 004 321 A1 relates to a multifunctional printed circuit board for use as a rigid-flexible or semi-flexible printed circuit board in the form of a through-contact printed circuit board, a multilayer board, or a flexible printed circuit board. At least one additional functional element is fastened to a copper foil, at least piece by piece, in a planar manner by forming a metal-to-metal connection, using ultrasonic welding or friction welding. A notched milling groove is incorporated into this region, allowing the printed circuit board to be bent in the manner of a rigid-flexible or semi-flexible printed circuit board. By incorporating two notched milling grooves, the printed circuit board can be bent by a total of 90°, using two bends of approximately 45°.

[0006] Further printed circuit boards are known from DE 10 2016 119 006 A1, US Pat. No. 9,706,645 B2 and US Pat. No. 10,168,200 B2.

[0007] DE 10 2016 205 240 B3 discloses a method for producing an ultrasonic sensor and an ultrasonic sensor configured to determine the fill level and / or temperature of a fluid in an internal combustion engine. The known method comprises providing the electronics of the ultrasonic sensor; arranging the electronics of the ultrasonic sensor in an injection mold; and injection-molding the electronics with a plastic, which is used to form a housing for the electronics. The housing includes at least one functional section configured to perform a predetermined function. Summary of the Invention

[0008] The object of the present invention is to provide a printed circuit board arrangement for a device for determining the fill level and / or quality and the temperature of a fluid arranged in a fluid container of an internal combustion engine, which is improved in terms of production costs and measurement quality, wherein the printed circuit board arrangement is also robust in terms of service life.

[0009] This object is achieved by a printed circuit board arrangement according to claim 1 and a method for producing a printed circuit board arrangement according to claim 9. Preferred embodiments are described in the dependent claims.

[0010] The present invention is essentially based on the concept of providing an at least partially curved printed circuit board, wherein a first region (on which an ultrasonic transducer for determining the fill level and / or quality of a fluid can be arranged) is designed to be arranged substantially outside a fluid container, and a second region (on which a temperature sensor for determining the temperature of the fluid and / or another ultrasonic transducer for determining the quality of the fluid can be arranged) is designed to be arranged substantially within the fluid. The second region extends through a wall, such as a bottom, of the fluid container in a medium-tight manner. Furthermore, the printed circuit board arrangement includes a support element designed to fix or maintain the curved printed circuit board, that is, the first and second regions of the printed circuit board arrangement, which are angled relative to each other, in their position. In particular, the support element ensures that the curved printed circuit board remains in its desired shape even when the printed circuit board, including the support element, is injection-coated with plastic to form a medium-tight housing.

[0011] According to a first aspect of the present invention, a printed circuit board arrangement for a device for determining the fill level and / or quality and the temperature of a fluid disposed in a fluid container of an internal combustion engine is disclosed. The printed circuit board arrangement according to the invention comprises a first, substantially plate-shaped area on which the electronic components of the device for determining the fill level and / or quality of the fluid are at least partially mounted, and which is designed to be disposed outside the fluid container; and a second, substantially plate-shaped area on which a temperature sensor for determining the temperature of the fluid and / or an ultrasonic transducer for determining the quality of the fluid are mounted, and which is designed to be disposed at least partially within the fluid in the fluid container and extends at an angle relative to the first area at a predetermined angle. The printed circuit board arrangement according to the invention also comprises a support element connected to the first area and to the second area and designed to secure the first and second areas at an angle relative to each other at a predetermined angle.

[0012] The angled arrangement of the first and second regions relative to each other ensures that the first region can be arranged outside the fluid container and the second region, to which a temperature sensor for determining the temperature of the fluid and / or an acoustic sensor for determining the quality of the fluid is mounted, can be arranged within the fluid in the fluid container. The second region thus extends at least partially through the wall, preferably through the bottom, of the fluid container. The support element can be used to secure the angled position of the first region relative to the second region.

[0013] In a preferred embodiment of the printed circuit board arrangement according to the invention, the first region and the second region are integrally connected via a transition region that is curved such that the first region and the second region are arranged at an angle relative to each other at a predetermined angle. The transition region is preferably a flexible printed circuit board region and is preferably integrally connected to the first region and the second region.

[0014] The predetermined angle is preferably in the range between approximately 45° and approximately 135° and is preferably also approximately 90°.

[0015] In another advantageous embodiment of the printed circuit board arrangement according to the invention, the supporting element has a first section connected to the first area and designed to support the first area, and a second section connected to the second area and designed to support the second area.

[0016] In such an advantageous embodiment of the printed circuit board arrangement according to the invention, the first section of the supporting element is designed to at least partially encompass the first area in such a way that the first section of the supporting element is connected to the first area of ​​the printed circuit board arrangement in a form-fitting and / or force-locking manner, and the second section of the supporting element is preferably designed to at least partially encompass the second area in such a way that the second section of the supporting element is connected to the second area in a form-fitting and / or force-locking manner.

[0017] Preferably, the support element further comprises a transition section, which is designed to support a transition region arranged between the first region and the second region. The transition section of the support element is designed to support the transition region only on one side. Preferably, the transition section is designed to support the transition region on a side that is obtusely angled relative to the predetermined angle.

[0018] In a preferred embodiment, the printed circuit board arrangement according to the invention further comprises a housing which at least partially surrounds the first region, completely surrounds the second region, and at least partially surrounds the support element in a fluid-tight manner. The housing is preferably a plastic housing produced by injection molding or injection-compression molding, wherein the support element is designed during the injection molding process to fix the first region at a predetermined angle relative to the second region.

[0019] According to another aspect of the present invention, a method for producing a printed circuit board arrangement for a device for determining the fill level and / or quality and temperature of a fluid arranged in a fluid container of an internal combustion engine is disclosed. The method according to the invention comprises: providing a printed circuit board having a first, essentially plate-shaped region and a second, essentially plate-shaped region; bending the printed circuit board such that the first and second regions are arranged at an angle relative to each other at a predetermined angle; and arranging a support element such that the support element is connected to the first and second regions and is designed to position the first and second regions relative to each other such that the first and second regions are arranged at an angle relative to each other at the predetermined angle.

[0020] In a preferred embodiment, the method according to the invention further comprises at least partially injection-molding the printed circuit board arrangement with plastic to form a housing of the printed circuit board arrangement. During the injection molding process of the printed circuit board arrangement, the support element can thus fix and hold the first region at a predetermined angle relative to the second region. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Additional tasks and features of the present invention will become apparent to those skilled in the art upon being given the teachings of the present invention and upon examining the accompanying drawings, in which:

[0022] FIG1 shows a schematic illustration of a device known from the prior art for determining the fill level and / or quality and the temperature of a fluid in a fluid container.

[0023] Figure 2 shows a plan view of an exemplary embodiment of a printed circuit board arrangement according to the invention before a bending process,

[0024] Figure 3 shows a plan view of another exemplary embodiment of a printed circuit board arrangement according to the invention before the bending process,

[0025] Figure 4 Shown after the bending process Figure 2 a side view of an exemplary embodiment of a printed circuit board arrangement,

[0026] Figure 5 shows a side view of an exemplary embodiment of a printed circuit board arrangement according to the invention together with a supporting element,

[0027] Figure 6 shows a side view of another exemplary embodiment of a printed circuit board arrangement according to the invention together with a supporting element,

[0028] Figure 7 shows a plan view of another exemplary embodiment of a printed circuit board arrangement according to the invention before the bending process,

[0029] Figure 8 shows a side view of another exemplary embodiment of a printed circuit board arrangement before the bending process,

[0030] Figure 9 Shown after the bending process Figure 8 A side view of a printed circuit board arrangement according to the invention,

[0031] Figure 10 A perspective view shows an embodiment of a support element for a printed circuit board arrangement according to the invention,

[0032] Figure 11 A perspective view of another embodiment of a support element for a printed circuit board arrangement according to the invention is shown, and

[0033] Figure 12 An exemplary flow chart of the method according to the invention for producing a printed circuit board arrangement according to the invention is shown.

[0034] Elements of the same structure or function are provided with the same reference numerals throughout the figures. DETAILED DESCRIPTION

[0035] Within the context of this disclosure, the term "fluid quality" describes parameters that characterize a fluid. For example, parameters that characterize fluid quality include the velocity of sound, the density of the fluid (from which the chemical composition of the fluid can be derived), the electrical properties of the fluid, and the damping properties of the fluid. For example, in the case of an aqueous urea solution, such as urea, the urea content in the water can be estimated by determining the temperature-dependent velocity of sound of the aqueous urea solution.

[0036] In the context of the present disclosure, the angled or inclined position of the first region relative to the second region is characterized by a predetermined angle that is not equal to 180°. Thus, the plate-shaped first region and the plate-shaped second region extend in different planes that are not parallel to each other.

[0037] FIG1 shows a schematic view of a device 10 known from the prior art for determining the fill level 11 and / or the quality and temperature of a fluid 12 in a fluid container 14. Fluid 12 can be, for example, an aqueous urea solution designed to be injected into the exhaust system of an internal combustion engine. Fluid 12 can also be motor oil or transmission oil, brake fluid, or a liquid for window cleaning.

[0038] The device 10 of FIG1 has a substantially plate-shaped printed circuit board 20 on which electronic components 22 for determining the fill level and / or quality of the fluid 12 are mounted, and the printed circuit board is designed to be arranged outside the fluid container 14. The electronic components 22 are, for example, ultrasonic transducers designed to couple ultrasonic signals 24 from the outside through the wall, preferably the bottom 15, of the fluid container 14 into the fluid 12 and to receive the ultrasonic signals 24 reflected at the surface 11 of the fluid 12. The electronic components 22 may also include capacitors, resistors, operational amplifiers, or application-specific integrated circuits (ASICs) that are necessary for the proper operation of the device 10.

[0039] 1 also includes a temperature sensor 26, which is arranged within the fluid 12 and is electrically connected to the printed circuit board 20 via corresponding electrical lines 28. The electrical lines 28 extend through the wall of the fluid container 14, preferably the bottom 15, and must be sealed accordingly.

[0040] Separate electrical connections 28 do not involve a negligible technical outlay in production and, due to these individually, separately wired component elements, represent an increased risk of defects such as, for example, short circuits between connecting wires or even broken electrical connections 28 .

[0041] Figure 2 A printed circuit board arrangement 100 according to the invention is shown for a device for determining the fill level and / or quality and the temperature of a fluid 12 arranged in a fluid container 14 of an internal combustion engine. The printed circuit board arrangement 100 initially consists of a printed circuit board and comprises a first, essentially plate-shaped area 110, on which electronic components 112 of the device for determining the fill level and / or quality of the fluid 12 are at least partially mounted, and which is designed to be arranged essentially outside the fluid container 14; and a second, essentially plate-shaped area 120, on which a temperature sensor 122 for determining the temperature of the fluid 12 is mounted, and which is designed to be arranged at least partially within the fluid in the fluid container 14. Preferably, as in Figure 2 As shown in FIG, the printed circuit board arrangement 100 comprises a transition region 130 (in FIG. Figure 2 The first region 110 can be a first printed circuit board and the second region 120 can be a second printed circuit board that is integrally connected to the first printed circuit board by means of a transition region 130 .

[0042] In addition to or as an alternative to the temperature sensor 122, an ultrasonic transducer can be provided on the second region 120, by means of which the quality of the fluid 12 can be detected. In particular, further electronic components of the device for determining the fill level and / or quality and the temperature of the fluid 12 can be arranged on the second region 120.

[0043] Electronics 112 has an ultrasonic transducer, which, as explained above with reference to FIG. 1 , is designed to couple ultrasonic signals 24 into fluid 12 in fluid container 14 and receive them again as reflected signals. Electronics 112 can also include further electronic components, such as capacitors, resistors, operational amplifiers, or application-specific integrated circuits (ASICs), which are necessary for the proper operation of the device for determining the fill level and / or quality and temperature of fluid 12.

[0044] As in Figure 2As indicated in FIG, the second region 120 is a section integrally connected to the first region 110 via a transition region 130 and is designed as a web-shaped element. The web-shaped shape of the second region can be defined, for example, by having its length L significantly greater than its width B. For example, the length L is approximately four to six times the width B.

[0045] exist Figure 2 In FIG. 1 , a dashed line 102 is also marked, which is located in the transition region 130 and indicates a possible bending line for bending the transition region 130 so that after the corresponding bending process the second region 120 extends substantially at an angle to the first region 110 (see also FIG. 1 ). Figure 4 、 Figure 5 、 Figure 6 and Figure 9 ).

[0046] Figure 3 Another exemplary embodiment of a printed circuit board arrangement 100 is shown, wherein: Figure 3 The printed circuit board device is compared with Figure 2 The printed circuit board arrangement 100 is distinguished in that the second region 120 extends in another direction relative to the first region 110. In particular, Figure 3 A design is shown in which the second region 120 can be obtained by introducing a cutout 101 into the initially rectangular printed circuit board of the printed circuit board arrangement 100, thereby obtaining a separate second region 120 which can in turn be connected integrally to the first region 110 via a transition region 130. Figure 3 The manufacturing costs of the printed circuit board arrangement 100 are Figure 2 can be reduced compared to the printed circuit board assembly 100 .

[0047] Figure 4 Shown Figure 2 100 according to the invention. As already explained, according to the invention, an initially flat printed circuit board having a first region 110 and a second region 120 is bent along a bending line 102 in a transition region 130 such that after the bending process, the second region 120 extends at a predetermined angle 150 relative to the first region 110. Figure 4 In the exemplary embodiment, the predetermined angle is approximately 90°. However, it goes without saying that a predetermined angle 150 not equal to 90° is also provided according to the invention, such as, for example, an angle in the range between approximately 45° and 135°. Figure 4 In FIG. 1 , the dashed line shows the printed circuit board arrangement 100 in a state before bending.

[0048] Figure 5 The printed circuit board arrangement 100 according to the invention is shown after the bending process and with the mounted support element 140, as for example Figure 4 A side view of an exemplary embodiment of a printed circuit board arrangement 100 is shown. The support element 140 is connected to the first region 110 and to the second region 120 and is designed to fix or hold the first region 110 and the second region 120 at an angle relative to each other at a predetermined angle 150. Figure 5 The embodiment of printed circuit board arrangement 100 shows an embodiment in which support element 140 is located on a side where the smaller angle is between first region 110 and second region 120, i.e., on the inside of the bend. According to the present disclosure, provision is made here so that first region 110 and second region 120 divide the full circle in such a way that a smaller angle (less than 180°) and a larger angle (greater than 180°) are produced, wherein the sum of the smaller angle and the larger angle corresponds to 360°.

[0049] exist Figure 6 In an alternative embodiment shown in FIG, the support element 140 is located substantially on the side on which a large angle is arranged between the first region 110 and the second region 120 , ie on the outside of the bend.

[0050] Figure 7 The printed circuit board arrangement according to the invention is shown before the bending process, as for example according to Figure 2 FIG. 1 is a plan view of another exemplary embodiment of a printed circuit board arrangement. Figure 7 The printed circuit board assembly 100 and Figure 2 The printed circuit board arrangement 100 of FIG. 1 differs in that a recess 103 is provided in the transition region 130 , which can simplify the bending of the transition region 130 due to the fact that there is less material to be bent.

[0051] In accordance with Figure 7In the embodiment of the present invention, the schematically illustrated electrical connection lines 124, 126 (which electrically connect the temperature sensor 122 to the electronic component 112 arranged in the first region 110), but interrupted by the recess 103, are reinforced by electrical connection wires 125, 127 extending across the recess 103. Therefore, during the bending process along the bending line 102, not only the transition region 130, or the two remaining tabs 131, 133, but also the electrical connection wires 125, 127 are bent. Thus, on the one hand, the electrical connection can be made more robustly than with simple conductor tracks on the printed circuit board. On the other hand, less of the often brittle printed circuit board material must be bent. Additionally, it can be advantageous to arrange the recess 103 such that the two regions 110 , 120 are completely separated from one another during the bending process (ie, the webs 131 , 133 are no longer present or are removed before the bending process) and are only connected to one another via the connecting wires 125 , 127 .

[0052] Figure 8 The printed circuit board arrangement 100 according to the invention is shown before the bending process, as for example Figure 2 A side view of another exemplary embodiment of a printed circuit board arrangement 100 is shown, on the other hand, Figure 9 The printed circuit board arrangement according to the invention is shown after the bending process and with the mounted support element 140 .

[0053] Figure 8 The printed circuit board arrangement 100 has a deepening 132 in the transition region 130, such as a notch, a groove or the like, thereby simplifying the bending along the bending line 102 (at Figure 8 In particular, the deepening 132 can locally thin the material of the transition region 130 , thereby making the bending process simpler and requiring less force.

[0054] Apart from Figure 8 In addition to the deepening 132 in the transition region 130 , it is also conceivable to also provide a deepening (not shown) on the side of the transition region 130 opposite the deepening 132 , thereby further simplifying the bending.

[0055] Figure 9 Shown after the bending process Figure 8 The printed circuit board assembly 100. Figure 9 It is known that the deepening 132 forms a free region which can be supported by means of the supporting element 140 (see in particular Figure 10), in particular having an adaptation region (see transition section 146 of support element 140 ).

[0056] exist Figure 10 An exemplary embodiment of a support element 140 according to the present invention is disclosed in . The support element 140 has, in particular, a first section 142 that can be connected to the first region 110 and is configured to support the first region 110; a second section 144 that can be connected to the second region 120 and is configured to support the second region 120; and a transition section 146 that is configured to support the transition region 130, in particular the deepening 132 (see also Figure 9 ). In particular, from Figure 9 and Figure 10 It is understood that the first section 142 of the support element 140 is designed to at least partially encompass the first region 110 such that the first region 110 is connected to the first section 142 in a form-fitting and / or force-locking manner. This can be achieved, for example, by means of an interference fit. Similarly, the second section 144 of the support element 140 is designed to at least partially encompass the second region 120 such that the second region 120 is connected to the second section 144 in a form-fitting and / or force-locking manner. This can also be achieved, for example, by means of an interference fit. The transition section 146 can be designed to correspond to the shape of the deepening 132 after the bending process and thus provide additional support for the transition region 130 weakened by the deepening 132.

[0057] Figure 11 Another possible design of the support element 140 is shown and is related to Figure 10 The difference of the support element 140 is that Figure 11 The support element 140 does not have a transition section 146. More precisely, Figure 11 The supporting element 140 comprises only a first section 142 and a second section 144 . Nevertheless, the supporting element 140 designed and shaped in this way can be designed to support the transition region 130 having the deepening 132 . Figure 10 The transition section 146 is relative to Figure 11 The variant has the only advantage that the transition region 130 receives additional support.

[0058] Figure 12 An exemplary flow chart of a method according to the present invention for producing a printed circuit board arrangement 100 for a device for ascertaining the fill level and / or quality and the temperature of a fluid 12 arranged in a fluid container of an internal combustion engine is shown.

[0059] The method according to the present invention begins in step 200 and then proceeds to step 210, in which a printed circuit board is provided, which has a substantially plate-shaped first region 110, a substantially plate-shaped second region 120, and a transition region 130 arranged between the first region 110 and the second region 120. In a subsequent step 220, the printed circuit board is bent in the transition region 130 such that the first region 110 and the second region 120 are arranged at an angle relative to each other at a predetermined angle 150. In a subsequent step 230, a support element 140 is arranged on the bent printed circuit board, which support element is connected to the first region 110 and the second region 120 and is designed to position the first region 110 and the second region 120 relative to each other such that the first region 110 and the second region 120 are arranged at an angle relative to each other at the predetermined angle 150.

[0060] In another method part 240, printed circuit board arrangement 100 is at least partially embedded in the plastic used to form the housing of printed circuit board arrangement 100. In particular, support element 140 is designed to fix first region 110 and second region 120 at an angle relative to one another at a predetermined angle 150 during the embedding process, so that temperature sensor 122 arranged in second region 120 remains in a predetermined position. The method then ends in step 250.

[0061] For example, in Figure 6 As shown in the figure, the printed circuit board arrangement 100 according to the invention can then be connected to the fluid container 14 in such a way that the first area 110 is arranged outside the fluid container 14 and the second area 120 together with the temperature sensor installed therein extends through the wall of the fluid container 14, preferably the bottom 15, into the fluid 12, so that the temperature of the fluid 12 can be detected by means of the temperature sensor 122.

[0062] If the printed circuit board arrangement 100 according to the invention is completely surrounded by plastic at least on the front side and the material in which the printed circuit board arrangement 100 is at least partially embedded is chemically stable with respect to the fluid 12 to be measured, then the entire device can also be brought into contact with the fluid and the ultrasonic measurement can be carried out directly in the fluid 12 instead of through the wall of the fluid container 14.

[0063] All of the advantages of the device according to the invention mentioned here can also be used if, instead of or in addition to the temperature sensor, an ultrasonic transducer is provided, with which ultrasonic transducer an ultrasonic measurement can then be carried out essentially perpendicularly to region 120 .

Claims

1. A printed circuit board arrangement (100) for a device for determining the filling level and / or quality and the temperature of a fluid (12) arranged in a fluid container (14) of an internal combustion engine, wherein: The printed circuit board device (100) comprises: a plate-shaped first region (110) on which electronic components (112) of the device for determining the filling level and / or quality of the fluid (12) are at least partially mounted and which is designed to be arranged outside the fluid container (14), a plate-shaped second region (120) on which a temperature sensor (122) for determining the temperature of the fluid (12) and / or an ultrasonic transducer for determining the quality of the fluid (12) is mounted, and which is designed to be arranged at least partially within the fluid (12) in the fluid container (14), wherein the first region (110) and the second region (120) are arranged at an angle relative to each other at a predetermined angle (150), and a supporting element (140) connected to the first region (110) and the second region (120) and designed to fix the first region (110) and the second region (120) at an angle relative to each other at the predetermined angle (150), The first region (110) and the second region (120) are integrally connected via a transition region (130), wherein the transition region (130) is bent such that the first region (110) and the second region (120) are arranged at an angle relative to each other at the predetermined angle (150).

2. The printed circuit board arrangement (100) according to claim 1, wherein The predetermined angle (150) is in the range between 45° and 135°.

3. The printed circuit board arrangement (100) according to claim 1, wherein The predetermined angle (150) is 90°.

4. The printed circuit board arrangement (100) according to claim 1, wherein The support element (140) has: a first section (142) connected to the first region (110) and configured to support the first region (110), and A second section (144) connected to the second region (120) and designed to support the second region (120).

5. The printed circuit board arrangement (100) according to claim 4, wherein The first section (142) of the supporting element (140) is configured to at least partially include the first region (110) in such a way that the first section (142) of the supporting element (140) is at least partially connected to the first region (110) in a form-fitting and / or force-fitting manner, and the second section (144) of the supporting element (140) is configured to at least partially include the second region (120) in such a way that the second section (144) of the supporting element (140) is at least partially connected to the second region (120) in a form-fitting and / or force-fitting manner.

6. The printed circuit board arrangement (100) according to claim 4, wherein The supporting element (140) further comprises a transition section (146) which is configured to support a transition region (130) arranged between the first region (110) and the second region (120), wherein the transition section (146) of the supporting element (140) is configured to support the transition region (130) only on one side.

7. The printed circuit board arrangement (100) according to claim 6, wherein The transition section (146) of the support element (140) is designed to support the transition region (130) on a side that is obtusely angled relative to the predetermined angle (150).

8. The printed circuit board arrangement (100) according to claim 1, further comprising: A housing which at least partially surrounds the first region (110), completely surrounds the second region (120) and at least partially surrounds the support element (140) in a fluid-tight manner.

9. Method for producing a printed circuit board arrangement (100) for a device for determining the filling level and / or quality and the temperature of a fluid (12) arranged in a fluid container (14) of an internal combustion engine, wherein: The method has: - providing a printed circuit board having a plate-shaped first region (110) and a plate-shaped second region (120), - bending the printed circuit board such that the first region (110) and the second region (120) are arranged at an angle relative to each other at a predetermined angle (150), and - Arranging a supporting element (140), which is connected to the first area (110) and to the second area (120) and is configured to position the first area (110) and the second area (120) relative to each other in such a way that the first area (110) and the second area (120) are arranged at an angle relative to each other at the predetermined angle (150).

10. The method according to claim 9, further comprising: - embedding the printed circuit board arrangement (100) at least partially in the plastic used to form the housing of the printed circuit board arrangement (100).

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