Thermal Mitigation for USB Power Delivery

Abstract

The thermal mitigation feature can be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of the USB cable jacket can have a higher thermal conductivity than the portion therebetween. The portion having the higher thermal conductivity can dissipate excess heat from the cable into the environment. In another aspect, the USB cable connector or the USB receptacle portion of the device can include a thermoelectric heat pump. The thermoelectric heat pump can transfer excess heat from the cable assembly or receptacle to a portion of the cable assembly or device that dissipates the heat into the environment.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims priority to U.S. Patent Application No. 16 / 798,238, titled "THERMAL MITIGATION FOR USB POWER DELIVERY", filed on February 21, 2020, the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure generally relates to thermal mitigation in electronic devices, and more particularly, to thermal mitigation in a cable connector system in which power is delivered together with data signals. BACKGROUND OF THE DISCLOSURE

[0004] Portable computing devices (PCDs) are becoming a necessity for people at both the personal and professional levels. These devices can include cellular phones, tablet computers, handheld computers, portable digital assistants (PDAs), portable game controllers, and other portable electronic devices. PCDs are typically powered by rechargeable batteries, but can also be powered from an external power source via a cable-based connector system.

[0005] Universal Serial Bus (USB) is a data interface capable of supplying power along with data signals. It has become common to charge a battery or otherwise power a PCD by connecting a USB cable between a USB port of the PCD and a powered USB port. USB ports used as power outlets in this manner have become ubiquitous and can be found in a variety of environments, including hotel rooms, cars, airplane seats, and other locations where people use PCDs. Although USB has long been able to provide limited power as well as data signals, newer USB iterations (referred to as USB Power Delivery or USB-PD) are capable of delivering a greater amount of power, such as, for example, approximately 100 watts. Higher power delivery enables faster battery charging and provides other advantages.

[0006] Although there may be sufficient space in some larger PCDs, such as laptop computers, to accommodate a power conversion circuitry capable of high power delivery via a higher supply voltage, PCDs without such power conversion circuitry may be limited to medium voltages and thus require high currents for high power delivery. For a given power, using a lower supply voltage for a PCD may have additional advantages, such as, for example, completely eliminating conversion losses, thereby requiring a higher current level. High currents in a USB connector system can generate a significant amount of heat energy. To support high currents in a USB or other connector system while avoiding adverse effects on the PCD and the connector system from excessive heat energy, improved thermal mitigation techniques are needed. SUMMARY OF THE INVENTION

[0007] The present invention content identifies the features of some exemplary aspects and is not an exclusive or exhaustive description of the disclosed subject matter. Additional features and aspects are described, and these additional features and aspects will be apparent to those skilled in the art after reading the following detailed description and viewing the drawings that form a part thereof.

[0008] A connector device according to at least one embodiment is disclosed. The connector device may include a first connector having a first plurality of electrical contacts, a second connector having a second plurality of electrical contacts, and a cable having a first end coupled to the first connector and a second end coupled to the second connector. The cable may include a plurality of electrical signal conductors within a cable sheath. The cable sheath may include at least a first end portion and an intermediate portion. The first end portion may extend between the first connector and the intermediate portion. The thermal conductivity of the first end portion may be greater than the thermal conductivity of the intermediate portion.

[0009] Another connector device according to at least one embodiment is disclosed. The connector device may include a connector having a plurality of electrical contacts, and a thermoelectric heat pump device coupled to the connector.

[0010] Yet another connector device according to at least one embodiment is disclosed. The connector device may include a first component for electrically and mechanically mating a first plurality of electrical contacts with a first mating connector, a second component for electrically and mechanically mating a second plurality of electrical contacts with a second mating connector, and a component for transmitting electrical signals between the first plurality of electrical contacts and the second plurality of electrical contacts through a cable. The transmission component may have a first end coupled to the first connector and a second end coupled to the second connector. The transmission component may include a first end portion and an intermediate portion. The first end portion may extend between the first component and the intermediate portion. The thermal conductivity of the first end portion may be greater than the thermal conductivity of the intermediate portion.

[0011] Yet another connector device according to at least one embodiment is disclosed. The connector device may include a component for electrically and mechanically mating a first plurality of electrical contacts with a mating connector, and a component for thermoelectrically dissipating thermal energy.

[0012] Disclosed is a method for dissipating thermal energy in a connector system according to at least one embodiment. The method may include inserting a first connector having a first plurality of electrical contacts into a first socket connector, inserting a second connector having a second plurality of electrical contacts into a second socket connector, and transmitting electrical signals through a plurality of electrical signal conductors coupled between the first plurality of electrical contacts and the second plurality of electrical contacts. The plurality of electrical signal conductors may be enclosed within a cable sheath that extends between the first connector and the second connector. The method may further include dissipating more thermal energy conductively through a first end portion of the cable sheath having a first thermal conductivity than through an intermediate portion of the cable sheath having a second thermal conductivity, the second thermal conductivity being less than the first thermal conductivity, wherein the first end portion extends between the first connector and the intermediate portion.

[0013] Disclosed is another method for dissipating thermal energy in a connector system according to at least one embodiment. The method may include mating a first connector of a connector system having a first plurality of electrical contacts with a second connector of a connector system having a second plurality of electrical contacts. The method may further include thermally dissipating thermal energy from at least one of the first connector and the second connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Aspects of the apparatus and method will now be presented in the detailed description by way of example and not limitation with reference to the accompanying drawings, in which:

[0015] Figure 1 is a plan view of a connector device according to certain aspects of the present disclosure.

[0016] Figure 2A is an end view of a USB-PD socket connector according to certain aspects of the present disclosure.

[0017] Figure 2B is an end view of a USB-PD plug connector according to certain aspects of the present disclosure.

[0018] Figure 3 is a plan view of another connector device according to certain aspects of the present disclosure.

[0019] Figure 4 is according to certain aspects of the present disclosure Figure 1 of a perspective view of a portion of a connector device, taken or cut along line 4-4 of Figure 1 to show the interior of the device housing.

[0020] Figure 5 is a flowchart showing a method for controlling thermal energy dissipation from a connector system using a thermoelectric heat pump according to certain aspects of the present disclosure.

[0021] Figure 6is taken along Figure 1 sectional view taken along line 6-6.

[0022] Figure 7 is a block diagram of a portable computing device in accordance with some aspects of the present disclosure. DETAILED DESCRIPTION

[0023] The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of various concepts. It will be apparent, however, to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form to avoid obscuring such concepts.

[0024] As used herein, the term “coupled to” in various tenses of the verb “couple” may mean that element A is directly connected to element B, or that other elements may be connected between elements A and B (i.e., element A is indirectly connected to element B) to operate certain desired functions. In the case of electrical components, the term “coupled to” may also be used herein to mean that element A and B are electrically connected using wires, traces, or other conductive materials (and any components electrically connected therebetween). In some examples, the term “coupled to” may mean that electrical energy is transferred between elements A and B to operate certain desired functions.

[0025] In some examples, the term “electrically connected” may mean having current or being configurable to have current flow between elements A and B. For example, elements A and B may be connected via a resistor, transistor, or inductor, as well as wires, traces, or other conductive materials and components. Additionally, for radio frequency functions, elements A and B may be “electrically connected” via a capacitor.

[0026] In some examples, the term “thermally coupled” may mean that elements are configured relative to each other to permit the transfer of thermal energy between them. Element A may be directly thermally coupled (e.g., by conduction) to element B with which it is in contact, or indirectly thermally coupled (e.g., by conduction) to element B with which it is in contact via one or more other (e.g., thermally conductive) elements in contact with elements A and B.

[0027] The terms “first,” “second,” “third,” etc. may be used for ease of reference and may not have a substantial meaning. Similarly, names of components / modules may be adopted for ease of reference and may not limit the components / modules. The modules and components presented in the present disclosure may be implemented in hardware, software, or a combination of hardware and software. The terms “software” and “firmware” are used synonymously in the present disclosure.

[0028] Thermal mitigation features may be included in one or more portions of a Universal Serial Bus (USB) cable assembly, in the USB receptacle portion of a device, or in other USB-related structures. According to one aspect of the present disclosure, one or both ends of a USB cable jacket may have a higher thermal conductivity than the portion therebetween. The portion having the higher thermal conductivity may dissipate excess heat from the cable to the environment. According to another aspect of the present disclosure, a USB cable connector or the USB receptacle portion of a device may include one or more thermoelectric heat pumps. The thermoelectric heat pumps may transfer excess heat from the cable assembly or receptacle to a portion of the cable assembly or device that dissipates the heat to the environment.

[0029] As Figure 1 shown, in an exemplary embodiment, a connector system 100 may include a cable assembly 102. The cable assembly 102 may include a first connector 104 and a second connector 106 coupled by a cable 108 that extends between the first connector 104 and the second connector 106. Each of the first connector 104 and the second connector 106 may have a configuration that complies with a standard specification, such as, for example, USB Power Delivery (USB-PD). In this exemplary embodiment, the first connector 104 and the second connector 106 may be USB plugs that are matingly compatible with a USB receptacle. As described in further detail below, the connector system 100 may also include a connector-related portion of a portable computing device (PCD) 110. The PCD 110 may be, for example, a cellular phone, a tablet computer, a handheld computer, a portable digital assistant (PDA), a portable game controller, etc. Although in this exemplary embodiment, the first connector 104 is user-connectable to and user-removable from the PCD 110, it should be understood that in other embodiments, an electronic device may have a connector according to the present disclosure that is fixedly held. For example, it is known that some power adapters have connectors that are fixedly held.

[0030] As Figure 2A shown, the USB-PD receptacle configuration 112 may be characterized by an array of electrical contacts 114 mounted within a receptacle housing 116. A portion of the electrical contacts 114 are configured to convey power, while other electrical contacts 114 are configured to convey data signals. Similarly, as Figure 2B shown, the USB-PD plug configuration 118 may be characterized by an array of electrical contacts 120 mounted within a plug housing 122. A portion of the electrical contacts 120 are configured to convey power, while other electrical contacts 120 are configured to convey data signals. Each of the first connector 104 and the second connector 106 ( Figure 1 ) may have a USB-PD plug configuration 118.

[0031] As Figure 3 shown, the first connector 104 and the second connector 106 may respectively include overmolds 124 and 126. In addition to the first connector 104, the second connector 106, and the cable 108, the cable assembly 102 may further include strain relief boots 128 and 130 respectively attached to the first connector 104 and the second connector 106. However, such strain relief boots may be omitted in other embodiments (not shown).

[0032] The cable 108 includes a cable jacket 132 extending between the first connector 104 and the second connector 106. Although not shown for clarity, the cable jacket 132 encloses electrical conductors (e.g., copper wires) that couple the electrical contact portions 120 of the connector 104 to the electrical contact portions 120 of the connector 106. In Figure 3 the illustrated embodiment, the cable jacket 132 consists of exactly three segments or portions: a first end portion 134 adjacent to the connector 104; a second end portion 136 adjacent to the connector 106; and an intermediate portion 138 extending between the first end portion 134 and the second end portion 136. The cable 108 may be made of a flexible material such that the cable 108 can be bunched, wound, etc. in the manner of a conventional USB cable.

[0033] The term "cable jacket" as used in this disclosure refers to a generally tubular structure made of a flexible, electrically insulating or dielectric material that forms the outer portion of the cable 108. The strain relief boots 128 and 130 are not part of the cable jacket 132 or the connectors 104 and 106. The end portions 134 and 136 and the intermediate portion 138 may all have the same diameter, appearance, texture, and other surface characteristics. However, in other embodiments, the end portions 134 and 136 may differ from the intermediate portion 138 in these respects. The first end portion 134 and the second end portion 136 refer to the portions of the cable jacket 132 that are exposed to the environment (e.g., air) and do not include any portion of the cable jacket 132 that may be located within the strain relief boots 128 and 130 or within the connectors 104 and 106.

[0034] The first end portion 134 and the second end portion 136 are configured to dissipate excess heat energy from the connectors 104 and 106, respectively, while the intermediate portion 138 may be more similar to a conventional USB cable in terms of such thermal characteristics. The first end portion 134 and the second end portion 136 may be made of a dielectric (i.e., electrically insulating) material having a higher thermal conductivity compared to the material of which the intermediate portion 138 is made. Examples of materials that the first end portion 134 and the second end portion 136 may be made of are low density polyethylene (LDPE)-based composite materials filled with hybrid boron nitride (BN) particles, thereby providing a higher thermal conductivity than LDPE. Other materials having a higher thermal conductivity compared to the materials of which conventional USB cables are made are also well known. An example of a material that the intermediate portion 138 may be made of is LDPE. For the purposes of the present disclosure, the measurement of heat dissipation may be used as an indicator of thermal conductivity. For example, when the cable 108 is used to charge or power a device, the measured temperature on the surfaces of the first end portion 134 and the second end portion 136 may be at least 20% higher than the measured temperature on the surface of the intermediate portion 138. More generally, if, when a connector device conducts current, it is determined that the measured temperature of a portion of the connector device is at least 20% higher than the measured temperature of another portion of the connector device, then for the purposes of the present disclosure, that portion has a higher thermal conductivity than the other portion.

[0035] In one example, the length of each of the first end portion 134 and the second end portion 136 may be between approximately 2.5 cm and 5.0 cm. Additionally or alternatively, the length of each of the first end portion 134 and the second end portion 136 may be between approximately 0.025 and 0.050 of the length of the intermediate portion 138. Thus, in an example where the total length of the cable jacket 132 is 1 meter, the length of each of the first end portion 134 and the second end portion 136 may be in the range of between approximately 2.5 cm and 5.0 cm, and the length of the intermediate portion 138 is correspondingly between approximately 85.0 cm and 90.0 cm. However, other examples of the cable 108 may have any length.

[0036] Although in the above exemplary embodiment the cable jacket 132 consists exactly of three parts, in other embodiments (not shown) such a heat dissipating cable jacket may consist of only two parts: an end portion and the remainder of the cable jacket, where the end portion may be made of a material having a higher thermal conductivity compared to the material of which the remainder of the cable jacket is made.

[0037] As Figure 4 shown, in another exemplary embodiment, the device 110 includes a connector device that includes a connector 140 mounted in a housing 142 of the device 110. The connector 140 may have the above-described USB socket configuration 112 ( Figure 2A)。The connector 140 can be mounted on the printed circuit board 144 in the housing 142, where the plug receiving (socket) portion of the connector 140 extends through an opening in the wall of the housing 142. The thermoelectric heat pump 146 can be located in the housing 142. For example, the thermoelectric heat pump 146 can be mounted in contact with the connector 140 and the inner surface of the housing 142. Such a mounting configuration can enable the thermoelectric heat pump 146 to transfer heat to the housing 142 from the connector 140 through conductive thermal coupling between the thermoelectric heat pump 146 and the connector 140 and between the thermoelectric heat pump 146 and the housing 142 when the thermoelectric heat pump 146 is activated. The housing 142 can be used as a heat sink to dissipate heat to the air outside the housing. The thermoelectric heat pump 146 uses the so-called Peltier effect to provide a cooling (i.e., heat transfer) effect in response to the current it provides through the connection of two materials. Since such thermoelectric heat pumps are commercially available and well known to those of ordinary skill in the art, details of their structure and operation are not provided in the present disclosure for the sake of brevity. However, a brief description of a method 500 for controlling the thermoelectric heat pump 146 is provided below with respect to Figure 5 A brief description of the method 500 for controlling the thermoelectric heat pump 146 is provided.

[0038] As Figure 5 shown, the method 500 can include at least setting an upper temperature threshold, as shown in block 502. The temperature measurement can be obtained from a sensor ( Figures 4 - 5 not shown) on or near the connector 140, as shown in block 504. The temperature measurement can be compared with the upper temperature threshold, as shown in block 506. If it is determined (block 506) that the temperature measurement is less than the upper temperature threshold, the thermoelectric heat pump 146 can be turned off (i.e., deactivated), as shown in block 508. When turned off, the thermoelectric heat pump 146 does not provide the above-described heat transfer effect. If it is determined (block 506) that the temperature measurement is greater than or equal to the upper temperature threshold, the thermoelectric heat pump 146 can be turned on (i.e., activated), as shown in block 510. After blocks 508 and 510, the method 500 can return to block 506 in an iterative or loop manner to provide continuous control of the thermoelectric heat pump 146.

[0039] When turned on, the thermoelectric heat pump 146 provides the above-described heat transfer effect. After the thermoelectric heat pump 146 is turned on, the temperature measurement may decrease due to the removal of heat from the connector 140. Although in Figure 5is not shown, but such a method may include hysteresis. In embodiments including hysteresis, the upper and lower temperature threshold limits will be set as described above with respect to block 502, and the temperature measurement will be compared to the upper and lower temperature threshold limits. Based on the comparison to the upper and lower temperature threshold limits, the thermoelectric heat pump 146 can be controlled in a manner that tends to keep the temperature measurement within a window between the upper and lower temperature threshold limits. The thermoelectric heat pump 146 may include a temperature sensor and controller circuitry configured in the foregoing manner, or the temperature sensor and controller circuitry may be included external to the thermoelectric heat pump 146. For example, the thermoelectric heat pump 146 may be controlled by a control element of the device 110 that provides thermal mitigation for other parts (not shown) of the device 110.

[0040] As Figure 6 shown, in another exemplary embodiment, the connector 104 or other such connectors may include thermoelectric heat pumps 150A and 150B, each thermoelectric heat pump being in contact with or otherwise positioned in the vicinity of active electronic devices 152A and 152B, respectively. In this context, the term "active" refers to an electronic device that consumes power to perform an electronic function. Although there are two thermoelectric heat pumps 150A and 150B and two corresponding active electronic devices 152A and 152B in the illustrated embodiment, any number of one or more thermoelectric heat pumps may be present in other embodiments. In such other embodiments, there may be as few as zero active electronic devices. Thermal interface materials 154A and 154B may be included between the active electronic devices 152A and 152B and the thermoelectric heat pumps 150A and 150B, respectively, to enhance the thermal coupling. The active electronic devices 152A and 152B may be mounted on a printed circuit board 156 within a metal inner housing 158. The thermoelectric heat pumps 150A and 150B may be located between an outer portion of the metal inner housing 158 and an inner portion of the overmold 124 that covers the metal inner housing 158. Copper conductors 160 coupled to the printed circuit board 156 extend rearward from the connector 104 through the shroud 128. The thermoelectric heat pumps 150A and 150B may include temperature sensors and controller circuitry configured in the manner described above with respect to Figure 5 described. In addition to the thermoelectric heat pumps 150A and 150B, the connector 104 ( Figure 6 ) may have a conventional structure and may conform to a USB standard, such as USB-PD. The connector 104 may have the above-described USB plug configuration 118 ( Figure 2B ).

[0041] As Figure 7 shown, the PCD 700 may be the same as that described above with respect to Figure 1An example of the described PCD 110. The PCD 700 includes a system-on-chip (SoC) 702. The SoC 702 may include a central processing unit (CPU) 704, a graphics processing unit (GPU) 706, a digital signal processor (DSP) 707, an analog signal processor 708, or other processors. The CPU 704 may include multiple cores, such as a first core 704A, a second core 704B, etc., up to an Nth core 704N.

[0042] A display controller 710 and a touchscreen controller 712 may be coupled to the CPU 704. A touchscreen display 714 external to the SoC 702 may be coupled to the display controller 710 and the touchscreen controller 712. The PCD 700 may also include a video decoder 716 coupled to the CPU 704. A video amplifier 718 may be coupled to the video decoder 716 and the touchscreen display 714. A video port 720 may be coupled to the video amplifier 718. A user identification module (“SIM”) card 726 may be coupled to the CPU 704. A USB controller 722 may also be coupled to the CPU 704, and a USB port 724 may be coupled to the USB controller 722. The USB port 724 may have the socket configuration 112 described above with respect to Figure 2A the described socket configuration 112.

[0043] One or more memories may be coupled to the CPU 704. One or more memories may include both volatile and non-volatile memories. Examples of volatile memories include static random access memory (SRAM) 728 and dynamic RAM (DRAM) 730 and 731. Such memories may be external to the SoC 702, such as DRAM 730, or internal to the SoC 702, such as DRAM 731. A DRAM controller 732 coupled to the CPU 704 may control writing data to and reading data from DRAM 730 and 731. In other embodiments, such a DRAM controller may be included in a processor such as the CPU 704.

[0044] The stereo audio CODEC 734 can be coupled to the analog signal processor 708. In addition, the audio amplifier 736 can be coupled to the stereo audio CODEC 734. The first stereo speaker 738 and the second stereo speaker 740 can be coupled to the audio amplifier 736 respectively. In addition, the microphone amplifier 742 can be coupled to the stereo audio CODEC 734, and the microphone 744 can be coupled to the microphone amplifier 742. The frequency modulation (“FM”) radio tuner 746 can be coupled to the stereo audio CODEC 734. The FM antenna 748 can be coupled to the FM radio tuner 746. In addition, the stereo headphones 750 can be coupled to the stereo audio CODEC 734. Other devices that can be coupled to the CPU 704 include one or more digital (e.g., CCD or CMOS) cameras 752.

[0045] The modem or RF transceiver 754 can be coupled to the analog signal processor 708. The RF switch 756 can be coupled to the RF transceiver 754 and the RF antenna 758. In addition, the keypad 760, the mono headphone with a microphone 762, and the vibrator device 764 can be coupled to the analog signal processor 708.

[0046] The power supply 766 can be coupled to the SoC 702 via the power management integrated circuit (PMIC) 768. The power supply 766 can include a rechargeable battery or a DC power supply, and the rechargeable battery or the DC power supply is derived from an AC-DC transformer connected to an AC power supply.

[0047] The SoC 702 can have one or more internal or on-chip thermal sensors 770A, and can be coupled to one or more external or off-chip thermal sensors 770B. The analog-to-digital converter (ADC) controller 772 can convert the voltage drops generated by the thermal sensors 770A and 770B into digital signals. One of the external thermal sensors 770B can be provided in contact with the USB port 724 socket structure or otherwise close to the USB port 724 socket structure in the manner described above. Figure 4 described to provide contact with the USB port 724 socket structure or otherwise be close to the USB port 724 socket structure.

[0048] In this exemplary embodiment, the touchscreen display 714, video port 720, USB port 724, camera 752, first stereo speaker 738, second stereo speaker 740, microphone 744, FM antenna 748, stereo headphones 750, RF switch 756, RF antenna 758, keypad 760, mono headphones 762, vibrator 764, thermal sensor 750B, ADC controller 752, PMIC 768, power supply 766, DRAM 730, and SIM card 726 are external to the SoC 702. However, it should be understood that in other embodiments, one or more of these devices may be included in such an SoC.

[0049] The CPU 704 (or its core), GPU 706, or DSP 707 operating with a PCD memory such as DRAM 730 or 731, or SRAM 728, and associated components can be examples of a processor system, where the above method 500 ( Figure 5 ) can be controlled or implemented by the execution of firmware or software. Any such PCD memory or other memory or storage medium having firmware or software or a portion thereof stored thereon in a computer-readable form can be an example of a "computer program product", "computer-readable medium", etc., as such terms are understood in a patent dictionary.

[0050] The foregoing description is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects. Thus, the claims are not intended to be limited to the aspects shown herein, but should be accorded the full scope consistent with the language of the claims, where the reference to an element in the singular is not intended to mean "one and only one" unless specifically stated, but rather "one or more". The term "exemplary" is used herein to mean "serving as an example, instance, or illustration". Any aspect described herein as "exemplary" need not be construed as preferred or superior to other aspects. Unless otherwise expressly stated, the term "some" means one or more. Combinations such as "at least one of A, B, or C", "one or more of A, B, or C", "at least one of A, B, and C", "one or more of A, B, and C", and "any combination of A, B, C, or thereof" include any combination of A, B, and / or C, and may include multiple A's, multiple B's, or multiple C's. Specifically, combinations such as "at least one of A, B, or C", "one or more of A, B, or C", "at least one of A, B, and C", "one or more of A, B, and C", and "any combination of A, B, C, or thereof" can be A only, B only, C only, A and B, A and C, B and C, or A and B and C, where any such combination can include one or more members of A, B, or C. All structural and functional equivalents of the elements of the various aspects described in this disclosure that are known or later come to be known to those of ordinary skill in the art are hereby expressly incorporated herein by reference and are intended to be covered by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public, whether or not such disclosure is expressly recited in the claims. The words "module", "mechanism", "element", "device", etc. shall not be used in place of the word "component". Thus, no claim element shall be construed as a means-plus-function unless the element is expressly recited using the phrase "means for".

Claims

1. A connector device, comprising: A first connector having a first plurality of electrical contact portions; A second connector having a second plurality of electrical contact portions; And A cable having a first end coupled to the first connector and a second end coupled to the second connector, the cable including a plurality of electrical signal conductors within a cable jacket, the cable jacket including a first end portion, a second end portion, and an intermediate portion, the first end portion extending between the first connector and the intermediate portion, the second end portion extending between the second connector and the intermediate portion, the first end portion having a higher thermal conductivity than the intermediate portion, the second end portion having a higher thermal conductivity than the intermediate portion, and the cable jacket having substantially the same thickness along the first end portion, the intermediate portion, and the second end portion.

2. The connector device according to claim 1, wherein: When the connector device conducts current, the measured temperature of the first end portion is at least 20% higher than the measured temperature of the intermediate portion.

3. The connector device according to claim 1, wherein: When the connector device conducts current, the measured temperature of each of the first end portion and the second end portion is at least 20% higher than the measured temperature of the intermediate portion.

4. The connector device according to claim 1, wherein each of the first connector and the second connector has a Universal Serial Bus Power Delivery (USB-PD) configuration.

5. A connector device, comprising: A first component for electrically and mechanically mating a first plurality of electrical contact portions with a first mating connector; A second component for electrically and mechanically mating a second plurality of electrical contact portions with a second mating connector; And A component for transmitting electrical signals between the first plurality of electrical contact portions and the second plurality of electrical contact portions through a cable, the transmitting component having a first end coupled to the first mating connector and a second end coupled to the second mating connector, the transmitting component including a plurality of electrical signal conductors within a cable jacket, the cable jacket including a first end portion, a second end portion, and an intermediate portion, the first end portion extending between the first component and the intermediate portion, the second end portion extending between the second component and the intermediate portion, the first end portion having a higher thermal conductivity than the intermediate portion, the second end portion having a higher thermal conductivity than the intermediate portion, and the cable jacket having substantially the same thickness along the first end portion, the intermediate portion, and the second end portion.

6. The connector device according to claim 5, wherein: When the connector device conducts current, the measured temperature of the first end portion is at least 20% higher than the measured temperature of the intermediate portion.

7. The connector device according to claim 5, wherein: When the connector device conducts current, the measured temperature of each of the first end portion and the second end portion is at least 20% higher than the measured temperature of the intermediate portion.

8. The connector device according to claim 5, wherein each of the first component and the second component has a Universal Serial Bus Power Delivery (USB-PD) configuration.

9. A method for dissipating heat energy in a connector system, comprising: inserting a first connector having a first plurality of electrical contacts into a first receptacle connector; inserting a second connector having a second plurality of electrical contacts into a second receptacle connector; transferring electrical signals through a plurality of electrical signal conductors coupled between the first plurality of electrical contacts and the second plurality of electrical contacts, the plurality of electrical signal conductors being enclosed within a cable sheath that extends between the first connector and the second connector; conductively dissipating more heat energy through a first end portion of the cable sheath having a first thermal conductivity than through an intermediate portion of the cable sheath having a second thermal conductivity, the second thermal conductivity being less than the first thermal conductivity, wherein the first end portion extends between the first connector and the intermediate portion; and conductively dissipating more heat energy through a second end portion of the cable sheath having a third thermal conductivity than through the intermediate portion of the cable sheath, the second thermal conductivity of the intermediate portion also being less than the third thermal conductivity, wherein the second end portion extends between the second connector and the intermediate portion, the cable sheath having substantially the same thickness along the first end portion, the intermediate portion, and the second end portion.

10. The method according to claim 9, wherein: when the connector system conducts current, a measured temperature of the first end portion is at least 20% higher than a measured temperature of the intermediate portion.

11. The method according to claim 9, wherein each of the first connector and the second connector has a Universal Serial Bus Power Delivery (USB-PD) configuration.

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