A thermoelectric temperature sensor, a packaging method thereof, and a temperature measuring device

Abstract

The application discloses a thermoelectric pile temperature sensor and a packaging method and a temperature measuring device thereof, and relates to the technical field of temperature sensors, to solve the problem of poor measurement accuracy caused by noise voltage generated in the sensitive area of the thermoelectric pile due to environmental temperature changes. The thermoelectric pile temperature sensor comprises a thermoelectric pile chip, a conditioning component electrically connected with the thermoelectric pile chip, and a packaging structure for packaging the thermoelectric pile chip and the conditioning component. The thermoelectric pile chip comprises a heat insulation structure and a thermoelectric pile sensitive structure, and the thermoelectric pile sensitive structure is distributed in the heat insulation structure. The conditioning component is used for detecting the temperature of the packaging structure and conditioning the output signal of the thermoelectric pile chip. The conditioning component and the packaging structure are also electrically connected with an external control circuit respectively. When the temperature of the packaging structure detected by the conditioning component changes, the external control circuit is used for controlling the packaging structure to adjust the temperature of the packaging structure, so that the temperature of the packaging structure remains constant.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature sensors, in particular to a thermoelectric temperature sensor, a packaging method thereof and a temperature measuring device. BACKGROUND

[0002] The thermoelectric temperature sensor is a kind of thermal release infrared sensor, which is widely used in ear-type thermometers, radiation thermometers, food temperature detection and other fields.

[0003] When the traditional thermoelectric temperature sensor measures temperature, the temperature change of the sensitive region of the thermoelectric chip cannot keep up with the change of the external environment temperature in time after the external environment temperature changes suddenly, so that the noise voltage generated by the change of the external environment temperature exists in the sensitive region of the thermoelectric chip, thereby causing the problem of poor measurement accuracy. SUMMARY

[0004] The present application aims to provide a thermoelectric temperature sensor, a packaging method thereof and a temperature measuring device, which can solve the problem of poor measurement accuracy caused by the noise voltage generated by the change of the external environment temperature in the sensitive region of the thermoelectric chip.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, the present application provides a thermoelectric temperature sensor, comprising a thermoelectric chip, a conditioning component electrically connected with the thermoelectric chip, and a packaging structure for packaging the thermoelectric chip and the conditioning component.

[0007] The thermoelectric chip comprises a heat insulation structure and a thermoelectric sensitive structure, and the thermoelectric sensitive structure is distributed in the heat insulation structure. The conditioning component is used to detect the temperature of the packaging structure and to condition the output signal of the thermoelectric chip. The conditioning component and the packaging structure are also electrically connected with an external control circuit respectively. When the temperature of the packaging structure detected by the conditioning component changes, the external control circuit is used to control the packaging structure to adjust its own temperature, so as to keep the temperature of the packaging structure constant.

[0008] Compared with the prior art, in the thermoelectric pile temperature sensor provided by the application, the thermoelectric pile chip comprises a heat insulation structure and a thermoelectric pile sensitive structure, the thermoelectric pile sensitive structure is distributed in the heat insulation structure, and based on this, when the target object is measured in temperature, the thermoelectric pile sensitive structure will not directly contact the environment in the packaging structure and the external environment outside the packaging structure, the heat exchange speed between the external environment and the thermoelectric pile sensitive structure can be reduced, the heat exchange rate through the heat insulation structure and the thermoelectric pile sensitive structure and the heat exchange rate through the gas in the packaging structure and the thermoelectric pile sensitive structure can be synchronized, the temperature influence of the external environment on the thermoelectric pile sensitive structure is reduced to a certain extent, and thus the output of the noise voltage of the thermoelectric pile sensitive structure is zero. The conditioning assembly is used for detecting the temperature of the packaging structure in real time. The conditioning assembly and the packaging structure are also electrically connected with the external control circuit respectively. Based on this, the conditioning assembly can detect the temperature of the packaging structure and transmit the detected temperature signal of the packaging structure to the external control circuit. When the temperature of the external environment decreases, the external control circuit controls the packaging structure to be heated, so that the temperature of the packaging structure and the temperature of the thermoelectric pile sensitive structure can be kept constant under the influence of the external environment; when the temperature of the external environment increases, the external control circuit controls the packaging structure to be heated, so that the temperature of the packaging structure and the temperature of the thermoelectric pile sensitive structure can be increased synchronously with the temperature of the external environment, so as to reduce the temperature difference between the inside and outside of the packaging structure, and finally the temperature of the packaging structure and the temperature of the thermoelectric pile sensitive structure can be kept constant again, so as to further reduce the influence of the temperature change of the external environment on the temperature of the thermoelectric pile sensitive structure, so that the thermoelectric pile sensitive structure has no obvious noise voltage output without the target object being measured in temperature. In addition, the conditioning assembly is also electrically connected with the thermoelectric pile chip, is used for conditioning the output signal of the thermoelectric pile chip, can convert the analog voltage signal output by the thermoelectric pile chip into a temperature digital signal and transmit it to the external control circuit, and then realizes the temperature measurement of the target object. As can be seen, the thermoelectric pile sensitive structure provided by the application reduces the influence of the temperature change of the external environment on the temperature change of the thermoelectric pile sensitive region, avoids the noise voltage generated by the thermoelectric pile sensitive structure, and further avoids the influence on the measurement accuracy.

[0009] In a second aspect, the application further provides a temperature measuring device comprising the thermoelectric pile temperature sensor of the technical solution of the first aspect.

[0010] Compared with the prior art, the temperature measuring device provided by the application has the same beneficial effects as the thermoelectric pile temperature sensor of the technical solution of the first aspect, which will not be repeated here.

[0011] In a third aspect, the application further provides a packaging method of a thermoelectric pile temperature sensor, and the thermoelectric pile temperature sensor is the thermoelectric pile temperature sensor of the technical solution of the first aspect, which comprises:

[0012] The thermoelectric sensitive structure is arranged in the heat insulation structure to obtain a thermoelectric chip;

[0013] The thermoelectric chip is electrically connected with the conditioning component;

[0014] The conditioning component and the packaging structure are electrically connected with external control circuit;

[0015] The thermoelectric chip and the conditioning component are arranged in the packaging structure, and the thermoelectric chip and the conditioning component are fixedly connected with the packaging structure.

[0016] Compared with the prior art, the packaging method of the thermoelectric temperature sensor provided by the present application has the same beneficial effects as the thermoelectric temperature sensor of the first aspect of the present application, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are included to provide a further understanding of the present application, form a part of the present application and are included to further explain the present application and, together with the description, serve to explain the present application. In the drawings:

[0018] Figure 1 A structural schematic diagram of a thermoelectric temperature sensor provided in an embodiment of the present application;

[0019] Figure 2 A structural schematic diagram of another thermoelectric temperature sensor provided in an embodiment of the present application;

[0020] Figure 3 A top view of a packaging substrate provided in an embodiment of the present application;

[0021] Figure 4 A top view of a thermoelectric chip provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of a thermoelectric chip provided in an embodiment of the present application.

[0023] Reference signs:

[0024] 1-thermoelectric chip, 11-thermoelectric sensitive structure,

[0025] 111-hot end, 112-cold end,

[0026] 12-heat insulation structure, 121-chip substrate,

[0027] 122-heat insulation film, 123-infrared reflector,

[0028] 21-conditioning chip, 22-conditioning circuit,

[0029] 3- packaging structure, 31- packaging substrate,

[0030] 311- substrate body, 312- heating element,

[0031] 32- packaging cap, 33- filter,

[0032] 34- first heat-conducting adhesive, 35- second heat-conducting adhesive,

[0033] 36- solder pad. DETAILED DESCRIPTION

[0034] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same items or similar items with basically the same function and effect. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and the order is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the number and execution order, and the words "first", "second" and the like do not necessarily mean different.

[0035] It should be noted that in the present application, the words "exemplary" or "for example" are used to represent an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words "exemplary" or "for example" are intended to present the relevant concept in a specific manner.

[0036] In the present application, "at least one" means one or more, and "multiple" means two or more. The association relationship of the associated objects is described, which means that there can be three relationships, for example, A and / or B, which can represent the following cases: A exists alone, A and B exist together, and B exists alone, wherein A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after it. "At least one of the following" or similar expressions means any combination of these items, including any combination of single item or multiple items. For example, at least one of a, b or c can represent: a, b, c, the combination of a and b, the combination of a and c, the combination of b and c, or the combination of a, b and c, wherein a, b and c can be single or multiple.

[0037] The thermoelectric pile temperature sensor, as a thermal release infrared sensor, is widely used in ear-type thermometers, radiation thermometers, food temperature detection and other fields.

[0038] The traditional thermoelectric temperature sensor, when measuring temperature, when the external environment temperature changes suddenly, the temperature change of the thermoelectric chip sensitive area cannot keep up with the change of the external environment temperature in time, so that the thermoelectric sensitive area exists the noise voltage caused by the change of the external environment temperature, thereby causing the problem of poor measurement accuracy.

[0039] In order to solve the above problems, as shown in Figure 1 and Figure 2 The embodiment of the present application provides a thermoelectric temperature sensor, which comprises a thermoelectric chip 1, a conditioning component electrically connected with the thermoelectric chip 1, and a packaging structure 3 for packaging the thermoelectric chip 1 and the conditioning component.

[0040] The thermoelectric chip 1 comprises a heat insulation structure 12 and a thermoelectric sensitive structure 11, and the thermoelectric sensitive structure 11 is distributed in the heat insulation structure 12. The conditioning component is used for detecting the temperature of the packaging structure 3 and conditioning the output signal of the thermoelectric chip 1. The conditioning component and the packaging structure 3 are also respectively electrically connected with an external control circuit. When the temperature of the packaging structure 3 detected by the conditioning component changes, the external control circuit is used for controlling the packaging structure 3 to adjust its own temperature, so that the temperature of the packaging structure 3 remains constant.

[0041] In specific implementation, the thermoelectric sensitive structure 11 is distributed in the heat insulation structure 12, so as to reduce the influence of the external environment on the thermoelectric sensitive structure 11 when measuring the temperature of the target object. The conditioning component detects the temperature of the packaging structure 3 and transmits the detected temperature to the external control circuit. When the temperature of the packaging structure 3 changes under the influence of the external environment, the external control circuit controls the packaging structure 3 to adjust its own temperature, so that the temperature of the packaging structure 3 remains constant.

[0042] As can be seen from the above implementation process and specific structure of the thermopile temperature sensor, the thermopile chip 1 includes a heat insulation structure 12 and a thermopile sensing structure 11. The thermopile sensing structure 11 is distributed within the heat insulation structure 12. Therefore, when measuring the temperature of a target object, the thermopile sensing structure 11 will not directly contact the environment inside the encapsulation structure 3 or the external environment outside the encapsulation structure 3. This reduces the heat exchange rate between the external environment and the thermopile sensing structure 11, achieving synchronization between the heat exchange rate through the heat insulation structure 12 and the thermopile sensing structure 11, as well as the heat exchange rate through the gas inside the encapsulation structure 3 and the thermopile sensing structure 11. This reduces the influence of the external ambient temperature on the temperature of the thermopile sensing structure 11 to a certain extent, resulting in zero noise voltage output from the thermopile sensing structure 11. A conditioning component is used to detect the temperature of the encapsulation structure 3. The conditioning component and the encapsulation structure 3 are also electrically connected to an external control circuit. Therefore, the conditioning component can detect the temperature of the encapsulation structure 3 and transmit the detected temperature signal to the external control circuit. When the ambient temperature decreases, the external control circuit controls the packaging structure 3 to heat up, preventing the temperature of the packaging structure from decreasing due to the influence of the external environment. This ensures that the temperature of the packaging structure 3 itself and the temperature of the thermopile sensitive structure 11 remain constant. When the ambient temperature increases, the external control circuit controls the packaging structure 3 to heat up, allowing the temperature of the packaging structure 3 itself and the temperature of the thermopile sensitive structure 11 to rise synchronously with the ambient temperature. This reduces the temperature difference between the inside and outside of the packaging structure, ultimately restoring the temperature of the packaging structure 3 itself and the temperature of the thermopile sensitive structure 11 to a constant state. This further reduces the impact of ambient temperature changes on the temperature of the thermopile sensitive structure 11, thus ensuring that the thermopile sensitive structure 11 has no significant noise voltage when no target object is being measured. Furthermore, the conditioning component is electrically connected to the thermopile chip 1 and is used to condition the output signal of the thermopile chip 1. It converts the analog voltage signal output by the thermopile chip 1 into a digital temperature signal and transmits it to the external control circuit, thereby achieving temperature measurement of the target object. Therefore, the thermopile sensing structure 11 provided in this embodiment of the invention reduces the influence of changes in the ambient temperature on the temperature changes in the thermopile sensing area, avoids the noise voltage generated by the thermopile sensing structure 11, and thus avoids the impact on measurement accuracy.

[0043] Understandably, after acquiring the temperature of the package structure 3 detected by the conditioning component, the external control circuit can control the applied voltage during heating of the package structure 3 based on the temperature difference between the package structure 3 and the ambient temperature. For example, to prevent the temperature of the package structure 3 from decreasing with the ambient temperature, when the ambient temperature decreases by 5°C, it is necessary to maintain a constant temperature of 35°C for the package structure 3. The applied voltage at this time can be denoted as V1. When the ambient temperature decreases by 10°C, it is necessary to maintain a constant temperature of 35°C for the package structure 3. The applied voltage at this time can be denoted as V2. Since 5°C is less than 10°C, the applied voltage V1 is also less than V2 due to the temperature difference between the two.

[0044] In addition, in practical applications, the constant temperature state of the packaging structure 3 can be directly set to 35°C. When the temperature of the packaging structure 3 is detected to decrease, the external control circuit controls the packaging structure 3 to heat up. When the conditioning component detects that the temperature of the packaging structure 3 has reached 35°C, the external control circuit directly cuts off the voltage applied to the packaging structure 3, so that the heating of the packaging structure 3 ends.

[0045] It should be noted that if the ambient temperature rises to 38°C and exceeds 35°C, in order to reduce the temperature difference between the inside and outside of the package structure 3, the external control circuit needs to control the package structure 3 to continue to heat up, so that the package structure 3 and the thermopile sensitive structure 11 can heat up synchronously until they reach 38°C and then maintain a constant state.

[0046] In one possible implementation, such as Figure 1 As shown, when the conditioning component includes a conditioning chip 21, the conditioning chip 21 and the thermopile chip 1 are wire-bonded. Based on this, both the conditioning chip 21 and the thermopile chip 1 are encapsulated within a package structure 3, and the conditioning chip 21 and the thermopile chip 1 are respectively fixedly connected to the package structure 3. The leads of the conditioning chip 21 are also electrically connected to the package structure 3 via pads 36 to detect the temperature of the package structure 3 and transmit the temperature signal of the package structure 3 to an external control circuit.

[0047] In one possible implementation, such as Figure 2 As shown, when the conditioning component includes conditioning circuit 22, conditioning circuit 22 and thermopile sensitive structure 11 are integrated on thermopile chip 1. Based on this, both conditioning circuit 22 and thermopile sensitive structure 11 are integrated on thermopile chip 1, achieving monolithic integration of conditioning circuit 22 and thermopile sensitive structure 11. At this time, since conditioning circuit 22 is integrated on thermopile chip 1, only thermopile chip 1 is packaged in package structure 3. The thermopile chip 1 is fixedly connected to package structure 3, and the leads of conditioning circuit 22 are also electrically connected to package structure 3 through pads 36 to detect the temperature of package structure 3 and transmit the temperature signal of package structure 3 to external control circuit.

[0048] In a possible implementation, as shown in Figure 1 and Figure 2 shown, the packaging structure 3 includes a packaging substrate 31, a packaging cap 32, and a filter 33. The packaging substrate 31 is fixedly connected with the packaging cap 32 through a first heat-conducting adhesive 34. The packaging cap 32 has an opening on a side away from the packaging substrate 31. The filter 33 covers the opening and is fixedly connected with the packaging cap 32 through the first heat-conducting adhesive 34. The filter 33 is used to filter light in the external environment. The thermoelectric chip 1 and the conditioning assembly are fixed in a packaging cavity formed by the packaging substrate 31 and the packaging cap 32 through a second heat-conducting adhesive 35. The thermal conductivity of the first heat-conducting adhesive 34 is greater than that of the second heat-conducting adhesive 35. The packaging substrate 31 is also electrically connected with an external control circuit, which is used to adjust the temperature of the packaging structure 3 under the control of the external control circuit.

[0049] When the thermoelectric temperature sensor is used to measure temperature, the radiation light of the target object can irradiate into the thermoelectric chip 1 through the opening. After the light in the external environment is filtered by the filter 33, the thermoelectric chip 1 generates electromotive force under the light irradiation. According to the voltage generated by the electromotive force, the voltage analog signal is transmitted to the conditioning chip 21 or the conditioning circuit 22. After the conditioning chip 21 or the conditioning circuit 22 converts the voltage analog signal into a temperature digital signal, the temperature digital signal is sent to the external control circuit, so that the temperature of the target object is measured.

[0050] When the packaging substrate 31 adjusts the temperature in the packaging structure 3, heat can be quickly transmitted to the packaging cap 32 through the packaging substrate 31, and then transmitted to the filter 33 by the packaging cap 32, and finally dissipated to the inside of the packaging structure 3, so as to improve the internal environment temperature of the packaging structure 3. At the same time, the packaging substrate 31 is also fixedly connected with the thermoelectric chip 1, and heat can also be transmitted to the thermoelectric chip 1 through the packaging substrate 31. However, because the thermal conductivity of the first heat-conducting adhesive 34 is higher than that of the second heat-conducting adhesive 35, the packaging substrate 31 can adjust the temperature of the thermoelectric chip 1 at the same time when adjusting the temperature of the packaging structure 3, so as to avoid that the thermoelectric chip 1 generates noise voltage under the influence of the external environment temperature, thereby causing poor measurement accuracy.

[0051] In the above embodiment, the first heat-conductive adhesive 34 includes one or more of nano-silver paste, gold-indium solder or gold-tin solder. The second heat-conductive adhesive 35 includes one or more of nano-silver paste, resin adhesive or polypropylene adhesive. Based on this, in order to match the temperature change speed of the thermoelectric chip 1 with the temperature change speed of the packaging structure 3, the packaging substrate 31, the packaging tube cap 32 and the filter sheet 33 can be bonded together by nano-silver paste, gold-indium solder or gold-tin solder with higher thermal conductivity, so that the heat transfer speed between the packaging substrate 31, the packaging tube cap 32 and the filter sheet 33 is faster. The thermoelectric chip 1 is fixedly connected to the packaging substrate 31 by nano-silver paste, resin adhesive or polypropylene adhesive with low thermal conductivity, so as to slow down the temperature change speed of the thermoelectric chip 1 when the packaging substrate 31 heats the packaging structure 3. When the second heat-conductive adhesive 35 is resin adhesive, it can be natural resin adhesive or synthetic resin adhesive, such as epoxy resin adhesive, etc. The embodiment of the present application does not limit this.

[0052] It can be understood that, according to the content of silver nanoparticles doped in the nano-silver paste, the thermal conductivity is also different. When the content of doped silver nanoparticles is higher, the thermal conductivity is higher, and when the content of doped silver nanoparticles is lower, the thermal conductivity is also lower. In the embodiment of the present application, the content of silver nanoparticles in the nano-silver paste in the first heat-conductive adhesive 34 is higher than the content of silver nanoparticles in the nano-silver paste in the second heat-conductive adhesive 35.

[0053] In some embodiments, as shown in Figure 3 The packaging substrate 31 includes a substrate body 311 and a heating element 312. The heating element 312 is located inside the substrate body 311 and is electrically connected to an external control circuit, for adjusting the temperature of the packaging structure 3 under the control of the external control circuit.

[0054] In specific implementation, the heating element 312 can be directly embedded in the substrate body 311. When the heating element 312 is a heating resistor, the external control circuit controls the voltage applied to the heating resistor, and the heating resistor converts electrical energy into heat energy, thereby adjusting the temperature of the packaging structure 3. When the temperature of the packaging structure 3 reaches a constant temperature state or a target temperature, the external control circuit stops providing voltage to the heating resistor.

[0055] In one possible implementation, as shown in Figure 4 and Figure 5As shown, the heat insulation structure 12 includes a heat insulation film 122, a chip substrate 121, and an infrared reflector 123. The thermopile sensing structure 11 is integrated within the heat insulation film 122, which is supported on the chip substrate 12, providing support and heat insulation for the thermopile sensing structure 11. The infrared reflector 123 covers the heat insulation film 122 and is centrally symmetrically distributed, reflecting a portion of the infrared radiation irradiated onto the thermopile sensing structure 11 back to the outside of the thermopile temperature sensor.

[0056] Based on this, after the heat insulation film 122 is supported on the chip substrate 121, the thermopile sensitive structure 11 is integrated inside the heat insulation film 122. The heat insulation film 122 also covers the thermopile sensitive structure 11, separating the thermopile sensitive structure 11 from the chip substrate 121 and isolating it from the environment inside the packaging structure 3. In other words, the thermopile sensitive structure 11 will not directly contact the chip substrate 121 or the internal environment of the packaging structure 3. Furthermore, when the external ambient temperature changes, before the heating element 312 heats the packaging structure 3, the thermopile sensitive structure 11 is encapsulated inside the heat insulation structure 12, which can minimize the influence of the external ambient temperature on the temperature of the thermopile sensitive structure 11. When the temperature of the packaging structure 3 changes under the influence of the external ambient temperature, the heating element 312 heats the packaging structure 3. At this time, the thermopile sensitive structure 11 is not in direct contact with the chip substrate 121 or the internal environment of the packaging structure 3, so the temperature change of the thermopile sensitive structure 11 is relatively slow, avoiding the generation of noise voltage, thus affecting the measurement accuracy.

[0057] like Figure 4 As shown, the infrared reflector 123 covers the outside of the heat insulation film 122 and is used to reflect the infrared rays that pass through the filter 33. This ensures that the thermopile sensitive structure 11 in the area where the infrared reflector 123 is projected will not absorb the heat of the infrared rays. In the area where the infrared reflector 123 is not covered, the thermopile sensitive structure 11 absorbs the heat of the infrared rays and converts the heat energy into electrical energy. Then, it outputs a voltage analog signal to the conditioning chip 21 or the conditioning circuit 22 according to the irradiation intensity, and finally realizes the temperature measurement of the target object.

[0058] Specifically, the infrared reflector 123 can be an infrared reflector made of metal, such as an aluminum infrared reflector, or it can be a reflector made of other materials with a surface sprayed or coated with a reflective material. This embodiment of the invention does not specifically limit this.

[0059] In one possible implementation, such as Figure 4 and Figure 5 As shown, the thermopile sensitive structure 11 is an axisymmetric structure, and / or the thermopile sensitive structure 11 includes a cold end 112 and a hot end 111 electrically connected to the cold end 112, and both the cold end 112 and the hot end 111 are located inside the heat insulation film 122.

[0060] Exemplarily, the thermoelectric sensitive structure 11 can be a left-right symmetrical structure as shown, sequentially comprising a first hot end, a first cold end, a second cold end and a second hot end from left to right. Figure 4 As shown, when the thermoelectric sensitive structure 11 is subjected to heat impact, the noise voltage generated by the first hot end and the first cold end in the thermoelectric sensitive structure 11 can be offset by the noise voltage generated by the second hot end and the second cold end. Figure 5 As shown, when the thermoelectric sensitive structure 11 is subjected to heat impact, the noise voltage generated by the first hot end and the first cold end in the thermoelectric sensitive structure 11 can be offset by the noise voltage generated by the second hot end and the second cold end.

[0061] The embodiment of the present application also provides a temperature measuring device comprising the thermoelectric temperature sensor provided in the above embodiment.

[0062] In actual application, the external control circuit in the above embodiment can be integrated with the control device in the temperature measuring device. For example, the control end of the external control circuit can be arranged outside the temperature measuring device, and the user can acquire the temperature of the packaging structure 3 detected by the conditioning assembly through the control end, so as to select whether the packaging structure 3 in the thermoelectric sensor needs to be heated, and select the voltage to be applied according to the difference between the temperature of the packaging structure 3 and the temperature of the external environment.

[0063] Compared with the prior art, the temperature measuring device provided by the embodiment of the present application has the same beneficial effects as the thermoelectric temperature sensor provided in the above embodiment, which will not be repeated here.

[0064] The embodiment of the present application also provides a packaging method of a thermoelectric temperature sensor, and the thermoelectric temperature sensor is the thermoelectric temperature sensor provided in the above embodiment, comprising:

[0065] Placing the thermoelectric sensitive structure 11 in the heat insulation structure 12 to obtain the thermoelectric chip 1;

[0066] Electrically connecting the thermoelectric chip 1 and the conditioning assembly;

[0067] Electrically connecting the conditioning assembly and the packaging structure 3 with the external control circuit;

[0068] Placing the thermoelectric chip 1 and the conditioning assembly in the packaging structure 3 together, and fixedly connecting the thermoelectric chip 1, the conditioning assembly and the packaging structure 3.

[0069] Compared with the prior art, the packaging method of the thermoelectric temperature sensor provided by the embodiment of the present application has the same beneficial effects as the thermoelectric temperature sensor provided in the above embodiment, which will not be repeated here.

[0070] Although the application has been described in connection with various embodiments thereof, it will be understood that the application is capable of further modifications and that this application is intended to cover any and all such variations, using the scope of the claims. In the claims, the term comprising does not exclude the presence of other elements or steps than those listed in a claim. The term "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. A single processor or other unit can fulfil the functions of several items recited in the claims. The terms "first", "second" and the like in the description do not necessarily imply that there are two or more items. Embodiments of the application can relate to any of the specific features and combinations thereof without necessarily referring to the corresponding drawings.

[0071] Although the application has been described in connection with specific embodiments thereof, it will be understood that it is capable of further modifications and this application is intended to cover any and all such variations, using the scope of the claims. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Therefore, it is intended that the present application cover all such modifications and variations of the application that come within the scope of the appended claims and their equivalents.

Claims

1. A thermopile temperature sensor, characterized by, The application relates to a thermoelectric chip, a conditioning component electrically connected with the thermoelectric chip, and a packaging structure for packaging the thermoelectric chip and the conditioning component, wherein: The thermoelectric chip comprises a heat insulation structure and a thermoelectric sensitive structure, and the thermoelectric sensitive structure is distributed in the heat insulation structure; The conditioning component is used for detecting the temperature of the packaging structure and conditioning the output signal of the thermoelectric chip; The conditioning component and the packaging structure are also electrically connected with an external control circuit respectively; When the temperature of the packaging structure detected by the conditioning component changes, the external control circuit is used for controlling the packaging structure to adjust the temperature of the packaging structure, so that the temperature of the packaging structure remains constant; The packaging structure comprises a packaging substrate, a packaging cap and a filter, wherein: The packaging substrate is fixedly connected with the packaging cap through a first heat-conducting adhesive, the side of the packaging cap away from the packaging substrate has an opening, the filter covers the opening and is fixedly connected with the packaging cap through the first heat-conducting adhesive, and the filter is used for filtering light in the external environment; the thermoelectric chip and the conditioning component are fixed in a packaging cavity formed by the packaging substrate and the packaging cap through a second heat-conducting adhesive; The heat conductivity of the first heat-conducting adhesive is greater than that of the second heat-conducting adhesive; The packaging substrate is also electrically connected with the external control circuit, and is used for adjusting the temperature of the packaging structure under the control of the external control circuit. The heat insulation structure comprises a heat insulation film, a chip substrate and an infrared reflector, the thermoelectric sensitive structure is integrated in the heat insulation film, the heat insulation film is supported on the chip substrate and is used for supporting and heat insulating the thermoelectric sensitive structure; 2. The thermopile temperature sensor of claim 1, wherein, The infrared reflector covers the heat insulation film and is centrally symmetrically distributed, and is used for reflecting part of infrared rays irradiated to the thermoelectric sensitive structure to the outside of the thermoelectric temperature sensor. The thermoelectric sensitive structure is an axisymmetric structure, and / or the thermoelectric sensitive structure comprises a cold end and a hot end electrically connected with the cold end, and the cold end and the hot end are both located in the heat insulation film.

3. The thermopile temperature sensor of claim 2, wherein, The packaging substrate comprises a substrate body and a heating element, wherein:

4. The thermopile temperature sensor of claim 1, wherein, The heating element is located inside the substrate body and is electrically connected with the external control circuit, and is used for adjusting the temperature of the packaging structure under the control of the external control circuit. The first heat-conducting adhesive comprises one or more of nano-silver paste, gold-indium solder or gold-tin solder; 5. The thermopile temperature sensor of claim 1, wherein, The second heat-conducting adhesive comprises one or more of nano-silver paste, resin adhesive or polypropylene adhesive. When the conditioning component comprises a conditioning chip, the conditioning chip is connected with the thermoelectric chip through wire bonding.

6. The thermopile temperature sensor of claim 1, wherein, When the conditioning component comprises a conditioning circuit, the conditioning circuit is integrated on the thermoelectric chip with the thermoelectric sensitive structure.

7. The thermopile temperature sensor of claim 1, wherein, The application relates to a thermoelectric temperature sensor.

8. A temperature measuring device, characterized by The thermoelectric temperature sensor is the thermoelectric temperature sensor according to any one of claims 1-7, comprising:

9. A method of packaging a thermopile temperature sensor, characterized by, ​ The thermoelectric sensitive structure is arranged in the heat insulation structure to obtain a thermoelectric chip; The thermoelectric chip is electrically connected with a conditioning assembly; The conditioning assembly and the packaging structure are electrically connected with an external control circuit; The thermoelectric chip and the conditioning assembly are arranged in the packaging structure, and the thermoelectric chip and the conditioning assembly are fixedly connected with the packaging structure.

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