Insulation Carrier Mechanism, Detection Equipment and Insulation Method

Abstract

The present invention provides a heat-insulating carrier mechanism, a detection device and a heat-insulating method. The heat-insulating carrier mechanism includes a transmission component and a first carrier component; the first carrier component includes a first carrier, a heating element and a heat dissipation prevention structure. The first carrier is connected to the transmission component, the heating element is arranged on the first carrier, and the heating element is used to heat the first carrier; the heat dissipation prevention structure is arranged on the first carrier, and the heat dissipation prevention structure is used to reduce or prevent the heat dissipation of the first carrier. By using the heat-insulating carrier mechanism provided by this technical solution, the technical problem that the temperature of the chip will be lost during transportation in the prior art and thus affect the test effect is effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a heat-insulating transport mechanism, a detection device and a heat-insulating method. Background Art

[0002] When testing a chip, it is necessary to heat the chip to a specified temperature before transporting it to a testing agency for testing. However, during transportation, the chip temperature will be lost, which will affect the test results. Summary of the invention

[0003] The object of the present invention is to provide a heat-insulating transport mechanism to solve the technical problem in the prior art that the temperature of the chip will be lost during the transportation process, thereby affecting the test effect.

[0004] In a first aspect, the present invention provides a heat preservation transport mechanism, the heat preservation transport mechanism comprising:

[0005] Transmission components;

[0006] The first carrier assembly includes a first carrier, a heating element and an anti-heat dissipation structure, the first carrier is connected to the transmission assembly, the heating element is arranged on the first carrier, and the heating element is used to heat the first carrier; the anti-heat dissipation structure is arranged on the first carrier, and the anti-heat dissipation structure is used to reduce or prevent heat loss from the first carrier.

[0007] As an embodiment of the present invention, the first carrier includes a frame body and a table top body, the frame body is formed with a mounting groove, the heating element is arranged in the mounting groove, and the table top body is connected to the frame body to cover the mounting groove.

[0008] As an embodiment of the present invention, the heating element is formed with a first positioning hole, and the table body is formed with a second positioning hole; the bottom protrusion of the installation groove forms a positioning column, and the positioning column is sequentially inserted into the first positioning hole and the second positioning hole.

[0009] As an embodiment of the present invention, the anti-heat dissipation structure includes a heat insulation board, which is arranged on a side of the stand body away from the table body, and the heat insulation board and the stand body together form a heat insulation cavity.

[0010] As an embodiment of the present invention, the heat insulation plate protrusion is formed with a side stopper, and the side stopper is arranged beside the first carrier.

[0011] As an embodiment of the present invention, the stand body is formed with a connecting portion, and the connecting portion is connected to the transmission assembly; there are two heat insulation plates, and the two heat insulation plates are respectively arranged on both sides of the connecting portion;

[0012] The anti-heat dissipation structure further includes heat insulation columns, and the heat insulation columns are arranged between the connecting portion and the transmission assembly.

[0013] As an embodiment of the present invention, the anti-heat dissipation structure further includes windshields, and the windshields are arranged at both ends of the first carrier platform oppositely arranged along the transmission direction of the transmission assembly.

[0014] As an embodiment of the present invention, the heat preservation carrying mechanism further includes a guiding assembly, and the guiding assembly includes a guide rail, a slider and a connecting beam. The guide rail is slidably connected with the slider, the connecting beam is arranged on the slider, the connecting beam is connected with the transmission assembly, and a wire routing groove is formed in the connecting beam;

[0015] The first carrier platform assembly is arranged on the connecting beam, and the connecting wires of the heating element are arranged in the wire routing groove.

[0016] As an embodiment of the present invention, the transmission assembly includes a driving motor, a first transmission wheel, a second transmission wheel, a transmission belt and a transmission connecting rod;

[0017] The power output end of the driving motor is connected with the first transmission wheel, the second transmission wheel is oppositely arranged with the first transmission wheel, one end of the transmission belt is sleeved on the first transmission wheel, and the other end of the transmission belt is sleeved on the second transmission wheel; one end of the transmission connecting rod is connected with the transmission belt, the other end of the transmission connecting rod is connected with the connecting beam, and the transmission connecting rod is formed with a wire routing channel communicated with the wire routing groove and an outlet port communicated with the wire routing channel; the connecting wires of the heating element sequentially pass through the wire routing groove, the wire routing channel, and are led out from the outlet port.

[0018] As an embodiment of the present invention, the heat preservation carrying mechanism further includes a second carrier platform assembly and a cover plate. The second carrier platform assembly is arranged on the connecting beam, and the second carrier platform assembly is arranged at an interval with the first carrier platform assembly; the cover plate is clamped between the first carrier platform assembly and the second carrier platform assembly, and the cover plate and the second carrier platform assembly jointly cover the wire routing groove.

[0019] As an embodiment of the present invention, the first carrier platform assembly further includes a temperature sensor arranged on the heating element, and the temperature sensor is used for detecting the temperature of the heating element.

[0020] In a second aspect, the present invention further provides a detection device, and the detection device includes the heat preservation carrying mechanism as described in the first aspect.

[0021] In a third aspect, the present invention further provides a heat preservation method for a heat preservation carrying mechanism, where the heat preservation carrying mechanism is the heat preservation carrying mechanism described in the first aspect; the heat preservation method includes:

[0022] Heating the heating element in a first heating mode;

[0023] Determine whether the real-time detected temperature value of the heating element reaches a preset standard temperature value. If so, heat the heating element in a second heating mode, where the heating voltage of the first heating mode is greater than the voltage of the second heating mode.

[0024] As an embodiment of the present invention, after heating the heating element in the second heating mode, the heat preservation method further includes:

[0025] Determine whether the real-time detected temperature value of the heating element rises above the standard temperature upper limit value or whether the real-time detected temperature value of the heating element drops below the standard temperature lower limit value; where the standard temperature upper limit value is the sum of the standard temperature value and the temperature floating value, and the standard temperature lower limit value is the difference between the standard temperature value and the temperature floating value;

[0026] If the real-time detected temperature value of the heating element rises above the standard temperature upper limit value, stop heating the heating element; if the real-time detected temperature value of the heating element drops below the standard temperature lower limit value, then heat the heating element in the first heating mode;

[0027] Determine whether the real-time detected temperature value of the heating element reaches the standard temperature value. If so, execute the step of heating the heating element in the second heating mode.

[0028] As an embodiment of the present invention, before determining whether the real-time detected temperature value of the heating element reaches the standard temperature value and, if so, heating the heating element in the second heating mode, it further includes:

[0029] Determine whether the real-time detected temperature value of the heating element rises above the standard temperature upper limit value within a preset standard time. If so, reduce the heating voltage of the second heating mode to obtain a reduced second heating mode;

[0030] Update the second heating mode with the reduced second heating mode.

[0031] As an embodiment of the present invention, before determining whether the real-time detected temperature value of the heating element reaches the standard temperature value and, if so, heating the heating element in the second heating mode, it further includes:

[0032] Determine whether the real-time detected temperature value of the heating element drops below the lower limit of the standard temperature within a preset standard time. If so, increase the heating voltage of the second heating mode to obtain an increased second heating mode;

[0033] Update the second heating mode by using the increased second heating mode.

[0034] As an embodiment of the present invention, the heat preservation method further includes

[0035] Receive the actual temperature value detected by an external detection device for the heating element;

[0036] Compensate the real-time detected temperature value of the heating element based on the actual temperature value.

[0037] As an embodiment of the present invention, before compensating the real-time detected temperature value of the heating element based on the actual temperature value, it further includes:

[0038] Determine whether the absolute value of the difference between the real-time detected temperature value of the heating element and the actual temperature value is greater than the standard difference value. If so, perform the step of compensating the real-time detected temperature value of the heating element based on the actual temperature value.

[0039] As an embodiment of the present invention, compensating the real-time detected temperature value of the heating element based on the actual temperature value includes:

[0040] Subtract the actual temperature value from the real-time detected temperature value of the heating element to obtain a temperature compensation value;

[0041] Subtract the temperature compensation value from the real-time detected temperature value of the heating element to obtain a changed real-time detected temperature value;

[0042] Update the real-time detected temperature value of the heating element by using the changed real-time detected temperature value;

[0043] Adjust the heating voltage of the heating element so that the change amplitude of the real-time detected temperature value of the heating element is equal to the temperature compensation value.

[0044] As an embodiment of the present invention, after compensating the real-time detected temperature value of the first stage based on the actual temperature value, it further includes:

[0045] Receive the actual temperature value detected by the external detection device for the heating element again;

[0046] Determine whether the absolute value of the difference between the real-time detected value of the temperature of the heating element and the actually received temperature value is greater than the standard difference. If so, perform the step of compensating the real-time detected value of the temperature of the first carrier stage based on the actually received temperature value; if not, stop receiving the actually received temperature value.

[0047] As an embodiment of the present invention, the heat preservation method further includes:

[0048] Determine whether the temperature of the heating element is greater than a preset temperature safety value. If so, stop heating the heating element.

[0049] Implementing the embodiments of the present invention will have the following beneficial effects:

[0050] In the present invention, a chip heated to a specified temperature is placed on the first carrier stage, and then the transmission component drives the first carrier stage to move to transport the chip to the test mechanism; during this transportation process, the heating element heats the first carrier stage so that the first carrier stage has a certain temperature, that is, the environment where the chip is located has a certain temperature. Therefore, the first carrier stage can keep the chip warm or even heat it to prevent the heat of the chip from dissipating; at the same time, the first carrier stage is also provided with a heat dissipation prevention structure, and through the heat dissipation prevention structure, the heat dissipation of the first carrier stage can be reduced or even prevented, ensuring the temperature of the first carrier stage and the heat transferred from the first carrier stage to the chip, and further ensuring the heat preservation effect of the first carrier stage on the chip. Using the heat preservation transportation mechanism provided by this technical solution effectively solves the technical problem in the prior art that the temperature of the chip will be lost during the transportation process, thereby affecting the test effect. Description of the Drawings

[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0052] Figure 1 It is a schematic structural diagram of the detection device described in the embodiments of the present invention;

[0053] Figure 2 It is a schematic structural diagram of the heat preservation transportation mechanism;

[0054] Figure 3 It is an exploded structural diagram of the heat preservation transportation mechanism;

[0055] Figure 4 It is an exploded structural diagram of the first carrier stage assembly;

[0056] Figure 5Schematic structural diagram of the transmission assembly;

[0057] Figure 6 Partial schematic structural diagram of the detection device;

[0058] Figure 7 Schematic flow diagram of a heat preservation method;

[0059] Figure 8 Another schematic flow diagram of the heat preservation method;

[0060] Figure 9 Schematic operation logic diagram of a heat preservation method;

[0061] Figure 10 Another schematic operation logic diagram of the heat preservation method.

[0062] Wherein: 100, detection device; 10, heat preservation carrier mechanism; 11, transmission assembly; 111, drive motor; 112, first transmission wheel; 113, second transmission wheel; 114, transmission belt; 115, transmission connecting rod; 1151, wire routing channel; 1152, lead-out port; 12, first carrier assembly; 121, first carrier; 1211, bench body; 12111, installation groove; 12112, positioning post; 12113, connecting part; 1212, table top body; 12121, second positioning hole; 122, heating element; 1221, first positioning hole; 123a, heat insulation cavity; 1231, heat insulation board; 1231a, side blocking part; 1232, heat insulation column; 1233, wind shield; 13, guiding assembly; 131, guide rail; 132, slider; 133, connecting beam; 1331, wire routing groove; 14, second carrier assembly; 15, cover plate; 16, shuttle; 17, sheet metal frame; 18, temperature sensor; 19, temperature switch; 20, main frame; 30, tray conveying mechanism; 40, tray handling mechanism; 41, third drive assembly; 42, third manipulator; 50, heating mechanism; 51, high-temperature plate; 52, first drive assembly; 53, first manipulator; 60, testing mechanism; 70, blanking mechanism; 71, blanking storage table; 72, second drive assembly; 73, second manipulator; 80, control module; 90, temperature controller. Detailed implementation manners

[0063] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure content of the present invention more thorough and comprehensive.

[0064] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0065] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0066] In the present invention, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0068] See Figures 1 - 5, the present invention provides a detection device 100 that can be used to test chips. The detection device 100 includes a main frame 20, a tray conveying mechanism 30, a tray handling mechanism 40, a heating mechanism 50, a testing mechanism 60, a heat preservation and transportation mechanism 10, and a blanking mechanism 70; the tray conveying mechanism 30 is arranged on the main frame 20, and the tray conveying mechanism 30 forms a plurality of conveying channels, and the conveying channels are used to convey trays with untested chips, or convey empty trays, or trays with chips that have completed testing; the tray handling mechanism 40 straddles above the tray conveying mechanism 30 to pick up the trays in the conveying channels or place the trays into the conveying channels; the heating mechanism 50 is arranged on the main frame 20, and the heating mechanism 50 is used to heat the chips; the testing mechanism 60 is arranged on the main frame 20, and the testing mechanism 60 is used to test the chips; the blanking mechanism 70 is arranged on the main frame 20 and is used to blank the chips that have completed testing; the heat preservation and transportation mechanism 10 is arranged on the main frame 20, the heat preservation and transportation mechanism 10 is located below the testing mechanism 60, and one end of the heat preservation and transportation mechanism 10 extends to the heating mechanism 50, and the other end of the heat preservation and transportation mechanism 10 extends to the blanking mechanism 70.

[0069] Specifically, place the trays with untested chips and empty trays into the conveying channels of the tray conveying mechanism 30 for conveying; the tray handling mechanism 40 transports the trays with tested chips to the heating mechanism 50 and transports the empty trays to the blanking mechanism 70; the heating mechanism 50 picks up the chips in the trays and heats them, and the tray handling mechanism 40 then transports the emptied empty trays to the conveying channels for recycling or transports them to the blanking mechanism 70 for blanking; after the heating mechanism 50 finishes heating the chips, the heat preservation and transportation mechanism 10 transports the chips to the testing mechanism 60, and during the transportation, the heat preservation and transportation mechanism 10 keeps the chips warm to ensure that the temperature of the chips remains within the standard range; after the testing mechanism 60 finishes testing the chips, the heat preservation and transportation mechanism 10 transports the tested chips to the blanking mechanism 70, and the blanking mechanism 70 places the tested chips on the empty trays for blanking.

[0070] In one embodiment, refer to Figure 1 , the heating mechanism 50 may include a high-temperature plate 51 arranged on the main frame 20, a first driving component 52 arranged on the main frame 20, and a first manipulator 53 connected to the power output end of the first driving component 52. The first driving component 52 drives the first manipulator 53 to reciprocate between the high-temperature plate 51, the tray handling mechanism 40, and the heat preservation and transportation mechanism 10 to pick up the chips on the trays transported by the tray handling mechanism 40 and place them on the high-temperature plate 51 for heating, or pick up the chips that have been heated on the high-temperature plate 51 and place them on the heat preservation and transportation mechanism 10.

[0071] In one embodiment, the blanking mechanism 70 includes a blanking storage table 71 provided on the main frame 20, a second driving assembly 72 provided on the main frame 20, and a second manipulator 73 connected to the power output end of the second driving assembly 72. An empty tray is placed on the blanking storage table 71. The second driving assembly 72 drives the second manipulator 73 to reciprocate between the blanking storage tray and the heat preservation and transportation mechanism 10, so as to pick up the tested chips transported by the heat preservation and transportation mechanism 10 and place them on the empty tray on the blanking storage table.

[0072] In one embodiment, referring to Figure 1 , the tray handling mechanism 40 includes a third driving assembly 41 and a third manipulator 42. The third driving assembly 41 is provided on the main frame 20, and the power output end of the third driving assembly 41 is connected to the third manipulator 42 to drive the third manipulator 42 to reciprocate between a plurality of transfer channels.

[0073] Referring to Figures 2 - 5 , the heat preservation and transportation mechanism 10 includes a transmission assembly 11 and a first stage assembly 12; the first stage assembly 12 includes a first stage 121, a heating element 122, and a heat dissipation prevention structure. The first stage 121 is connected to the transmission assembly 11, the heating element 122 is provided on the first stage 121, and the heating element 122 is used to heat the first stage 121; the heat dissipation prevention structure is provided on the first stage 121, and the heat dissipation prevention structure is used to reduce or prevent the heat dissipation of the first stage 121.

[0074] In the present invention, the transmission assembly 11 is fixed on the main frame 20, so that the heat preservation and transportation mechanism 10 is arranged on the main frame 20; specifically, the chips heated to a specified temperature are placed on the first stage 121, and then the transmission assembly 11 drives the first stage 121 to move to transport the chips to the testing mechanism 60; during this transportation process, the heating element 122 heats the first stage 121, so that the first stage 121 has a certain temperature, that is, the environment where the chips are located has a certain temperature. Therefore, the first stage 121 can keep the chips warm or even heat them to prevent the chips from losing heat; at the same time, a heat dissipation prevention structure is also provided on the first stage 121. Through the heat dissipation prevention structure, the heat dissipation of the first stage 121 can be reduced or even prevented, ensuring the temperature of the first stage 121 and the heat transferred from the first stage 121 to the chips, and further ensuring the heat preservation effect of the first stage 121 on the chips. By using the heat preservation and transportation mechanism 10 provided by this technical solution, the technical problem that the temperature of the chips will be lost during transportation in the prior art and thus affect the testing effect is effectively solved.

[0075] In one embodiment, referring to Figure 4The first carrier 121 includes a stand body 1211 and a table body 1212 , the stand body 1211 is formed with a mounting groove 12111 , the heating element 122 is arranged in the mounting groove 12111 , and the table body 1212 is connected to the stand body 1211 to cover the mounting groove 12111 .

[0076] Specifically, the chip is placed on the table body 1212, the heating element 122 is assembled into the mounting groove 12111 of the table body 1211, and then the table body 1212 is used to cover the mounting groove 12111, and the heating element 122 is pressed into the mounting groove 12111, so that the heating element 122 is located in a closed space, so that the heat of the heating element 122 is evenly and effectively transferred to the table body 1212, and the table body 1212 then keeps the chip thereon warm and heats it, thereby avoiding heat loss of the heating element 122 and increasing the heating area and uniformity of the heating element 122 relative to the chip.

[0077] In some specific embodiments, the heating element 122 is in the shape of a flat plate, so as to uniformly heat the mesa 1212 , thereby enabling the mesa 1212 to uniformly heat the chip.

[0078] In some specific embodiments, see Figure 4 The heating element 122 is formed with a first positioning hole 1221, and the table body 1212 is formed with a second positioning hole 12121; the bottom protrusion of the installation groove 12111 forms a positioning column 12112, and the positioning column 12112 is sequentially inserted into the first positioning hole 1221 and the second positioning hole 12121. Through the cooperation of the positioning column 12112 and the first positioning hole 1221, the heating element 122 is quickly and accurately assembled relative to the table body 1211, and through the cooperation of the positioning column 12112 and the second hole, the table body 1212 is quickly and accurately installed relative to the table body 1211.

[0079] In one embodiment, see Figure 3 The heat preservation transport mechanism 10 may further include a material shuttle 16. The material shuttle 16 is disposed on the first carrier 121, and the material shuttle 16 is installed relative to the first carrier 121 through a positioning column 12112, and the chip is positioned and placed through the material shuttle 16.

[0080] In one embodiment, see Figure 4 The anti-heat dissipation structure includes a heat insulation plate 1231, which is arranged on a side of the stand body 1211 away from the table body 1212, and the heat insulation plate 1231 and the stand body 1211 together form a heat insulation cavity 123a.

[0081] In this embodiment, the heat insulation cavity 123a formed by the heat insulation plate 1231 and the gantry body 1211 is located on the side of the gantry body 1211 away from the table body 1212. Therefore, the heat insulation cavity 123a disconnects the path for the heat of the first stage 121 to dissipate to the side away from the table body 1212. On the one hand, it reduces the heat loss of the first stage 121, and on the other hand, it enables the heat of the first stage 121 to be basically transferred through the table body 1212, thereby improving the heat transfer between the table body 1212 and the chip.

[0082] In some specific embodiments, refer to Figure 4 , the heat insulation plate 1231 is convexly formed with a side blocking portion 1231a, and the side blocking portion 1231a is arranged beside the first stage 121. Through the side blocking portion 1231a, on the one hand, the heat loss of the first stage 121 is further reduced, and on the other hand, it prevents the first stage 121 from scalding the staff.

[0083] It should be noted that the heat insulation plate 1231 is made of heat insulation material, so that the heat insulation plate 1231 has a heat insulation function.

[0084] In some specific embodiments, refer to Figure 4 , the gantry body 1211 is formed with a connecting portion 12113, and the connecting portion 12113 is connected to the transmission assembly 11; there are two heat insulation plates 1231, and the two heat insulation plates 1231 are respectively arranged on both sides of the connecting portion 12113;

[0085] Therefore, the transmission assembly 11 is connected to the middle of the gantry body 1211, so as to ensure the balanced and stable connection between the gantry body 1211 and the transmission assembly 11; then the two heat insulation plates 1231 are respectively arranged on both sides of the connecting plate, further improving the balance of the heat insulation plates 1231.

[0086] In one embodiment, in combination with Figure 3 , the heat dissipation prevention structure may further include a heat insulation column 1232, and the heat insulation column 1232 is arranged between the connecting portion 12113 and the transmission assembly 11.

[0087] A heat insulation column 1232 is arranged between the connecting portion 12113 and the transmission assembly 11, which avoids the temperature of the first stage 121 being transferred to the transmission assembly 11, resulting in the temperature loss of the first stage 121; and it also avoids the transmission assembly 11 from being heated, affecting the service life of the transmission assembly 11.

[0088] It should be noted that the connection between the connecting portion 12113 and the transmission assembly 11 can be realized through the heat insulation column 1232.

[0089] In one embodiment, refer to Figure 4, the heat dissipation prevention structure further includes a wind deflector 1233, and the wind deflector 1233 is provided at both ends of the first carrier 121 opposite to each other along the transmission direction of the transmission assembly 11.

[0090] The wind deflector 1233 is provided at both ends of the first carrier 121 opposite to each other along the transmission direction of the transmission assembly 11. When the transmission assembly 11 drives the first carrier assembly 12 to move, the wind deflector 1233 can play a role in blocking the wind, blocking the airflow for the table body 1212 and the chip, and preventing the temperature of the table body 1212 and the chip from being taken away by the wind.

[0091] In one embodiment, referring to Figure 2 and Figure 3 , the heat preservation and transportation mechanism 10 may further include a guiding assembly 13. The guiding assembly 13 includes a guide rail 131, a slider 132 and a connecting beam 133. The guide rail 131 is slidably connected to the slider 132. The connecting beam 133 is provided on the slider 132, and the connecting beam 133 is connected to the transmission assembly 11; the first carrier assembly 12 is provided on the connecting beam 133.

[0092] Specifically, the guide rail 131 is fixed to the main frame 20, and the connecting beam 133 is slidably connected to the guide rail 131 through the slider 132. Therefore, when the transmission assembly 11 drives the connecting beam 133 to drive the first carrier 121 to move, the relative restriction between the slider 132 and the guide rail 131 can guide the first carrier 121 fixed on the connecting beam 133, determine the moving path of the first carrier 121, and prevent the first carrier 121 from yawing. It should be noted that at this time, the heat insulation column 1232 is provided between the connecting portion 12113 and the connecting beam 133. When the heat preservation and transportation mechanism 10 further includes the guiding assembly 13, the heat insulation column 1232 can prevent the guiding assembly 13 from being heated and ensure the service life of the guiding assembly 13.

[0093] Referring to Figure 3 , the connecting beam 133 is formed with a wire routing groove 1331, and the connecting wires of the heating element 122 are arranged in the wire routing groove 1331. By providing the wire routing groove 1331 in the connecting beam 133 to define the routing of the connecting wires, not only the routing of the connecting wires is made beautiful, but also the interference of the connecting wires to the movement of the first carrier 121 is avoided.

[0094] In one embodiment, referring to Figure 2 and Figure 3, the transmission assembly 11 includes a driving motor 111, a first transmission wheel 112, a second transmission wheel 113, a transmission belt 114 and a transmission connecting rod 115; the power output end of the driving motor 111 is connected to the first transmission wheel 112, the second transmission wheel 113 is disposed opposite to the first transmission wheel 112, one end of the transmission belt 114 is sleeved on the first transmission wheel 112, and the other end of the transmission belt 114 is sleeved on the second transmission wheel 113; one end of the transmission connecting rod 115 is connected to the transmission belt 114, and the other end of the transmission connecting rod 115 is connected to the connecting beam 133.

[0095] The connection between the transmission belt 114 and the connecting beam 133 is realized through the transmission connecting rod 115, that is, the driving motor 111 drives the first transmission wheel 112 to rotate, so as to drive the transmission belt 114 sleeved on the first transmission wheel 112 and the second transmission wheel 113 to transmit power. The transmission rod connected to the transmission belt 114 can drive the connecting beam 133 to move, thereby realizing the driving of the first carrier assembly 12 by the transmission assembly 11.

[0096] See Figure 3 and Figure 5 , the transmission connecting rod 115 is formed with a wire routing channel 1151 communicating with the wire routing groove 1331 and an outlet 1152 communicating with the wire routing channel 1151; the connecting wires of the heating element 122 sequentially pass through the wire routing groove 1331 and the wire routing channel 1151 and are led out from the outlet 1152. By providing the wire routing channel 1151 and the outlet 1152 in the transmission connecting rod 115, on the one hand, the connecting wires are hidden through the wire routing groove 1331 and the wire routing channel 1151, avoiding the exposure of the connecting wires and improving the aesthetics of the wire routing of the connecting wires; on the other hand, the connecting wires are led out from the outlet 1152 of the transmission connecting rod 115, so that the leading end of the connecting wires is set away from the first guide rail 131, that is, the connecting wires are led out outside the moving range of the first carrier 121, further reducing the interference of the connecting wires.

[0097] In an embodiment, see Figure 2 and Figure 3, the heat preservation carrier mechanism 10 further includes a second carrier component 14, and the second carrier component 14 is arranged on the connecting beam 133. Therefore, the transmission component 11 can drive the first carrier component 12 and the second carrier component 14 to move simultaneously. When the transmission component 11 works, the first carrier component 12 moves to the heating structure to carry the heated chips; the transmission component 11 continues to drive, so that the first carrier component 12 moves to the testing mechanism 60, and the testing mechanism 60 takes away the chips on the first carrier component 12 and tests the chips; the transmission component 11 continues to drive, so that the first carrier component 12 moves away from the testing mechanism 60, and the second carrier component 14 moves to the testing mechanism 60. The testing mechanism 60 places the tested chips on the second carrier component 14, and then the transmission component 11 drives the second carrier component 14 to move to place the tested chips on the blanking mechanism 70. In this embodiment, by arranging the second carrier component 14 on the connecting beam 133 to transport the tested chips away from the testing mechanism 60, that is, it is not necessary for the first carrier component 12 to transport the tested chips away, avoiding the low cooling efficiency of the tested chips due to the temperature of the first carrier component 12.

[0098] In some specific embodiments, a shuttle 16 is also arranged on the second carrier component 14 to position and place the tested chips.

[0099] In one embodiment, see Figure 2 , the second carrier component 14 is arranged at an interval from the first carrier component 12, so as to avoid the temperature of the first carrier component 12 being transferred to the second carrier component 14, reducing the heat loss of the first carrier component 12, and at the same time avoiding the second carrier component 14 from heating up, which is not conducive to transporting the tested chips away; the heat preservation carrier mechanism 10 further includes a cover plate 15, and the cover plate 15 is clamped between the first carrier component 12 and the second carrier component 14. The cover plate 15 and the second carrier component 14 jointly cover the wire groove 1331, thus avoiding part of the wire groove 1331 being exposed due to the interval between the second carrier component 14 and the first carrier 121.

[0100] In one embodiment, see Figure 2 and Figure 3 , the heat preservation carrier mechanism 10 further includes a sheet metal frame 17 arranged on the main frame 20. After the connecting wires are led out from the lead-out port 1152, they are fixed on the sheet metal frame 17 so as to connect the connecting wires to the outside.

[0101] In one embodiment, see Figure 6, the first stage assembly 12 further includes a temperature sensor 18 disposed on the heating element 122, and the temperature sensor 18 is used to detect the temperature of the heating element 122. By detecting the temperature of the heating element 122 in real time through the temperature sensor 18, the heating voltage of the heating element 122 is controlled to avoid the temperature of the heating element 122 being too high or too low.

[0102] In one embodiment, referring to Figure 6 , the first stage assembly 12 further includes a temperature switch 19 electrically connected to the heating element 122. It can be understood that the temperature switch 19 is connected in series in the heating circuit of the heating element 122. It is used to disconnect the heating circuit of the heating element 122 when the heating element 122 overheats, so as to protect the first stage assembly 12.

[0103] In order to control the heating temperature of the heating element 122, referring to Figure 6 , the detection device 100 may further include a control module 80 and a temperature controller 90. The control module 80 is electrically connected to the temperature controller 90, and the temperature controller 90 is electrically connected to the heating element 122. The temperature controller 90 adjusts the input current or input voltage of the heating element 122 to regulate the heating power of the heating element 122; the control module 80 is electrically connected to the temperature controller 90 and the temperature sensor 18, and issues an instruction to the temperature controller 90 by receiving the detection value of the temperature sensor 18, so as to control the heating temperature of the heating element 122.

[0104] The present invention also provides a heat preservation method for the heat preservation transport mechanism 10, referring to Figure 7 , including:

[0105] S1. Heat the heating element 122 in a first heating mode;

[0106] S2. Determine whether the real-time detected value of the temperature of the heating element 122 reaches a preset standard temperature value. If so, heat the heating element 122 in a second heating mode, where the heating voltage of the first heating mode is greater than the voltage of the second heating mode.

[0107] It can be understood that the first heating mode is a high-speed heating mode, and the second heating mode is a low-speed heating mode; after the chip is placed on the first carrier 121, the first heating mode is first adopted to heat the heating element 122 at a high speed, so that the temperature of the heating element 122 can quickly reach the preset standard temperature value, that is, the temperature of the first carrier 121 can quickly reach the standard temperature value, quickly realizing the heat preservation and heating of the chip, and preventing the temperature of the chip just placed on the first carrier 121 from quickly losing; the real-time detection value of the temperature of the heating element 122 is detected by the temperature sensor 18 arranged on the heating element 122, and then it is judged whether the real-time detection value of the temperature of the heating element 122 is greater than or equal to the standard temperature value, that is, it is judged whether the temperature of the heating element 122 reaches the standard temperature value. When the temperature of the heating element 122 reaches the standard temperature value, the heating mode is switched, and the second heating mode is adopted to heat the heating element 122, that is, the heating element 122 is heated at a low speed, so that the temperature of the first carrier 121 can be maintained around the standard temperature value, realizing both the heat preservation effect of the first carrier 121 on the chip and avoiding waste of electric energy.

[0108] In some specific embodiments, the heating voltage of the second heating mode is 20V; the heating voltage of the first heating mode is 220V, and the heating voltages of the first heating mode and the second heating mode can be adjusted according to actual heating requirements.

[0109] In one embodiment, refer to Figure 8 , after adopting the second heating mode to heat the heating element 122, the heat preservation method further includes:

[0110] S3. Judge whether the real-time detection value of the temperature of the heating element 122 rises to be greater than the standard temperature upper limit value, or whether the real-time detection value of the temperature of the heating element 122 drops to be less than the standard temperature lower limit value; wherein, the standard temperature upper limit value is the sum of the standard temperature value and the temperature floating value, and the standard temperature lower limit value is the difference between the standard temperature value and the temperature floating value;

[0111] S4. If the real-time detection value of the temperature of the heating element 122 rises to be greater than the standard temperature upper limit value, stop heating the heating element 122; if the real-time detection value of the temperature of the heating element 122 drops to be less than the standard temperature lower limit value, then adopt the first heating mode to heat the heating element 122;

[0112] S5. Judge whether the real-time detection value of the temperature of the heating element 122 reaches the standard temperature value. If so, execute the step of adopting the second heating mode to heat the heating element 122.

[0113] For example, if the standard temperature value of the heating element 122 is set to 130 °C and the temperature fluctuation value is 2 °C, then the standard temperature upper limit value is 132 °C and the standard temperature lower limit value is 128 °C; after the heating element 122 is heated at a low speed in the second heating mode, the temperature sensor 18 detects the temperature of the heating element 122 in real time. When the real-time detected value of the temperature of the heating element 122 rises to be greater than the standard temperature upper limit value, it indicates that the temperature of the heating element 122 exceeds 132 °C and the temperature of the heating element 122 is too high. At this time, it is necessary to stop heating the heating element 122 so that the real-time detected value of the temperature of the heating element 122 can drop to the standard temperature value; when the real-time detected value of the temperature of the heating element 122 drops to be less than the standard temperature lower limit value, the temperature of the heating element 122 is lower than 128 °C, indicating that the temperature of the heating element 122 has dissipated too much. At this time, it is necessary to increase the heating voltage of the heating element 122, that is, heat the heating element 122 in the first heating mode so that the real-time detected value of the temperature of the heating element 122 can rise to the standard temperature value; when the real-time detected value of the temperature of the heating element 122 is between 128 °C and 130 °C, it indicates that the heating and cooling of the heating element 122 are within the normal range. At this time, it is only necessary to maintain heating the heating element 122 in the second heating mode; according to the technical solution in this embodiment, the first stage 121 can effectively maintain the required temperature.

[0114] In one embodiment, before determining whether the real-time detected value of the temperature of the heating element 122 reaches the standard temperature value, and if so, heating the heating element 122 in the second heating mode, it further includes

[0115] Determine whether the real-time detected value of the temperature of the heating element 122 rises to be greater than the standard temperature upper limit value within a preset standard time. If so, reduce the heating voltage of the second heating mode to obtain a reduced second heating mode;

[0116] Update the second heating mode with the reduced second heating mode.

[0117] For example, set the preset standard time to 300s. When the real-time detected temperature of the heating element 122 rises above the standard temperature upper limit value within 300s, it indicates that the temperature of the heating element 122 rises too fast, which indirectly means that the heating voltage of the second heating mode is too high. Therefore, it is necessary to reduce the heating voltage of the second heating mode. For example, reduce the heating voltage of the second heating mode by 1V, and the heating voltage of the second heating mode changes to 19V. That is, the heating voltage of the second heating mode after the reduction is 19V. After stopping heating and making the real-time detected temperature of the heating element 122 reach the standard temperature value, update the second heating mode with the reduced second heating mode, that is, heat the heating element 122 with the second heating mode with a heating voltage of 19V; if not, there is no need to change the heating voltage of the second heating mode. That is, after stopping heating and making the real-time detected temperature of the heating element 122 reach the standard temperature value, heat the heating element 122 with the second heating mode with a heating voltage of 20V.

[0118] In one embodiment, before determining whether the real-time detected temperature of the heating element 122 reaches the standard temperature value and, if so, heating the heating element 122 using the second heating mode, it further includes:

[0119] Determine whether the real-time detected temperature of the heating element 122 drops below the standard temperature lower limit value within the preset standard time. If so, increase the heating voltage of the second heating mode to obtain an increased second heating mode;

[0120] Update the second heating mode using the increased second heating mode.

[0121] When the real-time detected temperature of the heating element 122 drops below the standard temperature upper limit value within 300s, it indicates that the temperature of the heating element 122 drops too fast, which indirectly means that the heating voltage of the second heating mode is too low. Therefore, it is necessary to increase the heating voltage of the second heating mode. For example, increase the heating voltage of the second heating mode by 1V, and the heating voltage of the second heating mode changes to 21V. That is, the heating voltage of the second heating mode after the increase is 21V. After using the first heating mode to make the real-time detected temperature of the heating element 122 reach the standard temperature value, update the second heating mode with the increased second heating mode, that is, heat the heating element 122 with the second heating mode with a heating voltage of 21V; if not, there is no need to change the heating voltage of the second heating mode. That is, after using the second heating mode to make the real-time detected temperature of the heating element 122 reach the standard temperature value, heat the heating element 122 with the second heating mode with a heating voltage of 21V.

[0122] See Figure 9 Let the real-time temperature detection value of the heating element 122 be T, the standard temperature value be T1, the temperature floating value be T2, the preset standard time be t1, the time taken for the real-time temperature detection value of the heating element 122 to rise above the standard temperature upper limit value and the time taken for the real-time temperature detection value to drop below the standard temperature lower limit value both be t, the heating voltage in the second heating mode be U, and the decrease amplitude and increase amplitude of the second heating voltage be U1; specifically, first adopt the first heating mode to rapidly heat the heating element 122. When T≥T1, it is used to determine whether the real-time temperature detection value of the heating element 122 reaches the standard temperature value. If not, continue to heat the heating element 122 using the first heating mode until the real-time temperature detection value of the heating element 122 reaches the standard temperature value. If so, adopt the second heating mode to slowly heat the heating element 122; when T>T1+T2, it is used to determine whether the real-time temperature detection value of the heating element 122 rises above the standard temperature upper limit value. When t≥t1, it is used to determine whether the real-time temperature detection value of the heating element 122 rises above the standard temperature upper limit value within the preset standard time. First, stop heating the heating element 122. When T≤T1, it is used to determine whether the real-time temperature detection of the heating element 122 reaches the standard temperature value; when the real-time temperature detection value of the heating element 122 rises above the standard temperature upper limit value within the preset standard time, the heating voltage U of the second heating mode needs to be subtracted by the decrease amplitude U1 to obtain the decreased second heating mode. U = U - U1 means updating the second heating mode with the decreased second heating mode; when the real-time temperature detection value of the heating element 122 does not rise above the standard temperature upper limit value within the preset standard time, the heating voltage of the second heating mode does not need to be changed, that is, U = U; thus, the step of heating the heating element 122 using the second heating mode can be executed. When T<T1 - T2, it is used to determine whether the real-time temperature detection value of the heating element 122 drops below the standard temperature upper limit value. When t≥t1, it is used to determine whether the real-time temperature detection value of the heating element 122 drops below the standard temperature upper limit value within the preset standard time. First, adopt the first heating mode to heat the heating element 122 to determine whether the real-time temperature detection of the heating element 122 reaches the standard temperature value; when the real-time temperature detection value of the heating element 122 drops below the standard temperature upper limit value within the preset standard time, the heating voltage U of the second heating mode needs to be added with the increase amplitude U1 to obtain the increased second heating mode. U = U + U1 means updating the second heating mode with the increased second heating mode; when the real-time temperature detection value of the heating element 122 does not drop below the standard temperature upper limit value within the preset standard time, the heating voltage of the second heating mode does not need to be changed, that is, U = U; thus, the step of heating the heating element 122 using the second heating mode can be executed.

[0123] In one embodiment, the heat preservation method further includes:

[0124] Receive the actual temperature value detected by an external detection device for the heating element 122;

[0125] Compensate the real-time temperature detection value of the heating element 122 based on the actual temperature value.

[0126] It should be noted that the real-time temperature detection value of the heating element 122 is detected by the temperature sensor 18 provided on the heating element 122, and the actual temperature value of the heating element 122 is detected by an external detection device. The temperature detection accuracy of the external detection device is higher than that of the temperature sensor 18, but the external detection device is restricted by its volume and cannot be installed on the first material ship assembly, that is, the external detection device cannot perform real-time detection of the temperature of the heating element 122; the temperature sensor 18 on the heating element 122 can perform real-time detection of the temperature of the heating element 122, but there may be errors in the real-time temperature detection value. Therefore, in this embodiment, by receiving the actual temperature value detected by the external detection device for the heating element 122 to compensate the real-time temperature detection value of the heating element 122, the real-time temperature detection value of the heating element 122 can accurately reflect the temperature of the heating element 122.

[0127] It should be noted that the above compensation step can be operated during the entire heat preservation process. Preferably, the above compensation method is before the step of "judging whether the real-time temperature detection value of the heating element 122 rises to be greater than the standard temperature upper limit value, or whether the real-time temperature detection value of the heating element 122 drops to be less than the standard temperature lower limit value". By compensating the real-time temperature detection value, the accuracy of judging whether the temperature rises to be greater than the standard temperature upper limit value or drops to be less than the standard temperature lower limit value is improved.

[0128] In one embodiment, before compensating the real-time temperature detection value based on the actual temperature value, it further includes:

[0129] Judge whether the absolute value of the difference between the real-time temperature detection value of the heating element 122 and the actual temperature value is greater than the standard difference; if so, execute the step of compensating the real-time temperature detection value of the first stage 121 based on the actual temperature value.

[0130] When the absolute value of the difference between the real-time temperature detection value and the actual temperature value is greater than the standard difference, it indicates that the accuracy of the real-time temperature detection value is poor. At this time, the real-time temperature detection value needs to be compensated; when the absolute value of the difference between the real-time temperature detection values is not greater than the standard difference, it indicates that the accuracy of the real-time temperature detection value is good and no compensation is required.

[0131] In one embodiment, compensating the real-time temperature detection value of the heating element 122 based on the actual temperature value includes:

[0132] Subtract the actual temperature value from the real-time detected temperature value of the heating element 122 to obtain a temperature compensation value;

[0133] Subtract the temperature compensation value from the real-time detected temperature value of the heating element 122 to obtain the real-time detected temperature value after variation;

[0134] Update the real-time detected temperature value of the heating element 122 with the real-time detected temperature value after variation;

[0135] Adjust the heating voltage of the heating element 122 so that the change amplitude of the real-time detected temperature value of the heating element 122 is equal to the temperature compensation value.

[0136] In this embodiment, the control module 80 first subtracts the actual temperature value from the real-time detected temperature value to obtain a temperature compensation value, then subtracts the temperature compensation value from the real-time detected temperature value to obtain the real-time detected temperature value after variation, and updates the real-time detected temperature value of the heating element 122 with the real-time detected temperature value after variation. That is, the control module 80 displays the real-time detected temperature value of the temperature sensor 18 as the real-time detected temperature value after variation. The control module 80 then controls the temperature controller 90 to adjust the heating voltage of the heating element 122 so that the change amplitude of the real-time detected temperature value of the heating element 122 is equal to the temperature compensation value, thereby enabling the real-time detected temperature value to accurately reflect the temperature of the heating element 122.

[0137] In one embodiment, after compensating the real-time detected temperature value of the first stage 121 based on the actual temperature value, it further includes:

[0138] Receive again the actual temperature value detected by an external detection device for the heating element 122;

[0139] Judge whether the absolute value of the difference between the real-time detected temperature value of the heating element 122 and the again received actual temperature value is greater than the standard deviation value. If so, execute the step of compensating the real-time detected temperature value of the first stage 121 based on the actual temperature value; if not, stop receiving the actual temperature value.

[0140] That is, after compensating the real-time temperature detection value, it is necessary to detect the compensation effect of the real-time temperature detection value to determine whether the compensation is in place. Specifically, it is determined whether the absolute value of the difference between the real-time temperature detection value and the actually received temperature value is greater than the standard difference. If not, it means that the compensation of the real-time temperature detection value is in place and there is no need to perform further compensation, and the reception of the actual temperature value can be stopped. If so, it means that the compensation of the real-time temperature detection value is not in place, and the real-time temperature detection value fails to accurately reflect the temperature of the heating element 122, and it is necessary to execute again the step of compensating the real-time temperature detection value of the first stage 121 based on the actual temperature value.

[0141] See Figure 10, the actual set temperature is T4, the standard deviation is T5, and the compensation temperature is T3. After heating the heating element 122 in the second heating mode, the actual temperature value T4 detected by the external detection device for the heating element 122 is received. When the actual temperature value T4 is not equal to the real-time detected temperature value T, there are two cases. One is that the actual temperature value T4 is greater than the real-time detected temperature value T, and the other is that the real-time detected temperature value T is greater than the actual temperature value T4. The following is a specific description of the two compensation cases. T < T4 is used to determine whether the real-time detected temperature value T of the heating element 122 is less than the actual temperature value T4. If so, it means that the actual temperature value T4 is greater than the real-time detected temperature value T. Then, it is further determined whether the difference obtained by subtracting the real-time detected temperature value T from the actual temperature value T4 is greater than the standard deviation T5. If not, it means that the accuracy of the real-time detected temperature value T is good and no compensation is required. If so, it means that the accuracy of the real-time detected temperature value T is poor and compensation is required. T3 = T - T4 is used to calculate the compensation temperature. For example, if the real-time detected temperature value is 120°C and the actual temperature value is 126°C, T3 = 120 - 126 = -6; T = T - T3 is used to obtain the real-time detected temperature value after variation. For example, 120 - (-6) = 126, that is, the real-time detected temperature value after variation is 126°C; then after stopping heating, the change amplitude of the real-time detected temperature value of the heating element 122 is made equal to the temperature compensation value, that is, 126°C is decreased to 120°C. If the real-time detected temperature value T is greater than the actual temperature value T4, it is further determined whether the difference obtained by subtracting the actual temperature value T4 from the real-time detected temperature value T is greater than the standard deviation T5. If not, it means that the accuracy of the real-time detected temperature value T is good and no compensation is required. If so, it means that the accuracy of the real-time detected temperature value T is poor and compensation is required. T3 = T - T4 is used to calculate the compensation temperature. For example, if the real-time detected temperature value is 130°C and the actual temperature value is 125°C, T3 = 130 - 125 = 5; T = T - T3 is used to obtain the real-time detected temperature value after variation. For example, 130 - 5 = 125, that is, the real-time detected temperature value after variation is 125°C; then after stopping heating, the change amplitude of the real-time detected temperature value of the heating element 122 is made equal to the temperature compensation value, that is, 125°C is increased to 130°C.

[0142] In one embodiment, the heat preservation method further includes:

[0143] Determine whether the temperature of the heating element 122 is greater than a preset temperature safety value. If so, stop heating the heating element 122.

[0144] It can be understood that when the temperature sensor 18 detects that the temperature of the heating element 122 is greater than the preset temperature safety value, the control module 80 controls the thermostat 90 to stop the heating of the heating element 122; or, when the temperature sensor 18 fails, the temperature of the heating element 122 continues to rise. When the temperature of the heating element 122 exceeds the temperature safety value set in the temperature switch 19, the temperature switch 19 disconnects to stop the heating of the heating element 122, and the control module 80 issues an alarm signal to indicate that the temperature sensing function of the temperature sensor 18 is abnormal and requires manual processing.

[0145] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict, make combinations, additions, deletions, or other adjustments to the features in the embodiments of the present invention according to the situation without creative efforts, so as to obtain different technical solutions that essentially do not deviate from the concept of the present invention. These technical solutions also belong to the scope of protection of the present invention.

Claims

1. A heat preservation method for a heat preservation carrying mechanism, characterized in that, The heat preservation carrier mechanism includes a first carrier component, the first carrier component includes a first carrier, a heating element and a temperature sensor arranged on the heating element, and the heating element is used to heat the first carrier; The heat preservation method includes: Heating the heating element in a first heating mode; Judging whether the real-time detected value of the temperature of the heating element reaches a preset standard temperature value. If so, heating the heating element in a second heating mode, wherein the heating voltage of the first heating mode is greater than the voltage of the second heating mode; Judging whether the real-time detected value of the temperature of the heating element rises to be greater than the standard temperature upper limit value, or whether the real-time detected value of the temperature of the heating element drops to be less than the standard temperature lower limit value; wherein, the standard temperature upper limit value is the sum of the standard temperature value and the temperature floating value, and the standard temperature lower limit value is the difference between the standard temperature value and the temperature floating value; If the real-time detected value of the temperature of the heating element rises to be greater than the standard temperature upper limit value, stop heating the heating element; if the real-time detected value of the temperature of the heating element drops to be less than the standard temperature lower limit value, then heat the heating element in the first heating mode; Judging whether the real-time detected value of the temperature of the heating element reaches the standard temperature value. If so, execute the step of heating the heating element in the second heating mode.

2. The heat preservation method according to claim 1, wherein Before judging whether the real-time detected value of the temperature of the heating element reaches the standard temperature value and if so, heating the heating element in the second heating mode, it further includes: Judging whether the real-time detected value of the temperature of the heating element rises to be greater than the standard temperature upper limit value within a preset standard time. If so, reduce the heating voltage of the second heating mode to obtain a reduced second heating mode; Update the second heating mode with the reduced second heating mode.

3. The heat preservation method according to claim 1, characterized in that, Before judging whether the real-time detected value of the temperature of the heating element reaches the standard temperature value and if so, heating the heating element in the second heating mode, it further includes: Judging whether the real-time detected value of the temperature of the heating element drops to be less than the standard temperature lower limit value within a preset standard time. If so, increase the heating voltage of the second heating mode to obtain an increased second heating mode; Update to obtain the second heating mode with the increased second heating mode.

4. The heat preservation method according to claim 1, wherein The heat preservation method further includes Receiving the actual temperature value detected by an external detection device for the heating element; Compensating the real-time detected value of the temperature of the heating element based on the actual temperature value.

5. The heat preservation method according to claim 4, wherein Before compensating the real-time detected value of the temperature of the heating element based on the actual temperature value, it further includes: Judging whether the absolute value of the difference between the real-time detected value of the temperature of the heating element and the actual temperature value is greater than the standard difference value; if so, execute the step of compensating the real-time detected value of the temperature of the heating element based on the actual temperature value.

6. The heat preservation method according to claim 5, wherein Compensating the real-time detected value of the temperature of the heating element based on the actual temperature value includes: Subtracting the actual temperature value from the real-time temperature detection value of the heating element to obtain a temperature compensation value; The temperature compensation value is subtracted from the real-time temperature detection value of the heating element to obtain a real-time temperature detection value after the value is changed; Using the changed real-time temperature detection value to update the real-time temperature detection value of the heating element; The heating voltage of the heating element is adjusted so that the variation amplitude of the real-time temperature detection value of the heating element is equal to the temperature compensation value.

7. The heat preservation method according to claim 4, wherein After compensating the real-time temperature detection value of the first stage based on the actual temperature value, the method further includes: receiving an actual temperature value of the heating element detected by an external detection device again; Determine whether the absolute value of the difference between the real-time temperature detection value of the heating element and the actual temperature value received again is greater than the standard deviation value. If so, execute the step of compensating the real-time temperature detection value of the first carrier based on the actual temperature value; if not, stop receiving the actual temperature value.

8. The heat preservation method according to claim 1, wherein The heat preservation method also includes: Determine whether the temperature of the heating element is greater than a preset temperature safety value, and if so, stop heating the heating element.

9. A heat-insulating carrying mechanism, characterized in that, An insulation method for a heat-insulating transport mechanism as described in any one of claims 1 to 8 is adopted, wherein the heat-insulating transport mechanism also includes a transmission assembly, the first carrier assembly also includes an anti-heat dissipation structure, the first carrier is connected to the transmission assembly, and the heating element is arranged on the first carrier; the anti-heat dissipation structure is arranged on the first carrier, and the anti-heat dissipation structure is used to reduce or prevent heat loss from the first carrier.

10. The heat-insulating carrier mechanism according to claim 9, characterized in that, The first carrier includes a frame body and a table top body, the frame body is formed with a mounting groove, the heating element is arranged in the mounting groove, and the table top body is connected to the frame body to cover the mounting groove.

11. The heat-insulating carrying mechanism according to claim 10, wherein The heating element is formed with a first positioning hole, and the table body is formed with a second positioning hole; the groove bottom protrusion of the installation groove forms a positioning column, and the positioning column is sequentially penetrated through the first positioning hole and the second positioning hole.

12. The heat-insulating carrying mechanism according to claim 10, characterized in that, The anti-heat dissipation structure comprises a heat insulation board, which is arranged on a side of the platform body away from the table body, and the heat insulation board and the platform body together form a heat insulation cavity.

13. The heat-insulating carrying mechanism according to claim 12, characterized in that, The heat insulation plate protrusion is formed with a side stopper, and the side stopper is arranged beside the first carrier.

14. The heat-insulating carrying mechanism according to claim 12, characterized in that, The rack body is formed with a connecting portion, and the connecting portion is connected to the transmission assembly; there are two heat insulation plates, and the two heat insulation plates are arranged on both sides of the connecting portion; The anti-heat dissipation structure further includes a heat-insulating column, which is arranged between the connecting portion and the transmission assembly.

15. The heat-insulating carrier mechanism according to claim 12, wherein The anti-heat dissipation structure further includes a windshield, and the windshield is provided at both ends of the first carrier that are relatively arranged along the transmission direction of the transmission assembly.

16. The heat-insulating carrying mechanism according to claim 9, characterized in that The heat preservation transport mechanism further includes a guide assembly, the guide assembly includes a guide rail, a slider and a connecting beam, the guide rail and the slider are slidably connected, the connecting beam is arranged on the slider, the connecting beam is connected to the transmission assembly, and the connecting beam is formed with a wiring groove; The first carrier assembly is arranged on the connecting beam, and the connecting wires of the heating element are arranged in the wiring groove.

17. The heat-insulating carrier mechanism according to claim 16, characterized in that, The transmission assembly includes a driving motor, a first transmission wheel, a second transmission wheel, a transmission belt, and a transmission connecting rod; The power output end of the driving motor is connected to the first transmission wheel. The second transmission wheel is disposed opposite to the first transmission wheel. One end of the transmission belt is sleeved on the first transmission wheel, and the other end of the transmission belt is sleeved on the second transmission wheel. One end of the transmission connecting rod is connected to the transmission belt, and the other end of the transmission connecting rod is connected to the connecting beam. The transmission connecting rod is formed with a wire routing channel communicating with the wire routing groove and an outlet communicating with the wire routing channel. The connecting wire of the heating element sequentially passes through the wire routing groove, the wire routing channel, and is led out from the outlet.

18. The heat-insulating carrying mechanism according to claim 16, characterized in that, The heat preservation and transportation mechanism further includes a second stage assembly and a cover plate. The second stage assembly is disposed on the connecting beam, and the second stage assembly is spaced apart from the first stage assembly. The cover plate is clamped between the first stage assembly and the second stage assembly, and the cover plate and the second stage assembly jointly cover the wire routing groove.

19. A detection device, characterized in that, The detection device includes the heat preservation and transportation mechanism according to any one of claims 9-18.

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