A drive mechanism based on a traveling wave motor

Abstract

The application discloses a kind of driving mechanism based on travelling wave motor, it is related to motor drive technical field, including: bearing structure, MEMS driver and rotor structure;Rotor structure is arranged on MEMS driver, and rotor structure is driven by MEMS driver to rotate;Bearing structure is used to carry the body to be rotated, and bearing structure is set on rotor structure and rotates along with rotor structure;The scheme is based on the cooperation of MEMS's travelling wave micro driver and rotor mechanism and bearing structure, utilizes the cooperation of MEMS travelling wave type micro motor structure and rotor mechanism to realize in situ rotary drive of chip end, utilizes the processing capacity of micron or nanometer level of the characteristic size of MEMS process technology, and simultaneously, MEMS structure has the characteristics of batch preparation, no assembly or less assembly, so that the number of structural components of the driving mechanism is less, in situ rotary drive of chip end is facilitated.

Description

Technical Field

[0001] This invention relates to the field of motor drive technology, and more specifically to a drive mechanism based on a traveling wave motor. Background Technology

[0002] A piezoelectric motor is a type of motor that uses piezoelectric ceramics as the excitation element. It generates high-frequency mechanical vibrations through the inverse piezoelectric effect of the ceramics. An electrical signal is applied to the stator, which uses piezoelectric ceramics as the sensing material, causing the stator to vibrate along a specific trajectory, thus driving the rotor. Due to its unique advantages such as flexible design, fast response speed, high positioning accuracy, and absence of electromagnetic interference, it is used in fields including biomedicine, precision instruments, aerospace, and consumer products.

[0003] An ultrasonic motor generally includes: a stator, which acts as a vibrating element to generate vibration; and a rotor, which comes into contact with the stator. The vibration of the vibrating element generates friction on the contact surface, thereby driving the rotor to rotate.

[0004] Motors manufactured using traditional machining processes are large and cannot be used in high-density integrated environments. Existing motor drive mechanisms are also relatively large in overall size, generally used to drive packaged chips or external motors to drive loads in confined spaces via transmission structures. In summary, the main disadvantages of existing drive mechanisms are:

[0005] 1. It cannot be applied in high-density integrated environments;

[0006] 2. It is impossible to drive bare chips in situ within a compact size constraint space. Summary of the Invention

[0007] The technical problem to be solved by this invention is that motors manufactured by traditional machining processes are large in size and cannot be applied to high-density integrated environments, and cannot achieve in-situ driving of bare chips in a compact size constraint space. The purpose of this invention is to provide a driving mechanism based on a traveling wave motor, which uses the cooperation of a MEMS traveling wave micro-actuator, a rotor mechanism and a load-bearing structure to achieve in-situ rotational driving at the chip end by utilizing the cooperation of the MEMS traveling wave micro-motor structure and the rotor mechanism, thus solving the above-mentioned technical problems.

[0008] This invention is achieved through the following technical solution:

[0009] This invention provides a drive mechanism based on a traveling wave motor, comprising: a load-bearing structure, a MEMS driver, and a rotor structure;

[0010] The rotor structure is mounted on a MEMS driver and is driven to rotate by the MEMS driver.

[0011] The bearing structure is used to support the object to be rotated, and the bearing structure is set on the rotor structure and rotates together with the rotor structure.

[0012] The working principle of this solution: Motors manufactured using traditional machining processes are large in size, making them unsuitable for high-density integration environments and unable to achieve in-situ driving of bare chips within a compact space. The traveling wave motor-based drive mechanism provided by this invention, utilizing the cooperation of a MEMS traveling wave micro-actuator, rotor mechanism, and support structure, achieves in-situ rotational drive at the chip level, solving the aforementioned technical problems. This solution leverages the micrometer or nanometer-level fabrication capabilities of MEMS technology, while also utilizing the characteristics of mass production and minimal or no assembly in MEMS structures. This results in a smaller number of structural components constituting the drive mechanism, facilitating in-situ rotational drive at the chip level.

[0013] A further optimized solution includes: a shell structure and a rotating shaft; the MEMS driver is mounted on the shell structure, and the rotating shaft passes sequentially through the shell structure, the MEMS driver, and the rotor structure, with the rotor structure rotating around the rotating shaft. The shell structure simultaneously provides both precision mechanical support and electrical connection.

[0014] The tube shell structure completes the tube shell signal traces through metal substrate technology, and then is processed into a structure that matches the traveling wave driver by a precision CNC machine tool; the flatness and dimensional accuracy of the structure surface that matches the traveling wave driver are better than 10 micrometers.

[0015] A further optimized solution is that both the rotor structure and the shaft are cylindrical structures; the load-bearing structure is a cylindrical structure, the area of ​​the contact surface between the load-bearing structure and the rotor structure is smaller than the area of ​​the contact surface between the rotor structure and the rotor structure, and the highest point of the load-bearing structure is higher than the highest point of the shaft.

[0016] A further optimized solution is that the load-bearing structure and the rotor structure are integrated into one unit.

[0017] A further optimized solution is that the bearing structure is a semi-cylindrical structure with the same radius as the rotor structure, and the angle between the top surface of the bearing structure and the horizontal plane is 0° to 45°.

[0018] A further optimization scheme is that the shell structure is a cuboid shell, and signal line protrusions are provided on the shell structure. Each MEMS driver has at least a plurality of signal line protrusions, and each signal line protrusion is provided with a plurality of signal interfaces for connecting to the MEMS driver.

[0019] The rectangular housing not only provides stable support for the rotor structure and MEMS driver, but also solves problems such as electrical signal routing and preload loading for the traveling wave driver, which is beneficial for positioning the drive load structure to rotate.

[0020] A further optimized solution is that the MEMS driver includes: a plate, a support beam, and a driving component. The plate has a hollow cylindrical center, and the annular driving component is mounted on the hollow position of the plate through multiple support beams. The rotating shaft passes through the center of the driving component.

[0021] When the MEMS driver is powered on, the driving components of the MEMS driver perform corresponding modal actions according to the setting requirements, driving the rotor structure to rotate. The rotor structure drives the rotating body on the support structure to rotate together. It makes full use of the MEMS traveling wave micro motor structure and can realize in-situ rotation drive at the chip level based on the actuator.

[0022] A further optimization involves providing lead-in holes on the board, through which signal lines connected to the signal interface pass to the drive component. By configuring the electrical signal routing holes and signal interface for the traveling wave driver, the overall space occupied by the drive mechanism is reduced, improving space utilization.

[0023] A further optimized solution involves using a jewel shaft, which is assembled to the housing structure via an interference fit. A blind hole is designed at the bottom of the housing, concentric with the jewel shaft, for mounting a permanent magnet. This embedded permanent magnet design allows for the application of preload to the traveling wave micromotor.

[0024] The central shaft of the traveling wave micromotor rotor is made of a smooth sapphire shaft with a lower coefficient of friction, and it is assembled with the housing using an interference fit.

[0025] A further optimization scheme is proposed, in which the object to be rotated is either a reflector or a chip.

[0026] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0027] This invention provides a driving mechanism based on a traveling wave motor. It utilizes the cooperation of a MEMS traveling wave micro-actuator, a rotor mechanism, and a support structure to achieve in-situ rotational drive at the chip level, thus solving the aforementioned technical problems. This solution leverages the micrometer- or nanometer-scale fabrication capabilities of MEMS technology. Furthermore, MEMS structures offer the advantages of mass production and minimal or no assembly, resulting in a smaller number of structural components that make up the driving mechanism, facilitating in-situ rotational drive at the chip level. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In the drawings:

[0029] Figure 1 This is a schematic diagram of a drive mechanism based on a traveling wave motor.

[0030] Figure 2 This is a schematic cross-sectional view of a drive mechanism based on a traveling wave motor.

[0031] Figure 3 This is a schematic diagram of a MEMS driver structure;

[0032] Figure 4 This is a schematic diagram of the drive mechanism in Example 2;

[0033] Figure 5 This is a schematic diagram of the drive mechanism in Example 3;

[0034] Figure 6 This is a schematic diagram of the drive mechanism in Example 6.

[0035] The attached diagram shows the markings and corresponding component names:

[0036] 1-Bearing structure, 2-MEMS driver, 21-Plate body, 22-Support beam, 23-Driver, 3-Rotor structure, 4-To be rotated body, 5-Shell structure, 50-Signal interface, 51-Signal line protrusion, 6-Shaft. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0038] Motors manufactured using traditional machining processes are large and cannot be used in high-density integrated environments; they also suffer from problems such as the inability to drive bare chips in situ within a compact size constraint. To address these issues, this invention provides the following embodiments:

[0039] Example 1

[0040] This embodiment provides a drive mechanism based on a traveling wave motor, such as... Figure 1 and Figure 2 As shown, it includes: a load-bearing structure 1, a MEMS driver 2, and a rotor structure 3;

[0041] The rotor structure 3 is mounted on the MEMS driver 2 and is driven to rotate by the MEMS driver 2.

[0042] The bearing structure 1 is used to support the rotating body 4. The bearing structure 1 is set on the rotor structure 3 and rotates together with the rotor structure 3.

[0043] It also includes a housing structure 5 and a rotating shaft 6; the MEMS driver 2 is mounted on the housing structure 5, and the rotating shaft 6 passes through the housing structure 5, the MEMS driver 2 and the rotor structure 3 in sequence, and the rotor structure 3 rotates around the rotating shaft 6.

[0044] Both the rotor structure 3 and the shaft 6 are cylindrical structures; the bearing structure 1 is a cylindrical structure. The area of ​​the bearing structure 1 at the contact surface with the rotor structure 3 is less than or equal to the area of ​​the rotor structure 3, and the highest point of the bearing structure 1 is higher than the highest point of the shaft 6.

[0045] The load-bearing structure 1 and the rotor structure 3 are integrated.

[0046] The bearing structure 1 is a semi-cylindrical structure with the same radius as the rotor structure 3, and the angle between the upper bottom surface of the bearing structure 1 and the horizontal plane is 0° to 45°.

[0047] The shell structure 5 is a cuboid shell, and signal line protrusions 51 are provided on the shell structure 5. Each MEMS driver 2 is configured with multiple signal line protrusions 51, and multiple signal interfaces 50 are provided on each signal line protrusion 51 for connecting with the MEMS driver 2.

[0048] like Figure 3 As shown, the MEMS driver 2 includes: a plate 21, a support beam 22 and a driving component 23. The center of the plate 21 is a hollow cylinder. The annular driving component 23 is mounted on the hollow position of the plate 21 through multiple support beams 22. The rotating shaft 6 passes through the center of the driving component 23.

[0049] The plate 21 is provided with a lead hole 210, and the signal line connected to the signal interface passes through the lead hole 210 and is connected to the drive component 23.

[0050] The rotating shaft 6 is a jewel shaft, and the rotating shaft 6 is assembled with the shell structure 5 by an interference fit.

[0051] The object to be rotated, 4, is a reflector or a chip.

[0052] This embodiment utilizes the advanced MEMS process technology's ability to process feature dimensions at the micrometer or nanometer level, as well as the characteristics of MEMS structures that can be mass-produced with little or no assembly. The motor structure has a small number of components, and assembly can be completed in two bonding operations. It fully utilizes the MEMS traveling wave micromotor structure and can achieve in-situ rotational drive at the chip level based on the actuator.

[0053] Example 2

[0054] Based on Example 1, this example sets up multiple sets of drive rotation mechanisms sharing the same shell structure, such as... Figure 4 As shown, two sets of MEMS drivers are arranged side by side, and the two sets of MEMS drivers can share a set of signal line protrusions 51. The two signal line protrusions are located on both sides of the MEMS driver.

[0055] Example 3

[0056] Based on Example 1, in this example, the object to be rotated, 4, is a bare CMOS or CCD chip, such as... Figure 5 As shown, the bare CMOS or CCD chip is arranged on the rotor structure. By driving the rotor structure to rotate, the bare CMOS or CCD chip can achieve 360° detection.

[0057] Example 4

[0058] Based on Example 1, in this example, the rotating body 4 is a reflector fixed on the inclined surface of the support structure on the rotor structure. When the driver drives the rotor structure to rotate, the reflector rotates accordingly, which can be used for switching optical paths.

[0059] Example 5

[0060] Based on Example 1, in this example, the rotating body 4 is a pmut chip or cmut bare chip, and the ultrasonic sensing array unit is arranged on the support structure of the rotor structure. By driving the rotor structure to rotate, 360° detection can be achieved.

[0061] Example 6

[0062] Based on Example 1, in this example, the rotating body 4 is a MEMS gyroscope chip, such as... Figure 6 As shown, the rotor structure and load chip 303 rotate around the Z-axis under the drive of a MEMS traveling wave driver. In-situ calibration of the chip can be achieved by comparing the rotor's rotational speed with the gyroscope's output. In this embodiment, the rotor structure and support structure are integrated and cylindrical; therefore, the support structure is omitted here. Using a MEMS traveling wave micromotor, in-situ direct rotational drive at the chip end can be achieved, including continuous rotation or precise stepping.

[0063] Example 7

[0064] Based on Example 1, in this example, the body to be rotated 4 is a reflector, and similarly, multiple inclined reflectors with different angles are arranged on the supporting structure to achieve the switching of the optical path.

[0065] MEMS-based traveling wave micro-actuators can be as small as a few millimeters in diameter and hundreds of micrometers in thickness, enabling diverse load driving applications through integrated rotor mechanisms.

[0066] Throughout this specification, references to "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the invention. Therefore, the phrases "an embodiment," "an example," "an example," or "an example" appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0067] In the description of this invention, the terms "front", "rear", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0068] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A drive mechanism based on a traveling wave motor, characterized in that, include: The load-bearing structure (1), the MEMS driver (2), and the rotor structure (3); The rotor structure (3) is mounted on the MEMS driver (2) and is driven to rotate by the MEMS driver (2); The bearing structure (1) is used to support the body to be rotated (4), and the bearing structure (1) is set on the rotor structure (3) and rotates together with the rotor structure (3); It also includes: a shell structure (5) and a rotating shaft (6); the MEMS driver (2) is mounted on the shell structure (5), and the rotating shaft (6) passes through the shell structure (5), the MEMS driver (2) and the rotor structure (3) in sequence, and the rotor structure (3) rotates around the rotating shaft (6); The rotor structure (3) and the shaft (6) are both cylindrical structures; the bearing structure (1) is a cylindrical structure. The bearing structure (1) is in contact with the rotor structure (3). The area of ​​the bearing structure (1) is less than or equal to the area of ​​the rotor structure (3), and the highest point of the bearing structure (1) is higher than the highest point of the shaft (6). The shell structure (5) is a cuboid shell. Signal line protrusions (51) are provided on the shell structure (5). Each MEMS driver (2) is equipped with multiple signal line protrusions (51). Multiple signal interfaces (50) are provided on each signal line protrusion (51) for connecting with the MEMS driver (2). The MEMS driver (2) includes: a plate (21), a support beam (22) and a driving component (23). The center of the plate (21) is a hollow cylinder. The annular driving component (23) is mounted on the hollow position of the plate (21) through multiple support beams (22). The rotating shaft (6) passes through the center of the driving component (23).

2. The drive mechanism based on a traveling wave motor according to claim 1, characterized in that, The load-bearing structure (1) and the rotor structure (3) are integrated.

3. The drive mechanism based on a traveling wave motor according to claim 2, characterized in that, The bearing structure (1) is a semi-cylindrical structure with the same radius as the rotor structure (3), and the angle between the top surface of the bearing structure (1) and the horizontal plane is 0°~45°.

4. The drive mechanism based on a traveling wave motor according to claim 1, characterized in that, The plate (21) is provided with lead hole (210), and the signal line connected to the signal interface passes through the lead hole (210) and is connected to the drive (23).

5. The drive mechanism based on a traveling wave motor according to claim 1, characterized in that, The pivot (6) is a gemstone pivot, and the pivot (6) is assembled with the shell structure (5) by an interference fit.

6. The drive mechanism based on a traveling wave motor according to claim 1, characterized in that, The object to be rotated (4) is a reflector or a chip.

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