Semiconductor aging process device, transfer method, chamber and frame

Abstract

The present disclosure relates to an aging device, a transfer method, an aging chamber, and an interchangeable frame of the aging device for performing an aging process of a semiconductor device. The aging device includes an aging chamber with an incomplete substrate, which is suitable for cooperating with the insulating substrate of at least one interchangeable frame to become complete and insulated, and the at least one interchangeable frame is suitable for being removably moved into the aging chamber and docked in the aging chamber to complete the aging device. The aging device includes an aging chamber and at least one frame. When the frame is moved into the aging chamber and docked in the aging chamber, the aging device is complete and insulated. When the frame is moved out of the aging chamber and separated from the aging chamber, the aging device is incomplete and not insulated.

Description

Technical Field

[0001] The present invention relates to an aging device for performing an aging process on semiconductor devices or integrated circuits, and more specifically, to an aging device including an aging chamber that can operate in cooperation with one or more interchangeable frames to complete the insulation of the aging chamber, a method for transferring at least one frame into and out of the chamber by respectively completing and releasing the insulation of the chamber, a method for transferring a group of aging boards supported on a frame between the aging device and at least one other device in an aging area, and an aging device having an aging chamber and one or more interchangeable frames. Background Art

[0002] Burn-in is a process of exposing semiconductor devices to high and / or low temperatures along with excitation power supplies and / or signals to eliminate early failures before placing them into operation.

[0003] In this process, an automated burn-in loading / unloading device is used to load semiconductor devices onto a burn-in board. The burn-in board is then loaded into a burn-in system, where it is connected to a burn-in driver that provides excitation power and signals to the semiconductor devices. Thereafter, the burn-in board is unloaded from the burn-in system, and then the semiconductor devices are unloaded from the burn-in board by the burn-in loading / unloading device.

[0004] Generally speaking, there are two existing methods for loading or unloading burn-in boards into or from a burn-in system.

[0005] In the first method, a rack pulley (wheel carrier) is used to transport the aging board. For loading, the operator moves the rack pulley carrying the aging board from the aging loading / unloading device to the aging system, opens the door of the aging chamber, and manually transfers the board from the rack pulley to the rack inside the chamber one by one. After completing the board transfer, the operator manually inserts the aging board or automatically inserts the aging board into the corresponding connector of the aging board using the chamber board insertion mechanism, and the connector is connected to the aging drive. After completing the board insertion, that is, after the aging board is connected to the aging drive, the operator closes the chamber door, starts the aging process, removes the empty rack pulley, and parks the empty rack pulley at a specified position.

[0006] When the aging process is completed, for unloading, the operator moves the empty pulley rack to the aging system, opens the chamber door, and manually or automatically extracts the plates from the corresponding connectors using the chamber plate extraction mechanism. After the plate extraction is completed, that is, after the aging plate is disconnected from the aging drive, the operator manually transfers the plates from the chamber rack to the pulley rack one by one. Once the plate transfer is completed, the operator closes the chamber door and moves the pulley rack carrying the aging plate from the aging system to the aging loading / unloading device.

[0007] In this method, the loading and / or unloading of the aging board is manual and therefore physically burdensome to the operator. Over time, this can lead to operator fatigue, which in turn can damage the aging board due to unexpected impacts to the pulley rack or chamber rack during manual transfer. If the loading and / or unloading of the aging board at the aging loading / unloading device is also manual, operator fatigue can be further increased and more aging board damage will be caused. In addition, after the aging board is transferred from the pulley rack to the aging system, the empty pulley rack must be parked at a designated location, thus wasting valuable production floor space.

[0008] In the second method, the aging board is placed inside at least one aging board rack. The aging board rack is transported by a large trolley, which may or may not be powered. For loading, the operator moves the trolley carrying the aging board rack to the aging system, opens the door of the aging chamber, and manually transfers the racks from the trolley to the chamber one by one. After the rack transfer is completed, the operator manually inserts the aging board inside the rack or automatically inserts the aging board inside the rack into the corresponding connector of the aging board using the chamber plate insertion mechanism, which is connected to the aging drive. After the insertion is completed, that is, after the aging board is connected to the aging drive, the operator closes the chamber door, starts the aging process, and removes the empty trolley and parks the empty trolley at a specified location.

[0009] When the aging process is completed, for unloading, the operator moves the empty trolley to the aging system, opens the chamber door, and manually or automatically extracts the plates from the corresponding connectors using the chamber plate extraction mechanism. After the plate extraction is completed, i.e. after the aging plates are disconnected from the aging drive, the operator manually transfers the racks from the chamber to the trolley one by one. After the rack transfer is completed, the operator closes the chamber door and moves the trolley carrying the rack loaded with aging plates to the aging loading / unloading device.

[0010] In this approach, the size, weight, and cumbersome handling of the carts and manual transfer of racks between the burn-in system and the carts create safety risks and collision hazards. Large carts, if power-assisted, are larger, more cumbersome to operate, and more expensive to own and maintain. In addition, the turning radius of large carts necessitates wider aisles in the production area, thereby taking up valuable production floor space. Furthermore, manually transferring the burn-in racks between the carts and the burn-in loading / unloading device creates further safety risks and collision hazards. Summary of the invention

[0011] According to one aspect, an aging device for performing an aging process on a semiconductor device or an integrated circuit is provided, the aging device comprising: an aging chamber having at least one side opening and at least one base opening; at least one door or lid, suitable for closing the side opening; at least one interchangeable frame, movable through the side opening and removably dockable in the chamber to close the base opening, each frame having a temperature-isolating substrate and a rack, the temperature-isolating substrate having a first side and a second side, the rack being arranged at the first side of the temperature-isolating substrate, wherein when the side opening is closed and each frame is removably docked in the chamber, the temperature-isolating substrate is arranged at the base opening and adjacent to the chamber to complete the temperature insulation of the chamber, and the rack and the first side of the temperature-isolating substrate are located inside the chamber and the second side of the temperature-isolating substrate is located outside the chamber.

[0012] According to another aspect, a method includes: transferring a group of aging boards into a chamber by moving at least one frame through a side opening of the chamber into the chamber, wherein each frame includes an insulating base and a rack, the rack is arranged at a first side of the insulating base and supports the group of aging boards; completing the insulation of the chamber, completing the insulation of the chamber includes: closing the base opening of the chamber by docking the at least one frame in the chamber, the docking of the at least one frame in the chamber is performed in the following manner: arranging the insulating base of each frame at the base opening and making the insulating base adjacent to the chamber, so that the rack and the first side of the insulating base are located inside the chamber, and the second side of the insulating base is located outside the chamber and closes the side opening; and performing an aging process on the semiconductor devices arranged in the group of aging boards.

[0013] The method may also include: removing the insulation of the chamber, removing the insulation of the chamber includes opening the side opening and opening the base opening by separating the at least one frame from the chamber; transferring the set of aging boards out of the chamber by moving the at least one frame out of the chamber through the side opening.

[0014] The method may also include: transferring the group of aging boards on the frame between the aging device and at least one other device in the aging area, for example, an aging loading / unloading device, a aging board pre-inspection device, a aging board storage device, or an aging board cleaning device, by moving the at least one frame to one of the above-mentioned devices or other devices in the aging area and removably docking to the above-mentioned device or one of the other devices in the aging area.

[0015] According to another aspect, an aging chamber of the above aging device is provided.

[0016] According to another aspect, a framework of the above-mentioned burn-in device is provided.

[0017] The frame can be a common carrier for the aging board of the aging chamber and the aging board of at least one other device in the aging area, for example, an aging loading / unloading device, an aging board pre-inspection device, an aging board storage device, and an aging board cleaning device.

[0018] In some embodiments, the aging chamber includes at least one insulating side element disposed at least partially along the base opening and adapted to abut the insulating base when each frame is removably docked in the chamber.

[0019] In some embodiments, when the side opening is closed and each frame is removably docked in the aging chamber, the temperature-isolating substrate is disposed at the substrate opening.

[0020] In some embodiments, each frame further comprises: a pulley, which may be manual or power-assisted; or an arrangement suitable for use with an autonomous guided vehicle (AGV), wherein the pulley or the arrangement is arranged at the second side of the insulating substrate.

[0021] In some embodiments, an electronic circuit system is arranged at the second side of the insulation substrate, and the electronic circuit system may include at least one of the following: a communication circuit system, a sensor, a storage device and a microprocessor, and the electronic circuit system is configured to send and / or receive signals at least when the at least one frame is removably docked in the chamber and an aging process is carried out in the chamber and / or when the at least one frame is separated from the chamber.

[0022] In some embodiments, the at least one frame includes two or more frames, wherein at least one of the two or more frames is loaded with a burn-in board, and wherein at least another of the two or more frames does not have a burn-in board.

[0023] In some embodiments, a plurality of second frames are arranged outside the chamber, wherein the at least one frame is interchangeable with at least one of the second frames. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 An aging chamber according to one embodiment of the present invention is shown.

[0025] Figure 2 Shown suitable for moving to Figure 1 The frames in the aging chamber.

[0026] Figure 3A flow chart is shown relating to a method of transferring a burn-in board into / out of a burn-in chamber according to one embodiment of the present invention.

[0027] Figure 4 It is shown that Figure 1 Aging chamber and Figure 2 A perspective view of an incomplete aging device for a frame.

[0028] Figure 5A It shows that Figure 2 The frame can be removably docked to Figure 1 A perspective view of the aging device, which sometimes becomes complete, in the aging chamber of FIG.

[0029] Figure 5B is from Figure 5A A perspective view of the front view.

[0030] Figure 5C is from Figure 5A A perspective view of the device viewed from one side. DETAILED DESCRIPTION

[0031] In the following description, numerous specific details are set forth to provide a thorough understanding of various illustrative embodiments of the present invention. However, those skilled in the art will appreciate that embodiments of the present invention may be practiced without some or all of these specific details. In other instances, well-known process operations are not described in detail in order to avoid unnecessarily obscuring relevant aspects of the described embodiments.

[0032] Embodiments described in the context of one of a method, device, or system may also be applicable to the other method, device, or system. Similarly, embodiments described in the context of a method may also be applicable to a device or system, and vice versa.

[0033] Features described in the context of an embodiment may be correspondingly applicable to the same or similar features in other embodiments. Features described in the context of an embodiment may be correspondingly applicable to other embodiments, even if not explicitly described in these other embodiments. In addition, additions and / or combinations and / or alternative forms described for features in the context of an embodiment may be correspondingly applicable to the same or similar features in other embodiments.

[0034] In the accompanying drawings, similar reference numerals refer to the same or similar functions or features throughout the several views. The specific arrangements shown in the accompanying drawings should not be considered restrictive. It should be understood that other embodiments may include more or less elements in each element shown in a given figure. Some elements of the illustrated elements may be combined or omitted.

[0035] In the context of various embodiments, including in the examples and claims, the articles "a / an" and "the" used with respect to features or elements include reference to one or more of the features or elements. The terms "comprising", "including", "having" and variations thereof are intended to be open ended and mean that there may be additional features or elements other than the listed features or elements. The term "and / or" includes any and all combinations of one or more of the associated listed items. Identifiers such as "first", "second", and "third" are used only as labels and are not intended to impose numerical requirements on their objects, nor should they be interpreted as imposing any relative position or time order except for limitation. The term "coupled" may refer to being physically coupled, electrically coupled, and / or communicatively coupled. The term "coupled" when applied to two objects may refer to the two objects being directly coupled or indirectly coupled by a third object. The term "arranged at" may include reference to "coupled to". The term "supporting" when applied to two objects may refer to the first object being directly supported by the second object or indirectly supported by a third object.

[0036] Aspects of the present invention provide an aging device for performing an aging process on a semiconductor device or an integrated circuit and a method for transferring in and out of an aging board by completing and releasing the insulation of an aging chamber, respectively. The aging device includes: an aging chamber; and one or more interchangeable frames, each of which is suitable for being removably moved into the aging chamber and docked in the aging chamber.

[0037] The aging device includes an aging chamber with an incomplete base, which is suitable for cooperating with the insulating base of at least one interchangeable frame to become complete and insulated, and the at least one interchangeable frame is suitable for being removably moved into the aging chamber and docked in the aging chamber. More specifically, the aging device includes an aging chamber (alternatively referred to as a "chamber") having at least one side opening and at least one base opening, and at least one door or lid, which is suitable for closing or sealing the side opening and providing insulation for the aging chamber. When the frame is moved into the chamber and docked in the chamber, the insulating base of the frame can close or seal the base opening. When both the side opening and the base opening are closed, the insulation of the aging chamber is completed. The rest of the chamber (i.e., except for the aforementioned side opening and base opening) can be insulated.

[0038] The aging device may be coupled to or cooperate with at least one aging driver or test device, which is suitable for connecting to the aging board and providing power and / or electrical signals and / or receiving power and / or electrical signals to semiconductor devices arranged in and / or connected to the aging board. The aging driver may be arranged outside the chamber. The chamber is suitable for accommodating at least one frame supporting the aging board. The aging device including the chamber and the frame and the complete assembly of the aging driver form an aging system.

[0039] The frame provides a carrier for the burn-in board and the semiconductor device. The frame is adapted to be configured and sized to be removably moved into the burn-in chamber and docked in the burn-in chamber. The frame includes at least one rack, at least one insulating substrate adapted to be located at the frame (e.g., the bottom of the frame), so that when the frame is docked in the chamber, the insulating substrate is adjacent to at least a portion of the at least partially defined substrate opening of the chamber, thereby closing the substrate opening and providing insulation for the substrate opening of the chamber. The insulating substrate includes a first side and a second side, the second side may be opposite to the first side or transverse to the first side or have other appropriate orientations (e.g., the same or different directions) relative to the first side. The rack is arranged at the first side of the insulating substrate, i.e., coupled to the insulating substrate and / or the frame. Therefore, when the insulating substrate is arranged at the substrate opening of the chamber, the first side of the insulating substrate and the rack are arranged inside the chamber and are therefore subjected to the temperature conditions of the chamber during the aging process, while the second side of the insulating substrate is arranged outside the chamber (for example, in the ambient environment or in a housing of the aging device located outside the chamber) and is therefore not subjected to the temperature conditions of the chamber during the aging process.

[0040] Figure 1 and Figure 4A burn-in device 100 according to one embodiment of the present invention is shown. The burn-in device 100 includes a burn-in chamber 110 and a burn-in driver section 150, which can be arranged adjacent to the burn-in chamber 110. The burn-in driver section 150 can accommodate a burn-in driver or a test device and associated components or circuit systems. The chamber 110 provides at least two openings, such as a base opening 112 and a side opening 114. The base opening 112 can be disposed at the bottom of the chamber 110. The chamber can include at least one insulating side element 116 disposed at least partially along the base opening 112. The side element 116 can be an integral part of the chamber 110 or configured to be coupled to at least one separate element of the chamber 110. The dimensions defined by the insulating side element 116 and the base opening 112 are suitable for ensuring that the insulating side element 116 abuts against the insulating base 212 of the compatible frame 200 to close the base opening 112 when the frame is moved into the chamber 110 and docked in the chamber 110. The side opening 114 may be disposed at a side of the chamber 110 and may be arranged to be in fluid communication with the base opening 112, i.e., the base opening 112 intersects the side opening 114. The side may refer to a non-top side or a non-bottom side, and may be transverse to the bottom side. The side opening 114 enables a frame (e.g., a frame loaded with an aging board) to be transferred into and out of the chamber 110. The side opening 114 may be closed by at least one door 120 or lid that is movably coupled to the chamber 110 or the aging device 100, for example, by a hinge, or by at least one door or lid that is disassembled or separated from the chamber 110 or the aging device 100. The door 120 is suitable for providing thermal insulation for the side opening 114 when it is closed, however, when the compatible frame 200 is not present in the chamber 110 or is removed from the chamber 110, even if the side opening 114 is closed by the door 120, the thermal insulation of the chamber 110 is still incomplete because the base opening 112 is not filled or covered. When at least one of the base opening 112 and the side opening 114 is not closed, the base opening 112 and the side opening 114 enable fluid communication between the inside of the chamber 110 and the outside of the chamber 110 or the surrounding environment.

[0041] Figure 2 and Figure 4 Suitable for removably docking with Figure 1 The frame 200 in the aging device 100. The frame 200 includes a rack 210 for supporting one or more aging boards 220, which can be stacked or arranged in other configurations. The rack 210 may include other structural elements for directly or indirectly supporting the aging board. The frame 200 also includes an insulating substrate 212, which may partially or completely form the bottom of the rack 210 or the bottom of the frame 200. Figure 2In the context of the present invention, the thermal insulation substrate 212 has a first side (e.g., a top side) and a second side (e.g., a bottom side). Although the first side and the second side may be as Figure 2 10 and 110, but in other examples the first side and the second side may be transverse to each other or arranged on non-opposite sides, as long as the first side is arranged inside the chamber 110 and the second side is arranged outside the chamber 110 during the aging process or when the frame 200 is docked in the chamber 110. The frame 200 may also include a pulley 230, which is arranged at the second side of the insulating substrate 212, for example, rotatably coupled to the insulating substrate 212 and / or the rack 210. Therefore, during the aging process or when the frame 200 is docked in the chamber 110, the pulley 230 is arranged outside the chamber 110. The pulley 230 can be an electrostatic discharge (ESD) pulley, which can be manual, power-assisted, or an arrangement suitable for use with an autonomous guided vehicle (AGV). The combination of the frame 200 and its pulley 230 can also be referred to as a cart.

[0042] Figure 2 The frame 200 may also include an electronic circuit system (not shown) arranged at the second side of the insulating substrate 212. Therefore, during the aging process or when the frame 200 is docked in the chamber 110, the electronic circuit system is arranged outside the chamber 110 and is therefore not affected or at least not subjected to the temperature conditions of the chamber 110 during the aging process. The electronic circuit system may include a communication circuit system (e.g., a transmitter, a receiver) suitable for sending and / or receiving signals to one or more remote devices (e.g., communication devices) via a wired connection or a wireless connection. The electronic circuit system may also include at least one sensor, a computing processor or microprocessor, and / or a memory device for storing instructions that can be executed by the computing processor or microprocessor, and the computing processor or microprocessor can be communicatively coupled to the communication circuit system, the sensor, and / or the memory device. The signal may provide information about the frame 200 docked in the chamber 110, the aging board supported by the particular frame 200, and / or the semiconductor device. This information may include the location and / or characteristics of the particular frame 200, the aging board supported by the particular frame 200, and / or the semiconductor.

[0043] Figure 3 A flow chart 300 is shown of a method of transferring a burn-in board into / out of a burn-in chamber and in accordance with one embodiment of the present invention.

[0044] exist Figure 3 In block 302, at least one frame is loaded with a set of burn-in boards and semiconductor devices. When the frame is docked in a burn-in loading / unloading device (not shown), the semiconductor devices can be loaded onto the set of burn-in boards by the burn-in loading / unloading device.

[0045] exist Figure 3 In frame 304, a loaded frame including a rack supporting the aging boards is transferred into the aging chamber. During this transfer-in process, the loaded frame is progressively moved into the chamber through the side opening of the chamber, while the insulating base of the frame progressively closes the base opening of the chamber; when the insulating base closes the base opening, the frame docks in the chamber. In the docking position, the insulating base closes the base opening and provides insulation for the base opening; the first side of the insulating base and the rack are located inside the chamber, and the second side of the insulating base is located outside the chamber. Such transfer of the set of aging boards into the chamber may include moving the frame from the aging loading / unloading device to the chamber without unloading the set of aging boards from the rack or the frame.

[0046] In frame 200 is a trolley Figure 2 In the illustrated embodiment, transferring the loaded frame 200 includes moving (eg, pushing) the loaded cart into the chamber 110. Closing the substrate opening includes abutting the insulating substrate against at least one insulating side element disposed at least partially along the substrate opening.

[0047] exist Figure 3 In block 306, the side opening is closed by using or actuating at least one or more doors or covers designated for the closing purpose.

[0048] When the base opening is closed by docking the frame in the chamber and the side openings are also closed, the chamber is insulated, for example, see the aging system showing the completed insulation. FIG. 5A to FIG. 5C .

[0049] exist Figure 3 In block 308 of , an aging process occurs or is performed in the chamber. The temperature inside the chamber is set to a desired temperature. The aging board supported by the frame and the first side of the insulating substrate of the frame are exposed to the chamber temperature. The second side of the insulating substrate is located outside the chamber along with any pulleys and / or any communication circuit systems and electronic circuit systems, and is therefore not exposed to the chamber temperature and is therefore still at ambient temperature. During the aging process, the electronic circuit system may operate, for example, the communication circuit system may operate to send signals to one or more devices (e.g., communication devices) at the far end of the aging device and / or receive signals.

[0050] exist Figure 3 In frame 310, the aging process is completed. The side opening is opened, for example, a door or a lid is opened to allow access to the chamber through the side opening.

[0051] In frame 312, the warp loading frame is transferred out of the chamber. During this transfer out process, the substrate opening is opened or exposed by separating the warp loading frame from the chamber and progressively moving out of the chamber through the side opening until the frame is located outside or away from the substrate opening. In the separated position, the insulation substrate does not close or expose the substrate opening, so even if the side opening can be closed, the insulation of the chamber substrate is still incomplete. The frame can be transferred to the aging loading / unloading device without unloading the set of aging plates from the rack or frame. At the aging loading / unloading device, the semiconductor devices that have completed the aging process can be unloaded from the set of aging plates.

[0052] exist Figure 4 and Figure 5A In an embodiment, opening the base opening includes causing the insulating base to not abut at least one insulating side element disposed at least partially along the base opening.

[0053] exist Figure 3 In block 314, at least one second loading frame supporting a second set of burn-in boards and semiconductor devices is transferred into the chamber in the same manner as described with reference to block 304; the side openings are closed as described with reference to block 306; the burn-in process and optional electronic and / or communication operations are performed as described with reference to block 308; after the burn-in process is completed, the side openings are opened as described with reference to block 310; and the second frame is transferred out of the chamber as described with reference to block 312. The second frame used in block 314 may be different from but interchangeable with the frame used in block 304, i.e., when the frame used in block 304 is docked in the chamber during the burn-in process, the second frame used in block 314 is disposed outside the chamber.

[0054] FIG. 5A to FIG. 5C The completed burn-in system 500 is shown. The completed burn-in system 500 has Figure 1 The aging device 100 and Figure 2The system 500 includes an aging device 100 having a chamber 110, the chamber 110 having at least one side opening and at least one base opening, wherein the at least one side opening and the at least one base opening are not thermally insulated when open. The system 500 also includes at least one frame 200 that is movable through the side opening and removably dockable in the chamber 110, wherein the frame 200 includes an insulating base 212 having a first side and a second side. When the frame 200 is docked in the chamber 110, the insulating base 212 is arranged at the base opening 112, such as being mated or engaged within the base opening 112 to abut the chamber and / or the insulating side elements 116 of the chamber, thereby closing the base opening 112 and providing thermal insulation for the base opening 112. When the frame 200 is docked in the chamber 110 and the side opening 114 is closed, the chamber 110 is thermally insulated, and the first side of the thermally insulated substrate 212 is disposed inside the chamber 110, while the second side is disposed outside the chamber 110. The system 500 further includes at least one burn-in driver or test device (not shown) housed inside the burn-in driver section 150.

[0055] It should be appreciated that the above-described and / or illustrated embodiments may be modified or varied as described below.

[0056] In one embodiment, the chamber can accommodate more than one frame and therefore has one or more base openings and one or more side openings. Therefore, the base opening can be closed by docking two or more frames in the chamber. Each frame provides an insulating base so that the combination of the insulating bases is adjacent to the chamber and / or the insulating side elements of the chamber to close the base opening. In one example, multiple frames are arranged adjacent to each other to close a single base opening, and in another example, multiple frames are arranged to close multiple base openings respectively. In one example, all docked frames are loaded with an aging board, and in another example, at least one docked frame does not have an aging board or is not loaded, but must be docked in the chamber to close the base opening to complete the insulation of the chamber.

[0057] In the embodiments shown in the various figures, the insulating side elements may be disposed along three sides of the base opening. In some other embodiments (not shown), the insulating side elements may be disposed along one or more sides of the base opening, arranged continuously or intermittently. In still other embodiments, no insulating side elements may be disposed along any side of the base opening. In other words, the insulating base of the frame is configured to abut the chamber in direct contact with each other.

[0058] In the embodiments shown in the various figures, the size of the insulating substrate of the frame may be substantially the same as or slightly smaller than the size of the substrate opening of the chamber. Thus, in the docked position, the insulating substrate can be mated or engaged in the substrate opening. In some other embodiments (not shown), the size of the insulating substrate of the frame may be larger than the size of the substrate opening of the chamber. In one example of these embodiments, when the frame is docked in the chamber instead of the insulating substrate being mated in the substrate opening, the insulating substrate may be arranged below both the chamber and the substrate opening or adjacent to both the chamber and the substrate opening but adjacent to the chamber to cover or close the substrate opening. In another example of these embodiments, when the frame is docked in the chamber, at least a portion of the insulating substrate is mated or engaged in the substrate opening, and at least another portion of the insulating substrate is arranged outside the substrate opening. It should be understood that in the foregoing embodiments and other embodiments, making the insulating substrate adjacent to the chamber to cover or close the substrate opening includes arranging the insulating substrate at the substrate opening, which arrangement includes arranging in the substrate opening, arranging below the substrate opening, or adjacent to the substrate opening.

[0059] In one embodiment, the insulating substrate is cut or removed from the aging chamber and coupled to the frame and / or rack.

[0060] In one embodiment, a plurality of frames may be compatible with the burn-in device. The plurality of frames may have different arrangements to support different types of burn-in boards, however, the overall configuration and size of the plurality of frames (including their insulating base) are adapted to be compatible with the burn-in device to enable docking in the chamber and thus complete the insulation of the chamber.

[0061] In one embodiment, the frame may not be provided with pulleys. Thus, a vehicle may be required to transfer the frame into and out of the aging chamber. The vehicle may be manually operated and / or automated, such as an autonomous guided vehicle (AGV), an autonomous robot vehicle (ARV).

[0062] In one or more embodiments, the pulleys of the frame may be manual or power-assisted, or the frame may alternatively or additionally include an arrangement (e.g., a coupling element or an engagement element) suitable for use with an autonomous guided vehicle (AGV). The frame may include a power supply and a motor that may be disposed on a second side of the insulating substrate such that these components are disposed outside of the chamber during the aging process.

[0063] In one embodiment, the pulley may not be an electrostatically protected (ESD) pulley.

[0064] It should be understood that the above embodiments can be selectively combined. It should also be understood that the above modifications or variations and combinations can be applied to the reference Figure 3 The method described.

[0065] Embodiments of the present invention provide several advantages, including but not limited to the following:

[0066] (i) The present invention eliminates the manual transfer of the burn-in board or burn-in board rack to / from the burn-in chamber. Instead of manually transferring the burn-in board or burn-in board rack into or out of the burn-in chamber, the present invention provides an interchangeable frame for carrying the burn-in board to move directly into or out of the burn-in chamber.

[0067] Compared to the first prior art method described in the prior art, the present invention minimizes operator fatigue and reduces damage to aged panels due to manual handling.

[0068] Compared to the second prior art method described in the prior art, the present invention does not require a large cart or manual transfer of the aging plate rack, thereby minimizing safety hazards and collision risks.

[0069] It will be appreciated that the frame of the present invention takes up less floor space, is lighter, cheaper, easier to operate, and requires less maintenance than large carts with aged plate racks. The frame of the present invention also has a smaller turning radius, allowing aisles in production areas to be narrower, thus saving valuable floor space.

[0070] It should also be appreciated that in the present invention, after docking the frame in the chamber, there is no need to remove the empty pulley rack or empty cart and park it at a designated location, thus saving the operator an extra step and also conserving valuable production floor space.

[0071] (ii) The present invention achieves seamless integration, simplifies transfer, and facilitates automation between the burn-in device and at least one other device in the burn-in area.

[0072] It should be understood that in the present invention, the same frame moved into the chamber can also be moved into at least one other device in the aging area (e.g., an aging loading / unloading device, an aging board pre-inspection device, an aging board storage device, an aging board cleaning device) to perform various operations. In other words, the aging board is not unloaded from the frame or loaded onto the frame during the transportation of the aging board from the aging device to at least one other device in the aging area, and vice versa.

[0073] It should also be appreciated that during the burn-in process, the second or underside of the insulating substrate, along with a pulley or arrangement suitable for use with an autonomous guided vehicle (AGV), is located outside the chamber and is only exposed to ambient conditions. This enables automated drives, sensors, and / or electronic circuitry to be mounted on the underside of the frame to simplify transfer and facilitate automation between the burn-in device and at least one other device in the burn-in area.

[0074] (iii) The present invention enables position tracking of the burn-in board, which was not possible in the prior art methods. In the prior art methods, the burn-in board and the burn-in board rack are completely enclosed in the metal structure of the burn-in chamber and exposed to high / low temperature environments that render powered or non-powered wireless position tracking devices unusable or require extremely expensive devices.

[0075] In the present invention, during the burn-in period, only the first side of the insulating substrate, the rack and the burn-in board are located in the chamber and exposed to hot temperature conditions / cold temperature conditions, while the second side of the insulating substrate and the pulley or arrangement suitable for use with an autonomous guided vehicle (AGV) are located outside the chamber and exposed only to ambient conditions. This enables powered or non-powered position tracking devices, sensors and electronic circuit systems to be mounted on the second side of the frame to facilitate position tracking of the frame and the burn-in board throughout the burn-in area even when the burn-in board is completely enclosed in the metal structure of the burn-in device and exposed to high / low temperatures.

[0076] It should be understood that the embodiments and features described above should be considered as exemplary rather than limiting. Those skilled in the art will appreciate many other embodiments based on the specification and considerations of the practice of the present invention. In addition, certain terms have been used for the purpose of clarity and do not limit the embodiments disclosed in the present invention.

Claims

1. An aging device for performing an aging process on a semiconductor device or an integrated circuit, the aging device comprising: an aging chamber having at least one side opening, at least one base opening, and at least one insulating side element, the at least one insulating side element being arranged at least partially along the base opening; at least one door or cover adapted to close the at least one side opening; at least one interchangeable frame, wherein each of the at least one interchangeable frame comprises a thermally insulating base forming a bottom of the at least one interchangeable frame and a toothed rack arranged at a first side of the thermally insulating base, wherein the at least one interchangeable frame is configured to be movable through the at least one side opening so that the at least one interchangeable frame can be removably docked in the aging chamber in the following manner: the insulating substrate is progressively moved through the at least one side opening while the insulating substrate progressively closes the substrate opening and abuts the insulating side element, thereby fitting the insulating substrate within the at least one substrate opening to abut the aging chamber, so that the insulating substrate closes the substrate opening and insulates the insulating substrate from the substrate opening, Wherein, the temperature insulation of the aging chamber is completed when the at least one side opening is closed, and the rack and the first side of the temperature insulation substrate are located inside the aging chamber, while the second side of the temperature insulation substrate is located outside the aging chamber.

2. The burn-in device of claim 1 , wherein each of the at least one interchangeable frames further comprises: A pulley, either manual or power-assisted; or an arrangement, suitable for use with an autonomous guided vehicle (AGV), wherein the pulley or the arrangement is arranged at the second side of the insulating substrate.

3. The aging device according to any one of claims 1 to 2, further comprising: An electronic circuit system is arranged at the second side of the insulating substrate, the electronic circuit system including one or more selected from the group consisting of a communication circuit system, a sensor, a storage device and a microprocessor, and is configured to send and / or receive signals at least when the at least one interchangeable frame is removably docked in the aging chamber and the aging process occurs in the aging chamber.

4. The burn-in device of claim 1 , wherein the at least one interchangeable frame comprises two or more frames, and wherein at least one of the two or more frames is loaded with a burn-in board, and wherein at least another of the two or more frames does not have a burn-in board.

5. The aging device according to claim 1, further comprising: A plurality of second frames are disposed outside the burn-in chamber, wherein the at least one interchangeable frame is interchangeable with at least one of the plurality of second frames.

6. A method for performing an aging process on a semiconductor device, comprising: Transferring at least one frame having a set of aging boards into a chamber so that the at least one frame can be removably docked in the chamber, the chamber having at least one side opening, at least one base opening, and at least one insulating side element, the at least one insulating side element being arranged at least partially along the base opening, wherein each of the at least one frame comprises an insulating base and a rack, the insulating base forming the bottom of the frame, the rack being arranged at a first side of the insulating base and supporting the set of aging boards; wherein transferring the at least one frame having the set of aging boards into the chamber comprises moving the at least one frame through the at least one side opening of the chamber into the chamber so that the at least one frame can be removably docked in the chamber in the following manner: progressively moving the insulating base through the at least one side opening, while the insulating base progressively closes the base opening and abuts the insulating side element, thereby fitting the insulating base within the base opening to abut the chamber, so that the insulating base closes the base opening and insulates the insulating base from the base opening, The chamber is thermally isolated, including: closing the at least one side opening so that the rack and the first side of the insulating substrate are located inside the chamber and the second side of the insulating substrate is located outside the chamber, and A burn-in process is performed on the semiconductor devices arranged in the set of burn-in boards.

7. The method according to claim 6, further comprising: Removing the thermal insulation of the chamber comprises: opening the side opening, and opening the base opening by separating the at least one frame from the chamber, wherein opening the base opening of the chamber includes disengaging the insulating base from abutting the at least one insulating side element; The set of burn-in boards are transferred out of the chamber by moving the at least one frame out of the chamber through the side opening.

8. The method of claim 6, wherein docking the at least one frame having the set of burn-in panels in the chamber comprises: A manual or power-assisted pulley or arrangement suitable for use with an autonomous guided vehicle (AGV) is arranged, wherein the pulley or arrangement is arranged at the second side of the insulating substrate and outside the chamber.

9. The method according to any one of claims 6 to 8, further comprising: When the aging process is performed on the semiconductor devices arranged in the set of aging boards, operating an electronic circuit system disposed at the second side of the insulating substrate, and / or Operating the communication circuitry disposed at the second side of the insulating substrate includes sending and / or receiving signals via the communication circuitry.

10. The method of claim 6, wherein transferring the at least one frame having the set of burn-in boards into the chamber comprises moving the at least one frame from a burn-in loading / unloading device to the chamber without unloading the set of burn-in boards from the rack or the at least one frame, Wherein before transferring the at least one frame having the set of aging panels into the chamber, the method further comprises: transferring said at least one frame having said set of burn-in panels into said burn-in loading / unloading device; as well as The semiconductor device is loaded onto the set of burn-in boards by the burn-in loading / unloading device.

11. The method of claim 6, wherein transferring the set of burn-in boards out of the chamber comprises: Transferring the at least one frame to a burn-in loading / unloading device without unloading the set of burn-in boards from the rack or the at least one frame, the method further comprising: The semiconductor devices that have completed the aging process are unloaded from the set of aging boards by the aging loading / unloading device.

12. The method of claim 6, wherein transferring the at least one frame having the set of burn-in boards into or out of the chamber comprises: Without unloading the group of aging boards from the rack or the at least one frame, the at least one frame is transferred between the chamber and at least one other device in the aging area, and the at least one other device is selected from the group consisting of an aging loading / unloading device, an aging board pre-inspection device, an aging board storage device, and an aging board cleaning device.

13. An aging chamber, comprising: a chamber having at least one side opening, at least one base opening intersecting the side opening, and at least one insulating side element, the at least one insulating side element being arranged at least partially along the base opening, wherein at least the base opening, when open, is configured to allow fluid communication between the interior of the chamber and the exterior of the chamber and to render thermal insulation of the chamber incomplete, wherein the base opening is closable when at least one frame is removably docked in the chamber, wherein the base opening is configured to be progressively closed by means of an insulating substrate forming a bottom of the at least one frame by progressively moving the insulating substrate through the at least one side opening while the insulating substrate progressively closes the base opening and abuts the insulating side elements, wherein the removable docking is configured to fit the insulating substrate within the base opening to abut the chamber, and The temperature insulation of the chamber is configured to be completed when the at least one side opening is closed and the base opening is closed by the temperature insulation base removably docked to the at least one frame in the chamber.

14. A framework comprising: Rack, carrying multiple aging boards; as well as a thermal insulation substrate having a first side and a second side, wherein the rack is arranged at the first side of the thermal insulation substrate, wherein the insulation substrate is configured to be fitted into a substrate opening of the aging chamber to abut against the aging chamber when the frame is removably docked in the aging chamber by: progressively moving the insulation substrate through a side opening of the aging chamber while the insulation substrate progressively closes the substrate opening and abuts against an insulation side element of the aging chamber, wherein the insulation side element is at least partially arranged along the substrate opening; and Wherein, the insulation of the aging chamber is configured to be completed when the side opening of the aging chamber is closed, so that the rack, the aging plate and the first side of the insulation substrate are inside the aging chamber and exposed to the temperature conditions of the aging chamber, while the second side of the insulation substrate is outside the aging chamber and exposed to the environmental conditions.

15. The framework of claim 14, further comprising: A pulley, either manual or power-assisted; or an arrangement, suitable for use with an autonomous guided vehicle (AGV), wherein the pulley or the arrangement is arranged at the second side of the insulating substrate.

16. The frame according to any one of claims 14 to 15, further comprising: An electronic circuit system is arranged at the second side of the insulating substrate, the electronic circuit system including one or more selected from the group consisting of a communication circuit system, a sensor, a storage device and a microprocessor, and is configured to send and / or receive signals at least when the frame is removably docked in the aging chamber.

17. The frame of claim 14, wherein the frame provides a common carrier for a plurality of aging boards of the aging chamber and a plurality of aging boards of at least one other device in the aging area, wherein the at least one other device is at least one selected from the group consisting of an aging loading / unloading device, an aging board pre-inspection device, an aging board storage device, and an aging board cleaning device, wherein, The frame including the rack, the burn-in plate, and the insulating substrate is removably dockable to the at least one other device in the burn-in area.

Images