Electronic device with force element

Abstract

Various implementations include a force element for an electronic device. In some aspects, the force element includes: an outer ring surrounding a central axis and having a first diameter; an inner ring surrounding the central axis and having a second diameter less than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from the radially inner portion of the inner ring and located radially inward of the outer wall; and a central platform extending from the inner wall around the central axis.

Description

[0001] Priority declaration

[0002] This patent application claims priority to U.S. Patent Application No. 16 / 740,832, filed on January 13, 2020, which is hereby incorporated by reference in its entirety. Technical Field

[0003] The present disclosure generally relates to force elements for electronic devices. More specifically, the present disclosure relates to force elements for electronic devices such as audio devices. Background Art

[0004] Conventional force elements in electronic devices may not adequately limit forces from components in such devices. For example, during installation and / or use of devices housing such components, conventional force elements apply excessive forces to sensitive components. Such forces may cause component damage and / or failure. Summary of the invention

[0005] All examples and features mentioned below can be combined in any technically possible way.

[0006] Various implementations include force elements for electronic devices, and electronic devices employing such force elements. The force elements are configured to limit forces applied to one or more components within the electronic device, for example, during assembly, disassembly, and / or use.

[0007] In some specific aspects, a force element is disclosed, which includes: an outer ring, which surrounds a central axis and has a first diameter; an inner ring, which surrounds the central axis and has a second diameter smaller than the first diameter; an outer wall, which connects the radially inner portion of the outer ring with the radially outer portion of the inner ring; an inner wall, which extends from the radially inner portion of the inner ring and is located radially inside the outer wall; and a central platform, which extends from the inner wall around the central axis.

[0008] In other specific aspects, an electronic device is disclosed, comprising: a circuit board; a device component separated from the circuit board; and a force element located between the device component and the circuit board, the force element comprising: an outer ring surrounding a central axis and having a first diameter; an inner ring surrounding the central axis and having a second diameter smaller than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from a radially inner portion of the inner ring and located radially inside the outer wall; and a central platform extending from the inner wall around the central axis.

[0009] Implementations may include one or any combination of the following features.

[0010] In some cases, the inner wall is shaped as a cone and converges from the radially inner portion of the inner ring toward the central platform, and the inner wall is located radially inward of the outer ring relative to the central axis.

[0011] In certain aspects, there is a gap between the inner wall and the outer wall, and an upper surface of the central platform is substantially coplanar with an upper surface of the outer ring.

[0012] In some cases, the central platform includes a central disk.

[0013] In certain implementations, the inner ring and the outer ring are axially offset and radially offset relative to each other in a stationary state.

[0014] In some aspects, a vertical cross-section of the force element in the static state approximates a "W" shape.

[0015] In certain implementations, when the inner wall reaches a vertical compression limit, the inner wall transfers the compressive force applied to the force element to the outer wall.

[0016] In certain aspects, the outer wall has an incident angle of about 10 degrees to about 45 degrees with the inner ring, and the inner wall has an incident angle of about 10 degrees to about 45 degrees with the inner ring. In a specific implementation, the incident angle is equal to about 20 degrees.

[0017] In some cases, the thickness of the inner wall is less than the thickness of the outer wall.

[0018] In certain implementations, a ratio of the thickness of the inner wall to the thickness of the outer wall is equal to about 1:1 to about 1:3.

[0019] In particular aspects, at least one of the inner wall or the outer wall flexes in response to a compressive force of about 30 Newtons (N) to about 230 N, and the force element has a spring constant of about 20-90 N / millimeter (mm) from a rest state until the flexion point, about 0 N / mm to about -60 N / mm during flexion, and about 20 N / mm to about 400 N / mm shortly after flexion.

[0020] In some implementations, the outer ring is sized to contact an underside of a component in the housing, and the inner ring is sized to contact a circuit board beneath the component.

[0021] In some cases, the outer ring, the outer wall, the inner ring, the inner wall and the central platform are unitary and formed from a material selected from the group consisting of silicone, ethylene propylene diene monomer (EPDM) or a fluoroelastomer.

[0022] In some cases, the fluoroelastomer includes FKM.

[0023] In certain implementations, the material is flexible and stable within a range of about -40 degrees Celsius to about 125 degrees Celsius and has a low compression set.

[0024] In some aspects, the outer ring contacts a side of the device component and the inner ring contacts a circuit board.

[0025] In a particular case, the circuit board contacts a quad flat package (QFP) chip on the opposite side from that contacting the force element.

[0026] In a particular case, the QFP chip is located below the contact area of ​​the inner ring on the opposite side of the circuit board, and below the QFP chip is a heat sink. In various specific implementations, the force element absorbs the force applied to the side of the device component to protect the QFP chip.

[0027] In some implementations, the electronic device includes an audio device.

[0028] Two or more features described in this disclosure, including those described in this Summary, can be combined to form implementations not specifically described herein.

[0029] The details of one or more implementations are discussed in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent in the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Shown are cross-sectional perspective views of force elements according to various implementations.

[0031] Figure 2 A circuit board coupled to the circuit board according to various embodiments is shown. Figure 1 Perspective view of the force element.

[0032] Figure 3 Shows Figure 1 and Figure 2 Plan view of the force element.

[0033] Figure 4 yes Figures 1 to 3 Cross-sectional view of a portion of a force element.

[0034] Figure 5 is a graph illustrating buckling characteristics of a force element according to various exemplary implementations.

[0035] Figure 6 Cross-sectional views of electronic devices including force elements are shown according to various implementations.

[0036] It should be noted that the drawings of various embodiments are not necessarily drawn to scale. The drawings are intended only to illustrate typical aspects of the present disclosure and therefore should not be considered to limit the scope of the embodiments. In the drawings, similar numbers represent similar elements between the drawings. DETAILED DESCRIPTION

[0037] The disclosure is based at least in part on the recognition that a force element having a double-conical structure can be used in an electronic device to limit the force applied to a force-sensitive component. For example, a force element having an inner ring, an outer ring, and corresponding walls can be positioned in an electronic device (such as an audio device) to absorb forces applied to one or more components. In some cases, when the inner wall reaches a vertical compression limit, the inner wall transfers the compressive force applied to the force element to the outer wall. The force element disclosed in accordance with various specific embodiments is configured to flex within a greater force range than conventional force elements, thereby allowing improved impact protection compared to those conventional devices.

[0038] For purposes of illustration, components generally labeled in the drawings are considered to be substantially equivalent components, and redundant discussion of those components is omitted for clarity. Numerical ranges and values ​​described according to various implementations are merely examples of such ranges and values, and are not intended to limit those implementations. In some cases, the term "approximately" is used to modify a value, and in these cases, may refer to a value + / - a margin of error (such as measurement error), which may be in the range of up to 1% to 5%.

[0039] Figure 1 A cut-away perspective view of a force element 10 is shown according to various implementations. Figure 2 A perspective view of a force element 10 coupled to a circuit board 20 is shown, for example, in a portion of an electronic device. Figure 3 There is shown a plan view of the force element 10. Reference is made to these drawings simultaneously.

[0040] In certain instances, the force element 10 is shown to include an outer ring 30 and an inner ring 40, each surrounding a central axis (A). The outer ring 30 is shown to have a first diameter (D1), and the inner ring is shown to have a second diameter (D2). In some instances, D1 and D2 are measured as the inner diameter (ID) of the rings 30, 40, however, in other instances, D1 and D2 are measured from a centerline through each of the rings 30, 40. In any case, the second diameter (D2) is smaller than the first diameter (D1).

[0041] In some implementations, the force element 10 further includes an outer wall 50 that connects the radially inner portion 60 of the outer ring 30 with the radially outer portion 70 of the inner ring 40. In these cases, the force element 10 further includes an inner wall 80 extending from the radially inner portion 90 of the inner ring 40. Figures 1 to 3As shown, the inner wall 80 is located radially inwardly of the outer wall 50. It should be understood that the terms "inside" and "outside" are used to describe the radial position of components relative to the central axis (A), such that components located radially inwardly of different components relative to the axis (A) are closer to the central axis (A) on a radial (perpendicular) line extending from the axis (A).

[0042] like Figures 1 to 3 As shown, in various implementations, the force element 10 further includes a central platform 100 extending from the inner wall 80 around the central axis (A). In some implementations, the central platform 100 is substantially coplanar with the upper surface 110 of the outer ring 30. That is, the upper surface 120 of the central platform 100 is located at substantially the same height (or axial position, such as along the direction of the central axis (A)) as the upper surface 110 of the outer ring 30. Figure 4 1 shows a cross-sectional view of a portion of the force element 10, which shows one implementation in which the upper surface 120 of the central platform 100 is substantially coplanar with the upper surface 110 of the outer ring 30. However, in other implementations, the central platform 100 is axially offset from the outer ring 30. In some exemplary implementations, the central platform 100 includes a central disk, for example, Figure 3 In other cases, the central platform 100 adopts a different shape, such as an oval, oblong, rectangular or irregular shape.

[0043] like Figure 1 and Figure 2 , in some cases, the inner wall 80 is shaped as a cone and converges from the radially inner portion 90 of the inner ring 40 toward the central platform 100. That is, the inner wall 80 is located radially inward of the outer ring 30 (relative to the central axis (A)), and there is a gap 130 between the inner wall 80 and the outer wall 50. In some cases, the gap 130 is defined by the divergence of the inner wall 80 and the outer wall 50 from the inner ring 40.

[0044] Specifically turn to Figure 1 and Figure 4 , with a particular focus on Figure 4 , which shows additional examples of dimensions of the force element 10. In some aspects, the outer wall 50 has an incident angle (α iOW ), the incident angle is about 10 degrees to about 45 degrees, and the inner wall 80 has an incident angle (α iIW ), the incident angle is about 10 degrees to about 45 degrees. In a specific implementation, the incident angle is equal to about 20 degrees. In some examples, the thickness (T IW ) is smaller than the thickness (T OW). However, in various implementations, these thicknesses may be substantially equal. In a particular exemplary implementation, the thickness (T IW ) and the thickness of the outer wall 50 (T OW ) is equal to about 1:1 to about 1:3.

[0045] In some cases, the force element 10 is a one-piece component. In these cases, the outer ring 30, the outer wall 50, the inner ring 40, the inner wall 80 and the central platform 100 are integral, i.e., formed as a single component, such as by an additive manufacturing process, casting, molding, etc. In other cases, the force element is composed of separately formed parts that are bonded together, for example, with an adhesive. In some specific implementations, the force element 10 is formed of a material selected from the following items: silicone, ethylene propylene diene monomer (EPDM) or a fluoroelastomer (e.g., FKM). In these cases, the force element 10 can be one-piece. According to various specific implementations, the material constituting the force element is flexible and stable at about -40 degrees Celsius to about 125 degrees Celsius, and has a low compression set, for example, about 25% or less, and in certain cases, about 10% or less.

[0046] In a specific implementation, such as Figure 1 As shown, a vertical cross-section of the force element 10 (taken along a plane intersecting and extending parallel to the central axis (A)) in a stationary state approximates a "W". In this sense, in a stationary state, the inner ring 40 and the outer ring 30 are axially offset and radially offset relative to each other. That is, the inner ring 40 and the outer ring 30 are axially and radially positioned at different positions (i.e., relative to the main axis (A)).

[0047] In certain implementations, when the inner wall 80 reaches a vertical compression limit, the inner wall 80 transfers the compressive force applied to the force element 10 to the outer wall 50. In some examples, at least one of the inner wall 80 or the outer wall 50 buckles in response to a compressive force of about 30 Newtons (N) to about 230 N. In certain exemplary implementations, the force element 10 has a spring constant of about 20-90 N / millimeter (mm) from rest until the buckling point, about 0 N / mm to about -60 N / mm during buckling, and about 20 N / mm to about 400 N / mm shortly after buckling. Figure 5 A graphical representation 500 illustrating the concept of a spring constant in a force element is shown. That is, the representation 500 illustrates the characteristics of buckling in a force element, such as the force element 10, according to various implementations. The spring constant is illustrated in the representation 500 using a relationship between force and displacement, for example, where the force is in Newtons and the displacement is in millimeters. In this exemplary depiction, the static state can be illustrated as zero, i.e., the zero point on the representation 500, where both the force and the displacement are equal to zero.

[0048] Figure 6 1 shows a cross-sectional view of a portion of an exemplary electronic device 140 according to various implementations. In some examples, the electronic device 140 is a circuit board 20 (e.g., Figure 2 1 and 12) to control audio functions such as digital signal processing and amplification. In various embodiments, the circuit board 20 is located below the force element 10. In certain cases, the inner ring 40 is sized to contact the circuit board 20, such as a specific circuit on the circuit board 20. In these cases, the outer ring 30 is sized to contact the underside 150 of a component 160 (separate from the circuit board 20) in the electronic device. In some embodiments, the component 160 includes a portion of a device housing, such as a cover (e.g., a back cover), which can be coupled to other components in the electronic device 140 using conventional fasteners. As shown in FIG. Figure 6 As shown in the exemplary electronic device 140 in FIG. 1 , a quad flat package (QFP) chip 170 is coupled to the circuit board 20 on a side of the circuit board 20 opposite to the force element 10. It should be understood that the QFP chip 170 is only one of a variety of possible chips that can be positioned below the circuit board 20 and benefit from the presence of the force element 10. In certain cases, the QFP chip 170 is located below the contact area of ​​the inner ring 40 on the opposite side of the circuit board 20. For example, in various specific implementations, the outer dimensions of the inner ring 40 are approximately equal to the outer dimensions of the QFP chip 170 when measured in the radial direction. According to some specific implementations, the electronic device 140 also includes a heat sink 180 located below the QFP chip 170. In this exemplary configuration, the QFP chip 170 is susceptible to damage by forces (e.g., compressive forces). That is, in various specific implementations, the force element 10 limits the force applied to the upper side 190 of the device component 160 to protect the QFP chip 170.

[0049] It should be understood that in additional implementations, the force element 10 can be inverted or otherwise reoriented to protect specific components in a device (e.g., electronic device 140). That is, the force element 10 can be reoriented so that the outer ring 30 is positioned above the inner ring 40, or can be rotated to any orientation suitable for protecting components in the device. In some optional implementations, the force element 10 includes a vent 200 ( Figure 2 , Figure 3 ) or other openings for allowing airflow through the force element 10 during compression. In some cases, the vent 200 is a radially extending slot that traverses at least a portion of the upper surface 110 of the outer ring 30.

[0050] Compared to conventional force elements such as springs, foams, or compressible buttons, the force element 10 is configured to limit force by allowing buckling at both the outer wall 50 and the inner wall 80. That is, the double-walled (or double-conical) structure of the force element 10 allows the compressive force to be transferred between the two walls, increasing the allowable buckling point force on the force element 10 compared to conventional force elements while maintaining a compact geometric structure. In the specific examples described herein, when the inner wall 80 reaches the vertical compression limit, the inner wall 80 transfers the compressive force applied to the force element 10 to the outer wall 50. In these examples, the inner wall 80 transfers the initial force required to support the inner ring 40 until the outer wall 50 buckles, and the inner wall 80 then buckles after reaching its vertical compression limit. In any case, the force element 10 is configured to absorb greater forces over a longer period of time than conventional force elements.

[0051] One or more components of the electronic devices described herein may be formed from any conventional electronic device material, such as heavy plastic, metal (e.g., aluminum or alloys such as aluminum alloys), composite materials, etc. It should be understood that the relative proportions, sizes, and shapes of the transducer and its components and features as shown in the drawings included herein may be merely illustrative of such physical properties of these components. That is, these proportions, shapes, and sizes may be modified according to various specific implementations to suit various products.

[0052] In various implementations, components described as being "coupled" to one another may be joined along one or more interfaces. In some implementations, these interfaces may include joints between different components, and in other cases, these interfaces may include solid and / or integrally formed interconnects. That is, in some cases, components that are "coupled" to one another may be formed simultaneously to define a single continuous component. However, in other implementations, these coupled components may be formed as separate components and subsequently joined by known processes (e.g., welding, fastening, ultrasonic welding, bonding).

[0053] A number of implementations have been described. However, it should be understood that additional modifications may be made without departing from the scope of the inventive concepts described herein, and therefore, other implementations are within the scope of the following claims.

Claims

1. A force element for an electronic device, the force element comprising: an outer ring surrounding the central axis and comprising a first diameter; an inner ring surrounding the central axis and comprising a second diameter that is smaller than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from a radially inner portion of the inner ring and located radially inward of the outer wall; and a central platform extending from the inner wall about the central axis; wherein the inner wall is shaped as a cone and converges from the radially inner portion of the inner ring toward the central platform, wherein the inner wall is located radially inward of the outer ring relative to the central axis, wherein a gap exists between the inner wall and the outer wall, and wherein an upper surface of the central platform is coplanar with an upper surface of the outer ring. 2 . The force element according to claim 1 , wherein the inner ring and the outer ring are axially offset and radially offset relative to each other in a static state.

3. The force element according to claim 2, wherein a vertical cross-section of the force element is approximately "W"-shaped in the static state.

4. The force element of claim 1, wherein the inner wall transfers the compressive force applied to the force element to the outer wall when the inner wall reaches a vertical compression limit.

5. The force element of claim 1, wherein the outer wall has an incident angle of 10 to 45 degrees with the inner ring, and wherein the inner wall has an incident angle of 10 to 45 degrees with the inner ring. The force element according to claim 5 , wherein the thickness of the inner wall is smaller than the thickness of the outer wall.

7. The force element according to claim 6, wherein a ratio of the thickness of the inner wall to the thickness of the outer wall is equal to 1:1 to 1:

3.

8. A force element according to claim 1, wherein at least one of the inner wall or the outer wall bends in response to a compressive force of 30 Newtons (N) to 230N, and wherein the force element has a spring constant of 20-90N / millimeter (mm) from a stationary state until the flexion point, 0N / mm to -60N / mm during flexion, and 20N / mm to 400N / mm shortly after flexion.

9. The force element of claim 1, wherein the outer ring is sized to contact an underside of a component in a housing, and wherein the inner ring is sized to contact a circuit board beneath the component.

10. The force element of claim 1, wherein the outer ring, the outer wall, the inner ring, the inner wall, and the center platform are integral and formed from a material selected from the group consisting of silicone, ethylene propylene diene monomer (EPDM), or a fluoroelastomer.

11. An electronic device, comprising: Circuit boards; a device component, the device component being separate from the circuit board; and A force element, the force element being located between the device component and the circuit board, the force element comprising: an outer ring surrounding the central axis and comprising a first diameter; an inner ring surrounding the central axis and comprising a second diameter that is smaller than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from a radially inner portion of the inner ring and located radially inward of the outer wall; and a central platform extending from the inner wall about the central axis; wherein the inner wall is shaped as a cone and converges from the radially inner portion of the inner ring toward the central platform, wherein the inner wall is located radially inward of the outer ring relative to the central axis, wherein a gap exists between the inner wall and the outer wall, and wherein an upper surface of the central platform is coplanar with an upper surface of the outer ring.

12. The electronic device of claim 11, wherein the inner ring and the outer ring are vertically offset and radially offset relative to each other in a static state, and wherein a vertical cross-section of the force element approximates a "W" shape in the static state.

13. The electronic device of claim 11, wherein when the inner wall reaches a vertical compression limit, the inner wall transfers the compressive force applied to the force element to the outer wall.

14. An electronic device according to claim 11, wherein the outer wall has an incident angle of 10 degrees to 45 degrees with the inner ring, wherein the inner wall has an incident angle of 10 degrees to 45 degrees with the inner ring, and wherein the ratio of the thickness of the inner wall to the thickness of the outer wall is equal to 1:1 to 1:

3.

15. An electronic device according to claim 11, wherein at least one of the inner wall or the outer wall bends in response to a compressive force of 30 Newtons (N) to 230N, and wherein the force element has the following spring constant: 20-90N / millimeter (mm) from a static state until the flexion point, 0N / mm to -60N / mm during flexion, and 20N / mm to 400N / mm shortly after flexion.

16. The electronic device of claim 11, wherein the outer ring contacts a side of the device component, wherein the inner ring contacts the circuit board, and wherein the electronic device comprises an audio device.

17. The electronic device of claim 11, wherein the outer ring, the outer wall, the inner ring, the inner wall, and the central platform are integral and formed from a material selected from the group consisting of silicone, ethylene propylene diene monomer (EPDM), or a fluoroelastomer.

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