electronic devices

Abstract

An electronic device comprises a substrate (1), a signal wiring (100), and a heat dissipation wiring (150). The substrate comprises a surface (1a) and a surface (1b) opposite to the surface. The signal wiring is formed on an insulating layer (101) of the substrate. The heat dissipation wiring is formed on the insulating layer and is thermally connected to the signal wiring on the same plane as the signal wiring.

Description

Technical Field

[0001] The present disclosure relates to an electronic device having signal wiring. Background Art

[0002] Conventionally, electronic devices with signal wiring have been proposed. For example, Patent Document 1 proposes a power conversion device as an electronic device. Specifically, the power conversion device includes a primary winding and a secondary winding as signal wiring. An insulating plate is provided between the primary and secondary windings. Furthermore, the power conversion device includes a heat sink disposed on the primary winding. The power conversion device is constructed by stacking the secondary winding, insulating plate, primary winding, and heat sink, thereby forming an integral molded resin structure.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent document 1: JP 2019-165148 A. Summary of the Invention

[0006] For such electronic devices, it is desired to further improve their heat dissipation performance.

[0007] In view of the above points, an object of the present disclosure is to provide an electronic device capable of improving heat dissipation performance.

[0008] According to one aspect of the present disclosure, an electronic device includes a substrate having one surface and another surface opposite the one surface. Signal wiring is formed on an insulating layer of the substrate. Heat dissipation wiring formed on the insulating layer is thermally connected to the signal wiring on the same plane as the signal wiring.

[0009] Therefore, since the heat dissipation wiring is arranged on the same plane as the signal wiring, it is easy to arrange the signal wiring and the heat dissipation wiring closely together. Therefore, heat can be easily dissipated from the signal wiring through the heat dissipation wiring. Therefore, the heat dissipation performance can be improved.

[0010] Reference numerals attached to each component or the like indicate an example of a corresponding relationship between the component or the like and specific components or the like described in the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a perspective view of a power conversion apparatus according to a first embodiment.

[0012] Figure 2 This is the circuit diagram of the transformer.

[0013] Figure 3 is an exploded perspective view of the transformer configuration area.

[0014] Figure 4AThis is a plan view of the first constituent layer.

[0015] Figure 4B This is a plan view of the second constituent layer.

[0016] Figure 4C This is a plan view of the third constituent layer.

[0017] Figure 5A It is along Figure 1 A cross-sectional view taken along line VA-VA in FIG.

[0018] Figure 5B It is along Figure 1 A cross-sectional view taken along line VB-VB in FIG.

[0019] Figure 6 is a diagram for explaining problems that may occur when heat dissipation wiring is not divided.

[0020] Figure 7 is an exploded perspective view of a transformer arrangement area in a modification of the first embodiment.

[0021] Figure 8A is a plan view of the second constituent layer in the second embodiment.

[0022] Figure 8B is a plan view of the third constituent layer in the second embodiment.

[0023] Figure 9A is a plan view of the second constituent layer in the third embodiment.

[0024] Figure 9B is a plan view of the third constituent layer in the third embodiment.

[0025] Figure 10 is a perspective view of a power conversion apparatus according to a fourth embodiment.

[0026] Figure 11 It is an exploded perspective view of the pressing member, one side heat dissipation member, the transformer placement area, and the other side heat dissipation member.

[0027] Figure 12 It is along Figure 10 A cross-sectional view taken along line XII-XII in FIG.

[0028] Figure 13 is a perspective view of a power conversion apparatus according to a fifth embodiment.

[0029] Figure 14 is a perspective view of a power conversion apparatus according to a modification of the fifth embodiment.

[0030] Figure 15 A diagram for explaining problems that may occur when a printed circuit board is fixed to a housing.

[0031] Figure 16 is a schematic cross-sectional view of a power conversion apparatus according to a sixth embodiment.

[0032] Figure 17 is a schematic cross-sectional view of a power conversion device according to a modification of the sixth embodiment.

[0033] Figure 18 is a plan view of the first constituent layer in the seventh embodiment.

[0034] Figure 19 is an exploded perspective view of a transformer arrangement area according to an eighth embodiment.

[0035] Figure 20 is a circuit diagram of a transformer according to another embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the embodiments, the same or equivalent components are denoted by the same reference numerals.

[0037] (First embodiment)

[0038] A first embodiment will be described with reference to the accompanying drawings. In this embodiment, a power conversion device having a transformer T is described as an electronic device.

[0039] like Figure 1 As shown, the power conversion device of this embodiment includes a printed circuit board 1 and a housing 2. The printed circuit board 1 of this embodiment is a multilayer board in which signal wiring 100 made of copper or the like and insulating layers 101 made of epoxy resin or the like are alternately stacked. The printed circuit board 1 has one surface 1a and another surface 1b.

[0040] The printed circuit board 1 has a transformer arrangement area 10, which is a predetermined portion for a transformer T coil. The transformer arrangement area 10 is provided with a core 20 forming a transformer. Figure 1 Although omitted, electronic components such as capacitors are appropriately mounted on the printed circuit board 1 in an area different from the transformer arrangement area 10 .

[0041] like Figure 2As shown, the transformer T of the present embodiment has first to third coils 31 to 33. The first coil 31 has one end connected to the first connecting wire 41 and the other end connected to the second connecting wire 42. The first coil 31 is connected to an AC circuit (not shown) via the first connecting wire 41 and the second connecting wire 42. The second coil 32 and the third coil 33 are connected in series. The third connecting wire 43 is connected to the end of the second coil 32 opposite to the third coil 33. The fourth connecting wire 44 is connected to the end of the third coil 33 opposite to the second coil 32. The second coil 32 and the third coil 33 are connected to a rectifier circuit or the like (not shown) via the third connecting wire 43 and the fourth connecting wire 44. In addition, in the present embodiment, a fifth connecting wire 45 is connected between the second coil 32 and the third coil 33. As will be described below, the fifth connecting wire 45 is connected to the housing 2 and maintained at ground potential.

[0042] The signal wiring 100 is formed in the transformer arrangement region 10 of the printed circuit board 1 so as to form the first to third coils 31 to 33 and the first to fifth connection lines 41 to 45. Hereinafter, the transformer arrangement region 10 of the present embodiment will be described in detail.

[0043] like Figure 3 、 4A As shown in FIG4C, FIG5A and FIG5B, the transformer arrangement area 10 of the present embodiment is configured by stacking the first to fourth constituent layers 110, 120, 130 and 140. A portion of the printed circuit board 1 forms the transformer arrangement area 10. Figure 3 , the transformer arrangement region 10 is integrally formed using the first to fourth constituent layers 110, 120, 130, and 140. Similarly to the transformer arrangement region 10, the printed circuit board 1 is configured by stacking the first to fourth constituent layers 140. Hereinafter, when the description refers only to the first to fourth constituent layers 110, 120, 130, 140, it refers to the first to fourth constituent layers 110, 120, 130, 140 in the transformer arrangement region 10.

[0044] The first to third constituent layers 110, 120, and 130 include signal wiring 100 and insulating layer 101. The fourth constituent layer 140 includes signal wiring 100. The signal wiring 100 in the first to fourth constituent layers 110, 120, 130, and 140 are appropriately electrically connected via connection vias 102 formed in the first to third constituent layers 110, 120, and 130. The fourth constituent layer 140 has signal wiring 100 formed on the side of the insulating layer 101 of the third constituent layer 130 opposite to the second constituent layer 120. Therefore, it can be said that the insulating layer 101 in the third constituent layer 130 is shared by the third constituent layer 130 and the fourth constituent layer 140.

[0045] The first to third constituent layers 110, 120, and 130 have one central through-hole 101a and two peripheral through-holes 101b that penetrate the insulating layer 101 in the thickness direction. Specifically, the central through-hole 101a is formed in the substantially central portion of the first to third constituent layers 110, 120, and 130, and is interposed between the two peripheral through-holes 101b in the first to third constituent layers 110, 120, and 130. More specifically, the central through-hole 101a and the peripheral through-holes 101b are formed in positions and sizes such that the legs 21b, 21c, 22b, and 22c (described later) of the first core 21 or the second core 22 can be inserted.

[0046] First component layer 110 includes upper primary winding 111 arranged on insulating layer 101 around central through-hole 101a, serving as signal wiring 100 forming part of first coil 31 in transformer T. Upper primary winding 111 of this embodiment has four turns and is width-sized to accommodate four turns. Upper primary winding 111 is arranged between central through-hole 101a and peripheral through-holes 101b.

[0047] The first component layer 110 includes a first lead-out wiring 112, which forms the first connecting line 41, serving as the signal wiring 100. The lead-out wiring 112 extends from the upper primary winding 111 at the end opposite the central through-hole 101a. The first component layer 110 includes a third connecting wiring 113 and a fourth connecting wiring 114, serving as the signal wiring 100, on the side opposite the first lead-out wiring 112 through the central through-hole 101a. The third connecting wiring 113 is connected to a third lead-out wiring 122 (described later) formed in the second component layer 120 via a connecting via 102. The fourth connecting wiring 114 is connected to a fourth connecting wiring 124 (described later) formed in the second component layer 120 via a connecting via 102.

[0048] Second component layer 120 includes secondary winding 121, which serves as signal wiring 100 for second coil 32 in transformer T. Secondary winding 121 is arranged on insulating layer 101 around central through-hole 101a. In this embodiment, secondary winding 121 has one turn and a width corresponding to one turn. Secondary winding 121 is disposed between central through-hole 101a and peripheral through-holes 101b.

[0049] The second component layer 120 has a third lead-out wiring 122 serving as the signal wiring 100 to form a third connection line 43. The third lead-out wiring 122 is led out from one end of the secondary winding 121. The second component layer 120 has a fifth lead-out wiring 123 leading out from the other end of the secondary winding 121 to form a fifth connection line 45 serving as the signal wiring 100. The fifth lead-out wiring 123 has a fastening hole 123a into which a fastening member 60 (to be described later) is inserted. The fastening hole 123a is formed to penetrate the fifth lead-out wiring 123 and the insulating layer 101. In addition, in this embodiment, the third lead-out wiring 122 corresponds to the first end lead-out wiring, and the fifth lead-out wiring 123 corresponds to the second end lead-out wiring. The second component layer 120 has a fourth connection wiring 124, which is connected to a fourth lead-out wiring 132 (to be described later) formed in the third component layer 130 via a connection via 102.

[0050] The third lead-out wiring 122 and the fifth lead-out wiring 123 of the present embodiment are formed on the same side as the third connection wiring 113 and the fourth connection wiring 114 in the first constituent layer 110. In other words, the third lead-out wiring 122 and the fifth lead-out wiring 123 are located at a position opposite to a portion of the second constituent layer 120 that faces the first lead-out wiring 112 in the first constituent layer 110 through the central through-hole 101a.

[0051] The third component layer 130 includes a tertiary winding 131 arranged on the insulating layer 101 around the central through hole 101a, serving as the signal wiring 100 constituting the third coil 33 of the transformer T. In this embodiment, the tertiary winding 131 has one turn and a width corresponding to one turn. The tertiary winding 131 is arranged between the central through hole 101a and the peripheral through holes 101b.

[0052] The third constituent layer 130 has a fourth lead-out wiring 132 that forms a fourth connecting line 44 and is led out from one end of the third-level winding 131, serving as a signal wiring 100. The third constituent layer 130 has a fifth lead-out wiring 133 that forms a fifth connecting line 45 and is led out from the other end of the third-level winding 131, serving as a signal wiring 100. The fifth lead-out wiring 133 has a fastening hole 133a into which a fastener 60 (to be described later) is inserted. The fastening hole 133a is formed to penetrate the fifth lead-out wiring 133 and the insulating layer 101. In addition, in this embodiment, the fourth lead-out wiring 132 corresponds to the first-end lead-out wiring, and the fifth lead-out wiring 133 corresponds to the second-end lead-out wiring. The third constituent layer 130 has a third connection wiring 134 (to be described later) that is connected to the third connection wiring 143 of the fourth constituent layer 140 via a connection via 102.

[0053] The fourth lead-out wiring 132 and the fifth lead-out wiring 133 of the present embodiment are formed on the same side as the third connection wiring 113 and the fourth connection wiring 114 in the first constituent layer 110. In other words, the fourth lead-out wiring 132 and the fifth lead-out wiring 133 are positioned opposite to a portion of the third constituent layer 120 that faces the first lead-out wiring 112 in the first constituent layer 110 through the central through-hole 101a.

[0054] Fourth component layer 140 is arranged on the side of third component layer 130 opposite the surface of insulating layer 101 on which third primary winding 131 is formed. Fourth component layer 140 includes lower primary winding 141, serving as signal wiring 100, arranged around central through-hole 101a formed in insulating layer 101 of third component layer 130. Lower primary winding 141 of this embodiment has four turns and is wide enough to accommodate four turns. Lower primary winding 141 is arranged between central through-hole 101a and peripheral through-holes 101b formed in third component layer 130. The other end of lower primary winding 141, adjacent to central through-hole 101a, is electrically connected to the other end of upper primary winding 111, adjacent to central through-hole 101a, via connecting vias 102 formed in first to third component layers 110, 120, and 130. Thus, first coil 31 of this embodiment consists of upper primary winding 111 and lower primary winding 141.

[0055] The fourth component layer 140 has a second lead-out wiring 142 as the signal wiring 100, which is led out from the end of the lower primary winding 141 opposite to the center through hole 101a to form the second connection line 42. The fourth component layer 140 has a third connection wiring 143 and a fourth connection wiring 144 as the signal wiring 100. The third connection wiring 143 is connected to the third connection wiring 134 of the third component layer 130 via the connection via 102, and the fourth connection wiring 144 is connected to the fourth lead-out wiring 132 via the connection via 102.

[0056] The second lead-out wiring 142 is formed on the same side as the first lead-out wiring 112 in the first constituent layer 110. Furthermore, the third connection wiring 143 and the fourth connection wiring 144 are formed on the side opposite to the second lead-out wiring 142 through the central through hole 101a.

[0057] In this embodiment, as described above, the first coil 31 is configured by the primary windings 111 and 141 formed in the first and fourth constituent layers 110 and 140. The second coil 32 is configured by the secondary winding 121 formed on the second constituent layer 120. The third coil 33 is formed by the tertiary winding 131 formed in the third constituent layer 130. In addition, the first connecting line 41 is formed by the first lead-out wiring 112 formed in the first constituent layer 110. The second connecting line 42 is formed by the second lead-out wiring 142 formed in the fourth constituent layer 140. The third connecting line 43 is formed by the third lead-out wiring 122 formed in the second constituent layer 120. The fifth connecting line 45 is formed by the fifth lead-out wiring 123. The fourth connecting line 44 is formed by the fourth lead-out wiring 132 in the third constituent layer 130. The fifth connecting line 45 is formed by the fifth lead-out wiring 133.

[0058] Furthermore, the first to fourth component layers 140 have heat dissipation wiring 150. Specifically, the first component layer 110 has heat dissipation wiring 150 arranged on the insulating layer 101 around the upper primary winding 111, so as to be thermally connected to the upper primary winding 111. The second component layer 120 has heat dissipation wiring 150 around the secondary winding 121, thermally connected to the secondary winding 121. The third component layer 130 has heat dissipation wiring 150 around the tertiary winding 131, thermally connected to the tertiary winding 131. The fourth component layer 140 has heat dissipation wiring 150 around the lower primary winding 141, thermally connected to the lower primary winding 141. In other words, each of the first to fourth component layers 140 has heat dissipation wiring 150 on the same plane as the windings 111, 121, 131, and 141. Heat dissipation wiring 150 is made of copper, for example, similar to the signal wiring 100.

[0059] Each heat dissipation wiring 150 has a fastening hole 151 for inserting a fastening member 60 (to be described later). Specifically, each heat dissipation wiring 150 is divided as described below, and a fastening hole 151 is formed in each divided area. The fastening hole 151 is formed to penetrate the heat dissipation wiring 150 and the insulating layer 101. In addition, the fastening holes 151 in the heat dissipation wiring 150 of the first to fourth component layers 110, 120, 130 and 140 are formed at the same position in the normal direction relative to one surface 1a of the printed circuit board 1. The heat dissipation wiring 150 formed in the first to fourth component layers 110, 120, 130 and 140 are thermally connected to each other via the connection via 102. That is, each heat dissipation wiring 150 formed in the second to fourth component layers 120, 130, 140 is thermally connected to the heat dissipation wiring 150 formed in the first component layer 110. In other words, each heat dissipation wiring 150 formed in the first to third constituent layers 110 to 130 is thermally connected to the heat dissipation wiring 150 formed in the fourth constituent layer 140 .

[0060] The core 20 of the printed circuit board 1 is made of a magnetic material such as ferrite and includes a first core 21 and a second core 22. In this embodiment, the first core 21 has a base 21a, an inner leg 21b extending from the base 21a, and a pair of outer legs 21c extending from the base 21a. The second core 22 has a base 22a, an inner leg 22b extending from the base 22a, and a pair of outer legs 22c extending from the base 22a.

[0061] The bases 21a, 22a have a flat plate shape with one longitudinal direction. Inner legs 21b, 22b protrude from the longitudinal center of the bases 21a, 22a in a direction normal to the surface of the bases 21a, 22a. A pair of outer legs 21c, 22c protrude from both longitudinal ends of the bases 21a, 22a in a direction normal to the surface of the bases 21a, 22a. In other words, each of the first core 21 and the second core 22 of this embodiment is a so-called E-type core.

[0062] The first core 21 is arranged so that its inner leg 21b is inserted into the central through-hole 101a from one surface 1a of the printed circuit board 1, and each outer leg 21c is inserted into each peripheral through-hole 101b. The second core 22 is arranged so that its inner leg 22b is inserted into the central through-hole 101a from the other surface 1b of the printed circuit board 1, and each outer leg 22c is inserted into each peripheral through-hole 101b. In other words, the first core 21 and the second core 22 are arranged opposite each other. As a result, a closed magnetic circuit is formed in the transformer arrangement area 10. The protruding heights of the inner legs 21b and 22b and the outer legs 21c and 22c are adjusted so that when the first core 21 and the second core 22 are arranged on the printed circuit board 1, the inner legs 21b and 22b contact each other, and the outer legs 21c and 22c contact each other.

[0063] Furthermore, in this embodiment, a heat dissipation member 50 made of an insulating material having high thermal conductivity is arranged between the core 20 and the printed circuit board 1. The heat dissipation member 50 is composed of heat dissipation grease, heat dissipation gap filler, heat dissipation putty sheet, heat dissipation gel sheet, etc.

[0064] The heat dissipation wiring 150 of the present embodiment is formed in each winding 111, 121, 131, 141, and is divided at the portion where each lead-out wiring 112, 122, 123, 132, 133, 142 is formed. The heat dissipation wiring 150 of the present embodiment is further divided into a plurality of regions in the normal direction relative to the surface direction of the printed circuit board 1. Specifically, the windings 111, 121, 131, 141 are arranged on the inner side of the core 20 in the normal direction relative to the surface direction of the printed circuit board 1, and the heat dissipation wiring is formed at a position surrounding the outer periphery of the windings 111, 121, 131, 141 positioned in the core 20. In addition, as Figure 4AAs shown, heat dissipation wiring 150 of first component layer 110 is divided into a region located on one side of core 20 and a region located on the other side of core 20, with respect to a virtual line K passing through upper primary winding 111 and extending in one direction along the surface of printed circuit board 1. In other words, heat dissipation wiring 150 is divided around upper primary winding 111 so as not to form a winding and is arranged so as not to function as a coil. In this embodiment, heat dissipation wiring 150 is divided into a region located on one side of core 20 and a region located on the other side of core 20 in the portion overlapping with core 20.

[0065] Similarly, the heat dissipation wiring 150 of the second and third constituent layers 120 and 130 are separated in the same manner as the heat dissipation wiring 150 of the first constituent layer 110. That is, as Figure 4B or Figure 4C As shown, the heat dissipation wiring 150 of the second and third constituent layers 120 and 130 is divided into a region located on one side of the core 20 and a region located on the other side of the core 20 with respect to a virtual line K extending in one direction along the surface direction of the printed circuit board 1. In addition, although the details of the heat dissipation wiring 150 of the fourth constituent layer 140 are not shown, as shown in FIG. Figure 3 As shown, the heat dissipation wiring 150 is divided into a region located on one side of the core 20 and a region located on the other side of the core 20 with respect to a virtual line extending in one direction along the surface direction of the printed circuit board 1 .

[0066] The housing 2 is made of a conductive material and has a predetermined shape. The printed circuit board 1 is fixed to the housing by fastening members 60 such as screws so that the other surface 1b faces the housing 2. The housing 2 of this embodiment releases heat from the printed circuit board 1 and also serves as a heat sink.

[0067] Printed circuit board 1 is secured to housing 2 at a predetermined position on its outer periphery via fastening members 60. In transformer placement area 10, printed circuit board 1 is secured to housing 2 via fastening members 60, which pass through fastening holes 123a formed in fifth lead wire 123 of second component layer 120 and fastening holes 133a formed in fifth lead wire 133 of third component layer 130. As a result, fifth lead wires 123 and 133 are thermally and electrically connected to housing 2. Furthermore, in transformer placement area 10, printed circuit board 1 is secured to housing 2 via fastening members 60 inserted into fastening holes 151 formed in heat dissipation wire 150. Consequently, heat dissipation wire 150 formed in first component layer 110 is thermally connected to housing 2 via fastening members 60. Furthermore, since the heat dissipation wiring 150 formed in the second to fourth constituent layers 120, 130, and 140 is thermally connected to the heat dissipation wiring 150 formed in the first constituent layer 110, the printed circuit board 1 is thermally connected to the housing 2 via the heat dissipation wiring 150 formed in the first constituent layer 110 and the fastening member 60. That is, all the heat dissipation wiring 150 formed in the first to fourth constituent layers 110, 120, 130, and 140 are thermally connected to the housing 2 via the fastening member 60. Furthermore, as Figure 5B As shown, the fourth component layer 140 is arranged so that the heat dissipation wiring 150 of the fourth component layer 140 is in direct contact with the housing 2. The heat dissipation wiring 150 formed in the first to third component layers 110, 120, and 130 is thermally connected to the heat dissipation wiring 150 formed in the fourth component layer 140. Therefore, the heat dissipation wiring 150 formed in the first to third component layers 110, 120, and 130 is thermally connected to the housing 2 via the heat dissipation wiring 150 formed in the fourth component layer 140.

[0068] As described above, heat dissipation wiring 150 is divided into multiple regions. Furthermore, heat dissipation wiring 150 is divided according to the shape of signal wiring 100 in each of constituent layers 110, 120, 130, and 140. However, heat dissipation wiring 150 in each of constituent layers 110, 120, 130, and 140 is appropriately connected via connection vias 102. The positions of fastening members 60 and connection vias 102 connecting heat dissipation wiring 150 between constituent layers 110, 120, 130, and 140 are adjusted to ensure that all heat dissipation wiring 150 is thermally connected to housing 2.

[0069] The housing 2 of this embodiment has a holder 70 made of metal. One end of the holder 70 is positioned on the printed circuit board 1 and the other end is fixed. Then, the core 20 is placed on the printed circuit board 1 so as to be pressed by one end of the holder 70.

[0070] According to this embodiment, heat dissipation wiring 150 is arranged on the same plane as windings 111, 121, 131, 141 on printed circuit board 1. Therefore, heat dissipation wiring 150 can be easily arranged near windings 111, 121, 131, 141, thereby improving heat dissipation performance.

[0071] (1) In this embodiment, the transformer T is configured by using the printed circuit board 1 as a multilayer board. Therefore, compared with the case where components corresponding to the signal wiring 100, the insulating layer 101, the heat dissipation wiring 150, etc. in this embodiment are separately prepared and stacked, the size can be reduced.

[0072] (2) In this embodiment, the heat dissipation member 50 is arranged between the printed circuit board 1 and the core 20. Therefore, the heat of the printed circuit board 1 can be released from the core 20 via the heat dissipation member 50. In this embodiment, the core 20 is pressed against the holder 70. Therefore, the heat can be dissipated from the printed circuit board 1 to the housing 2 through the core 20 and the holder 70.

[0073] (3) In the present embodiment, with respect to a virtual line K extending in one direction along the surface direction of the printed circuit board 1, the heat dissipation wiring 150 is divided into an area located on one side of the core 20 and an area located on the other side of the core 20. That is, the heat dissipation wiring 150 is arranged so as not to function as a coil. Therefore, compared with the case where the heat dissipation wiring 150 is not divided in this manner, the loss of the transformer T can be reduced. That is, when the heat dissipation wiring 150 is not divided, the heat dissipation wiring 150 can function as a coil by forming the heat dissipation wiring 150 around the windings 111, 121, 131, 141. In this case, as Figure 6 As shown, the heat dissipation wiring 150 functions as a coil, causing a short-circuit current to flow through the heat dissipation wiring 150 , resulting in losses in the transformer T. In contrast, the heat dissipation wiring 150 of this embodiment is arranged so as not to function as a coil. Therefore, losses in the transformer T caused by the short-circuit current flowing through the heat dissipation wiring 150 can be suppressed.

[0074] (Modification of First Embodiment)

[0075] A modification of the first embodiment will be described. In the first embodiment, the configuration of the transformer configuration area 10 may be appropriately changed. For example, Figure 7 As shown, in the transformer configuration area 10, the first constituent layer 110 forming the primary winding 111 and the second constituent layer 120 forming the secondary winding 121 are stacked on each other. Figure 7An example is shown in which each of the primary winding 111 and the secondary winding 121 has one turn. Furthermore, although not specifically shown, the second coil 32 can be configured by connecting windings formed in different constituent layers, similarly to the first coil 31. Similarly, the third coil 33 can be configured by connecting windings formed in different constituent layers, similarly to the first coil 31.

[0076] (Second embodiment)

[0077] The second embodiment will be described below. This embodiment is a modification of the first embodiment, in which the configurations of the second constituent layer 120 and the third constituent layer 130 are changed. The description of the same configurations and processes as the first embodiment will not be repeated below.

[0078] In the power conversion device of this embodiment, as Figure 8A As shown, in the second constituent layer 120, the fifth lead-out wiring 123 and the heat dissipation wiring 150 are connected to each other. Figure 8B As shown, the fifth lead-out wiring 133 and the heat dissipation wiring 150 are connected to each other in the third constituent layer 130. That is, a part of the heat dissipation wiring 150 of this embodiment functions as the signal wiring 100.

[0079] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0080] (1) In this embodiment, fifth lead wiring 123 and heat dissipation wiring 150 are connected in second component layer 120. Fifth lead wiring 133 and heat dissipation wiring 150 are connected in third component layer 130. Therefore, compared to the first embodiment, the area of ​​fifth lead wiring 123 and 133 in second and third component layers 120 and 130 is increased. Consequently, the wiring resistance of fifth lead wiring 123 and 133 can be reduced, thereby suppressing heat generation in fifth lead wiring 123 and 133.

[0081] (Modification of Second Embodiment)

[0082] A modification of the second embodiment will be described below. In the second embodiment, only one of the fifth lead-out wiring 123 of the second constituent layer 120 and the fifth lead-out wiring 133 of the third constituent layer 130 may be connected to the heat-dissipating wiring 150 .

[0083] (Third embodiment)

[0084] The third embodiment will be described below. In this embodiment, the configuration of the second constituent layer 120 and the third constituent layer 130 is modified from that of the second embodiment. Since the other configurations and processes are the same as those of the second embodiment, they will not be repeated below.

[0085] In the power conversion device of this embodiment, as Figure 9A As shown, in the second constituent layer 120, the connection area R1 connecting the secondary winding 121 and the fifth lead-out wiring 123 is larger than the connection area R2 connecting the secondary winding 121 and the third lead-out wiring 122. Figure 9B As shown, in the third configuration layer 130 , a connection region R3 connecting the tertiary winding 131 and the fifth lead-out wiring 133 is larger than a connection region R4 connecting the tertiary winding 131 and the fourth lead-out wiring 132 .

[0086] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0087] (1) In this embodiment, the connection area R1 between the secondary winding 121 and the fifth lead-out wiring 123 is made larger than the connection area R2 between the secondary winding 121 and the third lead-out wiring 122. Therefore, compared with the case where the connection area R1 between the secondary winding 121 and the fifth lead-out wiring 123 is equal to the connection area R2 between the secondary winding 121 and the third lead-out wiring 122, the wiring resistance of the fifth lead-out wiring 123 can be further reduced to suppress heat generation in the fifth lead-out wiring 123.

[0088] Similarly, the connection area R3 between the tertiary winding 131 and the fifth lead-out wiring 133 is larger than the connection area R4 between the tertiary winding 131 and the fourth lead-out wiring 132. Therefore, compared with the case where the connection area R3 between the tertiary winding 131 and the fifth lead-out wiring 133 is equal to the connection area R4 between the tertiary winding 131 and the fourth lead-out wiring 132, the wiring resistance of the fifth lead-out wiring 133 can be further reduced to suppress heat generation in the fifth lead-out wiring 133.

[0089] (Modification of the Third Embodiment)

[0090] A modification of the third embodiment will be described. In the third embodiment, the size of the connection region may be different in only one of the second constituent layer 120 and the third constituent layer 130 .

[0091] (Fourth embodiment)

[0092] A fourth embodiment will be described. In this embodiment, compared to the first embodiment, a one-side heat dissipation member and an other-side heat dissipation member are arranged. Since the other configurations and processes are the same as those of the first embodiment, they will not be repeated below.

[0093] In the power conversion device of this embodiment, as Figures 10 to 12As shown, in the transformer arrangement region 10 of the printed circuit board 1 , the one-side heat dissipation member 81 is arranged on one surface 1 a , and the other-side heat dissipation member 82 is arranged on the other surface 1 b .

[0094] The one side heat dissipation member 81 and the other side heat dissipation member 82 have a predetermined thickness and thermal conductivity and are made of heat dissipation grease, heat dissipation gap filler, heat dissipation putty sheet, heat dissipation gel sheet, etc. made of heat insulating material. Figure 11 Sheet-like components serving as one side heat dissipation member 81 and the other side heat dissipation member 82 are shown. The one side heat dissipation member 81 and the other side heat dissipation member 82 have insertion holes 81a and 82a, respectively, into which the fastening member 60 is inserted. In addition, the one side heat dissipation member 81 has a recessed portion 81b corresponding to the signal wiring 100 in the first component layer 110. The other side heat dissipation member 82 has a recessed portion 82b corresponding to the signal wiring 100 in the fourth component layer 140. Figure 11 , the recessed portion 82 b formed in the other-side heat dissipation member 82 is omitted.

[0095] Pressing members 90 are arranged on one surface 1a of printed circuit board 1 via one side heat dissipation member 81. In this embodiment, two pressing members 90 are arranged on both sides of core 20 to press one side heat dissipation member 81 exposed from core 20 in a normal direction relative to the surface direction of printed circuit board 1. Furthermore, pressing members 90 have insertion holes 90a for inserting fastening members 60. Pressing members 90 of this embodiment are made of copper or the like.

[0096] Then, the printed circuit board 1 is arranged in the housing 2 so that the other-side heat dissipating member 82 is located between the other surface 1b and the housing 2, and one side of the other-side heat dissipating member 82 abuts against the housing 2. Furthermore, with the one-side heat dissipating member 81 and the pressing member 90 arranged on the one surface 1a and the fastening member 60 thermally connected to the pressing member 90, the printed circuit board 1 is fixed to the housing 2 via the fastening member 60.

[0097] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0098] (1) In this embodiment, the other-side heat dissipation member 82 is arranged between the housing 2 and the printed circuit board 1. Therefore, heat can be radiated from the windings 111, 121, 131, and 141 of the first to third coils 31 to 33 to the housing 2 via the other-side heat dissipation member 82. Therefore, the heat dissipation performance can be further improved.

[0099] (2) In this embodiment, the one-side heat dissipation member 81 is disposed on one surface 1a of the printed circuit board 1. Therefore, heat from the windings 111, 121, 131, and 141 of the first to third coils 31 to 33 is also transferred to the pressing member 90 via the one-side heat dissipation member 81. Since the pressing member 90 is thermally connected to the fastening member 60, heat dissipation to the housing 2 can be further improved.

[0100] (Fifth embodiment)

[0101] The fifth embodiment will be described. In this embodiment, compared with the fourth embodiment, the pressing member 90 and the retaining frame 70 are integrated into one body. The same configuration and process as the fourth embodiment will not be described again below.

[0102] In the power conversion device of this embodiment, as Figure 13 As shown, the pressing member 90 has two supporting portions 90b and a pressing portion 90c, wherein the supporting portion is located on one surface 1a of the printed circuit board 1 and is fastened by the fastening component 60, and the pressing portion is located on the core 20. The shape of the pressing portion 90c is adjusted so that it can press the core 20. The pressing member 90 of this embodiment is configured so that the two supporting portions 90b are connected to each other by the pressing portion 90c. In other words, the pressing member 90 of this embodiment is composed of a single member. In addition, the power conversion device of this embodiment does not include the retaining frame 70 described in the first embodiment.

[0103] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0104] (1) According to this embodiment, since the core 20 is pressed by the pressing member 90, there is no need to provide the retainer 70. Therefore, the number of components can be reduced compared to the fourth embodiment. In addition, since the core 20 is pressed by the pressing member 90, the heat of the core 20 can be dissipated to the housing 2 via the pressing member 90 and the fastening member 60.

[0105] (Modification of the Fifth Embodiment)

[0106] The following will describe a modification of the fifth embodiment. In the fifth embodiment, as Figure 14 As shown, the pressing member 90 may include a pressing portion 90c on each of the two supporting portions 90b. That is, compared to the fifth embodiment, in the pressing member 90, the pressing portion 90c provided on one supporting portion 90b and the pressing portion 90c provided on the other supporting portion 90b may be separate or may be composed of two members at predetermined positions on the core 20. Accordingly, compared to the fourth embodiment, it is easier to adjust the pressing force of the pressing portion 90c relative to the core 20, and the manufacturing process can be simplified.

[0107] (Sixth embodiment)

[0108] A sixth embodiment will be described. In this embodiment, the configuration of the portion where the fastening member 60 is arranged on the printed circuit board 1 is adjusted relative to the first embodiment. The same configuration and process as the first embodiment will not be described again.

[0109] In the first embodiment, the outer periphery of the printed circuit board 1 is fixed to the housing 2 via the fastening member 60, and the transformer placement area 10 is fixed to the housing 2 via the fastening member 60. That is, the printed circuit board 1 is fixed to the housing 2 at multiple locations via the fastening member 60. In this case, Figure 15 As shown, if the total thickness of wiring 200 varies at the location where fastening member 60 is arranged, printed circuit board 1 may not be uniformly fastened to housing 2. In this case, printed circuit board 1 may tilt relative to the surface of housing 2. If printed circuit board 1 tilts relative to the surface of housing 2, heat dissipation from printed circuit board 1 to housing 2 may be reduced. In this embodiment, wiring 200 is a general term for various wirings including signal wiring 100 and heat dissipation wiring 150.

[0110] Therefore, in this embodiment, if Figure 16 As shown, the total thickness of the portion of the wiring 200 where the fastening member 60 is arranged is set to be uniform. Therefore, in this embodiment, the printed circuit board 1 can be uniformly fixed to the housing 2, and the printed circuit board 1 can be prevented from tilting relative to the surface of the housing 2. The wiring 200 where the fastening member 60 is arranged can be only the signal wiring 100, only the heat dissipation wiring 150, or a combination of the signal wiring 100 and the heat dissipation wiring 150. Furthermore, the wiring 200 can be a dummy wiring used to ensure thickness, and its use is not particularly limited.

[0111] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0112] (1) In this embodiment, the total thickness of the portion of the wiring 200 where the fastening member 60 is arranged is uniform. Therefore, the printed circuit board 1 can be uniformly fastened to the housing 2, and the printed circuit board 1 can be prevented from tilting relative to the surface direction of the housing 2. Therefore, a reduction in heat dissipation from the printed circuit board 1 to the housing 2 can be suppressed.

[0113] (Modification of Sixth Embodiment)

[0114] A modification of the sixth embodiment will be described. In the sixth embodiment, if the thickness of the portion of the wiring 200 where the fastening member 60 is arranged is the same, as in Figure 17That is, if the total thickness of the wiring 200 is the same at the portion where the fastening member 60 is disposed, the layer on which the wiring 200 is formed may be appropriately changed.

[0115] (Seventh embodiment)

[0116] A seventh embodiment will be described. In this embodiment, the configuration of the first constituent layer 110 is modified from that of the first embodiment. The same configuration and processes as those of the first embodiment will not be described again.

[0117] In the power conversion device of this embodiment, as Figure 18 As shown in FIG. 1 , a portion of the heat dissipation wiring 150 in the first component layer 110 is led to the outside of the transformer arrangement region 10 . Figure 18 In the figure, heat dissipation wiring 150 in the upper right corner of the drawing is led outside transformer arrangement area 10. Heat dissipation wiring 150 then serves as ground wiring for another electronic component, etc., arranged on printed circuit board 1. In other words, heat dissipation wiring 150 is connected to signal wiring 100 outside transformer arrangement area 10.

[0118] According to the present embodiment, since the heat dissipation wiring 150 and the windings 111 , 121 , 131 , 141 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0119] (1) In this embodiment, the heat dissipation wiring 150 connected to the housing 2 is connected to the signal wiring 100 outside the transformer arrangement area 10. In other words, the heat dissipation wiring 150 connected to the housing 2 is used to maintain the signal wiring 100 outside the transformer arrangement area 10 at the ground potential. Therefore, the heat dissipation wiring 150 can be used more effectively.

[0120] (Modification of Seventh Embodiment)

[0121] A modification of the seventh embodiment will be described. In the seventh embodiment, the heat dissipation wiring 150 in the second to fourth constituent layers 120 , 130 , 140 may be connected to the signal wiring 100 outside the transformer arrangement region 10 .

[0122] (Eighth embodiment)

[0123] The eighth embodiment will be described below. In this embodiment, the configuration of the transformer arrangement area 10 is modified from that of the first embodiment. The same configuration and process as the first embodiment will not be described again below.

[0124] In the power conversion device of this embodiment, as Figure 19As shown, transformer configuration area 10 has a configuration layer 160, in which signal wiring 100 formed on insulating layer 101 serves as coil wiring. Specifically, configuration layer 160 of this embodiment has a rectangular shape with one direction being the longitudinal direction. Signal wiring 100 passes substantially through the center of configuration layer 160 and is formed in a straight line along the longitudinal direction.

[0125] Furthermore, two through holes 101c are formed in the insulating layer 101, and the signal wiring 100 is interposed between the two through holes 101c. The through holes 101c are positioned and sized so as to allow the legs 21c, 22c of the first core 21 or the second core 22 to be inserted.

[0126] In this embodiment, the first core 21 has a base 21a and a pair of outer legs 21c extending from the base 21a, and the second core 22 has a base 22a and a pair of outer legs 22c extending from the base 22a. The bases 21a and 22a have a flat plate shape with one direction being the longitudinal direction. The pair of outer legs 21c and 22c are formed so that both ends in a lateral direction perpendicular to the longitudinal direction of the bases 21a and 22a protrude in a direction normal to the surface direction of the bases 21a and 22a. In other words, each of the first core 21 and the second core 22 of this embodiment is a so-called U-shaped core.

[0127] The first and second cores 21 and 22 are arranged to face each other so that the outer legs 21c, 22c are inserted into the through-holes 101c. That is, the power conversion device of the present embodiment is configured to have a choke coil.

[0128] Furthermore, heat dissipation wiring 150 is formed on insulating layer 101 around signal wiring 100 and is thermally connected to signal wiring 100. Heat dissipation wiring 150 has fastening holes 151 in portions exposed from core 20. Although not particularly shown, heat dissipation wiring 150 is fixed to housing 2 via fastening members 60.

[0129] According to the present embodiment, since the heat dissipation wiring 150 and the signal wiring 100 are arranged on the same plane, the same effects as those of the first embodiment can be obtained.

[0130] (Other embodiments)

[0131] Although the present disclosure has been described with reference to the embodiments, it should be understood that the present disclosure is not limited to these embodiments or configurations. The present disclosure includes various modifications and variations within the scope of equivalents. In addition, as preferred various combinations and configurations, other combinations and configurations including more, less, or only a single element are also within the spirit and scope of the present disclosure.

[0132] For example, in each embodiment, it is possible to appropriately change the number of constituent layers constituting the printed circuit board 1. In this case, the transformer arrangement region 10 may include constituent layers in which no winding is formed.

[0133] Furthermore, in each embodiment, the heat dissipation member 50 may not be disposed between the core 20 and the printed circuit board 1 .

[0134] Then, in the first to seventh embodiments, as Figure 20 As shown, as a transformer T, the second coil 32 and the third coil 33 may not be connected in series. That is, the sixth connection line 46 may be connected to the end of the second coil 32 opposite to the third connection line 43, and the seventh connection line 47 may be connected to the end of the third coil 33 opposite to the fourth connection line 44. In this case, the fifth lead-out wiring 123 in the second constituent layer 120 constitutes the sixth connection line 46, and the fifth lead-out wiring 133 in the third constituent layer 130 constitutes the seventh connection line 47. Although not specifically shown, the arrangement position of the fastening member 60 is changed so that the fifth lead-out wiring 123 of the second constituent layer 120 and the fifth lead-out wiring 133 of the third constituent layer 130 are not electrically connected. Therefore, the configuration Figure 20 The transformer T in.

[0135] Furthermore, in the first to seventh embodiments, the heat dissipation wiring 150 may be separated not at the portion overlapping the core 20 in the normal direction but at the portion exposed in the normal direction from the core 20. Furthermore, the heat dissipation wiring 150 may be separated by a plurality of virtual lines K. That is, if the heat dissipation wiring 150 does not function as a coil, the separation position and separation method may be appropriately changed.

[0136] Furthermore, in each embodiment, the electronic device may not include the core 20. Even in such an electronic device, heat dissipation can be improved by arranging the heat dissipation wiring 150 thermally connected to the signal wiring 100 on the same plane as the signal wiring 100.

[0137] In the fourth embodiment, the electronic device may include only one of the one-side heat dissipation member 81 and the other-side heat dissipation member 82. When only the other-side heat dissipation member 82 is provided, the pressing member 90 may not be provided.

[0138] The above-described embodiments may be combined as appropriate. For example, the fourth embodiment may be combined with each embodiment to include a heat dissipation member 81 on one side and a heat dissipation member 82 on the other side. In this case, as in the fifth embodiment, the pressing member 90 may be provided with a pressing portion 90c. Furthermore, the sixth embodiment may be combined with each embodiment so that the total thickness of the portion of the wiring 200 where the fastening member 60 is arranged is the same. The seventh embodiment may be combined with each embodiment, and the heat dissipation wiring 150 may be connected to the signal wiring 100 outside the transformer arrangement area 10.

Claims

1. An electronic device comprising: a substrate having one surface and another surface opposite to the one surface; a signal wiring formed on the insulating layer of the substrate; and a heat dissipation wiring formed on the insulating layer and thermally connected to the signal wiring on the same plane as the signal wiring, wherein The substrate has a through hole penetrating along the thickness direction, A core forming a closed magnetic circuit is arranged at a position including the through hole, The substrate is a multilayer substrate in which a plurality of constituent layers are stacked, In at least two of the plurality of constituent layers, the signal wiring includes a winding arranged around the through hole and a lead wiring connected to the winding, In at least one of the at least two constituent layers among the plurality of constituent layers, the winding has one end connected to a first-end lead-out wiring and the other end connected to a second-end lead-out wiring, the second-end lead-out wiring is electrically connected to the housing made of a conductive material via a fastening member, and is connected to the heat dissipation wiring; and The multilayer substrate is fixed to the housing via the fastening member passing through the fastening hole formed in the second-end lead-out wiring, so that the second-end lead-out wiring is thermally and electrically connected to the housing. 2 . The electronic device according to claim 1 , wherein the substrate is fixed to a housing made of a conductive material via a fastening member thermally connected to the heat dissipation wiring.

3. The electronic device according to claim 1 or 2, wherein: A heat dissipation member is arranged between the substrate and the core.

4. The electronic device according to claim 1 or 2, wherein The heat dissipation wiring is divided into a plurality of regions in a normal direction relative to a surface direction of the substrate, and The heat dissipation wiring is divided into a region on one side of the core and a region on the other side of the core with respect to a virtual line passing through the winding and extending in one of the surface directions of the substrate.

5. The electronic device according to claim 4, wherein The heat dissipation wiring is divided into a region located on one side of the core and a region located on the other side of the core at a portion overlapping the core in the normal direction.

6. The electronic device according to claim 1 or 2, wherein A connection area connecting the winding and the second-end lead-out wiring is larger than a connection area connecting the winding and the first-end lead-out wiring.

7. The electronic device according to claim 1 or 2, wherein The substrate is arranged so that the other surface faces the housing made of a conductive material, and A heat dissipation member thermally connected to the signal wiring is arranged on at least one of the one surface and the other surface of the substrate.

8. The electronic device according to claim 7, wherein the heat dissipation member is arranged on the one surface of the substrate, The pressing member is arranged on the heat dissipation member, The substrate has a through hole penetrating along the thickness direction, A core forming a closed magnetic circuit is arranged at a position including the through hole, and The pressing member has a support portion disposed on the heat dissipating member and a pressing portion formed integrally with the support portion to press the core.

9. The electronic device according to claim 1 or 2, wherein The substrate is fixed to the housing at a plurality of locations via fastening members, and The total thickness of wiring including the signal wiring and the heat dissipation wiring is the same between portions of the substrate pressed by the fastening member.

10. The electronic device according to claim 1 or 2, wherein The substrate has a transformer arrangement region in which the signal wiring and the heat dissipation wiring are formed, and The heat dissipation wiring is electrically connected to a housing made of a conductive material and is connected to wiring outside the transformer arrangement area.

11. An electronic device comprising: a substrate having one surface and another surface opposite to the one surface; a signal wiring formed on the insulating layer of the substrate; and a heat dissipation wiring formed on the insulating layer and thermally connected to the signal wiring on the same plane as the signal wiring, wherein The substrate is arranged so that the other surface faces the housing made of a conductive material, a heat dissipation member thermally connected to the signal wiring is arranged on at least one of the one surface and the other surface of the substrate, the heat dissipation member is arranged on the one surface of the substrate, The pressing member is arranged on the heat dissipation member, The substrate has a through hole penetrating along the thickness direction, A core forming a closed magnetic circuit is arranged at a position including the through hole, and The pressing member has a support portion disposed on the heat dissipating member and a pressing portion formed integrally with the support portion to press the core. 12 . The electronic device according to claim 11 , wherein the substrate is fixed to a housing made of a conductive material via a fastening member thermally connected to the heat dissipation wiring.

13. The electronic device according to claim 11 or 12, wherein The substrate is fixed to the housing at a plurality of locations via fastening members, and The total thickness of wiring including the signal wiring and the heat dissipation wiring is the same between portions of the substrate pressed by the fastening member.

14. The electronic device according to claim 11 or 12, wherein The substrate has a transformer arrangement region in which the signal wiring and the heat dissipation wiring are formed, and The heat dissipation wiring is electrically connected to a housing made of a conductive material and is connected to wiring outside the transformer arrangement area.

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