Array circuit board, device array, light-emitting device and display screen

Abstract

The present invention discloses an array circuit board, a device array, a light-emitting device, and a display screen. The circuit board unit includes: a plurality of circuit board units arranged in an array; the circuit board unit includes: a substrate, a plurality of through holes, a plurality of pins, and a plurality of pad groups; the through holes penetrate the substrate; the pins correspond to the through holes one by one, and the pins are inserted into the corresponding through holes; the pad group includes a first pad and a second pad; within each circuit board unit, a plurality of pad groups are evenly distributed on the substrate, each first pad is electrically connected to a pin in a corresponding through hole, and each second pad is electrically connected to a pin in a corresponding through hole after being electrically connected to each other; wherein the substrates of two adjacent circuit board units are integrally formed. The technical solution of the embodiment of the present invention improves the transfer efficiency of the LED chip while improving the display uniformity of the display screen.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array circuit board, a device array, a light-emitting device and a display screen. Background Art

[0002] LED (Light Emitting Diode) displays are widely used in various fields such as industry, transportation, commercial advertising, and information release due to their advantages such as large viewing angle, low power consumption, high grayscale, and customizable screen shape.

[0003] Typically, LED displays consist of multiple independent LED chips arranged in an array. Therefore, during the display manufacturing phase, these individual LED chips need to be transferred to a driver substrate, which then drives the LED chips to emit light. However, the transfer of these individual LED chips to the driver substrate, as commonly used, results in low transfer efficiency and yield. Furthermore, the multiple LED chips transferred to the driver substrate can cause uneven display on the display. Summary of the Invention

[0004] The present invention provides an array circuit board, a device array, a light-emitting chip and a display screen, so as to improve the transfer efficiency of the LED chip and enhance the display uniformity of the display screen.

[0005] According to one aspect of the present invention, there is provided an array circuit board, comprising: a plurality of circuit board units arranged in an array;

[0006] The circuit board unit includes: a substrate, a plurality of through holes, a plurality of pins and a plurality of pad groups;

[0007] The through holes penetrate the substrate; the pins correspond to the through holes one by one, and the pins are inserted into the corresponding through holes;

[0008] The pad group includes a first pad and a second pad; in each circuit board unit, multiple pad groups are evenly distributed on the substrate, each first pad is electrically connected to a pin in a corresponding through hole, and each second pad is electrically connected to a pin in a corresponding through hole after being electrically connected to each other; wherein, the substrates of two adjacent circuit board units are integrally formed.

[0009] According to another aspect of the present invention, there is provided a device array, comprising: the array circuit board as described in the above aspect; the device array further comprising a plurality of light-emitting chips and a packaging layer;

[0010] One light-emitting chip corresponds to one pad group, and the light-emitting chip is arranged on the corresponding pad group and electrically connected to the pad group; the packaging layer is located on the side of the light-emitting chip away from the pad group and covers the light-emitting chip and the circuit board unit.

[0011] Optionally, each circuit board unit is provided with five through holes, five pins, four pad groups and four light-emitting chips;

[0012] The substrate is divided into four pad areas distributed in a field shape; the pad group is located at the center of the corresponding pad area, or the pad group is located at the center of the boundary line between two adjacent pad areas;

[0013] At most two of the four light-emitting chips emit light of the same color.

[0014] According to another aspect of the present invention, a light emitting device is provided, which is obtained by cutting the device array according to the above aspect, and one light emitting device corresponds to one circuit board unit.

[0015] According to another aspect of the present invention, there is provided a display screen, comprising: a driving substrate and a plurality of light-emitting devices as described in the above aspect;

[0016] The driving substrate includes a plurality of pixel areas, and the light emitting devices are disposed in corresponding pixel areas and are electrically connected to electrodes in the pixel areas through the pins.

[0017] The technical solution of the embodiment of the present invention is to provide an array circuit board including a plurality of circuit board units arranged in an array, wherein within each circuit board unit, each first solder pad is electrically connected to a pin within a corresponding through-hole, and each second solder pad is electrically connected to a pin within a corresponding through-hole after being electrically connected to each other, wherein the substrates of two adjacent circuit board units are integrally formed. Thus, multiple LED chips can be provided within each circuit board unit, and the number of LED chips can be consistent with the number of solder pad groups. The array circuit board can then be cut to obtain circuit board units provided with multiple LED chips. The circuit board units provided with multiple LED chips are then sequentially transferred to a driver substrate, which drives the LED chips to emit light, thereby achieving the transfer of multiple LED chips. Compared to the transfer of individual LED chips, the transfer of multiple LED chips improves transfer efficiency and yield.

[0018] At the same time, by arranging multiple pad groups in each circuit board unit and evenly distributing them on the substrate, the pad groups on the entire substrate of the array circuit board are evenly distributed, so that the LED chips arranged on the entire substrate of the array circuit board can be evenly distributed. After the array circuit board is cut and the circuit board units provided with multiple LED chips are sequentially transferred to the driving substrate, the LED chips on the entire driving substrate are still evenly distributed, thereby improving the display uniformity of the display screen.

[0019] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic structural diagram of an array circuit board provided by an embodiment of the present invention;

[0022] Figure 2 yes Figure 1 Schematic diagram of the structure of the circuit board unit;

[0023] Figure 3 yes Figure 2 A schematic diagram of the structure on the back of the circuit board unit shown;

[0024] Figure 4 is a structural schematic diagram of another circuit board unit provided by an embodiment of the present invention;

[0025] Figure 5 is a structural schematic diagram of another array circuit board provided by an embodiment of the present invention;

[0026] Figure 6 is a structural schematic diagram of a device array provided by an embodiment of the present invention;

[0027] Figure 7 It is a structural schematic diagram of a light-emitting device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] Figure 1 is a structural diagram of an array circuit board provided by an embodiment of the present invention, Figure 2 yes Figure 1 Schematic diagram of the circuit board unit. Figure 1 and Figure 2 The array circuit board 100 provided by an embodiment of the present invention includes: a plurality of circuit board units 200 arranged in an array; the circuit board unit 200 includes: a substrate 110, a plurality of through holes 220, a plurality of pins 230 and a plurality of pad groups 210; the through holes 220 pass through the substrate; the pins 230 correspond to the through holes 220 one by one, and the pins 230 are arranged in the corresponding through holes 220; the pad groups 210 include first pads 211 and second pads 212; in each circuit board unit 200, the plurality of pad groups 210 are evenly distributed on the substrate 110, each first pad 211 is electrically connected to the pin 230 in a corresponding through hole 220, and each second pad 212 is electrically connected to the pin 230 in the corresponding through hole 220 after being electrically connected to each other; wherein, the substrates 110 of two adjacent circuit board units 200 are integrally formed.

[0031] Specifically, the material of the substrate 110 can be FR4 material or glass, etc. The substrates 110 of all the circuit board units 200 in the array circuit board 100 are integrally formed, which can be understood as all the circuit board units 200 sharing the same substrate. The through hole 220 on the substrate 110 is used to set the pin 230; after the pin 230 is set in the through hole 220, the slit between the pin 230 and the hole wall of the through hole 220 can be filled with conductive material; one end of the pin 230 is used to connect the pad (the pad can be the first pad 211 or the second pad 212), and the other end of the pin 230 can extend to the back side of the substrate 110 (that is, the surface of the substrate 110 where the first pad 211 and the second pad 212 are not set) to connect to the drive substrate later. For example, Figure 3 yes Figure 2 The schematic diagram of the structure on the back of the circuit board unit is shown, combined with Figure 3 and Figure 2 It can be seen that one end of the pin 230 is connected to the corresponding first pad 211 or the second pad 212 (can be connected to the first pad 211 or the second pad 212 through a metal connecting wire 240), and the pin 230 passes through the corresponding through hole 220, so that the other end of the pin 230 extends to the back side of the substrate 110.

[0032] The number of pad groups 210 within each circuit board unit 200 can be three, four, or more, without specific limitation. The first pads 211 and the second pads 212 are used to mount a light-emitting chip, which can be a Mini LED chip, a Micro LED chip, or a flip-chip LED chip. For example, the first pads 211 and the second pads 212 within a pad group 210 can each connect to the anode and cathode of a light-emitting chip.

[0033] In each circuit board unit 200, each first solder pad 211 is electrically connected to a pin 230 in a corresponding through hole 220, and each second solder pad 212 is electrically connected to each other and then to a pin 230 in a corresponding through hole 220, thereby facilitating a common anode setting or a common cathode setting of multiple light-emitting chips; wherein the number of light-emitting chips can be consistent with the number of solder pad groups 210.

[0034] Based on the above, the technical solution of the embodiment of the present invention can set multiple light-emitting chips in each circuit board unit, and then the array circuit board provided with the light-emitting chips can be cut to obtain circuit board units provided with multiple light-emitting chips, and the circuit board units provided with multiple light-emitting chips are transferred one by one to the driving substrate. The driving substrate drives the light-emitting chips to emit light, thereby realizing the transfer of multiple light-emitting chips. Compared with the transfer of a single light-emitting chip (that is, transferring the light-emitting chips one by one to the driving substrate), the transfer of multiple light-emitting chips improves the transfer efficiency and yield.

[0035] At the same time, combined Figure 1 and Figure 2 As shown, the technical solution of the embodiment of the present invention is to evenly distribute the plurality of pad groups 210 on the substrate in each circuit board unit 200, so that the pad groups 210 on the entire substrate of the array circuit board are evenly distributed, so that the light-emitting chips arranged on the entire substrate of the array circuit board can be evenly distributed. After the array circuit board is cut and the circuit board units provided with the plurality of light-emitting chips are transferred one by one to the driving substrate, the light-emitting chips on the entire driving substrate are still evenly distributed, thereby improving the display uniformity of the display screen.

[0036] Combine Figure 1 and Figure 2 As shown, optionally, in a plurality of circuit board units arranged in an array, each pad group 210 is distributed at equal intervals on the substrate, so that after the circuit board units provided with a plurality of light-emitting chips are transferred one by one to the driving substrate, the light-emitting chips on the entire driving substrate are distributed at equal intervals, thereby further improving the display uniformity of the display screen.

[0037] refer to Figure 2 Optionally, in each circuit board unit, the through hole 220 corresponding to the first solder pad 211 is arranged adjacent to the first solder pad 211 to facilitate the connection between the first solder pad 211 and the corresponding pin 230, so that the structure of the circuit board unit is simple and reliable; the through hole 220 corresponding to the second solder pad 212 is located at the center of the circuit board unit to facilitate the electrical connection between the second solder pads 212, so that the connection method between the second solder pads 212 is simple, thereby simplifying the structure of the circuit board unit and facilitating the uniform distribution of the second solder pads 212 on the circuit board unit.

[0038] refer to Figure 2 Optionally, in one embodiment of the present invention, each circuit board unit is provided with five through-holes 220, five pins 230, and four pad groups 210. The substrate is divided into four pad areas 250 arranged in a "T-shaped" pattern, with pad groups 210 located at the center of corresponding pad areas 250. This allows for evenly spaced pad groups 210 within the circuit board unit, while also allowing for four light-emitting chips to be disposed within the circuit board unit.

[0039] Figure 4 This is a structural diagram of another circuit board unit provided by an embodiment of the present invention. Figure 4Alternatively, in another embodiment of the present invention, each circuit board unit is provided with five through holes 220, five pins 230, and four pad groups 210; the substrate is divided into four pad areas 250 distributed in a field shape, and the pad group 210 is located at the center of the boundary line between two adjacent pad areas 250. In this way, the pad groups 210 can be evenly spaced within the circuit board unit, and four light-emitting chips can also be provided within the circuit board unit. Accordingly, multiple Figure 4 The circuit board units shown are arranged in an array and share a common substrate, which can form the following Figure 5 The array circuit board shown in FIG. Figure 5 is a structural diagram of another array circuit board provided by an embodiment of the present invention, Figure 5 The array circuit board shown can also achieve the following Figure 1 The technical effects achieved by the array circuit board shown are not repeated here.

[0040] refer to Figure 1 Optionally, on the substrate, along the row direction x of the array arrangement, the first pads 211 and the second pads 212 are alternately arranged; along the column direction y of the array arrangement, the first pads 211 are arranged sequentially or the second pads 212 are arranged sequentially. This arrangement facilitates the equidistant distribution of the pad groups 210 within the circuit board unit, and further facilitates the equidistant distribution of the light-emitting chips 300 within the circuit board unit.

[0041] Based on the above embodiments, an embodiment of the present invention further provides a device array. Figure 6 This is a schematic diagram of the structure of a device array provided by an embodiment of the present invention, with reference to Figure 6 The device array includes the array circuit board provided by any of the above technical solutions, and further includes a plurality of light-emitting chips 300 and an encapsulation layer 400. Each light-emitting chip 300 corresponds to a pad group 210, and the light-emitting chip 300 is disposed on and electrically connected to the corresponding pad group 210 (for example, the first pad 211 and the second pad 212 within a pad group 210 may be connected to the anode and cathode of each light-emitting chip 300). The encapsulation layer 400 is located on a side of the light-emitting chip 300 away from the pad group 210 and covers the light-emitting chip 300 and the circuit board unit. The thickness of the encapsulation film constituting the encapsulation layer 400 may be 120 to 150 microns. The encapsulation film is adhered to the array circuit board on which the light-emitting chips 300 are disposed, encapsulating the light-emitting chips 300 and the circuit board unit. The encapsulation film exposes the pins 230 on the back side of the substrate.

[0042] refer to Figure 6Each circuit board unit is provided with five through-holes 220, five pins 230, four pad groups 210, and four light-emitting chips 300. The substrate is divided into four pad areas 250 arranged in a "T-shaped" pattern, with pad groups 210 located at the center of corresponding pad areas 250, or at the center of the boundary between two adjacent pad areas 250. At most two of the four light-emitting chips 300 emit the same color. For example, the four light-emitting chips 300 may be two green light-emitting chips 300_G that emit green light, one red light-emitting chip 300_R that emits red light, and one blue light-emitting chip 300_B that emits blue light. Within the circuit board unit, the green light-emitting chips 300_G, the red light-emitting chips 300_R, and the blue light-emitting chips 300_B are alternately arranged to form an RGB sub-pixel arrangement for display.

[0043] Based on the above embodiments, the present invention also provides a light emitting device, which is obtained by cutting the device array provided by any of the above technical solutions, and one light emitting device corresponds to one circuit board unit. For example, Figure 7 This is a structural schematic diagram of a light-emitting device provided by an embodiment of the present invention, wherein the light-emitting device includes a circuit board unit and four light-emitting chips 300 and an encapsulation layer 400, and the four light-emitting chips 300 are two green light-emitting chips 300_G, a red light-emitting chip 300_R and a blue light-emitting chip 300_B.

[0044] Based on the above embodiments, another embodiment of the present invention provides a display screen. The display screen includes a driver substrate and a plurality of light-emitting devices provided by any of the above technical solutions. The driver substrate includes a plurality of pixel regions, and the light-emitting devices are disposed within corresponding pixel regions and electrically connected to electrodes within the pixel regions via pins 230. Because the light-emitting chips 300 on the driver substrate provided in this embodiment of the present invention are evenly spaced, the display screen provided in this embodiment of the present invention exhibits excellent display uniformity.

[0045] In summary, in the embodiment of the present invention, first, the first solder pad 211 and the second solder pad 212 for setting the light-emitting chip 300 are arrayed on the substrate to form an array circuit board; then, the flip-chip LED chip is transferred from the blue film to the array circuit board by a needle-piercing mass transfer method, and then the packaging film is attached to the array circuit board on which the LED chip is already set to form a device array; then, the device array is cut to obtain the light-emitting device. Finally, a plurality of light-emitting devices are transferred in batches to the driving substrate using an array-type mass transfer device until the pixel area of ​​the driving substrate is covered with the light-emitting device, and the solder paste at the bottom of the light-emitting device pin 230 is cured by a vacuum reflow furnace or laser reflow, and finally sealed to form a display screen. In addition, the technical solution of the embodiment of the present invention is conducive to spectroscopic sorting (the light-emitting device can be binned and bagged according to different color blocks by a test spectrometer), which is conducive to reducing the difficulty of correcting the consistency of the white screen. Generally, a single-bin light-emitting device is used for the display screen.

[0046] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. An array circuit board, characterized in that: include: A plurality of circuit board units arranged in an array; The circuit board unit includes: a substrate, a plurality of through holes, a plurality of pins and a plurality of pad groups; The through holes penetrate the substrate; the pins correspond to the through holes one by one, and the pins are inserted into the corresponding through holes; The pad group includes a first pad and a second pad; in each circuit board unit, a plurality of pad groups are evenly distributed on the substrate, each first pad is electrically connected to a pin in a corresponding through-hole, and each second pad is electrically connected to a pin in a corresponding through-hole after being electrically connected to each other; wherein the substrates of two adjacent circuit board units are integrally formed; Each circuit board unit is provided with five through holes, five pins and four pad groups; one pad group is correspondingly connected to the anode and cathode of a light-emitting chip; and in the circuit board unit, the green light-emitting chip, the red light-emitting chip and the blue light-emitting chip are alternately arranged to form an RGB sub-pixel arrangement; the substrate is divided into four pad areas distributed in a field shape, and the pad group is located at the center of the corresponding pad area; or: the pad group is located at the center of the boundary line between two adjacent pad areas.

2. The array circuit board according to claim 1, characterized in that: In the plurality of circuit board units arranged in an array, the pad groups are distributed on the substrate at equal intervals.

3. The array circuit board according to any one of claims 1 or 2, characterized in that: In each of the circuit board units, the through hole corresponding to the first pad is arranged adjacent to the first pad, and the through hole corresponding to the second pad is located at the center of the circuit board unit.

4. The array circuit board according to claim 3, characterized in that: On the substrate, along the row direction of the array arrangement, the first pads and the second pads are alternately arranged; Along the column direction of the array arrangement, the first pads are arranged in sequence or the second pads are arranged in sequence.

5. A device array, characterized in that: Comprising the array circuit board according to any one of claims 1 to 4; the device array further comprising a plurality of light-emitting chips and a packaging layer; One light-emitting chip corresponds to one pad group, and the light-emitting chip is arranged on the corresponding pad group and electrically connected to the pad group; the packaging layer is located on the side of the light-emitting chip away from the pad group and covers the light-emitting chip and the circuit board unit.

6. The device array according to claim 5, characterized in that Each circuit board unit is provided with five through holes, five pins, four pad groups and four light-emitting chips; The substrate is divided into four pad areas distributed in a field shape; the pad group is located at the center of the corresponding pad area, or the pad group is located at the center of the boundary line between two adjacent pad areas; At most two of the four light-emitting chips emit light of the same color.

7. A light emitting device, characterized in that: Obtained by cutting the device array according to claim 6, one light-emitting device corresponds to one circuit board unit.

8. A display screen, characterized in that: comprising a driving substrate and a plurality of light emitting devices according to claim 7; The driving substrate includes a plurality of pixel areas, and the light emitting devices are disposed in corresponding pixel areas and are electrically connected to electrodes in the pixel areas through the pins.

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