A package structure and a magnetic chip package

Abstract

The application provides a packaging structure and a magnetic chip packaging piece, and the packaging structure is used for packaging a magnetic chip plastic packaging piece with pins. By adopting a first packaging piece and a second packaging piece to wrap six surfaces of the magnetic chip plastic packaging piece, the packaging piece made of high magnetic permeability material is additionally arranged outside the magnetic chip plastic packaging piece, and the magnetic shielding effect on the magnetic chip is improved. Each packaging piece has a connecting plate and two bending plates integrated, and the six surfaces of the magnetic chip plastic packaging piece can be wrapped by nesting the two packaging pieces together. The packaging piece can be prefabricated, and the assembly can be completed by directly nesting the two packaging pieces together. The first packaging piece and the second packaging piece enclose a pin hole for the pins to pass through outside the packaging structure, and only the length and width dimensions of the packaging piece need to be controlled, so that the edges of the two packaging pieces can enclose the pin hole when they are nested together. When the packaging piece is processed, the opening process is not needed, and the processing of the packaging piece is simplified.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and particularly relates to a packaging structure and a magnetic chip packaging piece. BACKGROUND

[0002] Magnetoresistive Random Access Memory (MRAM) records information by using different orientations of magnetic moments, and has the characteristics of non-volatility, high speed reading and writing, and high writing times. Data of MRAM is stored in an array of magnetic resistance elements, each of which contains a magnetic reference layer and a magnetic free layer. When the magnetic moments of the two layers are in the same direction, the element is in a low resistance state (logic 0); when the magnetic moments of the two layers are opposite, the element is in a high resistance state (logic 1). In the element design, the magnetic moment direction of the magnetic reference layer has high stability, while the magnetic moment direction of the magnetic free layer is relatively easy to change, so the magnetic moment direction of the magnetic free layer can be changed in various ways to achieve information input.

[0003] Interaction between magnetic field and magnetic moment is a basic property of magnetic system. Magnetic moment of the magnetic free layer with weak stability can be more easily flipped under different direction external magnetic field, or can be more difficult to flip. The former leads to error of storage information of the chip, and the latter leads to increase of writing voltage of the chip. Therefore, for the magnetic random access memory chip, the external magnetic field must be effectively shielded. Current static magnetic shielding scheme of MRAM is still focused on the design level of the plastic encapsulation layer or the MTJ (Magnetic Tunnel Junctions) in the bare chip during the process of forming the plastic encapsulation piece of the bare chip. However, due to the size and process problems, the shielding effect of the two levels is limited. SUMMARY

[0004] The present application provides a packaging structure and a magnetic chip packaging piece, which can improve the magnetic shielding effect of the magnetic chip, and simplify the packaging structure, and facilitate processing and assembly.

[0005] In a first aspect, the present application provides a packaging structure for packaging a magnetic chip plastic package having pins. The packaging structure comprises a first packaging piece and a second packaging piece, both of which are made of high magnetic permeability material. The first packaging piece comprises a rectangular first connecting plate having two first bent plates bent in the same direction at opposite edges of the first connecting plate. The second packaging piece comprises a rectangular second connecting plate having two second bent plates bent in the same direction at opposite edges of the second connecting plate. The first packaging piece and the second packaging piece are nested, the first connecting plate and the second connecting plate are opposite to each other, and the first connecting plate, the second connecting plate, the two first bent plates and the two second bent plates wrap six surfaces of the magnetic chip plastic package. At least one pin hole for the pins to pass out of the packaging structure is formed between the first packaging piece and the second packaging piece.

[0006] In the above scheme, the six surfaces of the magnetic chip plastic package are wrapped by the first packaging piece and the second packaging piece, and the magnetic chip plastic package is additionally provided with packaging pieces made of high magnetic permeability material outside the magnetic chip plastic package to improve the magnetic shielding effect of the magnetic chip. Each packaging piece has a connecting plate and two bent plates integrated, and the six surfaces of the magnetic chip plastic package can be wrapped by simply nesting the two packaging pieces. In application, the packaging pieces can be pre-prepared, and after the magnetic chip plastic package is packaged, the two packaging pieces can be directly nested to complete the assembly, thereby facilitating installation. The pin holes for the pins to pass out of the packaging structure are formed between the first packaging piece and the second packaging piece, and only the length and width dimensions of the packaging pieces need to be controlled so that the edges of the two packaging pieces can form the pin holes when nested. Therefore, when the packaging pieces are processed, a large number of pin holes do not need to be formed by a hole opening process, the processing difficulty is reduced, and the processing of the packaging pieces is simplified.

[0007] In a specific embodiment, the magnetic chip plastic package has opposite first and second surfaces and four side surfaces respectively connected to the first and second surfaces, wherein the areas of the first and second surfaces are greater than the area of each side surface. The first surface of the magnetic chip plastic package is fixed on the first connecting plate, and the second connecting plate is buckled on the second surface of the magnetic chip plastic package. Each pin hole is formed by the edge of the first connecting plate, the edge of the second bent plate, and part of the edge of each first bent plate.

[0008] In a specific embodiment, each first bent plate is flush with the outer surface of the second connecting plate, or each first bent plate is higher than the outer surface of the second connecting plate, to improve the magnetic shielding effect of the vertical magnetic field.

[0009] In a specific embodiment, the thickness of the second connecting plate is greater than the thickness of the first connecting plate to improve the magnetic shielding efficiency and prevent the first connecting plate from being too thick to affect pin welding.

[0010] In one embodiment, the magnetic chip package has opposite first and second faces, and four side faces connecting the first and second faces respectively, wherein the first and second faces each has an area larger than that of each side face, and the four side faces include opposite first and second side faces. The first and second faces are fixed on two first bending plates respectively, and a first connecting plate is arranged opposite to the first side face, and a second connecting plate is arranged opposite to the second side face. The second bending plate has a notch at an edge opposite to the position of the pin, and each pin hole is formed by the notch and an edge of one first bending plate.

[0011] In one embodiment, among the two first bending plates, the thickness of the first bending plate opposite to the position of the first face is smaller than that of the second bending plate opposite to the position of the second face, so as to improve the magnetic shielding effect on the vertical magnetic field.

[0012] In one embodiment, when the first package and the second package are nested together, the gap width between any two plates is less than 25 microns, and the distance between each face of the magnetic chip package and the nearest bending plate or connecting plate is less than 25 microns, so as to form a magnetic flux loop and improve the magnetic shielding effect.

[0013] In one embodiment, the high magnetic permeability material is pure iron, silicon steel or permalloy, so as to facilitate the processing of the connecting plate and the bending plate with a single-layer structure.

[0014] In one embodiment, the first package and the second package are both made by machining or casting, so as to facilitate the prefabrication of the package meeting the specification requirements, and the subsequent nesting installation can complete the re-encapsulation of the magnetic chip package.

[0015] In one embodiment, the magnetic chip package is a magnetic memory chip package, a sensor chip using a magnetoresistance element, or an integrated circuit chip package using a magnetoresistance element.

[0016] In a second aspect, the application also provides a magnetic chip package, which includes a magnetic chip package having pins, and any of the above-mentioned encapsulation structures encapsulating the magnetic chip package.

[0017] In the above scheme, by adopting the first and second packaging members to wrap the six surfaces of the magnetic chip plastic packaging member, the magnetic chip plastic packaging member is additionally provided with the packaging members made of high magnetic permeability material to improve the magnetic shielding effect on the magnetic chip. Meanwhile, each packaging member has a connecting plate and two integral bending plates, and by simply nesting the two packaging members together, the six surfaces of the magnetic chip plastic packaging member can be wrapped. In application, the packaging members can be pre-prepared, and after the magnetic chip plastic packaging member is packaged, the two packaging members are directly nested together to complete the assembly, thereby facilitating installation. The pin holes for the pins to pass outside the packaging structure are surrounded by the first and second packaging members, and only the length and width dimensions of the packaging members need to be controlled so that the edges of the two packaging members can surround the pin holes when nested together. Therefore, when the packaging members are processed, a large number of pin holes do not need to be formed by pin hole process, which reduces the processing difficulty and simplifies the processing of the packaging members. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A structure schematic view of a packaging structure provided by the embodiment of the present application when assembled together;

[0019] Figure 2 、 Figure 3 The structure schematic views of the first and second packaging members in the packaging structure provided by the present application are respectively shown in Figure 1

[0020] Figure 4 A structure schematic view of another packaging structure provided by the embodiment of the present application when assembled together;

[0021] Figure 5 、 Figure 6 The structure schematic views of the first and second packaging members in the packaging structure provided by the present application are respectively shown in Figure 4

[0022] Figure 7 A test data schematic view of the packaging structure provided by the embodiment of the present application.

[0023] REFERENCE SIGNS:

[0024] 10 - first packaging member 11 - first connecting plate 12 - first bending plate

[0025] 20 - second packaging member 21 - second connecting plate 22 - second bending plate

[0026] 23 - notch 30 - pin hole 40 - pin DETAILED DESCRIPTION

[0027] ​​In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0028] In order to facilitate understanding of the packaging structure provided by the embodiments of the present application, the application scenario of the packaging structure provided by the embodiments of the present application will be first described below. The packaging structure is applied to the packaging process of a magnetic chip and is used for packaging a magnetic chip plastic package having a pin. The packaging structure will be described in detail below with reference to the drawings.

[0029] With reference to Figures 1-6 The packaging structure provided by the embodiments of the present application includes two packaging pieces, i.e., a first packaging piece 10 and a second packaging piece 20, and both of the two packaging pieces are made of a high magnetic permeability material. The first packaging piece 10 includes a rectangular first connecting plate 11, and the first connecting plate 11 has two first bending plates 12 bent in the same direction at opposite edges of the first connecting plate 11. The second packaging piece 20 includes a rectangular second connecting plate 21, and the second connecting plate 21 has two second bending plates 22 bent in the same direction at opposite edges of the second connecting plate 21. The first packaging piece 10 and the second packaging piece 20 are nested, the first connecting plate 11 and the second connecting plate 21 are located opposite to each other, and the first connecting plate 11, the second connecting plate 21, the two first bending plates 12 and the two second bending plates 22 wrap six surfaces of a magnetic chip plastic package, and each connecting plate or bending plate wraps one surface of the magnetic chip plastic package. At a position opposite to the pin 40, the first packaging piece 10 and the second packaging piece 20 enclose at least one pin hole 30 for the pin 40 to pass through the packaging structure.

[0030] In the above scheme, by adopting the first packaging member 10 and the second packaging member 20 to wrap the six surfaces of the magnetic chip plastic package, the magnetic chip plastic package is additionally provided with the packaging member made of high magnetic permeability material outside, so as to improve the magnetic shielding effect of the magnetic chip. Meanwhile, each packaging member has a connecting plate and two integral bending plates, and by simply nesting the two packaging members together, the six surfaces of the magnetic chip plastic package can be wrapped. In application, the packaging member can be prefabricated, and after the magnetic chip plastic package is packaged, the two packaging members are directly nested together to complete the assembly, so as to facilitate the installation. The pin hole 30 for the pin 40 to pass through the packaging structure outside is surrounded by the first packaging member 10 and the second packaging member 20, and only the length and width dimensions of the packaging member need to be controlled, so that when the two packaging members are nested together, the edges of the two packaging members can surround the pin hole 30. Therefore, when the packaging member is processed, a large number of pin holes do not need to be formed by the hole processing process, the processing difficulty is reduced, and the packaging member processing is simplified. The above structures will be described in detail below with reference to the drawings.

[0031] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 Each of the first packaging member 10 and the second packaging member 20 includes a rectangular connecting plate, and the opposite edges of the connecting plate are provided with bending plates bent in the same direction, so that the positions of the two bending plates on each packaging member are opposite. When the two packaging members are nested, the first connecting plate 11 in the first packaging member 10 and the second connecting plate 21 in the second packaging member 20 are opposite to each other, and the magnetic chip plastic package is placed between the first connecting plate 11 and the second connecting plate 21. The two first bending plates 12 in the first packaging member 10 and the two second bending plates 22 in the second packaging member 20 are arranged in cross, that is, the two side edges of each first bending plate 12 are arranged adjacent to the side edges of the two second bending plates 22, and the two side edges of each second bending plate 22 are arranged adjacent to the side edges of the two first bending plates 12, so that the first packaging member 10 and the second packaging member 20 form a relatively closed structure similar to a cube, and the magnetic chip plastic package is wrapped therein.

[0032] The magnetic chip plastic package has opposite first and second faces and four side faces respectively connected to the first and second faces, wherein the areas of the first and second faces are greater than the area of each side face. That is, the shape of the magnetic chip plastic package is a flat cubic structure. In determining the type of the magnetic chip plastic package, the magnetic chip plastic package can be a magnetic memory chip plastic package, a sensor chip using a magnetoresistance element, or an integrated circuit chip plastic package using a magnetoresistance element. The magnetic chip plastic package can be a one-time plastic package, or a twice or multiple plastic package. Here, the plastic package refers to the plastic package of the bare chip, and not the nested packaging of two packages in the embodiments of the present application.

[0033] Referring to Figure 1 and Figure 4 After the first package 10 and the second package 20 are nested together to package the magnetic chip plastic package, each face of the magnetic chip plastic package is wrapped with a connecting plate or a bending plate, so that the six faces of the magnetic chip plastic package are wrapped with magnetic shielding plates made of high magnetic permeability material to improve the magnetic shielding effect of the magnetic chip plastic package. In application, the package can be pre-prepared, and after the magnetic chip plastic package is packaged, the two packages are directly nested together to complete the assembly, thereby facilitating installation. At least one face of the magnetic chip plastic package can be bonded to the adjacent connecting plate or bending plate to fix the magnetic chip plastic package and prevent the magnetic chip plastic package from shaking. Specifically, an adhesive such as epoxy resin can be used to fix the two packages on the surface of the magnetic chip plastic package. The thickness of the magnetic shielding material around the magnetic chip plastic package can also be adjusted by adjusting the thickness of the connecting plate and the bending plate, thereby obtaining different magnetic shielding capabilities.

[0034] In addition, when the first package 10 and the second package 20 are nested together, the gap width between any two plates can be less than 25 microns, and specifically, the gap width between any two plates can be controlled to be 24 microns, 20 microns, 16 microns, 12 microns, 8 microns, 4 microns, or any value less than 25 microns, to form a magnetic flux loop and improve the magnetic shielding effect. Of course, the distance between each face of the magnetic chip plastic package and the nearest bending plate or connecting plate can also be less than 25 microns, and specifically, the distance between each face of the magnetic chip plastic package and the nearest bending plate or connecting plate can be controlled to be 24 microns, 20 microns, 16 microns, 12 microns, 8 microns, 4 microns, or any value less than 25 microns, to form a magnetic flux loop and improve the magnetic shielding effect.

[0035] Referring to Figure 1 and Figure 4A pin 40 is further arranged on the magnetic chip package for electrically connecting external signals and electrical devices inside the magnetic chip package. The pin 40 can be arranged on the side of the chip package, or arranged on the edge line of the first or second surface of the chip package connecting with the side. As shown in Figure 1 and Figure 4 After the first package 10 and the second package 20 encapsulate the magnetic chip package, at least one pin hole 30 for passing the pin 40 out of the encapsulation structure is formed by the first package 10 and the second package 20 at the position opposite to the pin 40. That is, the pin hole 30 for passing the pin 40 is not formed on the first package 10, nor on the second package 20, but is formed by the edges of the first package 10 and the second package 20, part of the hole wall of the pin hole 30 is located at the edge of the first package 10, and part of the hole wall of the pin hole 30 is located at the edge of the second package 20. When processing the package, only the length and width dimensions of the package need to be controlled, so that when the two packages are nested together, the edges of the two packages can form the pin hole 30. There is no need to form a large number of pin holes through the hole forming process, which reduces the processing difficulty and simplifies the processing of the package. In addition, the structure shape can be further adjusted, such as the position of the pin hole 30, the length and thickness of the connecting plate and the bending plate, so that the pin 40 of the magnetic chip package is not covered and does not contact the edges of the two packages. Since the pin hole 30 of the two packages does not contact the pin 40, the pin 40 does not need to be insulated, which saves the process step. The number of pin holes 30 can be determined according to the distribution of the pin 40.

[0036] When determining the materials for preparing the packages, high-permeability materials can be pure iron, silicon steel, or permalloy, facilitating the fabrication of single-layer connecting plates and bending plates. It should be noted that high-permeability materials refer to ferromagnetic materials with a permeability of approximately 100 or higher. Silicon steel is the optimal choice for the raw material of the packages, ensuring magnetic shielding efficiency and good machinability. When prefabricating the two packages, both the first package 10 and the second package 20 can be manufactured using machining methods such as milling, grinding, and extrusion molding. This ensures that the packages meet the required specifications, and subsequent nesting and installation completes the re-encapsulation of the magnetic chip. Alternatively, other processes can be used to manufacture the packages. For example, a casting process can be used to prepare the first package 10 and the second package 20. Specifically, molds for casting the first package 10 and the second package 20 can be pre-fabricated, and then the first package 10 and the second package 20 can be manufactured using a casting process, facilitating rapid mass production. In addition, the first package 10 and the second package 20 can be insulated and rust-proofed to prevent electrical defects such as short circuits from occurring when they come into contact with the pin 40. This also prevents rust from affecting the insulation performance and lifespan of the packages.

[0037] Since the magnetic chip molding compound is a flattened cubic structure, when setting up two packages, two different structures can be designed, either with the first connecting plate 11 and the second connecting plate 21 corresponding to the larger first and second surfaces of the magnetic chip molding compound, or with the smaller two sides of the magnetic chip molding compound. These two structures will be described in detail below.

[0038] First, we introduce the design of the first connecting plate 11 and the second connecting plate 21, which correspond to the larger first and second surfaces of the magnetic chip molding compound, respectively. For example... Figure 1 The diagram shows a structural schematic of a first package 10 and a second package 20 assembled together, with the leads 40 of the magnetic chip molded package extending from the lead holes 30 formed by the edges of the first package 10 and the second package 20. Figure 2 for Figure 1 The schematic diagram of the second package 20 in the shown packaging structure shows that the second connecting plate 21 is located on the second surface of the magnetic chip molding compound, i.e. Figure 1 The upper surface of the magnetic plastic sealant. Figure 3 for Figure 1 The schematic diagram of the first package 10 in the shown packaging structure shows that the first connecting plate 11 is located on the first surface of the magnetic chip molding compound, i.e. Figure 1The lower surface of the magnetic plastic package in the magnetic chip. That is, the design of the first package 10 and the second package 20 is in the form of a nested upper and lower clamping. The first package 10 is the lower package, and the second package 20 is the upper package, and the second package 20 is clamped and nested on the first package 10 in the up-down direction.

[0039] At this time, the area of the connecting plate of the two packages is large enough to completely cover the first and second surfaces of the magnetic chip plastic package. During packaging, the first surface of the magnetic chip plastic package is fixed on the first connecting plate 11, which can be fixed on the inner surface of the first connecting plate 11 by using epoxy resin bonding. The inner surface here refers to the surface facing the first bending plate 12. The second connecting plate 21 is clamped on the second surface of the magnetic chip plastic package, and the second connecting plate 21 can also be fixed on the second surface of the magnetic chip plastic package by using bonding. Referring to Figure 1 Each pin hole 30 is surrounded by the edge of the first connecting plate 11, the edge of the second bending plate 22, and part of the edge of each first bending plate 12. That is, each pin hole 30 is located at a lower position.

[0040] Specifically, referring to Figure 2 , the second bending plate 22 is downwardly bent and respectively opposite to the two opposite side positions of the magnetic chip plastic package (with Figure 2 as a reference, the two second bending plates 22 cover the front and rear sides of the magnetic chip plastic package, respectively). And the length of the two second bending plates 22 bent downward is short to avoid contact with the pin 40. The length of the second connecting plate 21 is the same as the length of the magnetic chip plastic package, and the width of the second connecting plate 21 can be larger than the width of the magnetic chip plastic package (excluding the pin 40) by hundreds of microns to several millimeters, which can be determined according to the shielding requirement and the size of the pin 40 of the magnetic chip plastic package, and enough space is left for the pin 40. The distance between the two second bending plates 22 can be slightly larger than the width of the magnetic chip plastic package to accommodate certain processing errors. In addition, referring to Figure 2 , the second connecting plate 21 can be made thicker to improve the magnetic shielding efficiency.

[0041] As shown in the first package 10, Figure 3 , the two first bending plates 12 are upwardly bent and respectively opposite to the two opposite side positions of the magnetic chip plastic package. And the two first bending plates 12 can completely cover the left and right sides of the magnetic chip plastic package (with Figure 3The structure shown is for reference. In addition, each first bent plate 12 can be flush with the outer surface of the second connecting plate 21, or each first bent plate 12 can be higher than the outer surface of the second connecting plate 21. The magnetic shielding effect on the perpendicular magnetic field can be improved. The width of the first connecting plate 11 can be the same as the width of the magnetic chip plastic package, and the length of the first connecting plate 11 can be hundreds of microns to several millimeters longer than the length of the magnetic chip plastic package, which can be determined according to the shielding requirement. The distance between the two first bent plates 12 can be slightly larger than the length of the magnetic chip plastic package, but should be less than 50 microns, which on the one hand accommodates the processing error, and on the other hand does not greatly affect the magnetic flux loop. The thickness of the first connecting plate 11 can be limited so as not to affect the soldering of the pins 40. Specifically, the thickness of the second connecting plate 21 can be greater than the thickness of the first connecting plate 11 to improve the magnetic shielding efficiency, while preventing the first connecting plate 11 from being too thick to affect the soldering of the pins 40.

[0042] Next, a way in which the first connecting plate 11 and the second connecting plate 21 correspond to two sides of the magnetic chip plastic package with smaller areas is introduced. The four sides of the magnetic chip plastic package include opposite first and second sides. The first connecting plate 11 of the first package 10 is opposite the first side, and the second connecting plate 21 of the second package 20 is opposite the second side. As shown in Figure 4 A structure schematic diagram of the first package 10 and the second package 20 when assembled together is shown, and the pins 40 of the magnetic chip plastic package are led out from the pin hole 30 surrounded by the edges of the first package 10 and the second package 20. As shown in Figure 5 For Figure 1 A structure schematic diagram of the first package 10 in the packaging structure is shown, in which the first connecting plate 11 is opposite the left side (the first side) of the magnetic chip plastic package (for reference, the same below). Figure 4 , Figure 5 and Figure 6 The structure shown is for reference, the same below. Figure 6 For Figure 4 A structure schematic diagram of the second package 20 in the packaging structure is shown, in which the second connecting plate 21 is opposite the right side (the second side) of the magnetic chip plastic package. That is, when the magnetic chip plastic package is placed horizontally, the first package 10 and the second package 20 adopt a left-right clamping nested mode. The first package 10 is a left-side package, and the second package 20 is a right-side package, and the second package 20 is clamped and nested on the first package 10 along the left-right direction.

[0043] At this time, the area of the connecting plates of the two packages is small, and the left side and the right side of the magnetic chip plastic package are completely covered. During packaging, the magnetic chip plastic package is located between the two first bending plates 12 of the first package 10, and the first surface and the second surface of the magnetic chip plastic package are fixed on the two first bending plates 12 respectively, which can be fixed by using an adhesive such as epoxy resin. The first connecting plate 11 is arranged opposite to the first side (the left side), and the second connecting plate 21 is arranged opposite to the second side (the right side). Figure 6 The edge of the second bending plate 22 opposite to the position of the pin 40 has a notch 23, and each pin hole 30 is surrounded by the notch 23 and the edge of a first bending plate 12. That is, each pin hole 30 is located at a position below.

[0044] Specifically, referring to Figure 5 , the second bending plate 22 is bent to the right and is opposite to the position of the first surface and the second surface of the magnetic chip plastic package (for example, the upper surface and the lower surface of the magnetic chip plastic package in Figure 4 ). The height of the first connecting plate 11 is low, so that the distance between the two first bending plates 12 is small, which can accommodate the magnetic chip plastic package and ensure that the distance between the upper surface and the lower surface of the magnetic chip plastic package and the nearest first bending plate 12 is less than 25 microns. The length of the two second bending plates 22 bent to the right is long, so as to completely cover the upper surface and the lower surface of the entire magnetic chip plastic package. Referring to Figure 4 , the thickness of the first bending plate 12 opposite to the position of the first surface (the lower surface) among the two first bending plates 12 can be less than the thickness of the second bending plate 22 opposite to the position of the second surface (the upper surface). This can improve the magnetic shielding effect of the vertical magnetic field, while preventing the first bending plate 12 below from being too thick to affect the welding of the pin 40.

[0045] As shown in the second package 20 in Figure 6 , the two second bending plates 22 are bent to the left and are opposite to the positions of the two opposite sides (the front side and the rear side) of the magnetic chip plastic package. In order not to block the pin 40, the second bending plate 22 needs to cut part of the magnetic shielding structure to form a notch 23, so that when the second package 20 is nested on the first package 10, each pin hole 30 is surrounded by the notch 23 and the edge of a first bending plate 12. By forming the notch 23 on the second bending plate 22, the size of the cut magnetic shielding structure is minimized, and more magnetic shielding structures remain on the second bending plate 22, thereby improving the magnetic shielding effect. It should be explained that the thickness of the connecting plate or the bending plate in the first package 10 and the second package 20 can be adjusted between hundreds of microns and several millimeters, which can be determined according to the shielding requirement, the size of the pin 40, the chip welding condition, and the like.

[0046] The packaging structure shown in the embodiment of the present application has good magnetic shielding effect through experimental test. Figure 7 The packaging structure shown in the embodiment of the present application can achieve 85% shielding efficiency for a 700 Oe horizontal magnetic field and 40% shielding efficiency for a 1300 Oe vertical magnetic field.

[0047] The first packaging member 10 and the second packaging member 20 are used to wrap the six surfaces of the magnetic chip plastic packaging member, and the packaging member made of high magnetic permeability material is additionally arranged outside the magnetic chip plastic packaging member to improve the magnetic shielding effect on the magnetic chip. Meanwhile, each packaging member has a connecting plate and two integrated bending plates, and the two packaging members can be nested together to wrap the six surfaces of the magnetic chip plastic packaging member. In application, the packaging member can be prefabricated, and after the magnetic chip plastic packaging member is packaged, the two packaging members are directly nested together to complete the assembly, thereby facilitating the installation. The first packaging member 10 and the second packaging member 20 enclose the pin hole 30 for the pin 40 to pass through the packaging structure outside, and only the length and width dimensions of the packaging member need to be controlled so that the edges of the two packaging members can enclose the pin hole 30 when nested together. Therefore, when the packaging member is processed, a large number of pin holes do not need to be formed through the hole forming process, the processing difficulty is reduced, and the processing of the packaging member is simplified.

[0048] In addition, the embodiment of the present application also provides a magnetic chip packaging member, which comprises a magnetic chip plastic packaging member having a pin 40 and any of the above packaging structures for packaging the magnetic chip plastic packaging member. The first packaging member 10 and the second packaging member 20 are used to wrap the six surfaces of the magnetic chip plastic packaging member, and the packaging member made of high magnetic permeability material is additionally arranged outside the magnetic chip plastic packaging member to improve the magnetic shielding effect on the magnetic chip. Meanwhile, each packaging member has a connecting plate and two integrated bending plates, and the two packaging members can be nested together to wrap the six surfaces of the magnetic chip plastic packaging member. In application, the packaging member can be prefabricated, and after the magnetic chip plastic packaging member is packaged, the two packaging members are directly nested together to complete the assembly, thereby facilitating the installation. The first packaging member 10 and the second packaging member 20 enclose the pin hole 30 for the pin 40 to pass through the packaging structure outside, and only the length and width dimensions of the packaging member need to be controlled so that the edges of the two packaging members can enclose the pin hole 30 when nested together. Therefore, when the packaging member is processed, a large number of pin holes do not need to be formed through the hole forming process, the processing difficulty is reduced, and the processing of the packaging member is simplified.

[0049] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A packaging structure for packaging a magnetic chip plastic package having a pin, characterized by, The magnetic chip plastic package has opposite first and second faces and four side faces respectively connected to the first and second faces, wherein the areas of the first and second faces are greater than the area of each side face, and the packaging structure comprises: a first packaging piece made of high magnetic permeability material, the first packaging piece comprising a rectangular first connecting plate, the first connecting plate having two first bent plates bent in the same direction at opposite two edges of the first connecting plate; a second packaging piece made of high magnetic permeability material, the second packaging piece comprising a rectangular second connecting plate, the second connecting plate having two second bent plates bent in the same direction at opposite two edges of the second connecting plate; wherein the first packaging piece and the second packaging piece are nested in an upper-lower clamping manner, the first face of the magnetic chip plastic package is fixed on the first connecting plate, the second connecting plate is fixed on the second face of the magnetic chip plastic package, the first connecting plate and the second connecting plate are opposite to each other in position, the first connecting plate, the second connecting plate, the two first bent plates and the two second bent plates wrap six faces of the magnetic chip plastic package, and at positions opposite to the pins, the first packaging piece and the second packaging piece enclose at least one pin hole for the pins to pass out of the packaging structure, each pin hole being enclosed by an edge of the first connecting plate, an edge of the second bent plate and a part of an edge of each first bent plate.

2. The packaging structure of claim 1, wherein the first face of the magnetic chip plastic package is fixed on the first connecting plate in a bonding manner, and the second connecting plate is clamped on the second face of the magnetic chip plastic package in a bonding manner.

3. The package structure of claim 1, wherein, each first bent plate is flush with an outer surface of the second connecting plate, or each first bent plate is higher than the outer surface of the second connecting plate.

4. The package structure of claim 1, wherein, The thickness of the second connecting plate is greater than the thickness of the first connecting plate.

5. A packaging structure for packaging a magnetic chip plastic package having a pin, characterized by, The magnetic chip plastic package has opposite first and second faces and four side faces respectively connected to the first and second faces, wherein the areas of the first and second faces are greater than the area of each side face, and the four side faces comprise opposite first and second side faces, and the packaging structure comprises: a first packaging piece made of high magnetic permeability material, the first packaging piece comprising a rectangular first connecting plate, the first connecting plate having two first bent plates bent in the same direction at opposite two edges of the first connecting plate; a second packaging piece made of high magnetic permeability material, the second packaging piece comprising a rectangular second connecting plate, the second connecting plate having two second bent plates bent in the same direction at opposite two edges of the second connecting plate; The first and second packaging members are nested in a left-right buckling manner, the first and second surfaces of the magnetic chip plastic package are fixed on the two first bending plates respectively, the first connecting plate is arranged opposite to the first side surface, the second connecting plate is arranged opposite to the second side surface, the first and second connecting plates are opposite to each other, the first and second connecting plates, the two first bending plates and the two second bending plates wrap six surfaces of the magnetic chip plastic package; and at positions opposite to the pins, the first and second packaging members enclose at least one pin hole for the pins to pass through outside the packaging structure, the second bending plate has a notch at an edge opposite to the pin position, and each pin hole is enclosed by the notch and an edge of the first bending plate.

6. The package structure of claim 5, wherein, The thickness of the first bending plate opposite to the first surface is smaller than the thickness of the first bending plate opposite to the second surface.

7. The package structure of claim 1 or 5, wherein, When the first and second packaging members are nested together, the gap width between any two plates is less than 25 microns, and the distance between each surface of the magnetic chip plastic package and the nearest bending plate or connecting plate is less than 25 microns.

8. The package structure of claim 1 or 5, wherein, The high magnetic permeability material is pure iron, silicon steel or permalloy.

9. The package structure of claim 1 or 5, wherein, The first and second packaging members are made by mechanical processing or casting.

10. A magnetic chip package, characterized by Comprise: A magnetic chip plastic package with pins; A packaging structure as claimed in any one of claims 1-9 for packaging the magnetic chip plastic package.

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