A heat dissipation device

Abstract

The application discloses a heat dissipation device, which comprises an upper cover, a lower cover, a supporting structure, a heat transfer structure, a plurality of different capillary structures and a gas-liquid separation structure, wherein the gas-liquid separation structure is attached to the transmission area and is used for gas-liquid separation of gas formed by the evaporation area and condensate backflowing from the transmission area. The application makes full use of the advantages of different capillary structures, enables working liquid to rapidly and fully circulate heat through gas-liquid two-phase change, improves the effective wetting capillary sectional area, greatly reduces the scattering phenomenon of condensate at the gas-liquid contact interface and the resistance of the interface, enables more condensate to backflow to the evaporation area more quickly, and significantly improves the heat transfer performance of the heat dissipation device in limited space.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation device, and particularly relates to a heat dissipation device with gas-liquid separation and composite capillary structure. BACKGROUND

[0002] During operation of electronic products, heat generated by processors needs to be quickly dissipated so as to keep the working temperature within a normal range. With the upgrading of electronic products, the products become increasingly thin and compact, and the operation becomes increasingly rapid, so more heat is generated in a smaller space, and thus the requirements for heat dissipation devices are increasingly high.

[0003] Common heat dissipation devices, such as a uniform temperature plate, are usually a shell-shaped vacuum sealed cavity structure, the inner wall surface of the shell is provided with a capillary structure, and the shell is filled with working liquid. During operation, one side of the shell is attached to a heat source to absorb heat generated by the heat source to evaporate the working liquid into gas, and the other side of the shell is a condensing side, the gas condenses into liquid to release heat after being cooled, and the condensed liquid flows back to the heat source side of the shell under the action of the capillary structure to continue the cycle of gas-liquid phase change to achieve rapid uniform temperature of the uniform temperature plate, so as to achieve the purpose of heat transfer and dissipation. However, the existing heat dissipation device only relies on the capillary structure to improve the heat transfer performance, and the efficiency is ultimately limited.

[0004] Therefore, how to greatly improve the heat transfer performance of the heat dissipation device in a limited space is a key problem to be solved by the present application. SUMMARY

[0005] In order to improve the heat transfer performance of the heat dissipation device, the present application provides a heat dissipation device, which comprises:

[0006] an upper cover;

[0007] a lower cover, the lower cover and the upper cover jointly forming a sealed vacuum chamber, the sealed vacuum chamber comprising an evaporation area, a condensing area and a transmission area;

[0008] a plurality of first support structures, the top surface and the bottom surface of the first support structure being connected with the first inner surface of the upper cover and the second inner surface of the lower cover respectively, so as to support the upper cover and the lower cover;

[0009] a plurality of heat transfer structures, the bottom surface of the heat transfer structure being connected with the second inner surface of the lower cover, and the height of the heat transfer structure being lower than the height of the first support structure; each heat transfer structure is connected with a plurality of first support structures in series;

[0010] a plurality of second support structures, the top surface and the bottom surface of the second support structure being connected with the first inner surface of the upper cover and the third inner surface of the lower cover respectively, so as to support the upper cover and the lower cover;

[0011] a first capillary and a plurality of second capillaries, each of which is located in the evaporation zone; the first capillary is attached to the second inner surface of the lower cover, and the second capillary is attached to the first support structure and the heat transfer structure;

[0012] a third capillary, which is attached to the third inner surface of the lower cover and the second support structure, and is in series with and communicates with the first capillary;

[0013] an upper cover capillary, which is located in the condensation zone, and is attached to the first inner surface of the upper cover and communicates with the second capillary and the third capillary;

[0014] a gas-liquid separation structure, which is attached to the planar area of the third capillary in the transport zone, and separates the gas formed by the evaporation zone from the condensate flowing back to the transport zone.

[0015] The heat dissipation device described above, wherein, further comprising a plurality of fourth capillaries; the gas-liquid separation structure is provided with a plurality of slots located in the fourth capillary, and the fourth capillary is attached to the third capillary through the slots on the gas-liquid separation structure; one end of each of the fourth capillaries extends to communicate with the first capillary.

[0016] The heat dissipation device described above, wherein, the capillary thickness of the second capillary is greater than or equal to the capillary thickness of the first capillary.

[0017] The heat dissipation device described above, wherein, the capillary thickness of the third capillary is greater than the capillary thickness of the first capillary, the capillary force of the third capillary is smaller than the capillary force of the first capillary, and the permeability of the third capillary is greater than the permeability of the first capillary and the second capillary.

[0018] The heat dissipation device described above, wherein, the capillary thickness of the fourth capillary is greater than the capillary thickness of the third capillary, and the permeability of the fourth capillary is greater than the permeability of the third capillary.

[0019] The heat dissipation device described above, wherein, the gas-liquid separation structure is a metal foil.

[0020] The heat dissipation device described above, wherein, the gas-liquid separation structure is a copper foil.

[0021] The heat dissipation device described above, wherein, the upper cover is a flat plate structure.

[0022] The heat dissipation device described above, wherein, the lower cover is provided with a recess at the center, and the second inner surface of the lower cover is the inner bottom surface of the recess.

[0023] The heat dissipation device described above, wherein, the second inner surface and the third inner surface of the lower cover are in a coplanar relationship.

[0024] The heat dissipation device, wherein one or more of the first capillary, the second capillary, the third capillary, the fourth capillary and the upper cover capillary is made by sintering from any of powder, screen or fiber.

[0025] The heat dissipation device, wherein one or more of the first support structure, the second support structure and the heat transfer structure is bonded to the upper cover or the lower cover by welding, diffusion bonding, hot pressing, soft soldering, hard soldering or adhesive.

[0026] The heat dissipation device, wherein the first support structure, the second support structure and the heat transfer structure are integrally formed on the lower cover.

[0027] The heat dissipation device, wherein the first support structure and the second support structure are in the shape of a column, and the diameter of the second support structure is greater than that of the first support structure.

[0028] The heat dissipation device, wherein the first support structure and the second support structure can be in any of the shape of a column, a square, a rectangle or a polygon.

[0029] The heat dissipation device, wherein the heat transfer structure is in the shape of a rectangle and arranged in parallel to each other, each of the heat transfer structure is separated from each other and uniformly distributed in the whole evaporation area.

[0030] The efficacy of the present application relative to the prior art is that:

[0031] (1) By arranging the composite capillary structure, the advantages of different capillary structures are fully utilized, so that the working liquid in the heat dissipation device rapidly and fully participates in the cycle heat transfer of gas-liquid two-phase change, and the heat transfer performance of the heat dissipation device is improved.

[0032] (2) By arranging the gas-liquid separation structure of the transmission area, the effective wetting capillary cross-sectional area is improved, the scattering phenomenon of the condensate at the gas-liquid contact interface and the interface resistance are greatly reduced, the gas flowing from the evaporation area to the condensation area and the condensate flowing back to the transmission area do not interfere with each other, the backflow resistance of the condensate is reduced, more condensate flows back to the evaporation area faster, the evaporation speed of the working liquid in the evaporation area is effectively improved, and the heat transfer performance of the heat dissipation device is significantly improved in a limited space.

[0033] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the principles of the present application, and provide further explanation of the scope of the patent application of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1An exploded view of the structure of the heat dissipating device of the present invention;

[0035] Figure 2 A bottom view of the upper cover of the heat dissipating device of the present invention;

[0036] Figure 3 A top view of the lower cover of the heat dissipating device of the present invention;

[0037] Figure 4 A cross-sectional view of the lower cover of the heat dissipating device of the present invention;

[0038] Figure 4a A partial structure enlarged view of Figure 4 the heat dissipating device of the present invention;

[0039] Figure 5 A longitudinal section view of the heat dissipating device of the present invention;

[0040] Figure 6a A schematic view of the effective wetted capillary cross-sectional area of the prior art;

[0041] Figure 6b A schematic view of the effective wetted capillary cross-sectional area of the present invention;

[0042] Figure 7a A schematic view of the vapor cross-sectional area at the gas-liquid interface of the prior art;

[0043] Figure 7b A schematic view of the vapor cross-sectional area at the gas-liquid interface of the present invention;

[0044] Figure 8 A comparison chart of the test results of the thermal resistance performance of the heat dissipating device.

[0045] Wherein, the reference signs are:

[0046] 10.... upper cover

[0047] 11.... first inner surface

[0048] 101... upper cover capillary

[0049] 20.... lower cover

[0050] 21.... second inner surface

[0051] 22.... third inner surface

[0052] 201... first capillary

[0053] 202... second capillary

[0054] 203... third capillary

[0055] 204... fourth capillary

[0056] 205 gas-liquid separation structure

[0057] 2051 slot

[0058] 30 first support structure

[0059] 40 heat transfer structure

[0060] 50 second support structure

[0061] EZone evaporation zone

[0062] CZone condensation zone

[0063] TZone transport zone

[0064] A 1-wick effective wetted capillary cross-sectional area of the prior art

[0065] A 2-wick effective wetted capillary cross-sectional area of the present invention

[0066] A 1-vapor vapor cross-sectional area at the gas-liquid contact interface of the prior art

[0067] A 2-vapor vapor cross-sectional area at the gas-liquid contact interface of the present invention DETAILED DESCRIPTION

[0068] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely explain the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0069] The illustrative embodiments of the present application and their description serve only to explain the present application. They are not meant to limit the present application. In addition, elements / components having the same or similar functions and configurations are denoted by the same or similar reference numerals throughout the drawings and embodiments.

[0070] As to the directional terms used in the present disclosure, such as up, down, left, right, front, back, etc., they are only used to describe and understand the relative positions between the components in the drawings. Therefore, the directional terms are used to explain and not to limit the present application.

[0071] As to the terms "comprising", "including", "having", "containing", etc. used in the present disclosure, they are open terms meaning including but not limited to.

[0072] The term "and / or" as used herein includes any or all of the things mentioned.

[0073] The term "multiple" in this article includes "two" and "more than two"; the term "multiple groups" in this article includes "two groups" and "more than two groups".

[0074] Certain terms used to describe this application will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the application.

[0075] Please see Figures 1 to 4a . Figure 1 This is an exploded view of the heat dissipation device of the present invention. Figure 2 This is a bottom view of the upper cover of the heat dissipation device of the present invention. Figure 3 This is a top view of the lower cover of the heat dissipation device of the present invention. Figure 4 This is a cross-sectional perspective view (AA) of the lower cover of the heat dissipation device of the present invention. Figure 4a for Figure 4 A magnified view of a local structure. For example... Figures 1 to 4aAs shown, the heat dissipation device comprises an upper cover 10, a lower cover 20, an upper cover capillary 101, a first capillary 201, a plurality of second capillaries 202, a third capillary 203, a plurality of fourth capillaries 204, a plurality of first support structures 30, a plurality of heat transfer structures 40, a plurality of second support structures 50 and a gas-liquid separation structure 205; the top surface and the bottom surface of the first support structure 30 are connected with the first inner surface 11 of the upper cover 10 and the second inner surface 21 of the lower cover 20 respectively, the bottom surface of the heat transfer structure 40 is connected with the second inner surface 21 of the lower cover 20, each heat transfer structure 40 is connected with a plurality of first support structures 30 in series, the height of the heat transfer structure 40 is lower than the height of the first support structure 30, and the top surface and the bottom surface of the second support structure 50 are connected with the first inner surface 11 of the upper cover 10 and the third inner surface 22 of the lower cover 20 respectively. The upper cover 10 and the lower cover 20 jointly form a sealed vacuum chamber, the sealed vacuum chamber comprises an evaporation zone EZone, a condensation zone CZone and a transmission zone TZone, the transmission zone TZone is arranged on both sides of the evaporation zone EZone; the first capillary 201 and the second capillary 202 are both located in the evaporation zone EZone, the first capillary 201 is a planar capillary and is attached to the second inner surface 21 of the lower cover 20, and the second capillary 202 is a three-dimensional capillary and is attached to the first support structure 30 and the heat transfer structure 40; the upper cover capillary 101 is located in the condensation zone CZone, is a planar capillary, is attached to the first inner surface 11 of the upper cover 10, and is in communication with the second capillary 202 and the third capillary 203; the third capillary 203 is located in the transmission zone TZone and the evaporation zone EZone, is a three-dimensional capillary, is attached to the third inner surface 22 of the lower cover 20 and the second support structure 50, and is in sequence and communication with the first capillary 201; a plurality of fourth capillaries 204 are arranged in the transmission zone TZone and are attached to the third capillary 203, one end of each of the fourth capillaries 204 extends to the first capillary 201, and the height of the fourth capillary 204 is higher than the height of the third capillary 203; the gas-liquid separation structure 205 is attached to the planar area of the third capillary 203 in the transmission zone TZone, and a plurality of grooves 2051 for arranging the fourth capillaries 204 are arranged on the gas-liquid separation structure 205.

[0076] It should be noted that:

[0077] (1) The upper cover 10 of the embodiment is a flat plate structure, and the center of the lower cover 20 is provided with a recessed part for being close to a heat source (not shown); the inner bottom surface of the recessed part of the lower cover 20 is the second inner surface 21, and the inner bottom surface of the non-recessed part of the lower cover 20 and the side wall surface of the recessed part are the third inner surface 22; but the present application is not limited thereto, and in other embodiments, the second inner surface 21 and the third inner surface 22 of the lower cover 20 can also be in a coplanar relationship;

[0078] (2) The plurality of first support structures 30 and the plurality of second support structures 50 collectively support the upper cover 10 and the lower cover 20 of the heat dissipation device, avoid deformation such as concave or bulging of the heat dissipation device, enhance the compression resistance thereof, ensure the existence and stability of the steam space inside the heat dissipation device, and further ensure the stable heat transfer performance of the heat dissipation device; the first support structure 30, the second support structure 50, and the heat transfer structure 40 are integrally formed on the lower cover 20; or, one or more of the first support structure 30, the second support structure 50, and the heat transfer structure 40 are joined with the upper cover 10 or the lower cover 20 by welding, diffusion bonding, hot pressing, soft soldering, hard soldering, or adhesive; the shapes of the first support structure 30 and the second support structure 50 are cylindrical, and the diameter of the second support structure 50 is greater than that of the first support structure 30; or, the shapes of the first support structure 30 and the second support structure 50 can also be any one of cylindrical, square, rectangular, or polygonal;

[0079] (3) The heat transfer structures 40 of the present embodiment are substantially rectangular and arranged in parallel to each other, each heat transfer structure 40 is separated from each other and uniformly distributed in the entire evaporation zone EZone; but the present application is not limited thereto, in other embodiments, the heat transfer structures 40 can be arranged in a non-parallel manner, such as radiating, crossing, or other ways connecting several first support structures 30; the arrangement of the heat transfer structures 40 is used to enhance the strength of the first support structure 30, while increasing the heat transfer surface of the evaporation zone EZone;

[0080] (4) One or more of the first capillary 201, the second capillary 202, the third capillary 203, the fourth capillary 204, and the upper cover capillary 101 are made of any one of powder, screen, or fiber by high-temperature sintering;

[0081] (5) The gas-liquid separation structure 205 of the present embodiment is a metal foil, which can be a copper foil, and is attached to the planar area of the third capillary 203 in the transmission zone TZone by high-temperature sintering; since the transmission zone TZone of the present embodiment is arranged on both sides of the evaporation zone EZone, the number of gas-liquid separation structures 205 is 2, but the present application is not limited thereto; in other embodiments, the number and position of the gas-liquid separation structure 205 can be adjusted according to the specific arrangement of the transmission zone TZone;

[0082] (6) The number of the fourth capillary 204 of the present embodiment is 8 and is symmetrically arranged; but the present application is not limited thereto, in other embodiments, the number, layout, length, overall shape, etc. of the fourth capillary 204 can be adjusted and designed according to the specific situation.

[0083] Please refer to Figure 5 . Figure 5 is a longitudinal sectional view of the heat dissipation device of the present application. As Figure 5The direction of the dashed arrow shows the flow direction of the gas formed after the evaporation zone absorbs heat, and the direction of the solid arrow shows the flow direction of the condensed liquid. The following will be described in combination with Figure 5 The working process of the heat dissipation device will be described in detail. After the evaporation zone EZone absorbs heat from the second inner surface 21 of the lower cover 20 corresponding to the external heat source (not shown), the working liquid is vaporized into gas through the first capillary 201 attached to the second inner surface 21 of the lower cover 20, the second capillary 202 attached to the first support structure 30 and the heat transfer structure 40, and the third capillary 203 in the evaporation zone EZone. This vaporization process generates a local high pressure, and the gas flows to the condensation zone CZone under the action of the pressure; the gas is cooled in the condensation zone CZone and condensed into liquid through the upper cover capillary 101 attached to the upper cover 10, thereby releasing and transferring heat to the condensation zone CZone; the condensed liquid returns through the third capillary 203 attached to the second support structure 50 and the third inner surface 22 of the lower cover 20 in the transmission zone TZone, and the fourth capillary 204 attached to the third capillary 203, and finally returns to the evaporation zone EZone to continue the cycle of heat transfer of the gas-liquid two-phase change; in this process, the gas-liquid separation structure 205 attached to the planar area of the third capillary 203 in the transmission zone TZone is used to separate the gas formed in the evaporation zone EZone from the condensed liquid returning in the transmission zone TZone, so that they do not interfere with each other.

[0084] Further explanation: the capillary thickness of the first capillary 201 is less than or equal to the capillary thickness of the second capillary 202, and both the first capillary 201 and the second capillary 202 have strong capillary force, that is, both have large heat transfer capacity, which can quickly vaporize the working liquid in the evaporation zone EZone to quickly absorb heat from the heat source (not shown) for heat transfer; the capillary force of the third capillary 203 is smaller than that of the first capillary 201, the capillary thickness of the third capillary 203 is greater than that of the first capillary 201, and the permeability of the third capillary 203 is greater than that of the first capillary 201 and the second capillary 202, so that the third capillary 203 can absorb more liquid and the return resistance of the liquid is smaller, so that the condensed liquid can quickly return; the capillary thickness of the fourth capillary 204 is greater than that of the third capillary 203, and the permeability of the fourth capillary 204 is greater than that of the third capillary 203, and the dispersed fourth capillary 204 as a return enhancement structure can further accelerate the return of the condensed liquid. By arranging the composite capillary structure, the advantages of different capillary structures are fully utilized, so that the working liquid in the heat dissipation device quickly and fully participates in the cycle of heat transfer of the gas-liquid two-phase change; by arranging the gas-liquid separation structure in the transmission zone TZone, the return resistance of the condensed liquid is reduced, so that more condensed liquid returns to the evaporation zone EZone faster, and the heat transfer performance of the heat dissipation device is improved.

[0085] Please refer to Figure 6a 、 Figure 6b . Figure 6a is a schematic diagram of the effective wetted capillary cross-sectional area of the prior art, Figure 6b is a schematic diagram of the effective wetted capillary cross-sectional area of the present application. The heat transfer power Q of the heat dissipation device can be theoretically calculated by the following formula:

[0086]

[0087] In the above formula,

[0088] A wick : effective wetted capillary cross-sectional area, k wick : capillary permeability, p1: working fluid density; σ: working fluid surface tension; λ: latent heat of working fluid; r c : capillary radius; L Effec灄ive : effective length; μ1: working fluid viscosity.

[0089] As can be seen from the above formula, under the condition that other parameters remain unchanged, the size of the effective wetted capillary cross-sectional area A wick directly affects the level of the heat transfer power Q of the heat dissipation device. The larger the effective wetted capillary cross-sectional area A wick , the higher the heat transfer power Q. As shown in Figure 6a 、 Figure 6b , the gas formed after the evaporation zone absorbs heat shares a vacuum chamber with the condensed liquid backflowing in the transmission zone through the capillary structure, and the steam occupies part of the space on the surface of the capillary structure; while the present application has a gas-liquid separation structure 205 attached to the surface of the capillary structure, which can block the steam from occupying the space of the capillary structure; thus, the effective wetted capillary cross-sectional area A 2-wick of the present application is larger than the effective wetted capillary cross-sectional area A 1-wick of the prior art, which can make more condensed liquid backflow in the capillary structure of the transmission zone, thereby making more condensed liquid backflow to the evaporation zone, keeping the evaporation zone wet to generate a larger heat flux, and improving the heat transfer performance of the heat dissipation device.

[0090] Please refer to Figure 7a 、 Figure 7b . Figure 7a is a schematic diagram of the steam cross-sectional area at the gas-liquid contact interface of the prior art, Figure 7b is a schematic diagram of the steam cross-sectional area at the gas-liquid contact interface of the present application. When the heat dissipation device is working, the gas flowing to the condensation zone after the evaporation zone absorbs heat shares a vacuum chamber with the condensed liquid backflowing in the transmission zone through the capillary structure, and the two phases interfere with each other, the shear stress acts on the gas-liquid contact interface, the condensed liquid on the surface of the capillary structure appears droplet scattering, and the resistance of the interfacial tension is increased, which affects the backflow of the condensed liquid to the evaporation zone. This influence is the scattering limit q at the gas-liquid contact interfaceEn灄rain This can be expressed as follows, and can be theoretically calculated using the following formula:

[0091]

[0092] In the above formula,

[0093] A vapor : Steam cross-sectional area; λ fg : Latent heat of working fluid; σ: Surface tension; ρ v : Steam density; r c : Capillary radius.

[0094] From the above formula, it can be seen that, with other parameters remaining unchanged, the steam cross-sectional area A vapor The size directly affects the scattering limit q En灄rain Size. Steam cross-sectional area A vapor The smaller the value, the greater the scattering limit q. En灄rain If the liquid becomes infinitely small, there will be no problem with droplets scattering, thus improving the heat transfer performance of the heat dissipation device. For example... Figure 7a , Figure 7b As shown, the existing technology does not include any structure at the gas-liquid interface to reduce the mutual interference between the gas and liquid phases, and its vapor cross-sectional area A 1-vapor A larger value means a larger scattering limit, and the condensate on the capillary surface will scatter as droplets, affecting the condensate return flow and greatly reducing the heat transfer performance of the heat dissipation device; however, this invention uses a gas-liquid separation structure 205 at the gas-liquid interface, increasing the vapor cross-sectional area A at the gas-liquid interface. 2-vapor The size becomes very small, which means that the scattering limit also becomes infinitely small. The condensate on the capillary surface will not have the problem of droplet scattering. The resistance at the gas-liquid interface is greatly reduced, which is conducive to the smooth return of the condensate to the evaporation zone to continue the cycle of heat transfer of gas-liquid two-phase change, and significantly improves the heat transfer performance of the heat dissipation device.

[0095] Please see Figure 8 . Figure 8 This is a comparison chart of the test results for the thermal resistance performance of the heat dissipation devices. The heat transfer performance of a heat dissipation device is commonly expressed by thermal resistance; the lower the thermal resistance, the stronger the heat transfer performance. The test samples were a conventional composite capillary structure heat dissipation device without a gas-liquid separation structure and the heat dissipation device of this invention with a gas-liquid separation composite capillary structure, used to verify the influence of the gas-liquid separation structure on the thermal resistance performance. The thermal resistance performance test was conducted under the test conditions shown in the table below:

[0096]

[0097]

[0098] like Figure 8The test results of the thermal resistance performance show that the heat dissipation device with the gas-liquid separation composite capillary structure has a significantly reduced thermal resistance, that is, the heat transfer performance is significantly improved by about 20% to 25%, compared with the conventional composite capillary structure without the gas-liquid separation structure.

[0099] In summary, the heat dissipation device provided by the application utilizes the advantages of different capillary structures by arranging the composite capillary structure, so that the working liquid in the heat dissipation device rapidly and fully participates in the cyclic heat transfer of the gas-liquid two-phase change; the arrangement of the gas-liquid separation structure in the transmission area improves the effective wetting capillary sectional area and greatly reduces the scattering phenomenon of the condensed liquid at the gas-liquid contact interface, so that the gas flowing from the evaporation area to the condensation area and the condensed liquid flowing back to the evaporation area do not interfere with each other, more condensed liquid flows back to the evaporation area faster, the evaporation speed of the working liquid in the evaporation area is effectively improved, and the heat transfer performance of the heat dissipation device is significantly improved in a limited space.

[0100] Although the application is disclosed with the above-mentioned embodiments, it is not intended to limit the application, and any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the application, so the patent protection scope of the application should be defined by the protection scope of the claims attached to the specification.

Claims

1. A heat dissipating device, characterized by, The application relates to a vacuum chamber, comprising: an upper cover; a lower cover, which, together with the upper cover, forms a sealed vacuum chamber, the sealed vacuum chamber comprising an evaporation area, a condensation area and a transmission area, the evaporation area and the transmission area being arranged on the second inner surface and the third inner surface of the lower cover respectively, and the transmission area being arranged on both sides of the evaporation area, the condensation area being arranged on the first inner surface of the upper cover, the condensation area being arranged opposite to the evaporation area and the transmission area; a plurality of first support structures, the top surface and the bottom surface of the first support structures being connected to the first inner surface of the upper cover and the second inner surface of the lower cover respectively, so as to support the upper cover and the lower cover; a plurality of heat transfer structures, the bottom surface of the heat transfer structures being connected to the second inner surface of the lower cover, and the height of the heat transfer structures being lower than the height of the first support structures; each of the heat transfer structures being connected to a plurality of the first support structures in series; a plurality of second support structures, the top surface and the bottom surface of the second support structures being connected to the first inner surface of the upper cover and the third inner surface of the lower cover respectively, so as to support the upper cover and the lower cover; a first capillary and a plurality of second capillaries, which are arranged in the evaporation area; the first capillary being attached to the second inner surface of the lower cover, and the second capillaries being attached to the first support structures and the heat transfer structures; a third capillary, which is attached to the third inner surface of the lower cover and the second support structures, and is connected to the first capillary in series and communicates with the first capillary; an upper cover capillary, which is arranged in the condensation area, and is attached to the first inner surface of the upper cover and communicates with the second capillaries and the third capillary; a gas-liquid separation structure, which is attached to the planar area of the third capillary in the transmission area and extends to the side edge of the lower cover, separates the gas formed in the evaporation area from the condensed liquid flowing back in the transmission area, and is a metal foil, so as to improve the effective wetting capillary sectional area and reduce the gas-liquid interface resistance; a plurality of fourth capillaries, the gas-liquid separation structure being provided with a plurality of slots for the fourth capillaries, the fourth capillaries being attached to the third capillary through the slots on the gas-liquid separation structure, and one end of each of the fourth capillaries extending to communicate with the first capillary, the capillary thickness of the fourth capillaries being greater than that of the third capillaries, and the permeability of the fourth capillaries being greater than that of the third capillaries, so as to accelerate the flow back of the condensed liquid as a backflow strengthening structure; wherein the evaporation area absorbs external heat source, evaporates and vaporizes the working liquid into gas through the first capillary, the first support structures, the second capillary and the third capillary, the gas flows to the condensation area under the action of pressure and is condensed into liquid in the condensation area through the upper cover capillary; the condensed liquid flows back through the third capillary in the transmission area and the fourth capillaries attached to the third capillary, and finally flows back to the evaporation area; and the gas-liquid separation structure separates the gas formed in the evaporation area from the condensed liquid flowing back to the transmission area.

2. The heat dissipating device of claim 1, wherein The second capillary has a capillary thickness greater than or equal to the capillary thickness of the first capillary.

3. The heat dissipating device of claim 2, wherein The third capillary has a capillary thickness greater than the capillary thickness of the first capillary, a capillary force less than the capillary force of the first capillary, and a permeability greater than the permeability of the first capillary and the second capillary.

4. The heat dissipating device of claim 1, wherein The gas-liquid separation structure is a copper foil.

5. The heat dissipating device of claim 1, wherein The upper cover is a flat plate structure.

6. The heat dissipating device of claim 1, wherein The lower cover has a recess at the center, and the second inner surface of the lower cover is an inner bottom surface of the recess.

7. The heat dissipating device of claim 1, wherein The second inner surface and the third inner surface of the lower cover are coplanar.

8. The heat dissipating device of claim 1, wherein One or more of the first capillary, the second capillary, the third capillary, the fourth capillary, and the upper cover capillary is made of any one of powder, screen, or fiber by sintering.

9. The heat dissipating device of claim 1, wherein One or more of the first support structure, the second support structure, and the heat transfer structure is bonded to the upper cover or the lower cover by welding, diffusion bonding, hot pressing, soft soldering, hard soldering, or adhesive.

10. The heat dissipating device of claim 1, wherein The first support structure, the second support structure, and the heat transfer structure are integrally formed on the lower cover.

11. The heat dissipating device according to any one of claims 9 or 10, wherein The first support structure and the second support structure are cylindrical in shape, and the diameter of the second support structure is greater than the diameter of the first support structure.

12. The heat dissipating device according to any one of claims 9 or 10, wherein The first support structure and the second support structure can be cylindrical, square, rectangular, or polygonal in shape.

13. The heat dissipating device of claim 1, wherein The heat transfer structure is rectangular and arranged in parallel with each other, each of the heat transfer structures is separated from each other and uniformly distributed throughout the evaporation area.

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