Fingerprint detection device and electronic device

Abstract

A fingerprint detection device (200) and an electronic device (300), applicable to an electronic device (300) having a display screen (310), wherein the bottom layer of the display screen (310) is an opaque layer, and a window penetrating the opaque layer is formed on the opaque layer; the fingerprint detection device (200) comprises: an optical path layer (220) and a first sensor chip (230), wherein the optical path layer (220) is arranged above the first sensor chip (230); a substrate (210), a fixing structure, and a pressure-sensitive adhesive (391); the first sensor chip (230) and the A fixing structure is arranged on the upper surface of the substrate (210), and the upper surface of the fixing structure is fixed to the lower surface of the display screen (310) through the pressure-sensitive adhesive (391); the curing adhesive (240); the side of the fixing structure includes the first side (297) and at least one second side (298) other than the first side (297); the substrate (210) is provided with a gold finger (2122) at a position close to the first side (297); the curing adhesive (240) is arranged between the at least one second side (298) and the display screen (310). The method can not only reduce the thickness of the fingerprint detection device (200), but also ensure the performance stability of the fingerprint detection device (200).

Description

Technical Field

[0001] The embodiments of the present application relate to the field of fingerprint recognition, and more specifically, to a fingerprint detection device and an electronic device. Background Art

[0002] At present, the under-screen fingerprint recognition solution is to attach the optical or ultrasonic fingerprint recognition module to the bottom of the organic light-emitting diode (OLED) screen. That is, both the optical fingerprint recognition module and the ultrasonic fingerprint recognition module need to be tightly bonded to the light-emitting layer at the bottom of the screen.

[0003] However, for the existing screen-attaching solutions, when performing relevant mechanical reliability or thrust tests, the fingerprint recognition module as a whole will be displaced, so that the thrust value of the fingerprint detection module cannot meet the thrust test requirements of the end customers.

[0004] Therefore, there is an urgent need in the art for a fingerprint recognition device and an electronic device that can meet the thrust test requirements. Summary of the invention

[0005] Provided are a fingerprint detection device and an electronic device, which can not only reduce the thickness of the fingerprint detection device but also ensure the performance stability of the fingerprint detection device.

[0006] In a first aspect, a fingerprint detection device is provided, which is applicable to an electronic device having a display screen, wherein the bottom layer of the display screen is an opaque layer, and a window penetrating the opaque layer is formed on the opaque layer;

[0007] The fingerprint detection device comprises:

[0008] An optical path layer and a first sensor chip, wherein the optical path layer is arranged above the first sensor chip;

[0009] Substrates, fixing structures and pressure-sensitive adhesives;

[0010] The first sensor chip is fixedly and electrically connected to the substrate, the fixed structure is arranged on the upper surface of the substrate and surrounds the first sensor chip, and the upper surface of the fixed structure is fixed to the lower surface of the display screen by the pressure-sensitive adhesive, so that the first sensor chip is aligned with the window, and the first sensor chip is used to receive a fingerprint detection signal through the window that is returned by a human finger above the display screen and guided by the optical path layer, and the fingerprint detection signal is used to detect the fingerprint information of the finger;

[0011] Curing glue;

[0012] Among them, the side of the fixed structure includes the first side and at least one second side other than the first side, the substrate is provided with a gold finger at a position close to the first side, the gold finger of the substrate can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the curing adhesive is arranged between the at least one second side and the display screen to fix the pressure-sensitive adhesive relative to the display screen.

[0013] For the fingerprint detection device, the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed to the substrate by the first fixing glue, which can avoid setting up a separate shell for the optical path layer and the first sensor chip, thereby reducing the size (for example, thickness) of the fingerprint detection device.

[0014] In addition, the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed to the substrate by the first fixing glue, so that the components are tightly matched in the thickness direction (that is, the components are tightly matched in the thickness direction without reserving any gaps), thereby reducing the size (such as thickness) of the fingerprint detection device.

[0015] Accordingly, when the thickness of the fingerprint detection device is controlled, the fingerprint recognition device can be placed between the display screen and the battery, which not only does not require adjustment of the original internal structure of the electronic device, but also improves the utilization rate of the internal space of the electronic device. For example, the volume of the battery can be increased, and the saved space can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.

[0016] In addition, by arranging the curing adhesive between the at least one second side portion and the display screen to fix the pressure-sensitive adhesive relative to the display screen, the thrust value of the fingerprint detection device can meet the thrust test requirements of the end customer, that is, the fingerprint detection device will not be displaced during the thrust test. Based on this, the connection stability of the fingerprint detection device during use can be guaranteed, and accordingly, the performance stability of the fingerprint detection device can be guaranteed.

[0017] In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also ensure the performance stability of the fingerprint detection device.

[0018] In some possible implementations, the curing adhesive is UV curing adhesive or hot melt adhesive.

[0019] In some possible implementations, the fingerprint detection device further includes:

[0020] Limiting structure and structural fixing glue;

[0021] The limiting structure is fixed to the outer side of the at least one second side portion of the lower surface of the display screen by the structural fixing adhesive, and the curing adhesive is arranged between the limiting structure and the at least one second side portion.

[0022] By setting the limiting structure, not only can a holding space be provided for the curing adhesive, but also a holding space can be constructed for the curing adhesive. Accordingly, it can be ensured that the at least one second side portion is sufficiently covered with curing adhesive to improve the curing effect of the curing adhesive.

[0023] In some possible implementations, the limiting structure includes a limiting plate, and the limiting plate is provided with an opening corresponding to the first side portion.

[0024] The opening corresponding to the first side portion can provide a receiving space for the gold finger of the flexible circuit board, and accordingly, the installation complexity of the fingerprint detection device can be reduced.

[0025] In some possible implementations, at least one limit block corresponding to the at least one second side portion is formed on the inner side of the limit plate, and the limit plate and the at least one limit block form a step structure, the step structure includes the lower surface of the at least one limit block, the lower surface of the limit plate forms a step structure, and a vertical surface for connecting the lower surface of the at least one limit block and the lower surface of the limit plate, the lower surface of the limit plate is fixed to the lower surface of the display screen by the structural fixing adhesive, and the lower surface of the at least one limit block contacts the upper surface of the pressure-sensitive adhesive.

[0026] Through the step structure, the limiting structure can not only limit the displacement of the pressure-sensitive adhesive, but also limit the displacement of the curing adhesive, that is, the pasting effect of the pressure-sensitive adhesive and the curing effect of the curing adhesive can be enhanced simultaneously.

[0027] In some possible implementations, a gap for accommodating the curing adhesive is formed between the at least one limiting block and the at least one second side portion.

[0028] By arranging the curing glue between each limiting block and the corresponding second side portion, not only can it be ensured that the at least one second side portion has a sufficient contact area with the curing glue to ensure the curing effect, but it can also provide a buffer space between the at least one second side portion and the at least one limiting block. The buffer space can prevent the at least one limiting block from directly touching the at least one side portion, and accordingly, the stability of the performance of the fingerprint detection device can be ensured.

[0029] In some possible implementations, a gap for accommodating the curing adhesive is formed between the vertical surface and the side wall of the pressure-sensitive adhesive.

[0030] By arranging the curing adhesive between the vertical surface and the pressure-sensitive adhesive, not only can the contact area between the pressure-sensitive adhesive and the curing adhesive be guaranteed to ensure the curing effect of the curing adhesive, but also a buffer space can be provided between the pressure-sensitive adhesive and the limiting plate. The buffer space can prevent the limiting plate from directly touching the pressure-sensitive adhesive. Accordingly, it can prevent the fingerprint recognition device from being misaligned due to the limiting plate squeezing the pressure-sensitive adhesive, thereby ensuring the stability of the performance of the fingerprint detection device.

[0031] In some possible implementations, each of the at least one limit block is a T-shaped limit block.

[0032] By designing each of the at least one limiting block as a T-shaped limiting block, the force-bearing area of ​​the limiting structure can be increased while ensuring the accommodating space for the curing glue, and accordingly, the limiting effect of the limiting structure can be improved.

[0033] In some possible implementations, the opaque layer is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer in a surrounding area of ​​the window by the pressure-sensitive adhesive.

[0034] In some possible implementations, the opaque layer includes a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixed structure is fixed to the lower surface of the copper foil layer located in the surrounding area of ​​the window by the pressure-sensitive adhesive, or the upper surface of the fixed structure is fixed to the lower surface of the support film by the pressure-sensitive adhesive.

[0035] By using the first pressure-sensitive adhesive and the fixing structure of the substrate, the fingerprint detection device is adhered to the lower surface of the buffer layer, copper foil layer or support film of the display screen. Compared with directly adhering the fingerprint detection device to the display panel (i.e., OLED layer) of the display screen, it can not only avoid affecting the performance of the display screen after adhering the fingerprint detection device to the display screen, but also reduce the difficulty of installing the fingerprint detection device. Accordingly, it can reduce the installation complexity of the fingerprint detection device and improve the yield rate of the electronic device. Moreover, adhering the fingerprint detection device to the lower surface of the buffer layer, copper foil layer or support film of the display screen can also avoid damaging the display screen during the disassembly of the fingerprint detection device. Accordingly, it can reduce the disassembly complexity of the fingerprint detection device and improve the yield rate of the electronic device.

[0036] In addition, by using the fixing structure of the substrate through the first pressure-sensitive adhesive, the fingerprint detection device is adhered to the lower surface of the buffer layer or copper foil layer of the display screen. When the display screen is pressed or the electronic device falls or collides, the lower surface of the buffer layer and / or copper foil layer exists between the display panel and the fingerprint detection device, so as to avoid the display panel and the fingerprint detection device from being squeezed and affecting the performance of the display panel and the fingerprint detection device. In addition, by adhering the fingerprint detection device to the lower surface of the buffer layer or copper foil layer of the display screen, compared with directly attaching the fingerprint detection device to the display panel or support film of the display screen, it is also possible to avoid the size of the window being too large. Accordingly, it is possible to reduce the visibility of the fingerprint detection device when the user views it from the front of the display screen, thereby beautifying the appearance of the electronic device.

[0037] In some possible implementations, a connection portion corresponding to an upper surface of the fixing structure is provided on the lower surface of the supporting film in the area of ​​the window, and the connection portion is connected to the supporting film by a double-sided adhesive tape.

[0038] The connection portion can prevent the curing adhesive or the pressure-sensitive adhesive from forming irregular sticking marks on the support film, and accordingly, can ensure the aesthetics of the electronic device equipped with the fingerprint detection device.

[0039] In some possible implementations, the connecting portion is a rigid reinforcing plate or a polyethylene terephthalate adhesive layer.

[0040] In some possible implementations, the connecting portion is an opaque medium layer.

[0041] Setting the connecting portion as an opaque dielectric layer is equivalent to reducing the size of the window, and accordingly can reduce the visibility of the fingerprint detection device when the user views it from the front of the display screen, thereby beautifying the appearance of the electronic device.

[0042] In some possible implementations, the substrate includes, from top to bottom, a first covering layer, a first conductive layer, a base material layer, a second conductive layer, and a second covering layer in sequence; the upper surface of the substrate extends downward in a first region and penetrates the first covering layer and the first conductive layer to form a first groove; the upper surface of the substrate extends downward in a second region connected to the first region and penetrates the first covering layer to form a pad of the substrate;

[0043] The fingerprint detection device also includes:

[0044] A first fixing glue and a first gold wire;

[0045] The lower surface of the first sensor chip is fixed to the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.

[0046] By removing the first covering layer and the first conductive layer of the substrate at the first area to form a first groove for accommodating the first fixing glue and the first sensor chip, the thickness of the fingerprint detection device can be reduced.

[0047] Secondly, by removing the first covering layer at the second area of ​​the substrate, a substrate pad for electrically connecting the first sensor chip is formed, which can provide an accommodation space for the first gold wire for electrically connecting the first sensor chip and the substrate. Accordingly, the space occupied by the first gold wire above the substrate is reduced, thereby reducing the thickness of the fingerprint detection device.

[0048] Thirdly, in the thickness direction, the various layers are closely matched to ensure that the thickness of the fingerprint detection device is reduced to the greatest extent.

[0049] Finally, since the optical path layer is directly arranged on the upper surface of the first sensor chip, the image acquisition field of view of the fingerprint detection device is only affected by the area of ​​the optical path layer and the area of ​​the corresponding first sensor chip. Based on this, the area of ​​the optical path layer and the area of ​​the corresponding first sensor chip can be reasonably designed according to actual needs to meet the needs of different users and different customers (such as the need for a large-area image acquisition field of view).

[0050] In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also ensure a sufficiently large image acquisition field of view.

[0051] In some possible implementations, the fingerprint detection device further includes:

[0052] A second sensor chip, a second fixing glue and a second gold wire;

[0053] Among them, the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, the second sensor chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.

[0054] By setting up the second sensor chip, the processing task of the first sensor chip can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a first sensor chip and a second sensor chip that are thinner and set in parallel. Accordingly, the thickness of the fingerprint detection device can be reduced without affecting the fingerprint recognition performance.

[0055] In some possible implementations, the fixed structure includes:

[0056] Bracket and gold wire protection glue;

[0057] The gold wire protection glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first covering film and is located outside the first sensor chip.

[0058] In some possible implementations, the bracket is a polyethylene terephthalate adhesive layer; or the bracket is fixed to the upper surface of the first covering film by a bracket fixing adhesive and is located outside the first sensor chip.

[0059] In some possible implementations, the fixed structure further includes:

[0060] Shading layer;

[0061] The optical path layer includes a lens layer and an optical path guide layer, the microlens is used to converge the optical signal returned by the human finger above the display screen to the optical path guide layer, and the optical path guide layer guides the optical signal converged by the microlens to the first sensor chip, the light shielding layer extends from above the bracket to above the optical path guide layer, a gap is formed between the light shielding layer and the microlens layer, and the light shielding layer is used to shield the optical signal incident from other positions other than the incident surface of the first sensor chip.

[0062] The light-shielding layer is constructed to extend from the top of the bracket to the top of the optical path guiding layer, which can not only effectively block the optical signal incident from the non-incident surface of the first sensor chip, but also can fix the light-shielding layer to the optical path layer as tightly as possible. Accordingly, the thickness of the fingerprint detection device can be reduced as much as possible.

[0063] In addition, the light shielding layer is constructed to extend from above the bracket to above the light path guiding layer, so as to avoid the image acquisition area of ​​the fingerprint detection device being reduced due to the light shielding layer covering the lens layer.

[0064] In some possible implementations, the light-shielding layer is a shielding adhesive layer, and the arc height position of the first gold wire is covered by the light-shielding adhesive layer.

[0065] In some possible implementations, the fingerprint detection device further includes the flexible circuit board, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.

[0066] In a second aspect, an electronic device is provided, including:

[0067] Display screen;

[0068] A fingerprint detection device is arranged below the display screen. The fingerprint detection device is the fingerprint detection device described in the first aspect or any possible implementation of the first aspect, and its fingerprint collection area is at least partially located in the display area of ​​the display screen.

[0069] In some possible implementations, the electronic device also includes a middle frame; wherein the upper surface of the middle frame extends downward to form a third groove, and the fingerprint detection device extends into the third groove, or the middle frame is formed with an opening that passes through the middle frame, and the opening is used to provide an accommodation space for the fingerprint detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 It is a plan view of an electronic device to which the present application can be applied.

[0071] Figure 2 yes Figure 1 A schematic side cross-sectional view of an electronic device is shown.

[0072] Figures 3 to 6 It is a schematic structural diagram of a fingerprint recognition device according to an embodiment of the present application.

[0073] Figure 7 and Figure 8 It is a schematic structural diagram of a display screen of an electronic device according to an embodiment of the present application.

[0074] Figures 9 to 16 Schematic diagram of the structure of an electronic device equipped with a fingerprint detection device according to an embodiment of the present application. DETAILED DESCRIPTION

[0075] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0076] The technical solution of the embodiment of the present application can be applied to various electronic devices. For example, portable or mobile computing devices such as smart phones, laptops, tablet computers, gaming devices, and other electronic devices such as electronic databases, cars, and bank automated teller machines (ATMs). However, the embodiment of the present application is not limited to this.

[0077] The technical solution of the embodiment of the present application can be used for biometric identification technology. Among them, biometric identification technology includes but is not limited to fingerprint recognition, palm print recognition, iris recognition, face recognition, and liveness recognition. For the sake of convenience, the following description takes fingerprint recognition technology as an example.

[0078] The technical solution of the embodiment of the present application can be used for under-screen fingerprint recognition technology.

[0079] Under-screen fingerprint recognition technology refers to installing a fingerprint detection device under the display screen, so as to realize fingerprint recognition operation within the display area of ​​the display screen, and there is no need to set a fingerprint collection area on the front of the electronic device except for the display area. Specifically, the fingerprint detection device uses the light returned from the top surface of the display component of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (such as fingers) that are in contact or close to the top surface of the display component, and the fingerprint detection device located below the display component collects and detects this returned light to realize under-screen fingerprint recognition. Among them, the design of the fingerprint detection device can be to achieve the desired optical imaging by properly configuring optical elements for collecting and detecting returned light, thereby detecting the fingerprint information of the finger.

[0080] Figure 1 and Figure 2 A schematic diagram of an electronic device 100 to which the under-screen fingerprint recognition technology can be applied is shown, wherein Figure 1 is a front view of the electronic device 100, Figure 2 for Figure 1 The schematic diagram of the partial cross-section structure of the electronic device 100 is shown.

[0081] like Figure 2 As shown, the electronic device 100 may include a display screen 120 and a fingerprint detection device 130 .

[0082] The display screen 120 may be a self-luminous display screen, which uses self-luminous display units as display pixels. For example, the display screen 120 may be an organic light-emitting diode (OLED) display screen or a micro-LED display screen.

[0083] In addition, the display screen 120 may be specifically a touch display screen, which can not only display images, but also detect the user's touch or press operation, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a touch sensor, and the touch sensor may be specifically a touch panel (TP), which may be arranged on the surface of the display screen 120, or may be partially integrated or fully integrated into the display screen 120, thereby forming the touch display screen.

[0084] The fingerprint detection device 130 may be an optical fingerprint detection device.

[0085] Specifically, the fingerprint detection device 130 (also referred to as a fingerprint recognition module or a fingerprint detection module) may include a sensor chip (also referred to as a fingerprint sensor) having an optical sensing array. The optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a light detector or a photoelectric sensor. In other words, the fingerprint detection device 130 may include a photo detector array (or referred to as a photodetector array, a photoelectric sensor array), which includes a plurality of light detectors distributed in an array.

[0086] like Figure 1 As shown, the fingerprint detection device 130 can be set in a local area below the display screen 120, so that the fingerprint collection area (or detection area) 103 of the fingerprint detection device 130 is at least partially located in the display area 102 of the display screen 120.

[0087] like Figure 2 As shown, the area where the optical sensing array of the fingerprint detection device 130 is located or the light sensing range corresponds to the fingerprint collection area 103 of the fingerprint detection device 130. The fingerprint collection area 103 of the fingerprint detection device 130 may be equal to or not equal to the area or light sensing range of the area where the optical sensing array of the fingerprint detection device 130 is located, and the embodiment of the present application does not specifically limit this.

[0088] For example, through the design of a light path for light collimation, the fingerprint collection area 103 of the fingerprint detection device 130 can be designed to be substantially consistent with the area of ​​the sensing array of the fingerprint detection device 130 .

[0089] For another example, by designing an optical path for converging light or designing an optical path for reflecting light through a macro lens, the area of ​​the fingerprint collection area 103 of the fingerprint detection device 130 can be made larger than the area of ​​the sensing array of the fingerprint detection device 130 .

[0090] The optical path design of the fingerprint detection device 130 is exemplarily described below.

[0091] Taking the optical path design of the fingerprint detection device 130 using an optical collimator with a through-hole array with a high aspect ratio as an example, the optical collimator can be specifically a collimator (Collimator) layer made on a semiconductor silicon wafer, which has multiple collimation units or microholes. The collimation unit can be specifically a small hole. Among the reflected light reflected from the finger, the light perpendicularly incident to the collimation unit can pass through and be received by the sensor chip below it, while the light with an incident angle that is too large is attenuated after multiple reflections inside the collimation unit. Therefore, the sensor chip can basically only receive the reflected light reflected from the fingerprint pattern directly above it, which can effectively improve the image resolution and thus improve the fingerprint recognition effect.

[0092] Taking the optical path design of the fingerprint detection device 130 using a lens (Micro-Lens) layer as an example, the lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be formed above the sensing array of the sensor chip by a semiconductor growth process or other processes, and each micro-lens may correspond to one or more sensing units of the sensing array. Other optical film layers, such as a dielectric layer or a passivation layer, may be formed between the lens layer and the sensing unit. More specifically, a light-blocking layer having micro-holes may be included between the lens layer and the sensing unit, wherein the micro-holes are formed between the corresponding micro-lenses and the sensing unit. The light-blocking layer may block optical interference between adjacent sensing units, and allow light to converge through the micro-lenses into the micro-holes and be transmitted to the sensing unit corresponding to the micro-lens via the micro-holes, so as to perform optical fingerprint imaging.

[0093] It should be noted that the above-mentioned several implementation schemes of the optical path guiding structure can be used alone or in combination. For example, a lens layer can be further provided under the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the lens layer, the specific stacked structure or optical path may need to be adjusted according to actual needs.

[0094] The fingerprint detection device 130 can be used to collect fingerprint information (such as fingerprint image information) of the user.

[0095] Taking the display screen 120 as an example, the display screen 120 can be a display screen with a self-luminous display unit, such as an organic light-emitting diode (OLED) display screen or a micro-light-emitting diode (Micro-LED) display screen. The fingerprint detection device 130 can use the display unit (i.e., OLED light source) of the OLED display screen located in the fingerprint collection area 103 as an excitation light source for optical fingerprint detection.

[0096] When a finger touches, presses or approaches (for ease of description, collectively referred to as pressing in this application) the fingerprint collection area 103, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 103. This beam of light is reflected on the surface of the finger to form reflected light or is scattered inside the finger to form scattered light. In the relevant patent application, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridges and valleys of the fingerprint have different reflective capabilities for light, the reflected light from the fingerprint ridges and the reflected light from the valleys of the fingerprint have different light intensities. After the reflected light passes through the display screen 120, it is received by the sensor chip in the fingerprint detection device 130 and converted into a corresponding electrical signal, namely, a fingerprint detection signal; based on the fingerprint detection signal, fingerprint image data can be obtained, and fingerprint matching verification can be further performed, thereby realizing the optical fingerprint recognition function in the electronic device 100.

[0097] It can be seen that when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, the user only needs to press the finger on the fingerprint collection area 103 located on the display screen 120 to implement the fingerprint feature input operation.

[0098] Of course, the fingerprint detection device 130 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.

[0099] like Figure 1 As shown, the electronic device 100 may further include a protective cover 110 .

[0100] The cover plate 110 may be specifically a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front of the electronic device 100, and a protective layer may also be provided on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover plate 110 above the display screen 120 or the surface of the protective layer covering the cover plate 110.

[0101] like Figure 1 As shown, a circuit board 140 , such as a flexible printed circuit (FPC), may be further disposed below the fingerprint detection device 130 .

[0102] The fingerprint detection device 130 may be electrically connected to the circuit board 140, and realize electrical interconnection and signal transmission with other peripheral circuits or other elements of the electronic device 100 through the circuit board 140. For example, the fingerprint detection device 130 may receive a control signal of a processing unit of the electronic device 100 through the circuit board 140, and may also output a fingerprint detection signal from the fingerprint detection device 130 to a processing unit or a control unit of the electronic device 100 through the circuit board 140.

[0103] Figure 3 FIG. 2 is a schematic structural diagram of a fingerprint detection device 200 including a sensor chip according to an embodiment of the present application. The fingerprint detection device 200 is applicable to an electronic device having a display screen. For example, the fingerprint detection device 200 can be applicable to Figure 1 or Figure 2 An electronic device 100 is shown.

[0104] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks are used to represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0105] like Figure 3 As shown, the fingerprint detection device 200 includes a substrate 210 , an optical path layer 220 , a first sensor chip 230 , a first fixing glue 240 and a first gold wire 250 .

[0106] The substrate 210 includes a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214 and a second covering layer 215 from top to bottom. The upper surface of the substrate 210 extends downward in a first region and penetrates the first covering layer 212 and the first conductive layer 211 to form a first groove. The upper surface of the substrate 210 extends downward in a second region connected to the first region and penetrates the first covering layer 212 to form a pad 2111 of the substrate 210. Optionally, in other alternative embodiments, the substrate 210 may include a conductive layer other than the first conductive layer 211 and the second conductive layer 214. Optionally, the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer. Optionally, the first covering layer 212 or the second covering layer 213 may be an insulating layer (e.g., a resin layer).

[0107] The optical path layer 220 is arranged above the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed to the first groove by the first fixing glue 240. The first sensor chip 230 is connected to the pad 2111 of the substrate 210 through the first gold wire 250. The first sensor chip 230 is used to receive a fingerprint detection signal returned by a human finger above the display screen and guided by the optical path layer 220, and the fingerprint detection signal is used to detect the fingerprint information of the finger.

[0108] In other words, the lower surface of the first sensor chip 230 is adhered to the first groove by the first fixing glue 240, so that at least a part of the first sensor chip 230 is set in the first groove and is electrically connected to the substrate 210 through the first gold wire 250; wherein, the first sensor chip 230 can be set below the display screen of the electronic device through the substrate 210. The first sensor chip 230 is used to receive the fingerprint detection signal returned by the reflection or scattering of the human finger above the display screen, and detect the fingerprint information of the finger based on the fingerprint detection signal to perform fingerprint registration or identification.

[0109] It should be understood that the first sensor chip 230 may include multiple chips or one chip. For example, the first sensor chip 230 may include multiple optical fingerprint sensor chips, which are arranged side by side in the first groove to form an optical fingerprint sensor chip assembly. The optical fingerprint sensor chip assembly can be used to simultaneously acquire multiple fingerprint images, which can be used as a fingerprint image for fingerprint registration or recognition after being spliced.

[0110] For the fingerprint detection device 200, the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid setting up a separate shell for the optical path layer 220 and the first sensor chip 230, thereby reducing the size (for example, thickness) of the fingerprint detection device 200.

[0111] In addition, by removing the first covering layer 212 and the first conductive layer 211 of the substrate 210 at the first region to form a first groove for accommodating the first fixing glue 240 and the first sensor chip 230 , the thickness of the fingerprint detection device 200 can be reduced.

[0112] Secondly, by removing the first covering layer 212 at the second area of ​​the substrate 210, a substrate 210 pad for electrically connecting the first sensor chip 230 is formed, which can provide an accommodation space for the first gold wire 250 for electrically connecting the first sensor chip 230 and the substrate 210. Accordingly, the space occupied by the first gold wire 250 above the substrate 210 is reduced, thereby reducing the thickness of the fingerprint detection device 200.

[0113] Thirdly, in the thickness direction, the various layers are closely matched to ensure that the thickness of the fingerprint detection device 200 is reduced to the greatest extent.

[0114] Finally, since the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, the image acquisition field of view of the fingerprint detection device 200 is only affected by the area of ​​the optical path layer 220 and the corresponding area of ​​the first sensor chip 230. Based on this, the area of ​​the optical path layer 220 and the corresponding area of ​​the first sensor chip 230 can be reasonably designed according to actual needs to meet the needs of different users and different customers (such as the need for a large-area image acquisition field of view).

[0115] In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but also ensure a sufficiently large image acquisition field of view.

[0116] like Figure 3 As shown, in some embodiments of the present application, there is a gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove.

[0117] By designing a certain gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove, even if there is a difference between the size of the prepared product of the first sensor chip 230 and the designed size of the first sensor chip 230, or even if there is a difference between the actual size of the first groove and the designed size of the first groove, it does not affect the installation of the first sensor chip 230 in the first groove.

[0118] In other words, the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove can be used not only as the dimensional tolerance of the first sensor chip 230 and / or as the dimensional tolerance of the first groove, but also as the installation tolerance of the first sensor chip 230. Accordingly, the yield of the fingerprint detection device 200 can be improved. The dimensional tolerance can be the absolute value of the difference between the maximum limit size allowed and the minimum limit size allowed, or the dimensional tolerance can be the difference between the upper deviation allowed and the lower deviation allowed. Limit deviation = limit size - basic size, upper deviation = maximum limit size - basic size, lower deviation = minimum limit size - basic size. The dimensional tolerance of the first sensor chip 230 can be the amount of variation allowed during the cutting process of the first sensor chip 230. When the basic size is the same, the smaller the dimensional tolerance, the higher the dimensional accuracy. Similarly, the installation tolerance of the first sensor chip 230 may refer to an offset distance between an allowable first extreme installation position and a second extreme installation position, wherein the first extreme installation position may be an allowable installation position closest to the first side wall of the first groove, and the second extreme installation position may be an allowable installation position closest to the second side wall of the first groove, wherein the first side wall is a side wall opposite to the second side wall.

[0119] For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove is 100-300um. For example, 200um. Of course, alternatively, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be other values, or belong to another preset value range, and the present application does not make specific restrictions on this. For example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 250um. For another example, the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be within 100um~400un.

[0120] It should be noted that the present application does not specifically limit the thickness of each component or layer in the fingerprint detection device 200. As long as the structural relationship between the various components or layers adopts the design scheme of the present application and the thickness of the fingerprint detection device is controlled by a close fit, it falls within the scope of protection of the present application.

[0121] As an example, the thickness of the first covering layer 212 and the thickness of the second covering layer are both 10-30um, for example, 20um; the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 10-20um, for example, 13um; the thickness of the substrate is 40-80um, for example, 64um; the thickness of the first sensor chip 230 is 50-150um, for example, 60um; the thickness of the optical path layer 220 is 10-30um, for example, 21um; the maximum arc height d6 of the first gold wire 250 is 30-60um, for example, 40um; the thickness of the first fixing glue 240 is 10-30um, for example, 15um.

[0122] Of course, the thickness of the first covering layer 212, the thickness of the first conductive layer 211, the thickness of the substrate layer 213, the thickness of the second conductive layer 214, the thickness of the second covering layer 215, the thickness of the first sensor chip 230, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values ​​or within another preset value range, and the present application does not make any specific limitation on this.

[0123] like Figure 3 As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include a bracket 251 and a gold wire protection glue 252; wherein the gold wire protection glue 252 is used to encapsulate the first gold wire 250, and the bracket 251 is arranged on the upper surface of the first covering layer 212 and is located on the outside of the first sensor chip 230. Optionally, the bracket 251 is fixed to the upper surface of the first covering layer 212 and is located on the outside of the first sensor chip 230 by a bracket fixing glue 253. For example, the material of the bracket 251 includes but is not limited to metal, resin, glass fiber composite board and glue layer. For example, the bracket 251 is a polyethylene glycol terephthalate (PET) glue layer. For another example, the bracket 251 can be a bracket formed by a foam material. Optionally, the bracket fixing glue can be a double-sided adhesive.

[0124] In other words, the bracket 251 may be disposed above the substrate 210 and located outside or in a surrounding area of ​​the first groove and the pad 2111 of the substrate 210 (for electrically connecting the first sensor chip 230 ).

[0125] like Figure 3As shown, in some embodiments of the present application, the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is greater than or equal to the width of the gap d1 formed between the side wall of the first sensor chip 230 and the side wall of the first groove, and the outer side of the bracket 251 extends a preset distance d3 in the direction close to the first sensor chip 230 relative to the outer side of the first cover layer 212. As an example, the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is 100-400um, such as 270um, and the preset distance d3 is 100-400um, such as 200um. Optionally, the thickness of the bracket 251 is 40-100um, such as 50um or 80um.

[0126] Of course, in other alternative embodiments, the gap d2 formed between the first sensor chip 230 and the bracket 251, the preset distance d3 or the thickness of the bracket 251 can be other specific values ​​or can be within another preset value range. For example, the thickness of the bracket 251 can also be 80 um.

[0127] The gold wire protection glue 252 can ensure the stability of the electrical connection between the substrate 210 and the first sensor chip 230 , and accordingly, the performance of the fingerprint detection device 200 can be guaranteed.

[0128] In addition, the gap d2 formed by the first sensor chip 230 and the bracket 251 can be used not only as the size tolerance of the bracket 251, but also as the installation tolerance of the bracket 251, and accordingly, the yield of the fingerprint detection device 200 can be improved. Similarly, the preset distance d3 can be used not only as the size tolerance of the bracket 251, but also as the installation tolerance of the bracket 251, and accordingly, the yield of the fingerprint detection device 200 can be improved.

[0129] In some embodiments of the present application, the thickness of the gold wire protection glue 252 is less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240. Figure 3 As shown, the thickness of the gold wire protection glue 252 is equal to the sum of the thickness of the optical path guide layer 222 in the optical path layer 220 , the thickness of the first sensor chip 230 , and the thickness of the first fixing glue 240 .

[0130] The thickness of the gold wire protection glue 252 is constructed to be less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230 and the thickness of the first fixing glue 240, so that the thickness of the fingerprint detection device 200 can be reduced as much as possible while effectively encapsulating the first gold wire 250.

[0131] Of course, other parameters can also be designed for the bracket 251 to facilitate the preparation and installation of the bracket 251. Figure 3 As shown, in some embodiments of the present application, the width of the gap d4 between the side of the pad 2111 (for electrically connecting the first sensor chip 230) close to the substrate 210 of the first sensor chip 230 and the bracket 251 is greater than the gap d2 between the side of the pad 2111 (for electrically connecting the first sensor chip 230) away from the substrate 210 of the first sensor chip 230 and the bracket 251, so as to reserve sufficient accommodation space for the bracket fixing glue 252. Optionally, the width of the gap d4 between the side of the pad 2111 of the first sensor chip 230 close to the substrate 210 and the bracket 251 can be 1300um or other values.

[0132] like Figure 3 As shown, in some embodiments of the present application, the fingerprint detection device 200 further includes a light shielding layer 260 .

[0133] The optical path layer 220 includes a lens layer 221 and an optical path guide layer 222, wherein the lens layer 221 is used to converge the optical signal returned by the human finger above the display screen to the optical path guide layer 222, and the optical path guide layer 222 guides the optical signal converged by the lens layer 221 to the first sensor chip 230, and the light shielding layer 260 extends from above the bracket 251 to above the optical path guide layer 222, and a gap d5 is formed between the light shielding layer 260 and the lens layer 221, and the light shielding layer 260 is used to shield the optical signal incident from other positions other than the incident surface of the first sensor chip 230. Optionally, the thickness of the light shielding layer 260 is 10-30um, for example, 20um. Of course, the thickness of the light shielding layer 260 can also be other specific values ​​or within another preset value range, and the present application does not make specific limitations on this.

[0134] The light-shielding layer 260 is constructed to extend from above the bracket 251 to above the optical path guiding layer 222, which can not only effectively block the optical signal incident from the non-incident surface of the first sensor chip 230, but also can fix the light-shielding layer 260 to the optical path layer 220 as tightly as possible. Accordingly, the thickness of the fingerprint detection device 200 can be reduced as much as possible.

[0135] In addition, the light shielding layer 260 is configured to extend from above the bracket 251 to above the optical path guiding layer 222 , so as to avoid the image acquisition area of ​​the fingerprint detection device being reduced due to the light shielding layer 260 covering the lens layer 221 .

[0136] like Figure 3 As shown, in some embodiments of the present application, the light shielding layer 260 is a shielding glue layer, and the arc height position of the first gold wire 250 is covered by the shielding glue layer.

[0137] The arc height position of the first gold wire 250 is designed to be covered by the shielding glue layer, which can not only effectively block the light signal incident from the non-incident surface of the first sensor chip 230, but also use the gold wire protection glue of the first gold wire 250 to support the shielding glue layer, and accordingly, can improve the stability of the fingerprint detection device 200.

[0138] Of course, in other alternative embodiments, the light shielding layer 260 may also be replaced by a filter. The filter is used to reduce the undesired ambient light in fingerprint sensing to improve the optical sensitivity of the first sensor chip 230 to the received light. The filter can be used to filter out light of a specific wavelength, such as near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below 580nm. Based on this, the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the influence of ambient light on optical detection in fingerprint sensing. In a specific implementation, the filter may include one or more optical filters, which may be configured as, for example, a bandpass filter to allow the transmission of light emitted by the OLED screen while blocking other light components such as infrared light in sunlight. One or more optical filters may be implemented as, for example, an optical filter coating, which is formed on one or more continuous interfaces, or may be implemented on one or more discrete interfaces. For example, the filter may be a coating designed directly on the lens layer to avoid the appearance of Newton rings in the fingerprint image acquired by the first sensor chip 230. Optionally, in addition, the light-entering surface of the filter may be provided with an optical inorganic coating or an organic blackening coating so that the reflectivity of the light-entering surface of the filter is lower than a first threshold, for example, 1%, thereby ensuring that the first sensor chip 230 can receive sufficient light signals, thereby improving the fingerprint recognition effect.

[0139] like Figure 3 As shown, in some embodiments of the present application, the gold wire protection glue 252 of the first gold wire 250 is used to support the light shielding layer 260 .

[0140] In other words, the thickness of the gold wire protection glue 252 is equal to the sum of the thickness of the optical path guide layer 222 in the optical path layer 220 , the thickness of the first sensor chip 230 and the thickness of the first fixing glue 240 , so that the gold wire protection glue 250 supports the light shielding layer 260 .

[0141] like Figure 3 As shown, in some embodiments of the present application, the fingerprint detection device 200 also includes a first double-sided adhesive layer 271, a film material layer 272 and a second double-sided adhesive layer 273; wherein the first double-sided adhesive layer 271 is arranged above the light shielding layer 260, the film material layer 272 is arranged above the first double-sided adhesive layer 271, and the second double-sided adhesive layer 273 is arranged above the film material layer 272.

[0142] Before installing the fingerprint detection device 200 , by providing the first double-sided adhesive layer 271 , the film material layer 272 and the second double-sided adhesive layer 273 , it is possible to effectively prevent the optical path layer 220 in the fingerprint detection device 200 from being damaged during transportation.

[0143] Figure 4 yes Figure 3 The schematic structural diagram of the deformed structure of the fingerprint detection device 200 is shown.

[0144] like Figure 4 As shown, the fingerprint detection device 200 may further include a second sensor chip 280 , a second fixing glue 281 and a second gold wire 282 .

[0145] The upper surface of the substrate 210 extends downward in a third area connected to the second area and penetrates the first covering layer 212 and the first conductive layer 211 to form a second groove, the second sensor chip 280 is fixed in the second groove by a second fixing glue 281, and the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by a second gold wire 282, so that the second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used to cooperate with the first sensor chip 230 to perform under-screen fingerprint recognition. Optionally, the third area and the first area are respectively located on both sides of the second area.

[0146] By setting up the second sensor chip 280, the processing task of the first sensor chip 230 can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a first sensor chip 230 and a second sensor chip 280 that are thinner and set in parallel. Accordingly, the thickness of the fingerprint detection device 200 can be reduced without affecting the fingerprint recognition performance.

[0147] In some embodiments of the present application, there is a gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove. Optionally, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove is 100-300um, for example, 200um. Optionally, the thickness of the second sensor chip 280 is 50-150um, for example, 60um, the maximum arc height of the second gold wire 282 is 30-60um, for example, 40um, and the thickness of the second fixing glue 281 is 10-30um, for example, 15um. Of course, alternatively, the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove, the thickness of the second sensor chip 280, the maximum arc height of the second gold wire 282, or the thickness of the second fixing glue 281 can also be other specific values ​​or within another preset value range, and the embodiments of the present application do not specifically limit this.

[0148] By designing a certain gap d7 between the side wall of the second sensor chip 280 and the side wall of the second groove, even if there is a difference between the size of the prepared product of the second sensor chip 280 and the designed size of the second sensor chip 280, or even if there is a difference between the actual size of the second groove and the designed size of the second groove, it does not affect the installation of the second sensor chip 280 in the second groove.

[0149] In other words, the gap between the side wall of the second sensor chip 280 and the side wall of the second groove can not only be used as the size tolerance of the second sensor chip 280 and / or as the size tolerance of the second groove, but also can be used as the installation tolerance of the second sensor chip 280. Accordingly, the yield of the fingerprint detection device 200 can be improved.

[0150] It should be noted that when the fingerprint detection device 200 is installed in an electronic device, it can be connected to the main board of the electronic device through an additional flexible circuit board. Figure 5 As shown, the substrate 210 may further include a gold finger 2122 of the substrate 210, and the gold finger 2122 of the substrate 210 is used to connect to a flexible circuit board. Accordingly, the substrate 210 is connected to a mainboard of the electronic device through the flexible circuit board.

[0151] Figure 6 is a schematic structural diagram of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application.

[0152] like Figure 6As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include a flexible circuit board 290 and an anisotropic conductive film (ACF) 292, wherein the flexible circuit board 290 is formed with a gold finger 291 of the flexible circuit board 290; the gold finger 291 of the flexible circuit board 290 is electrically connected to the gold finger 2122 of the substrate 210 through the anisotropic conductive film 292.

[0153] Through the anisotropic conductive adhesive film 292, the gold finger 291 of the flexible circuit board 290 can be pressed onto the gold finger 2122 of the substrate 210, which is equivalent to configuring flexible circuit boards of different specifications for the fingerprint detection device 200, so that the fingerprint detection device 200 is more versatile and can meet the needs of different users or customers accordingly.

[0154] like Figure 6 As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include a protective adhesive 293 including an anisotropic conductive adhesive film 292, and the protective adhesive 293 may be located at both ends of the anisotropic conductive adhesive film 292 to protect the anisotropic conductive adhesive film 292, and further protect the gold finger 291 of the flexible circuit board 290 and the gold finger 2122 of the substrate 210. Figure 6 As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is disposed at one end of the flexible circuit board 290. For example, the image processor 296 may be a microprocessor (MCU) for receiving a fingerprint detection signal (such as a fingerprint image) sent from the first sensor chip 230 through the flexible circuit board 290, and performing simple processing on the fingerprint detection signal. Figure 6 As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include at least one capacitor 295 disposed at one end of the flexible circuit board 290, and the at least one capacitor 295 is used to optimize (e.g., filter) the fingerprint detection signal collected by the first sensor chip 230. Optionally, each chip in the first sensor chip 230 corresponds to one or more capacitors. Figure 6As shown, in some embodiments of the present application, the fingerprint detection device 200 may further include a connector 294 disposed at one end of the flexible circuit board 290, and the connector 294 may be used to connect to an external device or other components of the electronic device (such as a main board), thereby achieving communication with the external device or other components of the electronic device. For example, the connector 294 may be used to connect to a processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296, and performs fingerprint recognition based on the processed fingerprint detection signal.

[0155] It should be understood that Figures 3 to 6 It is only an example of the embodiment of the present application and should not be construed as a limitation to the present application.

[0156] For example, in Figure 3 and Figure 4 In the embodiment, the lens layer 221 is used as a device for converging light signals in the optical path layer 220. Alternatively, the lens layer 221 may also use an optical collimator. The description of the optical collimator may refer to the description of the optical path design of the fingerprint detection device 130 in the foregoing content.

[0157] For another example, the lens layer 221 may have a microlens array formed by a plurality of microlenses, the optical path guiding layer 222 may be a light blocking layer, the light blocking layer having a plurality of microholes and arranged below the microlens layer 221, and the microholes correspond one to one with the microlenses, and one or more optical sensing units in the first sensor chip 230 correspond to a microlens in the lens layer 221. Optionally, the optical path layer 220 may further include other optical film layers, such as a dielectric layer or a passivation layer.

[0158] Combination of the above Figures 3 to 6 The fingerprint detection device 200 of the embodiment of the present application has been introduced, and the installation scheme of the fingerprint detection device 200 is described in detail below.

[0159] It should be noted that since the support layer 251, the support fixing glue 253 and the light shielding layer 260 are all optional layers, in order to facilitate the description of the fingerprint detection device from the perspective of installation, an intermediate concept (i.e., a fixed structure) is introduced below. That is, the fixed structure includes at least one of the support layer 251, the support fixing glue 253 and the light shielding layer 260. In other words, the fixed structure is arranged on the upper surface of the substrate 210 and is located on the side of the first sensor chip 230. The fixed structure is the connecting part of the fingerprint detection device 200, which is used to connect and fix the fingerprint detection device 200 to the lower surface of the display screen.

[0160] In other words, the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240 and a first gold wire 250. The substrate 210 includes a first covering layer 212, a first conductive layer 211, a base material layer 213, a second conductive layer 214 and a second covering layer 215 from top to bottom. Optionally, the optical path layer 220 includes a lens layer 221 and an optical path guide layer 222 thereunder. Optionally, the fixing structure may include a bracket 251 and a gold wire protection glue 252. The fixing structure may also include a light shielding layer 260. Optionally, the fingerprint detection device 200 may also include a second sensor chip 280, a second fixing glue 281 and a second gold wire 282.

[0161] In some embodiments of the present application, the fingerprint detection device 200 may be applicable to an electronic device having a display screen, the bottom layer of the display screen being an opaque layer, and a window penetrating the opaque layer is formed on the opaque layer. Optionally, the overall thickness of the fingerprint detection device is 0.15-0.6 mm. Of course, the overall thickness of the fingerprint detection device may also be other values.

[0162] Wherein, the fingerprint detection device 200 comprises:

[0163] An optical path layer 220 and a first sensor chip 230 , wherein the optical path layer 220 is disposed above the first sensor chip 230 ;

[0164] Substrate 210, fixing structure and pressure-sensitive adhesive;

[0165] Among them, the first sensor chip 230 is fixedly electrically connected to the substrate 210, the fixed structure is arranged on the upper surface of the substrate 210 and the fixed structure surrounds the first sensor chip 230, and the upper surface of the fixed structure is fixed to the lower surface of the display screen by the pressure-sensitive adhesive so that the first sensor chip 230 is aligned with the window setting, and the first sensor chip 230 is used to receive through the window a fingerprint detection signal returned by a human finger above the display screen and guided by the optical path layer 220, and the fingerprint detection signal is used to detect the fingerprint information of the finger.

[0166] Taking the display screen as an OLED screen as an example, when a finger is placed on the bright OLED screen, the finger will reflect the light emitted by the OLED screen, and this reflected light will penetrate the OLED screen until it reaches the bottom of the OLED screen. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions. The fingerprint detection device 200 collects the light signal leaked from the top of the OLED screen and images the fingerprint image based on the received light signal.

[0167] For the fingerprint detection device 200, the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid setting up a separate shell for the optical path layer 220 and the first sensor chip 230, thereby reducing the size (for example, thickness) of the fingerprint detection device 200.

[0168] In addition, the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed to the substrate 210 by the first fixing glue 240, so that the components are tightly matched in the thickness direction (that is, the components are tightly matched in the thickness direction without reserving any gaps), thereby reducing the size (for example, thickness) of the fingerprint detection device 200.

[0169] Accordingly, when the thickness of the fingerprint detection device 200 is controlled, it can be placed between the display screen and the battery, which not only does not require adjustment of the original internal structure of the electronic device, but also improves the utilization rate of the internal space of the electronic device, compared to placing the fingerprint recognition device at other locations outside the battery. For example, the volume of the battery can be increased, and the saved space can be used to accommodate the increased volume of the battery, and accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.

[0170] In some embodiments of the present application, the side of the fixed structure includes the first side and at least one second side other than the first side, the substrate 210 is provided with a gold finger at a position close to the first side, the gold finger of the substrate 210 can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the cured adhesive is arranged between the at least one second side and the display screen to fix the pressure-sensitive adhesive relative to the display screen.

[0171] Without loss of generality, the curing adhesive is a UV curing adhesive or a hot melt adhesive.

[0172] Among them, ultraviolet (UV) curing glue can also be called UV glue, shadowless glue, UV light curing glue, etc. The ultraviolet curing glue is a single-component, low-viscosity, high-strength acrylic adhesive that can be cured by ultraviolet light. The ultraviolet curing glue has the characteristics of long storage period, no solvent, fast curing speed, good transparency, and good heat and chemical resistance.

[0173] The hot melt adhesive (Hot Glue) is a plastic adhesive whose physical state can change with temperature within a certain temperature range. Based on this, by coating the pressure-sensitive adhesive with the hot melt adhesive, not only can the curing effect of the curing adhesive be guaranteed, but during the process of disassembling the fingerprint detection device 200, the hot melt adhesive can also be heated to reduce its curing effect, thereby reducing the operational complexity of disassembling or replacing the fingerprint detection device 200.

[0174] By arranging the curing adhesive between the at least one second side portion and the display screen to fix the pressure-sensitive adhesive relative to the display screen, the thrust value of the fingerprint detection device 200 can meet the thrust test requirements of the end customer, that is, the fingerprint detection device 200 will not be displaced during the thrust test. Based on this, the connection stability of the fingerprint detection device 200 during use can be guaranteed, and accordingly, the performance stability of the fingerprint detection device 200 can be guaranteed.

[0175] In summary, the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200 , but also ensure the performance stability of the fingerprint detection device 200 .

[0176] In order to facilitate understanding of the installation scheme of the fingerprint detection device 200, the structure of the display screen applicable to the present application is briefly introduced below.

[0177] Figure 7 3 is a schematic structural diagram of the display screen 310 according to an embodiment of the present application.

[0178] like Figure 7 As shown, the display screen 310 may include, from top to bottom:

[0179] Cover glass (CG) 311, first optical clear adhesive (OCA) 312, touch screen 313, second OCA 314, polarizer (POL) 315, display panel 316, support film 317, cushion layer 318 and copper foil layer 319. Optionally, the touch screen 313 can also be integrated into the display panel 316, that is, the display panel 316 can also be used as a touch screen.

[0180] The display panel 316 is used to display images, and the display panel 316 may also be called a liquid crystal panel or a display panel. Optionally, the display panel 316 may be a display panel of various types formed by different materials. The display panel 316 may include a liquid crystal display (LCD) panel or an organic light emitting diode (OLED) display panel. LCD panels include but are not limited to thin film transistor (TFT) display panels, in-plane switching (IPS) display panels, and super LCD (SLCD) display panels. Optionally, the display panel 316 may be formed of different panels using different material technologies. For example, the display panel 316 may be an OLED organic light emitting panel made of low temperature polysilicon technology (LTPS), which is ultra-thin, light, and low in power consumption, and can be used to provide clearer images. Of course, the panel may also be prepared using other material technologies, and the other material technologies include but are not limited to amorphous silicon (A-Si) technology, indium gallium zinc oxide (IGZO) technology, and continuous granular crystalline silicon (CGS) technology.

[0181] The CG 311 is used to protect the display screen, the first OCA is used to attach the CG 311 to the touch screen 313, and the second OCA 314 is used to attach the touch screen 313 to the POL 315. The POL 315 can be an optical film composed of multiple layers of polymer materials and has the function of generating polarized light. When non-polarized light passes through the POL 315, it is filtered into linear polarized light parallel to a target direction, and the target direction is the polarization direction of the POL 315. The support film 317 is used to support the display panel 316.

[0182] The buffer layer 318 may also be referred to as a screen print layer or an embossed layer, and the screen print layer may carry graphics, which may be used as logos such as trademark patterns. The buffer layer 318 may be a black sheet layer or a printed layer for shielding light. For example, the buffer layer 318 may be a layer structure formed by a foam material. The copper foil layer 319 may also be referred to as a heat dissipation layer (used to reduce the temperature of the display screen) or an anti-radiation layer. The buffer layer 318 and the copper foil layer 319 may be combined to form a rear panel or bottom layer of the display screen 310, or the rear panel of the display screen may also include a transparent layer or an opaque layer in addition to the buffer layer 318 and the copper foil layer 319, which is not limited in the present application.

[0183] Figure 8 3 is another schematic structural diagram of the display screen 310 according to an embodiment of the present application.

[0184] like Figure 8 As shown, the display screen 310 may include, from top to bottom:

[0185] Cover glass (CG) 321, optical clear adhesive (OCA) 322, polarizer (POL) 323, encapsulation (Encap) layer 324, display panel 325 and cushion layer 326. Optionally, the display panel 325 can also be used as a touch screen.

[0186] It should be noted that Figure 7 The display screen 310 shown may also be referred to as a soft screen. Figure 8 The display screen 310 shown may also be referred to as a hard screen. In other words, the fingerprint detection device 200 of the embodiment of the present application may be applied to both a soft screen (ie, the display screen 310) and a hard screen (ie, the display screen 310).

[0187] The following is an exemplary description of a specific solution of applying the fingerprint detection device 200 to a display screen having a copper foil layer or a support film in conjunction with the accompanying drawings.

[0188] Fig. 9 It is a schematic side cross-sectional view of an electronic device 300 provided by an embodiment of the present application, in which a fingerprint detection device 200 is attached to the lower surface of a buffer layer 319 . Fig.10 yes Fig. 9 The schematic bottom view of the electronic device 300 is shown. Fig. 9 is along Fig.10 A schematic cross-sectional view of the electronic device 300 is shown in the direction of the dotted line.

[0189] like Fig. 9 As shown, the upper surface of the fixing structure is fixed to the lower surface of the copper foil layer 319 located around the window through the pressure-sensitive adhesive 391. Fig.10 As shown, the curing adhesive 392 covers the pressure-sensitive adhesive 391. The side of the fixing structure includes the first side 297 and at least one second side 298 other than the first side 297, wherein the curing adhesive 392 may be disposed on the outside of the at least one second side 298 of the fixing structure.

[0190] Fig.11 It is a schematic side cross-sectional view of an electronic device 300 provided in an embodiment of the present application, in which a fingerprint detection device 200 is attached to the lower surface of a support film 317 . Fig.12 yes Fig.11 The schematic bottom view of the electronic device 300 is shown. Fig.11 is along Fig.12 A schematic cross-sectional view of the electronic device 300 is shown in the direction of the dotted line.

[0191] like Fig.11 As shown, the upper surface of the fixing structure is fixed to the lower surface of the supporting film 317 by the pressure-sensitive adhesive 391. The openings of the opaque layer may include openings of the buffer layer 318 and openings of the copper foil layer 319. The openings of the opaque layer are used to provide accommodation space for the fingerprint detection device 200 and the curing adhesive 392. At this time, from the perspective of the bottom view, as shown in FIG. Fig.12 As shown, the curing adhesive 392 covers the pressure-sensitive adhesive 391, and a portion of the lower surface of the supporting film 317 can be seen. The side of the fixing structure includes the first side 297 and at least one second side 298 other than the first side 297, wherein the curing adhesive 392 can be disposed on the outer side of the at least one second side 298 of the fixing structure.

[0192] In other words, the fingerprint detection device 200 can be applied to an electronic device with a soft screen. Since the bottom layer of the display screen 310 includes a buffer layer 318 and a copper foil layer 319, the window opening of the opaque layer can include the window opening of the buffer layer 318 and the window opening of the copper foil layer 319. At this time, the upper surface of the fixed structure is fixed to the lower surface of the copper foil layer 319 and the surrounding area of ​​the window opening through the pressure-sensitive adhesive. Alternatively, the upper surface of the fixed structure is fixed to the lower surface of the support film 317 through the pressure-sensitive adhesive.

[0193] In short, if the opaque layer (i.e., the bottom layer) of the display screen includes a buffer layer and a copper foil layer from top to bottom, and a support film is provided above the buffer layer; wherein, the upper surface of the fixed structure can be fixed to the lower surface of the copper foil layer located in the surrounding area of ​​the window by the pressure-sensitive adhesive, or the upper surface of the fixed structure is fixed to the lower surface of the support film by the pressure-sensitive adhesive.

[0194] It should be understood that Figures 9 to 12 This is only an example of the present application and should not be construed as limiting the present application.

[0195] In other alternative embodiments, the fingerprint detection device 200 may also be applied to an electronic device having a hard screen, that is, the fingerprint detection device may also be applied to an electronic device whose bottom layer is a buffer layer.

[0196] Combination Figure 8For example, if the fingerprint detection device 200 can be applied to an electronic device with a hard screen, since the bottom layer of the display screen 310 is a buffer layer 326, the upper surface of the fixing structure is fixed to the lower surface of the buffer layer 326 and the surrounding area of ​​the window through the pressure-sensitive adhesive. At this time, the window of the buffer layer 326 is the window of the opaque layer.

[0197] In short, the opaque layer (ie, bottom layer) of the display screen is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer in the area around the window through the pressure-sensitive adhesive.

[0198] The fingerprint detection device is adhered to the buffer layer of the display screen (for example, Figure 8 The buffer layer 326 shown), the copper foil layer (eg, Figure 7 The copper foil layer 319 shown) or a support film (e.g., Figure 7 Compared with directly attaching the fingerprint detection device to the display panel of the display screen (for example, Figure 7 The display panel 316 shown, for example, Figure 8 The display panel 325 shown in the figure can not only avoid affecting the performance of the display screen after the fingerprint detection device is attached to the display screen, but also reduce the difficulty of installing the fingerprint detection device. Accordingly, it can reduce the installation complexity of the fingerprint detection device and improve the yield of the electronic device.

[0199] Moreover, by adhering the fingerprint detection device to the lower surface of the buffer layer, copper foil layer or support film of the display screen, it is also possible to avoid damaging the display screen during the disassembly of the fingerprint detection device. Accordingly, it is possible to reduce the complexity of disassembly of the fingerprint detection device and improve the yield of the electronic device.

[0200] In addition, the fingerprint detection device is adhered to the buffer layer of the display screen (for example, Figure 8 buffer layer 326 as shown) or a copper foil layer (e.g., Figure 7 When the display screen is pressed or the electronic device falls or collides, the buffer layer and / or the lower surface of the copper foil layer are present between the display panel and the fingerprint detection device, so as to avoid the display panel and the fingerprint detection device being squeezed and affecting the performance of the display panel and the fingerprint detection device.

[0201] Moreover, by adhering the fingerprint detection device to the lower surface of the buffer layer or copper foil layer of the display screen, compared with directly adhering the fingerprint detection device to the display panel or support film of the display screen, it is also possible to avoid the size of the window being too large. Accordingly, the visibility of the fingerprint detection device when the user views it from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.

[0202] Fig.13 It is a schematic side cross-sectional view of an electronic device 300 provided with a limiting structure on a support film 317 provided in an embodiment of the present application. Fig.14 yes Fig.13 The schematic bottom view of the electronic device 300 is shown. Fig.13 is along Fig.14 A schematic cross-sectional view of the electronic device 300 is shown in the direction of the dotted line.

[0203] like Fig.13 As shown in FIG. 14 , in some embodiments of the present application, the fingerprint detection device 200 may further include:

[0204] A limiting structure 41 and a structural fixing adhesive 42;

[0205] The limiting structure 41 is fixed to the outer side of the at least one second side portion of the lower surface of the display screen 310 by the structural fixing adhesive 42, and the curing adhesive 392 is arranged between the limiting structure 41 and the at least one second side portion.

[0206] By setting the limiting structure 41, not only can a holding space be provided for the curing glue 392, but also a holding space can be constructed for the curing glue 392. Accordingly, it can be ensured that at least one second side portion is covered with sufficient curing glue to improve the curing effect of the curing glue 392.

[0207] like Fig.14 As shown, in some embodiments of the present application, the limiting structure 41 includes a limiting plate 411, and the limiting plate 411 is provided with an opening corresponding to the first side portion.

[0208] The opening corresponding to the first side portion can provide a receiving space for the gold finger of the flexible circuit board, and accordingly, the installation complexity of the fingerprint detection device can be reduced.

[0209] like Fig.13As shown, in some embodiments of the present application, at least one limit block 412 corresponding to the at least one second side portion is formed on the inner side of the limit plate 411, and the limit plate 411 and the at least one limit block 412 form a step structure, and the step structure includes the lower surface of the at least one limit block 412, the lower surface of the limit plate 411 forms a step structure, and a vertical surface for connecting the lower surface of the at least one limit block 412 and the lower surface of the limit plate 411, the lower surface of the limit plate 411 is fixed to the lower surface of the display screen by the structural fixing adhesive, and the lower surface of the at least one limit block 412 contacts the upper surface of the pressure-sensitive adhesive.

[0210] Through the step structure, the limiting structure 41 can not only limit the displacement of the pressure-sensitive adhesive, but also limit the displacement of the curing adhesive, that is, the bonding effect of the pressure-sensitive adhesive and the curing effect of the curing adhesive can be enhanced simultaneously.

[0211] In other alternative embodiments, the lower surface of the at least one limiting block 412 may also be disposed on the upper surface of the pressure-sensitive adhesive by means of adhesive.

[0212] like Fig.13 As shown, in some embodiments of the present application, a gap for accommodating the curing adhesive is formed between the vertical surface and the side wall of the pressure-sensitive adhesive.

[0213] By arranging the curing adhesive between the vertical surface and the pressure-sensitive adhesive, not only can the contact area between the pressure-sensitive adhesive and the curing adhesive be ensured to ensure the curing effect of the curing adhesive, but also a buffer space can be provided between the pressure-sensitive adhesive and the limiting plate 411. The buffer space can prevent the limiting plate 411 from directly touching the pressure-sensitive adhesive. Accordingly, it can prevent the fingerprint recognition device from being misaligned due to the limiting plate 411 squeezing the pressure-sensitive adhesive, thereby ensuring the stability of the performance of the fingerprint detection device.

[0214] like Fig.14 As shown, in some embodiments of the present application, a gap for accommodating the curing adhesive is formed between the at least one limiting block 412 and the at least one second side portion 298 .

[0215] By arranging the curing glue between each limit block 412 and the corresponding second side portion, not only can it be ensured that the at least one second side portion 298 has a sufficient contact area with the curing glue to ensure the curing effect, but it can also provide a buffer space between the at least one second side portion 298 and the at least one limit block 412. The buffer space can prevent the at least one limit block 412 from directly touching the at least one side portion, and accordingly, the stability of the performance of the fingerprint detection device can be guaranteed.

[0216] like Fig.14 As shown, in some embodiments of the present application, each of the at least one limit block 412 is a T-shaped limit block.

[0217] By designing each of the at least one limit block 412 as a T-shaped limit block 412, the force-bearing area of ​​the limit structure 41 can be increased while ensuring the accommodating space for the curing glue, and accordingly, the limiting effect of the limit structure 41 can be improved.

[0218] In other alternative embodiments, each of the at least one limiting block 412 may also be an L-shaped limiting block or a limiting block with a regular shape or an irregular shape.

[0219] like Fig.14 As shown, in some embodiments of the present application, the limiting plate 411 may also form an L-shaped structure in an area close to the first side portion 297 to form a confining space for the curing adhesive 392 .

[0220] It should be understood that Figure 13 to Figure 14 This is only an example of the present application and should not be construed as limiting the present application.

[0221] For example, Fig.13 and Fig.14 The fingerprint detection device 200 shown can be fixedly arranged on the lower surface of the copper foil layer 319 in the surrounding area of ​​the window by the limiting structure 41, but the embodiment of the present application is not limited thereto. In other alternative embodiments, for example, Fig.15 and Fig.16 As shown, the fingerprint detection device 200 can be fixedly arranged on the lower surface of the support film 317 by the limiting structure 41. For example, the fingerprint detection device 200 can be fixedly arranged on the lower surface of the support film 317 by the limiting structure 41. Figure 8 The lower surface of the buffer layer 326 is shown to be located in the area surrounding the window.

[0222] For another example, the electronic device 300 involved in the embodiment of the present application may further include a middle frame. The middle frame may be used to carry or support various devices or components in the electronic device 300. The devices or components include but are not limited to batteries, cameras, antennas, motherboards, and the display screen.

[0223] Without loss of generality, the middle frame is formed with a groove below the fingerprint detection device 200, and the groove of the middle frame is used to accommodate the fingerprint detection device 200; or, the middle frame is formed with an opening that passes through the middle frame, and the opening is used to provide an accommodation space for the fingerprint detection device 200. In other words, the fingerprint detection device 200 is attached to the lower surface of the display screen by hanging. For example, there is a gap between the fingerprint detection device 200 and the device below the middle frame. For another example, there may be no gap between the fingerprint detection device 200 and the device below the middle frame. For another example, the electronic device may also include a battery located below the fingerprint detection device 200, and the fingerprint detection device 200 and the battery are respectively arranged on both sides of the middle frame, and a battery pull-out adhesive is arranged between the middle frame and the battery.

[0224] For another example, a connection portion corresponding to the upper surface of the fixing structure is provided on the lower surface of the supporting film in the area of ​​the window, and the connection portion is connected to the supporting film by a double-sided adhesive. Optionally, the connection portion is a rigid reinforcing plate or a polyethylene terephthalate adhesive layer. Optionally, the connection portion is an opaque dielectric layer.

[0225] The connection part can prevent the curing adhesive or the pressure-sensitive adhesive from forming irregular sticking marks on the support film, and accordingly, the aesthetics of the electronic device installed with the fingerprint detection device can be ensured. In addition, setting the connection part as an opaque dielectric layer is equivalent to reducing the size of the window, and accordingly, it can reduce the visibility of the fingerprint detection device when the user views it from the front of the display screen, thereby beautifying the appearance of the electronic device.

[0226] It should be noted that the preferred embodiments of the present application are described in detail above in conjunction with the accompanying drawings. However, the present application is not limited to the specific details in the above embodiments. Within the technical concept of the present application, the technical solution of the present application can be subjected to a variety of simple modifications, and these simple modifications all belong to the protection scope of the present application. For example, the various specific technical features described in the above specific embodiments can be combined in any suitable manner if there is no contradiction. In order to avoid unnecessary repetition, the present application will not further describe various possible combinations. For another example, the various different embodiments of the present application can also be arbitrarily combined, and as long as they do not violate the ideas of the present application, they should also be regarded as the contents disclosed in the present application.

[0227] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0228] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0229] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0230] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0231] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0232] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0233] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A fingerprint detection device, characterized in that: Applicable to an electronic device having a display screen, wherein the bottom layer of the display screen is an opaque layer, and a window penetrating the opaque layer is formed on the opaque layer; The fingerprint detection device comprises: An optical path layer and a first sensor chip, wherein the optical path layer is arranged above the first sensor chip; Substrates, fixing structures and pressure-sensitive adhesives; The first sensor chip is fixedly and electrically connected to the substrate, the fixed structure is arranged on the upper surface of the substrate and surrounds the first sensor chip, and the upper surface of the fixed structure is fixed to the lower surface of the display screen by the pressure-sensitive adhesive, so that the first sensor chip is aligned with the window, and the first sensor chip is used to receive a fingerprint detection signal through the window that is returned by a human finger above the display screen and guided by the optical path layer, and the fingerprint detection signal is used to detect the fingerprint information of the finger; Curing glue; Among them, the side of the fixed structure includes a first side and at least one second side other than the first side, the substrate is provided with a gold finger at a position close to the first side, the gold finger of the substrate can be electrically connected to the gold finger of the flexible circuit board through an anisotropic conductive adhesive film, and the curing adhesive is arranged between the at least one second side and the display screen to fix the pressure-sensitive adhesive relative to the display screen.

2. The fingerprint detection device according to claim 1, characterized in that: The curing adhesive is ultraviolet curing adhesive or hot melt adhesive.

3. The fingerprint detection device according to claim 1 or 2, characterized in that: The fingerprint detection device also includes: Limiting structure and structural fixing glue; The limiting structure is fixed to the outer side of the at least one second side portion of the lower surface of the display screen by the structural fixing adhesive, and the curing adhesive is arranged between the limiting structure and the at least one second side portion.

4. The fingerprint detection device according to claim 3, characterized in that: The limiting structure includes a limiting plate, and the limiting plate is provided with an opening corresponding to the first side portion.

5. The fingerprint detection device according to claim 4, characterized in that: At least one limit block corresponding to the at least one second side portion is formed on the inner side of the limit plate, and the limit plate and the at least one limit block form a step structure, and the step structure includes the lower surface of the at least one limit block, the lower surface of the limit plate forms a step structure, and a vertical surface for connecting the lower surface of the at least one limit block and the lower surface of the limit plate, the lower surface of the limit plate is fixed to the lower surface of the display screen by the structural fixing adhesive, and the lower surface of the at least one limit block contacts the upper surface of the pressure-sensitive adhesive.

6. The fingerprint detection device according to claim 5, characterized in that: A gap for accommodating the curing glue is formed between the at least one limiting block and the at least one second side portion.

7. The fingerprint detection device according to claim 5, characterized in that: A gap for accommodating the curing adhesive is formed between the vertical surface and the side wall of the pressure-sensitive adhesive.

8. The fingerprint detection device according to claim 5, characterized in that: Each of the at least one limiting block is a T-shaped limiting block.

9. The fingerprint detection device according to claim 1 or 2, characterized in that: The opaque layer is a buffer layer, and the upper surface of the fixing structure is fixed to the lower surface of the buffer layer in the surrounding area of ​​the window through the pressure-sensitive adhesive.

10. The fingerprint detection device according to claim 1 or 2, characterized in that: The opaque layer includes a buffer layer and a copper foil layer from top to bottom, and a support film is arranged above the buffer layer; wherein the upper surface of the fixed structure is fixed to the lower surface of the copper foil layer located around the window by the pressure-sensitive adhesive, or the upper surface of the fixed structure is fixed to the lower surface of the support film by the pressure-sensitive adhesive.

11. The fingerprint detection device according to claim 10, characterized in that: A connecting portion corresponding to the upper surface of the fixing structure is provided on the lower surface of the supporting film in the area of ​​the window, and the connecting portion is connected to the supporting film by a double-sided adhesive tape.

12. The fingerprint detection device according to claim 11, characterized in that: The connecting portion is a rigid reinforcing plate or a polyethylene terephthalate adhesive layer.

13. The fingerprint detection device according to claim 11, characterized in that: The connecting portion is an opaque medium layer.

14. The fingerprint detection device according to claim 1 or 2, characterized in that: The substrate includes, from top to bottom, a first covering layer, a first conductive layer, a base material layer, a second conductive layer, and a second covering layer in sequence; the upper surface of the substrate extends downward in a first region and penetrates the first covering layer and the first conductive layer to form a first groove; the upper surface of the substrate extends downward in a second region connected to the first region and penetrates the first covering layer to form a pad of the substrate; The fingerprint detection device also includes: A first fixing glue and a first gold wire; The lower surface of the first sensor chip is fixed to the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.

15. The fingerprint detection device according to claim 14, characterized in that: The fingerprint detection device also includes: A second sensor chip, a second fixing glue and a second gold wire; Among them, the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, the second sensor chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.

16. The fingerprint detection device according to claim 14, characterized in that: The fixed structure comprises: Bracket and gold wire protection glue; The gold wire protection glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first covering layer and is located outside the first sensor chip.

17. The fingerprint detection device according to claim 16, characterized in that: The bracket is a polyethylene terephthalate adhesive layer; or the bracket is fixed on the upper surface of the first covering layer by a bracket fixing adhesive and is located outside the first sensor chip.

18. The fingerprint detection device according to claim 16, characterized in that: The fixed structure also includes: Shading layer; The optical path layer includes a microlens and an optical path guide layer, the microlens is used to converge the optical signal returned by the human finger above the display screen to the optical path guide layer, the optical path guide layer guides the optical signal converged by the microlens to the first sensor chip, the light shielding layer extends from above the bracket to above the optical path guide layer, a gap is formed between the light shielding layer and the microlens, and the light shielding layer is used to shield the optical signal incident from other positions other than the incident surface of the first sensor chip.

19. The fingerprint detection device according to claim 18, characterized in that: The light shielding layer is a shielding adhesive layer, and the arc height position of the first gold wire is covered by the light shielding adhesive layer.

20. The fingerprint detection device according to claim 1 or 2, characterized in that: The fingerprint detection device further comprises the flexible circuit board, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.

21. An electronic device, characterized in that: include: Display screen; A fingerprint detection device is arranged below the display screen. The fingerprint detection device is a fingerprint detection device as described in any one of claims 1 to 20, and its fingerprint collection area is at least partially located in the display area of ​​the display screen.

22. The electronic device according to claim 21, characterized in that: The electronic device also includes a middle frame; wherein, the upper surface of the middle frame extends downward to form a third groove, and the fingerprint detection device extends into the third groove, or the middle frame is formed with an opening that passes through the middle frame, and the opening is used to provide a storage space for the fingerprint detection device.

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