A memory stick position detecting device

Abstract

The application discloses a memory bar position detection device, comprising: a pressing module for clamping a memory bar so as to insert the memory bar into a memory slot; a sensing module for generating an in-position signal when the memory bar is completely inserted into the memory slot and generating an off-position signal when the memory bar is not completely inserted into the memory slot; and an indicating module for displaying in-position state indicating information when the in-position signal is received and displaying off-position state indicating information when the off-position signal is received. Through the technical scheme, the application can reduce the risk of memory bar damage caused by non-standard clamping of the memory bar and improve the efficiency and accuracy of detecting the position of the memory bar.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of memory bar installation, in particular to a memory bar position detection device. BACKGROUND

[0002] At present, in the whole machine assembly process of servers and computer products, memory bars need to be installed into memory slots of mainboards. At present, the manual installation of memory bars is through three steps of clamping the memory bar, pressing the memory bar and checking whether the memory bar is installed in place. The three steps are independent and cannot be completed at one time. The installation mode has the following defects: in the clamping process, the fingers of workers are used to clamp the memory bar, the fingers are contaminated and the clamping is not standardized, which leads to quality hidden dangers and damaged parts of the memory bar. In the pressing process, after the memory bar is aligned with the memory slot of the mainboard, a pressing tool is taken to press the memory bar into the memory slot, and the production efficiency is low due to the multiple taking and placing of the memory bar and the memory pressing tool. In the checking process of whether the memory bar is installed in place, the actual installation position of the memory bar is checked by the naked eye after the memory bar is pressed into the memory slot, and therefore, due to the fatigue of personnel and the difference in individual checking ability of workers, it is impossible to ensure that all the memory bars are completely and accurately detected, and the naked eye checking also has the problem of low efficiency. SUMMARY

[0003] Therefore, the application aims to provide a memory bar position detection device which can reduce the risk of damaged memory bars caused by non-standard clamping of the memory bar and improve the efficiency and accuracy of detecting the position of the memory bar. The specific scheme is as follows:

[0004] The application discloses a memory bar position detection device, which comprises:

[0005] A pressing module is used for clamping the memory bar so as to insert the memory bar into a memory slot.

[0006] An induction module is used for generating an in-place signal when the memory bar is completely inserted into the memory slot and generating an off-site signal when the memory bar is not completely inserted into the memory slot.

[0007] An indication module is used for displaying in-place state indication information when the in-place signal is received and displaying off-site state indication information when the off-site signal is received.

[0008] Optionally, the pressing module comprises:

[0009] A pressing head and a clamping block are used for clamping the memory bar by pressing the pressing head and buckling the buckle on the clamping block into the notch on the memory bar, so as to insert the released memory bar into the memory slot by pressing the pressing head and extruding the clamping block when the memory bar is aligned with the memory slot.

[0010] Optionally, the clamping block comprises a spring installed between the clamping block and the base of the memory stick position detection device.

[0011] The clamping block is used for clamping or releasing the memory stick.

[0012] Optionally, the clamping block comprises a clamping side cover.

[0013] The clamping block is used for being fixed on the base through a screw hole on the clamping side cover.

[0014] Optionally, the sensing module comprises an in-position circuit, an off-position circuit and a sensing block movably arranged between a lateral sensing sheet of the in-position circuit and a side sensing sheet of the off-position circuit.

[0015] The sensing block is used for contacting the lateral sensing sheet when the memory stick is completely inserted into the memory slot, and contacting the side sensing sheet when the memory stick is not completely inserted into the memory slot.

[0016] The in-position circuit is used for generating the in-position signal when the lateral sensing sheet contacts the sensing block.

[0017] The off-position circuit is used for generating the off-position signal when the side sensing sheet contacts the sensing block.

[0018] Optionally, the sensing block comprises a wire connecting hole, a spring limiting column, a shaft hole, a lateral sensing surface and a side sensing surface.

[0019] Optionally, the memory slot comprises a hippocampus head.

[0020] The hippocampus head is used for contacting the lateral sensing surface when the memory stick is completely inserted into the memory slot, and contacting the side sensing surface when the memory stick is not completely inserted into the memory slot.

[0021] Optionally, the indication module comprises an in-position indication lamp and an off-position indication lamp.

[0022] The in-position indication lamp is used for displaying in-position state indication information when the in-position signal is received, and the off-position indication lamp is used for displaying off-position state indication information when the off-position signal is received.

[0023] Optionally, the alarm device comprises a buzzer.

[0024] The buzzer is used for alarming when the off-position indication lamp is on.

[0025] To solve the above technical problems, the application further provides a server comprising the memory stick position detection device and further comprising a memory stick and a memory slot.

[0026] It can be seen that the application provides a memory stick position detection device, which comprises a pressing module, an induction module and an indication module. The pressing module is used for clamping a memory stick so as to insert the memory stick into a memory slot. The induction module is used for generating an in-position signal when the memory stick is completely inserted into the memory slot and generating an off-position signal when the memory stick is not completely inserted into the memory slot. The indication module is used for displaying in-position state indication information when the in-position signal is received and displaying off-position state indication information when the off-position signal is received. Thus, on the one hand, the application sets the pressing module, the induction module and the indication module, clamps the memory stick by the pressing module and inserts the memory stick into the memory slot, reduces the risk of damage to the memory stick caused by non-standard clamping of the memory stick, and improves the efficiency and accuracy of detecting the position of the memory stick by combining the induction module and the indication module. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute the embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0028] Figure 1 A structure schematic diagram of a memory stick position detection device disclosed by the application;

[0029] Figure 2 A structure schematic diagram of a clamping block disclosed by the application;

[0030] Figure 3 A structure schematic diagram of a clamping side cover and a battery slot cover disclosed by the application;

[0031] Figure 4 A structure schematic diagram of a specific memory stick position detection device disclosed by the application;

[0032] Figure 5 A structure schematic diagram of a specific memory stick position detection device disclosed by the application;

[0033] Figure 6 A structure schematic diagram of a specific memory stick position detection device disclosed by the application;

[0034] Figure 7 A structure schematic diagram of a specific memory stick position detection device disclosed by the application;

[0035] Figure 8 A structure schematic diagram of a specific memory stick position detection device disclosed by the application;

[0036] Figure 9A schematic diagram of the contact between the induction block and the induction sheet disclosed in the present application;

[0037] Figure 10 A schematic diagram of the contact between the induction block and the induction sheet disclosed in the present application;

[0038] Figure 11 A schematic diagram of the cross induction sheet structure disclosed in the present application;

[0039] Figure 12 A schematic diagram of the side induction sheet structure disclosed in the present application;

[0040] Figure 13 A schematic diagram of the specific memory stick position detection device structure disclosed in the present application;

[0041] Figure 14 A schematic diagram of the specific memory stick position detection device structure disclosed in the present application. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0043] At present, the memory stick needs to be installed into the memory slot of the mainboard during the whole machine assembly process of the server and computer products. At present, the manual installation of the memory stick includes the following three steps: clamping the memory stick, pressing the memory stick, and checking whether the memory stick is installed in place. The three steps are independent and cannot be completed at one time. The installation method has the following disadvantages: in the clamping process, the finger of the worker is used to clamp the memory stick, which may contaminate the memory stick and cause non-standard clamping, resulting in quality hidden danger and damaged parts of the memory stick. In the pressing process, after the memory stick is aligned with the memory slot of the mainboard, a pressing tool needs to be taken to press the memory stick into the memory slot, and the repeated taking and placing of the memory stick and the memory pressing tool results in low production efficiency. In the checking process of whether the memory stick is installed in place, the actual installation position of the memory stick needs to be checked by the naked eye after the memory stick is pressed into the memory slot. Therefore, due to the fatigue of the worker and the difference in the checking ability of the worker, it is impossible to ensure that all the memory sticks are completely and accurately detected, and the naked eye checking also has the problem of low efficiency.

[0044] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0045] Reference is made to Figure 1As shown in the figure, this application embodiment provides a memory module position detection device, including:

[0046] The pressing module 11 is used to clamp the memory module so that the memory module can be inserted into the memory slot.

[0047] In this embodiment, the pressing module includes a pressing head and a clamping block. Pressing the pressing head engages a latch on the clamping block with a notch on the memory module to grip the memory module. Once the memory module is aligned with the memory slot, pressing the pressing head and squeezing the clamping block releases the released memory module into the memory slot. The clamping block includes a spring installed between the clamping block and the base of the memory module position detection device for gripping or releasing the memory module. The clamping block includes a clamping side cover for securing the clamping block to the base via screw holes on the side cover.

[0048] like Figure 2 The clamping block structure shown has a latch and a spring mounting hole. The main function of the clamping block is to clamp and release the memory module. The clamping block is installed in the clamping block mounting hole of the device base, and a spring supports the clamping block and the device base. When the clamping block is not pressed, the latch extends into the pressing groove of the device body, allowing the latch to engage with the notch of the memory module. When the clamping block is pressed, the latch retracts from the pressing groove, allowing the memory module to be released normally. The spring is installed in the spring mounting hole of the clamping block. (The last sentence appears to be incomplete and possibly refers to a different mechanism.) Figure 3 The clamping side cover shown presses and snaps the clamping block into the clamping block mounting hole of the device body. It can be understood that the clamping side cover is mainly used to fix the clamping block in the mounting hole of the device base, preventing the clamping block from popping out of the device base due to spring force. The battery slot cover is mainly used to cover the battery after it has been installed.

[0049] It is understandable that, such as Figure 4As shown, the pressing head in the diagram is the position where the hand grips and presses during the production operation. For example, after aligning the pressing slot of the device with the upper edge of the memory module, the hand presses down on the pressing head to insert the notch of the memory module into the pressing slot, causing the latches of the clamping blocks at both ends of the device to engage with the notch of the memory module. This allows the device to remove the memory module from the incoming material tray, and then move the device and memory module assembly above the motherboard memory slot. When the bottom edge of the memory module is aligned with the memory slot, the pressing head of the device is pressed down simultaneously, squeezing the clamping blocks. This causes the clamping blocks to disengage from the memory module's notch, pressing the memory module into the memory slot. The top and side wire channels in the diagram are mainly used to house the wires connecting the battery, buzzer, red indicator light, green indicator light, sensor block, horizontal sensor plate, and side sensor plate. The battery slot in the diagram is mainly used to install the battery required by this device; the battery slot has anode and cathode contact springs at both ends for connecting the wires. The clamping block is nested into the device body, and a spring supports it, causing the clamping block's latch to extend into the fixture's pressing groove. When the clamping block is pressed by hand, the clamping block's latch disengages from the fixture's pressing groove, thereby serving to hold or release the memory module.

[0050] The sensing module 12 is used to generate an in-place signal when the memory module is fully inserted into the memory slot and to generate an out-of-place signal when the memory module is not fully inserted into the memory slot.

[0051] In this embodiment, as Figure 5 As shown, the sensing modules are located on the corresponding left and right sides of the device, specifically comprising sensing blocks, side sensing plates, and horizontal sensing plates. A presence signal is generated when the memory module is fully inserted into the memory slot, and a departure signal is generated when the memory module is not fully inserted. As can be seen from the figure, the pressing fixture of this device also includes a red indicator light, a green indicator light, a buzzer, and a battery slot. The red and green indicator lights and the buzzer are used to indicate the installation status of the memory module.

[0052] The indicator module 13 is used to display on-state indication information when the on-state signal is received, and to display off-state indication information when the off-state signal is received.

[0053] In this embodiment, the indicator module is used to display in-position status indication information when receiving the in-position signal and to display out-of-position status indication information when receiving the out-of-position signal. It is understood that the indicator module includes an in-position indicator light and an out-of-position indicator light. The in-position indicator light displays in-position status indication information when receiving the in-position signal and out-of-position status indication information when receiving the out-of-position signal. For example, the in-position indicator light is green, and the out-of-position indicator light is red. That is, when the memory module is inserted into the memory slot and in the correct position, the green indicator light of the indicator module receives the in-position signal generated in the sensing module, and the green indicator light illuminates (i.e., displays in-position status indication information) upon receiving the in-position signal. When the memory module is inserted into the memory slot but not in the correct position, the red indicator light of the indicator module receives the out-of-position signal generated in the sensing module, and the red indicator light illuminates (i.e., displays out-of-position status indication information) and a buzzer sounds an alarm upon receiving the out-of-position signal.

[0054] Specifically, the "in position" indicator is green. It checks that when the memory module is fully pressed into the memory slot, the lower end of the sensing block contacts the horizontal sensing plate, forming a closed current loop from "battery - sensing block - horizontal sensing plate - green indicator," causing the green light to illuminate. The "out position" indicator is red, and the alarm device is a buzzer. It checks that when the memory module is not fully pressed into the memory slot, the lower end of the sensing block contacts the side sensing plate, forming a closed current loop from "battery - sensing block - side sensing plate - red indicator light - buzzer," causing the red light to illuminate and the buzzer to sound.

[0055] like Figure 6 As shown, this device mainly consists of a pressing fixture, a motherboard, a memory module, and a memory slot. The pressing fixture's main functions include: picking up the memory module from the receiving box and placing it into the memory slot; pressing the memory module into the memory slot to complete the installation process; and checking whether the memory module is fully installed by displaying the status through indicator lights and a buzzer. The motherboard has memory slots soldered onto it. The memory module is the object of this device. The memory slot is the object of this device; after the device picks up the memory module, it is placed into the memory slot and pressed into place. This device allows for a one-step operation of "memory module picking – memory module pressing – memory module installation check," eliminating the need to repeatedly handle the memory module and the pressing fixture, and eliminating the need for personnel to observe the actual installation position of the memory module. The operator only needs to observe whether the indicator lights and buzzer on the device are alarming to confirm whether the memory module is installed correctly. The memory module position detection device also includes the memory module and the memory slot.

[0056] For example, after installing the battery into the device's battery slot, check if the device's indicator lights and buzzer are working properly. Align the device's pressing slot with the upper edge of the memory module on the memory box, and press the device's pressing head and clamping block. Insert the upper edge of the memory module fully into the device's pressing slot, then release the clamping block to allow the clips to hold the memory module's notch. Lift the device and memory module assembly, aligning the lower edge of the memory module with the memory slot on the motherboard. Press the clamping block to place the memory module into the memory slot. Then, simultaneously press the pressing heads at both ends of the device to fully insert the memory module into the memory slot. Check the status of the indicator lights and buzzer at both ends of the device (memory module fully pressed: green light on, red light off, buzzer silent; memory module not fully pressed: green light off, red light on, buzzer sounds). This completes the "clamp, press, check" assembly process for installing one memory module, and you can proceed to the next cycle.

[0057] Furthermore, by using a device to clamp the memory module, the risks of material contamination and damage to the memory device caused by manual handling are avoided. This device integrates clamping, pressing, and detection, eliminating the need for multiple steps of picking up and placing the memory module or tools, followed by tooling and fixture pressing, and finally, a final pressing check. This improves production efficiency. The device's automatic detection of memory module placement, accompanied by indicator lights and a buzzer alarm, better alerts operators to improper memory installation, increasing first-pass yield, reducing rework rates, and lowering production costs. This automatic memory module placement detection also reduces the skill and awareness requirements of personnel, lowering the skill requirements for production line workers and reducing labor costs.

[0058] As can be seen, this application provides a memory module position detection device, comprising: a pressing module for clamping a memory module to insert it into a memory slot; a sensing module for generating a presence signal when the memory module is fully inserted into the memory slot and a departure signal when the memory module is not fully inserted into the memory slot; and an indicating module for displaying presence status indication information upon receiving the presence signal and departure status indication information upon receiving the departure signal. Therefore, this application, by setting up a pressing module, a sensing module, and an indicating module, reduces the risk of memory module damage due to improper clamping by using the pressing module to clamp and insert the memory module into the memory slot. Furthermore, the combination of the sensing module and the indicating module improves the efficiency and accuracy of detecting the memory module position.

[0059] This application discloses a memory module position detection device, see [link to relevant documentation]. Figure 7 As shown, the memory module position detection device includes:

[0060] The sensing block 21 is used to contact the horizontal sensing plate when the memory module is fully inserted into the memory slot, and to contact the side sensing plate when the memory module is not fully inserted into the memory slot. The sensing block is movably disposed between the horizontal sensing plate of the in-place circuit and the side sensing plate of the out-of-place circuit.

[0061] In this embodiment, when the memory module is fully inserted into the memory slot, it contacts the horizontal sensing plate; when the memory module is not fully inserted into the memory slot, it contacts the side sensing plate. The sensing block is a sensing block movably disposed between the horizontal sensing plate of the in-place circuit and the side sensing plate of the out-of-place circuit. It can be understood that the sensing block is a structure used to detect whether the memory module is fully pressed into the motherboard memory slot, such as... Figure 8 As shown in the diagram of the sensing block structure, the sensing block includes a wire connection hole, a spring limiting post, a shaft hole, a sensing horizontal surface, and a sensing side surface. The upper end of the sensing block has a wire connection hole for a wire connected to the negative terminal of a battery. Below the wire connection hole is a spring limiting post for fixing a spring to the post. Below the spring limiting post is a shaft hole for mounting a rotating shaft, allowing the sensing block to rotate around the shaft on the device's base. Below the shaft hole is a relatively flat contact surface, the sensing horizontal surface, which contacts the horizontal sensing surface of the horizontal sensing element. The curved contact surface connected to the sensing horizontal surface is the sensing side surface, which contacts the side sensing surface of the side sensing element. The spring mounting hole is for mounting a spring that supports the upper end of the sensing block, ensuring that when the device presses the inner strip into the motherboard memory slot, the lower end of the sensing block fits tightly against the memory slot's head, thus detecting whether the memory strip is properly installed. The shaft hole of the sensing block is used to fix the rotating shaft of the sensing block, so that the sensing block can rotate around the shaft.

[0062] Specifically, when the memory module is fully pressed into place, the sensing surface will contact the sensing surface of the horizontal sensing plate. At this time, the clip of the hippopotamus head installed on the memory slot is fully engaged in the notch on the memory module, and the hippopotamus head is in the correct position perpendicular to the memory slot. The hippopotamus head will not contact the sensing surface, the sensing block will not rotate, and the sensing block will contact the horizontal sensing plate, thus forming a closed circuit (i.e., the in-place circuit) of "battery-sensing block-horizontal sensing plate-green indicator light". The green indicator light will then illuminate, indicating that the memory module is fully pressed into place. Conversely, if the memory module is not fully pressed into place, the clip of the hippopotamus head installed on the memory slot will not be fully engaged in the notch on the memory module, and the hippopotamus head will be at a certain angle. In this case, the hippopotamus head will contact the sensing surface, causing the sensing block to rotate a certain angle based on the rotation axis, preventing the sensing block and the horizontal sensing plate from contacting each other. This results in the in-place circuit not closing, and the green light will not illuminate. Figure 9 As shown.

[0063] When the memory module is not fully pressed in, the sensing side will contact the side sensing surface of the side sensing plate. At this time, the clip of the hippocampus head installed on the memory slot is not fully engaged in the notch on the memory module, and the hippocampus head will form a certain angle. This causes the hippocampus head to contact the sensing side, causing the sensing block to rotate a certain angle based on the rotation axis, making the sensing block contact the side sensing plate. This forms a closed circuit (i.e., the disengagement circuit) between the battery, sensing block, side sensing plate, red indicator light, and buzzer. The red indicator light will illuminate and the buzzer will sound, indicating that the memory module is not fully pressed in. Conversely, if the memory module is fully pressed in, the hippocampus head of the memory slot will not contact the sensing side, preventing the sensing block and side sensing plate from contacting. This causes the disengagement circuit to break, the red indicator light to not illuminate, and the buzzer to not sound. Figure 10 As shown.

[0064] It is understandable that, such as Figure 3 As shown, the horizontal sensor mounting holes and the side sensor mounting holes are used for inserting the horizontal sensor and the side sensor, respectively. It should be noted that the side sensor is a pair, clamped onto two sides of the sensor block. The structure of the horizontal sensor is as follows: Figure 11 As shown, the horizontal sensing element has wire connection holes, screw fixing holes, and a horizontal sensing surface. The side sensing element structure is as follows. Figure 12 As shown, the side sensing plate is provided with wire connection holes, screw fixing holes, side sensing surface and locking edge.

[0065] Specifically, the main function of the horizontal sensor is to detect whether the memory module is properly pressed. If the memory module is properly pressed, the horizontal sensing surface contacts the sensing surface, forming a closed circuit of "battery-sensor block-horizontal sensor-green indicator light". The green indicator light illuminates when the memory module is not properly pressed; otherwise, the green indicator light is off. The wire connection hole is used to connect the wires in the device's circuit loop. The screw fixing hole is used to fix the horizontal sensor to the device base with screws. The main function of the side sensor is also to detect whether the memory module is properly pressed. If the memory module is not properly pressed, the side sensing surface contacts the sensing surface, forming a closed circuit of "battery-sensor block-side sensor-red indicator light-buzzer". The red indicator light illuminates and the buzzer sounds when the memory module is not properly pressed; otherwise, the red indicator light is off and the buzzer does not sound. The wire connection hole is used to connect the wires in the device's circuit loop. The screw fixing hole is used to fix the horizontal sensor to the device base with screws.

[0066] The in-situ circuit 22 is used to generate the in-situ signal when the transverse sensing sheet contacts the sensing block.

[0067] In this embodiment, the presence circuit generates the presence signal when the horizontal sensing plate contacts the sensing block. It is understood that when the memory module is fully pressed into place, the horizontal sensing surface contacts the horizontal sensing surface of the horizontal sensing plate. At this time, the snap-fit ​​of the hippocampus head mounted on the memory slot is fully engaged in the notch on the memory module, and the hippocampus head is in the correct position perpendicular to the memory slot. At this time, the hippocampus head does not contact the horizontal sensing surface, the sensing block does not rotate, and the sensing block contacts the horizontal sensing plate, thus forming a closed circuit (i.e., the presence circuit) of "battery-sensing block-horizontal sensing plate-green indicator light." At this time, the presence circuit generates the presence signal.

[0068] The displacement circuit 23 is used to generate the displacement signal when the side sensing sheet contacts the sensing block.

[0069] In this embodiment, the disengagement circuit generates the disengagement signal when the side sensing plate contacts the sensing block. It is understood that when the memory module is not fully pressed, the sensing side will contact the side sensing surface of the side sensing plate. At this time, the latch of the hippocampus mounted on the memory slot is not fully engaged in the notch on the memory module, and the hippocampus will form a certain angle. The hippocampus will then contact the sensing side, causing the sensing block to rotate a certain angle based on the rotation axis, making the sensing block contact the side sensing plate. This forms a closed circuit (i.e., the disengagement circuit) between the battery, sensing block, side sensing plate, red indicator light, and buzzer. At this time, the disengagement circuit generates the disengagement signal.

[0070] As can be seen, in this embodiment, when the memory module is fully pressed into place, the sensing surface will contact the sensing surface of the horizontal sensing plate, and the latch of the hippocampus head installed on the memory slot will be fully engaged in the notch on the memory module. The hippocampus head will be in the correct position perpendicular to the memory slot. At this time, the hippocampus head will not contact the sensing surface, the sensing block will not rotate, and the sensing block will contact the horizontal sensing plate, forming a closed in-place circuit. The in-place circuit generates the in-place signal. When the memory module is not pressed into place, the sensing side will contact the sensing surface of the side sensing plate. At this time, the latch of the hippocampus head installed on the memory slot will not be fully engaged in the notch on the memory module, and the hippocampus head will form a certain angle. At this time, the hippocampus head will contact the sensing side, causing the sensing block to rotate a certain angle based on the rotation axis, so that the sensing block contacts the side sensing plate, forming a closed out-of-place circuit. The out-of-place circuit generates the out-of-place signal. Through the combination of the sensing module and the indicator module, different signals are generated to indicate the current position of the memory module according to the installation position of the memory module, improving the efficiency and accuracy of detecting the position of the memory module.

[0071] This application discloses a memory module position detection device, see [link to relevant documentation]. Figure 13 As shown, the memory module position detection device includes:

[0072] The hippo head 31 is used to contact the sensing horizontal surface when the memory module is fully inserted into the memory slot, and to contact the sensing side surface when the memory module is not fully inserted into the memory slot.

[0073] In this embodiment, the hippocampus head is mounted on the memory slot. When the memory module is fully inserted into the memory slot, the hippocampus head contacts the sensing horizontal surface; when the memory module is not fully inserted into the memory slot, the hippocampus head contacts the sensing side surface. It is understood that the hippocampus head has a latch, which is used to secure the memory module when it is inserted into the memory slot by engaging the latch into the notch of the memory module. Furthermore, if the memory module is fully inserted into the memory slot, it indicates that the latch of the hippocampus head is fully embedded in the notch of the memory module. At this time, the hippocampus head is perpendicular to the motherboard on which the memory slot is mounted. In this perpendicular state, the hippocampus head does not contact the sensing horizontal surface of the sensing block (or contacts but without pressure). Therefore, the sensing block contacts the horizontal sensing plate, forming an in-situ circuit. If the memory module is not fully inserted into the memory slot, it indicates that the buckle of the hippocampus is not fully embedded in the notch of the memory module. At this time, the hippocampus is not perpendicular to the motherboard with the memory slot, but has a certain tilt angle. The hippocampus contacts the sensing surface of the sensing block and applies a certain pressure, forcing the sensing block to rotate a certain angle based on the rotating axis in the shaft hole. Therefore, the sensing block contacts the side sensing plate, forming a disengagement circuit.

[0074] Pressing slot 32 is used to guide the upper edge of the memory module into the memory slot.

[0075] In this embodiment, the pressing groove guides the upper edge of the memory module into the memory slot, thus allowing the memory module to be pressed more safely and accurately into the motherboard's memory slot. Figure 14 As shown. It should be noted that the edges of the pressing groove are also chamfered to facilitate guiding the upper edge of the memory module into the pressing groove of the fixture.

[0076] The inspection piece mounting slot 33 is used to install the horizontal sensing plate, the side sensing plate, the sensing block, and the top support spring required for the sensing block.

[0077] In this embodiment, the horizontal sensor plate, the side sensor plate, the sensor block, and the support spring required for the sensor block are installed on the inspection component mounting slot. Simultaneously, the mounting slot space also provides sufficient space for the movement of the headstocks at both ends of the memory slot when the memory module is pressed into the motherboard memory slot.

[0078] As can be seen, by setting a pressing groove in this embodiment, the memory module can be pressed more safely and accurately into the motherboard memory slot, facilitating the guidance of the upper edge of the memory module into the fixture pressing groove; an inspection component mounting slot is set, on which a horizontal sensing plate, a side sensing plate, a sensing block, and the top support spring required for the sensing block are installed; a hippocampus is set on the memory slot, and the angle between the hippocampus and the motherboard is changed according to the position of the memory module installed in the memory slot, that is, the pressure between the hippocampus and the sensing block, so that the sensing block contacts the side sensing plate or the horizontal sensing plate, forming a corresponding off-position circuit or in-position circuit, thereby improving the efficiency and accuracy of detecting the position of the memory module.

[0079] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0080] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A memory module position detection device, characterized in that, include: The pressing module is used to clamp the memory module so that it can be inserted into the memory slot; The sensing module is used to generate an in-place signal when the memory module is fully inserted into the memory slot, and to generate an out-of-place signal when the memory module is not fully inserted into the memory slot; An indicator module is used to display on-state indication information when the on-state signal is received, and to display off-state indication information when the off-state signal is received; The sensing module includes an in-position circuit, an out-of-position circuit, and a sensing block movably disposed between a horizontal sensing plate in the in-position circuit and a side sensing plate in the out-of-position circuit. The sensing block is used to contact the horizontal sensing plate when the memory module is fully inserted into the memory slot, and to contact the side sensing plate when the memory module is not fully inserted into the memory slot; The in-situ circuit is used to generate the in-situ signal when the transverse sensing sheet contacts the sensing block; The displacement circuit is used to generate the displacement signal when the side sensing sheet comes into contact with the sensing block.

2. The memory module position detection device according to claim 1, characterized in that, The pressing module includes: The pressing head and clamping block are used to press the pressing head to engage the clip on the clamping block with the notch on the memory module to clamp the memory module. After the memory module is aligned with the memory slot, the released memory module is inserted into the memory slot by pressing the pressing head and squeezing the clamping block.

3. The memory module position detection device according to claim 2, characterized in that, The clamping block includes a spring installed between the clamping block and the base of the memory module position detection device; Used to grip or release the memory module.

4. The memory module position detection device according to claim 3, characterized in that, The clamping block includes a clamping side cover; Used to fix the clamping block to the base through the screw holes on the clamping side cover.

5. The memory module position detection device according to claim 1, characterized in that, The sensing block includes a wire connection hole, a spring limiting post, a shaft hole, a sensing horizontal surface, and a sensing side surface.

6. The memory module position detection device according to claim 5, characterized in that, The memory slot includes a hippocampus; When the memory module is fully inserted into the memory slot, the hippocampus head contacts the sensing side surface; when the memory module is not fully inserted into the memory slot, the hippocampus head contacts the sensing side surface.

7. The memory module position detection device according to claim 1, characterized in that, The indicator module includes an in-position indicator light and an out-of-position indicator light; The indicator light is used to display an on-site status indication information when the on-site signal is received, and to display an off-site status indication information when the off-site signal is received.

8. The memory module position detection device according to claim 7, characterized in that, Also includes: An alarm device; wherein the alarm device includes a buzzer; The buzzer is used to sound an alarm when the away indicator light is on.

9. A server, characterized in that, The device includes the memory module position detection device as described in any one of claims 1 to 8, and further includes a memory module and a memory slot.

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