Material conveying system and method

Abstract

The present application relates to a material conveying system and method. The system includes: moving the first process printed circuit board after flux spraying to the printed circuit board transfer station through a mobile arm module, and moving the first process printed circuit board to a laser batch welding device; the mobile arm module moves the first process carrier plate after film pasting and tearing to the first carrier plate transfer station, and moves it to a chip arrangement transfer device; the mobile arm module moves the second process carrier plate after chip arrangement to the second carrier plate transfer station, and moves it to a laser batch welding device; the laser batch welding device welds the chip on the second process carrier plate to the first process printed circuit board, and moves the obtained second process printed circuit board to the unloading device through the mobile arm module, and the initial carrier plate is returned to the film pasting and tearing device through the mobile arm module, so that the material is delivered to the specified position within the specified time, thereby improving the overall LED chip solid crystal efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of material conveying, and in particular to a material conveying system and method. Background Art

[0002] With the development of LED technology, LED has been widely used in display devices, electronic equipment and other fields. The existing LED chip bonding solution requires first using a nozzle on a swing arm to place the chips one by one on the solder pad of a printed circuit board coated with flux, and then performing multiple steps such as reflow soldering to achieve bonding.

[0003] The existing LED chip bonding solution has low overall LED chip bonding efficiency, low yield, and low precision. In response to the above problems, a LED chip mass transfer solution is proposed to improve the defects of low efficiency, low yield, and low precision of the LED chip bonding solution, thus deriving this set of material conveying system. Summary of the invention

[0004] Based on this, it is necessary to provide a material conveying method, device and system for the above-mentioned mass transfer solution, which can transport materials to a specified location within a specified time and improve the overall LED chip bonding efficiency.

[0005] In a first aspect, the present application provides a material conveying system, comprising:

[0006] The printed circuit board transfer table is used to place the first process printed circuit board; the first process printed circuit board is obtained by spraying flux on the initial printed circuit board through the feeding spraying device;

[0007] A first carrier plate transfer table, the first carrier plate transfer table is used to place a first process carrier plate; the first process carrier plate is obtained by performing film pasting and tearing operations on an initial carrier plate by a film pasting and tearing device;

[0008] A second carrier plate transfer table, the second carrier plate transfer table is used to place a second process carrier plate; the second process carrier plate is obtained by performing a chip arrangement operation on the first process carrier plate through a chip arrangement transfer device;

[0009] A movable arm module, the movable arm module is used to move the first process printed board to the printed board transfer table, and is also used to move the first process printed board in the printed board transfer table to the first positioning point of the laser batch welding device; the movable arm module is used to move the first process carrier plate to the first carrier plate transfer table, and is also used to move the first process carrier plate in the first carrier plate transfer table to the chip arrangement transfer device, and is also used to move the second process carrier plate to the second carrier plate transfer table, and is also used to move the second process carrier plate in the second carrier plate transfer table to the second positioning point of the laser batch welding device; the laser batch welding device is used to weld the chip on the second process carrier plate to the pad of the first process printed board to obtain the initial carrier plate and the second process printed board;

[0010] Among them, the second process printed circuit board is moved to the unloading device through the mobile arm module; the initial carrier board is returned to the film sticking and tearing device through the mobile arm module.

[0011] Optionally, the movable arm module includes a first movable arm; the printed circuit board transfer station includes a first printed circuit board transfer station;

[0012] The first movable arm moves the first process printed board to the first printed board transfer station; the first movable arm is also used to move the first process carrier board to the first carrier board transfer station.

[0013] Optionally, the movable arm module further includes a second movable arm and a third movable arm; the printed circuit board transfer station further includes a second printed circuit board transfer station;

[0014] The second moving arm moves the first process printed board in the first printed board transfer station to the second printed board transfer station; the second moving arm is also used to move the first process carrier board in the first carrier board transfer station to the chip arrangement transfer device; the second moving arm is also used to move the second process carrier board to the second carrier board transfer station;

[0015] The third movable arm moves the first process printed board in the second printed board transfer table to the first positioning point of the laser batch welding device; the third movable arm also moves the second process carrier board in the second carrier board transfer table to the second positioning point of the laser batch welding device.

[0016] Optionally, the laser batch welding device is also used to align and weld the chip on the second process carrier board to the corresponding pad of the first process printed board through a CCD alignment algorithm when the first process printed board is detected at the first positioning point and the second process carrier board is detected at the second positioning point, so as to obtain an initial carrier board and a second process printed board.

[0017] Optionally, the initial carrier plate is sequentially transferred back to the film sticking and tearing device through the third moving arm, the second moving arm and the first moving arm.

[0018] Optionally, the initial carrier plate is carrier glass.

[0019] Optionally, the film sticking and tearing device is used to sequentially perform cleaning operation, film sticking operation and film tearing operation on the initial carrier plate to obtain a first process carrier plate; the cleaning operation is to clean the surface of the initial carrier plate; the film sticking operation is to stick a transfer film on the initial carrier plate that has completed the cleaning operation; the film tearing operation is to tear off a release film from the initial carrier plate that has completed the film sticking operation; the transfer film includes a release film.

[0020] Optionally, the transfer film includes a PET carrier film, a first adhesive layer arranged on the PET carrier film, a PET support film arranged on the first adhesive layer, a second adhesive layer arranged on the PET support film, and a release film arranged on the second adhesive layer.

[0021] In a second aspect, the present application provides a material conveying method, comprising the following steps:

[0022] The first process printed board is moved to the printed board transfer table by moving the arm module, and the first process printed board in the printed board transfer table is moved to the first positioning point of the laser batch welding device; the first process printed board is obtained by spraying flux on the initial printed board through the feeding spraying device;

[0023] The first process carrier plate is moved to the first carrier plate transfer table by moving the arm module, and the first process carrier plate in the first carrier plate transfer table is moved to the chip arrangement transfer device; the first process carrier plate is obtained by applying and tearing film to the initial carrier plate by the film applying and tearing device;

[0024] The second process carrier plate is moved to the second carrier plate transfer table by moving the arm module, and the second process carrier plate in the second carrier plate transfer table is moved to the second positioning point of the laser batch welding device; the second process carrier plate is obtained by performing chip arrangement operation on the first process carrier plate by the chip arrangement transfer device;

[0025] The chip on the second process carrier plate is welded to the first process printed board by a laser batch welding device to obtain an initial carrier plate and a second process printed board;

[0026] The second process printed circuit board is moved to the unloading device through the mobile arm module, and the initial carrier board is returned to the film pasting and tearing device through the mobile arm module.

[0027] Optionally, the first process carrier plate is obtained by applying a film to an initial carrier plate through a film applying and tearing device, and the steps include:

[0028] The initial carrier plate is cleaned by a film sticking and tearing device; the cleaning operation is to clean the surface of the initial carrier plate; the film sticking operation is to stick a transfer film on the initial carrier plate after the cleaning operation;

[0029] After the cleaning operation is completed, the film pasting operation is performed on the initial carrier plate after the cleaning operation is completed by the film pasting and tearing device;

[0030] After the film sticking operation is completed, the film sticking and tearing device is used to tear off the initial carrier plate after the film sticking operation to obtain the first process carrier plate; the film tearing operation is to tear off the release film from the initial carrier plate after the film sticking operation; the transfer film includes the release film.

[0031] One of the above technical solutions has the following advantages and beneficial effects:

[0032] In the above-mentioned material conveying system, the initial printed circuit board is sprayed with flux by the feeding spraying device to obtain the first process printed circuit board; the moving arm module moves the first process printed circuit board to the printed circuit board transfer table, and moves the first process printed circuit board in the printed circuit board transfer table to the first positioning point of the laser batch welding device; the initial carrier plate is subjected to the film pasting and tearing operation by the film pasting and tearing device to obtain the first process carrier plate, the carrier plate moving arm moves the first process carrier plate to the first carrier plate transfer table, and moves the first process carrier plate in the first carrier plate transfer table to the chip arrangement transfer device; the chip arrangement transfer device performs chip arrangement operation on the first process carrier plate to obtain to the second process carrier plate; the mobile arm module moves the second process carrier plate to the second carrier plate transfer table, and moves the second process carrier plate in the second carrier plate transfer table to the second positioning point of the laser batch welding device; the laser batch welding device welds the chip on the second process carrier plate to the first process printed board to obtain the initial carrier plate and the second process printed board; the second process printed board is moved to the unloading device through the mobile arm module; the initial carrier plate is returned to the film sticking and tearing device through the mobile arm module, thereby realizing the fast and accurate transmission of LED solid crystal materials, so that the materials are delivered to the specified position within the specified time, and the overall LED chip solid crystal efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a first structural schematic diagram of the material conveying system in an embodiment of the present application.

[0034] Figure 2 This is a second structural schematic diagram of the material conveying system in an embodiment of the present application.

[0035] Figure 3 This is a third structural schematic diagram of the material conveying system in the embodiment of the present application.

[0036] Figure 4It is a structural schematic diagram of the film sticking and tearing operations in the embodiment of the present application.

[0037] Figure 5 It is a schematic diagram of the flow of the material conveying method in the embodiment of the present application.

[0038] Figure 6 It is a schematic flow chart of the film sticking and tearing operation steps in the embodiment of the present application.

[0039] Reference numerals

[0040] 10. Printed circuit board transfer table; 102. First printed circuit board transfer table; 104. Second printed circuit board transfer table; 20. Moving arm module; 202. First moving arm; 204. Second moving arm; 206. Third moving arm; 30. First carrier plate transfer table; 40. Second carrier plate transfer table; 60. Loading and spraying device; 70. Laser batch welding device; 80. Film sticking and tearing device; 90. Chip arrangement and transfer device; 100. Unloading device. DETAILED DESCRIPTION

[0041] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0042] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element and combined with it as a whole, or there may be an intermediate element at the same time. The terms "disposed", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0044] In order to solve the problem that the material delivery arrival time error is large and the overall LED chip bonding efficiency is low in the existing LED chip bonding solution, in one embodiment, Figure 1 As shown, a material conveying system is provided, including a printed circuit board transfer table 10, a movable arm module 20, a first carrier board transfer table 30, and a second carrier board transfer table 40.

[0045] The printed circuit board transfer table 10 is used to place the first process printed circuit board; the first process printed circuit board is obtained by spraying flux on the initial printed circuit board through the feeding spraying device 60; the moving arm module 20 is used to move the first process printed circuit board to the printed circuit board transfer table 10, and is also used to move the first process printed circuit board in the printed circuit board transfer table 10 to the first positioning point of the laser batch welding device 70; the first carrier plate transfer table 30 is used to place the first process carrier plate; the first process carrier plate is obtained by applying film to and tearing the initial carrier plate through the film applying and tearing device 80; the second carrier plate transfer table 40 is used to place the second process carrier plate; the second process carrier plate is obtained by performing chip arrangement operation on the first process carrier plate through the chip arrangement transfer device 9 ... The movable arm module 20 is also used to move the first process carrier plate to the first carrier plate transfer table 30, and is also used to move the first process carrier plate in the first carrier plate transfer table 30 to the chip arrangement transfer device 90, and is also used to move the second process carrier plate to the second carrier plate transfer table 40, and is also used to move the second process carrier plate in the second carrier plate transfer table 40 to the second positioning point of the laser batch welding device 70; the laser batch welding device 70 is used to weld the chip on the second process carrier plate to the first process printed board to obtain the initial carrier plate and the second process printed board; wherein, the second process printed board is moved to the unloading device 100 by the movable arm module 20; the initial carrier plate is returned to the film pasting and tearing device 80 by the movable arm module 20.

[0046] The initial printed circuit board refers to a printed circuit board that is not provided with flux and is not welded with materials such as chips. It should be noted that the setting method of the flux can be, but is not limited to, spraying and smearing. The loading spraying device 60 can be used to spray flux on the surface of the initial printed circuit board to obtain a first-process printed circuit board. The first-process printed circuit board is moved to the printed circuit board transfer table 10 by the movable arm module 20, and the first-process printed circuit board is temporarily stored on the printed circuit board transfer table 10. Among them, the printed circuit board transfer table 10 can be provided with a printed circuit board limiter, and the printed circuit board limiter can be used to limit the placed first-process printed circuit board, so that the first-process printed circuit board can be placed in a fixed position on the printed circuit board transfer table 10 in an orderly manner. Exemplarily, the printed circuit board transfer table 10 can hold multiple first-process printed circuit boards.

[0047] The mobile arm module 20 can also move the first process printed board placed on the printed board transfer table 10 to the first positioning point of the laser batch welding device 70, so that the first process printed board is temporarily stored at the first positioning point of the laser batch welding device 70 for standby use. By setting the printed board transfer table 10, the first process printed board is transported in sections, which can effectively balance the working time of the feeding spraying device 60 and the laser batch welding device 70, facilitate installation, commissioning, maintenance, transportation, etc., and simplify the printed board transmission process, so that the printed board can be transported to the specified position within the specified time.

[0048] The initial carrier plate refers to a carrier plate on which no film or other materials are set. It should be noted that the film on the carrier plate can be set in a manner that is not limited to pasting and gluing. Exemplarily, the initial carrier plate can be a carrier glass. The film pasting and tearing device 80 can be used to perform film pasting and tearing operations on the initial carrier plate, so that the film is pasted on the initial carrier plate, and then the first process carrier plate is obtained. The first process carrier plate is moved to the first carrier plate transfer table 30 by the moving arm module 20, and the first process carrier plate is temporarily stored on the first carrier plate transfer table 30. Among them, the first carrier plate transfer table 30 can be provided with a first carrier plate limiter, and the first process carrier plate placed can be limited by the first carrier plate limiter, so that the first process carrier plate can be placed in a fixed position on the first carrier plate transfer table 30 in an orderly manner. Exemplarily, the first carrier plate transfer table 30 can hold at least one first process carrier plate.

[0049] The movable arm module 20 can also move the first process carrier plate placed on the first carrier plate transfer table 30 to the chip arrangement transfer device 90. The chip arrangement transfer device 90 can be used to arrange the chips on the first process carrier plate, thereby obtaining the second process carrier plate. The second process carrier plate is moved to the second carrier plate transfer table 40 by the movable arm module 20, and the second process carrier plate is temporarily stored on the second carrier plate transfer table 40. Among them, the second carrier plate transfer table 40 can be provided with a second carrier plate limiter, and the second process carrier plate placed can be limited by the second carrier plate limiter, so that the second process carrier plate can be placed in a fixed position on the second carrier plate transfer table 40 in an orderly manner. Exemplarily, the second carrier plate transfer table 40 can hold at least one second process carrier plate.

[0050] The mobile arm module 20 is also used to move the second process carrier plate placed on the second carrier plate transfer table 40 to the second positioning point of the laser batch welding device 70; then the laser batch welding device 70 can weld the chip on the second process carrier plate to the first process printed board. After the welding is completed, the initial carrier plate and the second process printed board are obtained. The second process printed board is moved to the unloading device 100 through the mobile arm module 20; the initial carrier plate is returned to the film pasting and tearing device 80 through the mobile arm module 20 to realize the recycling of the carrier plate. By setting the first carrier plate transfer table 30 and the second carrier plate transfer table 40, the carrier plates of different processes are transported in sections, and then the working time of the film pasting and tearing device 80, the chip arrangement and transfer device 90 and the laser batch welding device 70 can be effectively balanced, which is convenient for installation, debugging, maintenance, transportation, etc., so that the carrier plate can be transported to the specified position within the specified time.

[0051] In the above embodiment, the initial printed circuit board is sprayed with flux by the feeding spraying device 60 to obtain the first process printed circuit board; the arm module 20 moves the first process printed circuit board to the printed circuit board transfer table 10, and moves the first process printed circuit board in the printed circuit board transfer table 10 to the first positioning point of the laser batch welding device 70; the film pasting and tearing device 80 performs the film pasting and tearing operation on the initial carrier plate to obtain the first process carrier plate, the arm module 20 moves the first process carrier plate to the first carrier plate transfer table 30, and moves the first process carrier plate in the first carrier plate transfer table 30 to the chip arrangement transfer device 90; the chip arrangement transfer device 90 performs the chip arrangement operation on the first process carrier plate to obtain The second process carrier plate; the mobile arm module 20 moves the second process carrier plate to the second carrier plate transfer table 40, and moves the second process carrier plate in the second carrier plate transfer table 40 to the second positioning point of the laser batch welding device 70; the laser batch welding device 70 welds the chip on the second process carrier plate to the first process printed board to obtain the initial carrier plate and the second process printed board; the second process printed board is moved to the unloading device 100 through the mobile arm module 20; the initial carrier plate is returned to the film sticking and tearing device 80 through the mobile arm module 20, thereby realizing the fast and accurate transmission of the LED solid crystal material, so that the material is delivered to the specified position within the specified time, and the overall LED chip solid crystal efficiency is improved.

[0052] In one example, if Figure 2 As shown, the movable arm module 20 includes a first movable arm 202; the printed board transfer station 10 includes a first printed board transfer station 102. The first movable arm 202 moves the first process printed board to the first printed board transfer station 102; the first movable arm 202 is also used to move the first process carrier board to the first carrier board transfer station 30.

[0053] The feeding spraying device 60 sprays flux on the surface of the initial printed board, thereby obtaining a first process printed board. The first process printed board is moved to the first printed board transfer table 102 by the first moving arm 202, and the first process printed board is temporarily stored on the first printed board transfer table 102. By setting the first printed board transfer table 102 and the first moving arm 202, the first process printed board is transported in sections, thereby effectively balancing the working time of the feeding spraying device 60 and the laser batch welding device 70, facilitating installation, commissioning, maintenance, transportation, etc., so that the printed board can be transported to the designated location within the specified time.

[0054] In one example, if Figure 2 As shown, the movable arm module 20 further includes a second movable arm 204 and a third movable arm 206 ; the printed circuit board transfer table 10 further includes a second printed circuit board transfer table 104 .

[0055] The second movable arm 204 moves the first process printed board 102 in the first printed board transfer table to the second printed board transfer table 104; the second movable arm 204 is also used to move the first process carrier board in the first carrier board transfer table 30 to the chip arrangement transfer device 90; the second movable arm 204 is also used to move the second process carrier board to the second carrier board transfer table 40; the third movable arm 206 moves the first process printed board in the second printed board transfer table 104 to the first positioning point of the laser batch welding device 70; the third movable arm 206 also moves the second process carrier board in the second carrier board transfer table 40 to the second positioning point of the laser batch welding device 70.

[0056] The first process printed board placed on the first printed board transfer table 102 is moved to the second printed board transfer table 104 by the second moving arm 204, so that the first process printed board is temporarily stored on the second printed board transfer table 104 for standby use. The first process printed board placed on the second printed board transfer table 104 is moved to the first positioning point of the laser batch welding device 70 by the third moving arm 206, so that the first process printed board is temporarily stored on the first positioning point of the laser batch welding device 70 for standby use.

[0057] The film pasting and tearing device 80 performs a film pasting and tearing operation on the initial carrier plate, so that the film is pasted on the initial carrier plate, thereby obtaining a first process carrier plate. The first process carrier plate is moved to the first carrier plate transfer table 30 by the first moving arm 202, and the first process carrier plate is temporarily stored on the first carrier plate transfer table 30. The second moving arm 204 moves the first process carrier plate placed on the first carrier plate transfer table 30 to the chip arrangement transfer device 90, and the chip arrangement transfer device 90 arranges the chips on the first process carrier plate, thereby obtaining a second process carrier plate. The second process carrier plate is moved to the second carrier plate transfer table 40 by the second moving arm 204, and the second process carrier plate is temporarily stored on the second carrier plate transfer table 40.

[0058] The third movable arm 206 moves the second process carrier plate placed on the second carrier plate transfer table 40 to the second positioning point of the laser batch welding device 70; then the laser batch welding device 70 can weld the chip on the second process carrier plate to the first process printed circuit board. By setting the first carrier plate transfer table 30 and the second carrier plate transfer table 40, as well as the first movable arm 202, the second movable arm 204, and the third movable arm 206, the printed circuit boards of different processes are segmented and transmitted, thereby effectively balancing the working time of the film sticking and tearing device 80, the chip arrangement and transfer device 90 and the laser batch welding device 70, facilitating installation, debugging, maintenance, transportation, etc., and at the same time simplifying the carrier plate transmission process, so that the carrier plate can be transmitted to the specified position within the specified time.

[0059] In one example, if Figure 3 As shown, the laser batch welding device 70 is also used to align and weld the chip on the second process carrier board to the corresponding pad of the first process printed board through the CCD alignment algorithm when the first process printed board is detected at the first positioning point and the second process carrier board is detected at the second positioning point, so as to obtain the initial carrier board and the second process printed board.

[0060] The laser batch welding device 70 can detect the first process printed board at the first positioning point, for example, by setting an infrared sensor to detect whether the first process printed board is at the first positioning point by infrared sensing. The laser batch welding device 70 can detect the second process carrier board at the second positioning point, for example, by setting an infrared sensor to detect whether the second process carrier board is at the second positioning point by infrared sensing.

[0061] The laser batch welding device 70 is pre-loaded with a CCD alignment program. When the laser batch welding device 70 detects the first process printed board at the first positioning point and the second process carrier board at the second positioning point, the chip on the second process carrier board is aligned with the corresponding pad of the first process printed board through the CCD alignment algorithm and then press-welded. After the welding is completed, the initial carrier board and the second process printed board are obtained.

[0062] In one example, if Figure 3 As shown, the initial carrier plate after welding by the laser batch welding device 70 is successively transferred back to the film sticking and tearing device 80 through the third moving arm 206, the second moving arm 204 and the first moving arm 202, thereby improving the recycling rate of the carrier and improving the overall LED chip bonding efficiency.

[0063] It should be noted that the initial carrier plate sent back is a carrier plate with residual glue, that is, the transfer film may undergo a qualitative change after being hit by the laser, affecting the viscosity or the glue surface may be uneven after lamination, so it cannot be reused and needs to return to the film pasting and tearing device to tear off the old film and then apply a new film.

[0064] In one example, if Figure 4 As shown, the film sticking and tearing device 80 is used to sequentially perform cleaning operations, film sticking operations and film tearing operations on the initial carrier plate to obtain a first process carrier plate; the cleaning operation is to clean the surface of the initial carrier plate; the film sticking operation is to stick a transfer film to the initial carrier plate that has completed the cleaning operation; the film tearing operation is to tear off the release film from the initial carrier plate that has completed the film sticking operation; the transfer film includes a release film.

[0065] The transfer film includes a PET carrier film, a first adhesive layer, a PET support film, a second adhesive layer and a release film. Specifically, the PET carrier film is pasted on one surface of the cleaned initial carrier plate, the first adhesive layer is arranged on the PET carrier film, the PET support film is arranged on the first adhesive layer, the second adhesive layer is arranged on the PET support film, and the release film is arranged on the second adhesive layer.

[0066] The film pasting and tearing device 80 can clean the surface of the initial carrier plate to keep the surface of the initial carrier plate clean, and then paste the transfer film on the initial carrier plate that has completed the cleaning operation, and paste the transfer film on the surface of the initial carrier plate that has completed the cleaning operation, and the release film in the transfer film is away from the initial carrier plate. Then, the release film of the initial carrier plate that has completed the film pasting operation is torn off, so that the second adhesive layer is exposed, so as to facilitate the pasting of the array chip in the following process.

[0067] In one example, by setting a movable arm module 20, the feeding spraying device 60 sprays flux on the initial printed board to obtain a first process printed board. The first process printed board is moved to the printed board transfer table 10, and then moved to the laser batch welding device 70 for standby. After the film pasting and tearing device 80 cleans the initial carrier, pastes the transfer film, and tears the release film, the first process carrier plate is obtained, and the first process carrier plate is transferred to the first carrier plate transfer table 30, and then transferred to the chip arrangement transfer device 90 for chip arrangement to obtain the second process carrier plate. After the chip arrangement is completed, the second process carrier plate is transferred to the second carrier plate transfer table 40, and the second process carrier plate is transferred to the chip laser batch welding device 70. The laser batch welding device 70 uses CCD to align the arranged chips on the second process carrier plate and the pads on the first process printed board, and then presses and welds them. After welding is completed, the printed board obtained by welding is moved to the unloading device 100, and the carrier plate is returned to the film pasting and tearing device 80 for recycling. This enables fast and accurate delivery of LED die-bonding materials, improves carrier recycling rate, simplifies material delivery procedures, enables materials to be delivered to designated locations within a specified time, and improves the overall LED chip die-bonding efficiency.

[0068] In one embodiment, Figure 5 As shown, a material conveying method is provided, comprising the following steps:

[0069] Step S510, moving the first process printed circuit board to the printed circuit board transfer table by moving the arm module, and moving the first process printed circuit board in the printed circuit board transfer table to the first positioning point of the laser batch welding device; the first process printed circuit board is obtained by spraying flux on the initial printed circuit board through the feeding spraying device.

[0070] Step S520, moving the first process carrier plate to the first carrier plate transfer table by moving the arm module, and moving the first process carrier plate in the first carrier plate transfer table to the chip arrangement transfer device; the first process carrier plate is obtained by performing film sticking and tearing operations on the initial carrier plate by the film sticking and tearing device.

[0071] Step S530, moving the second process carrier plate to the second carrier plate transfer table by moving the arm module, and moving the second process carrier plate in the second carrier plate transfer table to the second positioning point of the laser batch welding device; the second process carrier plate is obtained by performing chip arrangement operation on the first process carrier plate through the chip arrangement transfer device.

[0072] Step S540, welding the chip on the second process carrier plate to the first process printed board by a laser batch welding device to obtain an initial carrier plate and a second process printed board.

[0073] Step S550, the second process printed board is moved to the unloading device through the moving arm module, and the initial carrier board is returned to the film sticking and tearing device through the moving arm module.

[0074] The surface of the initial printed circuit board is sprayed with flux through the feeding spraying device to obtain the first process printed circuit board. The first process printed circuit board is moved to the printed circuit board transfer table by the moving arm module, and the first process printed circuit board is temporarily stored on the printed circuit board transfer table. The first process printed circuit board placed on the printed circuit board transfer table is moved to the first positioning point of the laser batch welding device by the moving arm module, so that the first process printed circuit board is temporarily stored at the first positioning point of the laser batch welding device for standby use. By setting up the printed circuit board transfer table, the first process printed circuit board is transported in sections, which can effectively balance the working time of the feeding spraying device and the laser batch welding device, facilitate installation, debugging, maintenance, transportation, etc., and enable the printed circuit board to be transported to the designated location within the specified time.

[0075] The film sticking and tearing device can be used to stick and tear the film on the initial carrier plate, so that the film is stuck on the initial carrier plate, thereby obtaining the first process carrier plate. The first process carrier plate is moved to the first carrier plate transfer table by the moving arm module, and the first process carrier plate is temporarily stored on the first carrier plate transfer table. The first process carrier plate placed on the first carrier plate transfer table can be moved to the chip arrangement transfer device by the moving arm module. The chips on the first process carrier plate are arranged by the chip arrangement transfer device, thereby obtaining the second process carrier plate. The second process carrier plate is moved to the second carrier plate transfer table by the moving arm module, and the second process carrier plate is temporarily stored on the second carrier plate transfer table.

[0076] The second process carrier plate placed on the second carrier plate transfer table is moved to the second positioning point of the laser batch welding device by moving the arm module; then the laser batch welding device can weld the chip on the second process carrier plate to the first process printed board. After welding, the initial carrier plate and the second process printed board are obtained. The second process printed board is moved to the unloading device through the moving arm module; the initial carrier plate is returned to the film pasting and tearing device through the moving arm module to realize the recycling of the carrier plate. By setting the first carrier plate transfer table and the second carrier plate transfer table, the printed boards of different processes are transported in sections, which can effectively balance the working time of the film pasting and tearing device, the chip arrangement and transfer device and the laser batch welding device, facilitate installation, commissioning, maintenance, transportation, etc., and enable the carrier plate to be transported to the designated position within the specified time.

[0077] In the above-mentioned embodiment, the LED die-bonding material can be delivered quickly and accurately, which can improve the recycling rate of the carrier, so that the material can be delivered to the specified position within a specified time, thereby improving the overall LED chip die-bonding efficiency.

[0078] In one example, if Figure 6 As shown, the first process carrier plate is obtained by applying a film to an initial carrier plate through a film applying and tearing device, and the steps include:

[0079] Step S610, the initial carrier plate is cleaned by a film sticking and tearing device; the cleaning operation is to clean the surface of the initial carrier plate; the film sticking operation is to stick a transfer film to the initial carrier plate after the cleaning operation.

[0080] Step S620, after the cleaning operation is completed, a film pasting operation is performed on the initial carrier plate after the cleaning operation is completed by a film pasting and tearing device.

[0081] Step S630, after the film sticking operation is completed, the film sticking and tearing device performs a film tearing operation on the initial carrier plate after the film sticking operation is completed to obtain a first process carrier plate; the film tearing operation is to tear off the release film on the initial carrier plate after the film sticking operation is completed; the transfer film includes the release film.

[0082] The transfer film includes a PET carrier film, a first adhesive layer, a PET support film, a second adhesive layer and a release film. Specifically, the PET carrier film is pasted on one surface of the cleaned initial carrier plate, the first adhesive layer is arranged on the PET carrier film, the PET support film is arranged on the first adhesive layer, the second adhesive layer is arranged on the PET support film, and the release film is arranged on the second adhesive layer.

[0083] Specifically, the surface of the initial carrier plate can be cleaned by the film pasting and tearing device, so that the surface of the initial carrier plate is kept clean, and then the initial carrier plate that has completed the cleaning operation can be pasted with a transfer film, and the transfer film is pasted on the surface of the cleaned initial carrier plate, and the release film in the transfer film is away from the initial carrier plate. Then, the release film of the initial carrier plate that has completed the film pasting operation is torn off, so that the second adhesive layer is exposed, so as to facilitate the pasting of the array chip in the following process.

[0084] It should be understood that although Figure 5-6 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 5-6 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0085] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A material conveying system, characterized in that: include: A printed circuit board transfer table, wherein the printed circuit board transfer table is used to place a first process printed circuit board; the first process printed circuit board is obtained by spraying flux on an initial printed circuit board through a feeding spraying device; A first carrier plate transfer table, the first carrier plate transfer table is used to place a first process carrier plate; the first process carrier plate is obtained by applying a film to an initial carrier plate through a film applying and tearing device; A second carrier plate transfer table, the second carrier plate transfer table is used to place a second process carrier plate; the second process carrier plate is obtained by performing a chip arrangement operation on the first process carrier plate through a chip arrangement transfer device; A movable arm module, the movable arm module is used to move the first process printed board to the printed board transfer table, and is also used to move the first process printed board in the printed board transfer table to the first positioning point of the laser batch welding device; the movable arm module is used to move the first process carrier plate to the first carrier plate transfer table, and is also used to move the first process carrier plate in the first carrier plate transfer table to the chip arrangement transfer device, and is also used to move the second process carrier plate to the second carrier plate transfer table, and is also used to move the second process carrier plate in the second carrier plate transfer table to the second positioning point of the laser batch welding device; the laser batch welding device is used to weld the chip on the second process carrier plate to the first process printed board to obtain an initial carrier plate and a second process printed board; Wherein, the second process printed board is moved to the unloading device through the mobile arm module; the initial carrier plate is returned to the film sticking and tearing device through the mobile arm module; The movable arm module includes a first movable arm; the printed circuit board transfer station includes a first printed circuit board transfer station; The first moving arm moves the first process printed board to the first printed board transfer table; the first moving arm is also used to move the first process carrier board to the first carrier board transfer table; The movable arm module further includes a second movable arm and a third movable arm; the printed circuit board transfer station further includes a second printed circuit board transfer station; The second moving arm moves the first process printed board in the first printed board transfer station to the second printed board transfer station; the second moving arm is also used to move the first process carrier board in the first carrier board transfer station to the chip arrangement transfer device; the second moving arm is also used to move the second process carrier board to the second carrier board transfer station; The third movable arm moves the first process printed board in the second printed board transfer table to the first positioning point of the laser batch welding device; the third movable arm also moves the second process carrier board in the second carrier board transfer table to the second positioning point of the laser batch welding device; The laser batch welding device is also used to align and weld the chip on the second process carrier board to the corresponding pad of the first process printed board through the CCD alignment algorithm when the first process printed board on the first positioning point and the second process carrier board on the second positioning point are detected to obtain the initial carrier board and the second process printed board.

2. The material conveying system according to claim 1, characterized in that: The initial carrier plate is sequentially transferred back to the film sticking and tearing device through the third moving arm, the second moving arm and the first moving arm.

3. The material conveying system according to claim 1, characterized in that: The initial carrier plate is carrier glass.

4. The material conveying system according to claim 1, characterized in that: The film sticking and tearing device is used to sequentially perform cleaning operations, film sticking operations and film tearing operations on the initial carrier plate to obtain the first process carrier plate; the cleaning operation is to clean the surface of the initial carrier plate; the film sticking operation is to stick a transfer film on the initial carrier plate that has completed the cleaning operation; The film-tearing operation is to tear off the release film from the initial carrier plate after the film-sticking operation is completed; the transfer film includes the release film.

5. The material conveying system according to claim 4, characterized in that: The transfer film includes a PET carrier film, a first adhesive layer arranged on the PET carrier film, a PET support film arranged on the first adhesive layer, a second adhesive layer arranged on the PET support film, and a release film arranged on the second adhesive layer.

6. A material conveying method, characterized in that: The material conveying method is applied to the material conveying system according to any one of claims 1 to 5, comprising the following steps: The first process printed board is moved to the printed board transfer table by moving the arm module, and the first process printed board in the printed board transfer table is moved to the first positioning point of the laser batch welding device; the first process printed board is obtained by spraying flux on the initial printed board through the feeding spraying device; The first process carrier plate is moved to the first carrier plate transfer table by moving the arm module, and the first process carrier plate in the first carrier plate transfer table is moved to the chip arrangement transfer device; the first process carrier plate is obtained by applying and tearing film to the initial carrier plate by the film applying and tearing device; The second process carrier plate is moved to the second carrier plate transfer table by the mobile arm module, and the second process carrier plate in the second carrier plate transfer table is moved to the second positioning point of the laser batch welding device; the second process carrier plate is obtained by performing chip arrangement operation on the first process carrier plate by the chip arrangement transfer device; The chips on the carrier plate of the second process are welded to the printed board of the first process by the laser batch welding device to obtain an initial carrier plate and a printed board of the second process; The second process printed board is moved to the unloading device through the movable arm module, and the initial carrier board is returned to the film sticking and tearing device through the movable arm module.

7. The material conveying method according to claim 6, characterized in that: The first process carrier plate is obtained by applying a film to an initial carrier plate through a film applying and tearing device, and the steps include: The initial carrier plate is cleaned by the film sticking and tearing device; the cleaning operation is to clean the surface of the initial carrier plate; After the cleaning operation is completed, the film pasting and tearing device performs a film pasting operation on the initial carrier plate after the cleaning operation is completed; the film pasting operation is to paste a transfer film on the initial carrier plate after the cleaning operation is completed; After the film sticking operation is completed, the film sticking and tearing device performs a film tearing operation on the initial carrier plate after the film sticking operation is completed to obtain the first process carrier plate; the film tearing operation is to tear off the release film on the initial carrier plate after the film sticking operation is completed; the transfer film includes the release film.

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