Measuring tool, substrate processing device and substrate manufacturing method

Abstract

The present invention provides a measuring tool, a substrate processing device and a substrate manufacturing method that can easily measure the load of a holding member that holds a substrate. The measuring tool (10) of an embodiment of the present invention comprises: a base (11) having a plurality of contact portions (111) that make contact at positions where a plurality of holding members (32) provided on a workbench (20a) of a substrate processing device (1) that processes a rotating substrate (W) contacts the substrate (W); and a measuring unit (12) comprising a contact member (121) movably supported on the base (11) and in contact and separation with the holding member (32) and a load sensor (122) that measures the load applied to the contact member (121).

Description

Technical Field

[0001] The invention relates to a measuring tool, a substrate processing device and a substrate manufacturing method. Background Art

[0002] In the process of forming semiconductor devices on the surface of substrates such as semiconductor chips, the substrate is held in a dedicated processing chamber and various treatments are performed under special ambient gases or treatment liquids. In such treatments, the treatment liquid itself, substances such as residues generated by the treatment, contact marks generated by holding the substrate, etc., are left on the surface of the substrate, which may reduce the quality of the substrate. In addition, not only the surface of the substrate, but also the treatment liquid, substances, contact marks, etc. left on the back of the substrate will affect the surface of the substrate, so it is not ideal. Therefore, the following operation is performed: the treatment is performed in a state where the outer periphery of the substrate is held by multiple holding members instead of the surface or the back. As such holding members, for example, multiple chuck pins that move in the direction of contact and separation with the outer periphery of the substrate are used.

[0003] As a method to improve the uniformity of the treatment, a common method is to rotate the substrate while performing the treatment. For example, at the end of the cleaning treatment, the cleaning liquid is shaken off and dried by high-speed rotation. Therefore, a rotating mechanism is required that rotates while holding the outer periphery of the substrate with the help of chuck pins. In this case, if the load (gripping force) generated by the multiple chuck pins is uneven, when the centrifugal force generated by the rotation acts on the substrate, the substrate may be misaligned or the chuck may be detached. In addition, if there is a difference in the load of the multiple chuck pins, the centrifugal force of the substrate will increase in proportion to the square of the misalignment distance, so when rotating at high speed, the possibility of increased vibration or chuck detachment increases.

[0004] Therefore, when rotating while holding the outer periphery of the substrate, the load (gripping force) applied to the periphery of the substrate from the plurality of chuck pins must be uniform. Furthermore, in order to hold the substrate so that the center is aligned with the rotation center of the rotating mechanism, the force acting on the substrate at the final gripping position also needs to be uniform. Therefore, a method for accurately measuring the value of the load on the chuck pins is required.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] [Patent Document 1] Japanese Patent No. 4327304 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] The previous method of judging the quality of gripping by multiple chuck pins was to visually check the gap between the outer periphery of the substrate and each chuck pin while the substrate was gripped by multiple chuck pins, and to rotate the substrate in the gripped state to check for unevenness. However, the method of checking by visual inspection or smoothness does not accurately understand the degree of misalignment, nor can it measure the load of each chuck pin, so it is not effective enough for adjusting the mechanism.

[0010] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a measuring tool, a substrate processing apparatus, and a substrate manufacturing method that can easily measure the load (gripping force) of a holding member that holds a substrate.

[0011] [Technical means to solve the problem]

[0012] The measuring tool of the present invention comprises: a base having a contact portion, which contacts a position at which a plurality of holding members provided on a substrate processing device for processing a rotating substrate contacts the substrate; and a measuring unit, comprising a contact member movably supported on the base and in contact and separation with the holding member, and a load sensor for measuring the load (gripping force) applied to the contact member.

[0013] The substrate processing device of the present invention is a substrate processing device for processing a rotating substrate, comprising: a rotating body having a workbench, the workbench being provided with a plurality of holding members for rotating the substrate held on the holding members; a supply unit for supplying a processing liquid to the substrate rotated by the rotating body, thereby processing the substrate; a transport robot for carrying the substrate into and out of the workbench; and a control device for controlling the rotating body, the supply unit and the transport robot, the control device causing the transport robot to carry a measuring tool according to any one of technical solutions 1 to 9 into the workbench, the measuring tool carried in by the transport robot and held on the holding member measures the load from the holding member.

[0014] In the substrate manufacturing method of the present invention, the measuring tool is used to measure the load from the holding member, and the position of the holding member is adjusted according to the measurement result obtained by the measuring tool. While the rotating body having the holding member holding the substrate is rotated, the processing liquid is supplied to the substrate through the supply part, thereby manufacturing the processed substrate.

[0015] [Effects of the Invention]

[0016] The present invention can provide a measuring tool, a substrate processing apparatus, and a substrate manufacturing method that can easily measure the load of a holding member that holds a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an external perspective view showing the structure of a measuring tool according to an embodiment.

[0018] Figure 2 To express Figure 1 A three-dimensional view of a measuring unit of a measuring tool.

[0019] Figure 3 To indicate the use Figure 1 FIG. 1 is a diagram of a structure of a measuring tool of a substrate processing apparatus.

[0020] Figure 4 (A) Figure 4 (B) represents Figure 3 A top view of the operation of the holding portion of the substrate processing apparatus.

[0021] Figure 5 For omitted Figure 2 A perspective view of a portion of an assay unit.

[0022] Figure 6 (A) Figure 6 (B) Figure 6 (C) is an explanatory diagram showing a form of load detection by a load sensor.

[0023] Figure 7 This is an external perspective view showing an embodiment in which the number of measurement units arranged is set to three.

[0024] Figure 8 This is an external perspective view showing an embodiment in which the number of measurement units arranged is set to six.

[0025] Fig. 9 It is a side view showing a modified example of the support portion.

[0026] Fig.10 (A) Fig.10 (B) is an explanatory diagram showing a form of load detection by a load sensor for detecting tension.

[0027] Fig.11 (A) Fig.11 (B) is an explanatory diagram showing another form of load detection by the load sensor for detecting tension.

[0028] Fig.12 To express Fig.11 A stereogram of an example of .

[0029] Fig.13 To express Fig.11 A stereogram of another example of .

[0030] [Explanation of Symbols]

[0031] 1: Substrate processing equipment

[0032] 10: Measurement tools

[0033] 11: Matrix

[0034] 12: Measurement unit

[0035] 13: Support part

[0036] 14: Rotating body

[0037] 15: Extension spring

[0038] 20: Rotating body

[0039] 20a: Workbench

[0040] 20b: Through hole

[0041] 20c: Exhaust port

[0042] 21: Fixed seat

[0043] 22: Motor

[0044] 23: Rotating mechanism

[0045] 30: Maintaining

[0046] 31: Rotating member

[0047] 32: Keep the component

[0048] 32a: Inclined surface

[0049] 32b: Chuck pin

[0050] 33: Driving mechanism

[0051] 40: Supply Department

[0052] 41: Treatment liquid supply mechanism

[0053] 41a: Treatment tank

[0054] 41b: Single delivery pipe

[0055] 41c: Processing liquid supply pipe

[0056] 41d: Flow control valve

[0057] 41e: Flow meter

[0058] 42: Processing liquid holding unit

[0059] 42a: Spout

[0060] 43: Lifting mechanism

[0061] 44: Heating unit

[0062] 60: Control device

[0063] 111: Contact Department

[0064] 112: Gap

[0065] 121: Contact components

[0066] 121a: Edge

[0067] 121b: Bolt

[0068] 121c: Nut

[0069] 122: Load sensor

[0070] 122a: Detection axis

[0071] 122b: Connecting cord

[0072] 123: Sliding member

[0073] 123a: Slot

[0074] 124: Fixed plate

[0075] 124a, 124b: Bolts

[0076] 131: Mounting plate

[0077] 131a: Bolt

[0078] 131b: Nut

[0079] 132: Shaft

[0080] 132a: Loading section

[0081] 133: Elastic member

[0082] 331: Drive shaft

[0083] 332: Small gear

[0084] 333: Big gear

[0085] 441: Heater

[0086] 441a: Through hole

[0087] A: Shaft

[0088] F: tensile force

[0089] P, P1, P2: Load

[0090] W: substrate

[0091] α, β1, β2, γ: arrows DETAILED DESCRIPTION

[0092] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0093] [summary]

[0094] Figure 1 and Figure 2 The measuring tool 10 of the present embodiment shown is used to measure the substrate processing apparatus 1 (see Figure 3 ) of the holding member 32 on the substrate W. The substrate processing device 1 is a device that processes the substrate W while holding the substrate W by the holding member 32 and rotating it. The substrate W that becomes the processing object is, for example, a round silicon semiconductor chip. The processing performed by the substrate processing device 1 is, for example, a wet processing in which a processing liquid is supplied while rotating the substrate W. The wet processing of this embodiment includes an etching processing using a chemical liquid and a cleaning processing using a cleaning liquid.

[0095] The measuring tool 10 includes a base 11 and a measuring unit 12. The base 11 includes a contact portion 111, which contacts a plurality of holding members 32 provided on a workbench 20a of a substrate processing apparatus 1 for processing a rotating substrate W at positions where the holding members 32 contact the substrate W. The workbench 20a is formed on a rotating body 20. The position where the substrate W is contacted is a position where the holding member 32 contacts the substrate W when holding the substrate W, and changes depending on the state of the substrate W such as the position, warpage, and deformation of the substrate W carried in, so it is not necessarily a fixed position and has a certain degree of width.

[0096] The base 11 of this embodiment is a circular plate having the same diameter as the substrate W to be actually processed, and simulates the shape of the substrate W. The contact portion 111 has the outer peripheral edge of the base 11. In addition, two measuring units 12 of this embodiment are arranged at positions facing each other across the center of the base 11. That is, a pair of measuring units 12 are arranged symmetrically with respect to the rotation center of the substrate W.

[0097] The measuring unit 12 includes a contact member 121 and a load sensor 122. The contact member 121 is movably supported on the base 11 and is in contact with and separated from the holding member 32. At the location where the measuring unit 12 is provided, the contact member 121 contacts the holding member 32 instead of the contact portion 111 of the base 11. The load sensor 122 measures the load applied to the contact member 121.

[0098] Furthermore, if Figure 2As shown, the measuring tool 10 is provided with a support portion 13 that supports the base 11 on the substrate processing apparatus 1 to reduce the difference between the weight applied to the holding member 32 due to contact with the substrate W and the weight applied to the holding member 32 due to contact with the contact member 121. In this embodiment, it is set so that the weight of the measuring tool 10 becomes the same as the weight of the substrate W by the support portion 13.

[0099] [Substrate processing equipment]

[0100] Next, the structure of the substrate processing apparatus 1 will be described. In the following description, the direction against gravity is defined as upward, and the direction along gravity is defined as downward, but this does not limit the installation direction of the substrate processing apparatus 1. Figure 3 As shown, the substrate processing apparatus 1 is an apparatus that processes the surface of the substrate W by supplying a processing liquid from a supply unit 40 to one side (hereinafter referred to as the surface) of the substrate W while rotating the substrate W together with the rotating body 20 about the rotation axis A.

[0101] (rotating body)

[0102] The rotating body 20 has a flat table 20a, which is arranged to rotate together with the holding member 32, and the table 20a is spaced apart and faces the substrate W held on the holding member 32. The rotating body 20 is cylindrical in shape with one end blocked by the table 20a. The table 20a is a circular surface with a diameter larger than that of the substrate W. A circular through hole 20b is formed in the center of the table 20a (see Figure 4 ).

[0103] A through hole or outlet 20c for discharging the treatment liquid is formed on the side of the rotating body 20. The rotating body 20 is arranged on a fixed seat 21 so as to be rotatable around a rotation axis A by a rotating mechanism 23 having a motor 22. The fixed seat 21 is fixed to a setting surface (not shown) or a stand arranged on the setting surface.

[0104] (Maintaining part)

[0105] The holding part 30 holds the substrate W in a manner parallel to the workbench 20a and with a gap therebetween. Six holding parts 30 are provided at equal intervals along the periphery of the workbench 20a. Each holding part 30 includes a rotating member 31, a holding member 32, and a driving mechanism 33. Figure 4 (A) Figure 4 As shown in (B), the rotating member 31 is a cylindrical member arranged in multiple numbers at equal intervals around the substrate W. The rotating member 31 is provided to be rotatable around an axis parallel to the rotation axis A of the rotating body 20. The top surface of the rotating member 31 is exposed from the workbench 20a.

[0106] The holding member 32 is provided in a manner protruding upward at a position deviated from the center of rotation of the top surface of each rotating member 31. The holding member 32 is provided in six pieces, the same number as the rotating members 31. The holding member 32 has an inclined surface 32a and a chuck pin 32b. The inclined surface 32a is a surface inclined in a manner rising from the center side of the rotating body 20 toward the outer periphery, and is contacted by the edge of the substrate W as the rotating member 31 rotates.

[0107] The chuck pin 32b is the top of the holding member 32 and is a cylindrical protrusion provided at the upper end of the inclined surface 32a. A hoop groove is provided on the side of the chuck pin 32b for the edge of the substrate W to fit into. The holding member 32 holds the substrate W in the holding position by contacting the edge of the substrate W as the rotating member 31 rotates (see Figure 4 (A)) and the release position of the substrate W by leaving the edge of the substrate W (refer to Figure 4 In the present embodiment, the six chuck pins 32b finally contact the edge of the substrate W, thereby gripping the substrate W.

[0108] The driving mechanism 33 moves the holding member 32 between the holding position and the releasing position by rotating the rotating member 31. The driving mechanism 33 includes a driving shaft 331, a small gear 332, and a large gear 333. The driving shaft 331 is a cylindrical member provided on the side of the rotating member 31 opposite to the top surface in a manner coaxial with the rotating axis of the rotating member 31.

[0109] The pinion gear 332 is a sector gear provided at the end of the drive shaft 331 on the side opposite to the rotating member 31. The large gear 333 is a gear having gear grooves intermittently formed thereon in a manner corresponding to the pinion gear 332. The large gear 333 is provided so as to be coaxially rotatable with the rotating body 20 by the rotating mechanism 23 that rotates the rotating body 20. The large gear 333 is formed with six convex portions at predetermined intervals in the circumferential direction at intervals corresponding to the pinion gear 332, and a gear groove meshing with the pinion gear 332 is formed on the outer peripheral surface of the top end of each convex portion.

[0110] The spring or other urging member (not shown) is used to bias the Figure 4 The large gear 333 is forced in the rotation direction (counterclockwise direction) indicated by the arrow α in (A). As a result, the small gear 332 is forced in the clockwise direction indicated by the arrow β1, so the rotation of the rotating member 31 and the small gear 332 are linked, so that the chuck pin 32b moves toward the center direction of the rotating body 20 and is maintained at the holding position abutting against the substrate W. Furthermore, when the substrate is processed, the rotating member 31, the drive shaft 331, the chuck pin 32b, the small gear 332, the large gear 333 and the rotating body 20 rotate together while maintaining the holding position.

[0111] In addition, the large gear 333 is prevented from rotating by a stop mechanism (not shown). Figure 4 As shown in (B), when the rotating body 20 is rotated in the direction of arrow γ in a state where the rotation of the large gear 333 is blocked, the small gear 332 meshing with the large gear 333 whose rotation is blocked rotates in the counterclockwise direction indicated by arrow β2. As a result, the rotating member 31 rotates, so that the chuck pin 32b moves in a direction away from the edge of the substrate W and reaches the release position.

[0112] (Supply Department)

[0113] like Figure 3 As shown, the supply unit 40 supplies the processing liquid to the surface of the substrate W, that is, the surface of the substrate W held by the holding unit 30 opposite to the stage 20a. The supply unit 40 includes a processing liquid supply mechanism 41, a processing liquid holding unit 42, a lifting mechanism 43, and a heating unit 44.

[0114] The treatment liquid supply mechanism 41 is a mechanism for supplying a plurality of treatment liquids. 2 О), phosphoric acid (H 3 PO 4 ) aqueous solution (hereinafter referred to as phosphoric acid solution) and an aqueous solution containing hydrogen fluoride (HF) (hereinafter referred to as hydrofluoric acid solution) are used as the processing liquid. The processing liquid supply mechanism 41 has a processing liquid tank 41a for storing each processing liquid.

[0115] The individual delivery pipes 41b are connected to the processing liquid supply pipes 41c in parallel from the processing liquid tanks 41a. The top end of the processing liquid supply pipe 41c faces the substrate W held by the holding portion 30. Thus, the processing liquid from each processing liquid tank 41a is supplied to the surface of the substrate W via the individual delivery pipes 41b and the processing liquid supply pipes 41c. Each individual delivery pipe 41b is provided with a flow rate adjustment valve 41d and a flow meter 41e.

[0116] The processing liquid holding part 42 is circular in shape with a diameter larger than that of the substrate W, and has a basin shape by forming a wall rising toward the side opposite to the rotating body 20 at the peripheral portion. The outer bottom surface of the processing liquid holding part 42 faces the substrate W. The top end of the processing liquid supply pipe 41c is inserted into the processing liquid holding part 42, forming a discharge port 42a exposed to the substrate W side.

[0117] The lifting mechanism 43 is a mechanism for moving the processing liquid holding part 42 in a direction of contact with or separation from the substrate W. As the lifting mechanism 43, various mechanisms such as a hydraulic cylinder and a ball screw mechanism that move the processing liquid holding part 42 in a direction parallel to the axis of the rotating body 20 can be used, and the details are omitted.

[0118] The heating unit 44 heats the processing liquid supplied by the supply unit 40. The heating unit 44 includes a heater 441 provided on a surface of the processing liquid holding unit 42 opposite to the surface facing the substrate W. The heater 441 is in the shape of a circular sheet. The heater 441 is formed with a through hole 441a through which the processing liquid supply pipe 41c is inserted.

[0119] The control device 60 controls each part of the substrate processing apparatus 1. The control device 60 has a processor for executing a program, a memory for storing various information such as programs and operation conditions, and a drive circuit for driving each element to realize various functions of the substrate processing apparatus 1. That is, the control device 60 controls the rotating mechanism 23, the processing liquid supply mechanism 41, the lifting mechanism 43, the heating unit 44, etc. In addition, the control device 60 has an input device for inputting information and a display device for displaying information.

[0120] [Measurement tools]

[0121] Apart from Figure 1 and Figure 2 In addition, refer to Figure 5 The structure of the measuring tool 10 is described in detail. Figure 1 , Figure 2 and Figure 5 The figure is assumed to be transparent to the base body 11. Figure 5 The figure is set to omit the illustration of the support portion 13. As described above, the base 11 simulating the shape of the substrate W is preferably formed of the same material as the substrate W. For example, it is set to be silicon, which is the same as the semiconductor chip. As a result, the friction force when the contact portion 111, that is, the outer peripheral edge of the base 11 contacts the holding member 32 and moves is the same as that of the substrate W.

[0122] In addition, the contact portion 111 of the base 11 is in the shape of the outer periphery of the substrate W, and is therefore identical to the outer periphery of the substrate W. For example, the outer periphery of the base 11 is chamfered to have the shape of the outer periphery of the semiconductor chip. That is, the chamfer is performed by grinding the corners. Thus, the area and angle of the surface contacted by the contact portion 111 are identical to those of the substrate W. Such a base 11 can be manufactured by processing an actual substrate W. For example, it can be formed by processing a semiconductor chip made of silicon.

[0123] A notch 112 is formed in the portion of the substrate 11 where the measuring unit 12 is provided. The notch 112 has a pair of linear inner edges parallel to the radial direction of the substrate 11. Figure 5As shown, a sliding member 123 is inserted into the notch 112. The sliding member 123 is a rectangular block, and a pair of linear grooves 123a are formed on its opposite side surfaces. A pair of inner edges of the notch 112 are inserted into the grooves 123a, whereby the sliding member 123 is supported on the base 11 in a manner that allows sliding movement in the radial direction.

[0124] A contact member 121 is fixed to the surface of the sliding member 123 facing the holding member 32. The contact member 121 is a rectangular plate. The edge 121a of the contact member 121 facing the holding member 32 is in a partial circular shape and is located on a curve continuous with the outer periphery of the substrate 11, and the partial circular shape constitutes a part of the circle forming the outer periphery of the substrate 11. That is, the edge 121a of the contact member 121 is at the same height as the edge of the substrate 11. In addition, it is preferred that the contact member 121 is formed of the same material as the substrate 11, and the edge 121a of the contact member 121 is in the same shape as the outer periphery of the substrate 11, that is, the contact portion 111. For example, the contact member 121 is made of silicon and is in the shape of the outer periphery of a semiconductor chip.

[0125] The load sensor 122 is, for example, a uniaxial load sensor that measures the pushing force on the detection shaft 122a. However, the load sensor 122 is not limited to a load sensor. For example, a dynamometer may also be used. The load sensor 122 is supported on the base 11 via a fixing plate 124. That is, the fixing plate 124 is fixed to the base 11 from the front side of the base 11 by bolts 124a in a state of being against the back side of the base 11. The notch 112 of the base 11 has an expansion portion that expands toward the center side of the base 11 in a shape surrounding the load sensor 122. The load sensor 122 is inserted from the back side of the base 11 in a manner protruding upward from the expansion portion of the notch 112, and is fixed to the fixing plate 124 from the back side by bolts 124b. By the above fixation, the detection shaft 122a of the load sensor 122 is at the same height as the contact member 121. The contact member 121 is formed to penetrate the sliding member 123 and is fixed to the detection axis 122 a in the radial direction of the base 11 by means of a bolt 121 b and a nut 121 c .

[0126] With such a structure, the sliding member 123 can move only in the direction of load detection by the detection shaft 122a, and the detection shaft 122a can detect the load in the direction orthogonal to the tangent line of the edge 121a of the contact member 121. Therefore, by placing the base 11 on the workbench 20a of the rotating body 20 in such a manner that the contact position of the holding member 32 with the contact member 121 is on the extension line of the detection shaft 122a, the load in the direction in which the holding member 32 contacts the substrate W, that is, the direction in which the holding member 32 contacts the contact member 121 can be measured.

[0127] The support portion 13 includes a mounting plate 131, a shaft 132, and an elastic member 133. The mounting plate 131 is a rectangular plate, and is fixed to the upper surface of the sliding member 123 by bolts 131a and nuts 131b in a direction parallel to the tangent line of the edge 121a of the contact member 121. The shaft 132 is a pair of rod-shaped members in a direction perpendicular to the surface of the base 11. The pair of shafts 132 are arranged at positions facing each other across the sliding member 123 in a manner that penetrates the base 11. In addition, the upper end of the shaft 132 penetrates the mounting plate 131. The diameter of the through hole of the base 11 and the mounting plate 131 through which the shaft 132 passes is larger than the diameter of the shaft 132, so that the base 11 and the mounting plate 131 can be raised and lowered. In addition, the gap between the through hole and the shaft 132 allows the movement of the sliding member 123 when a load is applied from the contact member 121. The lower end of the shaft 132 has an expanded diameter and serves as a placement portion 132 a placed on the table 20 a .

[0128] The elastic member 133 is a compression spring disposed between the back surface of the base 11 of the shaft 132 and the mounting portion 132a. The elastic member 133 is selected to have such an elastic force that the weight applied from the contact member 121 to the holding member 32 is the same as the substrate W by elastically supporting the base 11. Thus, the friction force when the contact member 121 contacts the inclined surface 32a of the holding member 32 and moves is similar to that of the substrate W.

[0129] like Figure 1 As shown, in the present embodiment, the measuring unit 12 is arranged at two locations of the base 11 in the direction in which the edge 121a of each contact member 121 faces the holding member 32. Furthermore, the load sensor 122 is connected to a display device not shown in the figure via a connecting cord 122b. The display device displays the load of each holding member 32 measured by the load sensor 122 and the change of the load over time through numerical values, graphs, etc. The operator can make adjustments while watching the display screen of the display device. The operator directly holds the measuring tool 10 and the display device, and places the measuring tool 10 on the workbench 20a in the measuring object for measurement. The display device can be placed around the workbench 20a or carried or worn by the operator himself.

[0130] [Measurement]

[0131] In addition to the Figure 1 to Figure 5 In addition, refer to Figure 6 The explanatory diagram of the load measurement operation performed by the measuring tool 10 of the present embodiment as described above is described. For example, the measurement operation is performed when the substrate processing device 1 is started or maintained. Furthermore, a measurement method for measuring the load as described below and a substrate manufacturing method for manufacturing a processed substrate are also one form of the present embodiment.

[0132] First, before measurement, the holding member 32 is in Figure 4 The release position shown in (B) is then Figure 1 As shown, the operator places the mounting portion 132a of the measuring tool 10 on the workbench 20a. At this time, the pair of holding members 32 facing each other across the axis of rotation of the rotating body 20 are adjusted so that the chuck pin 32b in the holding position faces the center of the pair of contact members 121.

[0133] Then, the holding member 32 is moved to the holding position, so that the holding member 32 contacts the contact portion 111 of the base 11 and grips the base 11. The inclined surface 32a of the holding member 32 moves while contacting the contact portion 111 of the base 11, and stops when the chuck pin 32b is in contact with the contact member 121. Similarly, the inclined surface 32a of the holding member 32 corresponding to the measurement unit 12 moves while contacting the edge 121a of the contact member 121, and stops when the chuck pin 32b is in contact with the contact member 121.

[0134] Thus, the load sensor 122 detects the load applied to the contact member 121 from the time when the holding member 32 contacts the contact member 121 until the load stops when it hits the chuck pin 32b, and displays the detected value on the display device. Figure 6 When a gripping force is applied with a constant load P as shown in (A) of FIG. 1 , that is, when each chuck pin 32 b grips the measuring tool 10 in a state where the gripping force of each chuck pin 32 b is correctly adjusted, the chuck pin 32 b is positioned as shown in FIG. Figure 6 The certain load P is determined in the same way as (B).

[0135] However, if the gripping force of each chuck pin 32b is not adjusted, Figure 6 As shown in (C), the contact member 121 hits the inclined surface 32a and temporarily rises to P1, and then hits the chuck pin 32b and further rises to P2. Therefore, if there is a difference between the time when the contact member 121 of one measuring unit 12 hits the inclined surface 32a of the holding member 32 and the time when the contact member 121 of another measuring unit 12 hits the inclined surface 32a of the holding member 32, there will be a difference in the time when P1 is reached. Furthermore, if there is a difference in the time when the contact member 121 hits the chuck pin 32b, there will be a difference in the time when P2 is reached. The difference in the final load of the holding member 32 is measured in the form of the difference in the size of P2.

[0136] The measuring tool 10 that has completed the measurement as described above is taken out to the outside by the operator after the holding of the base body 11 by the holding member 32 is released.

[0137] In the present embodiment, as described above, the load applied to the contact member 121 can be measured when the two diagonal holding members 32 move from the release position to the holding position. That is, the change in load from the start of the movement of the holding member 32 to the holding position until it contacts the edge of the substrate W and stops. The stop state is a state in which each chuck pin 32b stops in a state of contacting the periphery of the substrate W and cannot move any further, and each chuck pin holds the substrate W. The operator observes the detection value displayed on the display device, and adjusts the position of any holding member 32 when one of the pair of holding members 32 has a deviation from the other at the time of reaching P1, when there is a deviation at the time of reaching P2, when the load of P2 is large, etc. More specifically, the position of the chuck pin 32b when the holding member 32 is in the holding position can be adjusted.

[0138] For example, with a load P2 ( Figure 6 (C)) is the same as the load P, that is, P = P2. The load P has a specified allowable range P MIN (minimum value)~P MAX That is, as long as the measured load value (P2) of the chuck pin 32b or the adjusted load value (P2) of the chuck pin 32b is within the prescribed allowable range of the load P, P MIN ≦P2≦P MAX , the adjustment is completed.

[0139] Furthermore, when the substrate W is actually gripped by the chuck pins 32b, the center of the substrate W may not be placed in a manner that is consistent with the rotation center of the worktable 20a, that is, the rotation axis A. Even in this state, the center of the substrate W is aligned with the rotation axis A through the gripping action and the gripping force of all the chuck pins 32b is substantially the same, that is, P MIN ≦P2≦P MAX To achieve adjustment.

[0140] Therefore, when the position where the measuring tool 10 is placed on the workbench 20a deviates from the rotation axis A, when there is a difference between the load P and the load P2, the deviation of the gripping force can be corrected by adjusting the position of the chuck pin 32b with the smaller gripping force measured. When measuring six chuck pins 32b by the measuring tool 10 that measures the chuck pins 32b at two diagonal positions as in the present embodiment, the operator will perform the above-mentioned adjustment three times.

[0141] In the case where the load applied by any holding member 32 to the contact member 121 is too large or too small, the substrate W will be tilted or deformed, so the flow of the processing liquid becomes uneven, thereby damaging the uniformity of the processing. Therefore, correction is made by adjusting the position of such a load difference and the chuck pin 32b to improve the uniformity of the processing. For example, the etching rate can be made uniform. Furthermore, the state in which no load is applied from the holding member 32 is that the holding member 32 is separated from the contact member 121, so the chuck is prevented from being separated by adjusting the position of the holding member 32.

[0142] [Substrate processing]

[0143] Next, the substrate processing performed by the substrate processing apparatus 1 is described. The substrate W mounted on the manipulator of the transfer robot is carried between the processing liquid holding portion 42 and the rotating body 20, and its edge is supported by a plurality of chuck pins 32b as in the base 11, thereby being held on the worktable 20a of the rotating body 20. At this time, after the adjustment as described above, the center of the substrate W is positioned in a manner consistent with the axis of rotation of the rotating body 20.

[0144] Then, the rotating body 20 rotates at a relatively low predetermined speed (for example, about 50 rpm). Thus, the substrate W rotates together with the holding part 30 at the predetermined speed. Furthermore, the etching liquid is supplied to the gap between the processing liquid holding part 42 and the surface of the substrate W from the ejection port 42a of the processing liquid holding part 42. When the hydrofluoric acid solution is supplied to the surface of the rotating substrate W, the etching liquid gradually moves toward the periphery of the substrate W, so that the surface of the substrate W is etched and the oxide film and organic matter are removed. Furthermore, the processing liquid flowing out toward the periphery of the substrate W is discharged to the outside from the gap of the chuck pin 32b.

[0145] Next, the processing liquid holding part 42 stops supplying the etching liquid and supplies pure water from the nozzle 42a to the gap between the processing liquid holding part 42 and the surface of the substrate W. When the pure water is supplied to the surface of the rotating substrate W, the pure water gradually moves toward the outer periphery of the substrate W, thereby washing away the hydrofluoric acid on the surface of the substrate W. Then, the processing liquid holding part 42 stops supplying the pure water.

[0146] The processing liquid holding part 42 descends to bring the heater 441 close to the substrate W, and phosphoric acid is supplied to the gap between the processing liquid holding part 42 and the surface of the substrate W. In this way, the phosphoric acid solution supplied between the processing liquid holding part 42 and the surface of the substrate W is heated by the processing liquid holding part 42 heated by the heater 441 to reach a high temperature.

[0147] When the phosphoric acid solution is continuously supplied from the discharge port 42a of the processing liquid holding portion 42 in this state, the phosphoric acid solution gradually moves on the surface of the substrate W toward the outer periphery of the substrate W, thereby replacing the pure water on the surface of the substrate W with phosphoric acid, thereby removing the nitride film by etching.

[0148] Next, the processing liquid holding unit 42 stops supplying the phosphoric acid solution and supplies pure water from the nozzle 42a to the gap between the processing liquid holding unit 42 and the surface of the substrate W. When the pure water is supplied to the surface of the rotating substrate W, the pure water gradually moves toward the outer periphery of the substrate W, thereby washing away the phosphoric acid on the surface of the substrate W. Then, when a predetermined cleaning time has passed, the processing liquid holding unit 42 stops supplying the pure water.

[0149] Thereafter, the processing liquid holding unit 42 rises, the robot arm of the transport robot is inserted under the substrate W, the holding of the substrate W by the holding unit 30 is released, and the substrate W is carried out by the robot arm of the transport robot.

[0150] [Effect]

[0151] (1) The measuring tool 10 of the present embodiment as described above comprises: a base 11 having a plurality of contact portions 111, wherein the plurality of contact portions 111 make contact at positions where a plurality of holding members 32 provided on a workbench 20a of a substrate processing device 1 for processing a rotating substrate W contact the substrate W; and a measuring unit 12, comprising a contact member 121 movably supported on the base 11 and contacting and separating from the holding member 32, and a load sensor 122 for measuring a load applied to the contact member 121.

[0152] Therefore, the holding member 32 performs an action of holding the base 11 by contacting the contact portion 111 and the contact member 121, thereby the load applied from the holding member 32 to the contact member 121 can be measured by the load sensor 122 in the same state as when the substrate W is held. Thus, the load applied from the holding member 32 to the contact member 121 can be easily detected in a state similar to the load applied to the substrate W when the substrate W is held, thereby improving the accuracy of adjustment of the holding member 32 based on the measurement result.

[0153] That is, the same load as the load applied to the substrate W from the holding member 32 can be measured by reproducing the state in which the holding member 32 grips the substrate W, so that gripping errors (chuck errors) when the substrate W is carried in or the phenomenon that the substrate W is separated from the holding member 32 during high-speed rotation can be suppressed by adjusting according to the measured load. In addition, since there is no need to add sensors to the substrate processing apparatus 1, the cost can be suppressed, and since the measurement can be performed in the same order as the substrate W is carried in and out, the measurement operation is also simplified.

[0154] (2) This embodiment has a support portion 13 that supports the base 11 on the workbench 20a to reduce the difference between the weight applied to the holding member 32 due to contact with the substrate W and the weight applied to the holding member 32 due to contact with the contact portion 111 and the contact member 121. Therefore, the friction force generated when the holding member 32 moves in contact with the contact portion 111 can be made similar to that of the substrate W, so that the sliding of the contact portion is the same as that of the substrate W, and the form of the load change to be measured can be made similar to that of the substrate W.

[0155] (3) The contact portion 111 and the contact member 121 contacting the holding member 32 are shaped like the outer periphery of the substrate W. Therefore, the area and angle of the portion of the contact portion 111 contacting the holding member 32 can be made similar to those of the substrate W, so that the load to be measured can be made similar to those of the substrate W.

[0156] (4) A plurality of measuring units 12 are symmetrically arranged with respect to the rotation center of the substrate W. Therefore, the loads applied to the substrate W by the plurality of holding members 32 that clamp and hold the substrate W can be measured at once, so that the difference or deviation in the loads of the plurality of holding members 32 when misaligned with respect to the rotation center can be confirmed to adjust the positions of the holding members 32, thereby correcting the misalignment.

[0157] (5) A pair of measuring units 12 are arranged at positions facing each other. Therefore, the load change can be measured including the movement until the holding members 32 facing each other approach each other to hold the substrate W and the position of the substrate W is stabilized. For example, when there are more than one pair of holding members 32 at four, six, or eight positions facing each other, the loads of all holding members 32 can be measured by changing the holding members 32 and measuring the loads of the holding members 32 at two positions facing each other multiple times.

[0158] (6) The substrate processing apparatus 1 of this embodiment includes: a plurality of holding members 32 for holding the measuring tool 10 or the substrate W; a rotating body 20 provided with the holding members 32 for rotating the substrate W held by the holding members 32; and a supply unit 40 for supplying a processing liquid to the substrate W rotated by the rotating body 20, thereby manufacturing a processed substrate W. Therefore, there is no need to introduce a special mechanism for measuring the load, and the base 11 can be carried in similarly to the substrate W to simply measure the load.

[0159] [Modifications]

[0160] (1) The present embodiment is not limited to the above-described form. For example, the number of measuring units 12 provided on the substrate 11 is not limited to two. The measuring unit 12 may be one. Even with one measuring unit 12, the load applied to the contact member 121 by each holding member 32 may be measured multiple times by changing the angle of the substrate 11. In this case, the contact portion 111 other than the measuring unit 12 also contacts the holding member 32 in the same manner as the substrate W, so the value of the measured load does not deviate greatly from that of the substrate W.

[0161] In addition, if Figure 7 As shown, the measuring units 12 may be arranged at three locations on the base 11 at equal intervals in the circumferential direction. Thus, even when there are three holding members 32 and the holding members 32 are not in opposing positions, the load applied to the contact member 121 by the holding member 32 that helps to grip the substrate W can be measured. For the six holding members 32, the measurement can be performed twice. In addition, as the operation of the substrate processing device 1, in order to suppress the influence of the heat of the holding member 32 on the processing of the substrate W, the holding by the holding member 32 is sometimes performed in an alternate manner. For example, during the processing, the holding member 32 that holds the substrate W and the holding member 32 that releases the substrate W are arranged in an alternate manner among the six holding members 32 and alternately during the processing, thereby alternating the contact at three locations each time. In the case of the substrate processing device 1 that performs such operation, the load at each of the three locations that are gripped at the same time must be the same. Therefore, at the time of startup or maintenance, the load at each of the three locations can be measured twice using the measuring tool 10 with the measuring units 12 arranged at three locations to adjust the load.

[0162] Furthermore, if Figure 8 As shown, the same number of measuring units 12 as the holding members 32 can be provided, thereby measuring the loads applied to the contact member 121 by all the holding members 32 at one time. Therefore, the change of the load applied to the substrate W by all the holding members 32 due to the position where the substrate W is placed and the difference in the centering operation can be measured at one time, and information such as the sliding difficulty of the substrate W relative to all the holding members 32 can be obtained from the measured load. Therefore, the actual cause of the chuck error of the substrate W can be investigated, identified, and further improved by measuring in a short time.

[0163] (2) In order to approximate the weight of the substrate W, a tension spring that supports the base 11 from the upper side may be used as the elastic body used in the support portion 13. For example, the base 11 may be suspended by a tension spring disposed between the upper end of the shaft 132 and the surface of the base 11 so that the weight approximates the weight of the substrate W. Fig. 9As shown, a support portion 13 that supports the substrate W in a manner that the overall weight is close to the weight of the substrate W may be provided at the center of the base 11 instead of providing the support portion 13 around the measuring unit 12. Furthermore, if the weight is not too large, the measuring tool 10 may be constructed without the support portion 13.

[0164] (3) In the above embodiment, a uniaxial load sensor is used as the load sensor 122, but any other sensor may be used as long as it can convert the load into an electrical signal for measurement. The load sensor 122 may be a sensor that measures the force when the load on the detection axis 122a is in the compressive direction, or a sensor that measures the force when the load on the detection axis 122a is in the tensile direction.

[0165] In the case of a sensor for measuring the force in the tensile direction, a conversion mechanism for converting the direction of the load from the holding member 32 into a direction detectable by the load sensor 122 is provided between the contact member 121 and the load sensor 122. The conversion mechanism is, for example, Fig.10 As shown in (A) of FIG. 1 , the L-shaped rotating body 14 is composed of the rotating body 14, and the rotating body 14 rotates around the fulcrum, thereby converting the load P from the holding member 32 into a tensile force F on the detection shaft 122a of the load sensor 122. Fig.10 As shown in (B), the load P can be detected.

[0166] In addition, a biasing mechanism may be provided for biasing the detection shaft 122a of the load sensor 122 in a direction opposite to the direction of the load from the holding member 32. Fig.11 As shown in (A), one side of the rotating body 14 is always applied to the detection shaft 122a with a certain force against the load P as shown by the dotted arrow in the figure by means of a force applying member such as a tension spring. Fig.11 As shown in (B), a certain tensile force F is applied to the detection shaft 122a. Then, when the load P from the holding member 32 is applied to the contact member 121, the load P is detected in the form of a value of the tensile force F reduced.

[0167] exist Fig.10 In the method, due to the friction force on the fulcrum of the rotating body 14, the initial state position of the rotating body 14, that is, the position where the load P is 0 (the position (F0) of the detection shaft 122a in the initial state) may not always be maintained, and the initial state position of the rotating body 14 may shift. For example, when the rotating body 14 stops while applying force to the detection shaft 122a due to the friction force of the fulcrum, the initial state position shifts, so the change of the load P from the start of contact to the completion of maintenance can no longer be measured. If Fig.11In the case where the load P is not applied, the tensile force F causes the rotating body 14 to return to the initial state, so that the position of the initial state can be prevented from being offset, and the measurement of the change in the load P becomes accurate, which is more ideal. As a more specific structural example, consider the following Fig.12 and Fig.13 As shown in the figure, the rotating body 14 rotated by the tension spring 15 urges the detection shaft 122a in the tension direction.

[0168] (4) As long as there is no significant difference between the actual contact form between the substrate W and the holding member 32, the base 11 and the contact member 121 may be formed of a material other than the substrate W. For example, they may be formed of resin or metal. The portion of one or both of the contact portion 111 and the contact member 121 that contacts the holding member 32 does not necessarily have to be the outer peripheral shape of the substrate W. As for the shape of the base 11, as long as it has a contact portion 111 that can be held by the holding member 32, it does not necessarily have to be the same circular shape as the substrate W. For example, when there are three holding members 32, it may be Y-shaped, when there are four holding members 32, it may be cross-shaped, and when there are six or eight holding members 32, it may be star-shaped or polygonal. Furthermore, it may also be set to a ring shape. By setting it to such a shape, the weight of the base 11 can be reduced and the overall weight of the measuring tool 10 can be made close to the substrate W.

[0169] (5) It is also possible to provide a form having a function of cooperating the rotational movements of the measuring tool 10, the transport robot, and the workbench 20a. For example, an operator causes the manipulator of the transport robot to hold the measuring tool 10, thereby causing the transport robot to hold the measuring tool 10. The manipulator carries the measuring tool 10 to the workbench 20a. That is, the measuring tool 10 is placed on the workbench 20a. Furthermore, the position of the contact member 121 on the measuring tool 10 held on the manipulator and the position of the chuck pin 32b are pre-adjusted to an aligned position. When the position adjustment is performed, the workbench 20a is rotated to fine-tune the position of the chuck pin 32b.

[0170] Then, when the measuring tool 10 is placed on the table 20a by the robot, the substrate processing apparatus 1 rotates the chuck pins 32b to hold the measuring tool 10. During the above operation, the load sensor 122 of the measuring tool 10 measures the load. When the number of load sensors 122 is the same as the number of chuck pins 32b, the measurement is completed at one time.

[0171] When the number of load sensors 122 of the measuring tool 10 is less than the number of chuck pins 32b, after one measurement, the measuring tool 10 is temporarily picked up by the manipulator, and the workbench 20a is rotated to the angle of the chuck pins 32b to be measured. Then, the measuring tool 10 is placed on the workbench 20a again by the manipulator and the measurement is started. The above action is repeated until the measurement of the load of all chuck pins 32b is completed. At this time, the position of the chuck pin 32b is also adjusted to align with the position of the contact member 121 of the measuring tool 10.

[0172] When the control device 60 of the substrate processing apparatus 1 recognizes that the measurement performed by the measuring tool 10 has been completed, the robot performs the picking-up and unloading actions of the measuring tool 10. The recognition of the control device 60 is performed by sending the measurement result and the measurement completion signal from the display device connected to the measuring tool 10 to the control device 60 or to the terminal carried by the operator.

[0173] Furthermore, various methods are conceivable for adjusting the position of the chuck pin 32b and the position of the contact member 121 of the measuring tool 10. For example, an operator may hold a terminal connected to the control device 60 to operate the substrate processing device 1 and perform visual position alignment. In other words, the operator may also perform rotation control of the worktable 20a.

[0174] The same is true when the position of the contact member 121 is aligned with the chuck pin 32b that becomes the next measurement object after the measurement performed by the measuring tool 10, and the workbench 20a can also be rotated by the operator operating the terminal as described above. However, the workbench 20a can also be rotated according to a preset rotation amount. That is, the control device 60 pre-stores the rotation amount for reaching the chuck pin 32b that becomes the next measurement object from the position of the chuck pin 32b measured last time. Therefore, the control device 60 stores the position of the chuck pin 32b measured last time, and rotates the workbench 20a from the said position with the preset rotation amount, thereby aligning the position of the contact member 121 with the next chuck pin 32b.

[0175] (6) The connection between the measuring tool 10 and the display device, and the connection between the control device 60 and the terminal are not limited to wired, but may be wireless. When the measuring tool 10 is carried in and out of the workbench 20a by a transfer robot, the connection between the measuring tool 10 and the display device may be wired as described above, but wireless connection is more ideal because there is no restriction on the operation.

[0176] [Other embodiments]

[0177] The above describes the embodiments of the present invention and the modified examples of each part, but the embodiments and the modified examples of each part are provided as an example and are not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are also included in the invention described in the claims.

Claims

1. A measuring tool, characterized in that: have: A base having a contact portion that contacts a position where a plurality of holding members that are provided on a workbench of a substrate processing device that processes a rotating substrate and that hold the substrate by contacting an edge of the substrate contact the substrate; as well as The measuring unit includes a contact member and a load sensor that is movably supported on the base and contacts and separates from the holding member, the load sensor includes a detection shaft, and the load sensor measures the pushing force or tensile force applied to the detection shaft. A notch is formed on the portion of the base where the measuring unit is provided, and a sliding member is inserted into the notch. The sliding member is supported on the base in a manner that allows sliding movement in the radial direction of the base. The contact member is formed to pass through the sliding member and is fixed to the detection shaft in the radial direction of the base. At the portion where the measuring unit is provided, the contact member contacts the holding member instead of the contact portion of the base. The load sensor is inserted from the back side of the base in a manner of protruding upward from the expanded portion of the notch, and the contact position of the retaining member with respect to the contact member is on the extension line of the detection axis. The detection axis can detect the load in a direction orthogonal to the tangent line of the edge of the contact member.

2. The measuring tool according to claim 1, characterized in that have: A support portion supports the base on the stage to reduce a difference between a weight applied to the holding member due to contact with the substrate and a weight applied to the holding member due to contact with the contact member.

3. The measuring tool according to claim 1 or 2, characterized in that: A portion of at least one of the contact portion and the contact member that contacts the holding member has an outer peripheral shape of the substrate.

4. The measuring tool according to claim 1 or 2, characterized in that: A conversion mechanism for converting the direction of the load from the holding member into a direction detectable by the load sensor is provided between the contact member and the load sensor.

5. The measuring tool according to claim 1 or 2, characterized in that: have: An urging mechanism urges the detection axis of the load sensor in a direction opposite to a direction of the load from the holding member.

6. The measuring tool according to claim 1 or 2, characterized in that: A plurality of the measuring units are arranged symmetrically with respect to a rotation center of the substrate.

7. The measuring tool according to claim 6, characterized in that The measuring units are arranged in pair at positions facing each other.

8. The measuring tool according to claim 6, characterized in that The measuring units are arranged at three locations at equal intervals in the circumferential direction.

9. The measuring tool according to claim 6, characterized in that The number of the measurement units disposed is the same as the number of the holding members.

10. A substrate processing device for processing a rotating substrate, characterized in that: have: A rotating body having a workbench, wherein the workbench is provided with a plurality of holding members, and the plurality of holding members hold the substrate; A rotating mechanism that rotates the substrate by rotating the rotating body; a supplying unit for supplying a processing liquid to the substrate rotated by the rotation of the rotating body, thereby processing the substrate; A transport robot for carrying the substrate into and out of the workbench; as well as a control device for controlling the rotating body, the supply unit, and the transport robot; The control device causes the transport robot to carry the measuring tool according to any one of claims 1 to 9 to the workbench, The measuring tool carried in by the transport robot and held on the holding member measures a load from the holding member.

11. A method for manufacturing a substrate, characterized in that: The load from the holding member is measured using a measuring tool according to any one of claims 1 to 9, adjusting the position of the holding member according to the measurement result obtained by the measuring tool, The processed substrate is manufactured by supplying a processing liquid to the substrate through a supply unit while rotating a rotating body having the holding member holding the substrate.

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