Electronic device, its external module, method of manufacturing the external module, and method of assembling the external module.

Abstract

This invention relates to the field of ruggedized computer technology, disclosing an electronic device, its external module, a method for manufacturing the external module, and an assembly method for configuring the external module. The external module includes a housing and electronic components. One side of the housing has a through-hole. The electronic components are disposed within the housing and have a first connector, which is floatingly disposed within the housing and exposed through the through-hole. The electronic device includes a main housing and the aforementioned external module. The outer surface of the main housing has a receiving groove, within which the external module is embedded. A second connector is disposed within the receiving groove. When the end of the external module away from the first connector engages with one side of the receiving groove, and the first connector mates with the second connector, the housing can float away from the first connector. Because the first connector is floatingly disposed within the housing, the housing is allowed to float away from the first connector, thereby preventing the first connector from being momentarily disconnected from the second connector when the electronic device is impacted.

Description

[0001] This application claims priority to U.S. Provisional Application No. 63 / 163,597 (filed on March 19, 2021, entitled Replaceable Electronic Device). Technical Field

[0002] This invention relates to the field of rugged computer technology, and in particular to an electronic device, its external module, a method for manufacturing the external module, and a method for assembling the external module. Background Technology

[0003] Rugged computers are commonly used in military or harsh operating environments, offering superior dust, water, and shock resistance compared to regular laptops. To prevent data leakage, military-grade rugged computers require hard drives designed as quick-release external modules, which are then assembled into the main unit. However, current military-grade rugged computers, in order to achieve quick-release, only allow the external modules to be snapped together, not locked to the main unit. While the external modules may not detach from a rugged computer when subjected to impacts from a specific direction, even slight misalignment can cause poor contact at the connector between the external module and the main unit, resulting in a momentary signal loss and ultimately, system failure. Summary of the Invention

[0004] Based on the above, the purpose of this invention is to provide an electronic device, its quick-release external module, a method for manufacturing the external module, and a method for assembling the external module, in order to solve the problem in the related art of momentary signal loss due to poor contact between the external module and the host connector caused by external impact.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] The present invention provides an external module including a housing and an electronic component. One side of the housing has a through hole. The electronic component is disposed inside the housing and has a first connector, which is floatingly disposed inside the housing and exposed through the through hole.

[0007] Optionally, a portion of the electronic component is fixed to the housing.

[0008] Optionally, the electronic component is in the shape of a long strip and is perpendicular to the opening direction of the through hole, and the insertion direction of the first connector is perpendicular to the electronic component.

[0009] Optionally, the electronic component is in the shape of a long strip, with one end of the electronic component fixed to the housing, and the first connector located at the other end of the electronic component.

[0010] Optionally, an elastic element is sandwiched between the electronic component and the housing, and the elastic element and the first connector are respectively disposed on opposite sides of the electronic component.

[0011] Optionally, the electronic component includes a solid-state drive (SSD) and an adapter board for connecting the SSD, a first connector disposed on the adapter board and electrically connected to the SSD, at least a portion of the SSD being fixed to the housing, and the adapter board being floatingly disposed within the housing.

[0012] Optionally, the electronic component is in the shape of a long strip, with one end of the electronic component fixed to the housing, and the adapter plate located at the other end of the electronic component.

[0013] The present invention also provides a method for manufacturing an external module, comprising the following steps:

[0014] S11. A housing and electronic components are provided, wherein one side of the housing has a through hole and the electronic components have a first connector;

[0015] S12. The electronic components are housed within the housing, and the first connector is floatingly disposed within the housing and exposed through the through-hole.

[0016] Optionally, the electronic component is in the shape of a long strip and the insertion direction of the first connector is perpendicular to the electronic component; in step S12, the electronic component is configured to be perpendicular to the opening direction of the through hole.

[0017] Optionally, the electronic component is in the shape of a long strip, with the first connector located at one end of the electronic component, and the other end of the electronic component is fixed to the housing in step S12.

[0018] Optionally, the following steps may also be included:

[0019] S13. An elastic element is provided on the side of the electronic component opposite to the first connector, so that the elastic element is clamped between the electronic component and the housing.

[0020] Optionally, in step S12, a portion of the electronic component is fixed to the housing.

[0021] Optionally, the electronic components include a solid-state drive and an adapter board for connecting the solid-state drive. In step S12, at least a portion of the solid-state drive is fixed to the housing, and the adapter board is floatingly disposed within the housing.

[0022] Optionally, the electronic component is in the shape of a long strip, the adapter plate is located at one end of the electronic component, and the other end of the electronic component is fixed to the housing in step S12.

[0023] The present invention also provides an electronic device, including an external module and a main housing. The external module includes a housing and electronic components. The electronic components are disposed inside the housing and have a first connector. The housing has a through hole corresponding to the position of the first connector. The first connector is floatingly disposed inside the housing and exposed through the through hole. The outer surface of the main housing has a receiving groove. The external module is embedded in the receiving groove. A second connector is disposed in the receiving groove. When the end of the external module away from the first connector is engaged with one side of the receiving groove, and the first connector is engaged with the second connector, the housing can float away from the first connector.

[0024] Optionally, an elastic element is sandwiched between the electronic component and the housing, and the elastic element and the first connector are respectively disposed on opposite sides of the electronic component; when the housing deviates from the first connector, the amount of compression on the elastic element decreases.

[0025] The present invention also provides an assembly method for configuring external modules in an electronic device, comprising the following steps:

[0026] S21. An electronic device, electronic components and housing are provided. The main housing of the electronic device is provided with a groove and a second connector is provided in the groove. The electronic components are provided with a first connector and the housing is provided with a through hole corresponding to the position of the first connector.

[0027] S22. The electronic components are placed inside the housing to form an external module, and the first connector is disposed in the through hole;

[0028] S23. First, engage the end of the external module away from the first connector with one side of the receiving groove, and then connect the first connector to the second connector. At this time, the outer shell can float away from the first connector.

[0029] The beneficial effects of this invention are as follows:

[0030] The electronic device of the present invention allows its external module to be installed in a recess at the bottom of the electronic device by means of an upside-down mounting, and can also be removed from the recess at the bottom of the electronic device in the same way. The first connector of the external module of the electronic device is floatingly configured with the housing and is allowed to deviate. This configuration ensures that even if the external module is not locked to the main housing, it will not cause a momentary loss of signal between the first and second connectors when subjected to a strong impact. Attached Figure Description

[0031] Figure 1 This is a three-dimensional exploded view of an electronic device configured with an external module according to an embodiment of the present invention;

[0032] Figure 2 This is a three-dimensional exploded view of the external module provided in an embodiment of the present invention;

[0033] Figure 3This is a schematic diagram of an external module configured in an electronic device according to an embodiment of the present invention;

[0034] Figure 4 yes Figure 3 A sectional view along section line AA;

[0035] Figure 5 yes Figure 4 A magnified view of one side of the image;

[0036] Figure 6 yes Figure 4 A magnified view of the other side of the screen;

[0037] Figure 7 This is a flowchart of the manufacturing method of the external module provided in the embodiment of the present invention;

[0038] Figure 8 This is a flowchart of the assembly method for configuring external modules in an electronic device according to an embodiment of the present invention.

[0039] In the picture:

[0040] 10. Electronic device; 100. Main unit housing; 100a. Second connector; 101. Receptacle; 110. Locking latch; 120. Circuit board; 200. External module; 200a. First connector; 201. Through hole; 210. Housing; 210a. Box; 210b. Cover plate; 211. Locking latch; 220. Electronic component; 221. Solid state drive; 222. Adapter board; 223. Adapter connector; 230. Elastic element. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0045] Example 1

[0046] See Figures 1 to 3 This invention provides an electronic device 10, which includes at least a main housing 100 and an external module 200.

[0047] In this embodiment, the main housing 100 is preferably the bottom or back of the electronic device 10, or a portion of the main housing 100 is the bottom of the electronic device 10. A receiving groove 101 is provided on the outer surface of the main housing 100, and the external module 200 is embedded in the receiving groove 101 for assembly with the electronic device 10. The external module 200 has a first connector 200a, and a second connector 100a is provided in the receiving groove 101 of the main housing 100 for mating with the first connector 200a. In this embodiment, a circuit board 120 is provided inside the main housing 100, and the second connector 100a is disposed on the circuit board 120. The bottom of the receiving groove 101 has an opening or is open, and the second connector 100a is exposed within the receiving groove 101 through the bottom of the receiving groove 101. A locking latch 110 is slidably provided on the main housing 100. The locking latch 110 is disposed on one side of the receiving groove 101, and at least a portion of the locking latch 110 is exposed on the outer surface of the main housing 100 and can be pushed to latch the external module 200.

[0048] See Figure 2The external module 200 includes a housing 210 and an electronic component 220 disposed within the housing 210. The housing 210 is flat, and a through hole 201 is formed on one side of the housing 210 corresponding to the position of the first connector 200a. Specifically, the housing 210 includes a box body 210a and a cover plate 210b. A latch 211 is provided at one end of the box body 210a, and the through hole 201 is formed in the cover plate 210b. The cover plate 210b closes the box body 210a, and the latch 211 and the through hole 201 are located at opposite ends of the housing 210. The first connector 200a is disposed within the electronic component 220, which is located within the housing 210. The first connector 200a is floatingly disposed within the housing 210 and exposed through the through hole 201.

[0049] In this embodiment, the electronic component 220 is elongated and a portion of it is fixed to the outer casing 210. The electronic component 220 is perpendicular to the opening direction of the through hole 201, and the insertion direction of the first connector 200a is perpendicular to the electronic component 220. Specifically, one end of the electronic component 220 is fastened to the outer casing 210 by screws, and the first connector 200a is located at the other end of the electronic component 220. An elastic element 230 can be selectively sandwiched between the electronic component 220 and the outer casing 210, and the elastic element 230 and the first connector 200a are respectively disposed on opposite sides of the electronic component 220. In this embodiment, the elastic element 230 is preferably elastic foam, but the invention is not limited thereto; for example, the elastic element 230 can also be a spring. When the outer casing 210 deviates from the first connector 200a, the compression of the elastic element 230 decreases.

[0050] See Figures 3 to 5 During the process of the user holding the housing 210 to insert the first connector 200a into the second connector 100a, the elastic member 230 can overcome the reaction force caused by the second connector 100a to reduce the offset of the first connector 200a relative to the housing 210 and make it easier to connect.

[0051] See Figure 2 ,and Figures 4 to 6In this embodiment, the electronic component 220 includes a solid-state drive 221 and an adapter plate 222 connecting the solid-state drive 221. One end of the electronic component 220 is fixed to the housing 210 as described above, the adapter plate 222 is located at the other end of the electronic component 220, and the first connector 200a is disposed on the adapter plate 222. The solid-state drive 221 is elongated, and at least a portion of the solid-state drive 221 is fixed to the housing 210. In this embodiment, one end of the solid-state drive 221 is fixed to the housing 210 by the aforementioned screws, and the other end of the solid-state drive 221 is inserted into the adapter plate 222, thereby electrically connecting to the first connector 200a. Moreover, the adapter plate 222 itself is not fixed to the housing 210 but is floatingly disposed within the housing 210. Preferably, an adapter connector 223 is provided on the edge of the adapter plate 222 for docking with the solid-state drive 221, and the insertion direction of the adapter connector 223 is perpendicular to the first connector 200a.

[0052] In this invention, the external module 200 is designed for quick detachment, therefore the outer shell 210 of the external module 200 is not locked to the main housing 100. When the external module 200 is assembled in the receiving groove 101, the end of the external module 200 away from the first connector 200a is engaged with one side of the receiving groove 101 by a latch 211, the first connector 200a mates with the second connector 100a, and the end of the external module 200 containing the first connector 200a is locked by a locking latch 110. Preferably, the locking latch 110 can be maintained in the locked position of the external module 200 by a spring provided in the main housing 100. A portion of the locking latch 110 protrudes into the receiving groove 101. During the process of inserting the external module 200 into the receiving groove 101, the locking latch 110 can be pushed away from the receiving groove 101 simultaneously. After the external module 200 is fully inserted into the receiving groove 101, the locking latch 110 resets to lock the external module 200.

[0053] When the electronic device 10 is impacted, the outer casing 210 of the external module 200, which is not locked to the main housing 100, may slightly deviate from the main housing 100. Since the first connector 200a is floating within the casing 210, the casing 210 is allowed to float slightly away from the first connector 200a. This arrangement prevents the first connector 200a from being momentarily disconnected from the second connector 100a when the electronic device 10 is impacted.

[0054] Example 2

[0055] See Figure 2 and Figure 7 Embodiment 2 of the present invention provides a method for manufacturing an external module as described in Embodiment 1, which includes the following steps:

[0056] S11. A housing 210 and an electronic component 220 are provided. One side of the housing 210 has a through hole 201. The electronic component 220 has a first connector 200a. The electronic component 220 is elongated and plate-shaped. Specifically, the electronic component 220 includes a solid-state drive 221 and an adapter plate 222 for connecting the solid-state drive 221. The adapter plate 222 is located at one end of the electronic component 220, and the first connector 200a is disposed on the adapter plate 222 with the insertion direction of the first connector 200a perpendicular to the electronic component 220.

[0057] S12. The electronic component 220 is disposed within the housing 210, with the electronic component 220 perpendicular to the opening direction of the through hole 201. The other end of the electronic component 220 is fixed to the housing 210. Specifically, at least a portion of the solid-state drive 221 is fixed to the housing 210. Furthermore, the first connector 200a is floatingly disposed within the housing 210 and exposed through the through hole 201. Specifically, the adapter plate 222 is floatingly disposed within the housing 210.

[0058] The manufacturing method of the external module provided in this embodiment may further include step S13: an elastic member 230 is provided on the side of the electronic component 220 opposite to the first connector 200a, so that the elastic member 230 is clamped between the electronic component 220 and the housing 210 to float and position the first connector 200a.

[0059] Example 3

[0060] See Figure 1 and Figure 8 Embodiment 3 of the present invention provides an assembly method for configuring an external module in an electronic device, which includes the following steps:

[0061] S21. An electronic device 10, an electronic component 220, and a housing 210 are provided. The electronic device 10 has a main unit and its main unit housing 100 has a receiving groove 101, in which a second connector 100a is provided. The electronic component 220 has a first connector 200a, and the housing 210 has a through hole 201 corresponding to the first connector 200a.

[0062] S22. The electronic component 220 is placed inside the housing 210 to form an external module 200, and the first connector 200a is disposed in the through hole 201.

[0063] S23. The end of the external module 200 away from the first connector 200a is first engaged with the side of the receiving groove 101 by the latch 211, and then the first connector 200a is connected to the second connector 100a. At this time, the outer shell 210 can float away from the first connector 200a.

[0064] The electronic device 10 of the present invention has an external module 200 that can be installed in the receiving groove 101 at the bottom of the electronic device 10 by means of an upside-down method, and can also be removed from the receiving groove 101 at the bottom of the electronic device 10 in the same way. The first connector 200a of the external module 200 is floatingly configured with the housing 210 and is allowed to deviate. This configuration ensures that even if the external module 200 is not locked to the main housing 100, when it is subjected to a strong impact (e.g., a 4-foot drop test), the first connector 200a and the second connector 100a will not experience a momentary loss of communication.

[0065] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. An external module, characterized in that, include: The outer casing (210) has a through hole (201) on one side. and An electronic component (220) is disposed within the housing (210) and has a first connector (200a) which is floatingly disposed within the housing (210) and exposed through the through-hole (201). The first connector (200a) is used for electrical connection. An elastic element (230) is sandwiched between the electronic component (220) and the housing (210), and the elastic element (230) and the first connector (200a) are respectively disposed on opposite sides of the electronic component (220). When the housing (210) deviates from the first connector (200a), the amount of compression on the elastic element (230) decreases.

2. The external module according to claim 1, characterized in that, A portion of the electronic component (220) is fixed to the housing (210).

3. The external module according to claim 1, characterized in that, The electronic component (220) is in the shape of a long strip and is perpendicular to the opening direction of the through hole (201), and the insertion direction of the first connector (200a) is perpendicular to the electronic component (220).

4. The external module according to claim 1, characterized in that, The electronic component (220) is in the shape of a long strip, one end of the electronic component (220) is fixed to the housing (210), and the first connector (200a) is located at the other end of the electronic component (220).

5. The external module according to claim 1, characterized in that, The electronic component (220) includes a solid-state drive (221) and an adapter plate (222) connected to the solid-state drive (221). The first connector (200a) is disposed on the adapter plate (222) and electrically connected to the solid-state drive (221). At least a portion of the solid-state drive (221) is fixed to the housing (210), and the adapter plate (222) is floatingly disposed within the housing (210).

6. The external module according to claim 5, characterized in that, The electronic component (220) is in the shape of a long strip plate. One end of the electronic component (220) is fixed to the outer shell (210), and the adapter plate (222) is located at the other end of the electronic component (220).

7. A method for manufacturing an external module, characterized in that, Includes the following steps: S11. Provide a housing (210) and an electronic component (220), wherein one side of the housing (210) has a through hole (201) and the electronic component (220) has a first connector (200a). S12. The electronic component (220) is disposed within the housing (210), and the first connector (200a) is floatingly disposed within the housing (210) and exposed through the through hole (201), wherein the first connector (200a) is used for electrical connection. It also includes the following steps: S13. An elastic element (230) is provided on the electronic component (220) on the side opposite to the first connector (200a), such that the elastic element (230) is clamped between the electronic component (220) and the housing (210), and the amount of compression on the elastic element (230) decreases when the housing (210) deviates from the first connector (200a).

8. The method for manufacturing an external module according to claim 7, characterized in that, The electronic component (220) is in the shape of a long strip and the insertion direction of the first connector (200a) is perpendicular to the electronic component (220); in step S12, the electronic component (220) is configured to be perpendicular to the opening direction of the through hole (201).

9. The method for manufacturing an external module according to claim 7, characterized in that, The electronic component (220) is in the shape of a long strip, the first connector (200a) is located at one end of the electronic component (220), and in step S12 the other end of the electronic component (220) is fixed to the housing (210).

10. The method for manufacturing an external module according to claim 7, characterized in that, In step S12, a portion of the electronic component (220) is fixed to the housing (210).

11. The method for manufacturing an external module according to claim 10, characterized in that, The electronic component (220) includes a solid-state drive (221) and an adapter plate (222) connected to the solid-state drive (221). In step S12, at least a portion of the solid-state drive (221) is fixed to the housing (210), and the adapter plate (222) is floatingly disposed within the housing (210).

12. The method for manufacturing an external module according to claim 11, characterized in that, The electronic component (220) is in the shape of a long strip plate, the adapter plate (222) is located at one end of the electronic component (220), and in step S12, the other end of the electronic component (220) is fixed to the outer shell (210).

13. An electronic device, characterized in that, include: An external module (200) includes a housing (210) and an electronic component (220). The electronic component (220) is disposed within the housing (210) and has a first connector (200a). The housing (210) has a through hole (201) corresponding to the position of the first connector (200a). The first connector (200a) is floatingly disposed within the housing (210) and exposed through the through hole (201). The main body housing (100) has a groove (101) on its outer surface. The external module (200) is embedded in the groove (101). The groove (101) has a second connector (100a). When the end of the external module (200) away from the first connector (200a) is engaged with one side of the groove (101), and the first connector (200a) is connected to the second connector (100a), the outer shell (210) can float away from the first connector (200a). The first connector (200a) is used to electrically connect to the second connector (100a). An elastic element (230) is sandwiched between the electronic component (220) and the housing (210), and the elastic element (230) and the first connector (200a) are respectively disposed on opposite sides of the electronic component (220); when the housing (210) deviates from the first connector (200a), the amount of compression on the elastic element (230) decreases.

14. A method for assembling an electronic device with an external module, characterized in that, Includes the following steps: S21. Provide an electronic device (10), an electronic component (220), and a housing (210). The main housing (100) of the electronic device (10) is provided with a receiving groove (101). A second connector (100a) is provided in the receiving groove (101). The electronic component (220) is provided with a first connector (200a). The housing (210) is provided with a through hole (201) corresponding to the position of the first connector (200a). S22. The electronic component (220) is placed inside the housing (210) to form an external module (200), and the first connector (200a) is disposed in the through hole (201). S23. First, engage the end of the external module (200) away from the first connector (200a) with one side of the receiving groove (101), and then connect the first connector (200a) to the second connector (100a). At this time, the outer shell (210) can float away from the first connector (200a). The first connector (200a) is used to electrically connect the second connector (100a). It also includes the following steps: S24. An elastic element (230) is provided on the electronic component (220) on the side opposite to the first connector (200a), such that the elastic element (230) is clamped between the electronic component (220) and the housing (210), and the amount of compression on the elastic element (230) decreases when the housing (210) deviates from the first connector (200a).

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