Processing method for mounting or transferring semiconductor components

Abstract

The present invention discloses a method for placing or transferring semiconductor components, which is used to transfer a semiconductor component attached to the lower surface of a first substrate downward to a target position on the upper surface of a second substrate. During the vertical movement of a pin, the pin first accelerates for a certain distance and then decelerates for a certain distance, reducing its speed to zero upon contact with the top surface of the semiconductor component. This allows the pin to safely contact the semiconductor component and avoids damage to the semiconductor component caused by high-speed impact. This not only avoids damage to the semiconductor component caused by impact, thereby improving the yield of the placement or transfer process, but also enables high-speed movement of the pin, thereby improving the placement or transfer process efficiency and significantly extending the service life of the pin. This method is particularly suitable for the placement or transfer of thin and brittle semiconductor components.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor component mounting and transfer processing, and in particular to a semiconductor component mounting or transfer processing method. Background Art

[0002] In the semiconductor production process, the method of ejector pin impact is often used to transfer semiconductor components from one substrate to another, thereby achieving the transfer of semiconductor components, such as Figure 4 As shown, this method has been widely used in the transfer and placement of conventional semiconductor components.

[0003] With the further development of semiconductor components, their size has become smaller and thinner. When these semiconductor components are struck by an ejector pin, they may be cracked, causing damage to the semiconductor components. This is especially true for brittle semiconductor components such as ceramic chips, which are more susceptible to being cracked by the ejector pin during the impact process, causing damage to the semiconductor components. Summary of the Invention

[0004] The object of the present invention is to provide a processing method for mounting or transferring semiconductor components, so as to minimize damage to the semiconductor components during the mounting process and improve the production yield of the mounting or transfer.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is:

[0006] A method for placing or transferring a semiconductor component is provided, for transferring a semiconductor component attached to the lower surface of a first substrate downward to a target position on the upper surface of a second substrate, wherein the vertical distance between the semiconductor component and the target position is L0, and an ejector pin is driven to move linearly downward in the vertical direction to push the semiconductor component to the upper surface of the second substrate. The vertical movement of the ejector pin sequentially includes:

[0007] In the first stage, the ejector pin is in a stationary state, and the distance between the bottom end of the ejector pin and the top surface of the semiconductor element is S0;

[0008] In the second stage, the ejector moves downward with acceleration, and the stroke of the acceleration movement is S1;

[0009] In the third stage, the ejector moves downward at a reduced speed, so that when the ejector reaches S2 during the reduced speed movement, the speed of the ejector drops to 0, where S2 = S0 - S1.

[0010] In the fourth stage, the ejector pins continue to move downward and push the semiconductor element to move downward L0, so that the semiconductor element is transferred from the first substrate to the target position on the second substrate.

[0011] Preferably, the fourth stage includes:

[0012] The ejector first accelerates downward, and the stroke of the accelerated motion is L1;

[0013] Subsequently, the ejector moves downward at a reduced speed, so that when the ejector reaches a stroke L2 during the reduced speed movement, the speed of the ejector drops to 0, wherein L2 = L0 - L1.

[0014] Preferably, the placement or transfer processing method further includes a reset stroke for driving the ejector pin to move upward in a vertical direction for reset, and in the reset stroke, the total movement stroke of the ejector pin is L0+S0.

[0015] Furthermore, during the upward movement and reset of the ejector pin, the ejector pin first accelerates upward, and the stroke of the accelerated movement is H1; then, the ejector pin decelerates upward, and when the stroke of the decelerated movement is H2, the speed of the ejector pin drops to 0, wherein H1+H2=L0+S0.

[0016] Furthermore, the mounting or transfer processing method further includes a translation step in which, after the ejector pin is moved upward and reset, the first substrate and the second substrate are translated together so that the ejector pin is transferred to directly above another semiconductor element.

[0017] Preferably, the distance between the bottom surface of the semiconductor element and the upper surface of the second substrate is L3, wherein L3≤L0.

[0018] Preferably, the second substrate is fixedly arranged on a workbench, and the first substrate is relatively fixedly arranged above the second substrate.

[0019] Preferably, the ejector pin is driven by a voice coil motor to perform linear reciprocating motion in a vertical direction.

[0020] Preferably, the second stage and the third stage take the same amount of time.

[0021] Due to the application of the above-mentioned technical solution, the present invention has the following advantages over the prior art: Using the present invention's placement or transfer processing method, the ejector pin can safely contact the semiconductor component, avoiding damage to the semiconductor component caused by high-speed impact of the ejector pin. This not only avoids damage to the semiconductor component caused by impact, thereby improving the yield of the placement or transfer process, but also enables high-speed movement of the ejector pin, thereby improving placement efficiency and significantly extending the service life of the ejector pin. This method is particularly suitable for the placement or transfer of thin and fragile semiconductor components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Attachment Figure 1A schematic diagram of the travel of an ejector pin in the semiconductor element mounting or transfer processing method of the present invention;

[0023] Attachment Figure 2 A schematic diagram of the process of mounting or transferring a semiconductor element according to the present invention, wherein the ejector pin contacts the upper surface of the first substrate;

[0024] Attachment Figure 3 Schematic diagram of the corresponding relationship between the ejector movement speed and time in the semiconductor component mounting or transfer processing method of the present invention;

[0025] Attachment Figure 4 A schematic diagram of the corresponding relationship between the ejector movement speed and time in a conventional placement or transfer processing method;

[0026] Among them: 1. first substrate; 2. second substrate; 3. semiconductor component; 4. ejector pin; 5. motor. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] See also Figures 1 to 3 As shown, the processing method for mounting or transferring a semiconductor element of the present invention is used to transfer a semiconductor element 3 attached to the lower surface of a first substrate 1 downward to a target position on the upper surface of a second substrate 2, wherein the second substrate 2 is fixedly arranged on a workbench, and the first substrate 1 is relatively fixedly arranged above the second substrate 2. The ejector pin 4 located above the first substrate 1 reciprocates in the vertical direction under the drive of the motor 5, and the needle tip at the bottom end of the ejector pin 4 penetrates downward into the first substrate 1 and pushes the semiconductor element 3 downward and presses it to the target position of the second substrate 2, thereby transferring the semiconductor element 3 from the first substrate 1 to the second substrate 2.

[0029] Initially, the bottom end of the ejector pin 4 is located directly above the semiconductor element 3, and the distance between the bottom end of the ejector pin 4 and the fixed end surface of the semiconductor element 3 is S0; the vertical distance between the semiconductor element 3 and the target position on the second substrate 2 is L0, and the vertical distance between the bottom end surface of the semiconductor element 3 and the upper surface of the second substrate 2 is L3. In order to achieve good adhesion of the semiconductor element 3 on the second substrate 2, the above L3 ≤ L0.

[0030] The motor 5 drives the ejector pin 4 to move downward to transfer the semiconductor element 3 from the first substrate 1 to the second substrate 2. The downward vertical movement of the ejector pin 4 includes the following stages:

[0031] In the first stage, the ejector pin 4 is in a stationary state, and the distance between the bottom end of the ejector pin 4 and the top surface of the semiconductor element 3 is S0;

[0032] In the second stage, the ejector pin 4 accelerates downward, and the stroke of the accelerated motion is S1;

[0033] In the third stage, the ejector pin 4 decelerates downward, and when the downward deceleration stroke of the ejector pin 4 is S2, the speed of the ejector pin 4 drops to 0, where S2 = S0 - S1. At this time, the bottom end of the ejector pin 4 contacts the top surface of the semiconductor element 3.

[0034] In the fourth stage, the ejector pins 4 continue to move downward and push the semiconductor element 3 downward by a distance L0 , so that the semiconductor element 3 is transferred from the first substrate 1 to a target position on the second substrate 2 .

[0035] In the fourth stage, the ejector pin 4 first accelerates downward, with the acceleration travel being L1. Subsequently, the ejector pin 4 decelerates downward, so that when the deceleration travel reaches L2, the speed of the ejector pin 4 drops to 0, where L2 = L0 - L1. At this point, the semiconductor element 3 is pressed downward onto the target position on the upper surface of the second substrate 2.

[0036] See also Figure 3 As shown, in the time period T1, the ejector pin 4 moves downward in the vertical direction from the highest position until it abuts against the top surface of the semiconductor element 3. During the above process, the speed of the ejector pin 4 is 0 when it contacts the semiconductor element 3, and no impact force acts on the semiconductor element 3. This avoids the problem of the ejector pin 4 hitting the semiconductor element 3 during the downward high-speed movement and causing damage to the semiconductor element 3. It also avoids damage to the ejector pin 4 itself, thereby extending the service life of the ejector pin 4.

[0037] During time period T2, ejector pin 4 pushes semiconductor component 3 downward, causing it to move vertically downward until it contacts the upper surface of second substrate 2 and is transferred to the target position on the upper surface of second substrate 2. Semiconductor component 3 is also accelerated and then decelerated. When semiconductor component 3 contacts the target position on second substrate 2, the speed of ejector pin 4 is also zero. This also prevents ejector pin 4 from impacting semiconductor component 3 and preventing damage to semiconductor component 3.

[0038] The above method can not only realize the high-speed movement of the ejector pin 4 and improve the production efficiency, but also enable the ejector pin 4 to safely contact the semiconductor element 3, thereby preventing the ejector pin 4 from pushing the semiconductor element 3 downward at high speed to realize the placement or transfer process. The impact and damage caused by the ejector pin 4 on the semiconductor element 3 are avoided, thereby greatly improving the yield rate of the placement or transfer process.

[0039] The mounting or transfer processing method further includes a reset stroke for driving the ejector pin 4 to move upward in the vertical direction to reset, so as to perform the next mounting or transfer processing after the reset. The reset stroke corresponds to Figure 3The time period indicated in the figure is the stroke of T3. During this reset stroke, the total movement stroke of ejector pin 4 is L0+S0. Specifically, during the upward reset process of ejector pin 4, ejector pin 4 first accelerates upward, and the acceleration stroke is H1. Subsequently, ejector pin 4 decelerates upward, and when the deceleration stroke is H2, the speed of the ejector pin drops to 0, wherein H1+H2=L0+S0.

[0040] After completing the upward movement and resetting, the ejector pin 4 is translated horizontally to be directly above another semiconductor element 3, or the first substrate 1 and the second substrate 2 are translated horizontally together, so that the ejector pin 4 is transferred directly above another semiconductor element 3 to prepare for the next placement or transfer process.

[0041] In the above process, the motor 5 is a conventional voice coil motor, which drives the ejector pin 4 to realize linear reciprocating motion. The voice coil motor is controlled by a driver and a controller, thereby realizing control of the movement speed of the ejector pin 4.

[0042] In some embodiments, during the downward movement of the ejector pin 4 in the vertical direction, the second stage and the third stage take the same time, that is, the time taken to accelerate from 0 to the maximum speed is the same as the time taken to decelerate from the maximum speed to 0, which facilitates the control of the motor 5.

[0043] In summary, the mounting or transfer processing method of the present invention can not only realize the high-speed movement of the ejector pin 4 and improve the efficiency of the mounting or transfer processing, but also avoid the problem of damage to the semiconductor component 3 due to impact, thereby improving the yield of the mounting or transfer processing, and is particularly suitable for the mounting or transfer processing of thin semiconductor components 3 and brittle semiconductor components 3.

[0044] At the same time, ejector pin 4 is not subject to impact, significantly extending its service life. Comparative testing has shown that when using conventional methods for placement or transfer, using tungsten steel pins as ejectors, the pins can become damaged, resulting in inaccurate or even incomplete placement after placing or transferring over 1,000 semiconductor components. However, using the present method for placement or transfer, the pins have remained intact after over 100,000 attempts.

[0045] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for mounting or transferring a semiconductor element, for transferring a semiconductor element attached to a lower surface of a first substrate downward to a target position on an upper surface of a second substrate, wherein: The distance between the semiconductor element and the target position in the vertical direction is L0. The feature is that the ejector pin is driven to move linearly downward in the vertical direction to push the semiconductor element onto the upper surface of the second substrate. The movement of the ejector pin in the vertical direction sequentially includes: In the first stage, the ejector pin is in a stationary state, and the distance between the bottom end of the ejector pin and the top surface of the semiconductor element is S0; In the second stage, the ejector moves downward with acceleration, and the stroke of the acceleration movement is S1; In the third stage, the ejector moves downward at a reduced speed, so that when the ejector reaches S2 during the reduced speed movement, the speed of the ejector drops to 0, where S2 = S0 - S1. In the fourth stage, the ejector pin continues to move downward and pushes the semiconductor element to move downward L0, so that the semiconductor element is transferred from the first substrate to the target position on the second substrate. The fourth stage includes: The ejector first accelerates downward, and the stroke of the accelerated motion is L1; Subsequently, the ejector moves downward at a reduced speed, so that when the ejector reaches a stroke L2 during the reduced speed movement, the speed of the ejector drops to 0, wherein L2=L0-L1.

2. The method for mounting or transferring a semiconductor element according to claim 1, wherein: The placement or transfer processing method further includes a reset stroke for driving the ejector pin to move upward in a vertical direction for reset. In the reset stroke, the total movement stroke of the ejector pin is L0+S0.

3. The method for mounting or transferring a semiconductor element according to claim 2, wherein: During the upward movement and reset of the ejector pin, the ejector pin first accelerates upward, and the stroke of the accelerated movement is H1; then, the ejector pin decelerates upward, and when the stroke of the decelerated movement is H2, the speed of the ejector pin drops to 0, wherein H1+H2=L0+S0.

4. The method for mounting or transferring a semiconductor element according to claim 2, wherein: The mounting or transfer processing method further includes a translation step in which, after the ejector pin is reset by upward movement, the first substrate and the second substrate are translated together so that the ejector pin is transferred to directly above another semiconductor element.

5. The method for mounting or transferring a semiconductor element according to claim 1, wherein: The distance between the bottom surface of the semiconductor element and the upper surface of the second substrate is L3, where L3≤L0.

6. The method for mounting or transferring a semiconductor element according to claim 1, wherein: The second substrate is fixedly arranged on a workbench, and the first substrate is relatively fixedly arranged above the second substrate.

7. The method for mounting or transferring a semiconductor element according to claim 1, wherein: The ejector pin is driven by a voice coil motor to perform linear reciprocating motion along the vertical direction.

8. The method for mounting or transferring a semiconductor element according to claim 1, wherein: The second stage and the third stage take the same amount of time.

Images