Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method. The substrate processing device (1) includes a processing liquid tank (30), a first circulation piping (31), a filter (39), a pump (37) and a control unit (3A). The upstream end (31a) of the first circulation piping (31) is connected to the processing liquid tank (30), and the downstream end (31b) is connected to the processing liquid tank (30) to circulate the processing liquid. The filter (39) is arranged on the first circulation piping (31) to capture particles contained in the processing liquid. The pump (37) is arranged on the first circulation piping (31). The pump (37) has a rotating body (371) and delivers the processing liquid by rotating the rotating body (371). When the pump (37) is driven in a stopped state, the control unit (3A) controls the pump (37) so that the rotating body (371) rotates at a rotational acceleration of less than 400 rpm / second.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] The liquid treatment device described in Patent Document 1 includes a tank, a circulation line, a pump, a filter, a back pressure valve, and a control unit. The tank stores a treatment liquid. The circulation line returns the treatment liquid transported from the tank to the tank. The pump forms a circulation flow of the treatment liquid in the circulation line. The filter is provided on the downstream side of the pump in the circulation line. The back pressure valve is provided on the downstream side of the filter in the circulation line. The control unit controls the pump and the back pressure valve. Furthermore, when the circulation of the treatment liquid in the circulation line is started, the control unit controls the discharge pressure of the pump so that the discharge pressure of the pump rises at a first pressure, and after a predetermined time, the discharge pressure of the pump is increased to a second pressure greater than the first pressure.

[0003] By controlling the pump discharge pressure to the first pressure and initiating circulation of the treatment liquid, the differential pressure between the upstream and downstream sides of the filter can be suppressed to a relatively small differential pressure. As a result, immediately after the start of circulation of the treatment liquid, foreign matter (particles) that is caused by the pump discharge pressure can be suppressed from passing through the filter.

[0004] However, there is no disclosure regarding the type of pump in the liquid treatment apparatus described in Patent Document 1. Examples of pump types include a pump that delivers treatment liquid through a bellows and a pump that delivers treatment liquid by rotating a rotor (eg, an impeller).

[0005] The inventors of the present application focused on a pump that delivers a processing liquid by rotating a rotating body and conducted extensive research, resulting in new findings regarding particles in the processing liquid supplied to a substrate.

[0006] That is, when the pump is started from a stopped state, the rotor rotates at a large rotational acceleration (eg, 3000 rpm / sec), thereby generating a pressure difference inside the pump. As a result, depending on the situation, bubbles may be generated in the treatment liquid sent by the rotor.

[0007] Specifically, according to Bernoulli's theorem, as the velocity of a fluid increases, its pressure decreases. In other words, the greater the acceleration of the fluid, the greater the pressure drop. Therefore, the saturated vapor pressure of the treatment fluid is more likely to be reached. Consequently, if a pump is started from a stopped state and the rotor rotates at a high acceleration, bubbles may easily form in the treatment fluid delivered by the rotor.

[0008] Furthermore, bubbles generated in the treatment fluid could potentially capture particles accumulated on the secondary side of the filter, particles that have accumulated on the secondary side of the filter and diffused into the flow path, and / or particles that remain in the flow path. In this case, the treatment fluid containing particles could be supplied to the substrate. Even in this extremely unlikely scenario, considering the recent trend toward miniaturization of substrate patterns, it is desirable to implement countermeasures.

[0009] Patent Document 1: Japanese Patent Application Publication No. 2019-41039 Summary of the Invention

[0010] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can effectively suppress a processing liquid containing particles from being supplied to a substrate.

[0011] According to one aspect of the present invention, a substrate processing device processes a substrate using a processing liquid. The substrate processing device includes a processing liquid storage unit, a first circulation piping, a filter, a pump, and a control unit. The processing liquid storage unit stores the processing liquid. The upstream end of the first circulation piping is connected to the processing liquid storage unit, and the downstream end is connected to the processing liquid storage unit, so that the processing liquid circulates. The filter is arranged on the first circulation piping to capture particles contained in the processing liquid. The pump is arranged on the first circulation piping. The control unit controls the pump. The pump has a rotating body, and the processing liquid is delivered by rotating the rotating body. When the pump is driven in a stopped state, the control unit controls the pump so that the rotating body rotates at a rotational acceleration of less than 400 rpm / second.

[0012] In one embodiment of the present invention, when the pump is in a stopped state, the control unit preferably controls the pump so that the rotating body rotates at a constant rotational acceleration of 400 rpm / s or less. When the rotational speed of the rotating body reaches a target rotational speed, the control unit preferably controls the pump so that the rotating body maintains the target rotational speed.

[0013] In one aspect of the present invention, preferably, when driving the pump in a stopped state, the control unit controls the pump so that the rotating body rotates at a rotational acceleration of 50 rpm / second or less.

[0014] In one embodiment of the present invention, the substrate processing apparatus preferably further includes a first drain pipe and a first drain valve. The first drain pipe is preferably connected to the first circulation pipe to discharge the processing liquid from the first circulation pipe. The first drain valve is preferably disposed in the first drain pipe to open and close the flow path of the first drain pipe. When the pump is stopped, the control unit preferably controls the first drain valve to open the flow path of the first drain pipe.

[0015] In one embodiment of the present invention, the substrate processing apparatus preferably further includes a second drain pipe and a second drain valve. The second drain pipe preferably extends from the filter to discharge the processing liquid from the filter. The second drain valve preferably is disposed on the second drain pipe to open and close the flow path of the second drain pipe. When the pump is stopped, the control unit preferably controls the second drain valve to open the flow path of the second drain pipe.

[0016] In one embodiment of the present invention, the substrate processing apparatus preferably further includes a first circulation valve, a second circulation pipe, and a second circulation valve. The first circulation valve is preferably disposed in the first circulation pipe to open and close the flow path of the first circulation pipe. The second circulation pipe preferably extends from the first circulation pipe to the processing liquid storage unit. The second circulation valve is preferably disposed in the second circulation pipe to open and close the flow path of the second circulation pipe. When the pump is driven in a stopped state, the control unit preferably controls the first circulation valve so that the first circulation valve closes the flow path of the first circulation pipe, and controls the second circulation valve so that the second circulation valve opens the flow path of the second circulation pipe.

[0017] According to another aspect of the present invention, a substrate processing method includes processing a substrate using a processing liquid. The method includes: a first rotation step of rotating a rotating body of a pump disposed upstream of a filter in a first circulation pipe for driving the processing liquid at a rotational acceleration of 400 rpm / s or less, while the pump is in a stopped state; and a processing liquid supply step of supplying the processing liquid delivered by the rotating body to the substrate after the first rotation step.

[0018] In one embodiment of the present invention, the substrate processing method preferably further includes a second rotation step. In the first rotation step, the rotating body is preferably rotated at a constant rotational acceleration of 400 rpm / s or less while the pump is driven in a stopped state. In the second rotation step, when the rotational speed of the rotating body reaches a target rotational speed, the rotating body is preferably maintained at the target rotational speed. In the processing liquid supply step, the processing liquid is preferably supplied to the substrate while the rotational speed of the rotating body is maintained at the target rotational speed.

[0019] In one aspect of the present invention, in the first rotating step, preferably, when the pump is driven in a stopped state, the rotating body is rotated at a rotational acceleration of 50 rpm / second or less.

[0020] In one aspect of the present invention, it is preferable to further include a circulation pipe draining step of draining the processing liquid from the first circulation pipe through a first drain pipe extending from the first circulation pipe when the pump is driven in a stopped state.

[0021] In one embodiment of the present invention, it is preferable to further include a filter draining step of draining the treatment liquid from the filter through a second drain pipe extending from the filter disposed in the first circulation pipe when the pump is driven in a stopped state.

[0022] In one embodiment of the present invention, the substrate processing method preferably further includes a circulation step of blocking the flow path of the first circulation pipe while the pump is in a stopped state, and supplying the processing liquid to a second circulation pipe connected to the first circulation pipe. Preferably, the second circulation pipe extends from the first circulation pipe to a processing liquid reservoir for storing the processing liquid. Preferably, during the circulation step, the processing liquid circulates in the second circulation pipe.

[0023] According to the substrate processing apparatus and substrate processing method of the present invention, it is possible to effectively prevent a processing liquid containing particles from being supplied to a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a plan view showing the interior of a substrate processing apparatus according to an embodiment of the present invention.

[0025] Figure 2 It is a side view showing the interior of the processing unit according to this embodiment.

[0026] Figure 3 It is a diagram showing the structure of the processing liquid supply device according to this embodiment.

[0027] Figure 4 (a) is a plan view showing the pump of this embodiment, and (b) is a graph showing the rotation speed of the pump of this embodiment.

[0028] Figure 5 It is a diagram showing the flow of the processing liquid in the standby state of the processing liquid supply device according to this embodiment.

[0029] Figure 6 It is a diagram showing the flow of the processing liquid in the circulation stop idle state of the processing liquid supply device according to this embodiment.

[0030] Figure 7 It is a diagram showing the flow of the processing liquid in the draining state of the processing liquid supply device according to this embodiment.

[0031] Figure 8 1 is a flowchart showing a substrate processing method according to this embodiment.

[0032] Figure 9 This is a flowchart showing the flow of substrate processing in this embodiment.

[0033] Figure 10 It is a diagram showing a ready state of a processing liquid supply device according to a modified example of the present embodiment.

[0034] Figure 11 It is a diagram showing an internal circulation state of a processing liquid supply device according to a modified example of the present embodiment.

[0035] Figure 12 This is a flowchart showing the flow of substrate processing according to a modified example of the present embodiment.

[0036] Figure 13 This is a graph showing the rotation speed of the pump in Examples 1 to 3 of the present invention and a comparative example.

[0037] Figure 14 This is a graph showing the relationship between the rotational acceleration and the number of particles in the pumps of Examples 1 to 3 of the present invention and a comparative example.

[0038] Figure 15 This is another graph showing the relationship between the rotational acceleration and the number of particles in the pumps of Examples 1 to 3 of the present invention.

[0039] Description of Reference Numerals

[0040] 1 substrate processing device,

[0041] 3A Control Department,

[0042] 30 Treatment liquid tank (treatment liquid storage part),

[0043] 31 First circulation piping,

[0044] 37 pumps,

[0045] 39 filters,

[0046] 40 First circulation valve,

[0047] 66 Second drain pipe,

[0048] 67 Second drain valve,

[0049] 70 Second circulation valve,

[0050] 85 First drain piping,

[0051] 86 First drain valve. DETAILED DESCRIPTION

[0052] Embodiments of the present invention are described below with reference to the accompanying drawings. In the drawings, identical or equivalent parts are denoted by the same reference numerals and descriptions thereof are omitted. Furthermore, in the drawings, a three-dimensional orthogonal coordinate system (X, Y, Z) is appropriately depicted for ease of description. Furthermore, in the drawings, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0053] First, refer to Figure 1 The substrate processing apparatus 1 will be described. Figure 1 It is a plan view showing the interior of the substrate processing apparatus 1 . Figure 1 The substrate processing apparatus 1 shown processes a substrate W using a processing liquid.

[0054] The substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, a field emission display (FED) substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, or a solar cell substrate.

[0055] The treatment liquid is, for example, a chemical solution. Examples of the chemical solution include dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide solution, organic acids (e.g., citric acid, oxalic acid), organic bases (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide solution (SPM), ammonia hydrogen peroxide solution (SC1), hydrochloric acid hydrogen peroxide solution (SC2), isopropyl alcohol (IPA), surfactants, or preservatives.

[0056] The treatment liquid may be, for example, a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (eg, about 10 ppm to 100 ppm).

[0057] In the following, IPA is used as an example as the processing liquid.

[0058] like Figure 1 As shown, the substrate processing apparatus 1 includes a plurality of load ports LP, an indexing robot IR, a central robot CR, a plurality of processing units 2 , a control device 3 , a plurality of fluid tanks 4 , and a processing liquid tank 5 .

[0059] The load port LP accommodates multiple substrates W in stacked stacks. The indexing robot IR transports substrates W between the load port LP and the central robot CR. The central robot CR transports substrates W between the indexing robot IR and the processing unit 2. The processing unit 2 supplies processing fluid to each substrate W to process the substrates W. The fluid tank 4 houses each fluid device. The processing fluid tank 5 stores the processing fluid.

[0060] Specifically, the plurality of processing units 2 form a plurality of towers TW (in a plan view) arranged so as to surround the central robot CR. Figure 1 In the example, there are 4 towers TW). Each tower TW includes a plurality of processing units 2 stacked up and down (in Figure 1 In the example, there are three processing units 2. The multiple fluid boxes 4 correspond to the multiple towers TW. The processing liquid in the processing liquid tank 5 is supplied to all the processing units 2 included in the tower TW corresponding to the fluid box 4 through any one of the fluid boxes 4.

[0061] The control device 3 controls the load port LP, the indexing robot IR, the central robot CR, the processing unit 2, the fluid tank 4, and the processing liquid tank 5. The control device 3 is, for example, a computer.

[0062] Control device 3 includes a control unit 3A and a storage unit 3B. Control unit 3A includes a processor such as a CPU (Central Processing Unit). Storage unit 3B includes a storage device that stores data and computer programs. Specifically, storage unit 3B includes a main storage device such as a semiconductor memory, and auxiliary storage devices such as a semiconductor memory, a solid-state drive, and / or a hard disk drive. Storage unit 3B may also include removable media. Storage unit 3B is an example of a non-transitory computer-readable storage medium.

[0063] The control unit 3A controls the load port LP, the indexing robot IR, the central robot CR, the processing unit 2 , the fluid tank 4 , and the processing liquid tank 5 by executing a computer program stored in the storage unit 3B.

[0064] Next, refer to Figure 2 The processing unit 2 will be described. Figure 2 It is a side view showing the interior of the processing unit 2 .

[0065] like Figure 2 As shown, the processing unit 2 includes a chamber 6, a spin chuck 10, a rotary motor 13, a plurality of baffles 14, a nozzle 16, a nozzle 21, and a nozzle moving unit 26. The substrate processing apparatus 1 further includes a processing liquid supply device CS, a pipe 17, and a valve 18. The processing liquid supply device CS includes a pipe 22 and a valve 23. Alternatively, the pipe 17 and valve 18 may be included in the processing liquid supply device CS.

[0066] The chamber 6 has a substantially box-like shape and houses the spin chuck 10, the rotary motor 13, the plurality of baffles 14, the nozzle 16, the nozzle 21, the nozzle moving unit 26, a portion of the piping 17, and a portion of the piping 22. Valves 18 and 23 may also be housed in the chamber 6.

[0067] The rotary chuck 10 holds the substrate W. Specifically, the rotary motor 13 rotates the rotary chuck 10 around the rotation axis AX1. Therefore, the rotary chuck 10 rotates the substrate W around the rotation axis AX1 while holding the substrate W horizontally. Specifically, the rotary chuck 10 includes a plurality of chuck components 11 and a rotary base 12. The rotary base 12 is roughly disk-shaped and supports the plurality of chuck components 11 in a horizontal posture. The plurality of chuck components 11 hold the substrate W in a horizontal posture. In addition, the rotary chuck 10 can be, for example, a vacuum chuck or a Bernoulli chuck that utilizes the Bernoulli effect, without particular limitation.

[0068] The nozzle 21 discharges the processing liquid onto the substrate W. The nozzle moving unit 26 raises and lowers the nozzle 21 or rotates the nozzle 21 horizontally about the rotation axis AX2. To raise and lower the nozzle 21, the nozzle moving unit 26 includes, for example, a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism. Furthermore, to horizontally rotate the nozzle 21, the nozzle moving unit 26 includes, for example, an electric motor.

[0069] The treatment liquid supply device CS supplies the treatment liquid to the nozzle 21. Specifically, a pipe 22 of the treatment liquid supply device CS supplies the treatment liquid to the nozzle 21. Therefore, the treatment liquid flows through the pipe 22. A valve 23 is disposed on the pipe 22. Furthermore, the valve 23 opens and closes the flow path of the pipe 22, switching the supply of the treatment liquid to the nozzle 21 on and off.

[0070] The nozzle 16 supplies the rinse liquid to the substrate W. As a result, the processing liquid is rinsed off from the substrate W.

[0071] The pipe 17 supplies the rinse liquid to the nozzle 16. Therefore, the rinse liquid flows in the pipe 17. The valve 18 is arranged on the pipe 17. The valve 18 opens and closes the flow path of the pipe 17, switching the supply and stop of the rinse liquid to the nozzle 16.

[0072] Each baffle 14 has a substantially cylindrical shape and receives the processing liquid or the rinse liquid discharged from the substrate W.

[0073] Next, refer to Figure 3 , the details of the processing liquid supply device CS are described. Figure 3 1 is a diagram showing a processing liquid supply device CS. Figure 3, the fluid tank 4 is indicated by a dashed line, and the treatment liquid tank 5 is indicated by a dashed double line. Components arranged in the area surrounded by the dashed double line are arranged in the fluid tank 4, and components arranged in the area surrounded by the dashed double line are arranged in the treatment liquid tank 5.

[0074] like Figure 3 As shown, the control unit 3A controls the processing liquid supply device CS by executing a computer program stored in the storage unit 3B. The processing liquid supply device CS includes a processing liquid tank 30 that stores processing liquid to be supplied to the substrate W, and a circulation pipe that circulates the processing liquid in the processing liquid tank 30. The processing liquid tank 30 is an example of the "processing liquid storage unit" of the present invention.

[0075] The circulation piping includes a first circulation piping 31 and a second circulation piping 32. The upstream end 31a of the first circulation piping 31 is connected to the treatment liquid tank 30, and the downstream end 31b of the first circulation piping 31 is also connected to the treatment liquid tank 30. The second circulation piping 32 extends from the first circulation piping 31 to the treatment liquid tank 30. Specifically, the second circulation piping 32 is a return piping that branches off from the first circulation piping 31 and returns the treatment liquid in the first circulation piping 31 to the treatment liquid tank 30. The first circulation piping 31 includes an upstream portion 33 located upstream of a connection point P2 to which the second circulation piping 32 is connected, and a downstream portion 34 located downstream of the connection point P2.

[0076] exist Figure 3 In the example of FIG, the first circulation flow path C1 for circulating the processing liquid in the processing liquid tank 30 is formed by the processing liquid tank 30 and the first circulation pipe 31. Figure 3 In the example of FIG, the second circulation flow path C2 for circulating the processing liquid in the processing liquid tank 30 is formed by the processing liquid tank 30, the upstream side portion 33 and the second circulation pipe 32.

[0077] Sometimes, circulation of the treatment liquid in the first circulation channel C1 (first circulation pipe 31) is referred to as "external circulation," and circulation of the treatment liquid in the second circulation channel C2 (second circulation pipe 32) is referred to as "internal circulation." Therefore, the first circulation channel C1 is an external circulation path, and the second circulation channel C2 is an internal circulation path. Furthermore, the first circulation pipe 31 is an external circulation pipe, and the second circulation pipe 32 is an internal circulation pipe.

[0078] In addition, Figure 3 In the example shown, the first circulation channel C1 extends to the fluid tank 4. In other words, the first circulation channel C1 supplies the processing liquid to multiple processing units 2. Furthermore, the piping 22 provided in a one-to-one correspondence with each processing unit 2 branches and connects to the first circulation piping 31. As a result, the processing liquid flowing through the first circulation channel C1 is supplied to the processing units 2 via the piping 22.

[0079] In addition, Figure 3 In the example, the first circulation piping 31 includes a common piping 35 extending downstream from the treatment liquid tank 30 and a plurality of individual piping 36 branching from the common piping 35. The upstream end of the common piping 35 is connected to the treatment liquid tank 30. The downstream end of each individual piping 36 is connected to the treatment liquid tank 30. The upstream end of the common piping 35 is equivalent to the upstream end 31a of the first circulation piping 31. The downstream end of each individual piping 36 is equivalent to the downstream end 31b of the first circulation piping 31. The upstream side portion 33 is included in the common piping 35. The connection position P2 is set in the common piping 35. The downstream side portion 34 includes a portion of the common piping 35 and a plurality of individual piping 36.

[0080] The individual pipes 36 respectively correspond to the towers TW. Figure 3 The entirety of one individual pipe 36 and parts of the remaining three individual pipes 36 are shown. Figure 3 3 processing units 2 included in the same tower TW are shown. The three pipes 22 corresponding to the three processing units 2 included in the same tower TW are connected to the same single pipe 36. In other words, the pipe 22 branches from the first circulation pipe 31 and is connected to the connection position P1 set downstream of the connection position P2.

[0081] Each individual pipe 36 is provided with a first circulation valve 40 for opening and closing the individual pipe 36. When the first circulation valve 40 is closed, the process liquid flowing through the common pipe 35 is not directed to the individual pipes 36. In other words, the process liquid flowing through the upstream portion 33 is not directed to the downstream portion 34. Furthermore, by opening the first circulation valve 40, the process liquid flowing through the common pipe 35 is directed to the individual pipes 36. In other words, the process liquid flowing through the upstream portion 33 is directed to the downstream portion 34.

[0082] like Figure 3 As shown, the processing liquid supply device CS of the substrate processing apparatus 1 includes a pump 37 that delivers the processing liquid in the processing liquid tank 30 to the first circulation pipe 31; a heater 38 that heats the processing liquid in the processing liquid tank 30 and adjusts its temperature; and a filter 39 that captures particles contained in the processing liquid flowing in the first circulation pipe 31. The pump 37, heater 38, and filter 39 are arranged in the upstream portion 33 in this order from the processing liquid tank 30 side. That is, the pump 37, heater 38, and filter 39 are arranged in this order from upstream to downstream in the first circulation pipe 31.

[0083] When the pump 37 is driven, it continuously delivers the treatment liquid in the treatment liquid tank 30 to the first circulation pipe 31 at a constant pressure. The pump 37 is arranged upstream of the filter 39 in the first circulation pipe 31 where the treatment liquid circulates. Figure 4Described later.

[0084] The heater 38 heats the processing liquid flowing in the upstream portion 33. The heater 38 is a heater that generates Joule heat.

[0085] The filter 39 captures particles contained in the treatment liquid that has passed through the filter 39. In other words, the filter 39 removes particles contained in the treatment liquid that has passed through the filter 39. In further other words, the filter 39 filters the treatment liquid.

[0086] For example, filter 39 has a large number of pores (not shown). The treatment liquid passes through the pores of filter 39. Consequently, the treatment liquid is filtered by filter 39. Specifically, particles contained in the treatment liquid are adsorbed by the walls that define the pores of filter 39 as they pass through them, and are captured within the pores. Consequently, the particles are removed from the treatment liquid.

[0087] The particle capture capacity of filter 39 changes with the pressure applied to filter 39. When pressure is applied to filter 39, smaller particles can be captured compared to when no pressure is applied to filter 39. Furthermore, as the pressure applied to filter 39 increases, even smaller particles can be captured.

[0088] like Figure 3 As shown, the processing liquid supply device CS of the substrate processing device 1 is further provided with an exhaust pipe 64 for discharging bubbles (air) on the primary side of the filter 39 and a second drain pipe 66 for discharging liquid in the filter 39. The exhaust pipe 64 is used to remove bubbles in the filter 39 that cause the generation of particles. Specifically, the exhaust pipe 64 and one end (upstream end) of the second drain pipe 66 are connected to the primary side of the filter 39. The other end of the exhaust pipe 64 is connected to the processing liquid tank 30. An exhaust valve 65 for opening and closing the exhaust pipe 64 is provided on the exhaust pipe 64. The other end of the second drain pipe 66 is connected to the drain tank 80. The second drain pipe 66 extends from the filter 39 and discharges the processing liquid from the filter 39. A second drain valve 67 is provided on the second drain pipe 66. The second drain valve 67 opens and closes the flow path of the second drain pipe 66.

[0089] like Figure 3 As shown, the processing liquid supply device CS of the substrate processing apparatus 1 includes a second circulation valve 70 disposed in the second circulation piping 32 and a pressure regulating unit for regulating the pressure of the processing liquid flowing in the upstream portion 33. The pressure regulating unit is an opening regulating unit for regulating the opening of the second circulation piping 32. The opening regulating unit is disposed in the second circulation piping 32. Figure 3 In the example of FIG, the opening adjustment unit is a regulator 71. The regulator 71 is, for example, an electropneumatic regulator.

[0090] The pressure regulating unit further includes a pressure sensor 72 for detecting the pressure of the process liquid in the upstream portion 33. The pressure sensor 72 detects the pressure of the process liquid in the upstream portion 33 at a predetermined detection position P11 on the upstream portion 33. Detecting the pressure of the process liquid in the upstream portion 33 by the pressure sensor 72 at the detection position P11 is substantially equivalent to detecting the pressure of the process liquid flowing through the filter 39. Figure 3 As shown, the detection position P11 may be upstream of the filter 39 or downstream of the filter 39 .

[0091] like Figure 3 As shown, the processing liquid supply device CS of the substrate processing apparatus 1 further includes a drain tank 80 for storing the processing liquid discharged from the processing liquid tank 30. A discharge pipe 81 extending toward the drain tank 80 is connected to the processing liquid tank 30. A discharge valve 82 is disposed midway along the discharge pipe 81 to open and close the discharge pipe 81. When the processing liquid stored in the processing liquid tank 30 is not being used for further processing of the substrate W, the discharge valve 82 is opened. As a result, the processing liquid stored in the processing liquid tank 30 is guided from the processing liquid tank 30 to the drain tank 80 and stored therein.

[0092] The drain pipe 83 is connected to the drain tank 80. The treatment liquid stored in the drain tank 80 is transferred to an external drain treatment facility by opening a valve (not shown) disposed on the drain pipe 83, and is subjected to drain treatment in the drain treatment facility.

[0093] One end of a first drain pipe 85 is branched and connected near the downstream side of each individual pipe 36 (i.e., near the downstream end of the first circulation pipe 31). That is, the first drain pipe 85 is connected to the first circulation pipe 31. The other end of the first drain pipe 85 is connected to the drain tank 80. Furthermore, the first drain pipe 85 discharges the treated liquid from the first circulation pipe 31. A first drain valve 86 for opening and closing the flow path of the first drain pipe 85 is arranged midway in the first drain pipe 85. In addition, a return valve 89 for opening and closing the individual pipe 36 is arranged downstream of the connection position P3 of the first drain pipe 85 in each individual pipe 36.

[0094] The first drain valve 86 and the return valve 89 constitute a first switching unit that switches the destination of the treatment liquid located upstream of the connection position P3 in the downstream portion 34 between the downstream portion 34 downstream of the connection position P3 and the first drain pipe 85. A three-way valve may be used as the first switching unit in place of the first drain valve 86 and the return valve 89.

[0095] By opening the return valve 89 while the first drain valve 86 is closed, the process liquid flowing upstream of the connection point P3 of the first drain pipe 85 in the separate pipe 36 is guided to the process liquid tank 30 via the downstream side of the connection point P3. On the other hand, by opening the first drain valve 86 while the return valve 89 is closed, the process liquid flowing upstream of the connection point P3 of the first drain pipe 85 in the separate pipe 36 is guided to the drain tank 80 via the first drain pipe 85.

[0096] like Figure 3 As shown, the processing liquid supply device CS of the substrate processing apparatus 1 further includes a processing liquid replenishing pipe 87 for replenishing the processing liquid tank 30 with new processing liquid and a processing liquid replenishing valve 88 for opening and closing the processing liquid replenishing pipe 87 .

[0097] The substrate processing apparatus 1 enters the idle state after power is turned on. Thereafter, the substrate processing apparatus 1 enters the ready state by performing a ready operation. In the ready state of the substrate processing apparatus 1, the substrate processing operation performed by the substrate processing apparatus 1 can be realized.

[0098] The operational states of the substrate processing apparatus 1 include a ready state (executable state, i.e., working state), in which processing can be executed in the processing unit 2, and an idle state (standby state), in which processing cannot be executed in the processing unit 2 (not ready). The ready state of the substrate processing apparatus 1 means that the processing liquid supply system CS is able to supply processing liquid to the processing unit 2. The idle state of the substrate processing apparatus 1 means that the processing liquid supply system CS is unable to supply processing liquid to the processing unit 2 (not ready).

[0099] The substrate processing apparatus 1 has two idle states: a circulation stop idle state (circulation stop standby state) in which circulation of the processing liquid is stopped in both the first circulation flow path C1 and the second circulation flow path C2, and a circulation idle state (circulation standby state) in which circulation of the processing liquid is stopped in the first circulation flow path C1 while circulation of the processing liquid in the second circulation flow path C2 is continued. In other words, the substrate processing apparatus 1 has two idle states. In this embodiment, the following focuses only on the ready state and the circulation stop idle state.

[0100] Next, refer to Figure 4 (a) in FIG. 3 illustrates the pump 37 . Figure 4 (a) is a plan view showing the pump 37 .

[0101] like Figure 4As shown in (a) in FIG. 3 , the control unit 3A controls the pump 37. The pump 37 has a rotating body 371 and a housing 372. The housing 372 accommodates the rotating body 371. The housing 372 has a suction port 373 and a discharge port 374. The rotating body 371 sucks the treatment liquid from the suction port 373 by rotating, and discharges the treatment liquid from the discharge port 374. The rotating body 371 is not particularly limited as long as it rotates, and may be, for example, an impeller or a propeller. Figure 4 In the example (a) in FIG, the pump 37 is a centrifugal pump. However, as long as the treatment liquid can be delivered by the rotation of the rotating body, the type of pump 37 is not particularly limited, and it can also be a diagonal flow pump or an axial flow pump. In addition, the rotating body 371 can be rotatably supported by bearings (not shown) or can be suspended in a non-contact state by magnetic force. In the case where the rotating body 371 is suspended in a non-contact state by magnetic force, the pump 37 is a magnetic levitation pump.

[0102] Above, as reference Figure 4 As described in (a) of FIG. 3 , the pump 37 has a rotating body 371, and the processing liquid is delivered by rotating the rotating body 371. Furthermore, in the present embodiment, when the pump 37 is driven in a stopped state, the control unit 3A controls the pump 37 so that the rotating body 371 rotates at a rotational acceleration of 400 rpm / second or less. Therefore, according to the present embodiment, it is possible to suppress the generation of differential pressure inside the pump 37. Therefore, it is possible to suppress the generation of bubbles in the processing liquid delivered by the rotating body 371. As a result, it is possible to suppress particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow path (the first circulation flow path C1 and / or the second circulation flow path C2), and particles retained in the flow path (the first circulation flow path C1 and / or the second circulation flow path C2) from being supplied to the substrate W in a state captured by bubbles in the processing liquid. That is, it is possible to effectively suppress the processing liquid containing particles from being supplied to the substrate W.

[0103] When driving the stopped pump 37, rotating the rotor 371 at a rotational acceleration of 400 rpm / s or less can reduce the number of particles in the treatment liquid, as will be demonstrated in the examples described below. "rpm (rotations per minute)" indicates the rotational speed of the rotor 371 per unit time.

[0104] Preferably, when the pump 37 is driven in a stopped state, the control unit 3A controls the pump 37 so that the rotating body 371 rotates at a rotational acceleration of 50 rpm / second or less. According to this preferred embodiment, compared with the case where the rotational acceleration of the rotating body 371 is 400 rpm / second or less and greater than 50 rpm / second, the differential pressure generated inside the pump 37 can be further suppressed. Therefore, the generation of bubbles in the treatment liquid sent by the rotating body 371 can be further suppressed. Therefore, it is possible to further suppress particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow path (the first circulation flow path C1 and / or the second circulation flow path C2), and particles retained in the flow path (the first circulation flow path C1 and / or the second circulation flow path C2) from being supplied to the substrate W in a state captured by bubbles in the treatment liquid. That is, it is possible to more effectively suppress the treatment liquid containing particles from being supplied to the substrate W. This is also confirmed by the embodiments described later.

[0105] Here, in this specification, rotational acceleration refers to "the rate of change of the rotational speed of rotating body 371 per unit time." Rotational speed refers to "the rotational speed of rotating body 371 per unit time" or "a physical quantity proportional to the rotational speed of rotating body 371 per unit time." An example of a physical quantity proportional to the rotational speed of rotating body 371 per unit time is the rotational angle of rotating body 371 per unit time, i.e., the angular velocity.

[0106] Next, refer to Figure 3 , explain the reasons why particles are produced even though it is force majeure.

[0107] When the pump 37 stops, the circulation of the treatment liquid stops (for example, the circulation stop idle state described later). Therefore, the treatment liquid in the filter 39 does not move, and therefore no pressure is applied to the filter 39. Therefore, when the pump 37 is stopped, the filter 39 has a lower ability to capture particles than when the pump 37 is driven. As a result, when the pump 37 is stopped, the particles captured by the filter 39 may flow out of the filter 39 to the secondary side and accumulate on the secondary side of the filter 39. Furthermore, when the particles accumulate from the filter 39 to the secondary side, if the pump 37 is driven to start the circulation of the treatment liquid, there is a possibility that the particles accumulated on the secondary side of the filter 39 will spread to the entire area of ​​the first circulation flow path C1 (first circulation piping 31) and / or the second circulation flow path C2 (second circulation piping 32).

[0108] Furthermore, when the pump 37 is stopped and the circulation of the treatment liquid is stopped (e.g., the idle state described later), the treatment liquid (e.g., IPA) is not filtered by the filter 39 and remains in the first circulation channel C1 (first circulation pipe 31), the second circulation channel C2 (second circulation pipe 32), and / or the treatment liquid tank 30. As a result, there is a possibility that an increase in particles may be generated due to elution of the treatment liquid (e.g., IPA) from the piping (resin piping) and / or the treatment liquid tank 30. Furthermore, there is a possibility that the particles generated by the elution may remain in the first circulation channel C1 (first circulation pipe 31), the second circulation channel C2 (second circulation pipe 32), and / or the treatment liquid tank 30.

[0109] Therefore, in this embodiment, when the pump 37 is driven from a stopped state, the rotating body 371 of the pump 37 is rotated at a rotational acceleration of 400 rpm / s or less (preferably a constant rotational acceleration), thereby suppressing the generation of bubbles when the pump 37 is driven from a stopped state. As a result, it is possible to suppress particles generated due to the above-mentioned reasons (particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow path, and particles retained in the flow path and the processing liquid tank 30) from being captured by bubbles in the processing liquid and supplied to the substrate W.

[0110] Next, refer to Figure 4 (b) in the figure will describe the control of the pump 37. Figure 4 (b) in FIG. 3 is a graph showing the rotation speed of the pump 37. Figure 4 In (b), the horizontal axis represents time and the vertical axis represents the rotation speed.

[0111] like Figure 4 (a) and Figure 4 As shown by line Q1 in (b) of FIG, when the pump 37 is stopped, the controller 3A controls the pump 37 so that the rotating body 371 rotates at a constant rotational acceleration of 400 rpm / s or less. This further suppresses the pressure differential generated within the pump 37. Consequently, the generation of bubbles in the processing liquid delivered by the rotating body 371 can be further suppressed. Consequently, the supply of processing liquid containing bubbles that have trapped particles to the substrate W can be more effectively suppressed.

[0112] When the rotation speed of the rotating body 371 reaches the target rotation speed TG, the control unit 3A controls the pump 37 so that the rotating body 371 maintains the target rotation speed TG. As a result, the pump 37 can deliver the processing liquid at a constant pressure.

[0113] Specifically, at time t0, the control unit 3A starts rotating the rotor 371 of the pump 37. From time t0 to time t1, the control unit 3A then rotates the rotor 371 at a constant rotational acceleration of 400 rpm / s or less. When the rotational speed reaches the target rotational speed TG at time t1, the control unit 3A maintains the target rotational speed TG for the rotor 371. That is, after time t1, the rotational acceleration of the rotor 371 is zero.

[0114] For example, when the target rotation speed TG is 6000 rpm and the steady rotation acceleration of the rotating body 371 is 400 rpm / second, the target rotation speed TG is reached 15 seconds after the time t0.

[0115] Preferably, if Figure 4 (a) and Figure 4 As shown by line Q2 in (b), when the pump 37 is stopped, the controller 3A controls the pump 37 so that the rotating body 371 rotates at a constant acceleration of 50 rpm / s or less. Therefore, compared to a case where the rotating body 371's acceleration is 400 rpm / s or less and greater than 50 rpm / s, the pressure differential generated within the pump 37 can be further suppressed. Consequently, the generation of bubbles in the processing liquid delivered by the rotating body 371 can be further suppressed. As a result, the supply of processing liquid containing bubbles that have trapped particles to the substrate W can be more effectively suppressed.

[0116] When the rotation speed of the rotating body 371 reaches the target rotation speed TG, the control unit 3A controls the pump 37 so as to maintain the target rotation speed TG of the rotating body 371. As a result, the pump 37 can deliver the processing liquid at a constant pressure.

[0117] Specifically, at time t0, the control unit 3A starts rotating the rotor 371 of the pump 37. From time t0 to time t2, the control unit 3A then rotates the rotor 371 at a constant rotational acceleration of 50 rpm / s or less. When the rotational speed reaches the target rotational speed TG at time t2, the control unit 3A maintains the target rotational speed TG for the rotor 371. That is, after time t2, the rotational acceleration of the rotor 371 is zero.

[0118] For example, when the target rotation speed TG is 6000 rpm and the constant rotation acceleration of the rotating body 371 is 50 rpm / second, the target rotation speed TG is reached 120 seconds from the time t0.

[0119] Next, refer to Figures 5 to 7 , the ready state, circulation stop idle state and drain state of the treatment liquid supply device CS are described. Figures 5 to 7In the symbols representing valves 40, 65, 67, 70, 82, 86, and 89, white indicates a closed valve, and black indicates an open valve. Furthermore, in the symbol representing pump 37, a white triangle indicates that pump 37 is stopped, and a black triangle indicates that pump 37 is driven. Furthermore, the flow path of the treatment liquid is indicated by a bold line.

[0120] First, refer to Figure 5 Describes the ready state. Figure 5 It is a diagram showing the flow of the processing liquid in the ready state of the processing liquid supply device CS.

[0121] like Figure 5 As shown, in the ready state, the pump 37 is in the driving state. The first circulation valve 40 and the second circulation valve 70 are open. The exhaust valve 65 is open, and the second drain valve 67 is closed. The return valve 89 is open, and the first drain valve 86 is closed. In addition, the discharge valve 82 is closed.

[0122] Therefore, the treatment liquid in the treatment liquid tank 30 is transported to the upstream portion 33 of the first circulation pipe 31 by the pump 37, and flows from the upstream portion 33 to the downstream portion 34. The treatment liquid in the upstream portion 33 flows to the downstream portion 34 at the connection position P2, and returns to the treatment liquid tank 30 from the downstream portion 34. During this period, the particles contained in the treatment liquid are captured by the filter 39. In addition, the treatment liquid in the treatment liquid tank 30 is heated by the heater 38 to a temperature specified by the process and is sent to the downstream portion 34. As a result, the treatment liquid in the treatment liquid tank 30 is sent to the downstream portion 34 while being maintained at a certain temperature higher than the temperature of the atmosphere in the processing unit 2 (for example, 20 to 26°C).

[0123] Furthermore, the processing liquid in the upstream portion 33 is guided not only to the downstream portion 34 at the connection position P2 but also to the second circulation pipe 32. The processing liquid guided to the second circulation pipe 32 is returned to the processing liquid tank 30 from the downstream end of the upstream portion 33 (connection position P2).

[0124] That is, in the ready state, the processing liquid circulates in the first circulation flow path C1 (first circulation pipe 31 ), and the processing liquid circulates in the second circulation flow path C2 (second circulation pipe 32 ) (double circulation state).

[0125] Next, refer to Figure 6 The cycle stop idle state is explained. Figure 6 It is a diagram showing the flow of the processing liquid in the circulation-stopped idle state of the processing liquid supply device CS.

[0126] like Figure 6As shown, in the circulation stop idle state of the treatment liquid supply device CS, the pump 37 is in a stopped state. The first circulation valve 40 and the second circulation valve 70 are closed. The other valves are also closed.

[0127] In the circulation stop idle state, the pump 37 is stopped, so the circulation of the treatment liquid in both the first circulation flow path C1 and the second circulation flow path C2 is stopped. In addition, in the circulation stop idle state, the treatment liquid accumulates in the middle of the first circulation flow path C1 and the second circulation flow path C2.

[0128] In this embodiment, as an example, Figure 6 The cycle shown stops in the idle state and transitions to Figure 5 In the ready state shown, the controller 3A controls the pump 37 so that the rotor 371 of the pump 37 rotates at a rotational acceleration of 400 rpm / s or less (preferably a constant rotational acceleration). As a result, the generation of bubbles within the pump 37 can be suppressed, effectively reducing the number of particles contained in the processing liquid supplied to the substrate W.

[0129] Preferably, in this embodiment, the processing liquid supply device CS is in the circulation stop idle state ( Figure 6 ), when the system restart button (not shown) is operated, the system transitions to the ready state via the drain state.

[0130] Figure 7 1 is a diagram showing the flow of the processing liquid in the discharge state of the processing liquid supply device CS. Figure 7 As shown, during the predetermined drain period T after the circulation stop idle state is released, the processing liquid supply device CS is in the drain state.

[0131] Specifically, the controller 3A drives the pump 37 in the stopped state and opens the first circulation valve 40. The controller 3A also opens the first drain valve 86 while keeping the second circulation valve 70, the return valve 89, and the exhaust valve 65 closed.

[0132] Specifically, when the pump 37 is stopped, the controller 3A controls the first drain valve 86 to open the flow path of the first drain pipe 85. Therefore, during the predetermined drain period T, the processing liquid retained in the first circulation flow path C1 and the second circulation flow path C2 is not returned to the processing liquid tank 30 but is instead drained to the drain tank 80 via the first drain pipe 85. Consequently, particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow paths (the first circulation flow path C1 and / or the second circulation flow path C2), and particles retained in the flow paths (the first circulation flow path C1 and / or the second circulation flow path C2) can be discharged to the drain tank 80 along with the processing liquid. Consequently, the amount of particles contained in the processing liquid supplied to the substrate W can be further reduced.

[0133] Furthermore, the controller 3A opens the second drain valve 67. Specifically, while the pump 37 is stopped, the controller 3A controls the second drain valve 67 to open the flow path of the second drain pipe 66. Consequently, during the predetermined drain period T, the processing liquid in the primary-side space within the filter 39 is drained into the drain tank 80 via the second drain pipe 66. Consequently, particles in the processing liquid are also drained from the second drain pipe 66 into the drain tank 80. Consequently, the particles contained in the processing liquid supplied to the substrate W can be further reduced.

[0134] Here, the predetermined drain period T is predetermined, for example, through experiments and / or experience. For example, the predetermined drain period T is set based on the supply capacity of the pump 37, the viscosity of the treatment liquid, the pipe diameter, and the pipe length so that all the retained treatment liquid in the first circulation flow path C1 and the second circulation flow path C2 can be replaced with the new treatment liquid supplied after the pump 37 is restarted.

[0135] When the predetermined drain period T has elapsed since the first drain valve 86 and the second drain valve 67 were opened, the control unit 3A closes the first drain valve 86 and the second drain valve 67 and opens the return valve 89 and the second circulation valve 70. As a result, the state of the treatment liquid supply device CS is transferred to Figure 5 In the ready state, the substrate W is processed in the processing unit 2 .

[0136] Next, refer to Figure 3 and Figure 8 In the substrate processing method, a substrate W is processed using a processing liquid. Figure 8 FIG. 1 is a flow chart showing a substrate processing method according to this embodiment. Figure 8 As shown, the substrate processing method of this embodiment includes steps S1 to S11. The substrate processing method is performed by the substrate processing device 1. When the substrate processing method starts, the processing liquid supply device CS is in the ready state ( Figure 5 That is, when the substrate processing method starts, the pump 37 is driven to circulate the processing liquid in the first circulation flow path C1 and the second circulation flow path C2.

[0137] Then, if Figure 3 and Figure 8 As shown, first, in step S1, the control unit 3A receives an operation signal indicating a lowering operation from an operating device (not shown). The lowering operation is an operation that instructs a transition from the ready state to the cycle stop idle state.

[0138] Next, step S2 and step S3 are performed in parallel.

[0139] That is, in step S2, the control unit 3A stops the pump 37 ( Figure 6 ).

[0140] On the other hand, in step S3, the control unit 3A controls the treatment liquid supply device CS so as to block the flow paths of the external circulation and the internal circulation of the treatment liquid ( Figure 6 Specifically, the control unit 3A closes the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation pipe 31 is blocked, and the external circulation of the treatment liquid is stopped. In addition, the control unit 3A closes the second circulation valve 70 and the exhaust valve 65. As a result, the flow path of the second circulation pipe 32 is blocked, and the internal circulation of the treatment liquid is stopped.

[0141] When the steps S2 and S3 are executed, the state of the processing liquid supply device CS changes from the ready state ( Figure 5 )Transfer to loop stop idle state( Figure 6 ).

[0142] Next, in step S4, the control unit 3A determines whether an operation signal indicating a ready operation has been received from an operating device (not shown). The ready operation is an operation that instructs the system to transition from the cycle stop idle state to the ready state.

[0143] When it is determined in step S4 that the operation signal indicating the ready operation has not been received (No), the process puts step S4 on standby.

[0144] On the other hand, when it is determined in step S4 that the operation signal indicating the ready operation has been received (YES), the process proceeds to step S5 and step S8.

[0145] Next, steps S5 to S7 and steps S8 and S9 are executed in parallel.

[0146] That is, in step S5, the control unit 3A drives the pump 37 ( Figure 7 Specifically, in step S5, the control unit 3A rotates the rotating body 371 of the pump 37 at a rotational acceleration of 400 rpm / second or less when the pump 37 is driven and stopped. In the present embodiment, the control unit 3A rotates the rotating body 371 of the pump 37 at a constant rotational acceleration of 400 rpm / second or less when the pump 37 is driven and stopped. Step S5 is an example of the "first rotation step" of the present invention.

[0147] Next, in step S6 , the control unit 3A determines whether the rotation speed of the rotating body 371 has reached the target rotation speed TG.

[0148] If it is determined in step S6 that the rotation speed of the rotating body 371 has not reached the target rotation speed TG (No), step S6 is repeated until the rotation speed reaches the target rotation speed TG.

[0149] On the other hand, when it is determined in step S6 that the rotation speed of the rotating body 371 has reached the target rotation speed TG (YES), the process proceeds to step S7.

[0150] Next, in step S7, the control unit 3A maintains the target rotation speed TG of the rotating body 371. Step S7 corresponds to an example of the "second rotation step" of the present invention.

[0151] On the other hand, in step S8, when the pump 37 is driven in the stopped state (step S5), the control unit 3A controls the processing liquid supply device CS so that the processing liquid is discharged from the first circulation pipe 31 through the first drain pipe 85 extending from the first circulation pipe 31 for external circulation of the processing liquid ( Figure 7 Specifically, the control unit 3A opens the first circulation valve 40 and the first drain valve 86. As a result, the treatment liquid is discharged from the first circulation pipe 31 through the first drain pipe 85 to the drain tank 80. Step S8 is an example of the "circulation pipe draining step" of the present invention.

[0152] Next, in step S9, while the pump 37 is driven and stopped (step S5), the control unit 3A controls the treatment liquid supply device CS so that the treatment liquid is discharged from the filter 39 through the second drain pipe 66 extending from the filter 39 disposed in the first circulation pipe 31 ( Figure 7 Specifically, the control unit 3A opens the second drain valve 67. As a result, the treated liquid in the primary side space inside the filter 39 is discharged to the drain tank 80 through the second drain pipe 66. Step S9 corresponds to an example of the "filter drain step" of the present invention.

[0153] When the steps S8 and S9 are executed, the state of the processing liquid supply device CS changes from the circulation stop idle state ( Figure 6 )Transfer to the drainage state( Figure 7 The control unit 3A maintains the predetermined liquid discharge period T and the liquid discharge state. Then, when the predetermined liquid discharge period T has elapsed, the control unit 3A advances the process to step S10.

[0154] Next, in step S10, the control unit 3A controls the treatment liquid supply device CS to start external circulation and internal circulation of the treatment liquid ( Figure 5 Specifically, the control unit 3A closes the first drain valve 86 and opens the return valve 89. As a result, the flow path of the first circulation pipe 31 is opened, and the external circulation of the treatment liquid begins. In addition, the control unit 3A closes the second drain valve 67 and opens the second circulation valve 70 and the exhaust valve 65. As a result, the flow path of the second circulation pipe 32 is opened, and the internal circulation of the treatment liquid begins.

[0155] When step S10 is executed, the state of the processing liquid supply device CS changes from the draining state ( Figure 7 )Transfer to the ready state( Figure 5 ) The control unit 3A also maintains the rotation speed of the rotor 371 of the pump 37 at the target rotation speed TG in the ready state (step S7).

[0156] Next, in step S11, the processing unit 2 ( Figure 2 ) The substrate W is processed using the processing liquid. Specifically, after steps S5 to S10, the processing unit 2 supplies the processing liquid delivered by the rotator 371 of the pump 37 to the substrate W. Specifically, in step S11, the processing unit 2 supplies the processing liquid to the substrate W while maintaining the rotation speed of the rotator 371 of the pump 37 at the target rotation speed TG. As a result, the substrate W is processed using the processing liquid. The substrate processing method then ends. Step S11 corresponds to an example of the "processing liquid supplying step" of the present invention.

[0157] Figure 9 Yes Figure 8 Flowchart of step S11. Figure 9 As shown, the substrate processing performed in step S11 includes steps S111 to S115.

[0158] First, in step S111, the central robot CR ( Figure 1 ) The substrate W is carried into the processing unit 2. Then, in the processing unit 2 ( Figure 2 ), the spin chuck 10 holds the substrate W. Then, the rotation motor 13 rotates the spin chuck 10 to rotate the substrate W.

[0159] Next, in step S112, the nozzle 21 of the processing unit 2 supplies the processing liquid toward the rotating substrate W. Specifically, the control unit 3A opens the valve 23. As a result, the processing liquid is supplied from the first circulation pipe 31 through the pipe 22 to the nozzle 21. As a result, the nozzle 21 supplies the processing liquid toward the substrate W. Step S112 is an example of the "processing liquid supplying step" of the present invention.

[0160] When a predetermined processing period has elapsed after the valve 23 is opened, the valve 23 is closed, and the supply of the processing liquid from the nozzle 21 is stopped. The predetermined processing period is determined in advance according to the processing purpose of the substrate W.

[0161] Next, in step S113, the nozzle 16 supplies the rinsing liquid to the rotating substrate W. As a result, the processing liquid on the substrate W is rinsed away by the rinsing liquid.

[0162] Specifically, when the valve 18 is open, the nozzle 16 supplies the rinsing liquid to the substrate W. When a predetermined rinsing period has passed since the valve 18 was opened, the valve 18 is closed, stopping the supply of the rinsing liquid from the nozzle 16. The predetermined rinsing period is predetermined, for example, through experiments and / or experience.

[0163] Next, in step S114 , the processing unit 2 dries the substrate W by rotating the substrate W at high speed.

[0164] Specifically, the rotation motor 13 accelerates the substrate W in the rotational direction, rotating it at a higher rotational speed than the rotational speed of the substrate W in steps S112 and S113. As a result, the liquid is removed from the substrate W, drying the substrate W. After a predetermined drying period has elapsed since the start of the high-speed rotation of the substrate W, the rotation motor 13 stops. Rotation of the substrate W then stops. The predetermined drying period can be predetermined, for example, through experimentation and / or experience.

[0165] Next, in step S115, the central robot CR carries the substrate W out of the processing unit 2. That is, the processed substrate W is carried out of the chamber 6. Then, the process returns to Figure 8 The main program of the substrate processing method ends.

[0166] (Variation)

[0167] Reference Figures 10 to 12 , a substrate processing apparatus 1 according to a modified example of the present embodiment will be described. The hardware structure of the substrate processing apparatus 1 according to the modified example is similar to that of the reference Figures 1 to 3 The hardware structure of the substrate processing device 1 described above is the same. Figure 5 and Figure 7 The main difference between the present embodiment described is that only the external circulation is executed in the ready state, and the internal circulation state exists instead of the drain state.

[0168] Figure 10 1 is a diagram showing the ready state of the processing liquid supply device CS of the modified example. Figure 10 As shown in FIG. 1 , in the ready state, the second circulation valve 70 is closed. Therefore, the treatment liquid does not flow in the second circulation pipe 32. That is, the treatment liquid does not circulate internally. The other states of the treatment liquid supply device CS are the same as those of FIG. Figure 5 Therefore, in the ready state, the treatment liquid flows in the first circulation pipe 31 (first circulation flow path C1). That is, only the external circulation of the treatment liquid is performed.

[0169] In the modified example, if the control unit 3A receives Figure 6 The loop shown stops in the idle state. Figure 10In the case of a transition instruction to the ready state, the processing liquid supply device CS is not immediately transitioned to the ready state, but is controlled so that the processing liquid supply device CS is in the internal circulation state.

[0170] Figure 11 1 is a diagram showing the internal circulation state of the treatment liquid supply device CS of a modified example. Figure 11 As shown, in the internal circulation state, the first circulation valve 40 is closed, while the second circulation valve 70 and the exhaust valve 65 are opened. As a result, the processing liquid flows in the second circulation pipe 32 (second circulation flow path C2). In other words, the processing liquid is internally circulated.

[0171] Specifically, the control unit 3A controls the first circulation valve 40 so that the first circulation valve 40 blocks the flow path of the first circulation piping 31, and controls the second circulation valve 70 so that the second circulation valve 70 opens the flow path of the second circulation piping 32 while driving the pump 37 in the stopped state. As a result, the external circulation of the treatment liquid in the first circulation piping 31 (first circulation flow path C1) is not performed, but the internal circulation of the treatment liquid in the second circulation piping 32 (second circulation flow path C2) is performed. The internal circulation of the treatment liquid is performed until the temperature of the treatment liquid reaches the target temperature. Then, for example, when the temperature of the treatment liquid reaches the target temperature, the state of the treatment liquid supply device CS changes from the internal circulation state ( Figure 11 )Transfer to the ready state( Figure 10 ).

[0172] According to the modified example, the rotation speed of the rotor 371 of the pump 37 can be simultaneously increased to the target rotation speed TG during the internal circulation. Meanwhile, since the temperature of the process liquid reaches the target temperature due to the internal circulation, the temperature of the process liquid stabilizes quickly after the state is shifted to the ready state.

[0173] For example, the internal circulation of the treatment liquid in the internal circulation state is performed only during a predetermined cycle period. The predetermined cycle period is, for example, determined by experiments and / or experience, and is the time until the temperature of the treatment liquid reaches the target temperature. In this case, for example, the predetermined cycle period can also be set to the time until the rotation speed of the rotating body 371 of the pump 37 reaches the target rotation speed TG from zero. In this case, "the time until the rotation speed reaches the target rotation speed TG from zero" means the time until the target rotation speed TG is reached when the rotating body 371 of the pump 37 in the stopped state is rotated at a rotation acceleration of less than 400 rpm (preferably a constant rotation acceleration).

[0174] Furthermore, the control unit 3A monitors the temperature of the treatment liquid detected by the temperature sensor (not shown) and controls the heater 38 so that the temperature of the treatment liquid circulating in the inner chamber becomes the target temperature. Figure 11 Although not shown in the figure, for example, a temperature sensor is arranged in the upstream side portion 33 .

[0175] Next, refer to Figure 3 and Figure 12 , a substrate processing method of a modified example is described. Figure 12 FIG. 1 is a flow chart showing a substrate processing method according to a modified example. Figure 12 As shown, the substrate processing method of the modified example includes steps S21 to S31. The substrate processing method is executed by the substrate processing apparatus 1. When the substrate processing method starts, the processing liquid supply device CS is in the ready state ( Figure 10 That is, when the substrate processing method starts, the pump 37 is driven to circulate the processing liquid in the first circulation flow path C1.

[0176] And, as Figure 3 and Figure 12 As shown, first, in step S21, the control unit 3A receives an operation signal indicating a lowering operation from an operating device (not shown). Figure 8 The same as step S1.

[0177] Next, step S22 and step S23 are performed in parallel.

[0178] That is, in step S22, the control unit 3A stops the pump 37 ( Figure 6 ).

[0179] On the other hand, in step S23, the control unit 3A controls the treatment liquid supply device CS so as to block the flow path of the external circulation of the treatment liquid ( Figure 6 Specifically, the control unit 3A closes the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation pipe 31 is blocked, and the external circulation of the treatment liquid stops ( Figure 11 ). In addition, in the modified example, in the ready state ( Figure 10 ) does not execute the inner loop.

[0180] When the steps S22 and S23 are executed, the state of the processing liquid supply device CS changes from the ready state ( Figure 10 )Transfer to loop stop idle state( Figure 6 ).

[0181] Next, in step S24, the control unit 3A determines whether an operation signal indicating a ready operation has been received from an operating device (not shown). Figure 8 The same as step S4.

[0182] When it is determined in step S24 that the operation signal indicating the ready operation has been received (YES), the process proceeds to step S25 and step S28 .

[0183] Next, steps S25 to S27 and steps S28 and S29 are executed in parallel.

[0184] That is, in step S25, the control unit 3A drives the pump 37 in the stopped state. Specifically, in step S25, the control unit 3A rotates the rotating body 371 of the pump 37 at a rotational acceleration of 400 rpm / second or less (preferably a constant rotational acceleration) when driving the pump 37 in the stopped state. Figure 8 The step S25 is equivalent to an example of the "first rotation step" of the present invention.

[0185] Next, in step S26, the control unit 3A determines whether the rotation speed of the rotating body 371 has reached the target rotation speed TG. Figure 8 The same as step S6.

[0186] Next, in step S27, the control unit 3A maintains the target rotation speed TG of the rotating body 371. Figure 6 The step S27 is equivalent to an example of the "second rotation step" of the present invention.

[0187] On the other hand, in step S28, the control unit 3A controls the processing liquid supply device CS to start internal circulation of the processing liquid ( Figure 11 ). That is, when the control unit 3A drives the pump 37 in the stopped state (step S25), the flow path of the first circulation piping 31 is blocked, and the treatment liquid is supplied to the second circulation piping 32 connected to the first circulation piping 31. Specifically, the control unit 3A maintains the closed state of the first circulation valve 40, and opens the second circulation valve 70 and the exhaust valve 65. As a result, the flow path of the second circulation piping 32 is opened, and the internal circulation of the treatment liquid is started. That is, the treatment liquid flows in the second circulation piping 32 (second circulation flow path C2). Step S28 is equivalent to an example of the "circulation process" of the present invention.

[0188] When step S28 is executed, the state of the processing liquid supply device CS changes from the circulation stop idle state ( Figure 6 )Transfer to the inner loop state( Figure 11 ).

[0189] Next, in step S29, when the predetermined cycle period has elapsed, the control unit 3A controls the treatment liquid supply device CS to stop the internal circulation of the treatment liquid. Specifically, the control unit 3A blocks the second circulation piping 32 (second circulation flow path C2) by closing the second circulation valve 70. As a result, the internal circulation of the treatment liquid is stopped. In this case, the predetermined cycle period is set to, for example, the time it takes for the rotation speed of the rotating body 371 of the pump 37 to reach the target rotation speed TG from zero.

[0190] Next, in step S30, the control unit 3A controls the processing liquid supply device CS to start external circulation of the processing liquid ( Figure 10 Specifically, the control unit 3A opens the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation pipe 31 is opened, and the external circulation of the treatment liquid begins. In other words, the treatment liquid flows in the first circulation pipe 31 (first circulation flow path C1).

[0191] When step S30 is executed, the state of the processing liquid supply device CS changes from the internal circulation state ( Figure 11 )Transfer to the ready state( Figure 10 ) The control unit 3A also maintains the rotation speed of the rotor 371 of the pump 37 at the target rotation speed TG in the ready state (step S27).

[0192] Next, in step S31, the processing unit 2 ( Figure 2 ) uses the processing liquid to process the substrate W. In addition, step S31 and Figure 8 Then, the substrate processing method ends.

[0193] Next, the present invention will be specifically described based on examples, but the present invention is not limited to the following examples.

[0194] [Example]

[0195] Reference Figures 13 to 15 Examples 1 to 3 of the present invention and comparative examples are described. Figures 1 to 3 The substrate processing apparatus 1 of the present embodiment is described. In addition, the hardware structure of the substrate processing apparatus of the comparative example is the same as that of the reference Figures 1 to 3 The hardware configuration of the substrate processing apparatus 1 of the embodiment described is the same. For convenience of description, the components of the substrate processing apparatus of the comparative example are denoted by the same reference numerals as those of the substrate processing apparatus 1 of Examples 1 to 3.

[0196] (1) The rotational acceleration of the rotating body 371 of the pump 37 is as follows.

[0197] Example 1: 400 rpm / sec

[0198] Example 2: 50 rpm / sec

[0199] Example 3: 10 rpm / sec

[0200] Comparative example: 3000 rpm / s

[0201] (2) The target rotation speed TG of Examples 1 to 3 and the comparative example is 6000 rpm.

[0202] (3) Figure 13Graph showing the rotation speed of the pump 37 in Examples 1 to 3 and the comparative example. Figure 13 In the figure, the horizontal axis represents time (seconds) and the vertical axis represents the rotation speed.

[0203] like Figure 13 As shown by the straight line RT1, in Example 1, the control unit 3A controls the pump 37 so that the rotor 371 rotates at a constant rotational acceleration of 400 rpm / second from the state where the pump 37 is stopped. Furthermore, the rotational speed of the rotor 371 reaches the target rotational speed TG 15 seconds after the start-up and is maintained at the target rotational speed TG.

[0204] As shown by the straight line RT2, in Example 2, the control unit 3A controls the pump 37 so that the rotor 371 rotates at a constant rotational acceleration of 50 rpm / second from the time the pump 37 is stopped. Furthermore, the rotational speed of the rotor 371 reaches the target rotational speed TG 120 seconds after the start-up and is maintained at the target rotational speed TG.

[0205] As shown by line RT3, in Example 3, control unit 3A controls pump 37 so that rotor 371 rotates at a constant rotational acceleration of 10 rpm / second from the time pump 37 is stopped. Furthermore, the rotational speed of rotor 371 reaches target rotational speed TG 600 seconds after startup and is maintained at target rotational speed TG. The rotational speed graph in Example 3 only shows the portion up to the time target rotational speed TG is reached, with the remainder omitted.

[0206] As shown by the straight line RT0, in the comparative example, the control unit 3A controls the pump 37 so that the rotor 371 rotates at a constant rotational acceleration of 3000 rpm / second from the state where the pump 37 is stopped. Furthermore, the rotational speed of the rotor 371 reaches the target rotational speed TG 2 seconds after the start-up and is maintained at the target rotational speed TG.

[0207] (4) Regarding the control of the processing liquid supply device CS, the liquid is not discharged ( Figure 7 ) and the cycle stops idle state ( Figure 6 ) immediately transitions to the ready state ( Figure 5). And, starting from the moment when the rotation speed of the rotating body 371 of the pump 37 reaches the target rotation speed TG, the ready state is maintained for more than 30 minutes. In this case, 30 minutes after the rotation speed of the rotating body 371 of the pump 37 reaches 6000 rpm, the processing liquid is supplied from the first circulation piping 31 and the piping 22 to the nozzle 21, and the processing liquid is supplied from the nozzle 21 to the substrate W. The supply time of the processing liquid to the substrate W is 8 seconds. Then, using a particle measuring device (manufactured by KLATencor, Surfscan (registered trademark) SP7), the number of particles in the processing liquid on the upper surface of the substrate W is counted. In this case, the number of particles with a particle size greater than 30 nm, the number of particles with a particle size greater than 19 nm, and the number of particles with a particle size greater than 15 nm are counted. The particle size is the length of the largest part in the particle.

[0208] (5) Figure 14 Graph showing the relationship between the rotational acceleration and the number of particles of the pump 37 in Examples 1 to 3 and the comparative example. Figure 14 In the graph, the horizontal axis represents rotational acceleration (rpm / s), and the vertical axis represents the number of particles having a diameter greater than 30 nm. Furthermore, bar A0 represents the number of particles in the comparative example, bar A1 represents the number of particles in Example 1, bar A2 represents the number of particles in Example 2, and bar A3 represents the number of particles in Example 3.

[0209] like Figure 14 As shown, the number of particles in the comparative example (rod A0) is 63. In contrast, the number of particles in Example 1 (rod A1) is 33, the number of particles in Example 2 (rod A2) is 25, and the number of particles in Example 3 (rod A3) is 23.

[0210] As can be seen from Examples 1 to 3, by setting the rotational acceleration of the pump 37 to 400 rpm / s or less when starting up, the number of particles in the processing liquid supplied to the substrate W is reduced to approximately 1 / 2 compared to the comparative example. In other words, by setting the rotational acceleration of the pump 37 to 400 rpm / s or less when starting up, the number of particles in the processing liquid supplied to the substrate W can be reduced.

[0211] Furthermore, the number of particles in Example 2 (Rod A2) and Example 3 (Rod A3) was lower than that in Example 1 (Rod A1). Specifically, by setting the rotational acceleration of the pump 37 at 50 rpm / s or less during startup, the number of particles in the processing liquid supplied to the substrate W can be further reduced.

[0212] (6) Figure 15 This is another graph showing the relationship between the rotational acceleration of the pump 37 and the number of particles in Examples 1 to 3. Figure 15 In the graph, the horizontal axis represents the rotational acceleration (rpm / second) and the vertical axis represents the number of particles.

[0213] (6-1) Figure 15 In the graph, the bar B1 represents the number of particles having a diameter greater than 19 nm in Example 1. The bar B2 represents the number of particles having a diameter greater than 19 nm in Example 2. The bar B3 represents the number of particles having a diameter greater than 19 nm in Example 3.

[0214] The number of particles in Example 1 (rod B1) was 583, the number of particles in Example 2 (rod B2) was 240, and the number of particles in Example 3 (rod B3) was 255.

[0215] In Example 2 (Rod B2) and Example 3 (Rod B3), the number of particles was reduced to approximately 1 / 2 compared to Example 1 (Rod B1). Specifically, by setting the rotational acceleration of the pump 37 at 50 rpm / s or less during startup, the number of particles in the processing liquid supplied to the substrate W can be further reduced.

[0216] (6-2) Figure 15 In the graph, rod E1 represents the number of particles having a diameter greater than 15 nm in Example 1. Rod E2 represents the number of particles having a diameter greater than 15 nm in Example 2. Rod E3 represents the number of particles having a diameter greater than 15 nm in Example 3.

[0217] The number of particles in Example 1 (rod E1) was 927, the number of particles in Example 2 (rod E2) was 365, and the number of particles in Example 3 (rod E3) was 386.

[0218] In Example 2 (rod E2) and Example 3 (rod E3), the number of particles was reduced to approximately 1 / 2.5 or less compared to Example 1 (rod E1). Specifically, by setting the rotational acceleration of the pump 37 at 50 rpm / s or less during startup, the number of particles in the processing liquid supplied to the substrate W can be further reduced.

[0219] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above-described embodiments and can be implemented in various ways without departing from the scope of the present invention. In addition, the multiple components disclosed in the above-described embodiments can be appropriately changed. For example, a component of all the components shown in a certain embodiment can be added to the components of another embodiment, or some components of all the components shown in a certain embodiment can be deleted from the embodiment.

[0220] To facilitate understanding of the invention, the accompanying drawings schematically illustrate various structural elements. The thickness, length, number, spacing, etc. of the structural elements shown in the drawings may sometimes differ from the actual structure due to the convenience of drawing production. In addition, the structure of each structural element shown in the above-mentioned embodiment is an example and is not particularly limited. Various modifications can be made within the scope that does not substantially deviate from the effects of the present invention.

[0221] (1) Figure 8 and Figure 12 In the description above, the cycle idle stop state is described as the state in which pump 37 is stopped. However, the present invention only requires driving pump 37 in the stopped state, and the stopped state of pump 37 is not limited to the cycle idle stop state. For example, the present invention is also applicable when the pump 37 is driven for the first time from the stopped state immediately after the substrate processing apparatus 1 is installed in a factory.

[0222] (2) Figure 8 In the above example, steps S8 and S9 may not be performed, or either step S8 or step S9 may be performed. Alternatively, step S8 may be performed after step S9. Furthermore, steps S5 to S7 may be performed after steps S8 and S9. Furthermore, step S3 may be performed after step S2, or step S2 may be performed after step S3.

[0223] (3) Figure 12 In the process, steps S28 and S29 may not be performed. In addition, steps S25 to S27 may be performed after steps S28 and S29. Furthermore, step S23 may be performed after step S22, or step S22 may be performed after step S23.

[0224] Industrial applicability

[0225] The present invention relates to a substrate processing apparatus and a substrate processing method, and has industrial applicability.

Claims

1. A substrate processing device for processing a substrate using a processing liquid, characterized in that: The substrate processing device comprises: a treatment liquid storage portion for storing the treatment liquid; a first circulation pipe having an upstream end connected to the treatment liquid storage portion and a downstream end connected to the treatment liquid storage portion for circulating the treatment liquid; a filter disposed in the first circulation pipe and configured to capture particles contained in the treatment liquid; a pump disposed in the first circulation pipe; and a control unit that controls the pump, The pump has a rotating body, and the treatment liquid is delivered by rotating the rotating body. When driving the pump in a stopped state, the control unit controls the pump by rotating the rotating body at a rotational acceleration of 50 rpm / second or less so that the rotational speed reaches a target rotational speed over 120 seconds or more.

2. The substrate processing apparatus according to claim 1, wherein: When the rotation speed of the rotating body reaches a target rotation speed, the control unit controls the pump so that the rotating body maintains the target rotation speed.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate processing apparatus further comprises: a first liquid discharge pipe connected to the first circulation pipe and discharging the treatment liquid from the first circulation pipe; and a first drain valve disposed on the first drain pipe and opening and closing the flow path of the first drain pipe; When the pump in the stopped state is driven, the control unit controls the first drain valve so that the first drain valve opens the flow path of the first drain pipe.

4. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate processing apparatus further comprises: a second liquid discharge pipe extending from a primary side space of the filter and discharging the treated liquid from the primary side space of the filter; as well as a second drain valve disposed on the second drain pipe and opening and closing the flow path of the second drain pipe; When the pump in the stopped state is driven, the control unit controls the second drain valve so that the second drain valve opens the flow path of the second drain pipe.

5. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate processing apparatus further comprises: a first circulation valve disposed in the first circulation pipe and opening and closing a flow path of the first circulation pipe; a second circulation pipe extending from a connection position of the first circulation pipe set downstream of both the pump and the filter to the treatment liquid storage portion; a second circulation valve disposed in the second circulation pipe and opening and closing the flow path of the second circulation pipe; When driving the pump in a stopped state, the control unit controls the first circulation valve to close the flow path of the first circulation pipe and controls the second circulation valve to open the flow path of the second circulation pipe.

6. A substrate processing method for processing a substrate using a processing liquid, characterized in that: The substrate processing method comprises: a first rotating step of driving a stopped pump disposed upstream of the filter in a first circulation pipe through which the treated liquid circulates, rotating a rotating body of the pump at a rotational acceleration of 50 rpm / s or less so that the rotational speed reaches a target rotational speed over 120 seconds or more; and The processing liquid supplying step is to supply the processing liquid sent out by the rotating body to the substrate after the first rotating step.

7. The substrate processing method according to claim 6, wherein: The substrate processing method further comprises a second rotating step, In the second rotation step, when the rotation speed of the rotating body reaches the target rotation speed, the rotating body is maintained at the target rotation speed. In the processing liquid supplying step, the processing liquid is supplied to the substrate while the rotation speed of the rotating body is maintained at the target rotation speed.

8. The substrate processing method according to claim 6 or 7, wherein: The substrate processing method further includes a circulation pipe draining step of draining the processing liquid from the first circulation pipe through a first drain pipe extending from the first circulation pipe when the pump is driven in a stopped state.

9. The substrate processing method according to claim 6 or 7, characterized in that: The substrate processing method further includes a filter draining step of draining the processing liquid from the primary side space of the filter through a second drain pipe extending from the primary side space of the filter disposed in the first circulation pipe when the pump is driven in a stopped state.

10. The substrate processing method according to claim 6 or 7, characterized in that: The substrate processing method further includes a circulation step of blocking a flow path of the first circulation pipe and supplying the processing liquid to a second circulation pipe connected to the first circulation pipe when the pump is driven in a stopped state. The second circulation pipe extends from a connection position of the first circulation pipe set downstream of both the pump and the filter to a treatment liquid storage portion storing the treatment liquid. In the circulation step, the processing liquid circulates in the second circulation pipe.

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