A pick-up nozzle heating precision die bonder applicable to independent eutectic bonding of chips

Abstract

The present invention discloses a nozzle-heated precision solid crystal head suitable for independent eutectic of chips, comprising a base, an XYZ three-axis mechanical arm is fixedly provided on the top of the base, a slide rail is provided on the XYZ three-axis mechanical arm, a sliding block is slidably connected to the inner wall of the slide rail, a positioning plate is provided on the outer wall of one side of the sliding block, and a positioning clamp is fixedly provided at one end of the bottom of the positioning plate. The present invention heats a single chip sucked by the nozzle by directly heating the nozzle, so that the chip is eutectically welded to the substrate to achieve eutectic solid crystal. It can avoid eutectic welding of chips by heating the substrate, prevent the position where the previously eutectic chip and the substrate are fused again, avoid the stress influence of repeated melting flow and cooling at the eutectic caused by large-area heating of the eutectic substrate, avoid the displacement of the eutectic chip, and meet the production requirements of precise eutectic of multiple chips on the same substrate.

Description

Technical Field

[0001] The present invention relates to the field of chip processing, and particularly to a nozzle heating precise die bonder applicable to independent eutectic of chips. Background Art

[0002] Eutectic die bonding technology is a die bonding technology that bonds dies through the fusion of metal to metal. It uses various heating means such as ultrasonic heating, pulse heating, and constant temperature heating to melt the tin / gold alloy layer between the eutectic chip and the eutectic chip, the eutectic chip and the base or lead frame, thereby forming a stable metal-to-metal molten bond. Compared with the traditional die bonding method, the metal-to-metal bond improves the bond strength, reduces the bond impedance, and also improves the heat conduction efficiency. It is a good die bonding method, especially widely used in the LED and optical communication industries. However, with the continuous reduction of the chip size and the base size, the requirement for die bonding accuracy is increasing day by day, and it has become a widespread demand to bond multiple chips on the same base or frame.

[0003] When making such a product with a traditional eutectic die bonder, multiple chips are usually first placed on the top of the substrate, and then directly heated to the eutectic point temperature multiple times through the existing eutectic stage to fix the chips on the top of the substrate respectively. The substrate is heated multiple times to eutectically bond the chips on the top of the substrate in sequence. For this reason, the chips on the top of the substrate will be heated multiple times, resulting in the re-melting of the eutectic part between the previously installed chips and the substrate, and being affected by the fluidity of the molten metal during chip eutectic, the stress and oxidation of the metal cooling process, causing the originally precisely positioned chips to be displaced and unable to meet the manufacturing requirements. Summary of the Invention

[0004] The purpose of the present invention is to provide a nozzle heating precise die bonder applicable to independent eutectic of chips to solve the above deficiencies in the technology.

[0005] To achieve the above object, the present invention provides the following technical solution: A pick-up head heating precision die bonder applicable to independent eutectic of chips, including a base, on the top of the base is fixedly provided with an XYZ three-axis robotic arm, on the XYZ three-axis robotic arm is provided with a slide rail, the inner wall of the slide rail is slidably connected with a sliding block, on one outer wall of the sliding block is provided with a positioning plate, at one end of the bottom of the positioning plate is fixedly provided with a positioning clamping block, on the top outer wall of the positioning clamping block is opened a clamping hole, inserted into the inner wall of the clamping hole is a tungsten steel pick-up nozzle, at one end of the bottom of the fixed block is fixedly provided with a coil matrix, around the outer circle of the coil matrix is wound an electromagnetic heating coil with a specific number of turns and shape, inside the coil matrix is provided with a tungsten steel heat collecting rod, on one side of the top of the tungsten steel heat collecting rod is fixedly provided with a thermocouple, on one side of the top of the base is fixedly provided with two wires, at one end of the top of the two wires is connected with a pulse heater, and at the other end is fixedly provided with a connecting block in a "Z" shape structure, at one end of the top of the connecting block is fixedly provided with a eutectic processing table, on the top of the eutectic processing table is provided with a negative pressure positioning port.

[0006] Preferably, on one outer wall of the XYZ three-axis robotic arm is fixedly provided with a fixed block through a plate, on one side of the fixed block away from the XYZ three-axis robotic arm is opened a fixed groove, on the inner wall of the fixed groove is fixedly provided with a slide rail through a bolt, on both inner walls of the slide rail are fixedly provided with limit guide rails, on both outer walls of the sliding block are opened limit sliding grooves, and the outer wall of the limit guide rail is slidably connected with the inner wall of the limit sliding groove.

[0007] Preferably, at one end of the top of the fixed block is fixedly provided with a support plate, on one outer wall of the support plate is fixedly provided with a push rod motor, and the output shaft of the push rod motor is fixedly connected with one end of the top of the sliding block through a coupling.

[0008] Preferably, on one outer wall of the sliding block are opened two threaded holes, on one outer wall of the positioning plate are opened two settling holes, and the inner walls of the settling holes and the threaded holes are equipped with bolts that match each other.

[0009] Preferably, on the side wall of the eutectic processing table are provided a negative pressure adapter and a nitrogen injection hole, inside the eutectic processing table, through an opening, the negative pressure positioning port is communicated with the negative pressure adapter, and through the nitrogen injection hole, nitrogen can be generated on the top of the eutectic processing table to avoid oxidation when the chip is heated.

[0010] Preferably, on one side of the top of the base is fixedly provided with a negative pressure generator, at one end of the top of the negative pressure generator includes three negative pressure interfaces, and the inner walls of the negative pressure interfaces are respectively communicated with the tungsten steel pick-up nozzle and the negative pressure adapter through air pipes.

[0011] Preferably, the tungsten steel heat collecting rod is located on one side of the tungsten steel pick-up nozzle, the tungsten steel heat collecting rod and the tungsten steel pick-up nozzle are located inside the coil matrix, and the eutectic processing table is located directly below the tungsten steel pick-up nozzle and the tungsten steel heat collecting rod.

[0012] S1: Before use, place the substrate with the chip to be installed on the eutectic processing table. After the substrate moves above the eutectic processing table, generate negative pressure through the negative pressure generator. The negative pressure interface starts to pump air. The negative pressure interface is connected to the negative pressure nozzle through a trachea. The negative pressure adapter sucks air from the top of the negative pressure positioning port. The substrate located on the top of the eutectic processing table will be adsorbed on the top of the eutectic processing table. Since the eutectic substrate is adsorbed on the top of the eutectic processing table, it can avoid the movement of the eutectic substrate during processing;

[0013] S2: Then, move the fixing block through the XYZ three-axis robotic arm. Move the tungsten steel nozzle to the specified position on the top of the chip through the fixing block. Move downward the output shaft of the push rod motor. The push rod motor drives the sliding block to move downward. The sliding block drives the positioning plate and the positioning clamp block to move downward, so that the tungsten steel nozzle moves downward. One end of the bottom of the tungsten steel nozzle is aligned with the specified position of the eutectic chip. Generate negative pressure through the negative pressure generator. The negative pressure interface makes the inside of the tungsten steel nozzle generate negative pressure through the trachea. One end of the bottom of the tungsten steel nozzle directly adsorbs on the top of the chip. The tungsten steel nozzle sucks up the chip. Move it to the specified position of the substrate through the XYZ three-axis robotic arm and place the chip on the substrate;

[0014] S3: At this time, pass an electric current through the electromagnetic heating coil wound around the coil base. Generate electromagnetic eddy currents in the inner circle of the coil base through the electromagnetic heating coil. The electromagnetic eddy currents preheat the tungsten steel heat collecting rod and the tungsten steel nozzle. It is convenient to understand the temperatures of the tungsten steel nozzle and the tungsten steel heat collecting rod through the thermocouple. Adjust the temperature by the intensity of the passed electric current. Preheat the tungsten steel heat collecting rod and the tungsten steel nozzle to a temperature close to the eutectic point. At the same time, heat the eutectic processing table to a temperature lower than but close to the eutectic point through the pulse heater; By adjusting the intensity of the current in the electromagnetic heating coil, the intensity of the electromagnetic eddy currents becomes larger, and the instantaneous temperature of the tungsten steel nozzle rises rapidly. The heating of the tungsten steel nozzle makes the temperature between the chip and the substrate quickly reach the temperature of the eutectic point, melts the eutectic between the chip and the substrate. Turn off the current in the electromagnetic heating coil and the pulse heater, and let the temperature continue to drop. The molten eutectic gradually cools, and the chip is eutectic on the substrate;

[0015] S4: The tungsten steel nozzle is moved away by the XYZ three-axis robotic arm to pick up the next chip. Move the tungsten steel nozzle again to align with the next chip. Move it to the specified position of the substrate through the XYZ three-axis robotic arm and place the chip on the substrate. Individually heat and eutectically weld the chip on the substrate. Repeat the above operations until all the chips to be die-bonded are eutectic on the substrate;

[0016] S5: After the eutectic chip processing is completed, lift the coil base and the positioning plate upward by the output shaft of the push rod motor, so that the tungsten steel nozzle and the tungsten steel heat collecting rod are far away from the eutectic chip. Turn off the negative pressure generator. After the eutectic chip cools, take out the eutectic product from the top of the eutectic processing table.

[0017] In the above technical solution, the technical effects and advantages provided by the present invention are as follows:

[0018] The fixed block is moved by the XYZ three-axis robotic arm. The coil base is moved to the specified position on top of the chip by the fixed block. The output shaft of the push rod motor moves downward, driving the sliding block to move downward. The sliding block drives the positioning plate and the positioning clamp block to move downward, thereby causing the tungsten steel nozzle to move downward. One end of the bottom of the tungsten steel nozzle is aligned with the specified position on the substrate where the eutectic chip is required. Negative pressure is generated by the negative pressure generator. The negative pressure interface causes negative pressure to be generated inside the tungsten steel nozzle through the air pipe. One end of the bottom of the tungsten steel nozzle directly adsorbs on the top of the chip. By controlling the current passed through the electromagnetic heating coil wound around the coil base, the instantaneous temperature of the tungsten steel nozzle in the coil rapidly increases. Through the non-contact heating of the tungsten steel nozzle, the tungsten steel nozzle transfers heat to the single chip adsorbed by it and the substrate area connected to the chip for heating, melting the chip eutectic. By turning off the current of the electromagnetic heating coil and the pulse heater, the molten eutectic cools, causing the chip to be eutectic on the substrate, realizing eutectic die bonding. Electromagnetic eddy currents are generated by the electromagnetic heating coil to heat the tungsten steel nozzle, making non-contact heating of the nozzle possible. By directly heating the chip adsorbed by the nozzle with the nozzle, it is possible to directly heat a small area of the chip and a small area of the chip connection substrate, avoiding the method of heating the substrate to weld the chip, realizing heating of the specified position on the substrate where the eutectic chip is required, preventing the previously eutectic position of the chip and the substrate from melting again, avoiding the stress influence of repeated melting, flowing, and cooling of the eutectic caused by large-area heating of the eutectic substrate, and avoiding the displacement of the eutectic chip, meeting the manufacturing requirements of precise eutectic of multiple chips on the same substrate.

[0019] Negative pressure is generated by the negative pressure generator, and the negative pressure interface starts to pump air. The tungsten steel nozzle is connected to the negative pressure nozzle, and the negative pressure adapter sucks air from the top of the negative pressure positioning port. The eutectic substrate placed on the top of the eutectic processing table will be adsorbed. The eutectic substrate is adsorbed on the top of the eutectic processing table, which can avoid the movement of the eutectic chip during processing and is beneficial to improving the precision of the present invention. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 2Schematic diagram of the eutectic processing table structure of the present invention;

[0023] Figure 3 Schematic diagram of the fixed block structure of the present invention;

[0024] Figure 4 Schematic diagram of the coil matrix structure of the present invention;

[0025] Figure 5 Schematic diagram of the slide rail structure of the present invention;

[0026] Figure 6 Schematic diagram of the push rod motor structure of the present invention;

[0027] Figure 7 Schematic diagram of the positioning plate structure of the present invention.

[0028] Explanation of reference numerals:

[0029] 1 Base, 2 XYZ three-axis robotic arm, 3 Fixed block, 4 Fixed slot, 5 Slide rail, 6 Limiting guide rail, 7 Sliding block, 8 Limiting chute, 9 Support plate, 10 Push rod motor, 11 Positioning plate, 12 Settlement hole, 13 Positioning clamp block, 14 Clamping hole, 15 Tungsten steel suction nozzle, 18 Coil matrix, 19 Electromagnetic heating coil, 20 Thermocouple, 21 Tungsten steel heat collecting rod, 22 Negative pressure generator, 23 Negative pressure interface, 24 Electric wire, 25 Connecting block, 26 Eutectic processing table, 27 Negative pressure positioning port, 28 Negative pressure adapter, 29 Nitrogen injection hole. Detailed implementation manners

[0030] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further introduced in detail below with reference to the accompanying drawings.

[0031] Embodiment 1

[0032] Refer to the accompanying specification Figure 1-7, A pick-up nozzle heating precision die bonder applicable to independent die bonding of chips, comprising a base 1. A XYZ three-axis robotic arm 2 is fixedly arranged on the top of the base 1. A slide rail 5 is arranged on the XYZ three-axis robotic arm 2. A slider 7 is slidably connected to the inner wall of the slide rail 5. A positioning plate 11 is arranged on the outer wall of one side of the slider 7. A positioning clamping block 13 is fixedly arranged at one end of the bottom of the positioning plate 11. A clamping hole 14 is opened on the outer wall of the top of the positioning clamping block 13. A tungsten steel pick-up nozzle 15 is inserted into the inner wall of the clamping hole 14. A coil base body 18 is fixedly arranged at one end of the bottom of the fixed block 3. An electromagnetic heating coil 19 with a specific number of turns and shape is wound around the outer circle of the coil base body 18. A tungsten steel pick-up nozzle 15 and a tungsten steel heat collecting rod 21 are arranged in the inner circle of the coil base body. A thermocouple 20 is fixedly arranged on one side of the top of the tungsten steel heat collecting rod 21. Two electric wires 24 are fixedly arranged on one side of the top of the base 1. One end of the two electric wires 24 is connected to a pulse heater, and the other end is connected to a connecting block 25 with a "Z" shape structure. A eutectic processing table 26 is fixedly arranged at one end of the top of the connecting block 25. A negative pressure positioning port 27 is arranged on the top of the eutectic processing table 26.

[0033] Embodiment 2

[0034] Based on Embodiment 1, a fixed block 3 is fixedly arranged on the outer wall of one side of the XYZ three-axis robotic arm 2 through a plate. A fixing groove 4 is opened on the side of the fixed block 3 away from the XYZ three-axis robotic arm 2. A slide rail 5 is fixedly arranged on the inner wall of the fixing groove 4 through bolts. Limiting guide rails 6 are fixedly arranged on the inner walls on both sides of the slide rail 5. Limiting sliding grooves 8 are opened on the outer walls on both sides of the slider 7. The outer wall of the limiting guide rail 6 is slidably connected to the inner wall of the limiting sliding groove 8. Limiting sliding grooves 8 are opened on the outer walls on both sides of the slider 7. The outer wall of the limiting guide rail 6 is slidably connected to the inner wall of the limiting sliding groove 8. A support plate 9 is fixedly arranged at one end of the top of the fixed block 3. A push rod motor 10 is fixedly arranged on the outer wall of one side of the support plate 9. The output shaft of the push rod motor 10 is fixedly connected to one end of the top of the slider 7 through a coupling. Two threaded holes are opened on the outer wall of one side of the slider 7. Two settling holes 12 are opened on the outer wall of one side of the positioning plate 11. Bolts adapted to the inner walls of the settling holes 12 and the threaded holes are provided.

[0035] Embodiment 3

[0036] Based on Embodiment 1, the side wall of the eutectic processing table 26 is provided with a negative pressure adapter 28 and a nitrogen injection hole 29. The inside of the eutectic processing table 26 is connected to the negative pressure adapter 28 through an opening for the negative pressure positioning port 27. Nitrogen can be generated at the top of the eutectic processing table 26 through the nitrogen injection hole 29 to prevent oxidation when the chip is heated. One side of the top of the base 1 is fixedly provided with a negative pressure generator 22. One end of the top of the negative pressure generator 22 includes three negative pressure interfaces 23. The inner walls of the negative pressure interfaces 23 are respectively connected to the tungsten steel suction nozzle 15 and the negative pressure adapter 28 through air pipes. The tungsten steel heat collecting rod 21 is located on one side of the tungsten steel suction nozzle 15. The tungsten steel heat collecting rod 21 and the tungsten steel suction nozzle 15 are located in the inner ring of the coil base 18. The eutectic processing table 26 is located directly below the tungsten steel suction nozzle 15 and the tungsten steel heat collecting rod 21.

[0037] The working principle of the present invention:

[0038] Refer to the attached Figure 1-7, before use, place the substrate of the chip to be installed on the eutectic processing table 26. After the substrate moves above the eutectic processing table 26, generate negative pressure through the negative pressure generator 22, and the negative pressure interface 23 starts to pump air. The negative pressure interface 23 is connected to the negative pressure nozzle 29 through an air pipe. The negative pressure adapter 28 sucks air from the top of the negative pressure positioning port 27, and the substrate located on the top of the eutectic processing table 26 will be adsorbed on the top of the eutectic processing table 26. Since the eutectic substrate is adsorbed on the top of the eutectic processing table 26, it can avoid the movement of the eutectic substrate during processing. Then, pass an electric current through the electromagnetic heating coil 19, and electromagnetic eddy currents are generated in the coil matrix 18. The tungsten steel heat collecting rod 21 and the tungsten steel suction nozzle 15 located in the inner circle of the coil matrix 18 are preheated by the electromagnetic eddy currents. The thermocouple 20 is used to facilitate understanding of the temperatures of the tungsten steel suction nozzle 15 and the tungsten steel heat collecting rod 21. By controlling the unified current, the tungsten steel heat collecting rod 21 and the tungsten steel suction nozzle 15 are preheated to a temperature close to the eutectic point. At the same time, the eutectic processing table 26 is heated to a temperature lower than but close to the eutectic point by the pulse heater. At this time, move the fixed block 3 through the XYZ three-axis robotic arm 2. The suction nozzle that has adsorbed the chip is moved to the specified position on the top of the substrate through the fixed block 3. The output shaft of the push rod motor 10 moves downward, driving the sliding block 7 to move downward. The sliding block 7 drives the positioning plate 11 and the positioning clamp block 13 to move downward, so that the tungsten steel suction nozzle 15 moves downward. One end of the bottom of the tungsten steel suction nozzle 15 is aligned with the specified position on the substrate where the eutectic chip is required. Place the chip on the substrate. Pass an electric current through the electromagnetic heating coil 19 wound around the outer circumference of the coil matrix 18. The instantaneous temperature of the tungsten steel suction nozzle 15 rises rapidly. The temperature of the tungsten steel suction nozzle 15 transfers heat to the chip and the eutectic body at the connection between the chip and the substrate. The temperature of the eutectic body quickly reaches the temperature of the eutectic point. When the current in the electromagnetic heating coil and the pulse heater are turned off, the temperature of the eutectic body drops rapidly for cooling, and the chip is eutectic on the substrate. The XYZ three-axis robotic arm 2 of the tungsten steel suction nozzle 15 moves away to pick up the next chip, moves the tungsten steel suction nozzle 15 again to align with the next chip, and moves to the specified position of the substrate through the XYZ three-axis robotic arm 2. Place the chip on the substrate and heat and eutectic weld the chip to the substrate individually. After all the required eutectic chips are eutectic, lift the coil matrix 18 and the positioning plate 11 upward through the output shaft of the push rod motor 10, so that the tungsten steel suction nozzle 15 and the tungsten steel heat collecting rod 21 are far away from the eutectic chip. Turn off the negative pressure generator 22, and take out the eutectic chip from the top of the eutectic processing table 26 after the eutectic chip cools down.

[0039] Only some exemplary embodiments of the present invention have been described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the rights of the present invention

[0040] Limitations on the scope of protection claimed.

Claims

1. A pick-up nozzle heating and precise die bonding head applicable to independent eutectic of chips, comprising a base (1), characterized in that: A top of the base (1) is fixedly provided with an XYZ three-axis robotic arm (2). A slide rail (5) is arranged on the XYZ three-axis robotic arm (2). An inner wall of the slide rail (5) is slidably connected with a sliding block (7). An outer wall of one side of the sliding block (7) is provided with a positioning plate (11). A bottom end of one side of the positioning plate (11) is fixedly provided with a positioning clamping block (13). A clamping hole (14) is formed in a top outer wall of the positioning clamping block (13). A tungsten steel suction nozzle (15) is inserted into an inner wall of the clamping hole (14). A bottom end of one side of a fixed block (3) is fixedly provided with a coil matrix (18). An electromagnetic heating coil (19) is wound around an outer circumference of the coil matrix (18). A tungsten steel heat collecting rod (21) is arranged in an inner ring of the coil matrix (18). A thermocouple (20) is fixedly provided on one side of a top of the tungsten steel heat collecting rod (21). Two electric wires (24) are fixedly provided on one side of a top of the base (1). One ends of the two electric wires (24) are connected to a pulse heater, and the other ends are fixedly connected to a connecting block (25) in a "Z" shape structure. A top end of one side of the connecting block (25) is fixedly provided with a eutectic processing table (26). A negative pressure positioning port (27) is arranged on a top of the eutectic processing table (26); An outer wall of one side of the XYZ three-axis robotic arm (2) is fixedly provided with a fixed block (3) through a plate. A fixing groove (4) is formed in a side of the fixed block (3) away from the XYZ three-axis robotic arm (2). The slide rail (5) is fixedly provided in an inner wall of the fixing groove (4) through a bolt. Limiting guide rails (6) are fixedly provided on two inner walls of the slide rail (5). Limiting sliding grooves (8) are formed in two outer walls of the sliding block (7). An outer wall of the limiting guide rail (6) is slidably connected with an inner wall of the limiting sliding groove (8); A top end of one side of the fixed block (3) is fixedly provided with a support plate (9). A push rod motor (10) is fixedly provided on an outer wall of one side of the support plate (9). An output shaft of the push rod motor (10) is fixedly connected to a top end of one side of the sliding block (7) through a coupling; The electromagnetic heating coil (19) with a specific number of turns and shape is wound around an outer circumference of the coil matrix (18); The tungsten steel heat collecting rod (21) is located on one side of the tungsten steel suction nozzle (15). The tungsten steel heat collecting rod (21) and the tungsten steel suction nozzle (15) are located in an inner ring of the coil matrix (18). The eutectic processing table (26) is located directly below the tungsten steel suction nozzle (15) and the tungsten steel heat collecting rod (21).

2. The pick-up nozzle heating and precise die bonding head applicable to independent eutectic of chips according to claim 1, wherein: Two threaded holes are formed in an outer wall of one side of the sliding block (7). Two settling holes (12) are formed in an outer wall of one side of the positioning plate (11). Bolts adapted to inner walls of the settling holes (12) and the threaded holes are provided.

3. The accurate die bonding head with nozzle heating applicable to independent eutectic of chips according to claim 2, wherein: A negative pressure adapter (28) and a nitrogen injection hole (29) are arranged on a side wall of the eutectic processing table (26). An inner part of the eutectic processing table (26) is communicated with the negative pressure positioning port (27) and the negative pressure adapter (28) through an opening.

4. The pick-up nozzle heating and accurate die bonding head applicable to independent eutectic of chips according to claim 3, characterized in that: On one side of the top of the base (1), a negative pressure generator (22) is fixedly provided. One end of the top of the negative pressure generator (22) includes three negative pressure interfaces (23). The inner walls of the negative pressure interfaces (23) are respectively communicated with a tungsten steel suction nozzle (15) and a negative pressure adapter (28) through air pipes.

5. A method for applying a nozzle heating precise die bonding head applicable to independent eutectic of chips, according to the nozzle heating precise die bonding head applicable to independent eutectic of chips described in any one of claims 1-4, characterized in that, The method includes the following operation steps: Step 1: Before use, place the substrate to be installed with chips on the eutectic processing table (26). After the substrate moves above the eutectic processing table (26), generate negative pressure through the negative pressure generator (22), and the negative pressure interfaces (23) start to draw air. The negative pressure interfaces (23) are communicated with the negative pressure adapter (28) through air pipes, and the negative pressure adapter (28) sucks air from the top of the negative pressure positioning port (27). The substrate located on the top of the eutectic processing table (26) will be adsorbed on the top of the eutectic processing table (26). Since the eutectic substrate is adsorbed on the top of the eutectic processing table (26), the movement of the eutectic substrate during processing can be avoided. Step 2: Then start the electromagnetic heating coil (19) wound around the coil matrix (18), and generate electromagnetic eddy currents through the electromagnetic heating coil (19) to preheat the tungsten steel heat collecting rod (21) and the tungsten steel suction nozzle (15). The thermocouple (20) is used to facilitate understanding the temperatures of the tungsten steel suction nozzle (15) and the tungsten steel heat collecting rod (21), and preheat the tungsten steel heat collecting rod (21) and the tungsten steel suction nozzle (15) to a temperature close to the eutectic point. At the same time, heat the eutectic processing table (26) to a temperature close to the eutectic point through a pulse heater. Step 3: At this time, move the fixed block (3) through the XYZ three-axis robotic arm (2). Move the coil base body (18) to the specified position on the top of the chip through the fixed block (3). Move the output shaft of the push rod motor (10) downward. The push rod motor (10) drives the sliding block (7) to move downward. The sliding block (7) drives the positioning plate (11) and the positioning clamping block (13) to move downward, so that the tungsten steel nozzle (15) moves downward. One end of the bottom of the tungsten steel nozzle (15) is aligned with the specified position of the chip that needs to be eutectic on the substrate. Generate negative pressure through the negative pressure generator (22). The negative pressure interface (23) makes the inside of the tungsten steel nozzle (15) generate negative pressure through the air pipe. One end of the bottom of the tungsten steel nozzle (15) directly adsorbs on the top of the chip. The tungsten steel nozzle (15) sucks up the chip. Move it to the specified position on the substrate through the XYZ three-axis robotic arm (2). Place the chip on the substrate. Pass an electric current through the electromagnetic heating coil (19) wound around the outside of the coil base body (18). Electromagnetic eddy currents are generated in the coil base body. The instantaneous temperatures of the tungsten steel nozzle (15) and the tungsten steel heat collecting rod in the electromagnetic eddy currents rapidly increase. The temperature of the tungsten steel nozzle (15) quickly reaches the eutectic point temperature between the chip and the substrate. Heat the chip on the top of the substrate alone, and it can heat the chip alone for eutectic die bonding, so that the chip is eutectically bonded to the substrate alone. The XYZ three-axis robotic arm (2) of the tungsten steel nozzle (15) moves away to pick up the next chip. Move the tungsten steel nozzle (15) again to align with the next chip. Move it to the specified position on the substrate through the XYZ three-axis robotic arm (2). Place the chip on the substrate and heat and eutectically weld the chip to the substrate alone; Step 4: After all the chips that need to be eutectic are processed, lift the coil base body (18) and the positioning plate (11) by the output shaft of the push rod motor (10) to make the tungsten steel nozzle (15) and the tungsten steel heat collecting rod (21) away from the eutectic chip. Turn off the negative pressure generator (22). After the eutectic product cools down, take out the eutectic product from the top of the eutectic processing table (26).

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