Adhesive part sample preparation tooling with controllable adhesive thickness

Abstract

The present invention relates to the technical field of adhesive sample preparation, and provides an adhesive sample preparation tooling with controllable adhesive thickness, which includes a base, a PTFE bonding module and a PTFE gasket. The PTFE bonding module is detachably embedded in the base. The upper substrate positioning area is provided with a first positioning groove, and the first positioning groove extends from the substrate positioning area through the upper step portion of the PTFE bonding module to the connection between the upper step portion and the lower step portion. The lower substrate positioning area is provided with a second positioning groove that matches the first positioning groove in position and quantity. The second positioning groove extends from the lower substrate positioning area through the lower step portion of the PTFE bonding module to the connection between the upper step portion and the lower step portion; the PTFE gasket is placed in the first positioning groove to control the adhesive thickness; the upper substrate is placed above the PTFE gasket in the first positioning groove, and the lower substrate is placed in the second positioning groove. The sample preparation of the present invention has high precision, and the modular design is easy to load and unload, can control the adhesive thickness, and meets the requirements of continuous sample preparation.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesive component testing, and particularly to a sample preparation tooling for adhesive components with controllable adhesive thickness. Background Art

[0002] Adhesive components generally refer to components that use adhesives to connect different base materials, forming a bonding joint in the adhesive-coated areas of the two base materials. The firmness of the bonding joint directly affects the use of the adhesive component, and the firmness of the bonding joint depends on the bonding performance between the adhesive and the base material.

[0003] In order to ensure that the selected adhesive can meet the usage requirements of the bonded parts, it is necessary to test its bonding performance. It is impossible to completely transport the materials in the actual usage environment into the laboratory during testing. Therefore, it is necessary to prepare samples according to the actual usage environment first, and then test the bonding performance using the prepared samples. Currently, the sample preparation method for bonded parts is relatively simple. For the preparation of the adhesive layer joint after bonding, mainly manual pad clamping is used. The control of the adhesive layer thickness is not accurate, the bonding area deviates greatly from the standard requirements, the operation is inconvenient, and the consistency of the samples is poor; or the thickness is fixed and cannot be adjusted, and after the adhesive is applied at the joint, it is necessary to clean the overflow glue on 4 surfaces. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: in order to overcome the deficiencies in the prior art, the present invention provides a sample preparation tooling for adhesive components with controllable adhesive thickness.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a sample preparation tooling for adhesive components with controllable adhesive thickness, including a base, a PTFE bonding module, and a PTFE gasket. Among them, along the width direction of the base, there are successively arranged an upper substrate positioning area, a bonding module installation area, and a lower substrate positioning area. The PTFE bonding module is a stepped structure and is fixedly embedded in the bonding module installation area, including a sequentially connected upper step portion and a lower step portion. The upper substrate positioning area is provided with at least one first positioning groove, and the first positioning groove extends from the substrate positioning area through the upper step portion to the connection between the upper step portion and the lower step portion. The lower substrate positioning area is provided with second positioning grooves that match the position and quantity of the first positioning grooves. The second positioning grooves extend from the lower substrate positioning area through the lower step portion to the connection between the upper step portion and the lower step portion. The PTFE gasket is placed in the first positioning groove to control the adhesive thickness. The upper substrate is placed above the PTFE gasket in the first positioning groove, the lower substrate is placed in the second positioning groove, and the overlapping part of the upper substrate extending outward and the lower substrate forms an adhesive application area. The distance between the lower surface of the upper substrate and the upper surface of the lower substrate is the adhesive thickness.

[0006] The PTFE material is prone to wear, while the wear-resistant alloy material is prone to sticking. Therefore, in the present invention, the bottom structure of the sample preparation tooling is set in a split manner. The bottom near the gluing area is made of a PTFE bonding module, and the rest of the base is made of an alloy material. This not only ensures the firmness of the base but also avoids sticking. Moreover, after the PTFE wears, it can be easily replaced to ensure the precision of sample preparation. In addition, a PTFE gasket is provided in the first positioning groove of the upper substrate. By placing PTFE gaskets of different thicknesses, sample preparation with different thicknesses of adhesive layers can be satisfied. To ensure the precision of sample preparation, preferably, the tooling size is for sample preparation with an adhesive layer thickness of about 1 to 10 mm at the bonding joint. Due to the stepped structure, only three surfaces of the overflow glue need to be cleaned after applying the glue, improving the sample preparation efficiency. The gluing and glue application part of this tooling is made of polytetrafluoroethylene (PTFE) material and is made into a modular form, which is easy to load and unload the joints. For a large number of sample preparations, only the corresponding module needs to be replaced to continuously prepare samples; at the same time, only three surfaces of the overflow glue need to be cleaned after the glue application is completed.

[0007] Furthermore, in order to achieve overflow glue pressing, it further includes a pressing plate. A pressing strip with a size matching the first positioning groove is provided on the lower surface of the pressing plate, which is used to press on the upper substrate. After applying the glue in the glue application area, cover the upper substrate, and the overflow glue appears by pressing the upper substrate through the pressing strip to make the glue compact, and then clean the excess glue. Preferably, the pressing plate is a carbon steel pressing plate.

[0008] Furthermore, it further includes a limiting crossbeam, and the limiting crossbeam abuts against one end of the lower substrate away from the glue application area.

[0009] Furthermore, in order to adapt to different lengths of substrate sizes, a crossbeam fixing area is provided outside the lower substrate positioning area on the base, and the limiting crossbeam is fixedly installed in the crossbeam fixing area through an adjustable mechanism.

[0010] Specifically, the adjustable mechanism includes at least two strip-shaped limiting holes provided on the limiting crossbeam, and threaded holes provided in the crossbeam fixing area and corresponding to the positions of the strip-shaped limiting holes. The extending direction of the strip-shaped limiting holes is the same as the extending direction of the first positioning groove.

[0011] When placing the lower substrate in the second positioning groove, install the limiting crossbeam on one side of the base, adjust the tightness of the lower substrate through the strip-shaped limiting holes, and then apply glue on the glue application area of the lower substrate.

[0012] Preferably, the base is integrally formed of aluminum alloy. Using the aluminum alloy machining integral forming process, the machining accuracy is high, which can effectively ensure the geometric dimensions of the adhesive layer.

[0013] Further, in order to fix the PTFE bonding module to the base, a bonding module fixing mechanism is further included. The bonding module fixing mechanism includes a threaded hole provided in the bonding module installation area and a countersunk through hole provided on the lower stepped portion of the PTFE bonding module. A screw is placed at the bottom of the countersunk through hole and threadedly connected to the threaded hole, thereby fixing the PTFE bonding module to the base.

[0014] The beneficial effects of the present invention are as follows: A sample preparation tooling for adhesive parts with controllable adhesive thickness provided by the present invention has a simple and compact structure, is easy to operate, has high control precision for the size of the adhesive layer, can realize continuous multi-batch sample preparation, and is especially suitable for the case of a large number of samples to be prepared, thereby shortening the sample preparation cycle and greatly reducing the sample preparation cost of a single sample. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below in conjunction with the drawings and embodiments.

[0016] Figure 1 is a three-dimensional structural schematic diagram of the sample preparation tooling of the present invention.

[0017] Figure 2 is a top view structural schematic diagram of the sample preparation tooling of the present invention.

[0018] Figure 3 is Figure 2 a sectional structural schematic diagram of A-A in

[0019] Figure 4 is a partial structural schematic diagram of the sample preparation tooling.

[0020] Figure 5 is a structural schematic diagram of the base.

[0021] Figure 6 is a structural schematic diagram of the PTFE bonding module.

[0022] Figure 7 is a structural schematic diagram of the pressing plate.

[0023] In the figure: 1. Base, 11. Upper substrate positioning area, 12. Bonding module installation area, 13. Lower substrate positioning area, 14. Cross beam fixing area, 15. Threaded hole, 2. PTFE bonding module, 21. Upper stepped portion, 22. Lower stepped portion, 23. Countersunk through hole, 3. First positioning groove, 4. Second positioning groove, 5. PTFE gasket, 6. Pressing plate, 61. Pressing strip, 7. Limit cross beam, 71. Strip-shaped limit hole, 8. Upper substrate, 9. Lower substrate, 10. Glue application area. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basic structure of the present invention in a schematic manner, so it only shows the components related to the present invention.

[0025] As Figures 1-4 shown, a sample preparation tooling for an adhesive part with a controllable adhesive thickness according to the present invention includes a base 1, a PTFE bonding module 2, a PTFE gasket 5, a pressing plate 6, and a limiting cross beam 7. For the convenience of showing the structure of the tooling, Figure 1 and Figure 2 only a set of upper substrate 8 and lower substrate 9 are shown in Figure 3 a sectional view with the position of the substrate provided, Figure 4 and a schematic structural view showing the first positioning groove 3 and the second positioning groove 4. In the figure, the PTFE gasket 5, the pressing plate 6, and the substrate are hidden.

[0026] As Figure 5 and Figure 6As shown in the figure, the base 1 is integrally formed by machining aluminum alloy. Along the width direction of the base 1, there are successively arranged an upper substrate positioning area 11, an adhesive module installation area 12, a lower substrate positioning area 13, and a crossbeam fixing area 14. Threaded holes 15 are provided in both the adhesive module installation area 12 and the crossbeam fixing area 14. In this embodiment, there are 4 threaded holes 15 in the adhesive module installation area 12. The PTFE adhesive module 2 is embedded in the adhesive module installation area 12 on the aluminum alloy base 1 and is fixed to the threaded holes 15 on the base 1 through 4 bolts via the countersunk through holes 23 on the PTFE adhesive module 2. The 4 threaded holes 15 and the countersunk through holes 23 together form an adhesive module fixing mechanism; there are 2 threaded holes 15 in the crossbeam fixing area 14. The limiting crossbeam 7 is provided with two strip-shaped limiting holes 71, and the positions of the strip-shaped limiting holes 71 match the threaded holes 15 in the crossbeam fixing area 14. The strip-shaped limiting holes 71 and the threaded holes 15 together form an adjustable mechanism. The limiting crossbeam 7 controls the tightness of the limiting crossbeam 7 through stainless steel bolts arranged in the strip-shaped limiting holes 71, so as to realize the positioning of the lower substrate 9. The PTFE adhesive module 2 is of a stepped structure and includes a upper stepped portion 21 and a lower stepped portion 22 connected in sequence. The upper substrate positioning area 11 of the base 1 is provided with at least one first positioning groove 3. Preferably, in this embodiment, there are 7 first positioning grooves 3, and the first positioning grooves 3 extend from the substrate positioning area through the upper stepped portion 21 to the connection between the upper stepped portion 21 and the lower stepped portion 22. The lower substrate positioning area 13 is provided with 7 second positioning grooves 4, and the positions match those of the first positioning grooves 3. The second positioning grooves 4 extend from the lower substrate positioning area 13 through the lower stepped portion 22 to the connection between the upper stepped portion 21 and the lower stepped portion 22; there is a certain height difference when the first positioning grooves 3 and the second positioning grooves 4 are in contact, which is convenient for the positioning of the lower substrate 9. The PTFE gasket 5 is placed in the first positioning groove 3 to control the thickness of the adhesive; the upper substrate 8 is placed above the PTFE gasket 5 in the first positioning groove 3, the lower substrate 9 is placed in the second positioning groove 4, and the overlapping part where the upper substrate 8 extends outward and overlaps with the lower substrate 9 forms an adhesive application area 10. The distance between the lower surface of the upper substrate 8 and the upper surface of the lower substrate 9 is the thickness of the adhesive.

[0027] As Figure 7 shown in the figure, there are 7 pressing strips 61 on the lower surface of the pressing plate 6, which are used to press on the upper substrate 8. The width of the pressing strips 61 should be able to press the substrate smoothly. Preferably, the width of the pressing strips 61 is at least slightly smaller than the width of the first positioning groove 3. After applying glue in the adhesive application area 10, cover the upper substrate 8, and press the upper substrate 8 through the pressing strips 61 to cause glue overflow, so that the glue is compact, and then clean the excess glue. Preferably, the pressing plate 6 is a carbon steel pressing plate.

[0028] Working principle:

[0029] Sample preparation for thick adhesive layer bonding joints requires strict control over the adhesive layer thickness and lap size. To facilitate sample preparation, a standard substrate for sample preparation is placed in a machined positioning groove. For example, the standard substrate size is 100mm * 25mm * 2mm. The thickness of the adhesive layer is controlled by adjusting the distance between the upper substrate 8 and the lower substrate 9 using PTFE gaskets 5 of different thicknesses. The positioning of the lower substrate 9 is controlled by a limit crossbeam 7 on one side. Then, glue is applied to the lower substrate 9 on one side of the bottom, ensuring that the adhesive layer is full. Then, another upper substrate 8 is placed over the gluing area 10, ensuring that excess glue overflows. A carbon steel pressing plate 6 is used to fix the upper substrate 8. Then, the excess glue on three sides is removed. At the same time, a detachable PTFE bonding module 2 is used to prepare multiple samples.

[0030] The main feature of this sample preparation tooling is that the lap size can be precisely controlled and the bonding module is detachable. Since the complete curing period for thick adhesive layer bonding generally takes 7 - 10 days, especially when preparing multiple samples, as long as several bonding modules are prepared in advance, the elastic adhesive samples can surface dry and form in 2 days. The prepared samples are detached from the base 1 together with the bonding module as a whole. A new bonding module is installed on the base 1 for the next batch of sample preparation. This can greatly reduce the sample preparation cycle and material costs.

[0031] Inspired by the ideal embodiments of the present invention described above, through the above description, relevant staff can make various changes and modifications without departing from the scope of the present invention. The technical scope of this invention is not limited to the content in the specification and must be determined according to the scope of the claims.

Claims

1. A sample preparation tooling for adhesive parts with controllable adhesive thickness, characterized in that: It includes a base, a PTFE bonding module and a PTFE gasket. Among them, an upper substrate positioning area, a bonding module installation area and a lower substrate positioning area are sequentially arranged on the base along the width direction. The PTFE bonding module is a stepped structure and is detachably embedded in the bonding module installation area, including an upper stepped portion and a lower stepped portion connected in sequence. At least one first positioning groove is provided in the upper substrate positioning area, and the first positioning groove extends from the substrate positioning area through the upper stepped portion to the connection between the upper stepped portion and the lower stepped portion. The lower substrate positioning area is provided with second positioning grooves whose positions and quantities match those of the first positioning grooves. The second positioning grooves extend from the lower substrate positioning area through the lower stepped portion to the connection between the upper stepped portion and the lower stepped portion. The PTFE gasket is placed in the first positioning groove to control the thickness of the adhesive. The upper substrate is placed above the PTFE gasket in the first positioning groove, the lower substrate is placed in the second positioning groove, and the overlapping part where the upper substrate extends outwards and overlaps with the lower substrate forms a glue application area. The distance between the lower surface of the upper substrate and the upper surface of the lower substrate is the thickness of the adhesive. It further includes a pressing plate. A pressing strip whose size matches that of the first positioning groove is provided on the lower surface of the pressing plate and is used to press on the upper substrate to make the glue compact. It further includes a limiting cross beam, and the limiting cross beam abuts against one end of the lower substrate away from the glue application area.

2. The sample preparation tooling for adhesive parts with controllable adhesive thickness according to claim 1, characterized in that: A cross beam fixing area is provided outside the lower substrate positioning area on the base, and the limiting cross beam is adjustably fixed in the cross beam fixing area through an adjusting mechanism.

3. The sample preparation tooling for adhesive parts with controllable adhesive thickness according to claim 2, characterized in that: The adjusting mechanism includes at least two strip-shaped limiting holes provided on the limiting cross beam, and threaded holes provided in the cross beam fixing area and corresponding to the positions of the strip-shaped limiting holes. The extending direction of the strip-shaped limiting holes is the same as the extending direction of the first positioning groove.

4. The sample preparation tooling for adhesive parts with controllable adhesive thickness according to claim 1, characterized in that: The base is an aluminum alloy base.

5. The sample preparation tooling for adhesive parts with controllable adhesive thickness according to claim 1, characterized in that: It further includes a bonding module fixing mechanism. The bonding module fixing mechanism includes threaded holes provided in the bonding module installation area and countersunk through holes provided on the lower stepped portion of the PTFE bonding module.

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