Array substrate detection method, device, equipment and storage medium
By acquiring inspection images of the array substrate using a near-infrared image acquisition device and calculating grayscale differences to determine defect locations, the problem of inaccurately locating defects in data signal lines and scan signal lines in existing technologies is solved, thereby improving the production yield and efficiency of the array substrate.
Patent Information
- Application Number
- CN202210835775.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-15
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2042-07-15
AI Technical Summary
Existing technologies for inspecting liquid crystal display panels can only identify the location of display defects, but cannot detect specific defects and their locations on data signal lines and/or scan signal lines.
Near-infrared image acquisition device is used to acquire the detection image of the array substrate. By calculating the difference between the average gray value of other pixels within a preset range around each pixel and the gray value of the pixel, it is determined whether the gray value difference is within the preset range, so as to determine the defect location.
It enables accurate detection of defects in array substrates, improves production yield and efficiency, prevents missed detections, and facilitates targeted repair.
Smart Images

Figure CN115131331B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of array substrate testing technology, and in particular to a method, apparatus, device and storage medium for testing array substrates. Background Technology
[0002] An active matrix display panel includes an array substrate on which data signal lines, scan signal lines, and thin-film transistor switches are disposed. For an active matrix liquid crystal display panel, it also includes a color filter substrate disposed opposite to the array substrate and a liquid crystal layer located between the color filter substrate and the array substrate. The color filter substrate is provided with photoresist of different colors. The scan signal transmitted by the scan signal lines can control the thin-film transistor switches to be turned on or off. The drive signal transmitted by the data signal lines can be written when the thin-film transistor switches are turned on, so as to drive the liquid crystal molecules in the liquid crystal layer to twist, thereby allowing light to pass through the liquid crystal layer to reach the color filter substrate, and after being filtered by the photoresist of different colors, light of the corresponding color is emitted, enabling the liquid crystal display panel to achieve color display.
[0003] Currently, with the development of display technology, the requirements for display panel quality are becoming increasingly stringent. To prevent display defects in panels before they are put into use, testing is conducted on the display panels both after and during their fabrication process to ensure they meet display requirements. In existing technologies, after the liquid crystal display panel is fabricated, an array test (ART) is performed. This involves transmitting scan signals via scan signal lines and drive signals via data signal lines on the array substrate to drive the liquid crystal molecules in the liquid crystal layer to twist, allowing light to pass through the liquid crystal layer and reach the display surface. By acquiring the light signal reaching the display surface, the presence of display defects is determined, and consequently, whether the display panel needs repair.
[0004] The existing technology has the following drawbacks: the existing technology can only determine the location of the display defect in the liquid crystal display panel, but cannot detect the specific defects and their specific locations on the data signal lines and / or scan signal lines. Summary of the Invention
[0005] The purpose of this invention is to provide a method, apparatus, device, and storage medium for detecting array substrates, which can accurately determine the location of defects and improve the production yield and efficiency of array substrates.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A method for detecting an array substrate is provided, comprising:
[0008] The detection image of the area to be detected in the array substrate is obtained based on a near-infrared image acquisition device;
[0009] The difference between the average gray value of each pixel in the detection image and the gray value of the pixel itself is determined as the gray value difference of the pixel.
[0010] Determine whether the grayscale difference corresponding to the pixel is within a preset difference range;
[0011] If not, the location of the pixel will be determined as the defect location.
[0012] As a preferred method for detecting array substrates,
[0013] The difference between the average grayscale value of all pixels surrounding each pixel in the detected image and the grayscale value of the pixel itself is determined as the grayscale difference value corresponding to the pixel, including:
[0014] A sliding window is used to traverse each pixel of the detected image;
[0015] The grayscale value of the target pixel and the grayscale values of all other pixels in the sliding window are obtained respectively.
[0016] The average grayscale value of all pixels in the sliding window, excluding the target pixel, is calculated as the average grayscale value corresponding to the target pixel.
[0017] The difference between the gray value of the target pixel and the average gray value corresponding to the target pixel is determined as the gray difference corresponding to the target pixel.
[0018] As a preferred embodiment of the detection method for the array substrate, the array substrate includes a plurality of signal lines; each of the signal lines extends along a first direction and is arranged along a second direction; the first direction intersects the second direction;
[0019] Before acquiring a detection image of the region to be detected in the array substrate based on a near-infrared image acquisition device, the method further includes:
[0020] Electrical signals are sequentially supplied to each of the signal lines, and feedback signals from each of the signal lines are obtained one by one.
[0021] Determine whether the feedback signal of the signal line exceeds the preset signal range;
[0022] If so, the region to which the signal line corresponding to the feedback signal that exceeds the preset signal range belongs is determined as the region to be detected, and the step of acquiring the detection image of the region to be detected in the array substrate based on the near-infrared image acquisition device is executed.
[0023] As a preferred embodiment of the detection method for the array substrate, electrical signals are sequentially provided to each of the signal lines, and feedback signals of each of the signal lines are acquired one-to-one, including:
[0024] Each of the aforementioned signal lines is sequentially identified as a target signal line. A signal transmitting module couples the transmitted signal to the target signal line, and a signal receiving module obtains the signal coupling amount on the target signal line as a feedback signal corresponding to the target signal line.
[0025] As a preferred embodiment of the detection method for the array substrate, before coupling the transmitted signal to the target signal line using a signal transmitting module, the method further includes:
[0026] The input signal received by the signal transmitting module is filtered and converted into the transmitted signal.
[0027] As a preferred embodiment of the detection method for the array substrate, the array substrate includes multiple signal lines and multiple pixel circuits; each of the signal lines extends along a first direction and is arranged along a second direction; the first direction intersects the second direction; at least a portion of the pixel circuits located in the same column are electrically connected to the same signal line;
[0028] Before acquiring a detection image of the region to be detected in the array substrate based on a near-infrared image acquisition device, the method further includes:
[0029] A drive signal is provided to each of the signal lines and written into each of the pixel circuits in a corresponding manner to control the control area of each pixel circuit to display light emission;
[0030] Acquire the optical signal of the control area of each pixel circuit, and convert the optical signal into a detection signal;
[0031] Determine whether the voltage of the detection signal in the control area of each pixel circuit exceeds the set voltage range;
[0032] If so, the region to which the signal line electrically connected to the pixel circuit corresponding to the detection signal whose voltage exceeds the set voltage range is determined as the region to be detected, and the step of acquiring the detection image of the region to be detected in the array substrate based on the near-infrared image acquisition device is executed.
[0033] As a preferred embodiment of the detection method for the array substrate, after determining the location of the pixel as the defect location, the method further includes:
[0034] The defect locations in the array substrate are repaired.
[0035] A detection device for an array substrate is also provided, comprising:
[0036] The image acquisition module is used to acquire a detection image of the area to be detected in the array substrate based on a near-infrared image acquisition device;
[0037] The difference determination module is used to determine the difference between the average gray value of each pixel in the detection image and the gray value of the pixel as the gray value difference corresponding to the pixel.
[0038] The difference judgment module is used to determine whether the grayscale difference corresponding to the pixel is within a preset difference range;
[0039] The defect location determination module is used to determine the location of the pixel as the defect location when the grayscale difference corresponding to the pixel is not within the preset difference range.
[0040] A computer-readable storage medium is also provided, which stores computer instructions for causing a processor to execute the above-described detection method for the array substrate.
[0041] A testing device is also provided, comprising:
[0042] Near-infrared image acquisition device;
[0043] At least one processor; and
[0044] A memory communicatively connected to the at least one processor; wherein,
[0045] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the above-described detection method for the array substrate.
[0046] The beneficial effects of this invention are as follows: by acquiring a detection image of the area to be detected in the array substrate through a near-infrared image acquisition device, the acquired detection image has high clarity and accuracy. Based on the gray value of each pixel in the detection image and the average gray value of the pixel circuits within a preset range around it, the gray value difference corresponding to each pixel can be determined. By judging whether the gray value difference corresponding to each pixel is within the preset difference range, the position of the pixel whose gray value is not within the preset difference range in the area to be detected is determined as the defect position. Thus, the location of the defect in the area to be detected in the array substrate can be accurately detected, preventing missed detection, facilitating subsequent point repair of the array substrate, and improving the production yield and efficiency of the array substrate. Attached Figure Description
[0047] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.
[0048] Figure 1 A flowchart of a detection method for an array substrate provided in Embodiment 1 of the present invention;
[0049] Figure 2 This is a top view of an array substrate provided in an embodiment of the present invention;
[0050] Figure 3 This is a schematic diagram of the structure of a detection image provided in an embodiment of the present invention;
[0051] Figure 4 To and Figure 3 A schematic diagram of a pixel array structure for the corresponding detection image;
[0052] Figure 5 The flowchart shows a detection method for an array substrate provided in Embodiment 2 of the present invention;
[0053] Figure 6 The flowchart shows a detection method for an array substrate provided in Embodiment 3 of the present invention;
[0054] Figure 7 This is a schematic diagram of the structure of a signal transceiver device provided in an embodiment of the present invention;
[0055] Figure 8 A three-dimensional structural diagram of a signal transceiver module in a signal transceiver device provided in an embodiment of the present invention;
[0056] Figure 9 This is a bottom view of the signal transceiver module in a signal transceiver device provided in an embodiment of the present invention;
[0057] Figure 10 An equivalent structural diagram of a signal transceiver device provided in an embodiment of the present invention;
[0058] Figure 11 The flowchart shows a detection method for an array substrate provided in Embodiment 4 of the present invention;
[0059] Figure 12 This is a schematic diagram of the structure of a detection device for an array substrate provided in Embodiment 5 of the present invention;
[0060] Figure 13 This is a schematic diagram of the structure of a detection device provided in Embodiment Six of the present invention. Detailed Implementation
[0061] The advantages and features of the present invention, as well as methods of implementing them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided merely to complete the disclosure of the invention and to enable those skilled in the art to fully understand the scope of the invention, which is defined only by the scope of the claims. The same reference numerals denote the same constituent elements throughout the specification.
[0062] The present invention will now be described in detail with reference to the accompanying drawings.
[0063] Figure 1 This is a flowchart of a detection method for an array substrate provided in Embodiment 1 of the present invention. This embodiment is applicable to the detection of defect locations and defect types in an array substrate. The method can be executed by an array substrate detection device, which can be implemented in hardware and / or software and can be configured in a detection equipment. Figure 1 As shown, the method includes:
[0064] S110. Acquire the detection image of the area to be detected in the array substrate based on the near-infrared image acquisition device.
[0065] Among them, the near-infrared image acquisition device can acquire images of objects outside the visible light spectrum. It can still acquire clear images in poor lighting conditions, allowing it to capture images of the conductive structures in the array substrate of the display panel through the photoresist used for filtering. The area to be detected on the array substrate is the area in the array substrate where defects may exist. This area could be a defective signal line or the location of a thin-film transistor.
[0066] Specifically, Figure 2 This is a top view schematic diagram of an array substrate provided in an embodiment of the present invention, as shown below. Figure 2As shown, taking the array substrate of a liquid crystal display panel as an example, the array substrate includes signal lines (Line), thin-film transistors (T), and pixel electrodes (P). The signal lines (Line) can include scan signal lines (S) and data signal lines (D). The gate of the thin-film transistor (T) is electrically connected to the scan signal line (S), the source of the thin-film transistor (T) is electrically connected to the data signal line (D), and the drain of the thin-film transistor (T) is electrically connected to the pixel electrode (P). When the scan signal transmitted by the scan signal line (S) controls the thin-film transistor (T) to be in the conducting state, the thin-film transistor (T) can write the driving signal transmitted on the data signal line (D) into the pixel electrode (P), so that the pixel electrode (P) has a corresponding electrical signal, thereby controlling the twisting of the liquid crystal molecules in the liquid crystal display panel, so that light can pass through the liquid crystal molecules and reach the display surface of the liquid crystal display panel. However, when there is a short circuit or open circuit in any of the scan signal lines, data signal lines, or thin-film transistors, it will affect the electrical signal on the pixel electrode (P), causing light to be unable to reach the display surface or the brightness of the light reaching the display surface to be abnormal, thereby affecting the display effect of the display panel. When using a near-infrared image acquisition device to acquire images of the detection area that may have defects in the array substrate, it is possible to acquire images of conductive structures such as signal lines and thin-film transistors in the detection area. Furthermore, since the near-infrared image acquisition device can penetrate the cover layer above the conductive structures such as signal lines and thin-film transistors, it is possible to obtain clear and accurate detection images.
[0067] S120. The difference between the average gray value of each pixel in the preset range surrounding each pixel in the detected image and the gray value of the pixel is determined as the gray value difference corresponding to the pixel.
[0068] Specifically, Figure 3 This is a schematic diagram of the structure of a detection image provided in an embodiment of the present invention. Figure 4 To and Figure 3 A schematic diagram of a pixel array structure in the corresponding detection image, combined with Figure 3 and Figure 4 As shown, locations with the same conductive structure in the detection area of the array substrate have the same imaging brightness in the detection image, while locations with different conductive structures have different imaging brightness in the detection image. This ensures that the grayscale value of each pixel in the detection image corresponds to the conductive structure at each location in the detection area. Taking the detection of short circuits and open circuits in the data signal lines of the array substrate as an example, after acquiring the detection image, it can be divided into multiple pixels arranged in an array. Each pixel has a corresponding grayscale value, as shown in Table 1 below, which lists the grayscale values of each pixel in region A of the detection image.
[0069] Table 1 Figure 4 grayscale values of each pixel in region A
[0070] 255 255 255 255 255 255 255 255 255
[0071] At this point, pixels 13, 22, 24, and 33 can be considered as other pixels within a preset range surrounding pixel 23. In Table 1, the first row and first column correspond to the grayscale value of pixel 12, the first row and second column correspond to the grayscale value of pixel 13, the first row and third column correspond to the grayscale value of pixel 14, the second row and first column correspond to the grayscale value of pixel 22, the second row and second column correspond to the grayscale value of pixel 23, the second row and third column correspond to the grayscale value of pixel 24, the third row and first column correspond to the grayscale value of pixel 32, the third row and second column correspond to the grayscale value of pixel 33, and the third row and third column correspond to the grayscale value of pixel 34. As shown in Table 1, when there is no defect structure in region A of the detected image, the gray values of pixels 13, 22, 24, and 33 are all 255. It can be seen that the average gray value of other pixels (13, 22, 24, and 33) within the preset range around pixel 23 is 255. The gray value of pixel 23 is also 255, so the difference between the average gray value of other pixels (13, 22, 24, and 33) within the preset range around pixel 23 and the gray value of pixel circuit 23 is 0, that is, the gray value difference corresponding to pixel 23 is 0.
[0072] Table 2 below shows the grayscale values of each pixel in region B of the detected image.
[0073] Table 2 Figure 4 grayscale values of each pixel in region B
[0074] 255 255 255 0 0 0 255 255 255
[0075] At this point, pixels 73, 82, 84, and 93 can be identified as other pixels within a preset range surrounding pixel 83. In Table 2, the first row and first column correspond to the grayscale value of pixel 72, the first row and second column correspond to the grayscale value of pixel 73, the first row and third column correspond to the grayscale value of pixel 74, the second row and first column correspond to the grayscale value of pixel 82, the second row and second column correspond to the grayscale value of pixel 83, the second row and third column correspond to the grayscale value of pixel 84, the third row and first column correspond to the grayscale value of pixel 92, the third row and second column correspond to the grayscale value of pixel 93, and the third row and third column correspond to the grayscale value of pixel 94. As shown in Table 2, the grayscale values of pixels 73 and 93 are 255, while the grayscale values of pixels 82 and 84 are 0. This indicates that the average grayscale value of the other pixels (73, 82, 84, and 93) within the preset range surrounding pixel 83 is 127.5. Since the grayscale value of pixel 83 is 0, the difference between the average grayscale value of the other pixels (73, 82, 84, and 93) within the preset range surrounding pixel 83 and the grayscale value of pixel 83 is 127.5. In other words, the grayscale difference corresponding to pixel 83 is 127.5.
[0076] Table 3 below shows the grayscale values of each pixel in region C of the detected image.
[0077] Table 3 Figure 4 grayscale values of each pixel in region C
[0078] 255 0 255 255 255 255 255 0 255
[0079] At this point, pixels 19, 28, 30, and 39 can be identified as other pixels within a preset range surrounding pixel 29. In Table 1, the first row and first column correspond to the grayscale value of pixel 18, the first row and second column correspond to the grayscale value of pixel 19, the first row and third column correspond to the grayscale value of pixel 20, the second row and first column correspond to the grayscale value of pixel 28, the second row and second column correspond to the grayscale value of pixel 29, the second row and third column correspond to the grayscale value of pixel 30, the third row and first column correspond to the grayscale value of pixel 38, the third row and second column correspond to the grayscale value of pixel 39, and the third row and third column correspond to the grayscale value of pixel 40. As shown in Table 3, the grayscale values of pixels 28 and 30 are 255, while the grayscale values of pixels 19 and 39 are 0. This indicates that the average grayscale value of the other pixels (19, 28, 30, and 39) within the preset range surrounding pixel 29 is 127.5. Since the grayscale value of pixel 29 is 255, the difference between the average grayscale value of the other pixels (19, 28, 30, and 39) within the preset range surrounding pixel 29 and the grayscale value of pixel 29 is -127.5. In other words, the grayscale difference corresponding to pixel 29 is -127.5.
[0080] It is understood that the above example only defines the four pixels around the pixel point (top, bottom, left, and right) as pixels within a preset range around the pixel circuit. In the embodiments of the present invention, the pixels within the preset range around the pixel point may also include other pixels, which can be set according to actual needs. The embodiments of the present invention do not make specific limitations in this regard.
[0081] S130. Determine whether the grayscale difference corresponding to the pixel is within the preset difference range; if not, execute S140; if yes, execute S150.
[0082] S140. Determine the location of the pixel as the defect location.
[0083] S150, Determine the location of the pixel as a non-defect location.
[0084] Specifically, each pixel has a corresponding grayscale difference. If the grayscale difference of a pixel is within a preset difference range, there is no defect structure at the detection area of the array substrate corresponding to that pixel. However, if the grayscale difference of a pixel is not within the preset difference range, there is a defect structure at the detection area of the array substrate corresponding to that pixel. The specific type of defect structure can be determined based on the relationship between the grayscale difference of the pixel and the upper and lower limits of the preset difference range.
[0085] For example, continue to refer to the reference Figure 3 and Figure 4Since the grayscale difference corresponding to pixel 23 is within the preset difference range, it can be determined that there is no defect structure at the detection area in the array substrate corresponding to pixel 23, and the detection area in the array substrate corresponding to pixel 23 can be determined as a non-defect location. However, since the grayscale difference corresponding to pixel 83 is not within the preset range, it can be determined that there is a defect structure at the detection area in the array substrate corresponding to pixel 83. Furthermore, since the grayscale difference corresponding to pixel 83 is greater than 0, it can be concluded that the defect structure at the detection area in the array substrate corresponding to pixel 83 is not a defect location. The presence of a conductive structure at the location where the conductive structure should be installed indicates a short circuit between signal lines D1 and D2 at the location of pixel 83. The grayscale difference corresponding to pixel 29 is also outside the preset range, confirming a defect structure in the detection area of the array substrate corresponding to pixel 29. Since the grayscale difference corresponding to pixel 29 is less than 0, the defect structure at the detection area of the array substrate corresponding to pixel 29 is that a conductive structure is absent at the location where it should be installed, indicating an open circuit in signal line D3 at the location of pixel 29. Thus, after determining the location and type of defects in the detection area of the array substrate, the array substrate can be repaired accordingly. Optionally, after determining the location and type of defects in the detection area, the array substrate detection method provided in this application further includes a process for repairing the defect location.
[0086] S160, Repair the defect locations in the array substrate.
[0087] Specifically, after determining the location and type of defects in the array substrate, the defects can be repaired. During repair, a laser can be used to adaptively repair the defect location. For example, if the defect type at the location is determined to be a short circuit, a laser can be used to remove the conductive structure at that location; if the defect type is determined to be an open circuit, a laser can be used to weld the defect location, creating a connection between the repaired defect location and other locations. After the defect repair in the array substrate is completed, the repaired defect location or the entire array substrate can be verified to ensure that the repaired defect location is in a normal state, allowing the array substrate to be put into normal use. This embodiment of the invention does not specifically limit the repair process and verification process of the array substrate.
[0088] In this embodiment, a near-infrared image acquisition device is used to acquire a detection image of the area to be detected in the array substrate, so that the acquired detection image has high clarity and accuracy. Based on the gray value of each pixel in the detection image and the average gray value of the pixel circuits in the surrounding preset range, the gray value difference corresponding to each pixel can be determined. By judging whether the gray value difference corresponding to each pixel is within the preset difference range, the position of the pixel whose gray value difference is not within the preset difference range in the area to be detected is determined as the defect position. In this way, the location of the defect in the area to be detected in the array substrate can be accurately detected, preventing missed detection, facilitating subsequent point repair of the array substrate, and improving the production yield and efficiency of the array substrate.
[0089] In other embodiments, the grayscale difference corresponding to each pixel can also be determined using a sliding window method. Figure 5 This is a flowchart of a detection method for an array substrate provided in Embodiment 2 of the present invention, as shown below. Figure 5 As shown, the method includes:
[0090] S210. Acquire detection images of the area to be detected in the array substrate based on a near-infrared image acquisition device.
[0091] S220. Use a sliding window to traverse and detect each pixel of the image.
[0092] The size of the sliding window can be set as needed; for example, refer to... Figure 4 The sliding window can cover 3*3 pixels. In this case, each sliding window can include 9 pixels. The pixel located in the center of the sliding window can be used as the target pixel. For example, if the sliding window covers all pixels in area A, pixel 23 is the target pixel; if it covers all pixels in area B, pixel 83 is the target pixel; and if it covers all pixels in area C, pixel 29 is the target pixel. By sliding the window in one-pixel increments along the X or Y direction, each pixel in the detected image can be sequentially used as the target pixel.
[0093] S230. Obtain the grayscale value of the target pixel and the grayscale values of all other pixels in the sliding window.
[0094] For example, continue to refer to Figure 4Taking a sliding window covering 3*3 pixels as an example, when the sliding window covers all pixels in area A, pixel 23 is the target pixel of the sliding window, and pixels 12, 13, 14, 22, 24, 32, 33, and 34 are all other pixels in the sliding window except for the target pixel 23. As shown in Table 1 above, the grayscale value of the target pixel 23 in the sliding window is 255, and the grayscale values of all other pixels in the sliding window (12, 13, 14, 22, 24, 32, 33, and 34) are also 255. When the sliding window covers all pixels in area B, pixel 83 is the target pixel of the sliding window, and pixels 72, 73, 74, 82, 84, 92, 93, and 94 are all other pixels in the sliding window except for the target pixel 83. Table 2 shows that the grayscale value of target pixel 83 in the sliding window is 0. Among the other pixels in the sliding window besides target pixel 83, the grayscale values of pixels 72, 73, 74, 92, 93, and 94 are all 255, and the grayscale values of pixels 82 and 84 are both 0. When the sliding window covers the pixels in region C, pixel 29 is used as the target pixel of the sliding window, and pixels 18, 19, 20, 28, 30, 38, 39, and 40 are used as the other pixels in the sliding window besides target pixel 29. As shown in Table 3 above, the grayscale value of target pixel 29 in the sliding window is 255. Among the other pixels in the sliding window besides target pixel 29, the grayscale values of pixels 18, 20, 28, 30, 38, and 40 are all 255, and the grayscale values of pixels 19 and 39 are both 0.
[0095] S240. Calculate the average gray value of all pixels in the sliding window except the target pixel as the average gray value corresponding to the target pixel.
[0096] S250, The difference between the gray value of the target pixel and the average gray value corresponding to the target pixel is determined as the gray difference corresponding to the target pixel.
[0097] For example, taking the sliding window covering each pixel in region C as an example, the average grayscale value corresponding to target pixel 29. The value is (255+0+255+255+255+255+0+255) / 8, which is the average grayscale value corresponding to the target pixel 29. The value is 191.25. At this point, the average grayscale value corresponding to target pixel 29 is... The difference ΔG29 between the grayscale value G29 of the target pixel 29 and the grayscale value G29 is -63.75, so the grayscale difference ΔG29 corresponding to the target pixel 29 can be determined to be -63.75.
[0098] S260. Determine whether the grayscale difference corresponding to the pixel is within the preset difference range; if not, execute S270; if yes, execute S280.
[0099] S270. Determine the location of the pixel as the defect location.
[0100] S280. Determine the location of the pixel as a non-defect location.
[0101] S290, Repair the defect locations in the array substrate.
[0102] This embodiment determines the grayscale difference corresponding to each pixel by using a sliding window, which simplifies the determination of grayscale difference and improves the accuracy of the determined grayscale difference. This, in turn, improves the accuracy of the determined defect location, thereby accurately detecting the location of the defect in the area to be detected in the array substrate, preventing missed detection, facilitating subsequent point-to-point repair of the array substrate, and improving the production yield and efficiency of the array substrate.
[0103] Further reference Figure 2 The signal lines (S or D) in the array substrate can extend along a first direction (X or Y) and be arranged along a second direction (Y or X). That is, when the signal line is a scan signal line S, the first direction is the X direction and the second direction is the Y direction. When the signal line is a data signal line D, the first direction is the Y direction and the second direction is the X direction. This embodiment of the invention does not specifically limit this.
[0104] As an optional embodiment, the step of determining the area to be detected in the array substrate may be included before acquiring the detection image of the area to be detected in the array substrate. Figure 6 This is a flowchart of a detection method for an array substrate provided in Embodiment 3 of the present invention, as follows: Figure 6 As shown, the method includes:
[0105] S310, sequentially provides electrical signals to each signal line, and obtains the feedback signals of each signal line one by one.
[0106] S320: Determine whether the feedback signal of the signal line exceeds the preset signal range; if yes, execute S330 and S340 in sequence; if no, execute S3100.
[0107] S330. The area corresponding to the signal line of the feedback signal that exceeds the preset signal range is determined as the area to be detected.
[0108] For details, please refer to [link / reference]. Figure 2Taking the signal line as the data signal line D as an example, when providing electrical signals to each signal line D in sequence, each signal line can be identified as the target signal line in sequence, and the transmitted signal can be coupled to the target signal line by the signal transmitting module, and the signal receiving module can obtain the signal coupling amount on the target signal line as the feedback signal corresponding to the target signal line.
[0109] For example, Figure 7 This is a schematic diagram of the structure of a signal transceiver device provided in an embodiment of the present invention. Figure 8 This is a three-dimensional structural diagram of a signal transceiver module in a signal transceiver device provided in an embodiment of the present invention. Figure 9 This is a bottom view of the signal transceiver module in a signal transceiver device according to an embodiment of the present invention. Figure 10 This is an equivalent structural diagram of a signal transceiver device provided in an embodiment of the present invention, in conjunction with reference to the reference. Figure 7-10 The signal transceiver device may include multiple scanning modules (LDS) existing in pairs. Each scanning module (LDS) may include at least one signal transmitting module (Tr) and at least one signal receiving module (Re). The signal transmitting module (Tr) can provide a transmitted signal to the signal line D, and the signal receiving module (Re) can receive the feedback signal from the signal line D. Each scanning module (LDS) may be correspondingly provided with a horizontal moving part (HLDS), a radial moving part (RLDS) connecting part (SLDS), and an electrical part (DLDS). The horizontal moving part (HLDS), the radial moving part (RLDS) connecting part (SLDS), and the electrical part (DLDS) cooperate to control the position of the scanning module (LDS) and the signals it transmits and receives. Meanwhile, since the scanning modules (LDS) of the signal transceiver are arranged in pairs, for one LDS scanning module (Tr) transmitting a signal to the signal line D, the signal receiving module (Re) of the other LDS scanning module (Re) receives the feedback signal from the signal line. For example, the signal transmitting module (Tr) of one LDS scanning module (D) forms a capacitive structure with the target signal line D, and the signal receiving module (Re) of the other LDS scanning module (D) also forms a capacitive structure with the target signal line D. This allows the transmitted signal of the signal transmitting module (Tr) of one LDS scanning module (D) to be coupled to the target signal line D. The target signal line D then couples its electrical signal to the signal receiving module (Re) of the other LDS scanning module (D). The coupled signal is the feedback signal of the target signal line D. The magnitude of the feedback signal indicates whether the target signal line D has a defective structure. That is, when the feedback signal is within a preset signal range, it can be determined that the target signal line does not have a defective structure. When the feedback signal is outside the preset signal range, it can be determined that the target signal line may have a defective structure. In this case, the area where the target signal line with the defective structure is located can be determined as the area to be detected for subsequent detection.
[0110] It is understood that the feedback signal exceeding the preset signal range may be due to the period of the feedback signal not being within the preset signal period range, and / or the amplitude of the feedback signal not being within the preset signal amplitude range. This can be set according to actual needs, and this embodiment of the invention does not specifically limit this. For example, when an open circuit is detected in the target signal line, the feedback signal of the target signal line will suddenly decrease, falling below the set signal threshold. When a short circuit is detected, the feedback signal of the target signal line will be higher than the set signal threshold because the signal on the target signal line is superimposed with the signals on other signal lines. This allows for the determination of an open circuit and / or short circuit on the target signal line.
[0111] As an optional embodiment, before using a signal transmitting module to couple the transmitted signal to the target signal line, the input signal received by the signal transmitting module can be filtered and converted into a transmitted signal.
[0112] Specifically, after the input signal is denoised by a filter, it can be integrated once using the ideal filter transfer formula (1) to convert it into a standard signal. Then, it is integrated twice using the transfer formula (2) of a second-order bandpass filter to convert it into a transmit signal that is easy to judge. In the ideal filter transfer formula (1), n is the order of the filter; in the transfer formula (2) of the second-order bandpass filter, Q is the quality factor, ω is the center frequency, and A is the center frequency. vp Here, S represents the passband gain, and S is the value of each response voltage after Laplace transform. Thus, by filtering the input signal received by the signal transmission module, it becomes easier to identify and judge the transmitted signal provided by the signal transmission module to the target signal line, thereby simplifying the subsequent signal processing and improving detection efficiency.
[0113]
[0114]
[0115] In addition, such as Figure 9As shown, each scanning module LDS, in addition to including at least one signal receiving module Tr and at least one signal receiving module Re, may also include a position detection sensor and a levitation vent Hole. The levitation vent Hole allows each scanning module LDS to float above the array substrate for detection. The position detection sensor can detect the position of the scanning module LDS, which includes, but is not limited to, its relative height position with respect to the array substrate. This ensures that the paired scanning modules LDS are on the same horizontal plane, and that the capacitance formed by the signal transmitting module Tr and the target signal line D of one scanning module LDS and the capacitance formed by the signal receiving module Re of the other scanning module LDS are aligned. This avoids detection errors and improves detection accuracy.
[0116] S340: Acquire detection images of the area to be detected in the array substrate based on a near-infrared image acquisition device.
[0117] S350. The difference between the average gray value of each pixel in the preset range surrounding each pixel in the detected image and the gray value of the pixel is determined as the gray value difference corresponding to the pixel.
[0118] S360. Determine whether the grayscale difference corresponding to the pixel is within the preset difference range; if not, execute S370; if yes, execute S380.
[0119] S370, Determine the location of the pixel as the defect location.
[0120] S380, Determine the location of the pixel as a non-defect location.
[0121] S390, Repair the defect locations in the array substrate.
[0122] S3100: Determine the area of the signal line corresponding to the feedback signal that does not exceed the preset signal range as the non-detection area.
[0123] In this embodiment, before acquiring the detection image of the area to be detected on the array substrate, an electrical signal can be provided to the signal line to determine the area where defects may exist. When acquiring the detection image, the near-infrared image acquisition device can be directly moved to the area to be detected, thereby reducing the image acquisition range of the near-infrared image acquisition device, thereby improving detection efficiency, increasing the production yield of the array substrate and improving the production efficiency of the array substrate.
[0124] It should be noted that the method for determining the area to be detected in the array substrate is not limited to the situation described in the above embodiments. In other embodiments, the light transmittance of the array substrate can also be directly detected to determine the area to be detected.
[0125] Further reference Figure 2 In addition to signal lines extending along a first direction and arranged along a second direction, the array substrate may also include multiple pixel circuits (in the figure, a pixel circuit includes a thin-film transistor T and a pixel electrode P as an example); at least some of the pixel circuits located in the same column are electrically connected to the same signal line (taking the signal line as a data signal line D as an example).
[0126] As another optional embodiment, before acquiring the detection image of the area to be detected in the array substrate based on the near-infrared image acquisition device, a step of detecting the light emission status at the control area of each pixel circuit is also included. Figure 11 This is a flowchart of a detection method for an array substrate provided in Embodiment 4 of the present invention, as follows: Figure 11 As shown, the method includes:
[0127] S410 provides drive signals to each signal line and writes them into each pixel circuit in a corresponding manner to control the control area of each pixel circuit to display and emit light.
[0128] S420: Acquire the light signal of the control area of each pixel circuit and convert the light signal into a detection signal.
[0129] S430: Determine whether the voltage of the detection signal in the control area of each pixel circuit exceeds the set voltage range; if yes, execute S440 and S450 in sequence; if no, execute 4110.
[0130] S440 determines the area to be detected as the region to which the signal line electrically connected to the pixel circuit corresponding to the detection signal whose voltage exceeds the set voltage range belongs.
[0131] Specifically, taking the array substrate of a liquid crystal display panel as an example, the driving signals transmitted by each data signal line D are transmitted one-to-one to the thin-film transistors T of each pixel circuit, and written to the pixel electrode P by the thin-film transistors T of the pixel circuit, so that the pixel electrode P has a corresponding electrical charge. This allows the electric field generated by the pixel electrode P to control the twisting of the liquid crystal molecules in the control area corresponding to the pixel electrode P, so that the light provided by the back of the array substrate passes through the liquid crystal layer to reach the display surface. By collecting the light transmission of the display surface in the control area corresponding to each pixel electrode P, it can be determined whether there are defective structures in each pixel electrode P and the thin-film transistors T and data signal lines D connected to it; that is, if there are no defects in the pixel electrode P and the thin-film transistors T and data signal lines D connected to it... When there is a defective structure, the control area of the pixel electrode P can transmit light normally, meaning the brightness of the transmitted light is within the normal range. By collecting the light signal transmitted from the control area and converting it into a detection signal, it can be determined that the voltage of the detection signal is within the set voltage range. However, when any of the pixel electrode P, the thin-film transistor T, or the data signal line D connected to it has a defective structure, the control area of the pixel electrode P cannot transmit light normally, for example, the brightness of the transmitted light is too high or too low. By collecting the light signal transmitted from the control area and converting it into a detection signal, it can be determined that the voltage of the detection signal is not within the set voltage range. Therefore, the area where the pixel circuit corresponding to the control area and the data signal line D connected to it are located can be identified as the area to be detected for subsequent detection.
[0132] S450: Based on a near-infrared image acquisition device, acquire detection images of the area to be detected in the array substrate.
[0133] S460. The difference between the average gray value of each pixel in the preset range surrounding each pixel in the detected image and the gray value of the pixel is determined as the gray value difference corresponding to the pixel.
[0134] S470. Determine whether the grayscale difference corresponding to the pixel is within the preset difference range; if not, execute S480; if yes, execute S490.
[0135] S480, Determine the location of the pixel as the defect location.
[0136] S490, Determine the location of the pixel as a non-defect location.
[0137] S4100 Repair the defect locations in the array substrate.
[0138] S4110 determines the area to which the signal line electrically connected to the pixel circuit corresponding to the detection signal whose voltage does not exceed the set voltage range belongs as a non-detection area.
[0139] In this embodiment, before acquiring the detection image of the area to be detected on the array substrate, a driving signal can be provided to each pixel circuit, and the light signal transmitted through the control area corresponding to each pixel circuit can be acquired to determine the area that may have defects. When acquiring the detection image, the near-infrared image acquisition device can be directly moved to the area to be detected, thereby reducing the image acquisition range of the near-infrared image acquisition device, thereby improving the detection efficiency, increasing the production yield of the array substrate and improving the production efficiency of the array substrate.
[0140] Based on the same inventive concept Figure 12 This is a schematic diagram of a detection device for an array substrate provided in Embodiment 5 of the present invention. This embodiment is applicable to the detection of defect locations and defect types in an array substrate. The detection device for the array substrate can be implemented in hardware and / or software, and can be configured within a detection equipment. Figure 12 As shown, the device includes:
[0141] Image acquisition module 1001 is used to acquire detection images of the area to be detected in the array substrate based on a near-infrared image acquisition device;
[0142] The difference determination module 1002 is used to determine the difference between the average gray value of each pixel in the preset range around each pixel in the detection image and the gray value of the pixel as the gray difference value corresponding to the pixel.
[0143] The difference judgment module 1003 is used to determine whether the grayscale difference corresponding to a pixel is within a preset difference range;
[0144] The defect location determination module 1004 is used to determine the location of a pixel as a defect location when the grayscale difference corresponding to the pixel is not within a preset difference range.
[0145] The array substrate detection device of this embodiment can be used to execute the array substrate detection method of any embodiment of the present invention. Therefore, the array substrate detection device includes the module that executes the array substrate detection method provided by the embodiment of the present invention and the corresponding beneficial effects. The similarities can be referred to the above description of the array substrate detection method provided by the embodiment of the present invention, and will not be repeated here.
[0146] Based on the same inventive concept Figure 13 This is a schematic diagram of the structure of a detection device provided in Embodiment Six of the present invention, as shown below. Figure 13As shown, the detection device includes a near-infrared image acquisition unit (Cam), at least one processor (Pro), and a memory (Mem) communicatively connected to the at least one processor (Pro). The detection images acquired by the near-infrared image acquisition unit (Cam) can be stored in the memory (Mem). Simultaneously, the memory (Mem) stores a computer program executable by the at least one processor (Pro), which enables the at least one processor (Pro) to execute the detection method for the array substrate according to any embodiment of the present invention.
[0147] As an optional embodiment, continue to refer to Figure 13 The detection equipment may also include a signal transceiver device, which may include multiple scanning modules (LDS) existing in pairs. The specific structure and function can be referred to the description above, and will not be repeated here.
[0148] In some embodiments, the array substrate detection method can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as memory Mem. In some embodiments, part or all of the computer program can be loaded and / or installed onto the detection device via a communication unit Com. When the computer program is loaded into memory Mem and executed by at least one processor Pro, one or more steps of the array substrate detection method described above can be performed. Alternatively, in other embodiments, the processor Pro can be configured to perform the array substrate detection method by any other suitable means (e.g., by means of firmware).
[0149] Although embodiments of the invention have been described above with reference to the accompanying drawings, the invention is not limited to the above embodiments, but can be made in various forms, and those skilled in the art will understand that the invention can be implemented in other specific forms without changing the technical spirit or essential characteristics of the invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.
Claims
1. A method for detecting an array substrate, characterized in that, include: The area to be detected in the array substrate is determined; the area to be detected is a region in the array substrate that may have defects; the array substrate includes multiple signal lines and multiple pixel circuits; Each of the signal lines extends along a first direction and is arranged along a second direction; the first direction intersects the second direction; At least some of the pixel circuits located in the same column are electrically connected to the same signal line; wherein, determining the area to be detected in the array substrate includes: determining the potentially defective area by providing an electrical signal to the signal line, or determining the potentially defective area by providing a drive signal to each of the pixel circuits and obtaining the light signal transmitted through the control area corresponding to each of the pixel circuits; The detection image of the area to be detected in the array substrate is obtained based on a near-infrared image acquisition device; The difference between the average gray value of each pixel in the detection image and the gray value of the pixel itself is determined as the gray value difference of the pixel. Determine whether the grayscale difference corresponding to the pixel is within a preset difference range; If not, the location of the pixel will be determined as the defect location.
2. The method for detecting an array substrate according to claim 1, characterized in that, The difference between the average grayscale value of all pixels surrounding each pixel in the detected image and the grayscale value of the pixel itself is determined as the grayscale difference value corresponding to the pixel, including: A sliding window is used to traverse each pixel of the detected image; The grayscale value of the target pixel and the grayscale values of all other pixels in the sliding window are obtained respectively. The average grayscale value of all pixels in the sliding window, excluding the target pixel, is calculated as the average grayscale value corresponding to the target pixel. The difference between the gray value of the target pixel and the average gray value corresponding to the target pixel is determined as the gray difference corresponding to the target pixel.
3. The method for detecting an array substrate according to claim 1, characterized in that, Before acquiring a detection image of the region to be detected in the array substrate based on a near-infrared image acquisition device, the method further includes: Electrical signals are sequentially supplied to each of the signal lines, and feedback signals from each of the signal lines are obtained one by one. Determine whether the feedback signal of the signal line exceeds the preset signal range; If so, the region to which the signal line corresponding to the feedback signal that exceeds the preset signal range belongs is determined as the region to be detected, and the step of acquiring the detection image of the region to be detected in the array substrate based on the near-infrared image acquisition device is executed.
4. The method for detecting an array substrate according to claim 3, characterized in that, Providing electrical signals to each of the aforementioned signal lines sequentially, and acquiring feedback signals from each of the aforementioned signal lines one by one, including: Each of the aforementioned signal lines is sequentially identified as a target signal line. A signal transmitting module couples the transmitted signal to the target signal line, and a signal receiving module obtains the signal coupling amount on the target signal line as a feedback signal corresponding to the target signal line.
5. The method for detecting an array substrate according to claim 4, characterized in that, Before using a signal transmitting module to couple the transmitted signal to the target signal line, the method further includes: The input signal received by the signal transmitting module is filtered and converted into the transmitted signal.
6. The method for detecting an array substrate according to claim 1, characterized in that, Before acquiring a detection image of the region to be detected in the array substrate based on a near-infrared image acquisition device, the method further includes: A drive signal is provided to each of the signal lines and written into each of the pixel circuits in a corresponding manner to control the control area of each pixel circuit to display light emission; Acquire the optical signal of the control area of each pixel circuit, and convert the optical signal into a detection signal; Determine whether the voltage of the detection signal in the control area of each pixel circuit exceeds the set voltage range; If so, the region to which the signal line electrically connected to the pixel circuit corresponding to the detection signal whose voltage exceeds the set voltage range is determined as the region to be detected, and the step of acquiring the detection image of the region to be detected in the array substrate based on the near-infrared image acquisition device is executed.
7. The method for detecting an array substrate according to claim 1, characterized in that, After determining the location of the pixel as the defect location, the method further includes: The defect locations in the array substrate are repaired.
8. A detection device for an array substrate, characterized in that, include: A region determination module is used to determine the region to be detected in the array substrate; the region to be detected is a region in the array substrate where defects may exist. The array substrate includes multiple signal lines and multiple pixel circuits; Each of the signal lines extends along a first direction and is arranged along a second direction; the first direction intersects the second direction; at least a portion of the pixel circuits located in the same column are electrically connected to the same signal line; wherein, the area driving module is specifically used to determine the potentially defective area by providing an electrical signal to the signal line, or by providing a driving signal to each of the pixel circuits and obtaining the light signal transmitted through the control area corresponding to each of the pixel circuits; The image acquisition module is used to acquire a detection image of the area to be detected in the array substrate based on a near-infrared image acquisition device; The difference determination module is used to determine the difference between the average gray value of each pixel in the detection image and the gray value of the pixel as the gray value difference corresponding to the pixel. The difference judgment module is used to determine whether the grayscale difference corresponding to the pixel is within a preset difference range; The defect location determination module is used to determine the location of the pixel as the defect location when the grayscale difference corresponding to the pixel is not within the preset difference range.
9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the detection method for the array substrate according to any one of claims 1-7.
10. A testing device, characterized in that, include: Near-infrared image acquisition device; At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the detection method of the array substrate according to any one of claims 1-7.
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