Laminated coil component

Abstract

A laminated coil component (1) includes a body (2), a coil (5), first and second terminal electrodes (3, 4), a first connecting conductor (6), and a second connecting conductor (7). The first connecting conductor (6) extends in a first direction (D1), and in a cross section orthogonal to the extending direction, has a third edge (6c) intersecting a second direction (D2) and a third direction (D3). The coil (5) opposes the third edge (6c) of the first connecting conductor (6) as viewed in the first direction (D1), and in a portion opposing the third edge (6c), an edge (5a) opposing the third edge (6c) is parallel to the third edge (6c).

Description

Technical Field

[0001] This invention relates to a laminated coil component. Background Technology

[0002] As an existing type of laminated coil component, for example, the laminated coil component described in Patent Document 1 (Japanese Patent Application Publication No. 2019-16642) is known. The laminated coil component described in Patent Document 1 includes a laminated body in which multiple units are stacked, each unit having multiple substrate layers and having a first main surface and a second main surface. Each unit has a groove on the first main surface with a depth of at least one substrate layer. At least one unit has a hole at the bottom of the groove that reaches the second main surface. Conductors are filled in the groove and the hole, respectively. By stacking multiple units, the conductors filling the hole of an adjacent unit and the conductors filling the groove of an adjacent unit are connected. Inside the laminated body, the conductors are connected in a spiral shape about the stacking direction of the units. Summary of the Invention

[0003] In laminated coil components, increasing the coil diameter is desirable to improve performance. However, in structures where the connecting conductor is housed within the coil body, increasing the coil diameter shortens the distance between the connecting conductor and the coil. Consequently, the stray capacitance (parasitic capacitance) formed by the coil and the connecting conductor may increase. If the stray capacitance between the coil turns and the connecting conductor increases, the self-resonant frequency (SRF) and the Q (quality factor) value of the coil will decrease. Therefore, a certain distance must be maintained between the coil and the connecting conductor. On the other hand, extending the distance between the connecting conductor and the coil reduces the inner diameter of the coil, thus preventing performance improvements.

[0004] Regarding the aforementioned issue, in order to increase the coil diameter while ensuring a sufficient distance between the connecting conductor and the coil, the coil is shaped to follow the outline of the connecting conductor in the portion opposite to the conductor. This allows for a fixed distance between the connecting conductor and the coil while maximizing the coil diameter. However, in existing laminated coil components where the connecting conductor (conductor) is prismatic, if the coil is shaped to follow the outline of the connecting conductor, corners are formed within the coil. In this case, magnetic saturation occurs due to magnetic flux concentration at these corners, potentially leading to a decrease in DC overlap characteristics.

[0005] One aspect of the present invention is to provide a stacked coil component that suppresses the generation of stray capacitance and improves its characteristics.

[0006] One aspect of the present invention provides a stacked coil component comprising: a body formed by stacking a plurality of insulating layers, having a pair of opposing end faces, a pair of opposing main faces, and a pair of opposing side faces, wherein one main face is a mounting surface; a coil disposed within the body, the coil axis extending along a first direction relative to the pair of main faces; a first terminal electrode and a second terminal electrode connected to the coil and disposed on the mounting surface; a first connecting conductor, viewed from the first direction, disposed outside the coil within the body and connecting one end of the coil located on the other main face to the first terminal electrode; and a second connecting conductor connecting the other end of the coil located on one main face to the second terminal electrode. The first connecting conductor extends along the first direction and has a first inclined side intersecting the second direction relative to the pair of end faces and the third direction relative to the pair of side faces in a cross section orthogonal to the extending direction. Viewed from the first direction, the coil is opposite to the first inclined side of the first connecting conductor, and in the portion opposite to the first inclined side of the first connecting conductor, the side opposite to the first inclined side is parallel to the first inclined side.

[0007] In a stacked coil assembly according to one aspect of the present invention, a first connecting conductor connects one end of the coil located on another main surface side to a first terminal electrode and extends along a first direction. In this structure, because the area (region) between the first connecting conductor and the coil is increased, the effect of stray capacitance on characteristics may increase. In the stacked coil assembly, viewed from the first direction, the coil faces the first inclined side of the first connecting conductor, and in the portion facing the first inclined side of the first connecting conductor, the side facing the first inclined side is parallel to the first inclined side. Therefore, in the stacked coil assembly, because a certain distance can be ensured between the first connecting conductor and the coil, the formation of stray capacitance between the coil and the first connecting conductor can be suppressed. Furthermore, in this structure, the diameter of the coil can be increased. Moreover, in the stacked coil assembly, no corner is formed in the portion where the coil faces the first connecting conductor. Therefore, in the stacked coil assembly, the decrease in DC overlap characteristics caused by the concentration of magnetic flux in the corner can be suppressed. Therefore, in the stacked coil assembly, the generation of stray capacitance is suppressed, and improved characteristics are achieved.

[0008] In one embodiment, the first terminal electrode may be arranged in a rectangular shape when viewed from a first direction, with each side parallel to the end face or side face. The first connecting conductor has at least three sides, including a first inclined side, and the two sides of the first connecting conductor other than the first inclined side are parallel to the sides of the first terminal electrode. In this structure, the inner diameter of the coil can be increased.

[0009] In one embodiment, the second connecting conductor may extend along the first direction and have a second inclined side intersecting the second and third directions in a cross-section orthogonal to the extending direction. Viewed from the first direction, the coil is opposite to the second inclined side of the second connecting conductor, and in the portion opposite the second inclined side, the side opposite the second inclined side is parallel to the second inclined side. In this structure, because a certain distance can be ensured between the second connecting conductor and the coil, stray capacitance between the coil and the second connecting conductor can be suppressed.

[0010] In one embodiment, the first connecting conductor and the second connecting conductor may each have a triangular shape in their cross-sections orthogonal to the extension direction.

[0011] According to one aspect of the present invention, the generation of stray capacitance is suppressed, thereby improving performance. Attached Figure Description

[0012] Figure 1 This is a perspective view of the stacked coil component according to the first embodiment.

[0013] Figure 2 yes Figure 1 A three-dimensional view of the stacked coil component shown.

[0014] Figure 3 yes Figure 1 The side view of the stacked coil component shown.

[0015] Figure 4 yes Figure 1 The end view of the stacked coil component is shown.

[0016] Figure 5 yes Figure 1 An exploded perspective view of the stacked coil component shown.

[0017] Figure 6 yes Figure 1 A top view of the stacked coil component shown.

[0018] Figure 7 This is a perspective view of the stacked coil component according to the second embodiment.

[0019] Figure 8 yes Figure 7 A three-dimensional view of the stacked coil component shown.

[0020] Figure 9 yes Figure 7 The side view of the stacked coil component shown.

[0021] Figure 10 yes Figure 7 The end view of the stacked coil component is shown.

[0022] Figure 11 yes Figure 7 An exploded perspective view of the stacked coil component shown.

[0023] Figure 12 yes Figure 7 A top view of the stacked coil component shown. Detailed Implementation

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the description of the drawings, the same or equivalent elements are labeled with the same symbols, and repeated descriptions are omitted.

[0025] [First Implementation Method] Refer to Figures 1-4 The laminated coil component of the first embodiment will be described. Figure 1 This is a perspective view of the stacked coil component according to the first embodiment. Figure 2 yes Figure 1 A three-dimensional view of the stacked coil component shown. Figure 3 yes Figure 1 The side view of the stacked coil component shown. Figure 4 yes Figure 1 The diagram shows the end face of the stacked coil. (As shown) Figures 1-4 As shown, the stacked coil component 1 of the first embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5, a first connecting conductor 6 and a second connecting conductor 7. Figures 1-4 In the diagram, for ease of explanation, the base body 2 is represented by a dashed line.

[0026] Substrate 2 is rectangular in shape. The rectangular shape includes both cuboids with chamfered corners and edges, and cuboids with rounded corners and edges. Substrate 2 has a pair of end faces 2a and 2b, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f as its outer surfaces. End faces 2a and 2b are opposite each other. Main faces 2c and 2d are opposite each other. Side faces 2e and 2f are opposite each other. Hereinafter, the relative direction of main faces 2c and 2d is designated as the first direction D1, the relative direction of end faces 2a and 2b as the second direction D2, and the relative direction of side faces 2e and 2f as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately orthogonal to each other.

[0027] End faces 2a and 2b extend along a first direction D1, connecting to main faces 2c and 2d. End faces 2a and 2b also extend along a third direction D3, connecting to side faces 2e and 2f. Main faces 2c and 2d extend along a second direction D2, connecting to end faces 2a and 2b. Main faces 2c and 2d also extend along a third direction D3, connecting to side faces 2e and 2f. Side faces 2e and 2f extend along a first direction D1, connecting to main faces 2c and 2d. Side faces 2e and 2f also extend along a second direction D2, connecting to end faces 2a and 2b.

[0028] Main surface 2d (a main surface) is a mounting surface, for example, when the laminated coil component 1 is mounted to other electronic devices (e.g., circuit substrates or laminated electronic components) not shown, it is the surface opposite to the other electronic devices. End surfaces 2a and 2b are surfaces that are continuous from the mounting surface (i.e., main surface 2d).

[0029] The length of component 2 in the second direction D2 is longer than the length of component 2 in the first direction D1 and the length of component 2 in the third direction D3. The length of component 2 in the first direction D1 is longer than the length of component 2 in the third direction D3. That is, in this embodiment, the end faces 2a and 2b, the main faces 2c and 2d, and the side faces 2e and 2f are rectangular. The length of component 2 in the second direction D2 can be equal to or shorter than the length of component 2 in the first direction D1 and the length of component 2 in the third direction D3.

[0030] Furthermore, in this embodiment, "equal" can mean not only equal, but also values ​​that include minor differences or manufacturing errors within a predetermined range. For example, if multiple values ​​are within ±5% of the average of those values, then those multiple values ​​are defined as equal.

[0031] Substrate 2 has multiple substrate layers (insulator layers) 10a to 10x stacked on the first direction D1 (refer to) Figure 5 The substrate 2 is formed by stacking multiple substrate layers 10a to 10x in a direction that is the first direction D1. The specific stacking structure will be described later. In the actual substrate 2, the boundaries between the multiple substrate layers 10a to 10x are integrated to the point that they are not visually distinguishable. Substrate layers 10a to 10x are, for example, composed of magnetic materials (Ni-Cu-Zn ferrite materials, Ni-Cu-Zn-Mg ferrite materials, or Ni-Cu ferrite materials, etc.). The magnetic materials constituting substrate layers 10a to 10x may also include Fe alloys, etc. Substrate layers 10a to 10x may also be composed of non-magnetic materials (glass ceramic materials, dielectric materials, etc.).

[0032] The first terminal electrode 3 and the second terminal electrode 4 are respectively disposed on the body 2. The first terminal electrode 3 consists of a first terminal electrode layer 18x (refer to...). Figure 5The second terminal electrode 4 is composed of a second terminal electrode layer 19x (refer to...). Figure 5 The substrate 2 is configured such that a first terminal electrode 3 and a second terminal electrode 4 are respectively disposed on the main surface 2d of the substrate 2. The first terminal electrode 3 and the second terminal electrode 4 are separated from each other in the second direction D2 and are disposed on the substrate 2. Specifically, the first terminal electrode 3 is disposed on the end surface 2a side of the substrate 2. The second terminal electrode 4 is disposed on the end surface 2b side of the substrate 2.

[0033] The first terminal electrode 3 and the second terminal electrode 4 are both rectangular in shape. The first terminal electrode 3 and the second terminal electrode 4 are arranged such that their long sides are along a third direction D3 and their short sides are along a second direction D2. That is, each side of the first terminal electrode 3 and the second terminal electrode 4 is parallel to the end faces 2a and 2b or the side faces 2e and 2f. Figure 3 and Figure 4 As shown, the first terminal electrode 3 and the second terminal electrode 4 protrude further than the main surface 2d. That is, in this embodiment, the surfaces of the first terminal electrode 3 and the second terminal electrode 4 are not on the same surface as the main surface 2d.

[0034] On each of the first terminal electrode 3 and the second terminal electrode 4, a plating layer (not shown) containing, for example, Ni, Sn, Au, etc., may be provided by electrolytic plating or non-electrolytic plating. The plating layer may also have, for example, a Ni plating film containing Ni and covering the first terminal electrode 3 and the second terminal electrode 4, and an Au plating film containing Au and covering the Ni plating film.

[0035] Coil 5 is housed within body 2. Coil 5 consists of multiple coil conductor layers 12b to 12v (refer to...). Figure 5 The coil 5 is constructed by interconnecting multiple coil conductor layers 12b to 12v within the body 2. The coil axis of the coil 5 is arranged along a first direction D1. Viewed from the first direction D1, the coil conductor layers 12b to 12v are arranged in a manner that at least partially overlaps each other. Viewed from the first direction D1, the coil 5 is approximately parallelogram-shaped. Viewed from the first direction D1, the coil 5 does not contain any acute angles (less than 90°). The multiple coil conductor layers 12b to 12v are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 12b to 12v are separated from the end faces 2a and 2b, the main faces 2c and 2d, and the side faces 2e and 2f.

[0036] A first connecting conductor 6 is disposed within the body 2. The first connecting conductor 6 connects the first terminal electrode 3 to the coil 5. The first connecting conductor 6 is a through-hole conductor. The first connecting conductor 6 extends along a first direction D1 and connects to one end of the first terminal electrode 3 and the coil 5. Specifically, the end of the first connecting conductor 6 on the main surface 2c (another main surface) side in the first direction D1 is connected to the end of the coil 5 located on the main surface 2c side. The first connecting conductor 6 consists of multiple first connecting conductor layers 14b to 14w (see reference). Figure 5 The first connecting conductor 6 is positioned outside the coil 5 when viewed from the first direction D1. Specifically, when viewed from the first direction D1, the first connecting conductor 6 is positioned at a corner. More specifically, the first connecting conductor 6 is positioned at the corner formed by the end face 2a and the side face 2e. The cross-section of the first connecting conductor 6 orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is triangular in shape. That is, the first connecting conductor 6 is triangular prism-shaped. The triangular shape includes, for example, shapes with chamfered corners and shapes with rounded corners.

[0037] The first connecting conductor 6, in a cross-section orthogonal to the first direction D1, has a hypotenuse intersecting the second direction D2 and the third direction D3. That is, the first connecting conductor 6, in a cross-section orthogonal to the first direction D1, has a hypotenuse intersecting end faces 2a and 2b and side faces 2e and 2f. Figure 6 As shown, in this embodiment, the first connecting conductor 6 has a triangular cross-section, therefore it has a first side 6a, a second side 6b, and a third side 6c. The third side 6c is a hypotenuse (the first hypotenuse). In this embodiment, the first side 6a is parallel to the long side of the first terminal electrode 3 (the side along the second direction D2). The second side 6b is parallel to the short side of the first terminal electrode 3 (the side along the third direction D3).

[0038] The second connecting conductor 7 is disposed within the body 2. The second connecting conductor 7 connects the second terminal electrode 4 and the coil 5. The second connecting conductor 7 is a through-hole conductor. The second connecting conductor 7 extends along the first direction D1 and connects to the other end of the second terminal electrode 4 and the coil 5. Specifically, the end of the second connecting conductor 7 on the main surface 2c side in the first direction D1 connects to the other end of the coil 5 located on the main surface 2d side. The second connecting conductor 7 consists of multiple second connecting conductor layers 16v, 16w (refer to...). Figure 5The second connecting conductor 7 is positioned outside the coil 5 when viewed from the first direction D1. Specifically, when viewed from the first direction D1, the second connecting conductor 7 is positioned at a corner. More specifically, the second connecting conductor 7 is positioned at the corner formed by the end face 2b and the side face 2f. That is, the second connecting conductor 7 is positioned diagonally opposite to the first connecting conductor 6. The cross-section of the second connecting conductor 7 orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is triangular in shape. That is, the second connecting conductor 7 is triangular prism-shaped.

[0039] The second connecting conductor 7 has a hypotenuse in its cross-section orthogonal to the first direction D1, intersecting the second direction D2 and the third direction D3. That is, the second connecting conductor 7 has a hypotenuse in its cross-section orthogonal to the first direction D1, intersecting the end faces 2a and 2b and the side faces 2e and 2f. In this embodiment, because the cross-section of the second connecting conductor 7 is triangular, it has a first side 7a, a second side 7b, and a third side 7c. The third side 7c is a hypotenuse (the second hypotenuse). In this embodiment, the first side 7a is parallel to the long side of the second terminal electrode 4. The second side 7b is parallel to the short side of the second terminal electrode 4.

[0040] Figure 5 This is an exploded perspective view of the stacked coil components. For example... Figure 5 As shown, the stacked coil component 1 has multiple layers La, Lb, Lc, Ld, Le, Lf, Lg, Lh, Li, Lj, Lk, Ll, Lm, Ln, Lo, Lp, Lq, Lr, Ls, Lt, Lu, Lv, Lw, and Lx. The stacked coil component 1 is constructed, for example, by sequentially stacking layers La to Lx from the main surface 2c side. Layers Lc, Lf, Li, Ll, Lo, Lr, and Lu have the same structure. Layers Ld, Lg, Lj, Lm, Lp, and Ls have the same structure. Layers Le, Lh, Lk, Ln, Lq, and Lt have the same structure.

[0041] Layer La is composed of base layer 10a.

[0042] Layer Lb is constructed by combining the base layer 10b, the coil conductor layer 12b, and the first connecting conductor layer 14b. The coil conductor layer 12b and the first connecting conductor layer 14b are formed as a single unit. A defect Rb is provided in the base layer 10b, which has a shape corresponding to the coil conductor layer 12b and the first connecting conductor layer 14b, and is embedded in the coil conductor layer 12b and the first connecting conductor layer 14b. The base layer 10b, the coil conductor layer 12b, and the first connecting conductor layer 14b are complementary to each other.

[0043] Layer Lc is constructed by combining the base layer 10c, the coil conductor layer 12c, and the first connecting conductor layer 14c. A defect Rc is provided in the base layer 10c, which has a shape corresponding to the coil conductor layer 12c and the first connecting conductor layer 14c, and is embedded within them. The base layer 10c, the coil conductor layer 12c, and the first connecting conductor layer 14c are complementary to each other.

[0044] Layer Ld is constructed by combining the base layer 10d, the coil conductor layer 12d, and the first connecting conductor layer 14d. A defect Rd is provided in the base layer 10d, which has a shape corresponding to the coil conductor layer 12d and the first connecting conductor layer 14d, and is embedded within them. The base layer 10d, the coil conductor layer 12d, and the first connecting conductor layer 14d are complementary to each other.

[0045] Layer Le is constructed by combining the base layer 10e, the coil conductor layer 12e, and the first connecting conductor layer 14e. A defect Re is provided in the base layer 10e, the defect Re having a shape corresponding to the coil conductor layer 12e and the first connecting conductor layer 14e, and the coil conductor layer 12e and the first connecting conductor layer 14e are embedded therein. The base layer 10e, the coil conductor layer 12e, and the first connecting conductor layer 14e are complementary to each other.

[0046] Layer Lf is constructed by combining the base layer 10f, the coil conductor layer 12f, and the first connecting conductor layer 14f. A defect Rf is provided in the base layer 10f. Layer Lg is constructed by combining the base layer 10g, the coil conductor layer 12g, and the first connecting conductor layer 14g. A defect Rg is provided in the base layer 10g. Layer Lh is constructed by combining the base layer 10h, the coil conductor layer 12h, and the first connecting conductor layer 14h. A defect Rh is provided in the base layer 10h.

[0047] Layer Li is constructed by combining the base layer 10i, the coil conductor layer 12i, and the first connecting conductor layer 14i. A defect Ri is provided in the base layer 10i. Layer Lj is constructed by combining the base layer 10j, the coil conductor layer 12j, and the first connecting conductor layer 14j. A defect Rj is provided in the base layer 10j. Layer Lk is constructed by combining the base layer 10k, the coil conductor layer 12k, and the first connecting conductor layer 14k. A defect Rk is provided in the base layer 10k.

[0048] Layer L1 is constructed by combining the base layer 10l, the coil conductor layer 12l, and the first connecting conductor layer 14l. A defect Rl is provided in the base layer 10l. Layer Lm is constructed by combining the base layer 10m, the coil conductor layer 12m, and the first connecting conductor layer 14m. A defect Rm is provided in the base layer 10m. Layer Ln is constructed by combining the base layer 10n, the coil conductor layer 12n, and the first connecting conductor layer 14n. A defect Rn is provided in the base layer 10n.

[0049] Layer Lo is constructed by combining the base layer 10o, the coil conductor layer 12o, and the first connecting conductor layer 14o. A defect Ro is provided in the base layer 10o. Layer Lp is constructed by combining the base layer 10p, the coil conductor layer 12p, and the first connecting conductor layer 14p. A defect Rp is provided in the base layer 10p. Layer Lq is constructed by combining the base layer 10q, the coil conductor layer 12q, and the first connecting conductor layer 14q. A defect Rq is provided in the base layer 10q.

[0050] Layer Lr is constructed by combining the base layer 10r, the coil conductor layer 12r, and the first connecting conductor layer 14r. A defect Rr is provided in the base layer 10r. Layer Ls is constructed by combining the base layer 10s, the coil conductor layer 12s, and the first connecting conductor layer 14s. A defect Rs is provided in the base layer 10s. Layer Lt is constructed by combining the base layer 10t, the coil conductor layer 12t, and the first connecting conductor layer 14t. A defect Rt is provided in the base layer 10t. Layer Lu is constructed by combining the base layer 10u, the coil conductor layer 12u, and the first connecting conductor layer 14u. A defect Ru is provided in the base layer 10u.

[0051] Layer Lv is constructed by combining a base layer 10v, a coil conductor layer 12v, a first connecting conductor layer 14v, and a second connecting conductor layer 16v. The coil conductor layer 12v and the second connecting conductor layer 16v are formed as a single unit. A defect Rv is provided in the base layer 10v, which has a shape corresponding to the coil conductor layer 12v, the first connecting conductor layer 14v, and the second connecting conductor layer 16v, and is embedded within them. The base layer 10v, the coil conductor layer 12v, the first connecting conductor layer 14v, and the second connecting conductor layer 16v are complementary to each other. In this embodiment, although not shown in the figure, multiple layers Lv are stacked.

[0052] Layer Lw is constructed by combining a base layer 10w, a first connecting conductor layer 14w, and a second connecting conductor layer 16w. A defect Rw is provided in the base layer 10w, the defect Rw having a shape corresponding to the first connecting conductor layer 14w and the second connecting conductor layer 16w, and is embedded within the first connecting conductor layer 14w and the second connecting conductor layer 16w. The base layer 10w and the first connecting conductor layer 14w and the second connecting conductor layer 16w are complementary to each other.

[0053] Layer Lx is constructed by combining a substrate layer 10x, a first terminal electrode layer 18x, and a second terminal electrode layer 19x. A defect Rx is provided in the substrate layer 10x, the defect Rx having a shape corresponding to the first terminal electrode layer 18x and the second terminal electrode layer 19x, and is embedded within the first terminal electrode layer 18x and the second terminal electrode layer 19x. The substrate layer 10x and the first terminal electrode layer 18x and the second terminal electrode layer 19x are complementary to each other.

[0054] The width of the defective portions Rb to Rx (hereinafter referred to as the width of the defective portions) is generally set to be wider than the width of the coil conductor layers 12b to 12v, the first connecting conductor layers 14b to 14w, the second connecting conductor layers 16v and 16w, the first terminal electrode layer 18x, and the second terminal electrode layer 19x (hereinafter referred to as the width of the conductor portions). In order to improve the adhesion between the base layers 10b to 10x and the coil conductor layers 12b to 12v, the first connecting conductor layers 14b to 14w, the second connecting conductor layers 16v and 16w, the first terminal electrode layer 18x, and the second terminal electrode layer 19x, the width of the defective portions may also be intentionally set to be narrower than the width of the conductor portions. The value of subtracting the width of the conductor portion from the width of the defective portion is preferably -3 μm or more and 10 μm or less, and more preferably 0 μm or more and 10 μm or less.

[0055] Figure 6 yes Figure 1 A top view of the stacked coil assembly shown. Figure 6 The image shows the state of the main surface 2c of the laminated coil component 1 as viewed from the first direction D1. Figure 6 In the diagram, for ease of explanation, the base body 2 is represented by a dashed line, and the diagrams of the coil conductor layer 12b and coil conductor layer 12v of the coil 5 are omitted.

[0056] like Figure 6As shown, in the stacked coil component 1, viewed from the first direction D1, the coil 5 is arranged opposite to the third side 6c of the first connecting conductor 6. Viewed from the first direction D1, in the portion of the coil 5 opposite to the third side 6c of the first connecting conductor 6, the side 5a opposite to the third side 6c is parallel to the third side 6c. In this embodiment, a portion of each of the coil conductor layers 12d, 12g, 12j, 12m, 12p, 12s, and 12v constituting the coil 5 is opposite to the third side 6c of the first connecting conductor 6. In each of the coil conductor layers 12d, 12g, 12j, 12m, 12p, 12s, and 12v, the side opposite to the third side 6c of the first connecting conductor 6 is parallel to the third side 6c. Parallelism also includes the concept of approximate parallelism, which includes not only the case where the two sides are strictly parallel, but also the case where the angle formed by the two sides is within 15°.

[0057] In the stacked coil assembly 1, viewed from the first direction D1, the coil 5 is arranged opposite to the third side 7c of the second connecting conductor 7. In the stacked coil assembly 1, viewed from the first direction D1, in the portion of the coil 5 opposite to the third side 7c of the second connecting conductor 7, the side 5b opposite to the third side 7c is parallel to the third side 7c. In this embodiment, a portion of each of the coil conductor layers 12b, 12e, 12h, 12k, 12n, 12q, and 12t constituting the coil 5 is opposite to the third side 7c of the second connecting conductor 7. In each of the coil conductor layers 12b, 12e, 12h, 12k, 12n, 12q, and 12t, the side opposite to the third side 7c of the second connecting conductor 7 is parallel to the third side 7c. Furthermore, in the second connecting conductor 7, when viewed from the first direction D1, the third side 7c of the second connecting conductor 7 and a portion of each of the coil conductor layers 12b, 12e, 12h, 12k, 12n, 12q, and 12t are opposite each other on the plane.

[0058] An example of a method for manufacturing the laminated coil component 1 according to the embodiment will be described.

[0059] First, a substrate forming layer is formed by coating the constituent materials of the substrate layers 10a to 10x and a substrate paste containing a photosensitive material onto a substrate (e.g., a PET film). The photosensitive material contained in the substrate paste can be either negative or positive, and a known material can be used. Next, the substrate forming layer is exposed and developed, for example, using a Cr mask photolithography method, to form a substrate pattern on the substrate with the shape corresponding to the shape of the conductor forming layer described later removed. The substrate pattern becomes the substrate layers 10a to 10x after heat treatment. That is, a substrate pattern is formed with defect portions Rb to Rx provided. Furthermore, the "photolithography method" of this embodiment is not limited to any type of mask, as long as the desired pattern can be processed by exposing and developing the layer containing the photosensitive material.

[0060] On the other hand, a conductor forming layer is formed by coating the constituent materials of the coil conductor layers 12b-12v, the first connecting conductor layers 14b-14w, the second connecting conductor layers 16v, 16w, the first terminal electrode layer 18x, and the second terminal electrode layer 19x, and a conductor paste containing a photosensitive material onto a substrate (e.g., a PET film). The photosensitive material contained in the conductor paste can be either negative or positive, and known materials can be used. Next, the conductor forming layer is exposed and developed, for example, using a Cr mask photolithography method, to form a conductor pattern on the substrate. The conductor pattern is the layer that, after heat treatment, becomes the coil conductor layers 12b-12v, the first connecting conductor layers 14b-14v, the second connecting conductor layers 16v, 16w, the first terminal electrode layer 18x, and the second terminal electrode layer 19x.

[0061] Next, the substrate forming layer is transferred from the substrate to the support. The substrate forming layer is a layer that becomes layer La after heat treatment.

[0062] Next, the conductor pattern and the substrate pattern are repeatedly transferred onto the support, and then laminated on the third-direction D3. Specifically, first, the conductor pattern is transferred from the substrate to the substrate forming layer. Next, the substrate pattern is transferred from the substrate to the substrate forming layer. The defects in the conductor pattern and the substrate pattern are combined, and the substrate pattern and the conductor pattern become a single layer on the substrate forming layer. Furthermore, the transfer process of the conductor pattern and the substrate pattern is repeated, and the conductor pattern and the substrate pattern are laminated in a combined state. Thus, layers Lb to Lx are laminated after heat treatment.

[0063] Next, the substrate forming layer is transferred from the substrate onto the layer that has been laminated through the transfer process of the conductor pattern and the substrate pattern. The substrate forming layer becomes layer La after heat treatment.

[0064] Based on the above description, after heat treatment, the laminated body constituting the laminated coil component 1 is formed on the support. Next, the obtained laminated body is cut to a predetermined size. Afterwards, the cut laminated body undergoes adhesive removal treatment, followed by heat treatment. The heat treatment temperature is, for example, around 850–900°C. If necessary, electrolytic plating or non-electrolytic plating can be performed on the first terminal electrode 3 and the second terminal electrode 4 after heat treatment to form a plating layer.

[0065] As described above, in the stacked coil component 1 of this embodiment, the first connecting conductor 6 connects one end of the coil 5 located on the main surface 2d side to the first terminal electrode 3 and extends along the first direction D1. In this structure, because the area (region) between the first connecting conductor 6 and the coil 5 is larger, the influence on characteristics caused by stray capacitance may be greater. In the stacked coil component 1, viewed from the first direction D1, the coil 5 is opposite to the third side 6c of the first connecting conductor 6, and in the portion opposite to the third side 6c of the first connecting conductor 6, the side 5a opposite to the third side 6c is parallel to the third side 6c. Therefore, in the stacked coil component 1, because a certain distance can be ensured between the first connecting conductor 6 and the coil 5, the formation of stray capacitance between the coil 5 and the first connecting conductor 6 can be suppressed. In addition, in this structure, the diameter of the coil 5 can be increased. Moreover, in the stacked coil component 1, no corner is formed in the portion where the coil 5 is opposite to the first connecting conductor 6. Therefore, in the stacked coil component 1, the decrease in DC overlap characteristics caused by the concentration of magnetic flux in the corner can be suppressed. Therefore, in the stacked coil component 1, the generation of stray capacitance is suppressed, and the characteristics are improved.

[0066] In the stacked coil component 1 of this embodiment, viewed from the first direction D1, the coil 5 is opposite to the third side 7c of the second connecting conductor 7, and in the portion opposite to the third side 7c of the second connecting conductor 7, the side 5b opposite to the third side 7c is parallel to the third side 7c. In this structure, because a certain distance can be ensured between the second connecting conductor 7 and the coil 5, the formation of stray capacitance between the coil 5 and the second connecting conductor 7 can be suppressed.

[0067] In this embodiment, when viewed from a third direction (D3) in the laminated coil component 1, the first terminal electrode 3 and the second terminal electrode 4 are both rectangular in shape. The first terminal electrode 3 and the second terminal electrode 4 are arranged such that each side is parallel to the end faces 2a, 2b or the side faces 2e, 2f. In the laminated coil component 1, the first side 6a and the second side 6b of the first connecting conductor 6 (excluding the third side 6c) are parallel to each side of the first terminal electrode 3. This structure allows for an increase in the inner diameter of the coil 5.

[0068] [Second Embodiment] Next, refer to Figures 7-10The laminated coil component of the second embodiment will be described. Figure 7 This is a perspective view of the stacked coil component according to the second embodiment. Figure 8 yes Figure 7 A three-dimensional view of the stacked coil component shown. Figure 9 yes Figure 7 The side view of the stacked coil component shown. Figure 10 yes Figure 7 The diagram shows the end face of the stacked coil. (As shown) Figures 7-10 As shown, the stacked coil component 1A of the second embodiment includes a body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5A, a first connecting conductor 6A and a second connecting conductor 7A. Figures 7-10 In the diagram, for ease of explanation, the base body 2 is represented by a dashed line.

[0069] Substrate 2 has multiple substrate layers (insulator layers) 20a~20x stacked on the first direction D1 (refer to) Figure 11 It is formed by ).

[0070] Coil 5A is housed within body 2. Coil 5A consists of multiple coil conductor layers 22b to 22v (see reference). Figure 11 The coil 5A is constructed by interconnecting multiple coil conductor layers 22b to 22v within the body 2. The coil axis of coil 5A is arranged along a first direction D1. Viewed from the first direction D1, the coil conductor layers 22b to 22v are arranged in a manner that at least partially overlaps each other. Viewed from the first direction D1, coil 5A is approximately parallelogram-shaped. Viewed from the first direction D1, coil 5A does not contain any acute angles (less than 90°). The multiple coil conductor layers 22b to 22v are made of a conductive material (e.g., Ag or Pd). The coil conductor layers 22b to 22v are separated from end faces 2a and 2b, main faces 2c and 2d, and side faces 2e and 2f.

[0071] A first connecting conductor 6A is disposed within the body 2. The first connecting conductor 6A connects the first terminal electrode 3 to the coil 5A. The first connecting conductor 6A extends along a first direction D1 and is connected to one end of the first terminal electrode 3 and one end of the coil 5A. Specifically, the end of the first connecting conductor 6A on the main surface 2c side in the first direction D1 is connected to the end of the coil 5A located on the main surface 2c side. The first connecting conductor 6A consists of multiple first connecting conductor layers 24b to 24v (see reference). Figure 11The first connecting conductor 6A is positioned outside the coil 5A when viewed from the first direction D1. Specifically, when viewed from the first direction D1, the first connecting conductor 6A is positioned at a corner. More specifically, the first connecting conductor 6A is positioned at the corner formed by the end face 2a and the side face 2e. The cross-section of the first connecting conductor 6A orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is polygonal (pentagonal). That is, the first connecting conductor 6A is polygonal prism-shaped. The polygonal shape includes, for example, shapes with chamfered corners and shapes with rounded corners.

[0072] The first connecting conductor 6A, in a cross-section orthogonal to the first direction D1, has a hypotenuse intersecting the second direction D2 and the third direction D3. That is, the first connecting conductor 6A, in a cross-section orthogonal to the first direction D1, has a hypotenuse intersecting end faces 2a and 2b and side faces 2e and 2f. For example... Figure 12 As shown, in this embodiment, the first connecting conductor 6A has a pentagonal cross-section, therefore it has a first side 6Aa, a second side 6Ab, a third side 6Ac, a fourth side 6Ad, and a fifth side 6Ae. The fourth side 6Ad is the hypotenuse (the first hypotenuse). In this embodiment, the first side 6Aa is parallel to the long side of the first terminal electrode 3 (the side along the third direction D3). The second side 6Ab is parallel to the short side of the first terminal electrode 3 (the side along the second direction D2).

[0073] The second connecting conductor 7A is disposed within the body 2. The second connecting conductor 7A connects the second terminal electrode 4 to the coil 5A. The second connecting conductor 7A extends along the first direction D1 and connects to the other end of the second terminal electrode 4 and the coil 5A. Specifically, the end of the second connecting conductor 7A on the main surface 2c side in the first direction D1 is connected to the other end of the coil 5A located on the main surface 2d side. The second connecting conductor 7A consists of multiple second connecting conductor layers 26v (see reference). Figure 11 The second connecting conductor 7A is positioned outside the coil 5A when viewed from the first direction D1. Specifically, when viewed from the first direction D1, the second connecting conductor 7A is positioned at a corner. More specifically, the second connecting conductor 7A is positioned at the corner formed by the end face 2b and the side face 2f. That is, the second connecting conductor 7A is positioned diagonally opposite to the first connecting conductor 6A. The cross-section of the second connecting conductor 7A orthogonal to the extending direction (first direction D1) (the cross-section along the second direction D2 and the third direction D3) is polygonal in shape (pentagonal). That is, the second connecting conductor 7A is polygonal prism-shaped.

[0074] The second connecting conductor 7A has a hypotenuse in its cross-section orthogonal to the first direction D1, intersecting the second direction D2 and the third direction D3. That is, the second connecting conductor 7A has a hypotenuse in its cross-section orthogonal to the first direction D1, intersecting the end faces 2a and 2b and the side faces 2e and 2f. In this embodiment, the second connecting conductor 7A has a pentagonal cross-section, therefore it has a first side 7Aa, a second side 7Ab, a third side 7Ac, a fourth side 7Ad, and a fifth side 7Ae. The fourth side 7Ad is a hypotenuse (the second hypotenuse). In this embodiment, the first side 7Aa is parallel to the long side of the first terminal electrode 3. The second side 7Ab is parallel to the short side of the first terminal electrode 3.

[0075] Figure 11 This is an exploded perspective view of the stacked coil components. For example... Figure 11 As shown, the stacked coil component 1A includes multiple layers LAa, LAb, LAc, LAd, LAe, LAf, LAg, LAh, LAi, LAj, LAk, LAl, LAm, LAn, LAo, LAp, LAq, LAr, LAs, LAt, LAu, LAv, LAw, and LAx. The stacked coil component 1A is constructed, for example, by sequentially stacking layers LAa to LAx from the main surface 2c side. Layers LAc, LAf, LAi, LAl, LAo, LAr, and LAu have the same structure. Layers LAd, LAg, LAj, LAm, LAp, and LAs have the same structure. Layers LAe, LAh, LAk, LAn, LAq, and LAt have the same structure.

[0076] Layer LAa consists of base layer 20a.

[0077] Layer LAb is constructed by combining the base layer 20b, the coil conductor layer 22b, and the first connecting conductor layer 24b. The coil conductor layer 22b and the first connecting conductor layer 24b are formed as a single unit. A defect RAb is provided in the base layer 20b, which has a shape corresponding to the coil conductor layer 22b and the first connecting conductor layer 24b, and is embedded in the coil conductor layer 22b and the first connecting conductor layer 24b. The base layer 20b, the coil conductor layer 22b, and the first connecting conductor layer 24b are complementary to each other.

[0078] Layer LAc is constructed by combining the base layer 20c, the coil conductor layer 22c, and the first connecting conductor layer 24c. A defect RAc is provided in the base layer 20c, which has a shape corresponding to the coil conductor layer 22c and the first connecting conductor layer 24c, and is embedded within them. The base layer 20c, the coil conductor layer 22c, and the first connecting conductor layer 24c are complementary to each other.

[0079] Layer LAd is constructed by combining the base layer 20d, the coil conductor layer 22d, and the first connecting conductor layer 24d. A defect RAd is provided in the base layer 20d, which has a shape corresponding to the coil conductor layer 22d and the first connecting conductor layer 24d, and is embedded within them. The base layer 20d, the coil conductor layer 22d, and the first connecting conductor layer 24d are complementary to each other.

[0080] Layer LAe is constructed by combining the base layer 20e, the coil conductor layer 22e, and the first connecting conductor layer 24e. A defect RAe is provided in the base layer 20e, the defect RAe having a shape corresponding to the coil conductor layer 22e and the first connecting conductor layer 24e, and is embedded within the coil conductor layer 22e and the first connecting conductor layer 24e. The base layer 20e, the coil conductor layer 22e, and the first connecting conductor layer 24e are complementary to each other.

[0081] Layer LAf is constructed by combining the base layer 20f, the coil conductor layer 22f, and the first connecting conductor layer 24f. A defect RAf is provided in the base layer 20f. Layer LAg is constructed by combining the base layer 20g, the coil conductor layer 22g, and the first connecting conductor layer 24g. A defect RAg is provided in the base layer 20g. Layer LAh is constructed by combining the base layer 20h, the coil conductor layer 22h, and the first connecting conductor layer 24h. A defect RAh is provided in the base layer 20h.

[0082] Layer LAi is constructed by combining the base layer 20i, the coil conductor layer 22i, and the first connecting conductor layer 24i. A defect RAi is provided in the base layer 20i. Layer LAj is constructed by combining the base layer 20j, the coil conductor layer 22j, and the first connecting conductor layer 24j. A defect RAj is provided in the base layer 20j. Layer LAk is constructed by combining the base layer 20k, the coil conductor layer 22k, and the first connecting conductor layer 24k. A defect RAk is provided in the base layer 20k.

[0083] Layer LA1 is constructed by combining the base layer 20l, the coil conductor layer 22l, and the first connecting conductor layer 24l. A defect RA1 is provided in the base layer 20l. Layer LAm is constructed by combining the base layer 20m, the coil conductor layer 22m, and the first connecting conductor layer 24m. A defect RAm is provided in the base layer 20m. Layer LAn is constructed by combining the base layer 20n, the coil conductor layer 22n, and the first connecting conductor layer 24n. A defect RAn is provided in the base layer 20n.

[0084] Layer LAo is constructed by combining the base layer 20o, the coil conductor layer 22o, and the first connecting conductor layer 24o. A defect RAo is provided in the base layer 20o. Layer LAp is constructed by combining the base layer 20p, the coil conductor layer 22p, and the first connecting conductor layer 24p. A defect RAp is provided in the base layer 20p. Layer LAq is constructed by combining the base layer 20q, the coil conductor layer 22q, and the first connecting conductor layer 24q. A defect RAq is provided in the base layer 20q.

[0085] Layer LAr is constructed by combining the base layer 20r, the coil conductor layer 22r, and the first connecting conductor layer 24r. A defect RAr is provided in the base layer 20r. Layer LAs is constructed by combining the base layer 20s, the coil conductor layer 22s, and the first connecting conductor layer 24s. A defect RAs is provided in the base layer 20s. Layer LAt is constructed by combining the base layer 20t, the coil conductor layer 22t, and the first connecting conductor layer 24t. A defect RAt is provided in the base layer 20t. Layer LAu is constructed by combining the base layer 20u, the coil conductor layer 22u, and the first connecting conductor layer 24u. A defect RAu is provided in the base layer 20u.

[0086] Layer LAv is constructed by combining a base layer 20v, a coil conductor layer 22v, a first connecting conductor layer 24v, and a second connecting conductor layer 26v. The coil conductor layer 22v and the second connecting conductor layer 26v are formed integrally. A defect RAv is provided in the base layer 20v, which has a shape corresponding to the coil conductor layer 22v, the first connecting conductor layer 24v, and the second connecting conductor layer 26v, and is embedded within them. The base layer 20v and the coil conductor layer 22v, the first connecting conductor layer 24v, and the second connecting conductor layer 26v are complementary to each other. In this embodiment, although the figures are omitted, multiple layers LAv are stacked.

[0087] Layer LAw is constructed by combining a base layer 20w, a first connecting conductor layer 24w, and a second connecting conductor layer 26w. A defect RAw is provided in the base layer 20w, which has a shape corresponding to the first connecting conductor layer 24w and the second connecting conductor layer 26w, and is embedded within the first connecting conductor layer 24w and the second connecting conductor layer 26w. The base layer 20w and the first connecting conductor layer 24w and the second connecting conductor layer 26w are complementary to each other.

[0088] Layer LAx is constructed by combining a substrate layer 20x, a first terminal electrode layer 28x, and a second terminal electrode layer 29x. A defect RAx is provided in the substrate layer 20x, the defect RAx having a shape corresponding to the first terminal electrode layer 28x and the second terminal electrode layer 29x, and is embedded within the first terminal electrode layer 28x and the second terminal electrode layer 29x. The substrate layer 20x and the first terminal electrode layer 28x and the second terminal electrode layer 29x are complementary to each other.

[0089] Figure 12 yes Figure 7 A top view of the stacked coil assembly shown. Figure 12 The image shows the state of the main surface 2c of the laminated coil component 1A as viewed from the first direction D1. Figure 12 In the diagram, for ease of explanation, the body 2 is represented by a dashed line, and the diagrams of coil conductor layer 22b and coil conductor layer 22v of coil 5A are omitted.

[0090] like Figure 12 As shown, in the stacked coil component 1A, viewed from the first direction D1, the coil 5A is arranged opposite to the fourth side 6Ad of the first connecting conductor 6A. Viewed from the first direction D1, in the portion of the coil 5A opposite to the fourth side 6Ad of the first connecting conductor 6A, the side 5Aa opposite to the fourth side 6Ad is parallel to the fourth side 6Ad. In this embodiment, a portion of each of the coil conductor layers 22d, 22g, 22j, 22m, 22p, 22s, and 22v constituting the coil 5A is opposite to the fourth side 6Ad of the first connecting conductor 6A. In each of the coil conductor layers 22d, 22g, 22j, 22m, 22p, 22s, and 22v, the side opposite to the fourth side 6Ad of the first connecting conductor 6A is parallel to the fourth side 6Ad.

[0091] In the stacked coil component 1A, viewed from the first direction D1, the coil 5A is arranged opposite to the fourth side 7Ad of the second connecting conductor 7A. In the stacked coil component 1A, viewed from the first direction D1, in the portion of the coil 5A opposite to the fourth side 7Ad of the second connecting conductor 7A, the side 5Ab opposite to the fourth side 7Ad is parallel to the fourth side 7Ad. In this embodiment, a portion of each of the coil conductor layers 22b, 22e, 22h, 22k, 22n, 22q, and 22t constituting the coil 5A is opposite to the fourth side 7Ad of the second connecting conductor 7A. In each of the coil conductor layers 22b, 22e, 22h, 22k, 22n, 22q, and 22t, the side opposite to the fourth side 7Ad of the second connecting conductor 7A is parallel to the fourth side 7Ad. Furthermore, on the second connecting conductor 7A, when viewed from the first direction D1, the fourth side 7Ad of the second connecting conductor 7A and a portion of each of the coil conductor layers 22b, 22e, 22h, 22k, 22n, 22q, and 22t are opposite each other on the plane.

[0092] As described above, in the laminated coil component 1A of this embodiment, the first connecting conductor 6A connects one end of the coil 5A located on the main surface 2d side to the first terminal electrode 3 and extends along the first direction D1. In this structure, because the area (region) between the first connecting conductor 6A and the coil 5A is increased, the influence on characteristics caused by stray capacitance may be increased. In the laminated coil component 1A, viewed from the first direction D1, the coil 5A faces the fourth side 6Ad of the first connecting conductor 6A, and in the portion facing the fourth side 6Ad of the first connecting conductor 6A, the side 5Aa facing the fourth side 6Ad is parallel to the fourth side 6Ad. Therefore, in the laminated coil component 1A, because a certain distance can be ensured between the first connecting conductor 6A and the coil 5A, the formation of stray capacitance between the coil 5A and the first connecting conductor 6A can be suppressed. In addition, in this structure, the diameter of the coil 5A can be increased. Moreover, in the laminated coil component 1A, no corner is formed in the portion where the coil 5A faces the first connecting conductor 6A. Therefore, in the laminated coil component 1A, the decrease in DC overlap characteristics caused by the concentration of magnetic flux at the corner can be suppressed. Thus, in the laminated coil component 1A, the generation of stray capacitance is suppressed, and improved characteristics are achieved.

[0093] The embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments, and various modifications can be made without departing from its spirit.

[0094] In the above embodiment, the first terminal electrode 3 and the second terminal electrode 4 are described as rectangular in shape. However, the shapes of the first terminal electrode 3 and the second terminal electrode 4 are not limited to this.

[0095] In the above embodiment, the arrangement of the first connecting conductors 6, 6A and the second connecting conductors 7, 7A at diagonal positions is described as an example. However, the first connecting conductors 6, 6A and the second connecting conductors 7, 7A can also be arranged in other positions.

[0096] In the above embodiment, an example was described where the cross-sections of the first connecting conductor 6 and the second connecting conductor 7 are triangular, and the cross-sections of the first connecting conductor 6A and the second connecting conductor 7A are pentagonal. However, the cross-sections of the first connecting conductors 6 and 6A and the second connecting conductors 7 and 7A orthogonal to the first direction D1 only need to have at least a hypotenuse intersecting the second direction D2 and the third direction D3. For example, the first connecting conductors 6 and 6A and the second connecting conductors 7 and 7A could also be semi-circular, etc.

[0097] In the above embodiment, the second connecting conductors 7 and 7A are described as having beveled edges (third edge 7c and fourth edge 7Ad). However, the second connecting conductors 7 and 7A may also be in shapes without beveled edges (e.g., cylindrical, prismatic, etc.).

[0098] In the above embodiment, coil 5 was described as an example, consisting of coil conductor layers 12b to 12v. However, the number of coil conductor layers constituting coil 5 is not limited to the values ​​described above. The same applies to coil 5A.

[0099] In the above embodiment, an example of a method for manufacturing the laminated coil component 1 is shown, but the laminated coil component 1 can also be manufactured by other methods.

Claims

1. A laminated coil component, wherein provided with: a body formed by laminating a plurality of insulating layers, and having a pair of end faces opposed to each other, a pair of main faces opposed to each other, and a pair of side faces opposed to each other, and one of the main faces being a mounting face; a coil disposed in the body, a coil axis extending along a first direction as an opposite direction of the pair of main faces; a first terminal electrode and a second terminal electrode connected to the coil, and disposed on the mounting face; a first connecting conductor disposed outside the coil in the body, as viewed in the first direction, and connecting one end of the coil on the other main face side to the first terminal electrode; and a second connecting conductor connecting the other end of the coil on the one main face side to the second terminal electrode, the first connecting conductor extends along the first direction, and has a first oblique side intersecting a second direction as an opposite direction of the pair of end faces and a third direction as an opposite direction of the pair of side faces, in a cross section orthogonal to the extending direction, as viewed in the first direction, the coil opposes the first oblique side of the first connecting conductor, and in a portion opposing the first oblique side of the first connecting conductor, an edge opposing the first oblique side is parallel to the first oblique side.

2. The laminated coil component according to claim 1, wherein the first terminal electrode is disposed in a rectangular shape as viewed in the first direction, with each edge parallel to the end face or the side face, the first connecting conductor has at least three edges including the first oblique side, two edges of the first connecting conductor other than the first oblique side are parallel to the edges of the first terminal electrode.

3. The laminated coil component according to claim 1, wherein the second connecting conductor extends along the first direction, and has a second oblique side intersecting the second direction and the third direction, in a cross section orthogonal to the extending direction, as viewed in the first direction, the coil opposes the second oblique side of the second connecting conductor, and in a portion opposing the second oblique side of the second connecting conductor, an edge opposing the second oblique side is parallel to the second oblique side.

4. The laminated coil component according to claim 2, wherein the second connecting conductor extends along the first direction, and has a second oblique side intersecting the second direction and the third direction, in a cross section orthogonal to the extending direction, as viewed in the first direction, the coil opposes the second oblique side of the second connecting conductor, and in a portion opposing the second oblique side of the second connecting conductor, an edge opposing the second oblique side is parallel to the second oblique side.

5. The laminated coil component according to any one of claims 1 to 4, wherein the first connecting conductor and the second connecting conductor each have a triangular shape in a cross section orthogonal to the extending direction. ​

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