Heat Dissipation Metallized Film Capacitor and Its Installation Method

Abstract

Heat-dissipating metallized film capacitor, comprising a capacitor body, the top opening of the capacitor body is sealed by an end cover adapted thereto, and a pair of terminal blocks are vertically arranged on the top surface of the end cover; a heat-dissipating pressure ring is respectively and relatively clamped and matched with the bottom of the capacitor body and the end cover, the longitudinal section of the heat-dissipating pressure ring is an L-shaped structure, and at least eight or more heat-dissipating fins are vertically arranged at equal circumferential intervals between the outer sides of the vertical parts of the two heat-dissipating pressure rings. The present invention can increase the heat-dissipating area of the capacitor body, which is beneficial to the timely dissipation of the heat generated inside the capacitor body, and prolong the service life of the capacitor; the present invention can better adapt to the heat dissipation of large metallized film capacitors.

Description

Technical Field

[0001] The present invention belongs to the technical field of metallized film capacitors, and particularly relates to a heat-dissipating metallized film capacitor and an installation method thereof. Background Art

[0002] A metallized film capacitor is a capacitor made by using an organic plastic film as a dielectric and a metallized film as an electrode through a winding method (except for a stacked structure). The films used in metallized film capacitors include polyethylene terephthalate, polypropylene, polycarbonate, etc. In addition to the wound type, there is also a stacked type. Among them, polyester film dielectric and polypropylene film dielectric are the most widely used.

[0003] During the use of a metallized film capacitor, the capacitor will generate heat. Generally, part of the heat generated by the capacitor will be dissipated into the surrounding environment, and part of it will cause the internal heat of the capacitor. If this part of the heat is not dissipated in time, it will cause changes in the electrical properties of the capacitor, and long-term heating will cause aging of the film dielectric and a reduction in lifespan. For large metallized film capacitors, this situation is even more serious. Summary of the Invention

[0004] Aiming at the deficiencies of the existing technology, the present invention provides a heat-dissipating metallized film capacitor and an installation method thereof. The specific technical solutions are as follows:

[0005] The heat-dissipating metallized film capacitor includes a capacitor body. The top opening of the capacitor body is sealed by a mating end cap, and a pair of terminal blocks are vertically arranged on the top surface of the end cap.

[0006] Heat dissipation pressure rings are respectively and relatively clamped on the bottom of the capacitor body and the end cap. The longitudinal section of the heat dissipation pressure ring is an L-shaped structure, and at least eight or more heat dissipation fins are vertically arranged at equal circumferential intervals between the outer side surfaces of the vertical parts of the two heat dissipation pressure rings.

[0007] Furthermore, stepped grooves are symmetrically arranged at the inner side end parts of the heat dissipation fins respectively. The stepped grooves are clamped with the vertical parts of the corresponding heat dissipation pressure rings, and the inner side surfaces of the heat dissipation fins are in contact with the outer side surface of the capacitor body.

[0008] Furthermore, first card slots equal in number to the heat dissipation fins are vertically installed at equal circumferential intervals on the outer side surfaces of the two heat dissipation pressure rings respectively, and the length of the first card slot is the same as the length of the vertical part of the heat dissipation pressure ring. The inner side end part of the heat dissipation fin is clamped with the corresponding first card slot, and the two are locked and connected by corresponding bolts.

[0009] Further, a chassis with a circular structure is provided below the bottom surface of the capacitor body, and the area of the chassis is larger than the bottom surface area of the capacitor body; a plug rod is vertically connected to the middle of the bottom surface of the capacitor body, a ring-shaped flange is axially connected to the middle of the outer peripheral wall of the plug rod, the lower part of the plug rod is in interference fit with a first slot opened in the middle of the top surface of the chassis, and the ring-shaped flange is in contact with the top surface of the chassis.

[0010] Further, the first slot is of a square structure.

[0011] Further, a heat dissipation cylinder is sleeved outside the heat dissipation fins, and a second slot with the same number as the heat dissipation fins is vertically arranged at equal intervals in the circumferential direction in the middle of the inner side surface of the heat dissipation cylinder, and the second slot is in interference fit with the outer side part of the corresponding heat dissipation fin.

[0012] Further, heat dissipation holes are arranged in an array on the outer peripheral wall of the heat dissipation cylinder.

[0013] Further, at least four or more insertion pieces are vertically connected at equal intervals in the circumferential direction at the bottom edge of the heat dissipation cylinder, and the lower part of the insertion piece is in interference fit with a second slot opened on the outer edge of the top surface of the chassis.

[0014] Further, the insertion piece is of a circular arc structure, and the radian of the insertion piece is the same as the radian of the heat dissipation cylinder.

[0015] An installation method for a heat dissipation type metallized film capacitor, the method comprising the following steps:

[0016] Step S1: First, the bottom of the capacitor body and the end cover are respectively clamped with the heat dissipation pressure ring in a relative manner, and then, the end part of the inner side surface of the heat dissipation fin is locked and connected to the corresponding first slot through the bolt one by one;

[0017] Step S2: Fix the chassis to the substrate to be installed, and insert the plug rod into the first slot, so that the capacitor body is fixedly suspended with the chassis;

[0018] Step S3: The outer side part of the heat dissipation fin is clamped with the second slot of the corresponding heat dissipation cylinder, and the insertion piece of the heat dissipation cylinder is inserted into the corresponding second slot.

[0019] The beneficial effects of the present invention are:

[0020] In the present invention, heat dissipation pressure rings are respectively and relatively clamped and matched at the bottom of the capacitor body and on the end cover. At least eight or more heat dissipation fins are vertically arranged at equal intervals in the circumferential direction between the outer sides of the vertical parts of the two heat dissipation pressure rings. In this way, the heat dissipation area of the capacitor body can be increased, which is beneficial to the timely dissipation of the heat generated inside the capacitor body and prolongs the service life of the capacitor. The present invention can better adapt to the heat dissipation of large metal film capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. shows a sectional view of the assembled structure of the present invention;

[0022] Figure 2 FIG. shows a top view of the assembled structure of the present invention;

[0023] Figure 3 FIG. shows a top view of the structure of the heat dissipation pressure ring in the present invention;

[0024] Figure 4 FIG. shows a three-dimensional schematic view of the structure of the heat dissipation fin in the present invention;

[0025] Figure 5 FIG. shows a top view of the structure of the chassis in the present invention;

[0026] Figure 6 FIG. shows a three-dimensional schematic view of the structure of the heat dissipation cylinder in the present invention;

[0027] Figure 7 FIG. shows a top view of the structure of the heat dissipation cylinder in the present invention.

[0028] As shown in the figure: 1. Capacitor body; 11. End cover; 12. Wiring terminal; 13. Plug rod; 131. Ring-shaped flange; 2. Heat dissipation pressure ring; 21. First clamping groove; 22. Bolt; 3. Heat dissipation fin; 31. Step groove; 32. Screw hole; 4. Chassis; 41. First slot; 42. Second slot; 5. Heat dissipation cylinder; 51. Insert piece; 52. Second clamping groove; 53. Heat dissipation hole. DETAILED DESCRIPTION OF THE INVENTION

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] As Figure 1 and 2 shown, the heat dissipation type metallized film capacitor includes a capacitor body 1. The top opening of the capacitor body 1 is sealed by a matching end cover 11. A pair of wiring terminals 12 are vertically arranged on the top surface of the end cover 11;

[0031] A heat dissipation pressure ring 2 is respectively and relatively clamped and fitted to the bottom of the capacitor body 1 and the end cover 11. The longitudinal section of the heat dissipation pressure ring 2 is an L-shaped structure. At least eight or more heat dissipation fins 3 are vertically arranged at equal circumferential intervals between the outer sides of the vertical parts of the two heat dissipation pressure rings 2.

[0032] By adopting the above technical solution, a heat dissipation pressure ring is respectively and relatively clamped and fitted to the bottom of the capacitor body and the end cover. At least eight or more heat dissipation fins are vertically arranged at equal circumferential intervals between the outer sides of the vertical parts of the two heat dissipation pressure rings. In this way, the heat dissipation area of the capacitor body can be increased, which is beneficial to the timely dissipation of the heat generated inside the capacitor body and prolongs the service life of the capacitor.

[0033] As Figure 1 and 4 shown, stepped grooves 31 are symmetrically arranged at the inner side end parts of the heat dissipation fins 3 respectively. The stepped grooves 31 are clamped and fitted with the vertical parts of the corresponding heat dissipation pressure rings 2, and the inner sides of the heat dissipation fins 3 are in contact with the outer side of the capacitor body 1.

[0034] By adopting the above technical solution, the inner sides of the heat dissipation fins 3 are in contact with the outer side of the capacitor body 1. In this way, the contact area between the heat dissipation fins 3 and the capacitor body 1 is increased, and the heat generated inside the capacitor body 1 can be better guided and dissipated in a timely manner.

[0035] As Figure 1 and 3 shown, a first card slot 21 with the same number as the heat dissipation fins 3 is vertically installed at equal circumferential intervals on the outer sides of the two heat dissipation pressure rings 2 respectively, and the length of the first card slot 21 is the same as the length of the vertical part of the heat dissipation pressure ring 2; the inner side end part of the heat dissipation fin 3 is clamped and fitted with the corresponding first card slot 21, and the two are locked and connected by a corresponding bolt 22.

[0036] By adopting the above technical solution, the inner side end part of the heat dissipation fin 3 is clamped and fitted with the corresponding first card slot 21 and locked and connected by the bolt 22. In this way, it is not only convenient for the disassembly and replacement of the heat dissipation fins 3, but also the two heat dissipation pressure rings 2 can be well fixedly connected, which can increase the connection tightness between the end cover 11 and the capacitor body 1 and prevent the end cover 11 from being thrown out when the capacitor body 1 explodes, causing other secondary damages. Among them, the bolt 22 is screwed with a screw hole 32 opened on the inner side end part of the heat dissipation fin 3.

[0037] As Figure 1 and 5As shown, a chassis 4 with a circular structure is provided below the bottom surface of the capacitor body 1, and the area of the chassis 4 is larger than the bottom surface area of the capacitor body 1; a plug rod 13 is vertically connected to the middle of the bottom surface of the capacitor body 1, and a ring-shaped flange 131 is axially connected to the middle of the outer peripheral wall of the plug rod 13. The lower part of the plug rod 13 is in interference fit with a first slot 41 opened in the middle of the top surface of the chassis 4, and the ring-shaped flange 131 is in contact with the top surface of the chassis 4.

[0038] By adopting the above technical solution, the provided chassis 4 can lift and suspend the capacitor body 1 through the plug rod 13, so as to better assist the dissipation of internal heat; the ring-shaped flange 131 provided on the plug rod 13 can not only more stably support the capacitor body 1, but also locate the insertion depth of the plug rod 13.

[0039] As Figure 5 shown, the first slot 41 is of a square structure.

[0040] By adopting the above technical solution, the first slot 41 is set to be of a square structure, which can prevent the plug rod 13 from slipping sideways with the first slot 41 and changing the orientation of the capacitor body 1.

[0041] As Figure 1 、 2 、6 and 7 shown, a heat dissipation cylinder 5 is sleeved outside the heat dissipation fin 3. The middle of the inner side surface of the heat dissipation cylinder 5 is vertically provided with the same number of second slots 52 as the heat dissipation fin 3 at equal circumferential intervals. The second slots 52 are in interference fit with the outer side parts of the corresponding heat dissipation fins 3.

[0042] By adopting the above technical solution, the provided heat dissipation cylinder 5 can prevent the heat dissipation fins 3 from stabbing nearby components, and the provided second slots 52 can increase the structural installation strength of the heat dissipation fins 3.

[0043] As Figure 1 and 6 shown, heat dissipation holes 53 are provided on the outer peripheral wall of the heat dissipation cylinder 5 in an array arrangement.

[0044] By adopting the above technical solution, the provided heat dissipation holes 53 can increase the ventilation effect of the heat dissipation cylinder 5.

[0045] As Figure 1 、 5 and 6 shown, at least four or more insertion pieces 51 are vertically connected to the bottom edge of the heat dissipation cylinder 5 at equal circumferential intervals. The lower parts of the insertion pieces 51 are in interference fit with second slots 42 opened on the outer edge of the top surface of the chassis 4.

[0046] By adopting the above technical solution, the lower part of the insertion piece 51 is clamped and matched with the second slot 42, so that the heat dissipation cylinder 5 can be kept from contacting the chassis 4, thereby increasing the ventilation and heat dissipation effect of the capacitor body 1.

[0047] As Figure 6 shown, the insertion piece 51 is of an arc-shaped structure, and the radian of the insertion piece 51 is the same as that of the heat dissipation cylinder 5.

[0048] By adopting the above technical solution, the arc-shaped insertion piece 51 can prevent it from slipping sideways with the second slot 42 and causing the orientation of the heat dissipation cylinder 5 to change.

[0049] As Figure 1 and 2 shown, an installation method of a heat dissipation type metallized film capacitor, the method includes the following steps:

[0050] Step S1: First, the heat dissipation pressing ring 2 is respectively clamped and matched with the bottom of the capacitor body 1 and the end cover 11, and then the inner side end parts of the heat dissipation fins 3 are locked and connected to the corresponding first slots 21 one by one through the bolts 22;

[0051] Step S2: The chassis 4 is fixedly connected to the substrate to be installed, and the insertion rod 13 is inserted into the first slot 41, so that the capacitor body 1 is fixedly suspended from the chassis 4;

[0052] Step S3: The outer side parts of the heat dissipation fins 3 are clamped and matched with the corresponding second slots 52 of the heat dissipation cylinders 5, and the insertion pieces 51 of the heat dissipation cylinders 5 are inserted into the corresponding second slots 42.

[0053] By adopting the above technical solution, the whole installation process is relatively convenient, and it is also convenient to disassemble, assemble and replace damaged parts in the later stage, reducing the maintenance cost.

[0054] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat-dissipating metallized film capacitor, characterized in that: It includes a capacitor body (1), the top opening of the capacitor body (1) is sealed by a matching end cap (11), and a pair of terminal blocks (12) are vertically arranged on the top surface of the end cap (11); The bottom of the capacitor body (1) and the end cap (11) are respectively relatively clamped and fitted with heat dissipation pressure rings (2). The longitudinal section of the heat dissipation pressure ring (2) is an L-shaped structure. At least eight or more heat dissipation fins (3) are vertically arranged at equal circumferential intervals between the outer side surfaces of the vertical parts of the two heat dissipation pressure rings (2); Step grooves (31) are symmetrically arranged at the inner side end parts of the heat dissipation fins (3). The step grooves (31) are clamped and fitted with the vertical parts of the corresponding heat dissipation pressure rings (2), and the inner side surfaces of the heat dissipation fins (3) are in contact with the outer side surface of the capacitor body (1); On the outer side surfaces of the two heat dissipation pressure rings (2), the same number of first clamping grooves (21) as the heat dissipation fins (3) are vertically installed at equal circumferential intervals. The length of the first clamping groove (21) is the same as the length of the vertical part of the heat dissipation pressure ring (2); the inner side end part of the heat dissipation fin (3) is clamped and fitted with the corresponding first clamping groove (21), and the two are locked and connected by corresponding bolts (22); A circular chassis (4) is arranged below the bottom surface of the capacitor body (1), and the area of the chassis (4) is larger than the bottom surface area of the capacitor body (1); a plug rod (13) is vertically connected to the middle of the bottom surface of the capacitor body (1). An annular flange (131) is axially connected to the middle of the outer peripheral wall of the plug rod (13). The lower part of the plug rod (13) is in interference clamping fit with a first slot (41) opened in the middle of the top surface of the chassis (4), and the annular flange (131) is in contact with the top surface of the chassis (4).

2. The heat-dissipating metallized film capacitor according to claim 1, wherein: The first slot (41) is a square structure.

3. The heat-dissipating metallized film capacitor according to claim 1, wherein: A heat dissipation cylinder (5) is sleeved outside the heat dissipation fin (3). The middle of the inner side surface of the heat dissipation cylinder (5) is vertically provided with the same number of second clamping grooves (52) as the heat dissipation fins (3) at equal circumferential intervals. The second clamping grooves (52) are in interference clamping fit with the outer side parts of the corresponding heat dissipation fins (3).

4. The heat-dissipating metallized film capacitor according to claim 3, wherein: Heat dissipation holes (53) are arranged in an array on the outer peripheral wall of the heat dissipation cylinder (5).

5. The heat-dissipating metallized film capacitor according to claim 4, wherein: At least four or more insertion pieces (51) are vertically connected to the bottom edge of the heat dissipation cylinder (5) at equal circumferential intervals. The lower parts of the insertion pieces (51) are in interference clamping fit with second slots (42) opened on the outer edge of the top surface of the chassis (4).

6. The heat-dissipating metallized film capacitor according to claim 5, wherein: The insertion piece (51) is an arc-shaped structure, and the radian of the insertion piece (51) is the same as the radian of the heat dissipation cylinder (5).

7. A mounting method for a heat-dissipating metallized film capacitor, characterized in that, Using the heat dissipation type metallized film capacitor described in claim 6, the method includes the following steps: Step S1: First, the heat dissipation pressure rings (2) are respectively relatively clamped and fitted to the bottom of the capacitor body (1) and the end cap (11). Then, the inner side end parts of the heat dissipation fins (3) are locked and connected to the corresponding first clamping grooves (21) one by one through the bolts (22); Step S2: Fix the chassis (4) to the substrate to be installed, and insert the insertion rod (13) into the first slot (41) so that the capacitor body (1) is fixedly suspended from the chassis (4); Step S3: Snap the outer part of the heat dissipation fin (3) into the second card slot (52) of the corresponding heat dissipation cylinder (5), and insert the insertion piece (51) of the heat dissipation cylinder (5) into the corresponding second slot (42).

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