Substrate processing device and control method thereof

Abstract

The present invention discloses a substrate processing device and a control method for the substrate processing device. The disclosed substrate processing device includes: a vacuum chuck portion for adsorbing and supporting a wafer assembly, the wafer assembly including a wafer; a rotary chuck portion for rotating the vacuum chuck portion; a rotary shaft connected to the rotary chuck portion to rotate the rotary chuck portion; an annular cover portion for applying pressure to the wafer assembly to prevent processing liquid sprayed onto the wafer from diffusing into the vacuum chuck portion; a sealing ring portion provided on the vacuum chuck portion for supporting the wafer assembly; and a medium supply portion for supplying an inspection medium to the vacuum chuck portion so that the inspection medium, used to confirm damage to the sealing ring portion, flows into the interior of the sealing ring portion.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a control method thereof. The substrate processing device is used for processing wafers by spraying processing liquid onto the wafers. Background Art

[0002] Generally, semiconductor processes include an etching process for etching a wafer, a singulation process for cutting a wafer into a plurality of dies, and a cleaning process for cleaning the wafer. A substrate processing apparatus is used in the wafer etching process or the wafer cleaning process.

[0003] The substrate processing apparatus is rotatable and includes a rotating table on which wafers are placed, and a sealing ring portion that is annularly attached to the edge of the table. While the table rotates, processing fluid is supplied to the wafers placed on the table. Because existing substrate processing apparatuses cannot accurately determine whether the sealing ring portion is damaged, it must be periodically replaced. This can increase maintenance costs for the substrate processing apparatus.

[0004] In addition, the process of combining the sealing ring portion on the upper part of the turntable is cumbersome, and the completion state of the sealing ring portion is not constant during combination, so combination errors (misalignment, etc.) may occur. Furthermore, when a combination error occurs in the sealing ring portion, as the processing liquid penetrates to the outside of the sealing ring, the structure of the outer periphery of the turntable may be damaged. In addition, a wafer fixing module is provided to prevent the position of the wafer from changing, and a sealing ring fixing module is provided for fixing the sealing ring. Therefore, the structure of the substrate processing device becomes complicated, and it will lead to an increase in manufacturing costs.

[0005] The background technology of the present invention is disclosed in Korean Patent Publication No. 10-2016-0122067 (published on October 21, 2016, invention title: Wafer processing device and sealing ring for wafer processing device). Summary of the Invention

[0006] The present invention is proposed to solve the above-mentioned problem, and an object of the present invention is to provide a substrate processing apparatus and a control method thereof, which can easily and quickly confirm whether the sealing ring portion is damaged.

[0007] Another object of the present invention is to provide a substrate processing apparatus having a rotary joint coupled to a rotating shaft of the substrate processing apparatus and having a vacuum connection flow path portion and a pressurized connection flow path portion therein, and a control method thereof.

[0008] The present invention provides a substrate processing device, which includes: a vacuum chuck part for adsorbing and supporting a wafer assembly, wherein the wafer assembly includes a wafer; a rotating chuck part for rotating the vacuum chuck part; a rotating shaft connected to the rotating chuck part to rotate the rotating chuck part; an annular cover part for applying pressure to the wafer assembly to prevent the processing liquid sprayed onto the wafer from diffusing toward the vacuum chuck part; a sealing ring part, which is arranged on the vacuum chuck part and supports the wafer assembly; and a medium supply part for supplying an inspection medium to the vacuum chuck part so that the inspection medium flows into the interior of the sealing ring part, and the inspection medium is used to confirm damage to the sealing ring part.

[0009] A vacuum flow path portion for forming a vacuum pressure on the vacuum chuck portion and a vertical medium flow path portion for supplying a fluid medium to the seal ring portion may be formed on the rotation shaft.

[0010] The substrate processing apparatus may further include a rotary joint including a rotary core and a fixed core. The rotary core is connected to the rotary shaft and rotates together with the rotary shaft. The fixed core surrounds the rotary core and rotatably supports the rotary core.

[0011] A vacuum connection flow path portion and a pressurized connection flow path portion may be formed in the rotary joint. The vacuum connection flow path portion is connected to the vacuum flow path portion in a manner that allows fluid to flow, and the pressurized connection flow path portion is connected to the vertical medium flow path portion in a manner that allows fluid to flow. In the vacuum flow path portion, the fluid flowing into the vacuum connection flow path portion flows out to the outside of the rotary joint through the fixed core, and in the pressurized connection flow path portion, the fluid flowing out to the vertical medium flow path portion flows into the interior of the rotary joint through the fixed core.

[0012] The vacuum connecting flow path portion may include: a first vertical vacuum flow path, extending in a vertical direction inside the rotating core, and the upper end of the first vertical vacuum flow path is open toward the upper side surface of the rotating core; a first horizontal vacuum flow path, connected to the lower end of the first vertical vacuum flow path, and extending in a horizontal direction toward the outer peripheral surface of the rotating core; a second vertical vacuum flow path, extending in a vertical direction inside the fixed core, and the lower end of the second vertical vacuum flow path is open toward the lower side surface of the fixed core; and a second horizontal vacuum flow path, connected to the upper end of the second vertical vacuum flow path, and extending in a horizontal direction toward the inner peripheral surface of the fixed core to connect with the first horizontal vacuum flow path.

[0013] The pressurized connecting flow path portion may include: a first vertical pressurized flow path, extending in a vertical direction inside the rotating core, and the upper end of the first vertical pressurized flow path is open toward the upper side surface of the rotating core; a first horizontal pressurized flow path, connected to the lower end of the first vertical pressurized flow path, and extending in a horizontal direction toward the outer peripheral surface of the rotating core; a second vertical pressurized flow path, extending in a vertical direction inside the fixed core, and the lower end of the second vertical pressurized flow path is open toward the lower side surface of the fixed core; and a second horizontal pressurized flow path, connected to the upper end of the second vertical pressurized flow path, and extending in a horizontal direction toward the inner peripheral surface of the fixed core to connect with the first horizontal pressurized flow path, and the vacuum connecting flow path portion does not intersect with the pressurized connecting flow path portion.

[0014] The first horizontal vacuum flow path and the first horizontal pressurized flow path may each include an annular groove recessed inward from an outer circumferential surface of the rotating core.

[0015] A plurality of the vacuum connection flow path portions may be formed so as not to intersect with each other inside the rotary joint, and a plurality of the pressurization connection flow path portions may be formed so as not to intersect with each other inside the rotary joint.

[0016] At least one of the plurality of pressurizing connection flow path portions may be connected to the medium supply portion so that the inspection medium flows in through the lower side surface of the stationary core and flows out through the upper side surface of the rotating core.

[0017] The rotary joint may also include an annular vacuum flow path packaging portion (packing), which is arranged on the inner circumferential surface of the fixed core to prevent fluid from flowing from between the first horizontal vacuum flow path and the second horizontal vacuum flow path into the vacuum connecting flow path portion, thereby reducing the vacuum pressure of the vacuum connecting flow path portion.

[0018] A vacuum flow path packaging portion placement groove (groove) with an annular depression can be formed on the inner circumferential surface of the fixed core, and the vacuum flow path packaging portion includes: a main body portion, which is inserted and placed in the vacuum flow path packaging portion placement groove and is formed with a through hole to prevent the second horizontal vacuum flow path from being closed; and a lip portion, which protrudes from the main body portion toward the outer circumferential surface of the rotating core, contacts the outer circumferential surface of the rotating core while preventing the first horizontal vacuum flow path from being closed, and the lip portion of the vacuum flow path packaging portion protrudes in a manner that the closer it approaches to the outer circumferential surface of the rotating core in the horizontal direction, the more it inclines toward the direction away from the first horizontal vacuum flow path in the vertical direction.

[0019] The rotary joint may also include an annular pressurized flow path packaging portion, which is arranged on the inner circumferential surface of the fixed core to prevent the fluid from flowing out from between the first horizontal pressurized flow path and the second horizontal pressurized flow path to the outside of the pressurized connecting flow path portion, thereby reducing the air pressure of the pressurized connecting flow path portion.

[0020] A pressurized flow path packaging portion placement groove with an annular depression can be formed on the inner circumferential surface of the fixed core, and the pressurized flow path packaging portion includes: a main body portion, which is inserted and placed in the pressurized flow path packaging portion placement groove and is formed with a through hole to prevent the second horizontal pressurized flow path from being closed; and a lip portion, which protrudes from the main body portion toward the outer circumferential surface of the rotating core, contacts the outer circumferential surface of the rotating core while preventing the first horizontal pressurized flow path from being closed, and the lip portion of the pressurized flow path packaging portion protrudes in a manner that the closer it approaches the outer circumferential surface of the rotating core in the horizontal direction, the more it inclines toward the first horizontal pressurized flow path in the vertical direction.

[0021] The rotating core may include a ceramic coating layer stacked on an outer peripheral surface of the rotating core to reduce friction when the rotating core rotates relative to the stationary core.

[0022] The stationary core may include a plurality of annular blocks stacked to surround the rotating core.

[0023] The rotary joint may further include a cooling shell surrounding an outer peripheral surface of the stationary core to form a cooling flow path through which a refrigerant flows between the cooling shell and the stationary core.

[0024] A refrigerant circulation flow path may be formed inside the stationary core. The refrigerant circulation flow path is connected to the cooling flow path and penetrates the stationary core to allow the refrigerant to flow.

[0025] The medium supply unit may include: a medium supply pipe unit connected to the vacuum chuck unit to supply an inspection medium to the vacuum chuck unit; and a pressure detection unit for measuring a pressure of the medium supply pipe unit.

[0026] The medium supply unit may further include a flow rate detection unit configured to measure a flow rate of the inspection medium supplied from the medium supply pipe unit to the vacuum chuck unit.

[0027] The substrate processing apparatus of the present invention may further include a chuck module, which is disposed on the rotary chuck portion and is used to position the wafer assembly on the vacuum chuck portion and to lower the annular cover portion so that the annular cover portion applies pressure to the wafer assembly.

[0028] The chuck module may include: a chuck base, which is arranged on the rotating chuck part; a chuck rotating part, which is connected to the chuck base to rotate the chuck base; a plurality of first chuck connecting rod parts, which move in a radial direction when the chuck base rotates; a plurality of wafer assembly limiting parts, which are connected to the plurality of first chuck connecting rod parts to apply pressure as the plurality of first chuck connecting rod parts move in a radial direction, thereby positioning the retaining ring part on the vacuum chuck part; a plurality of second chuck connecting rod parts, which move in a radial direction when the chuck base rotates; and a plurality of cover limiting parts, which are used to connect the plurality of second chuck connecting rod parts and the annular cover part, so as to lift and lower the annular cover part in conjunction with the movement of the plurality of second chuck connecting rod parts.

[0029] When the chuck base rotates, the plurality of first chuck link parts and the plurality of second chuck link parts can move in radial directions simultaneously.

[0030] The sealing ring portion may include: a sealing component housed in a sealing groove portion provided in the vacuum chuck portion to form a deformation space portion inside the sealing component; a limiting ring portion provided in the sealing groove portion to fix the sealing component; and a connector portion connected to the deformation space portion to supply the inspection medium to the deformation space portion.

[0031] The sealing component may include at least one of an elastic groove portion, a tapered portion, a recessed portion, a height difference portion, a deformation groove portion, a round portion, and a protruding portion, so as to increase the elastic deformation amount of the sealing component when the annular cover portion applies pressure to the sealing component through the wafer assembly.

[0032] The wafer assembly may further include a bonding sheet and a retaining ring portion, wherein the bonding sheet is used to adsorb and support the wafer, the retaining ring portion is combined with the outer periphery of the bonding sheet, and the annular cover portion applies pressure to the bonding sheet between the wafer and the retaining ring portion.

[0033] Furthermore, the present invention provides a control method for the above-mentioned substrate processing device, which includes: an inspection medium supply step, driving the medium supply part to supply the inspection medium to the interior of the sealing ring part; and an inspection medium leakage detection step, detecting whether the inspection medium supplied to the interior of the sealing ring part leaks to the outside of the sealing ring part.

[0034] The control method of the substrate processing device of the present invention may also include: a sealing ring replacement step, when leakage of the inspection medium is detected in the inspection medium leakage detection step, separating and removing the sealing ring from the vacuum chuck part and setting other sealing ring parts on the vacuum chuck part; a wafer loading step, fixing the wafer assembly on the vacuum chuck part; and a wafer processing step, spraying the processing liquid onto the wafer of the wafer assembly to process the wafer.

[0035] The control method of the substrate processing device of the present invention may also include: a wafer loading step, when no leakage of the inspection medium is detected in the inspection medium leakage detection step, the sealing ring part is not replaced, and the wafer assembly is fixedly mounted on the vacuum chuck part; and a wafer processing step, spraying the processing liquid onto the wafer of the wafer assembly to process the wafer.

[0036] According to the present invention, a worker can quickly and accurately determine whether the seal ring is damaged by supplying the inspection medium into the seal ring through the medium supply unit to confirm whether the inspection medium leaks from the seal ring.

[0037] Therefore, during the wafer processing process using the substrate processing apparatus, the processing liquid can be prevented from diffusing and penetrating into the vacuum chuck and the spin chuck to damage or contaminate the substrate processing apparatus, thereby saving maintenance costs of the substrate processing apparatus.

[0038] According to the present invention, a miniaturized rotary joint including a plurality of vacuum connection flow paths and pressurized connection flow paths can be designed and manufactured, so that the rotary joint and a substrate processing apparatus including the same can be easily installed in a limited installation space.

[0039] According to the present invention, the rotary joint has a vacuum flow path packaging portion and a pressurized flow path packaging portion made of rubber material, thereby preventing pressure loss in the vacuum connection flow path portion and the pressurized connection flow path portion. Compared with the case where a mechanical seal is applied, it is easy to miniaturize the rotary joint and suppress the generation of particles.

[0040] According to the present invention, a cooling shell is provided on the outer circumference of the stationary core to form a refrigerant circulation path in the rotary joint, thereby improving the durability, ie, the service life, of the rotary joint by suppressing heat generation during operation of the rotary joint. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 FIG. 1 is a top view schematically illustrating a wafer assembly processed in a substrate processing apparatus according to an embodiment of the present invention.

[0042] Figure 2FIG. 1 is a side view schematically illustrating a wafer assembly processed in a substrate processing apparatus according to an embodiment of the present invention.

[0043] Figure 3 A side view schematically illustrating a state in which the intervals between a plurality of dies are widened as the vacuum chuck portion rises in a substrate processing apparatus according to an embodiment of the present invention.

[0044] Figure 4 FIG. 1 is a cross-sectional view schematically illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0045] Figure 5 FIG. 1 is a top view schematically showing a chuck module in a substrate processing apparatus according to an embodiment of the present invention.

[0046] Figure 6 The present invention is a cross-sectional view schematically showing a state in which a medium supply portion in a substrate processing apparatus according to an embodiment of the present invention supplies an inspection medium to a vacuum chuck portion.

[0047] Figure 7 This is a cross-sectional view schematically showing a state in which an inspection medium is supplied to a seal ring portion in a substrate processing apparatus according to an embodiment of the present invention.

[0048] Figures 8 to 18 The figure briefly shows a cross-sectional view of multiple embodiments of a sealing ring portion in a substrate processing apparatus according to an embodiment of the present invention.

[0049] Figure 19 The flowchart briefly illustrates a method for controlling a substrate processing apparatus according to an embodiment of the present invention.

[0050] Figure 20 For Figure 4 A longitudinal sectional view of an embodiment of a rotary joint to which the lower end of the rotary shaft is connected.

[0051] Figure 21 To illustrate the cut along P1-P1 Figure 20 Transverse cross-sectional view of the rotary joint.

[0052] Figure 22 To illustrate the cut along P2-P2 Figure 20 Transverse cross-sectional view of the rotary joint.

[0053] Figure 23 To illustrate the cut along V1-V1 Figure 21 Longitudinal cross-sectional view.

[0054] Figure 24 To illustrate the cut along V2-V2 Figure 22 Longitudinal cross-sectional view.

[0055] Figure 25 A longitudinal cross-sectional view of another embodiment of a rotary joint.

[0056] Figure 26 It is a longitudinal cross-sectional view of another embodiment of a rotary joint.

[0057] Description of Reference Numerals

[0058] 10: Wafer 11: Die

[0059] 12: Adhesive sheet 13: Snap ring

[0060] 14: Ring frame 15: Wafer assembly

[0061] 110: Driving unit 111: Rotating shaft

[0062] 120: Rotary chuck part 130: Vacuum chuck part

[0063] 131: First vacuum chuck 133: Second vacuum chuck

[0064] 140: annular cover 142: limiting step

[0065] 143: Cover pressing part 150: Chuck module

[0066] 210: Medium supply unit 211: Medium supply pipe unit

[0067] 213: Valve 214: Pressure detection unit

[0068] 215: Flow detection unit 220: Sealing ring unit

[0069] 221: Sealing member 222: Sealing body

[0070] 223: Deformation space 224: Fixed rib

[0071] 225: Restriction ring portion 227: Connector portion. DETAILED DESCRIPTION

[0072] Below, with reference to the accompanying drawings, a detailed description of a substrate processing apparatus and a method for controlling a substrate processing apparatus according to embodiments of the present invention is provided. The various terminologies used in this specification are intended to appropriately represent preferred embodiments of the present invention and may vary depending on the intent of the user or application, or on common practices in the art to which the present invention pertains. Therefore, the definitions of these terms should be based on the full text of this specification.

[0073] Figure 1 To briefly illustrate a top view of a wafer assembly processed in a substrate processing apparatus according to an embodiment of the present invention, Figure 2 1 is a side view schematically illustrating a wafer assembly processed in a substrate processing apparatus according to an embodiment of the present invention. Figure 3 This is a side view schematically illustrating a state in which the intervals between a plurality of crystal grains are widened as the vacuum chuck portion rises in a substrate processing apparatus according to an embodiment of the present invention. Figure 4 A cross-sectional view briefly illustrates a substrate processing apparatus according to an embodiment of the present invention. Figure 5 FIG. 1 is a top view schematically showing a chuck module in a substrate processing apparatus according to an embodiment of the present invention.

[0074] Reference Figures 1 to 5 , a substrate processing device according to an embodiment of the present invention includes a driving portion 110, a rotary chuck portion 120, a vacuum chuck portion 130, a ring cover portion 140, a medium supply portion 210 and a sealing ring portion 220. The substrate processing device can be used to etch and clean a wafer 10. In the etching process, an etching liquid is sprayed onto the wafer 10. As the etched wafer 10 is cut in a matrix form in the singulation process, a plurality of crystal grains 11 are formed. In the cleaning process, as the cleaning liquid is sprayed onto the wafer 10, foreign matter attached to the plurality of crystal grains 11 is removed. As the cleaning liquid, various types such as deionized water (DI-water) can be used. Hereinafter, the etching liquid and the cleaning liquid are collectively referred to as the processing liquid.

[0075] Wafer 10 is mounted on a substrate processing apparatus in the form of a wafer assembly 15 supported by a ring frame 14. Wafer 10 includes a plurality of dies 11 arranged in a matrix. Ring frame 14 includes: a bonding sheet 12 to which wafer 10 is attached; and a retainer ring portion 13, which is coupled to the outer periphery of bonding sheet 12 to tighten bonding sheet 12 (see FIG. 1 ). Figure 1 and Figure 2 The bonding sheet 12 is formed of a material that is stretchable in the horizontal direction. As the bonding sheet 12 is tightened by the clamping ring 13, the multiple dies 11 on the wafer 10 are positioned.

[0076] The rotary chuck portion 120 is rotatably disposed on the driving portion 110 (see Figure 4). The rotating chuck part 120 rotates the vacuum chuck part 130 supported by the rotating chuck part 120 and the wafer assembly 15 mounted on the vacuum chuck part 130. The driving part 110 includes: a rotating shaft 111 connected to the rotation center of the rotating chuck part 120; and a motor part 113, which is arranged on the rotating shaft 111. The motor part 113 provides power to rotate the rotating shaft 111 and the rotating chuck part 120 fixedly supported thereby about the axis CL, and includes: a stator (not shown), which is arranged inside a housing (not shown); and a rotor (not shown), which is arranged inside the stator and is arranged to surround the rotating shaft 111. Among them, the driving part 110 provided in the substrate processing apparatus of the present invention is not limited as long as it provides power to rotate the rotating chuck part 120. Figure 4 For example, a belt drive type drive unit that rotates the rotating shaft 111 via a belt, or a chain drive type drive unit that rotates the rotating shaft 111 via a chain may be employed.

[0077] The rotating shaft 111 includes a vacuum flow path portion 115 (see Figure 4 ) for creating a vacuum pressure in the vacuum chuck portion 130; and a vertical medium flow path portion 117 for supplying a fluid medium, such as air, to the sealing ring portion 220. The vacuum flow path portion 115 and the vertical medium flow path portion 117 each extend along the length of the rotating shaft 111 and are spaced apart from each other. The vacuum chuck portion 130 includes a vacuum chamber 132 connected to the vacuum flow path portion 115 to enable fluid flow; and a horizontal medium flow path portion 136 connected to the vertical medium flow path portion 117 to enable fluid flow.

[0078] The vacuum chuck 130 is placed on the spin chuck 120. The wafer assembly 15 is mounted on the vacuum chuck 130. The vacuum chuck 130 has a disk-like surface, allowing it to be placed on top of the spin chuck 120. The vacuum chuck 130 rotates along with the spin chuck 120 using the driving force of the drive 110. When an etching process is performed in the substrate processing apparatus, the wafer assembly 15, comprising a wafer 10 containing a plurality of uncut dies 11 and a ring frame 14 attached thereto for supporting the wafer 10, is mounted on the vacuum chuck 130.

[0079] Meanwhile, when the substrate processing apparatus performs a cleaning process, a wafer assembly 15 comprising a wafer 10 including multiple dies 11 in a singulated state and a ring frame 14 attached thereto for supporting the wafer assembly is mounted on a vacuum chuck unit 130. As the wafer 10 is singulated into multiple dies 11 during the singulation process, foreign matter may remain on the surfaces of the dies 11 and in the gaps between adjacent dies 11. During the cleaning process, these foreign matter can be removed from the surfaces of the dies 11 and between adjacent dies 11.

[0080] The vacuum chuck section 130 includes a first vacuum chuck 131 and a second vacuum chuck 133. The first vacuum chuck 131 is mounted on the spin chuck section 120 so as to rotate together with the spin chuck section 120. As described above, the vacuum chuck section 130 includes a vacuum chamber 132 connected to the vacuum flow path section 115 to allow fluid flow, and a horizontal medium flow path section 136 connected to the vertical medium flow path section 117 to allow fluid flow.

[0081] The first vacuum chuck 131 creates vacuum pressure to absorb the wafer assembly 15. The second vacuum chuck 133 is mounted on the first vacuum chuck 131 so as to be movable relative to the first vacuum chuck 131 of a moving module (not shown). The second vacuum chuck 133 is provided with a seal ring 220.

[0082] The second vacuum chuck 132 is formed with a plurality of suction holes 134 that communicate with the vacuum chamber 132 and are used to absorb the wafer assembly 15. The plurality of suction holes 134 may be arranged along concentric circles centered about the center of the second vacuum chuck 133. When vacuum pressure is applied to the vacuum flow path 115 and the connected vacuum chamber 132, a vacuum suction force is generated in the plurality of suction holes 134. This vacuum suction force maintains the wafer assembly 15 in close contact with the upper side of the second vacuum chuck 133. Therefore, the flatness of the wafer 10 can be maintained while the substrate processing apparatus is performing an etching or cleaning process on the wafer 10.

[0083] The annular cover portion 140 is arranged on the outer periphery of the vacuum chuck portion 130. The annular cover portion 140 applies pressure to the bonding sheet 12 of the wafer assembly 15 to seal the outer periphery of the vacuum chuck portion 130 to prevent the processing liquid from diffusing to the outer periphery of the vacuum chuck portion 130. The annular cover portion 140 is connected to the chuck module 150. The annular cover portion 140 is in the shape of a circular ring, and applies pressure to the bonding sheet 12 of the wafer assembly 15 to seal the outer periphery of the vacuum chuck portion 130. Therefore, it is possible to minimize the damage to the bonding sheet 12 caused by the etching liquid (specifically the processing liquid), and prevent the rotating chuck portion 120 and the vacuum chuck portion 130 from being contaminated or damaged by the etching liquid.

[0084] The annular cover 140 includes a cover body 141 that surrounds the outer periphery of the vacuum chuck 130; a limiting step 142 that protrudes inward from the bottom of the cover body 141; and a cover pressure portion 143 that extends inward from the top of the cover body 141 and is used to apply pressure to the bonding sheet 12 of the wafer assembly 15. The cover pressure portion 143 applies downward pressure to the bonding sheet 12 between the wafer 10 and the retaining ring 13. Specifically, the cover pressure portion 143 applies pressure to the portion of the bonding sheet 12 in the wafer assembly 15 that is approximately 1 mm away from the outermost edge of the wafer 10. The cover pressure portion 143 can be formed to gradually decrease in thickness toward its inner end. Because the portion of the bonding sheet 12 between the retaining ring 13 and the wafer 10, except for a width of approximately 1 mm, is sealed by the cover pressure portion 143, damage to the bonding sheet 12 by the etching solution is minimized during the etching process.

[0085] In the cleaning process, before the cleaning liquid is sprayed onto the wafer 10, the second vacuum chuck 133 carrying the supporting wafer assembly 15 can be raised relative to the rotary chuck portion 120 and the first vacuum chuck 131 by the moving module (not shown). When the moving module is driven to raise the second vacuum chuck 133 of the vacuum chuck portion 130, the first vacuum chuck 131 does not rise. Therefore, in the state where the retaining ring portion 13 of the annular frame 14 is positioned, only the adhesive sheet 12 rises and is stretched in the radial direction. As the adhesive sheet 12 is stretched in the radial direction, the interval G2 (refer to FIG. 1 ) between the plurality of grains 11 of the wafer 10 is increased. Figure 3 In this state, when the cleaning liquid is sprayed onto the wafer 10, foreign matter sandwiched between the gaps of the plurality of crystal grains 11 can be removed quickly and rapidly.

[0086] The substrate processing apparatus further includes a chuck module 150, which is disposed within the rotating chuck portion 120 and positions the wafer assembly 15 on the vacuum chuck portion 130. The chuck module 150 also lowers the annular cover portion 140 so that the annular cover portion 140 applies pressure to the bonding sheet 12 between the wafer 10 and the retaining ring portion 13. The chuck module 150 includes a chuck base 151, a chuck rotating portion 155, a plurality of first chuck links 160, a plurality of wafer assembly restraining portions 170, a plurality of second chuck links 180, and a plurality of cover restraining portions 190.

[0087] The chuck base 151 is provided on the rotating chuck portion 120. The chuck rotating portion 155 is connected to the chuck base 151 so as to rotate the chuck base 151. A plurality of first chuck connecting rod portions 160 are respectively connected to the chuck base 151 and extend in radial directions, and move when the chuck base 151 rotates. As the first chuck connecting rod portion 160 moves in the radial direction, a plurality of wafer assembly limiting portions 170 apply pressure in a manner so as to position the retaining ring portion 13 of the wafer assembly 15 on the vacuum chuck portion 130. The plurality of wafer assembly limiting portions 170 are respectively connected to the plurality of first chuck connecting rod portions 160. The chuck base 151 is provided in a manner concentric with the rotating chuck portion 120. The chuck base 151, the chuck rotating portion 155, and the first chuck connecting rod portions 160 are arranged inside the rotating chuck portion 120.

[0088] When the chuck rotating portion 155 is driven, the chuck base 151 rotates a certain angle, and the plurality of first chuck links 160 move radially of the chuck base 151, specifically toward the center of the chuck base 151. As the plurality of first chuck links 160 move simultaneously, the plurality of wafer assembly restraining portions 170 pressurize and secure the retaining ring portion 13, thereby maintaining the vertical alignment of the wafer assembly 15 relative to the first vacuum chuck 131.

[0089] The chuck base 151 includes a base body 152, a plurality of guide portions 153, and a base gear portion 154. The base body 152 is formed in a ring shape so as to be concentric with the rotation center of the rotating chuck portion 120. The base body 152 is disposed inside the rotating chuck portion 120. The plurality of guide portions 153 are formed in the base body 152 so as to allow the first chuck connecting rod portion 160 to be movably coupled. The number of the plurality of guide portions 153 can be twice the number of the first chuck connecting rod portion 160. The plurality of guide portions 153 can be formed at equal angular intervals relative to the center of the base body 152.

[0090] Each of the first chuck link portions 160 is coupled to one of the plurality of guide portions 153. The base gear portion 154 is formed on the base body 152 and connected to the chuck rotating portion 155. The base gear portion 154 is arranged on the inner circumference of the base body 152 in an arc-shaped manner. When the chuck rotating portion 155 is driven, the base gear portion 154 rotates, rotating the base body 152 and the base gear portion 154 together, causing the first chuck link portion 160 to move radially relative to the base body 152.

[0091] The guide portion 153 extends in an inclined manner relative to the radial direction of the base body 152. The guide portion 153 may be a guide hole. The guide portion may be a guide groove or a guide protrusion, and is not limited to a guide hole. The guide portion 153 is inclined relative to the radial direction of the base body 152. Therefore, as the base body 152 rotates a predetermined angle, the first chuck link portion 160 moves linearly in the radial direction of the base body 152.

[0092] The first chuck link portion 160 includes a first guide slider 161, a first link component 162, and a first link gear portion 163. The first guide slider 161 is movably coupled to the guide portion 153. The first link component 162 is connected to the first guide slider 161, and when the first guide slider 161 moves, it moves linearly in the radial direction of the base body 152. The first link component 162 is in the shape of a straight rod. The first link gear portion 163 can be formed on the first link component 162 in a manner that meshes with the wafer assembly limiting portion 170. For example, the first link gear portion 163 can be in the shape of a rack parallel to the length direction of the first link component 162.

[0093] The first chuck link portion 160 further includes a first guide block 164 to which the first link member 162 is linearly movable. The first guide block 164 prevents the first link member 162 from rotating in the circumferential direction of the base body 152 when the base body 152 rotates. Therefore, when the base body 152 rotates, if the first guide slider 161 moves along the guide portion 153, the first link member 162 can move linearly without rotating.

[0094] The wafer assembly restraining unit 170 includes a gripper 175 that compresses and decompresses the retaining ring 13 of the wafer 10 when the first chuck link 160 moves. The gripper 175 extends in an arc shape to apply pressure to the outer peripheral surface of the retaining ring 13 of the wafer assembly 15 to secure it.

[0095] Multiple second chuck links 180 are respectively connected to the chuck base 151, extending in radial directions, and move in radial directions when the chuck base 151 rotates. Multiple cover limiting portions 190 are linked to the second chuck links 180 and the limiting step portion 142 of the annular cover portion 140. When the chuck rotating portion 155 is driven, the base gear portion 154 rotates, and the base body portion 152 rotates together with the base gear portion 154, causing the second chuck links 180 to move in the radial direction of the base body portion 152, specifically toward the center of the chuck base 151. When the base body portion 152 of the chuck base 151 rotates, the multiple first chuck links 160 and the multiple second chuck links 180 simultaneously move in radial directions.

[0096] As the first chuck link 160 moves, the retaining ring portion 13 of the wafer assembly 15 is positioned relative to the vacuum chuck portion 130. As the second chuck link 180 moves, the annular cover portion 140 moves downward and is positioned, thereby applying pressure to the bonding sheet 12 between the wafer 10 of the wafer assembly 15 and the retaining ring portion 13 along a closed curved track, such as a circular track. A single chuck base 151 and a single chuck rotating portion 155 can be used to simultaneously position the wafer assembly 15 and the annular cover portion 140, thereby simplifying the structure of the substrate processing apparatus.

[0097] The second chuck link 180 includes a second guide slider 181 and a second link member 182. The second guide slider 181 is movably coupled to the guide portion 153. The second link member 182 is coupled to the second guide slider 181. When the second guide slider 181 moves, the second link member 182 moves linearly along the radius of the base body 152.

[0098] The second link member 182 has a linear rod shape. The second link gear portion 183 may be formed on the second link member 182 so as to mesh with the cover restrictor 190. For example, the second link gear portion 183 may have a rack shape aligned with the longitudinal direction of the second link member 182.

[0099] The second chuck link 180 also includes a second guide block 184 that is coupled to the second link member 182 in a linearly movable manner. The second guide block 184 prevents the second chuck link 180 from rotating in the circumferential direction of the base body 152 when the base body 152 rotates. Therefore, when the base body 152 rotates, if the second guide slider 181 moves along the guide portion 153, the second link member 182 can move linearly without rotating. Multiple cover limiters 190 are connected to the multiple second chuck links 180 and the limiting step portion 142 of the annular cover portion 140, so that the annular cover portion 140 can be raised and lowered in conjunction with the movement of the second chuck link 180.

[0100] Figure 6 This is a cross-sectional view schematically illustrating a state in which a medium supply portion supplies an inspection medium to a vacuum chuck portion in a substrate processing apparatus according to an embodiment of the present invention. Figure 7 This is a cross-sectional view schematically showing a state in which an inspection medium is supplied to a seal ring portion in a substrate processing apparatus according to an embodiment of the present invention.

[0101] Reference Figure 6 and Figure 7The medium supply unit 210 supplies the inspection medium to the interior of the vacuum chuck unit 130 and the interior of the sealing ring unit 220 disposed therein. A horizontal medium flow path 136 is formed within the vacuum chuck unit 130, specifically within the first vacuum chuck 131, to supply the inspection medium flowing from the medium supply unit 210 into the vacuum chuck unit 130 to the sealing ring unit 220. The horizontal medium flow path 136 may be formed radially within the first vacuum chuck 131 to connect to the multiple communication channels 227a disposed in the sealing ring unit 220.

[0102] The medium supply unit 210 includes a medium supply pipe 211 connected to supply a test medium as a fluid to the interior of the vacuum chuck 130, specifically to the horizontal medium flow path 136; and a valve 213 provided on the medium supply pipe 211 to open and close the flow path of the medium supply pipe 211. Specifically, the horizontal medium flow path 136 is connected to the vertical medium flow path 117, which extends vertically to allow fluid to flow within the rotating shaft 111. The medium supply pipe 211 can be connected directly to the horizontal medium flow path 136 or via the vertical medium flow path 117.

[0103] For example, when the wafer 10 is being etched or cleaned in the substrate processing apparatus, a fluid medium such as air is supplied to the interior of the seal ring portion 220 via the vertical medium flow path 117 and the horizontal medium flow path 136. When the wafer 10 is not being processed in the substrate processing apparatus, in other words, when the substrate processing apparatus is not operating, the valve 213 is opened, and an inspection medium is supplied to the horizontal medium flow path 136 via the medium supply pipe 211.

[0104] The medium supply unit 210 further includes a pressure detector 214, disposed within the medium supply pipe 211, for measuring the pressure within the medium supply pipe 211; and a flow rate detector 215, for measuring the flow rate of the test medium supplied from the medium supply pipe 211 to the horizontal medium flow path 136 of the vacuum chuck 130. If the pressure within the medium supply pipe 211 drops below a predetermined reference pressure while the test medium is being supplied to the medium supply pipe 211, it can be determined that the sealing ring 220 has been damaged.

[0105] The flow rate detector 215 measures the flow rate of the test medium to supply a predetermined amount of the test medium to the seal ring 220, thereby preventing an excessive increase in the internal pressure of the seal ring 220. The test medium may include a fluorescent material. This allows leakage of the test medium from the seal ring 220 to be detected even in dark locations, making it easy to check whether the seal ring 220 is damaged.

[0106] For example, the sealing ring portion 220 is formed of an elastic material such as rubber, and is arranged in the vacuum chuck portion 130 in a manner that supports the wafer assembly 15. Specifically, the sealing ring portion 220 is used to support the adhesive sheet 12 between the wafer 10 and the retaining ring portion 13 of the wafer assembly 15. The inspection medium supplied to the vacuum chuck portion 130 flows into the interior of the sealing ring portion 220. If the sealing ring portion 220 is partially damaged, the inspection medium leaks to the outside through the damaged portion of the sealing ring portion 220. In this case, for example, the staff can easily identify the damage of the sealing ring portion 220 by feeling it by placing their fingertips close to the sealing ring portion 220. On the other hand, the staff can also use a separate leakage inspection device (not shown) to confirm whether the inspection medium is leaking in the sealing ring portion 220. Whether the sealing ring portion 220 is damaged or not can be performed before performing a processing process of the wafer 10 such as an etching process or a cleaning process using a substrate processing device.

[0107] As described above, damage to the seal ring 220 can be quickly and easily confirmed by checking for leaks in the inspection medium. Consequently, the replacement time for the seal ring 220 can be accurately determined, thereby reducing maintenance costs for the substrate processing apparatus. Furthermore, contamination or damage to the substrate processing apparatus caused by damage to the seal ring 220 can be prevented.

[0108] The sealing ring portion 220 includes a sealing member 221, a limiting ring portion 225, and a connector portion 227. The sealing member 221 is housed in the sealing groove portion 137 of the vacuum chuck portion 130, forming a deformable space portion 223 therein. The limiting ring portion 225 is disposed in the sealing groove portion 137 to secure the sealing member 221. The connector portion 227 is connected to the deformable space portion 223 to supply an inspection medium to the deformable space portion 223. The cross-sectional shape of the sealing member 221 can be a quadrilateral with an open bottom. The bottom side of the sealing member 221 is inserted into the limiting ring portion 225 and is thereby restricted.

[0109] Connector 227 forms a communication channel 227a to connect deformable space 223 with horizontal medium flow path 136. The test medium supplied to horizontal medium flow path 136 is supplied to deformable space 223 of sealing member 221 via connector 227. Therefore, leaks of the test medium can be detected in sealing member 221, accurately confirming the replacement time for sealing member 221.

[0110] Figures 8 to 18 The following are cross-sectional views schematically illustrating various embodiments of the sealing ring portion in a substrate processing apparatus according to an embodiment of the present invention. Hereinafter, various embodiments of the sealing member 221 in the sealing ring portion 210 will be described in detail with reference to these drawings.

[0111] Reference Figure 8The sealing member 221 includes a sealing body 222 housed in the sealing groove 137 and defining a deformable space 223; and fixing ribs 224 extending from the lower end of the sealing body 222 toward the restricting ring 225 so as to be inserted into the restricting ring 225. The cross-section of the sealing body 222 is generally shaped like an inverted "U." The fixing ribs 224 extend from the lower ends of the sealing body 222 toward each other. The fixing ribs 224 are inserted into and constrained by the restricting ring 225, thereby preventing the sealing member 221 from separating from the restricting ring 225 even if the pressure in the deformable space 223 increases.

[0112] The pressure and flow of the medium supply pipe 211 can be measured by the pressure detection unit 214 and the flow detection unit 215. Therefore, the staff can confirm whether the inspection medium is accurately flowing into the interior of the sealing ring 220. Not only that, it can also be identified whether the sealing component 221 is damaged.

[0113] Reference Figures 9 to 11 , an elastic groove portion 231 is formed on the outer side or inner side of the sealing main body portion 222. The elastic groove portion 231 can be formed on the upper side edge of the sealing main body portion 222 or its periphery. The elastic groove portion 231 is formed into a circle along the circumferential direction of the sealing main body portion 222. With the formation of the elastic groove portion 231, when the cover pressurizing portion 143 of the annular cover portion 140 applies pressure to the sealing main body portion 222 across the bonding sheet 12, the sealing main body portion 222 can be elastically deformed more smoothly. The elastic deformation amount of the sealing main body portion 222 increases. Therefore, through the elastic restoring force of the sealing main body portion 222, the bonding sheet 12 of the wafer assembly 15 can be more strongly elastically adhered to the cover pressurizing portion 143, and the area of ​​close contact between the sealing main body portion 222 and the cover pressurizing portion 12 increases, which can ultimately improve the sealing performance of the sealing main body portion 222.

[0114] Reference Figure 12 , a tapered portion 232 is formed on the inner and outer sides of the sealing main body 222. The tapered portion 232 is inclined downward toward the inner and outer sides of the sealing main body 222. Through the tapered portion 232, the upper end portion of the sealing main body 222 can be elastically deformed more smoothly. Through the elastic restoring force of the sealing main body 222, the bonding sheet 12 of the wafer assembly 15 can be more strongly and elastically adhered to the cover pressurizing portion 143, and the close contact area between the sealing main body 222 and the cover pressurizing portion 143 is increased, which can ultimately improve the sealing performance of the sealing main body 222.

[0115] Reference Figure 13 and Figure 14, a recessed portion 233 is formed at the upper end of the sealing main body portion 222. The recessed portion 233 can make the width-direction center portion of the upper end of the sealing main body portion 222 recessed downward. The recessed portion 233 is formed in a circular shape along the circumferential direction of the sealing main body portion 222. The recessed portion 233 is formed at the upper end of the sealing main body portion 222. Therefore, when the cover pressure portion 143 of the annular cover portion 140 applies pressure to the sealing main body portion 222 through the adhesive sheet 12, the elastic deformation of the sealing main body portion 222 increases, and the close contact area between the sealing main body portion 222 and the cover pressure portion 143 increases, which can ultimately improve the sealing performance of the sealing main body portion 222.

[0116] An elastic groove 231 may also be formed on the outer or inner side of the sealing body 222. The elastic groove 231 may be formed at the upper edge or periphery of the sealing body 222. The elastic groove 231 is formed in a circular shape along the circumference of the sealing body 222. The recessed portion 233 and the elastic groove 231 may be formed simultaneously in the sealing body 222, thereby further increasing the elastic deformation of the sealing body 222.

[0117] Reference Figure 15 A height difference portion 234 is formed at the upper end of the sealing body 222. The height difference portion 234 can be formed at the portion that contacts the distal end of the cover pressurizing portion 143. The height difference portion 234 is formed in a circular shape along the circumference of the sealing body 222. Forming the height difference portion 234 at the upper end of the sealing body 222 further increases the elastic deformation of the sealing body 222, increasing the contact area between the sealing body 222 and the cover pressurizing portion 143, and ultimately improving the sealing performance of the sealing body 222.

[0118] Reference Figure 16 A plurality of deformation grooves 235 are formed at the upper end of the sealing body 222. The plurality of deformation grooves 235 can be formed on the inner side surface of the upper end of the sealing body 222. The plurality of deformation grooves 235 are formed in a circular shape along the circumference of the sealing body 222. The formation of the plurality of deformation grooves 235 at the upper end of the sealing body 222 further increases the elastic deformation of the sealing body 222, thereby increasing the contact area between the sealing body 222 and the cover pressurizing portion 143, and ultimately improving the sealing performance of the sealing body 222.

[0119] Reference Figure 17, a round portion 236 whose cross section is processed to extend in a curved shape is formed on the inner and outer circumferential sides of the upper end portion of the sealing main body portion 222. The round portion 236 is formed on the inner and outer circumferential edges of the upper end portion of the sealing main body portion 222. The round portion 236 is formed into a circle along the circumferential direction of the sealing main body portion 222. The round portion 236 is formed on the inner and outer circumferential sides of the sealing main body portion 222, so that the elastic deformation amount of the sealing main body portion 222 is further increased, and the close contact area between the sealing main body portion 222 and the cover pressurizing portion 143 is increased, which can ultimately improve the sealing performance of the sealing main body portion 222.

[0120] Reference Figure 18 The sealing body 222 includes a protrusion 237 formed upwardly at its upper portion. The protrusion 237 is formed in a circular shape along the circumference of the sealing body 222, and the cross-section of the protrusion 237 extends in a curved shape. The formation of the protrusion 237 at the upper portion of the sealing body 222 further increases the elastic deformation of the sealing body 222, thereby increasing the contact area between the sealing body 222 and the cover pressurizing portion 143, and ultimately improving the sealing performance of the sealing body 222.

[0121] The following details are provided. Figures 4 to 7 A control method for a substrate processing apparatus is described. Figure 19 1 is a flow chart briefly showing a control method of a substrate processing apparatus according to an embodiment of the present invention. Figures 4 to 7 and Figure 19 A control method for a substrate processing apparatus according to an embodiment of the present invention includes a medium supply inspection step S10, a medium leakage inspection step S20, a seal ring replacement step S30, a wafer loading step S40, and a wafer processing step S50. The control method for a substrate processing apparatus according to the present invention can be performed before starting a process of processing a wafer 10 in the substrate processing apparatus, or after processing a wafer 10 and unloading the wafer 10 in the substrate processing apparatus and before loading a new wafer 10 into the substrate processing apparatus.

[0122] The test medium supply step S10 is a step in which the test medium is supplied into the seal ring portion 220 by activating the test medium supply unit 210. When the valve 213 is opened, the test medium is supplied to the horizontal medium flow path 136 through the medium supply pipe 211. The test medium flowing into the horizontal medium flow path 136 is supplied to the deformable space 223 of the seal member 221 through the connector 227.

[0123] When the medium supply unit 210 is driven to supply the test medium to the seal ring unit 220, the pressure detection unit 214 and the flow detection unit 215 measure the pressure and flow rate of the test medium supplied to the seal ring unit 220. The flow detection unit 215 measures the flow rate of the test medium to ensure that a specified amount of the test medium is supplied to the seal ring unit 220, thereby preventing an excessive increase in the internal pressure of the seal ring unit 220. Specifically, if the value measured by the flow detection unit 215 reaches a preset reference flow rate, the control unit (not shown) of the substrate processing apparatus may close the valve 213 or reduce the opening of the valve 213.

[0124] The inspection medium leakage detection step S20 detects whether the inspection medium supplied to the interior of the sealing ring portion 220, i.e., the deformable space portion 223, has leaked outside the sealing ring portion 220. When the sealing ring portion 220 is damaged, the inspection medium leaks through the damaged portion of the sealing ring portion 220. A worker can easily identify damage to the sealing ring portion 220 by feeling the flow of gas through the skin of the fingertip when the fingertip is placed close to the sealing ring portion 220. When the inspection medium includes a fluorescent substance, the fluorescent color appears in a recognizable manner on the outside of the sealing ring portion 220. Therefore, by observing the fluorescent substance leaking outside the sealing ring portion 220, the worker can easily identify whether the sealing ring portion 220 is damaged, even in a dark place. Alternatively, the worker can use a separate leakage detection device to identify whether the sealing ring portion 220 is damaged.

[0125] When the inspection medium is supplied from the medium supply pipe portion 211 to the horizontal medium flow path portion 136, if the pressure of the medium supply pipe portion 211 measured by the pressure detection portion 214 drops to a preset reference pressure, the control portion (not shown) of the substrate processing apparatus can determine that the sealing ring portion 220 is damaged.

[0126] The seal ring replacement step S30 is a step in which, when leakage of the test medium is detected in the test medium leakage detection step S20 and the seal ring 220 is determined to be damaged, the seal ring 220 is removed from the seal groove 137 of the vacuum chuck 130 and a new seal ring 220 is installed therein. During the seal ring replacement step S30, the fluid medium within the new seal ring 220 is discharged. As a result, the seal body 222 is crimped and contracted into the inner side of the seal groove 137, and the fixing ribs 224 of the seal ring 220 are deformed and tightly inserted into the restraining ring 225. This improves the assembly accuracy of the seal ring 220.

[0127] Wafer loading step S40 is a step for securing wafer assembly 15 onto the vacuum chuck unit 130 of the substrate processing apparatus. First, wafer loading step S40 includes the following steps: a wafer transfer unit (not shown) picks up wafer assembly 15, which has not undergone substrate processing such as etching or cleaning, and places it on vacuum chuck unit 130. In this case, retaining ring 13 of wafer assembly 15 is placed on the outer periphery of vacuum chuck unit 130, and adhesive sheet 12 between retaining ring 13 and wafer 10 is placed on the upper side of seal ring 220.

[0128] Next, the wafer loading step S40 includes the step of driving the chuck module 150 to secure the wafer assembly 15 to the vacuum chuck unit 130. In this case, the chuck base 151 rotates via the chuck rotating unit 155, thereby simultaneously moving the plurality of first chuck links 160 and the plurality of second chuck links 180. As the first chuck links 160 move, the retaining ring 13 of the wafer assembly 15 is secured to the vacuum chuck unit 130. As the second chuck links 180 move, the restricting step 142 of the annular cover 140 moves downward in conjunction with this movement and is secured, causing the cover pressurizing unit 143 to apply pressure to the sealing ring 220 via the adhesive sheet 12.

[0129] Next, the wafer loading step S40 includes supplying a fluid medium, such as air, into the interior of the seal ring 220 to expand it. The fluid medium is supplied to the interior of the seal ring 220 via the vertical fluid flow path 117 and the horizontal fluid flow path 136. The expansion force of the seal ring 220 applies stronger pressure to the seal ring 220 from the cover pressurizing portion 143 of the annular cover 140, thereby further improving the sealing performance of the annular cover 140.

[0130] Wafer processing step S50 is a step of spraying a processing liquid onto wafer 10 in wafer assembly 15 to process wafer 10. In this case, a processing liquid spray nozzle (not shown) sprays the processing liquid onto the upper side of wafer 10. When processing of wafer 10 is completed, chuck module 150 is driven to release the restraint on wafer 10, and the wafer transfer unit picks up wafer assembly 15 and discharges wafer assembly 15 to the outside of vacuum chuck unit 130.

[0131] On the other hand, if no leakage of the test medium is detected in the test medium leakage detection step S20, the seal ring replacement step S30 can be omitted. In other words, after the test medium leakage detection step S20, the wafer loading step S40 and the wafer processing step S50 are performed without replacing the seal ring 220.

[0132] Figure 20 For Figure 4 A longitudinal sectional view of an embodiment of a rotary joint to which the lower end of the rotary shaft is connected, Figure 21 To illustrate the cut along P1-P1 Figure 20 Transverse cross-sectional view of the rotary joint, Figure 22 To illustrate the cut along P2-P2 Figure 20 Transverse cross-sectional view of the rotary joint, Figure 23 To illustrate the cut along V1-V1 Figure 21 A longitudinal cross-sectional view of Figure 24 To illustrate the cut along V2-V2 Figure 22 Refer to the longitudinal section view of Figure 4 、 Figures 20 to 24 The substrate processing device of the present invention may further include Figure 4 The lower end of the rotating shaft 111 is connected to a rotating joint 300 . The rotating joint 300 includes a rotating core 301 , a stationary core 310 , and a cooling case 390 .

[0133] Inside the rotating core 301 and the fixed core 310 are formed: a vacuum connection flow path portion 360 connected to the lower end of the vacuum flow path portion 115 of the rotating shaft 111 in a manner that allows fluid to flow; and a first pressurized connection flow path portion 370 and a second pressurized connection flow path portion 380 connected to the lower end of the vertical medium flow path portion 117 of the rotating shaft 111 in a manner that allows fluid to flow. Figure 4 As shown, the vertical medium flow path portion 117 forms a pair, and accordingly, the pressurized connection flow path portions 370 and 380 also form a pair. Figure 4 When there is one or three or more, the number of the pressurizing connection flow path portions is also the same as the number of the vertical medium flow path portions.

[0134] Rotating core 301 is connected to the lower end of rotating shaft 111 and rotates along with rotating shaft 111 about axis CL. Stationary core 310 surrounds rotating core 301 and rotatably supports it. Stationary core 310 does not rotate along with rotating core 301. Rotating core 301 is generally cylindrical, while stationary core 310 is generally hollow cylindrical.

[0135] The vacuum connection flow path unit 360 includes a first vertical vacuum flow path 361, a first horizontal vacuum flow path 362, a second vertical vacuum flow path 368, and a second horizontal vacuum flow path 366. The first horizontal vacuum flow path 362 extends vertically parallel to the axis CL within the rotating core 301. Its upper end is open toward the upper side surface 302 of the rotating core 301 and is connected to the lower end of the vacuum flow path unit 115 in a manner that allows fluid flow. The first horizontal vacuum flow path 362 is connected to the lower end of the first vertical vacuum flow path 361 in a manner that allows fluid flow and extends horizontally toward the outer peripheral surface 303 of the rotating core 301.

[0136] Second vertical vacuum flow path 368 extends within stationary core 310 in a direction perpendicular to and parallel to axis CL, with its lower end open toward lower side surface 311 of stationary core 310. The lower end of second vertical vacuum flow path 368 is connected to a vacuum intake portion (not shown) for drawing in fluid, allowing fluid to flow. This allows fluid to flow in through the upper end of first vertical vacuum flow path 361 and be discharged through the lower end of second vertical vacuum flow path 368. The vacuum intake portion may include a vacuum pump (not shown) for generating negative pressure.

[0137] The second horizontal vacuum channel 366 is connected to the upper end of the second vertical vacuum channel 368 in a manner that allows fluid flow. It extends horizontally toward the inner side surface 313 of the stationary core 310 and is connected to the first horizontal vacuum channel 362 in a manner that allows fluid flow. An annular groove 364 is formed in the first horizontal vacuum channel 362, recessed inward from the outer circumferential surface 303 of the rotating core 301. The annular groove 364 extends along a circular path centered on the axis CL. The formation of the annular groove 364 allows fluid to flow from the first horizontal vacuum channel 362 to the second horizontal vacuum channel 366 even when the rotating core 301 rotates relative to the stationary core 310.

[0138] The first and second pressurized connecting flow paths 370 and 380 respectively include first vertical pressurized flow paths 371 and 381, first horizontal pressurized flow paths 372 and 382, ​​second vertical pressurized flow paths 378 and 388, and second horizontal pressurized flow paths 376 and 386. The first vertical pressurized flow paths 371 and 381 extend vertically parallel to the axis CL within the rotating core 301, with their upper ends open toward the upper side surface 302 of the rotating core 301, thereby connecting to the lower ends of the pair of vertical medium flow paths 117 in a manner that allows fluid flow. The first horizontal pressurized flow paths 372 and 382 are connected to the lower ends of the first vertical pressurized flow paths 371 and 381 in a manner that allows fluid flow, and extend horizontally toward the outer circumferential surface 303 of the rotating core 301.

[0139] Second vertical pressurized flow paths 378 and 388 extend within stationary core 310 in a direction perpendicular to and parallel to axis CL, with their lower ends opening toward lower side surface 311 of stationary core 310. The lower ends of second vertical pressurized flow paths 378 and 388 are connected to a fluid medium supply unit (not shown) for supplying a fluid medium in a fluid-flowable manner. This allows the fluid medium to flow into and out of first vertical pressurized flow paths 371 and 381 through the lower ends of second vertical pressurized flow paths 378 and 388 and be discharged through the upper ends of first vertical pressurized flow paths 371 and 381. The fluid medium supply unit may include a positive pressure pump for generating positive pressure.

[0140] The second horizontal pressurized flow paths 376 and 386 are connected to the upper ends of the second vertical pressurized flow paths 378 and 388 to facilitate fluid flow. They extend horizontally toward the inner circumferential surface 313 of the stationary core 310 to connect with the first horizontal pressurized flow paths 372 and 382. Annular grooves 374 and 384 are formed in the first horizontal pressurized flow paths 372 and 382, ​​recessed inward from the outer circumferential surface 303 of the rotating core 301. These grooves extend along a circular path centered on the axis CL. The annular groove 384 of the second pressurized connection flow path section 380 and the annular groove 374 of the first pressurized connection flow path section 370 have the same shape, differing only in their height on the outer circumferential surface of the rotating core 301. The formation of the annular grooves 374 and 384 allows fluid to flow from the second horizontal pressurized flow paths 376 and 386 to the first horizontal pressurized flow paths 372 and 382 even when the rotating core 301 rotates relative to the stationary core 310.

[0141] The vacuum connection flow path 360, the first pressurized connection flow path 370, and the second pressurized connection flow path 380 do not intersect within the rotating core 301 and the stationary core 310. With this structure, fluid flowing from the vacuum flow path 115 into the vacuum connection flow path 360 flows out of the rotary joint 300 through the lower side 311 of the stationary core 310. Furthermore, fluid (i.e., the fluid medium) flowing out of the first pressurized connection flow path 370 and the second pressurized connection flow path 380 into the vertical medium flow path 117 flows into the rotary joint 300 through the lower side 311 of the stationary core 310.

[0142] The rotary joint 300 also includes: an annular vacuum flow path packaging portion 330 (packing), which is arranged on the inner circumference 313 of the fixed core 310 to prevent the fluid from flowing from between the first horizontal vacuum flow path 362 and the second horizontal vacuum flow path 366 to the vacuum connection flow path portion 360, resulting in a decrease in the vacuum pressure (i.e., negative pressure) of the vacuum connection flow path portion 360; and an annular first pressurized flow path packaging portion 340 and a second pressurized flow path packaging portion 350, which are arranged on the inner circumference of the fixed core 310 to prevent the fluid from flowing from between the first horizontal pressurized flow paths 372, 382 and the second horizontal pressurized flow paths 376, 386 of the first pressurized connection flow path portion 370 and the second pressurized connection flow path portion 380 to the outside of the first pressurized connection flow path portion 370 and the second pressurized connection flow path portion 380, resulting in a decrease in the air pressure (fluid gas pressure) of the first pressurized connection flow path portion 370 and the second pressurized connection flow path portion 380.

[0143] A vacuum channel encapsulation groove 320, a first pressurized channel encapsulation groove 323, and a second pressurized channel encapsulation groove (not shown) are formed on the inner circumferential surface 313 of the stationary core 310. These grooves are formed in an annular pattern extending along a circular path centered on the axis CL. The vacuum channel encapsulation groove 320 is the same height as the first horizontal vacuum channel 362 and the second horizontal vacuum channel 366. The first pressurized channel encapsulation groove 323 is the same height as the first horizontal pressurized channel 372 and the second horizontal pressurized channel 376 of the first pressurized connecting channel unit 370. The second pressurized channel encapsulation groove is the same height as the first horizontal pressurized channel 382 and the second horizontal pressurized channel 386 of the second pressurized connecting channel unit 380.

[0144] The vacuum flow path packaging portion 330 includes a body portion 331, an upper lip portion 334 and a lower lip portion 336. The body portion 331, the upper lip portion 334 and the lower lip portion 336 all extend in a ring shape along a circular trajectory centered on the axis CL. The upper lip portion 334 and the lower lip portion 336 are arranged to be separated from each other up and down. The body portion 331 is inserted and placed in the vacuum flow path packaging portion placement groove 320. A through hole 332 is formed in the body portion 331 that passes through the body portion 331 in the horizontal direction to prevent the second horizontal vacuum flow path 366 from being closed. The upper lip portion 334 and the lower lip portion 336 protrude from the body portion 331 toward the outer peripheral surface 303 of the rotating core 301, and contact the outer peripheral surface 303 of the rotating core 301 while preventing the first horizontal vacuum flow path 362 from being closed.

[0145] like Figure 23 As shown, the upper lip 334 and the lower lip 336 protrude in an inclined manner in a direction vertically away from the annular groove 364 of the first horizontal vacuum flow path 362 as they approach the outer circumferential surface 303 of the rotating core 301 in the horizontal direction. Specifically, the upper lip 334 protrudes in an inclined direction in an upward direction as it approaches the outer circumferential surface 303 of the rotating core 301 in the horizontal direction, and the lower lip 336 protrudes in a inclined direction in a downward direction as it approaches the outer circumferential surface 303 of the rotating core 301 in the horizontal direction. When vacuum pressure is formed in such a way that the fluid is sucked into the annular groove 364 of the first horizontal vacuum flow path 362 and the inner peripheral side end 367 of the second horizontal vacuum flow path 366, the end of the upper lip 334 and the end of the lower lip 336 shrink in a manner close to each other and strongly adhere to the outer peripheral surface 303 of the rotating core 301. Therefore, the inflow of fluid between the outer peripheral surface 303 of the rotating core 301 and the end of the upper lip 334 and the end of the lower lip 336 is reliably blocked, so that the vacuum pressure of the vacuum connecting flow path portion 360 will not be weakened.

[0146] The first pressurized flow path packaging part 340 includes a main body 341, an upper lip 344 and a lower lip 346. The main body 341, the upper lip 344 and the lower lip 346 all extend in a ring shape along a circular trajectory centered on the axis CL. The upper lip 344 and the lower lip 346 are arranged to be separated from each other up and down. The main body 341 is inserted and placed in the first pressurized flow path packaging part placement groove 323. A through hole 342 is formed in the main body 341, which passes through the main body 341 in the horizontal direction, to prevent the second horizontal pressurized flow path 376 from being closed. The upper lip 344 and the lower lip 346 protrude from the main body 341 toward the outer peripheral surface 303 of the rotating core 301, and contact the outer peripheral surface 303 of the rotating core 301 while preventing the first horizontal pressurized flow path 372 from being closed.

[0147] like Figure 24 As shown, the upper lip 344 and the lower lip 346 protrude in an inclined manner as they approach the outer circumferential surface 303 of the rotating core 301 in the horizontal direction, and vertically approach the annular groove 374 of the first horizontal pressurizing flow path 372. Specifically, the upper lip 344 protrudes in an inclined direction as it approaches the outer circumferential surface 303 of the rotating core 301 in the horizontal direction, and the lower lip 346 protrudes in an inclined direction as it approaches the outer circumferential surface 303 of the rotating core 301 in the horizontal direction. When positive pressure is generated by supplying fluid between the annular groove 374 of the first horizontal pressurized flow path 372 and the inner peripheral side end 377 of the second horizontal pressurized flow path 376, the end of the upper lip 344 and the end of the lower lip 346 are separated from each other and strongly adhered to the outer peripheral surface 303 of the rotating core 301 in a mutually expanded manner, so that the outflow of fluid between the outer peripheral surface 303 of the rotating core 301 and the end of the upper lip 344 and the end of the lower lip 346 is reliably blocked, so that the positive pressure of the first pressurized connecting flow path portion 370 will not be weakened.

[0148] The second pressurized flow path packaging part 350 includes a main body, an upper lip and a lower lip having the same shape and structure as the main body 341, the upper lip 344 and the lower lip 346 of the first pressurized flow path packaging part 340, so repeated descriptions will be omitted. The main body of the second pressurized flow path packaging part 350 is inserted and placed in the second pressurized flow path packaging part placement groove (not shown). For example, the vacuum flow path packaging part 330, the first pressurized flow path packaging part 340 and the second pressurized flow path packaging part 350 can be formed of a rubber material. Preferably, in order to reduce friction with the rotating rotating core 301, the vacuum flow path packaging part 330, the first pressurized flow path packaging part 340 and the second pressurized flow path packaging part 350 can be formed of a polytetrafluoroethylene (PTFE, polytetrafluoroethylene) material with excellent self-lubricity.

[0149] The rotating core 301 includes a ceramic coating layer 305 laminated on the outer peripheral surface 303 to reduce friction when the rotating core 301 rotates about the axis CL relative to the stationary core 310. The ceramic coating layer 305 has excellent heat resistance and wear resistance, thereby enabling the rotating core 301 to rotate stably at high speed and preventing damage to the rotating core 301 and the stationary core 310. Figure 23 and Figure 24 As shown, the ceramic coating 305 can be selectively laminated only on the area of ​​the outer peripheral surface 303 that contacts the vacuum flow path sealing part 330 , the first pressurized flow path sealing part 340 and the second pressurized flow path sealing part 350 , or can be laminated on the entire area of ​​the outer peripheral surface 303 .

[0150] The stationary core 310 may be formed of one component, such as Figure 20 As shown, the rotary joint 300 may include a plurality of annular blocks 355, 356, 357, and 358 stacked and surrounding the rotary core 301. In this case, the number of annular blocks 355, 356, 357, and 358 can be increased or decreased to easily adjust the height of the rotary joint 300. Furthermore, by pre-preparing a plurality of standard annular blocks 355, 356, 357, and 358, the rotary joint 300 can be quickly assembled and manufactured.

[0151] The cooling shell 390 surrounds the outer circumferential surface 313 of the stationary core 310, forming a cooling flow path 397 between the cooling shell 390 and the stationary core 310. Specifically, the cooling shell 390 includes an annular upper end portion 392 and a lower end portion 393, which are connected and supported by the upper and lower ends of the outer circumferential surface 313 of the stationary core 310. The cooling shell 390 also includes a tube portion 391 extending from the outer circumference of the upper end portion 392 to the outer circumference of the lower end portion 393. This forms the cooling flow path 397 between the outer circumferential surface 313 of the stationary core 310, the inner circumferential surface of the tube portion 391, the lower side surface of the upper end portion 392, and the upper side surface of the lower end portion 393.

[0152] A refrigerant inlet 394 and a refrigerant outlet 395 are formed in the lower end portion 393, extending vertically therethrough. The tube portion 391 includes an inner wall 396 that protrudes toward the axis CL, with its inner circumference in contact with the outer circumferential surface 313 of the stationary core 310. The refrigerant inlet 394 and the refrigerant outlet 395 are arranged on one side and the other side of the rotary joint 300, with the inner wall 396 interposed therebetween. The refrigerant inlet 394 is connected to a refrigerant supply passage (not shown) external to the rotary joint 300, while the refrigerant outlet 395 is connected to a refrigerant discharge passage (not shown) external to the rotary joint 300.

[0153] Even when the rotating core 301 rotates at high speed relative to the stationary core 310, the refrigerant flowing into the cooling flow path 397 through the refrigerant inflow hole 394 flows along the outer peripheral surface of the stationary core 310, cools the stationary core 310 and the rotating core 301 through heat exchange, and is then released to the outside of the rotary joint 300 through the refrigerant outflow hole 395. This prevents overheating of the rotary joint 300 and the resulting damage, thereby improving the service life, i.e., the durability, of the rotary joint 300.

[0154] like Figure 20 As shown, when stationary core 310 includes a plurality of stacked annular blocks 355, 356, 357, and 358, the refrigerant flowing into cooling flow path 397 can pass between the stacked annular blocks 355, 356, 357, and 358, further improving cooling efficiency. Inner wall 396 is disposed between refrigerant inlet 394 and refrigerant outlet 395, so that refrigerant flowing into cooling flow path 397 through refrigerant inlet 394 does not exit through refrigerant outlet 395 without sufficient heat exchange. For example, the refrigerant flowing into cooling flow path 397 through refrigerant inlet 394 can be cooling water at room temperature.

[0155] The rotary joint 300 is connected to a vacuum suction unit (not shown) and a fluid medium supply unit (not shown) outside the rotary joint 300 in a fluid-flowing manner solely through the lower end of the fixed core 310. Connection to the vacuum suction unit and fluid medium supply unit is not through the outer circumference of the rotary joint 300. This allows for a compact design and manufacture of the rotary joint 300, making it easily installable in limited installation spaces.

[0156] Figure 25 FIG. 1 is a longitudinal cross-sectional view of another embodiment of a rotary joint. Figure 25 ,and Figure 20 Similar to the rotary joint 300 shown, a rotary joint 400 according to another embodiment of the present invention includes a rotating core 401, a stationary core 405, and a cooling housing 440. The rotating core 401 is rotatable relative to the stationary core 405. A cooling flow path 445 is formed between the outer circumference of the stationary core 405 and the inner circumference of the cooling housing 440, through which refrigerant flows to prevent overheating of the rotating core 401 and the stationary core 405. A refrigerant inlet 442 and a refrigerant outlet 443 are formed at the lower end of the cooling housing 440. The refrigerant inlet 442 guides refrigerant from the exterior of the rotary joint 400 into the cooling flow path 445, while the refrigerant outlet 443 guides refrigerant from the cooling flow path 445 out of the rotary joint 400.

[0157] and Figure 20Unlike the illustrated rotary joint 300, the rotary joint 400 has multiple vacuum connection flow paths 410 and 415 and multiple pressurized connection flow paths 420, 425, and 430 formed inside the rotating core 401 and the stationary core 405. The multiple vacuum connection flow paths 410 and 415 do not intersect within the rotary joint 400, and the multiple pressurized connection flow paths 420, 425, and 430 also do not intersect within the rotary joint 400.

[0158] and Figure 20 The vacuum connection flow path portion 360 of the rotary joint 300 shown is the same as that of the rotary joint 300, and the plurality of vacuum connection flow path portions 410 and 415 respectively include a first vertical vacuum flow path, a second vertical vacuum flow path, a first horizontal vacuum flow path, and a second horizontal vacuum flow path. Figure 20 The pressurized connection flow path portions 370 and 380 of the rotary joint 300 shown are identical, and the plurality of pressurized connection flow path portions 420 , 425 , and 430 respectively include a first vertical pressurized flow path, a second vertical pressurized flow path, a first horizontal pressurized flow path, and a second horizontal pressurized flow path.

[0159] and Figure 20 The same as the rotary joint 300, the lower ends of all the second vertical vacuum flow paths of the plurality of vacuum connection flow path parts 410, 415 are open downward through the lower side of the fixed core 405, and the upper ends of all the first vertical vacuum flow paths of the plurality of vacuum connection flow path parts 410, 415 are open upward through the upper side of the rotating core 401. Figure 20 The same as the rotary joint 300, the lower ends of all the second vertical pressurized flow paths of the multiple pressurized connection flow path parts 420, 425, and 430 are opened downward through the lower side surface of the fixed core 405, and the upper ends of all the first vertical pressurized flow paths of the multiple pressurized connection flow path parts 420, 425, and 430 are opened upward through the upper side surface of the rotating core 401.

[0160] At least one of the plurality of pressurized connection flow paths 420, 425, and 430 is connected to the medium supply unit 210. Thus, the inspection medium used to confirm damage to the seal ring unit 220 can pass through the medium supply tube 211 of the medium supply unit 210, flow into the interior of the rotary joint 400 through the lower side of the stationary core 405, and then flow out through the upper side of the rotating core 401 to be supplied to the seal ring unit 220 through the horizontal medium flow path 136 of the vertical medium flow path 117.

[0161] but Figure 25 The lower ends of the second vertical vacuum flow paths of the plurality of vacuum connection flow path portions 410 and 415 shown in the figure do not extend downwardly in an open manner through the lower side surface of the fixed core 405. This is because it is impossible to present the entire structure in one longitudinal section, and the figure is simplified due to this limitation. Figure 25The upper end of the first vertical pressurized flow path in the multiple pressurized connecting flow path sections 420, 425, and 430 shown does not extend upward in a manner that is open through the upper side surface of the rotating core 401, and the lower end of the second vertical pressurized flow path in the multiple pressurized connecting flow path sections 420, 425, and 430 does not extend downward in a manner that is open through the lower side surface of the fixed core 405. This is because the entire structure cannot be presented in one longitudinal section, and a brief illustration is given due to this limitation.

[0162] Figure 26 FIG. 1 is a longitudinal sectional view of another embodiment of a rotary joint. Figure 26 ,and Figure 25 Similar to the rotary joint 500 shown, another embodiment of the rotary joint 500 of the present invention includes a rotating core 501, a stationary core 505, and a cooling housing 540. The rotating core 501 is rotatable relative to the stationary core 505. A cooling flow path 545 is formed between the outer circumference of the stationary core 505 and the inner circumference of the cooling housing 540, allowing refrigerant to flow to prevent overheating of the rotating core 501 and the stationary core 505. A refrigerant inlet 542 and a refrigerant outlet 543 are formed at the lower end of the cooling housing 540. The refrigerant inlet 542 guides refrigerant from the outside of the rotary joint 500 into the cooling flow path 545, while the refrigerant outlet 543 guides refrigerant from the cooling flow path 545 to the outside of the rotary joint 400.

[0163] The rotary joint 500 forms a plurality of vacuum connection flow paths 510, 515 and a plurality of pressurized connection flow paths 520, 525, 530 inside the rotating core 501 and the stationary core 505. The plurality of vacuum connection flow paths 510, 515 do not intersect with each other inside the rotary joint 500, and the plurality of pressurized connection flow paths 520, 525, 530 also do not intersect with each other inside the rotary joint 500. The structure of the plurality of vacuum connection flow paths 510, 515 and the plurality of pressurized connection flow paths 520, 525, 530 is similar to that of the rotary joint 500. Figure 25 The structures of the plurality of vacuum connection flow path portions 410 and 415 and the plurality of pressurized connection flow path portions 420 , 425 , and 430 are the same, and therefore repeated descriptions will be omitted.

[0164] The fixed core 505 is formed of a single tubular block, not a plurality of stacked blocks. A refrigerant circulation flow path 550 is formed inside the fixed core 505, which is connected to the cooling flow path 545 and passes through the fixed core 505, so that the refrigerant can flow. The refrigerant flowing into the cooling flow path 545 through the refrigerant inlet hole 542 passes through the refrigerant circulation flow path 550 and passes through the fixed core 505, and is discharged to the outside of the rotary joint 500 through the refrigerant outflow hole 543. As a result, the heat exchange efficiency of the refrigerant is improved. Therefore, for example, even if a liquid with excellent cooling performance such as cooling water is not used as a refrigerant, but a gas such as air or nitrogen (N2) is used as a refrigerant, an appropriate cooling effect of the rotary joint 500 can be expected.

[0165] Although the present invention is described with reference to the embodiments shown in the accompanying drawings, these are merely examples, and those skilled in the art will readily appreciate that various modifications and equivalent embodiments are possible. Therefore, the true scope of the present invention is defined by the appended claims.

Claims

1. A substrate processing device, characterized in that: include: A vacuum chuck portion, configured to absorb and support a wafer assembly, wherein the wafer assembly includes a wafer; a rotating chuck portion, configured to rotate the vacuum chuck portion; a rotating shaft connected to the rotating chuck portion to rotate the rotating chuck portion; an annular cover portion, applying pressure to the wafer assembly to prevent the processing liquid sprayed onto the wafer from spreading toward the vacuum chuck portion; a sealing ring portion, disposed on the vacuum chuck portion and used to support the wafer assembly; as well as The medium supply portion is connected to the vacuum chuck portion and is used to supply an inspection medium to the vacuum chuck portion so that the inspection medium flows into the interior of the sealing ring portion. The inspection medium is used to confirm damage to the sealing ring portion.

2. The substrate processing apparatus according to claim 1, wherein: A vacuum flow path portion for forming a vacuum pressure on the vacuum chuck portion and a vertical medium flow path portion for supplying a fluid medium to the seal ring portion are formed on the rotation shaft.

3. The substrate processing apparatus according to claim 2, wherein: The substrate processing apparatus further includes a rotary joint including a rotary core and a fixed core. The rotary core is connected to the rotary shaft and rotates together with the rotary shaft. The fixed core surrounds the rotary core and rotatably supports the rotary core.

4. The substrate processing apparatus according to claim 3, wherein: A vacuum connection flow path portion and a pressurized connection flow path portion are formed in the rotary joint. The vacuum connection flow path portion is connected to the vacuum flow path portion in a manner that allows fluid to flow, and the pressurized connection flow path portion is connected to the vertical medium flow path portion in a manner that allows fluid to flow. In the vacuum flow path portion, the fluid flowing into the vacuum connection flow path portion flows out to the outside of the rotary joint through the fixed core. In the pressurized connection flow path portion, the fluid flowing out to the vertical medium flow path portion flows into the interior of the rotary joint through the fixed core.

5. The substrate processing apparatus according to claim 4, wherein: The vacuum connection flow path portion includes: a first vertical vacuum flow path extending vertically inside the rotating core, wherein an upper end of the first vertical vacuum flow path is open toward an upper side surface of the rotating core; a first horizontal vacuum flow path connected to a lower end of the first vertical vacuum flow path and extending in a horizontal direction toward an outer peripheral surface of the rotating core; a second vertical vacuum flow path extending vertically inside the fixed core, wherein a lower end of the second vertical vacuum flow path is open toward a lower side surface of the fixed core; and The second horizontal vacuum flow path is connected to the upper end of the second vertical vacuum flow path and extends in a horizontal direction toward the inner peripheral surface of the fixed core to be connected to the first horizontal vacuum flow path.

6. The substrate processing apparatus according to claim 5, wherein: The pressurized connecting flow path portion includes: a first vertical pressurized flow path extending vertically inside the rotating core, with an upper end of the first vertical pressurized flow path opening toward an upper side surface of the rotating core; a first horizontal pressurizing flow path connected to a lower end of the first vertical pressurizing flow path and extending horizontally toward an outer peripheral surface of the rotating core; a second vertical pressurized flow path extending vertically inside the stationary core, with a lower end of the second vertical pressurized flow path opening toward a lower side surface of the stationary core; and a second horizontal pressurized flow path connected to the upper end of the second vertical pressurized flow path and extending horizontally toward the inner circumference of the fixed core to connect to the first horizontal pressurized flow path; The vacuum connection flow path portion and the pressurization connection flow path portion do not intersect with each other.

7. The substrate processing apparatus according to claim 6, wherein: The first horizontal vacuum flow path and the first horizontal pressurized flow path each include an annular groove recessed inward from the outer circumferential surface of the rotary core.

8. The substrate processing apparatus according to claim 4, wherein: The plurality of vacuum connection flow path portions are formed in a manner not to intersect with each other inside the rotary joint, The plurality of pressurizing connection flow path portions are formed so as not to intersect with each other inside the rotary joint.

9. The substrate processing apparatus according to claim 8, wherein: At least one of the plurality of pressurized connection flow path portions is connected to the medium supply portion so that the inspection medium flows in through the lower side surface of the stationary core and flows out through the upper side surface of the rotating core.

10. The substrate processing apparatus according to claim 5, wherein: The rotary joint also includes an annular vacuum flow path packaging portion, which is arranged on the inner circumferential surface of the fixed core to prevent fluid from flowing from between the first horizontal vacuum flow path and the second horizontal vacuum flow path into the vacuum connecting flow path portion, thereby reducing the vacuum pressure of the vacuum connecting flow path portion.

11. The substrate processing apparatus according to claim 10, wherein: A vacuum flow path packaging portion placement groove is formed in the form of an annular depression on the inner circumference of the fixed core. The vacuum flow path packaging portion includes: a main body, inserted into the vacuum flow path packaging portion placement groove, and formed with a through hole to prevent the second horizontal vacuum flow path from being closed; and a lip portion protruding from the main body toward the outer peripheral surface of the rotating core, and contacting the outer peripheral surface of the rotating core while preventing the first horizontal vacuum flow path from being closed; The lip portion of the vacuum flow path sealing portion protrudes so as to be inclined in a direction away from the first horizontal vacuum flow path in a vertical direction as it approaches the outer peripheral surface of the rotary core in a horizontal direction.

12. The substrate processing apparatus according to claim 6, wherein: The rotary joint also includes an annular pressurized flow path packaging portion, which is arranged on the inner circumferential surface of the fixed core to prevent the fluid from flowing out from between the first horizontal pressurized flow path and the second horizontal pressurized flow path to the outside of the pressurized connecting flow path portion, thereby reducing the air pressure of the pressurized connecting flow path portion.

13. The substrate processing apparatus according to claim 12, wherein: A pressurized flow path packaging portion placement groove is formed in the form of an annular depression on the inner circumference of the fixed core. The pressurized flow path packaging portion includes: a main body, inserted into the pressurized flow path packaging portion placement groove, formed with a through hole to prevent the second horizontal pressurized flow path from being closed; and a lip portion protruding from the main body toward the outer peripheral surface of the rotating core, and contacting the outer peripheral surface of the rotating core while preventing the first horizontal pressurizing flow path from being closed; The lip portion of the pressurizing flow path sealing portion protrudes so as to be inclined in a direction closer to the first horizontal pressurizing flow path in a vertical direction as it approaches the outer peripheral surface of the rotating core in a horizontal direction.

14. The substrate processing apparatus according to claim 3, wherein: The rotating core includes a ceramic coating layer laminated on an outer peripheral surface of the rotating core to reduce friction when the rotating core rotates relative to the stationary core.

15. The substrate processing apparatus according to claim 3, wherein: The stationary core includes a plurality of annular blocks stacked to surround the rotating core.

16. The substrate processing apparatus according to claim 3, wherein: The rotary joint further includes a cooling shell surrounding an outer peripheral surface of the stationary core to form a cooling flow path for a refrigerant to flow between the cooling shell and the stationary core.

17. The substrate processing apparatus according to claim 16, wherein: A refrigerant circulation flow path is formed inside the stationary core. The refrigerant circulation flow path is connected to the cooling flow path and penetrates the stationary core so that the refrigerant can flow.

18. The substrate processing apparatus according to claim 1, wherein The medium supply unit includes: a medium supply pipe portion connected to the vacuum chuck portion to supply an inspection medium to the vacuum chuck portion; and The pressure detection unit is used to measure the pressure of the medium supply pipe.

19. The substrate processing apparatus according to claim 18, wherein: The medium supply unit further includes a flow rate detection unit configured to measure a flow rate of the inspection medium supplied from the medium supply pipe unit to the vacuum chuck unit.

20. The substrate processing apparatus according to claim 1, wherein The substrate processing apparatus further includes a chuck module disposed on the rotary chuck portion, configured to position the wafer assembly on the vacuum chuck portion and to lower the annular cover portion so that the annular cover portion applies pressure to the wafer assembly.

21. The substrate processing apparatus according to claim 20, wherein: The chuck module comprises: A chuck base, disposed on the rotating chuck portion; a chuck rotating portion connected to the chuck base to rotate the chuck base; a plurality of first chuck connecting rods, which move in radial directions when the chuck base rotates; a plurality of wafer assembly restraining portions connected to the plurality of first chuck link portions so as to apply pressure as the plurality of first chuck link portions move in radial directions, thereby positioning the retaining ring portion on the vacuum chuck portion; a plurality of second chuck link portions that move in radial directions when the chuck base rotates; and A plurality of cover limiting parts are used to connect the plurality of second chuck link parts and the annular cover part, so as to move the annular cover part upward and downward in conjunction with the movement of the plurality of second chuck link parts.

22. The substrate processing apparatus according to claim 21, wherein: When the chuck base rotates, the plurality of first chuck link parts and the plurality of second chuck link parts move in radial directions simultaneously.

23. The substrate processing apparatus according to claim 1, wherein The sealing ring portion includes: a sealing member received in a sealing groove portion provided in the vacuum chuck portion, and forming a deformable space portion inside the sealing member; a limiting ring portion, disposed in the sealing groove portion to fix the sealing component; and The connector portion is connected to the deformation space portion to supply the inspection medium to the deformation space portion.

24. The substrate processing apparatus according to claim 23, wherein: The sealing component includes at least one of an elastic groove, a tapered portion, a recessed portion, a height difference portion, a deformation groove, an arc portion and a protruding portion, so as to increase the elastic deformation of the sealing component when the annular cover portion applies pressure to the sealing component through the wafer assembly.

25. The substrate processing apparatus according to claim 1, wherein The wafer assembly further includes a bonding sheet and a retaining ring portion, wherein the bonding sheet is used to absorb and support the wafer, and the retaining ring portion is combined with the outer periphery of the bonding sheet. The annular cover portion applies pressure to the bonding sheet between the wafer and the clamping ring portion.

26. A control method for a substrate processing device, characterized in that: The substrate processing device is the substrate processing device according to claim 1, The control method of the substrate processing device includes: an inspection medium supplying step of driving the medium supplying portion to supply the inspection medium into the interior of the sealing ring portion; and The inspection medium leakage detection step detects whether the inspection medium supplied to the interior of the seal ring portion has leaked to the outside of the seal ring portion.

27. The control method of a substrate processing apparatus according to claim 26, wherein: Also includes: a sealing ring replacing step of removing the sealing ring from the vacuum chuck portion and installing another sealing ring portion on the vacuum chuck portion when leakage of the inspection medium is detected in the inspection medium leakage detecting step; a wafer mounting step of fixing and mounting the wafer assembly on the vacuum chuck portion; and The wafer processing step sprays the processing liquid onto the wafer of the wafer assembly to process the wafer.

28. The control method of a substrate processing apparatus according to claim 26, wherein: Also includes: a wafer loading step of, when no leakage of the inspection medium is detected in the inspection medium leakage detection step, fixing and loading the wafer assembly on the vacuum chuck portion without replacing the sealing ring portion; and The wafer processing step sprays the processing liquid onto the wafer of the wafer assembly to process the wafer.

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