Portable communication device

Abstract

Disclosed is a portable communication device comprising: a panel forming at least a portion of a display unit and being foldable along a folding line; a bending unit arranged adjacent to a long side of the panel; a film unit connected to the bending unit and including a display driving circuit; an FPCB connected to the film unit and connecting a processor and the display driving circuit; and a protective member arranged on the bending unit so as to cover at least a portion of the bending unit, wherein the protective member is adhered to a surface of the bending unit where the bending unit contacts a bracket. Various other embodiments are possible as determined by the specification.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 202080013321.9, whose application date is February 10, 2020 and whose invention name is “Foldable electronic device including protective component”. Technical Field

[0002] The present disclosure relates to a technology for realizing a foldable electronic device including a protective member. Background Art

[0003] In an electronic device, a display driver IC for driving a display may be disposed on a curved portion of a panel. A foldable electronic device may have a fold line extending across the display in a direction parallel to its long sides. The foldable electronic device may be foldable along the fold line. In the foldable electronic device, the display driver IC may be disposed in an area adjacent to the long side that is not provided on the fold line. Summary of the Invention

[0004] Technical issues

[0005] In conventional electronic devices, a gap is formed between the curved portion and the bracket without attaching a separate protective member to the curved portion of the panel on which the display driver IC is mounted. The front panel of a typical electronic device is rigid, so even if pressure is applied to the front panel, the curved portion and the bracket may not contact each other. However, in the case of a foldable electronic device, the front panel can be flexible so as to be foldable. When pressure is applied to the front panel of the foldable electronic device, the curved portion and the bracket may contact each other. If foreign matter is present on the surface where the bracket contacts the curved portion, the curved portion may be damaged.

[0006] An aspect of the present disclosure is to provide a foldable electronic device for preventing damage to a bent portion due to contact between a support and the bent portion.

[0007] Technical Solution

[0008] An electronic device according to one aspect of the present disclosure includes: a panel constituting at least a portion of a display portion and being folded along a folding line; a bent portion arranged adjacent to a long edge of the panel; a membrane portion connected to the bent portion and including a display driving circuit; an FPCB connected to the membrane portion and connecting a processor and the display driving circuit; and a protective member arranged on the bent portion and covering at least a portion of the bent portion, wherein the protective member is adhered to one side of the bent portion, on which side the bent portion and a bracket are in contact.

[0009] An electronic device according to one aspect of the present disclosure includes: a bracket; a decoration connected to one side of the bracket; a window having flexibility; a panel arranged between the bracket and the window; a protective member arranged on a curved portion of the panel and covering at least a portion of the curved portion, wherein the protective member is adhered to one side of the curved portion, on which the curved portion and the bracket are in contact, and wherein the decoration is spaced apart from the window.

[0010] Beneficial effects

[0011] According to an embodiment of the present disclosure, a protective member may be provided on the bent portion to prevent contact between the bracket and the bent portion, thereby preventing damage to the bent portion even if pressure is applied to the front plate.

[0012] Furthermore, the present disclosure can provide various effects that are seen directly or indirectly. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a view illustrating a flat state of the electronic device according to the embodiment.

[0014] Figure 2 is a view illustrating a folded state of the electronic device according to the embodiment.

[0015] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0016] Figure 4 is a view showing a panel, a bending portion, a display driver IC, and a film portion of a conventional electronic device.

[0017] Figure 5a is a view showing a panel, a flex portion, a film portion, a display driver IC, and an FPCB of a conventional electronic device.

[0018] Figure 5b are views illustrating a bending portion, a membrane portion, and an FPCB of an electronic device according to an embodiment.

[0019] Figure 6 are views illustrating a panel, a bending portion, a film portion, a display driver IC, an FPCB, and a protective member of an electronic device according to an embodiment.

[0020] Figure 7 is a view illustrating a transistor layer, a substrate layer, a plurality of films, an encapsulation layer and a resin layer, and a protective member included in a panel and a bending portion of an electronic device according to an embodiment.

[0021] Figure 8 It is a cross-sectional view of a conventional electronic device.

[0022] Figure 9is a cross-sectional view of an electronic device according to an embodiment.

[0023] Figure 10 is a cross-sectional view of an electronic device according to another embodiment.

[0024] Figure 11a is a cross-sectional view of an electronic device according to another embodiment.

[0025] Figure 11b is a cross-sectional view of an electronic device according to another embodiment.

[0026] Figure 12 is a block diagram illustrating electronic devices in a network environment according to various embodiments.

[0027] With regard to the description of the drawings, the same or similar reference numerals may be used to refer to the same or similar components. DETAILED DESCRIPTION

[0028] Hereinafter, various embodiments of the present disclosure may be described with reference to the accompanying drawings. Therefore, those skilled in the art will recognize that, without departing from the scope and spirit of the present disclosure, the various embodiments described herein may be modified, equivalent and / or replaced.

[0029] Figure 1 is a view illustrating a flat state of the electronic device according to the embodiment. Figure 2 is a view illustrating a folded state of the electronic device according to the embodiment.

[0030] Reference Figure 1 and Figure 2 In an embodiment, the electronic device 10 may include a foldable housing 500, a hinge cover 530 covering a foldable portion of the foldable housing, and a flexible or foldable display 100 (hereinafter referred to as the "display" 100) disposed in a space formed by the foldable housing 500. In the present disclosure, a side on which the display 100 is disposed is defined as a first side or front side of the electronic device 10. A side facing away from the front side is defined as a second side or rear side of the electronic device 10. In addition, a side surrounding the space between the front side and the rear side is defined as a third side or lateral side of the electronic device 10.

[0031] In an embodiment, the foldable housing 500 may include a first housing structure 510, a second housing structure 520 including a sensor area 524, a first back cover 580, and a second back cover 590. The foldable housing 500 of the electronic device 10 is not limited to Figure 1 and Figure 2The forms and connections shown in the drawings may be implemented by combinations and / or connections of other shapes or components. For example, in another embodiment, the first housing structure 510 and the first back cover 580 may be integrally formed with each other, and the second housing structure 520 and the second back cover 590 may be integrally formed with each other.

[0032] In the illustrated embodiment, the first housing structure 510 and the second housing structure 520 can be disposed on opposite sides of the folding axis (axis A) and can have shapes that are substantially symmetrical to each other relative to the folding axis A. As described below, the angle or distance between the first housing structure 510 and the second housing structure 520 can vary depending on whether the electronic device 10 is in a flat state, a folded state, or an intermediate state. In the illustrated embodiment, unlike the first housing structure 510, the second housing structure 520 can additionally include a sensor region 524 in which various sensors are disposed. However, the first housing structure 510 and the second housing structure 520 can have shapes that are symmetrical to each other in other regions.

[0033] In an embodiment, Figure 1 As shown, the first housing structure 510 and the second housing structure 520 can form a recess in which the display 100 is received. In the embodiment shown, due to the sensor area 524, the recess can have two or more different widths in a direction perpendicular to the folding axis A.

[0034] For example, the recess may have (1) a first width w1 between a first portion 510a of the first housing structure 510 parallel to the folding axis A and a first portion 520a of the second housing structure 520 formed on the periphery of the sensor region 524, and (2) a second width w2 between a second portion 510b of the first housing structure 510 and a second portion 520b of the second housing structure 520 that does not correspond to the sensor region 524 and is parallel to the folding axis A. In this case, the second width w2 may be greater than the first width w1. In other words, the first portion 510a of the first housing structure 510 and the first portion 520a of the second housing structure 520 having mutually asymmetrical shapes may form the first width w1 of the recess, and the second portion 510b of the first housing structure 510 and the second portion 520b of the second housing structure 520 having mutually symmetrical shapes may form the second width w2 of the recess. In an embodiment, the first portion 520a and the second portion 520b of the second housing structure 520 may have different distances from the folding axis A. The width of the recess is not limited to the example shown. In various embodiments, the recess may have a variety of widths depending on the form of the sensor region 524 or the asymmetric portions of the first and second housing structures 510, 520.

[0035] In an embodiment, at least a portion of the first housing structure 510 and at least a portion of the second housing structure 520 may be formed of a metallic or non-metallic material having a stiffness selected to support the display 100 .

[0036] In an embodiment, the sensor area 524 may have a predetermined area adjacent to one corner of the second housing structure 520. However, the arrangement, shape, and size of the sensor area 524 are not limited to the example shown. For example, in another embodiment, the sensor area 524 may be provided in another corner of the second housing structure 520, or in any area between the upper corner and the lower corner of the second housing structure 520. In an embodiment, components embedded in the electronic device 10 for performing various functions may be exposed to the front side of the electronic device 10 through the sensor area 524 or through one or more openings formed in the sensor area 524. In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front-facing camera, a receiver, or a proximity sensor.

[0037] The first rear cover 580 can be disposed on the rear side of the electronic device on one side of the folding axis. For example, the first rear cover 580 can have a generally rectangular periphery, and the periphery can be surrounded by the first housing structure 510. Similarly, the second rear cover 590 can be disposed on the rear side of the electronic device on the opposite side of the folding axis, and the periphery of the second rear cover 590 can be surrounded by the second housing structure 520.

[0038] In the illustrated embodiment, the first back cover 580 and the second back cover 590 may have shapes that are substantially symmetrical relative to the folding axis (axis A). However, the first back cover 580 and the second back cover 590 do not necessarily have mutually symmetrical shapes. In another embodiment, the electronic device 10 may include a first back cover 580 and a second back cover 590 of various shapes. In another embodiment, the first back cover 580 may be integrally formed with the first housing structure 510, and the second back cover 590 may be integrally formed with the second housing structure 520.

[0039] In an embodiment, the first rear cover 580, the second rear cover 590, the first housing structure 510, and the second housing structure 520 may form a space in which various components of the electronic device 10 (e.g., a printed circuit board or a battery) are disposed. In an embodiment, one or more components may be disposed on the rear side of the electronic device 10 or visually exposed on the rear side of the electronic device 10. For example, at least a portion of the sub-display 190 may be visually exposed through the first rear region 582 of the first rear cover 580. In another embodiment, one or more components or sensors may be visually exposed through the second rear region 592 of the second rear cover 590. In various embodiments, the sensor may include a proximity sensor and / or a rear-facing camera.

[0040] Reference Figure 2 , the hinge cover 530 can be disposed between the first housing structure 510 and the second housing structure 520 and can be configured to shield internal components (e.g., the hinge structure). In an embodiment, depending on the state of the electronic device 10 (flat state or folded state), the hinge cover 530 can be shielded by a portion of the first housing structure 510 and a portion of the second housing structure 520, or can be exposed to the outside.

[0041] For example, when the electronic device 10 is in Figure 1 In the flat state shown, the hinge cover 530 may be shielded by the first housing structure 510 and the second housing structure 520 and not be exposed. Figure 2 In the folded state shown (e.g., the fully folded state), the hinge cover 530 can be exposed to the outside from between the first housing structure 510 and the second housing structure 520. In another example, when the electronic device 10 is in an intermediate state where the first housing structure 510 and the second housing structure 520 are folded at a certain angle, a portion of the hinge cover 530 can be exposed to the outside from between the first housing structure 510 and the second housing structure 520. However, in this case, the exposed area can be smaller than the exposed area when the electronic device 10 is in the fully folded state. In an embodiment, the hinge cover 530 can include a curved surface.

[0042] The display 100 may be disposed in a space formed by the foldable housing 500. For example, the display 100 may be mounted in a recess formed by the foldable housing 500 and may form most of the front side of the electronic device 10.

[0043] Therefore, the front side of the electronic device 10 may include the display 100 and a partial area of the first housing structure 510 and a partial area of the second housing structure 520 adjacent to the display 100. The rear side of the electronic device 10 may include the first back cover 580, a partial area of the first housing structure 510 adjacent to the first back cover 580, the second back cover 590, and a partial area of the second housing structure 520 adjacent to the second back cover 590.

[0044] The display 100 may refer to a display in which at least a portion of the display can be deformed into a flat or curved shape. In an embodiment, the display 100 may include a folding region 103, a folding region 103 disposed on one side (in the middle of the folding region 103), and a folding region 103 disposed on the other side (in the middle of the folding region 103). Figure 1 The first area 101 is provided on the left side of the folding area 103 shown in FIG. 1 , and the first area 101 is provided on the opposite side of the folding area 103 (on the left side of the folding area 103 shown in FIG. 1 ). Figure 1 The second area 102 is to the right of the folding area 113 shown.

[0045] The display 100 is divided into Figure 1 The areas shown are illustrative, and the display 100 may be divided into a plurality of areas (eg, four or more areas, or two areas) depending on the structure or function of the display 100. For example, in Figure 1 In the illustrated embodiment, the regions of the display 100 may be divided into one another by the folding region 103 or a folding axis (axis A) extending parallel to the y-axis. However, in another embodiment, the display 100 may be divided into a plurality of regions relative to another folding region (e.g., a folding region parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

[0046] The first region 101 and the second region 102 may have shapes that are substantially symmetrical to each other with respect to the folding region 103. However, unlike the first region 101, the second region 102 may include a notch cut out according to the presence of the sensor region 524, and in other regions, the second region 102 may have a shape symmetrical to that of the first region 101. In other words, the first region 101 and the second region 102 may include portions having mutually symmetrical shapes and portions having mutually asymmetrical shapes.

[0047] Hereinafter, operations of the first and second housing structures 510 and 520 depending on the state (eg, flat state or folded state) of the electronic device 10 and the area of the display 100 will be described.

[0048] In an embodiment, when the electronic device 10 is in a flat state (eg, Figure 1 ), the first housing structure 510 and the second housing structure 520 can face the same direction while forming a 180-degree angle between them. The surface of the first region 101 and the surface of the second region 102 of the display 100 can face the same direction (e.g., toward the front of the electronic device) while forming a 180-degree angle. The folding region 103 can form the same plane as the first region 101 and the second region 102.

[0049] In an embodiment, when the electronic device 10 is in a folded state (eg, Figure 2 ), the first housing structure 510 and the second housing structure 520 may face each other. The surface of the first region 101 and the surface of the second region 102 of the display 100 may face each other while forming a narrow angle (e.g., an angle between 0 degrees and 10 degrees). At least a portion of the folding region 103 may be curved to have a predetermined curvature.

[0050] In an embodiment, when the electronic device 10 is in an intermediate state (eg, Figure 2), the first housing structure 510 and the second housing structure 520 may form a certain angle therebetween. The surfaces of the first region 101 and the second region 102 of the display 100 may form an angle that is larger than the angle in the folded state and smaller than the angle in the flat state. At least a portion of the folding region 103 may be curved to have a predetermined curvature, and this curvature may be smaller than the curvature in the folded state.

[0051] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0052] Reference Figure 3 In an embodiment, the electronic device 10 may include a display unit 20, a bracket assembly 30, a circuit board 600, a first housing structure 510, a second housing structure 520, a first back cover 580, and a second back cover 590. In the present disclosure, the display unit 20 may be referred to as a display module or a display assembly.

[0053] The display unit 20 may include a display 100 and one or more panels or layers 140 on which the display 100 is mounted. In an embodiment, the panel 140 may be disposed between the display 100 and the support assembly 30. The display 100 may be disposed on one surface of the panel 140 (e.g., relative to the panel 140). Figure 3 The plate 140 may be formed in a shape corresponding to the display 100. For example, a partial area of the plate 140 may be formed in a shape corresponding to the notch 104 of the display 100.

[0054] The bracket assembly 30 may include a first bracket 410, a second bracket 420, a hinge structure arranged between the first bracket 410 and the second bracket 420, a hinge cover 530 covering the hinge structure when viewed from the outside, and a wiring member 430 (e.g., a flexible printed circuit (FPC)) spanning the first bracket 410 and the second bracket 420.

[0055] In an embodiment, the bracket assembly 30 may be disposed between the plate 140 and the circuit board 600. For example, the first bracket 410 may be disposed between the first area 101 of the display 100 and the first circuit board 610. The second bracket 420 may be disposed between the second area 102 of the display 100 and the second circuit board 620.

[0056] In an embodiment, at least a portion of the wiring member 430 and at least a portion of the hinge structure 300 may be disposed inside the bracket assembly 30. The wiring member 430 may be disposed along a direction (e.g., an x-axis direction) spanning the first bracket 410 and the second bracket 420. The wiring member 430 may be disposed along a folding axis (e.g., an x-axis direction) perpendicular to the folding region 103 of the electronic device 10. Figure 1The y-axis or folding axis A) is set in the direction of the y-axis or folding axis A) (for example, the x-axis direction).

[0057] As described above, the circuit board 600 may include a first circuit board 610 disposed on one side of the first bracket 410 and a second circuit board 620 disposed on one side of the second bracket 420. The first circuit board 610 and the second circuit board 620 may be disposed in a space formed by the bracket assembly 30, the first housing structure 510, the second housing structure 520, the first back cover 580, and the second back cover 590. Components for implementing various functions of the electronic device 10 may be mounted on the first circuit board 610 and the second circuit board 620.

[0058] The first housing structure 510 and the second housing structure 520 can be assembled together so as to be coupled to opposite sides of the stand assembly 30 when the display unit 20 is coupled to the stand assembly 30. As described below, the first housing structure 510 and the second housing structure 520 can be coupled to the stand assembly 30 by sliding on opposite sides of the stand assembly 30.

[0059] In an embodiment, the first housing structure 510 may include a first rotation support surface 512, and the second housing structure 520 may include a second rotation support surface 522 corresponding to the first rotation support surface 512. The first rotation support surface 512 and the second rotation support surface 522 may include curved surfaces corresponding to the curved surface included in the hinge cover 530.

[0060] In an embodiment, when the electronic device 10 is in a flat state (eg, Figure 1 The first rotation support surface 512 and the second rotation support surface 522 may cover the hinge cover 530, and the hinge cover 530 may not be exposed on the rear side of the electronic device 10, or may be exposed to a minimum extent. Meanwhile, when the electronic device 10 is in a folded state (e.g., Figure 2 ), the first rotation support surface 512 and the second rotation support surface 522 can rotate along the curved surface included in the hinge cover 530, and the hinge cover 530 can be maximally exposed to the rear side of the electronic device 10.

[0061] Figure 4 is a view illustrating a panel 610, a bending portion 620, a display driver IC 621, and a film portion 630 of a conventional electronic device. Figure 4 The conventional electronic device shown is not exemplified as a foldable electronic device.

[0062] The panel 610 may form a display device (eg, Figure 12The panel 610 may display a screen image. The curved portion 620 may be folded to face the rear side of the panel 610. The curved portion 620 may extend from one side of the panel 610. A display driver IC 621 for driving the panel 610 may be mounted on the curved portion 620. Figure 4 FIG. 6 shows a state where the curved portion 620 is unfolded before the panel 610 is installed in the electronic device. The membrane portion 630 may be connected to the curved portion 620 and may face one surface of the panel 610. Figure 1 Elements of the display 100) and the touch panel may be mounted on the membrane portion 630.

[0063] In a conventional electronic device, the bent portion 620 may be disposed adjacent to a short side of the panel 610 .

[0064] Figure 5a is a view illustrating a panel 710, a bending portion 720, a film portion 730, a display driver IC 731, and an FPCB 740 of a conventional electronic device. Figure 5a The conventional electronic device shown is exemplified as a foldable electronic device. Figure 5a A state in which the bent portion 720 is unfolded before the panel 710 is mounted in the electronic device is shown.

[0065] The panel 710 may form a display unit (eg, Figure 3 The panel 710 may be folded along a folding line 711. The curved portion 720 may be provided adjacent to an edge of the panel 710 parallel to the folding line 711. The membrane portion 730 may be connected to the curved portion 720. The membrane portion 730 may include a display driver IC 731. The FPCB 740 may be connected to the membrane portion 730. The FPCB 740 may be connected to a processor (e.g., Figure 12 processor 1220) and display driver IC 731.

[0066] In conventional foldable electronic devices, the display driver IC 731 can be positioned adjacent to a side of the panel 710 that is parallel to the fold line 711. For example, the display driver IC 730 can be positioned adjacent to a side formed in the Y-axis direction, where the Y-axis direction is the direction of the fold line 711. The display driver IC 731 can be positioned parallel to the fold line 711 of the panel 710. In particular, when the fold line 711 is formed in the Y-axis direction parallel to the long side of the panel 710, the display driver IC 731 can be positioned parallel to the long side of the panel 710, thereby increasing the number of data lines connecting the display driver IC 731 and the pixels of the panel 710. The number of output ports of the display driver IC 731 can be specified. To reduce the number of data lines, a multiplexer (MUX) (e.g., a 2:1 MUX or a 3:1 MUX) can be used in the display driver IC 731. When using a multiplexer, it may be necessary to switch the data lines within the duration (scanning timing) of one frame (1H). A structure that reduces the load (such as the impedance between the display driver IC 731 and the panel 731) may be required to ensure the timing required for switching. Due to physical characteristics, the flexure 720, the membrane portion 730, and the display driver IC 731 have a lower load impedance when implemented in a chip-on-film (COF) structure than when implemented in a chip-on-plastic (COP) structure. Therefore, the display driver IC 731 may need to be provided on the membrane portion 730 in a COF structure.

[0067] Furthermore, in conventional foldable electronic devices, the curved portion 720 may be disposed adjacent to the long side of the panel 710, and thus the length of the curved portion 720 may be increased. As the length of the curved portion 720 increases, the area of the curved portion 720 may also increase. As the area of the curved portion 720 increases, when the curved portion 720 is installed in the electronic device in a state where it is folded to face the rear side of the panel 610, the curved portion 720 may be in contact with a bracket (e.g., Figure 3 When the bent portion 720 contacts the bracket 30, the bent portion 720 may be damaged by foreign matter on the bracket 30.

[0068] Figure 5b 7 is a view illustrating a bending portion 720 , a membrane portion 730 , and an FPCB 740 of an electronic device according to an embodiment.

[0069] In an embodiment, the FPCB 740 may include a memory 741, a touch IC 742, a power distribution circuit 743, and an electrostatic emission element 744. The memory 741 may store data to be transmitted to the display driver IC 731. The memory 741 may be implemented with a non-volatile memory such as a flash memory. The touch IC 742 may receive and process data transmitted to the panel (e.g., Figure 5a The touch input of the panel 710) can be transmitted to the processor (eg, Figure 12 The power distribution circuit 743 may distribute signals and / or data transmitted from the memory 741 and / or the touch IC 742 to the pixels on the panel 710, or may decouple the signals and / or data and then transmit the decoupled signals and / or data to the pixels on the panel 710. The electrostatic emission element 744 may emit static electricity generated from or introduced into the FPCB 740. For example, the electrostatic emission element 744 may be implemented using an ESD diode.

[0070] Figure 6 7 is a view illustrating a panel 710 , a bending portion 720 , a film portion 730 , a display driver IC 731 , an FPCB 740 , and a protective member 750 of an electronic device according to an embodiment.

[0071] In an embodiment, the protective member 750 may be provided on the bent portion 720. The protective member 750 may cover at least a portion of the bent portion 720. The protective member 750 may be attached to a bracket (eg, Figure 3 Opposite surfaces of the protective member 750 may be attached to one surface of the bent portion 720 and one surface of the bracket 30, respectively.

[0072] In the embodiment, the protective member 750 can protect the bent portion 720. Compared with the exposed area of the bent portion of a conventional electronic device, the exposed area of the bent portion 720 of the electronic device according to the embodiment can be relatively large. Therefore, the area where the bent portion 720 may contact the bracket 30 can be increased.

[0073] In addition, when the electronic device according to the embodiment is a foldable electronic device, since a flexible display (eg, Figure 1 Due to the nature of the display 100, the flexible display may be pressed when pressure is applied to the upper portion of the flexible display. In order to protect the surface of the display 100, the end of the display 100 may not be attached to the housing (e.g., Figure 1 Therefore, the necessity of protecting the display 100 from the rear may increase.

[0074] In an embodiment, the protective member 750 may prevent contact between the bent portion 720 and the bracket 30. The protective member 740 may prevent foreign matter from accumulating on the bracket 30. The protective member 750 may include an adhesive member for attaching the bent portion 720 and the bracket 30. For example, the protective member 750 may include a pressure sensitive adhesive (PSA).

[0075] In an embodiment, the panel 710 of the electronic device may have flexibility so as to be folded along the folding line 711. When pressure is applied to the panel 710, the pressure may be applied to the bent portion 720 and the bracket 30. The protective member 750 may be provided between the bent portion 720 and the bracket 30 and may absorb the pressure applied to the bent portion 720 and the bracket 30.

[0076] Figure 7 FIG. 1 is a diagram showing an electronic device according to an embodiment including a panel (eg, Figure 6 of the panel 710) and the curved portion (e.g., Figure 6 720 ), a view of the transistor layer 810, the substrate layer 820, the plurality of films 831 and 832, the encapsulation layer 840 and the resin layer 850, and the protective member 750.

[0077] In an embodiment, the transistor layer 810 may drive the pixels included in the panel 710. The transistor layer 810 may include a light-emitting element layer including pixels. For example, the transistor layer 810 may include an organic light-emitting diode (OLED) layer. The transistor layer 810 may include a thin film transistor (TFT). The transistor layer 810 may include wires for driving the panel 710, and the wires are connected to the touch screen panel (TSP) and the pixels provided in the panel 710.

[0078] In an embodiment, substrate layer 820 may be disposed on one surface of transistor layer 810. For example, when transistor layer 810 is bent, substrate layer 820 may be disposed on an inner surface. Substrate layer 820 may support transistor layer 810. Substrate layer 820 may form a lower substrate of panel 710. Substrate layer 820 may provide flexibility to panel 710. Substrate layer 820 may include a flexible material. For example, substrate layer 820 may include polyimide (PI).

[0079] In an embodiment, the plurality of films 831 and 832 may include a first film 831 and a second film 832. The first film 831 and the second film 832 may be provided on one surface of the resin layer 820. For example, the first film 831 may be provided on one surface of the resin layer 820 included in the panel 710, and the second film 832 may be provided on one surface of the resin layer 820 included in the curved portion 720. When the resin layer 820 is curved, the first film 831 and the second film 832 may be provided on the inner surface. The first film 831 and the second film 832 may protect the inner surfaces of the panel 710 and the curved portion 720.

[0080] In an embodiment, an encapsulation layer 740 may be provided on at least a portion of the transistor layer 810. The encapsulation layer 740 may be provided on one surface of the transistor layer 810 included in the panel 710. When the transistor layer 810 is bent, the encapsulation layer 740 may be provided on the outer surface. The encapsulation layer 740 may protect the transistor layer 810 from external foreign matter. The encapsulation layer 740 may be implemented using thin film encapsulation (TFE).

[0081] In an embodiment, a resin layer 850 may be provided on at least a portion of the transistor layer 810. The resin layer 850 may be provided on one surface of the transistor layer 810 included in the portion of the bent portion 720 that is bent to have a specific curvature. When the transistor layer 810 is bent, the resin layer 850 may be provided on the outer surface. The resin layer 850 may protect the portion of the bent portion 720 that is bent to have a specific curvature.

[0082] In an embodiment, the protective member 750 may be provided on at least a portion of the transistor layer 810. The protective member 750 may be provided on one surface of a portion of the bent portion 720 disposed to face the panel 710. When the transistor layer 810 is bent, the protective member 750 may be provided on the outer surface. The protective member 750 may be attached to the transistor layer 810. The protective member 750 may prevent the outer surface of the transistor layer 810 from contacting with a support (e.g., Figure 3 of the bracket assembly 30).

[0083] Figure 8 This is a cross-sectional view of a conventional electronic device. Figure 8 , a conventional electronic device may include a window 910, a first adhesive layer 921, a polarizing layer 922, a second adhesive layer 923, a panel 930 (eg, Figure 6 panel 710 and curved portion 720), a third adhesive layer 931, a buffer layer 941, a fourth adhesive layer 942, a metal layer 943, a bracket 950 (eg, Figure 3 bracket assembly 30) and bonding member 960.

[0084] The window 910 may form a front plate. The window 910 may have rigidity. Figure 8 A conventional electronic device is not a foldable electronic device. The window 910 may display a screen image output from the panel 930 to the outside and may protect the front side.

[0085] The first adhesive layer 921 may attach the window 910 and the polarizing layer 922 to each other. The polarizing layer 922 may prevent reflection of external light incident on the panel 930 or may polarize light output from the panel 930. The second adhesive layer 923 may attach the polarizing layer 922 and the panel 930 to each other.

[0086] The third adhesive layer 931 can attach the panel 930 and the buffer layer 941 to each other. The buffer layer 941 can be formed of a stretchable material and can protect the panel 930 from external impact. The fourth adhesive layer 942 can attach the buffer layer 941 and the metal layer 943 to each other. The metal layer 943 can be a ground layer. For example, the metal layer 943 can be a copper sheet (Cu sheet).

[0087] The bracket 950 may be provided spaced apart from the curved portion 720 to have a first gap G1 with the curved portion 720 of the panel 930. One side of the bracket 950 may be attached to the window 910 via an adhesive member 960. Since the window 910 has rigidity, the first gap G1 between the bracket 950 and the curved portion 720 of the panel 930 may be maintained even when pressure is applied to the window 910.

[0088] when Figure 8 When the conventional electronic device is a foldable electronic device, the window 910 may be flexible. When the window 910 is flexible, the first gap G1 between the bracket 950 and the curved portion 720 of the panel 930 cannot be maintained, and the bracket 950 and the panel 930 may contact each other. When the bracket 950 and the panel 930 contact each other, the curved portion 720 of the panel 930 may have defects such as puncture marks due to metal burrs on the bracket 950 and steps and / or foreign matter on the surface of the bracket 950.

[0089] In addition, when Figure 8 When the conventional electronic device is a foldable electronic device, window 910 may be repeatedly folded and unfolded, and the movement of the periphery of window 910 may occur due to the repeated folding and unfolding movements. When window 910 is fixed to bracket 950 by adhesive member 960, window 910 may be lifted from adhesive member 960 or may be damaged due to the tolerance of the movement of the periphery of window 910.

[0090] Figure 9 9 is a cross-sectional view of an electronic device according to an embodiment. The electronic device according to this embodiment may include a window 1010, a first adhesive layer 921, a polarizing layer 922, a second adhesive layer 923, a panel 930 (eg, Figure 6 panel 710 and curved portion 720), a third adhesive layer 931, a buffer layer 941, a fourth adhesive layer 942, a metal layer 943, a bracket 950 (eg, Figure 3 bracket assembly 30 ), a protective member 750 and a deco 1020 . Figure 9 The first adhesive layer 921, the polarizing layer 922, the second adhesive layer 923, the panel 930, the third adhesive layer 931, the buffer layer 941, the fourth adhesive layer 942, the metal layer 943 and the bracket 950 can be connected with Figure 8 The first adhesive layer 921, the polarizing layer 922, the second adhesive layer 923, the panel 930, the third adhesive layer 931, the buffer layer 941, the fourth adhesive layer 942, the metal layer 943 and the bracket 950 are substantially the same. Therefore, repeated description will be omitted below.

[0091] In an embodiment, the protective member 750 may be provided between the panel 930 and the bracket 950. The protective member 750 may be attached to the panel 930 and the bracket 950. The protective member 750 may be formed on a curved portion of the panel 930 (eg, Figure 6 For example, the protective member 750 may be provided on the COP portion.

[0092] In an embodiment, the protective member 750 may have a gap corresponding to the first gap (eg, Figure 8 The protective member 750 may be formed to fill the gap between the panel 930 and the bracket 950. The protective member 750 may fix the panel 930 and the bracket 950 so as not to move.

[0093] In an embodiment, Figure 9 The electronic device is foldable, for example. To implement a foldable electronic device, the window 1010 may be flexible. For example, the window 1010 may be formed by printing a flexible material such as polyimide or polyethylene terephthalate (PET). When pressure is applied to the window 1010, the window 1010 may deform while applying pressure to components below the window 1010. The protective member 750 may prevent the panel 930 from moving due to the pressure transmitted from the window 1010.

[0094] In an embodiment, the decoration 1020 may be provided on one side of the bracket 950. The decoration 1020 may extend toward the window 1010, and at least a portion of the decoration 1020 may overlap with the window 1010. The decoration 1020 may be provided on the periphery of the window 1010. The decoration 1020 may not overlap with the protective member 750.

[0095] In an embodiment, the decoration 1020 may be provided with a second gap G2 from the window 1010. The window 1010 can be repeatedly folded and unfolded while being spaced apart from the decoration 1020. When the window 1010 and the decoration 1020 are spaced apart from each other, even if a slip occurs in which the periphery of the window 1010 moves or slides, friction with the decoration 1020 or the amount of movement can be prevented. Therefore, damage to the window 1010 can be prevented.

[0096] Figure 10is a cross-sectional view of an electronic device according to another embodiment. The electronic device according to another embodiment may include a first window 1011, a first pressure-sensitive adhesive layer 1012, a second window 1021, a second pressure-sensitive adhesive layer 1022, a polarizing layer 1031 (eg, Figure 9 polarizing layer 922), a third pressure-sensitive adhesive layer 1032, a panel 1040 (eg, Figure 9 panel 930), resin layer 1041 (eg, Figure 7 resin layer 850), a fourth pressure-sensitive adhesive layer 1051, a first film 1052 (eg, Figure 7 a first film 831 of the present invention), a fifth pressure-sensitive adhesive layer 1053, a buffer layer 1061 (eg, Figure 9 , a buffer layer 941 , a sixth pressure-sensitive adhesive layer 1062 , and a metal layer 1063 (eg, Figure 9 Furthermore, an electronic device according to another embodiment may include a step compensation tape 1110, a second film 1121 (eg, Figure 7 ), a seventh pressure-sensitive adhesive layer 1022 , a cover spacer 1130 , a film portion 1140 (eg, Figure 6 The membrane portion 730), the conductive tape 1150, the FPCB 1160 (eg, Figure 6 FPCB 740), display driver IC 1170 (eg, Figure 6 Display driver IC 731), protective member 1180 (eg, Figure 7 protective member 750) and a first anti-static member 1191.

[0097] In an embodiment, the first window 1011 may be disposed above the second window 1021. Compared to conventional windows formed of glass, the second window 1021 may be more susceptible to damage, such as scratches on its surface. The first window 1011 may be additionally attached to protect the second window 1021. The first window 1011 may be formed of a material and structure that can be replaced when damaged. For example, the first window 1011 may be formed of polyethylene having ductility. The first pressure-sensitive adhesive layer 1012 may attach the first window 1011 and the second window 1021 to each other.

[0098] In an embodiment, the second window 1021 may be a flexible window. For example, the first window 1011 may be formed of flexible polyimide. The second pressure-sensitive adhesive layer 1022 may attach the second window 1021 and the polarizing layer 1031 to each other.

[0099] In an embodiment, the polarizing layer 1031 may prevent reflection of external light incident on the panel 1040, or may polarize light output from the panel 1040. The third pressure-sensitive adhesive layer 1032 may attach the polarizing layer 1031 and the panel 1040 to each other.

[0100] In an embodiment, the panel 1040 may output a screen image to the first window 1011. The resin layer 1041 may protect the outer portion of the panel 1040, which is bent to have a specific curvature. The fourth pressure-sensitive adhesive layer 1051 may attach the panel 1040 and the first film 1052 to each other.

[0101] In an embodiment, when the panel 1040 is bent, the first film 1052 may protect the inner surface of the curve.The fifth pressure-sensitive adhesive layer 1053 may attach the first film 1052 and the buffer layer 1061 to each other.

[0102] In an embodiment, the buffer layer 1061 may protect the panel 1040 from external impact. The sixth pressure-sensitive adhesive layer 1062 may attach the buffer layer 1061 and the metal layer 1063 to each other. The metal layer 1063 may be a ground layer.

[0103] In an embodiment, a step compensation tape 1110 may be provided in a region where the second film 1121, the seventh pressure-sensitive adhesive layer 1022, and the cover spacer 1130 are provided. The step compensation tape 1110 may compensate for a step caused by the second film 1121, the seventh pressure-sensitive adhesive layer 1022, and the cover spacer 1103 having a height smaller than that of the conductive tape 1150 and the FPCB 1160.

[0104] In an embodiment, when the panel 1040 is bent, the second film 1121 can protect the inner surface of the curve. The seventh pressure-sensitive adhesive layer 1022 can attach the second film 1121 and the panel 1040 to each other. The cover spacer 1130 can compensate for the step between the step compensation tape 1110 and the film portion 1140. The film portion 1140 may include a display driver IC 1170 mounted thereon. The conductive tape 1150 can connect the FPCB 1160 and the metal layer 1063 to each other. The FPCB 1160 can be electrically connected to the display driver IC 1170 through the connection with the film portion 1140. The FPCB 1160 can connect a processor (e.g., Figure 12 The processor 1220) and the display driver IC 1170 are connected to each other.

[0105] In an embodiment, the protective member 1180 may be provided at a bent portion of the panel 1040 (eg, Figure 6 The protective member 1180 may be provided on the curved portion 720 except for the region where the membrane portion 1140 is provided. The protective member 1180 may cover at least a portion of the curved portion 720 except for the region where the membrane portion 1140 is provided. The protective member 1180 may have a greater thickness than the membrane portion 1140.

[0106] In an embodiment, the first anti-static member 1191 may cover the FPCB 1160, the film portion 1140, and the display driver IC 1170. The first anti-static member 1191 may protect the FPCB 1160, the film portion 1140, and the display driver IC 1170 from shock caused by static electricity.

[0107] Figure 11a and Figure 11b 1 is a cross-sectional view of an electronic device according to another embodiment. In addition to the electronic device according to another embodiment having a second antistatic member 1192, the electronic device according to another embodiment is similar to the reference Figure 10 The electronic devices described are substantially the same, and therefore, repeated descriptions will be omitted below.

[0108] In an embodiment, the second anti-static member 1192 may cover the FPCB 1160, the film portion 1140, the display driver IC 1170, and the bent portion of the panel 1040 (eg, Figure 6 For example, Figure 11a As shown, the second anti-static member 1192 may be disposed between the panel 1040 and the protective member 1180. The second anti-static member 1192 may extend to the curved portion 720 and may cover at least a portion of the curved portion 720. For example, as shown in FIG. Figure 11b As shown, the second anti-static member 1192 may extend to the curved portion 720 on which the protective member 1180 is formed. In this case, the protective member 1180 may be disposed between the panel 1040 and the second anti-static member 1192. The second anti-static member 1192 may protect the curved portion 720 of the panel 1040 on which the protective member 1180 is disposed from shock caused by static electricity.

[0109] In an embodiment, the protection member 1180 may be provided on one surface of the second anti-static member 1192. The protection member 1180 may cover at least a portion of the area of the bent portion 720 covered by the second anti-static member 1192, except for the area where the film portion 1140 is provided.

[0110] Figure 12 1 is a block diagram illustrating an electronic device 1201 in a network environment 1200 according to various embodiments. Figure 12, the electronic device 1201 in the network environment 1200 may communicate with the electronic device 1202 via a first network 1298 (e.g., a short-range wireless communication network), or may communicate with the electronic device 1204 or the server 1208 via a second network 1299 (e.g., a long-range wireless communication network). Depending on an embodiment, the electronic device 1201 may communicate with the electronic device 1204 via the server 1208. Depending on an embodiment, the electronic device 1201 may include a processor 1220, a memory 1230, an input device 1250, a sound output device 1255, a display device 1260, an audio module 1270, a sensor module 1276, an interface 1277, a haptic module 1279, a camera module 1280, a power management module 1288, a battery 1289, a communication module 1290, a subscriber identification module (SIM) 1296, or an antenna module 1297. In some embodiments, at least one of the components (e.g., display device 1260 or camera module 1280) may be omitted from electronic device 1201, or one or more other components may be added to electronic device 1201. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, sensor module 1276 (e.g., a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in display device 1260 (e.g., a display).

[0111] The processor 1220 may execute, for example, software (e.g., program 1240) to control at least one other component of the electronic device 1201 connected to the processor 1220 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1220 may load commands or data received from another component (e.g., sensor module 1276 or communication module 1290) into the volatile memory 1232, process the commands or data stored in the volatile memory 1232, and store the resulting data in the non-volatile memory 1234. Depending on the embodiment, the processor 1220 may include a main processor 1221 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 1223 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1221 in operation. Additionally or alternatively, the auxiliary processor 1223 may be adapted to consume less power than the main processor 1221 or to be adapted for a specific function. The auxiliary processor 1223 may be implemented separately from the main processor 1221 or as part of the main processor 1221.

[0112] When the main processor 1221 is in an inactive state (e.g., a sleep state), the auxiliary processor 1223 may control at least some of the functions or states related to at least one component (e.g., the display device 1260, the sensor module 1276, or the communication module 1290) among the components of the electronic device 1201 instead of the main processor 1221, or when the main processor 1221 is in an active state (e.g., running an application), the auxiliary processor 1223 may control at least some of the functions or states related to at least one component (e.g., the display device 1260, the sensor module 1276, or the communication module 1290) among the components of the electronic device 1201 together with the main processor 1221. Depending on the embodiment, the auxiliary processor 1223 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 1280 or the communication module 1290) that is functionally related to the auxiliary processor 1223.

[0113] The memory 1230 may store various data used by at least one component of the electronic device 1201 (e.g., the processor 1220 or the sensor module 1276). The various data may include, for example, software (e.g., the program 1240) and input data or output data for commands related thereto. The memory 1230 may include a volatile memory 1232 or a non-volatile memory 1234.

[0114] The program 1240 may be stored as software in the memory 1230 , and the program 1240 may include, for example, an operating system (OS) 1242 , middleware 1244 , or applications 1246 .

[0115] The input device 1250 may receive commands or data from outside the electronic device 1201 (e.g., a user) to be used by other components of the electronic device 1201 (e.g., the processor 1220). The input device 1250 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0116] The sound output device 1255 can output sound signals to the outside of the electronic device 1201. The sound output device 1255 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, while the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0117] The display device 1260 can visually provide information to the outside of the electronic device 1201 (e.g., a user). The display device 1260 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 1260 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0118] The audio module 1270 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 1270 can obtain sound via the input device 1250, or output sound via the sound output device 1255 or an earphone of an external electronic device (e.g., electronic device 1202) directly (e.g., wired) or wirelessly connected to the electronic device 1201.

[0119] The sensor module 1276 can detect the operating state (e.g., power or temperature) of the electronic device 1201 or the environmental state (e.g., the state of the user) outside the electronic device 1201, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 1276 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0120] The interface 1277 may support one or more specific protocols to be used to connect the electronic device 1201 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 1202). Depending on the embodiment, the interface 1277 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0121] The connection end 1278 may include a connector, wherein the electronic device 1201 can be physically connected to an external electronic device (e.g., the electronic device 1202) via the connector. Depending on the embodiment, the connection end 1278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0122] The haptic module 1279 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his or her sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0123] The camera module 1280 may capture still images or moving images. Depending on the embodiment, the camera module 1280 may include one or more lenses, image sensors, image signal processors, or flashes.

[0124] The power management module 1288 may manage power supply to the electronic device 1201. According to an embodiment, the power management module 1288 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0125] The battery 1289 may power at least one component of the electronic device 1201. According to an embodiment, the battery 1289 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0126] The communication module 1290 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1201 and an external electronic device (e.g., electronic device 1202, electronic device 1204, or server 1208), and perform communication via the established communication channel. The communication module 1290 may include one or more communication processors capable of operating independently from the processor 1220 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 1290 may include a wireless communication module 1292 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1294 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 1298 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 1299 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1292 can identify and authenticate the electronic device 1201 in a communication network (such as the first network 1298 or the second network 1299) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1296.

[0127] The antenna module 1297 can transmit or receive signals or power to or from the outside of the electronic device 1201 (e.g., an external electronic device). Depending on the embodiment, the antenna module 1297 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). Depending on the embodiment, the antenna module 1297 may include multiple antennas. In this case, at least one antenna suitable for the communication scheme used in the communication network (such as the first network 1298 or the second network 1299) may be selected from the multiple antennas by, for example, the communication module 1290 (e.g., the wireless communication module 1292). Signals or power can then be transmitted or received between the communication module 1290 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of the antenna module 1297.

[0128] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0129] Depending on the embodiment, commands or data may be transmitted or received between the electronic device 1201 and the external electronic device 1204 via the server 1208 connected to the second network 1299. Each of the electronic device 1202 and the electronic device 1204 may be of the same type as the electronic device 1201, or a different type of device than the electronic device 1201. Depending on the embodiment, all or some operations to be executed on the electronic device 1201 may be executed on one or more of the external electronic device 1202, the external electronic device 1204, or the server 1208. For example, if the electronic device 1201 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1201 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or in addition to executing the function or service, the electronic device 1201 may request the one or more external electronic devices to execute at least part of the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 1201. The electronic device 1201 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0130] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0131] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0132] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0133] The various embodiments described herein can be implemented as software (e.g., program 1240) comprising one or more instructions stored in a storage medium (e.g., internal memory 1236 or external memory 1238) that can be read by a machine (e.g., electronic device 1201). For example, under the control of a processor, a processor (e.g., processor 1220) of the machine (e.g., electronic device 1201) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0134] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0135] According to various embodiments, each component (for example, module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (for example, module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. A portable communication device (10), comprising: a housing (500) comprising a first housing portion (510), a second housing portion (520) and a hinge, at least part of said housing forming a support portion (950), The first housing portion comprises: a side wall defining a side of the portable communication device, and a cover member (1020) disposed along the side wall; a flexible display (100) housed in the housing and spaced apart from the side wall and the cover member, the flexible display being bent so that at least part of a bent portion of the flexible display faces a rear side of the portable communication device; a display driver integrated circuit (1170) electrically connected to a plurality of pixels in the flexible display; a flexible printed circuit board (1160) electrically connected to the display driver integrated circuit; and an antistatic member (1192) covering at least a portion of the bent portion, the display driver integrated circuit, and at least a portion of the flexible printed circuit board, wherein an adhesive member (1180) is provided between the portion of the antistatic member covering at least a portion of the curved portion and the supporting portion.

2. The portable communication device according to claim 1, wherein The display driver integrated circuit and the adhesive member are disposed in different regions when viewed from a direction perpendicular to the support portion.

3. The portable communication device according to claim 1, wherein At least a portion of the sidewall comprises metal.

4. The portable communication device according to claim 1, wherein The bonding member bonds one side of an edge portion of the antistatic member to the supporting portion.

5. The portable communication device according to claim 1, wherein The adhesive member has a thickness corresponding to a gap between the antistatic member and the supporting portion.

6. The portable communication device according to claim 1, wherein The adhesive member includes a pressure-sensitive adhesive.

7. The portable communication device according to claim 1, wherein The bonding member reduces contact between the bent portion and the supporting portion.

8. The portable communication device according to claim 1, wherein The adhesive member reduces accumulation of foreign matter on the support portion.

9. The portable communication device according to claim 1, wherein The cover member does not overlap the adhesive member when viewed from a direction perpendicular to the support portion.

10. The portable communication device according to claim 1, wherein The flexible display repeatedly folds and unfolds while being spaced apart from the cover member.

11. The portable communication device according to claim 1, wherein The flexible printed circuit board is configured to connect a processor of the portable communication device and the display driver integrated circuit to each other.

12. The portable communication device according to claim 1, wherein The display driver integrated circuit is disposed adjacent to an edge of the bent portion.

13. The portable communication device according to claim 1, wherein The adhesive member is disposed between an edge portion of the anti-static member and the supporting portion.

Images