Headphone device

Abstract

The present invention discloses a headphone device, which includes a housing component, an inner housing component, an audio processor, and a force sensor patch. The inner housing component is disposed in the housing component and integrated with a printed circuit board having specific electrodes. The audio processor is disposed on the printed circuit board. The force sensor patch is adhered to the specific electrodes of the printed circuit board to be coupled to the audio processor through the specific electrodes. The force sensor patch is disposed between a part of the housing component and a part of the inner housing component and is used to detect the pressure applied by a user to the part of the housing component. The force sensor patch does not significantly occupy internal space, enabling more circuit components to be installed in the electronic device. In addition, the assembly process / procedure becomes more convenient. The present invention also discloses a method for assembling the headphone device.

Description

Technical Field

[0001] The present invention relates to a mechanism for assembling a sensor patch circuit into an electronic device, and more particularly to a headphone device including a force sensor patch circuit and a corresponding assembly method program. Background Art

[0002] Generally, a conventional method of assembling a conventional larger sensor circuit into an electronic device such as a headphone device inevitably requires the use and installation of an additional holding component to hold the position of the conventional larger sensor circuit on a circuit board inside the electronic device. However, this additional holding component will relatively occupy a quite large internal circuit space of the electronic device. In addition, the additional installation of the holding component will also become more complicated for the assembly process. Summary of the Invention

[0003] Therefore, one of the objectives of the present invention is to provide a headphone device and a method for assembling the headphone device to solve the above problems.

[0004] According to an embodiment, a headphone device is disclosed. The headphone device includes a housing component, an inner housing component, an audio processor, and a force sensor patch. The inner housing component is disposed in the housing component and integrated with a printed circuit board having at least one specific electrode. The audio processor is disposed on the printed circuit board. The force sensor patch is adhered to at least one specific electrode of the printed circuit board to be coupled to the audio processor through at least one specific electrode. The force sensor patch is disposed between a part of the housing component and a part of the inner housing component and is used to detect the pressure applied by a user to a part of the housing component.

[0005] According to an embodiment, a method for assembling a headphone device is disclosed. The method includes: providing a housing component; providing and disposing an inner housing component inside the housing component to be integrated with a printed circuit board having at least one specific electrode; providing and installing an audio processor on the printed circuit board; providing a force sensor patch and adhering it to at least one specific electrode of the printed circuit board to be coupled to the audio processor through at least one specific electrode; wherein, the force sensor patch is disposed between a part of the housing component and a part of the inner housing component and is used to detect the user pressure applied to the part of the housing component.

[0006] For the headphone device and the method for assembling the headphone device provided by the above embodiments of the present invention, since the force sensor patch does not significantly occupy the internal space, more circuit components can be installed in the electronic device. In addition, the assembly process will become more convenient. Description of the Drawings

[0007] Figure 1 These are schematic diagrams of different side views and cross-sections of an electronic device, such as a headphone device, according to an embodiment of the present invention.

[0008] Figure 2 This is a schematic diagram of an assembly method for assembling the force sensor patch to the Figure 1 headphone device in accordance with an embodiment of the present invention.

[0009] Figure 3 This is a side cross-sectional view of another example of a headphone device and its stem according to an embodiment of the present invention.

[0010] Figure 4 This is a schematic diagram of an example of a headphone device that supports pressing functions in different directions according to an embodiment of the present invention. Figure 3

[0011] Figure 5 This is according to another embodiment of the present invention Figure 3 Schematic diagrams of an example scenario and different side cross-sections of the headphone device in as a G-sensor.

[0012] Figure 6 This is a schematic diagram of a process flow of an assembly method for assembling a force sensor patch onto the surface of a PCB according to an embodiment of the present invention.

[0013] Figure 7 This is a schematic diagram of a procedure of an assembly method for assembling a force sensor patch onto the top surface or side surface of a PCB according to another embodiment of the present invention.

[0014] Figure 8 This is a schematic diagram of a process flow of an assembly method for assembling a force sensor patch onto the surface of a PCB according to another embodiment of the present invention.

[0015] Figure 9 This is a schematic diagram of a procedure of an assembly method for assembling a force sensor patch onto the surface of a PCB according to another embodiment of the present invention.

[0016] Figure 10 This is a schematic diagram of a procedure of an assembly method for assembling a force sensor patch onto the surface of a PCB according to another embodiment of the present invention.

[0017] Figure 11 This is a schematic diagram of a procedure of an assembly method for assembling a force sensor patch onto the surface of a PCB according to another embodiment of the present invention.

[0018] Figure 12 This is a schematic diagram of an assembly procedure of a headphone device according to an embodiment of the present invention.

[0019] Figure 13 This is a schematic diagram of an assembly procedure of a headphone device according to another embodiment of the present invention.

[0020] Figure 14 It is a schematic flowchart showing the process of the assembly method of the force sensor patch according to an embodiment of the present invention.

[0021] Among them, the reference numerals are explained as follows:

[0022] 100 Headphone device

[0023] 101 Main body part

[0024] 102 Rod part

[0025] 103 Outer shell component

[0026] 104 Inner shell component

[0027] 105 Processor

[0028] 106, 606, 706, 806, 906, 1006, Force sensor patch 1106

[0030] 108 Spacer

[0031] 109 Battery device Detailed implementation manners

[0032] The present invention aims to disclose a technical solution, providing and applying a small (or micro) thin-film force sensor patch (or sensor tab) in an electronic device, where the small (or micro) thin-film force sensor patch can be self-adhesive (pasting and adhering) or it can be pasted and adhered to at least one sensing electrode E1 of a printed circuit by using an adhesive. The printed circuit is, for example, a printed circuit board (hereinafter simply referred to as PCB) or a flexible printed circuit (hereinafter simply referred to as FPC) inside the electronic device. Furthermore, it can be adhered or pasted to a specific circuit inside the electronic device, such as a battery circuit. The electronic device is, for example (but not limited to), a headphone device. Depending on different applications, the force sensor patch integrated in the electronic device can be used to detect the control force / pressure exerted by the user on the electronic device and / or can be used as a G sensor (i.e., an accelerometer) to detect and sense the sudden acceleration and deceleration of the electronic device. The force sensor patch can be formed and realized, for example (but not limited to), by using a polymer material. The electronic device can be, for example, a headphone device, such as a wired headphone, a true wireless headphone, a true wireless stereo headphone, or a wireless earbud headphone device, etc. The electronic device supports wireless communication such as Bluetooth communication protocol or other wireless communication protocols.

[0033] One advantage of the provided force sensor patch is that it does not significantly occupy the internal space of the electronic device (i.e., it can significantly save the internal space of the electronic device), enabling more circuit components to be installed within the electronic device. Additionally, another advantage of the force sensor patch is that since it is easy to paste the force sensor patch onto the top / side of a component (such as a PCB or a battery, etc.) inside the electronic device, the assembly process / procedure of assembling the force sensor patch into the electronic device becomes more convenient for the user or the manufacturer. Furthermore, in one embodiment, for a single electronic device, more small and thin force sensor patches can also be provided and adhered to one or more components inside the electronic device.

[0034] Figure 1 are schematic diagrams of different sides and cross-sections of an electronic device, such as the headphone device 100, according to an embodiment of the present invention. The headphone device 100 includes a main body part / main body 101 and a rod part 102 that may contain a battery unit / circuit ( Figure 1 not shown in the figure). The headphone device 100 includes a housing (or housing component) 103, an inner housing (inner housing component) 104, a processor such as an audio processor 105 (e.g., an audio signal processing circuit), and a sensor patch (e.g., a force sensor patch) 106. The main body 101 and / or the rod part 102 may be formed by different parts of the housing component 103.

[0035] The inner housing component 104 is disposed inside or within the outer housing component 103 and is integrated with a printed circuit, such as a PCB having one or more specific electrodes (such as sensing electrode E1, ground electrode E2, or other electrodes). For example (but not limited to), the inner housing component 104 is disposed in an inner empty space formed by the outer housing component 103, that is, a tubular empty space, and it may include a first part and a second part, where the first part may be a long arched upper cover part and the second part may be another long arched bottom cover part. The PCB and / or the micro battery unit / circuit may be disposed in an inner empty space formed by the upper cover part and the bottom cover part of the inner housing component 104, and the sensing electrode E1 and the ground electrode E2 of the PCB are not covered by any of the upper cover part and the bottom cover part. The sensing electrode E1 and the ground electrode E2 may be connected and coupled to the surface (such as the bottom surface) of the force sensor patch 106. The inner housing component 104 is used to protect the PCB, one or more circuit components, and the battery circuit from damage. The upper cover part of the inner housing component 104 and the PCB may jointly form a semi-cylindrical inner empty circuit space (but not limited), and the audio processor 105 may be disposed at the PCB and within the inner empty circuit space. The PCB may have at least one specific electrode, such as two electrodes E1 and E2 and other electrodes, where the two electrodes E1 and E2 may be located on the side or top of the PCB.

[0036] The force sensor patch 106 can be pasted / adhered to at least one specific electrode of the PCB to be coupled to the audio processor 105 mounted on the PCB. In practice, as Figure 1 shown, two or more electrodes can be provided on one side (such as the same side) of the PCB, and the force sensor patch 106 can be pasted on the electrodes on the surface of this side. The position of the force sensor patch 106 can be set between a part of the outer housing component 103 and a part of the inner housing component 104 and is used to detect the pressure applied by a user to a part of the outer housing component 103.

[0037] Figure 2 is a schematic diagram of an assembly method for assembling the force sensor patch 106 into the Figure 1 headphone device 100 according to an embodiment of the present invention. As Figure 2As shown, the force sensor patch 106 can be, for example (but not limited to), a small thin-film force sensor patch, which includes a top surface without an adhesive material part and a bottom surface with one or more adhesive material parts. In practice, the force sensor patch 106 includes an active sensing area AR, a first conductive part such as a transmission metal pad TX1, and a second conductive part such as a ground metal pad GND1 on its bottom surface. Part or all of the surfaces of the transmission metal pad TX1 and the ground metal pad GND1 can be coated with conductive glue, while the active sensing area AR is not coated with conductive glue. The transmission metal pad TX1 and the ground metal pad GND1 are disconnected and separated by the active sensing area AR. During the assembly process, the user only needs to move the bottom surface of the force sensor patch 106 to make it close to the surfaces of the electrodes E1 and E2 on the side of the PCB. The transmission metal pad TX1 can be pasted on the sensing electrode E1 of the PCB, and the ground metal pad GND1 can be pasted on the ground electrode E2 of the PCB.

[0038] The active sensing area AR is used to detect the pressure applied by the user on a part of the housing component 103, and the force sensor patch 106 can transmit and report the detected pressure to the audio processor 105 through the transmission metal pad TX1 and the ground metal pad GND1. In one embodiment, for example (but not limited to), the bottom surface of the thin-film force sensor patch 106 can have a length equal to / approximate to 6.3 mm (millimeters) and a width equal to / approximate to 2.3 mm. The transmission metal pad TX1 can have a width equal to / approximate to the width of the bottom surface of the thin-film force sensor patch 106 (e.g., 2.3 mm) and a length equal to or less than its width. The ground metal pad GND1 can have a width equal to / approximate to the width of the bottom surface of the thin-film force sensor patch 106 (e.g., 2.3 mm) and a length equal to or less than its width, and the active sensing area AR can have a length equal to / approximate to 4.6 mm and a width equal to / about 2.3 mm. The above values are not limitations of the present invention.

[0039] In addition, in one embodiment, the electrode on one side of the PCB can have a rectangular area, the length of the rectangular area is greater than the lengths of the transmission metal pad TX1 and the ground metal pad GND1, and its width is less than the widths of the transmission metal pad TX1 and the ground metal pad GND1, as Figure 2 shown; these are not limitations of the present invention. Similarly, the values of the length and width of each component / part of the headphone device 100 (such as the inner housing component 104) are shown, for example, in Figure 2 However, these are not limitations of the present invention either.

[0040] Since it is only necessary to move and make the bottom surface of the force sensor patch 106 contact the corresponding area / electrode on the side of the PCB accordingly, the force sensor patch 106 can be automatically adhered to the side of the PCB, so the sensor assembly process will become very convenient. After the housing component 103 is encapsulated to accommodate or cover the inner housing component 104 and the PCB, the force sensor patch 106 can be automatically disposed between a part of the housing component 103 and a part of the inner housing component 104 to detect the user control force applied to the housing component 103.

[0041] Figure 3 is another example of the earphone device 100 according to an embodiment of the present invention and a schematic side cross-sectional view of its rod portion 102. As Figure 3 shown, in this embodiment, the force sensor patch 106 can be a thin film circuit, which can be pasted on a printed circuit such as the FPC to create a relatively large internal empty space (represented by a dotted line), and this empty space can be configured to accommodate rigid or inflexible components, such as a battery circuit / battery. In addition, a specific spacer unit 108, such as a flexible gasket, can be disposed between a part of the housing component 103 and a part of the force sensor patch 106 to provide sufficient tolerance for the encapsulation of the housing component 103. The advantages of the thin film force sensor patch 106 are thin, flat and flexible, so that the rod portion 102 can have a larger internal space to accommodate a battery circuit and / or more components, such as a microphone component. The FPC, the specific gasket 108 or the force sensor patch 106 can have a thickness of 0.5 mm, for example; however, this is not a limitation of the present invention.

[0042] Figure 4 is an example schematic diagram of the earphone device 100 of an embodiment of the present invention having a pressing function that supports different directions Figure 3 The force sensor patch 106 disposed between the housing component 103 and the inner housing component 104 is preferably a capacitive force sensor patch (but not limited) and is arranged to have a shape-tight fit connection or a pressure-tight fit connection with a part of the housing component 103 in order to have / pre-load a specific or sufficient pressure. The force sensor patch 106 is a capacitive force sensor patch made of a polymer material layer, and when the polymer material layer is pressed, its dielectric constant will change accordingly. The capacitance of the force sensor patch 106 can change through this dielectric constant.

[0043] As Figure 4As shown, the user can apply different pressures in different force application directions of the headphone device 100. For example (but not limited to), if the user applies a force horizontally to the headphone device 100, the force sensor patch 106 disposed between the outer shell member 103 and the inner shell member 104 will be compressed and its capacitance will increase, thereby generating and obtaining a positive indication signal corresponding to the increased capacitance. If the user applies another pressure vertically on the headphone device 100, the force sensor patch 106 will be stretched and its capacitance will decrease, thereby generating and obtaining a negative indication signal corresponding to the decreased capacitance. By doing so, the force sensor patch 106 can detect different force application directions and different applied pressures of the user.

[0044] Figure 5 is according to another embodiment of the present invention Figure 3 is a schematic diagram of an example scenario and different side cross-sections of the headphone device 100 as a G sensor. The force sensor patch 106 disposed between the outer shell member 103 and the inner shell member 104 is preferably a capacitive force sensor patch (but not limited) and is arranged to have a shape-tight fit connection or a pressure-tight fit connection with a part of the inner shell member 104, so as to correspondingly have a shape-tight fit connection or a pressure-tight fit connection to connect to a battery device 109 (such as a battery circuit) to have / preload a specific or sufficient pressure. The battery device 109 is disposed in the internal empty space formed by the inner shell member 104. In this case, the battery device 109 is equivalently integrated with the inner shell member 104, and the force sensor patch 106 can be used as a gravity sensing circuit to detect a sudden acceleration or deceleration of the battery device 109, thereby sensing a sudden acceleration or deceleration of the headphone device 100. In this embodiment, the force sensor patch 106 can be set to detect different control forces of the user and simultaneously detect a sudden acceleration or deceleration of the headphone device 100 to generate a result signal of the G sensor for the audio processor 105, so that the audio processor 105 (or the headphone device 100) can determine which control command / action the user has made, and it can, for example, detect the situation where the headphone device 100 falls out of the user's ear based on the result signal of the G sensor. In addition, in other embodiments, the inner shell member 104 can have a specific hole, and the force sensor patch 106 can be adhered to a part of the surface of the battery device 109 through the hole and be arranged as a gravity sensing circuit to detect sudden acceleration or deceleration, which also belongs to the technical scope of the present invention.

[0045] Figure 6 is a schematic diagram of the process of an assembly method for assembling the force sensor patch 606 onto the PCB surface according to an embodiment of the present invention. As Figure 6As shown, the surface of the PCB can be the top surface, and in other embodiments, it can also be the side surface, which is not a limitation of the present invention. The operation of assembling the force sensor patch 606 to the top and side surfaces of the PCB is similar. The force sensor patch 606 is also, for example, a capacitive force sensor patch and has a bottom view and a side view as Figure 6 shown. The side view of the force sensor patch 606 shows that the force sensor patch 606 includes a top conductive layer portion TOPCL, an intermediate dielectric layer portion DIEL (i.e., a polymer material layer), an isolation layer portion ISOL, a signal transfer layer portion STL, a first bottom conductive portion BOTC1 (e.g., a self-adhesive conductive material portion) provided on the bottom surface, and a second bottom conductive portion BOTC2 (e.g., a self-adhesive conductive material portion) provided on the bottom surface. Its conductive portions BOTC1 and BOTC2 can be self-adhesive layer portions and are, for example, not liquids; however, this is not a limitation of the present invention. As Figure 6 shown, the force sensor patch 606 includes a top layer, an intermediate layer, and a bottom layer. The top layer is formed by the top conductive layer portion TOPCL, and the intermediate layer is formed by the intermediate dielectric layer portion DIEL, the isolation layer portion ISOL, and the signal transmission layer portion STL. The bottom layer is formed by two bottom conductive portions BOTC1 and BOTC2. The bottom view of the force sensor patch 606 respectively shows the bottom surfaces of the two bottom conductive portions BOTC1 and BOTC2, and partial bottom surfaces of the isolation layer portion ISOL and the intermediate dielectric layer portion DIEL. The two bottom conductive portions BOTC1 and BOTC2 are separated and disconnected.

[0046] The PCB has a top view example and a side view example. The top view of the PCB shows a dashed area in which two areas are configured as a sensing electrode E1 and a ground electrode E2 to be respectively coupled to a sensing end / signal and a ground end / signal of the force sensor patch 606. The side view of the PCB shows different circuit arrangements of the sensing electrode E1 and the ground electrode E2 of the PCB. According to the assembly procedure, the two bottom conductive portions BOTC1 and BOTC2 have conductive and self-adhesive materials, and the user only needs to paste the bottom surface of the force sensor patch 606 onto the designated area on the top surface of the PCB, so that the bottom conductive portions BOTC1 and BOTC2 are respectively attached to the sensing electrode E1 and the ground electrode E2, and thus the assembly procedure becomes very convenient.

[0047] The force sensor patch 606 is, for example, a capacitive pressure sensor. The middle dielectric layer portion DIEL is flexible and has a top surface and a bottom surface, and its capacitance is set to change or vary with a change in the dielectric constant as the distance between its top surface and bottom surface is pressed by the user, either with or without a change. The processor 105 can obtain the changed capacitance value through the first bottom conductive portion BOTC1, the sensing electrode E1, and the sensing signal line at the PCB, the top conductive layer portion TOPCL, the signal transmission layer portion STL, the second bottom conductive portion BOTC2, and the ground electrode E2 and the ground signal line at the PCB. Then, the processor 105 can estimate and calculate the pressure applied by the user based on the obtained capacitance value.

[0048] In other embodiments, the force sensor patch may also have a conductive portion, such as a metal gasket. Figure 7 It is a schematic diagram of an assembly method procedure for assembling the force sensor patch 706 onto the top surface or side surface of the PCB according to another embodiment of the present invention. As Figure 7 shown, the surface of the PCB can be a top surface, or in other embodiments, it can also be a side surface; this is not a limitation of the present invention. The operation of assembling the force sensor patch 706 onto the top surface or side surface of the PCB can be similar. Similarly, the force sensor patch 706 is, for example, a capacitive force sensor patch and has a bottom view and a side view. The side view shows that the force sensor patch 706 includes a top layer (the top conductive layer portion TOPCL located on the top surface), a first intermediate layer (the middle dielectric layer portion DIEL, the upper half of the isolation layer portion ISOL, and the signal transmission layer portion STL), a second intermediate layer (a ground metal gasket / portion GND1, a sensing / transmission metal gasket / portion TX1, and the lower half of the isolation layer portion ISOL), and a bottom layer (the first bottom conductive portion BOTC1 and the second bottom conductive portion BOTC2). The bottom view of the force sensor patch 706 shows the bottom surfaces of the two bottom conductive portions BOTC1 and BOTC2, the isolation layer portion ISOL, and a partial bottom surface of the transmission metal gasket / portion TX1, respectively.

[0049] Similarly, after completing the assembly process and encapsulating the housing component 103, when a user applies pressure to a part of the housing component 103, the capacitance value generated by the intermediate dielectric layer portion DIEL will change accordingly. The processor 105 can obtain the changed capacitance value through the metal gasket / portion TX1, the first bottom conductive portion BOTC1, the sensing electrode E1 and the sensing signal line on the PCB, the top conductive layer portion TOPCL, the signal transmission layer portion STL, the metal gasket / portion GND1, the second bottom conductive portion BOTC2, and the ground electrode E2 and ground signal line at the PCB. Then, the processor 105 can estimate and calculate the pressure applied by the user based on the obtained capacitance value.

[0050] Figure 8 FIG. is a schematic diagram of an assembly method procedure for assembling the force sensor patch 806 onto the surface of the PCB according to another embodiment of the present invention. The force sensor patch 806 is, for example, a capacitive force sensor patch and has a bottom view and a side view. The side view of the force sensor patch 806 shows that the force sensor patch 806 includes a top layer (the top conductive layer portion TOPCL), an intermediate layer (the intermediate dielectric layer portion DIEL, the upper half of the isolation layer portion ISOL, and the signal transmission layer portion STL), and a bottom layer (the ground metal gasket / portion GND1, the lower half of the isolation layer portion ISOL, and the transmission metal gasket / portion TX1). As Figure 8 shown, in the first step, a dispensing device is set to generate or drip conductive glue on the surfaces of the sensing electrode E1 and the ground electrode E2 at the top of the PCB, respectively. Then, in the second step, the bottom of the force sensor patch 806 is moved and contacted with the upper surfaces of the areas of the sensing electrode E1 and the ground electrode E2, and then the dripped liquid conductive glue is heated at a relatively low temperature to cure it, so that the force sensor patch 806 is adhered to the PCB.

[0051] After the assembly method procedure is completed and the housing component 103 is encapsulated, when a user applies pressure to a part of the housing component 103, the capacitance value generated by the intermediate dielectric layer portion DIEL will change accordingly. The processor 105 can obtain the changed capacitance value through the metal gasket / portion TX1, a part of the cured conductive glue adhesive, the sensing electrode E1 and the sensing signal line on the PCB, the top conductive layer portion TOPCL, the signal transmission layer portion STL, the metal gasket / portion GND1, another part of the cured conductive glue adhesive, and the ground electrode E2 and ground signal line at the PCB. Then, the processor 105 can estimate and calculate the pressure applied by the user based on the obtained capacitance value.

[0052] Figure 9FIG. 0 is a schematic diagram of the process of an assembly method for assembling the force sensor patch 906 onto the surface of a PCB according to another embodiment of the present invention. The force sensor patch 906 is, for example, a capacitive force sensor patch and has a bottom view and a side view. The side view of the force sensor patch 906 shows that it includes a top layer (the top conductive layer portion TOPCL and two side portions (e.g., isolation portions)), a first intermediate layer (a partial isolation portion, the signal transmission layer portion STL, the upper half of the isolation layer portion ISOL, the intermediate dielectric layer portion DIEL), a second intermediate layer (the ground metal gasket / portion GND1, the lower half of the isolation layer portion ISOL, and the transmission metal gasket / portion TX1), and a bottom layer (an anisotropic conductive film (hereinafter simply referred to as ACF) at the bottom). The bottom view of the force sensor patch 906 shows the bottom surface of the ACF. The ACF includes at least a first portion, a second portion, and a third portion. The first portion is coupled to the bottom of the transmission metal gasket / portion TX1 (i.e., the first conductive portion), the second portion is coupled to the bottom of the ground metal gasket / portion GND1 (i.e., the second conductive portion), and the third portion is disposed between the first portion and the second portion and is non-conductive to separate the first portion and the second portion. The first portion of the ACF and the second portion of the ACF are heated to become conductive and are respectively adhered to the sensing electrode E1 of the PCB and the ground electrode E2 of the PCB. The top view and the side view of the PCB respectively show two regions marked by diagonal lines corresponding to the sensing electrode E1 and the ground electrode E2 on the PCB.

[0053] As Figure 9As shown, in the first step, a bonding machine can be set to push the entire top surface of the force sensor patch 906, so that within a first specific time period, the entire bottom surface of the ACF is in close contact with the corresponding area by applying a first specific pressure to the ACF, and the ACF is heated using a first specific temperature to bond the ACF to the corresponding area, causing the entire bottom surface of the ACF to come into contact with and be fixed / bonded to the sensing electrode E1, the ground electrode E2, and an intermediate area between the sensing electrode E1 and the ground electrode E2 on the PCB respectively. For example (but not limited to), the first specific time period can be four seconds, the first specific pressure can be between 1 megapascal (MPa) and 3 megapascals, and the first specific temperature can be between 60 degrees Celsius and 80 degrees Celsius. In this case, the bottom surface of the ACF can be tightly and firmly attached to the surface of the corresponding area on the PCB, and at this time the ACF still does not have conductivity, that is, it is in an open circuit state in the circuit state. That is to say, the assembly method is to adhere the first part, the second part, and the third part of the ACF to the sensing electrode E1, the ground electrode E2, and another area on the PCB respectively by applying the first specific pressure to the ACF and heating the ACF at the first specific temperature within the first specific time period.

[0054] Next, in the second step, the bonding machine is set to use two smaller bonding devices to push two corresponding partial areas on the top surface of the force sensor patch 906, and within a second specific time period, to pressurize two corresponding local areas on the bottom surface of the ACF with a second specific pressure to make it closely adhere to two corresponding areas of the PCB, and to heat two corresponding partial areas on the bottom surface of the ACF with a second specific temperature to make two corresponding partial areas on the bottom surface of the ACF conductive, so that two corresponding partial areas on the bottom surface of the ACF can be respectively conducted to the sensing electrode E1 and the grounding electrode E2. For example (but not limited to), the second specific time period can also be four seconds (or can be different from the first specific time period), the second specific pressure can be the same as or different from the first specific pressure, and the second specific temperature can be set between 120°C and 180°C Celsius, so that its temperature is different from and higher than the first specific temperature. This enables only two areas on the ACF heated by the higher temperature to become conductive to transmit signals. That is, the assembly method is set to make the first part of the ACF conductive by pressurizing the first part of the ACF with the second specific pressure and heating the first part of the ACF with the second specific temperature within the second specific time period, and also to make the second part of the ACF conductive by pressurizing the second part of the ACF with the second specific pressure and heating the second part of the ACF with the second specific temperature within the second specific time period. It should be noted that the assembly method does not heat the third part of the ACF with the second specific temperature, so the third part is only adhered to another area of the PCB without being conductive. In addition, it should be noted that the third part can at least include a part located directly below the isolation layer part ISOL and having the same width as the isolation layer part ISOL. That is, the third part is a part located directly below the isolation layer part ISOL and having a width that can be equal to or greater than the width of the isolation layer part ISOL.

[0055] Figure 10Schematic diagram of the assembly method procedure for assembling the force sensor patch 1006 onto the PCB surface according to another embodiment of the present invention. The force sensor patch 1006 is, for example, a capacitive force sensor patch and has a bottom view and a side view. The side view of the force sensor patch 1006 shows that it includes a top layer (the top conductive layer part TOPCL), an intermediate layer (the intermediate dielectric layer part DIEL and a part of the compressible conductive part / cell CP), and a bottom layer (another part of the compressible conductive part CP and the transmission metal gasket / part TX1). The compressible conductive part CP having conductive properties is arranged to be disconnected from the intermediate dielectric layer part DIEL and disconnected from the transmission metal gasket / part TX1. For example, the compressible conductive part CP is used to replace the function of the ground metal gasket / part GND1. As Figure 10 shown, an empty space is designed between the compressible conductive part CP and the intermediate dielectric layer part DIEL (or the transmission metal gasket / part TX1). The height of the compressible conductive part CP is higher than the total height of the intermediate dielectric layer part DIEL and the transmission metal gasket / part TX1. The bottom of the compressible conductive part CP and the bottom of the transmission metal gasket / part TX1 can be coated with conductive and adhesive materials. Therefore, during the assembly process, the user can, in the first step, place the force sensor patch 1006 correspondingly on the top surface of the dashed-line area of the PCB, and then, in the second step, the user can place a compressible gasket (such as a silicone gasket cell) on the top surface of the force sensor patch 1006; the silicone gasket cell is arranged between the TOPCL part of the force sensor patch 1006 and a part of the housing member 103. Then, the user can directly and easily apply an assembly compression pressure with a slight pressure on a part of the housing member 103 to make the force sensor patch 1006 closely fit with the dashed-line area of the PCB, completing the assembly procedure. It is worth mentioning that after the assembly procedure is completed, the height of the compressible conductive part CP will change to be lower than the original height of the compressible conductive part CP.

[0056] Figure 11 Schematic diagram of the assembly method procedure for assembling the force sensor patch 1106 onto the PCB surface according to another embodiment of the present invention. The force sensor patch 1106 is, for example, a capacitive force sensor patch, which can have the transmission metal gasket / part TX1 and the ground metal gasket / part GND1 on the same side (such as its bottom surface), and correspondingly, the dashed-line area of the PCB is designed such that the sensing electrode E1 and the ground electrode E2 are also on the same side, as Figure 11As shown. For example (but not limited to), the size of the force sensor patch 1106 can be 2.5 mm × 3.5 mm, and its capacitance value range can be from 0 to 15 pF (picofarad). Similarly, during the assembly process, in the first step, a dispensing device is set to generate or drip conductive glue on the surfaces of the sensing electrode E1 and the grounding electrode E2 on the top of the PCB. Then, in the second step, the bottom surface of the force sensor patch 1106 is moved and contacted with the top surface of the area of the sensing electrode E1 and the grounding electrode E2. And in the third step, a silicone gasket unit can be placed on the top surface of the force sensor patch 1106 (for example, on the bumper of the force sensor patch 1106). Then, after the housing component 103 is encapsulated, the user can directly and easily apply an assembly compression pressure with a slight pressure on a part of the housing component 103 to make the force sensor patch 1006 closely contact and adhere to the dotted area on the PCB, thus completing the assembly procedure.

[0057] Figure 12 Schematic diagram of the assembly procedure of the earphone device 100 according to an embodiment of the present invention. As Figure 12 shown, for example (but not limited), in step (a), one or more surface mount devices (hereinafter referred to as SMDs) can be set and installed on the PCB. Then, in step (b), the force sensor patch 106 can be assembled and pasted onto a part of the surface of the PCB. Then, in steps (c) and (d), the housing component 103 having a compressible silicone gasket unit can be encapsulated to cover / accommodate the PCB.

[0058] Figure 13 Schematic diagram of the assembly procedure of the earphone device 100 according to another embodiment of the present invention. As Figure 13 shown, for example (but not limited), in step (a), a circuit device such as an SMD component can be set and installed on the PCB. Then, in step (b), the force sensor patch 106 can be assembled and pasted onto the PCB. Then, in step (c), a silicone gasket unit can be placed on the top of the bumper of the force sensor patch 106. Then, in step (d), the housing component 103 can be encapsulated to cover the PCB.

[0059] It should be noted that in Figure 12 and Figure 13In this case, the silicone gasket unit can be compressed by the user during the assembly process to preload a specific pressure onto the force sensor patch 106, so that the force sensor patch 106 can accurately detect the pressure exerted by the user on the housing component 103 after the assembly process is completed. After the assembly process is completed, the shape of the silicone gasket unit may become smaller. The force sensor patch 106 is used to detect sudden changes in the pressure exerted by the user, so the preloaded specific pressure does not affect the performance of the force sensor patch 106.

[0060] In addition, the above-mentioned force sensor patch can also be implemented by using other circuits, such as a force-sensitive resistor element different from a capacitive force sensor. In addition, the electronic device 100 can also be other different types of electronic devices to accommodate different applications. In addition, another advantage is that the top conductive layer part TOPCL can further provide a shielding effect.

[0061] To enable the reader to more clearly understand the operation of the present invention, please refer to Figure 14 , Figure 14 which is a schematic flowchart of the process of assembling a force sensor patch according to an embodiment of the present invention. Assuming that substantially the same results are obtained, the process steps shown in Figure 14 can be omitted. In addition, Figure 14 the steps of

[0062] do not need to be in the exact order shown and do not need to be consecutive, that is, other steps can be in between. The detailed steps are as follows:

[0063] Step S1405: Start;

[0064] Step S1415: Provide a housing component;

[0065] Step S1420: Provide and install an audio processor on the printed circuit board;

[0066] Step S1425: Provide the force sensor patch and paste it onto at least one specific electrode of the printed circuit board to be coupled to the audio processor through at least one specific electrode, so that the force sensor patch can be disposed between a part of the housing component and a part of the inner housing component and is arranged to detect the pressure exerted by the user on a part of the housing component; and

[0067] Step S1430: End.

[0068] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An earphone device, characterized in that, Comprising: A printed circuit board and a force sensor patch; The force sensor patch is adhered to a specific electrode of the printed circuit board to be coupled to an audio processor provided on the printed circuit board through the specific electrode; The force sensor patch is disposed between a part of a housing member of the headphone device and a part of an inner housing member of the headphone device, and is used to detect user pressure applied to the part of the housing member; The inner housing member is disposed in the housing member and integrated with the printed circuit board; The force sensor patch includes: a top conductive layer portion located at a top surface; An intermediate dielectric layer portion; A first bottom conductive portion disposed at a bottom surface and coupled to the intermediate dielectric layer portion; and A second bottom conductive portion disposed at the bottom surface, coupled to the top conductive layer portion, and spaced apart from the first bottom conductive layer portion; Wherein the first bottom conductive portion is attached to a first electrode of the printed circuit board, and The second bottom conductive portion is attached to a second electrode of the printed circuit board.

2. The earphone device according to claim 1, wherein The first electrode of the printed circuit board is a sensing electrode, and the second electrode of the printed circuit board is a ground electrode.

3. The earphone device according to claim 1, characterized in that The force sensor patch includes: A top conductive layer portion located at a top surface; An intermediate dielectric layer portion; A first conductive portion coupled to a bottom of the intermediate dielectric layer portion; A second conductive portion coupled to a bottom of the top conductive layer portion; A first bottom conductive portion disposed at a bottom surface, coupled to a bottom of the first conductive portion to be coupled to the intermediate dielectric layer portion; and A second bottom conductive portion disposed at the bottom surface, coupled to a bottom of the second conductive portion to be coupled to the top conductive layer portion, and spaced apart from the first bottom conductive layer portion; Wherein the first bottom conductive portion is attached to a first electrode of the printed circuit board, and The second bottom conductive portion is attached to a second electrode of the printed circuit board.

4. The earphone device according to claim 3, wherein, The first electrode of the printed circuit board is a sensing electrode, and the second electrode of the printed circuit board is a ground electrode.

5. The earphone device according to claim 3, wherein The first bottom conductive portion and the second bottom conductive portion are conductive adhesives or self-adhesive conductive materials.

6. The earphone device according to claim 1, wherein, The headphone device further includes: A battery device integrated with the inner housing member; Wherein the force sensor patch is further attached to a part of a surface of the battery device and is configured as a gravity sensing circuit to detect sudden acceleration or deceleration of the battery device, thereby sensing sudden acceleration or deceleration of the headphone device.

7. An earphone device, characterized in that, Comprising: A printed circuit board and a force sensor patch; The force sensor patch is adhered to a specific electrode of the printed circuit board to be coupled to an audio processor provided on the printed circuit board through the specific electrode; The force sensor patch is disposed between a part of a housing member of the headphone device and a part of an inner housing member of the headphone device, and is used to detect user pressure applied to the part of the housing member; The inner housing member is disposed in the housing member and integrated with the printed circuit board; The force sensor patch includes: a top conductive layer portion located at the top surface; an intermediate dielectric layer portion; a first conductive portion coupled to the bottom of the intermediate dielectric layer portion; a second conductive portion coupled to the bottom of the top conductive layer portion; and a bottom anisotropic conductive film having a first portion, a second portion, and a third portion, the first portion being coupled to the bottom of the first conductive portion, the second portion being coupled to the bottom of the second conductive portion, and the third portion being disposed between the first portion and the second portion to separate the first portion and the second portion; wherein the first portion, the second portion, and the third portion of the bottom anisotropic conductive film are respectively bonded to an induction electrode, a ground electrode, and another area on the printed circuit board by applying pressure to the bottom anisotropic conductive film at a first specific pressure for a first specific period of time and heating the bottom anisotropic conductive film at a first specific temperature; by applying pressure to the first portion of the bottom anisotropic conductive film at a second specific pressure for the second specific period of time and heating the first portion of the bottom anisotropic conductive film at a second specific temperature to make the first portion of the bottom anisotropic conductive film conductive; by applying pressure to the second portion of the bottom anisotropic conductive film at the second specific pressure for the second specific period of time and heating the second portion of the bottom anisotropic conductive film at the second specific temperature to make the second portion of the bottom anisotropic conductive film conductive; and the third portion of the bottom anisotropic conductive film is attached to the other area of the printed circuit board and is non-conductive.

8. The earphone device according to claim 7, characterized in that, The first conductive portion of the printed circuit board is an induction electrode, and the second conductive portion of the printed circuit board is a ground electrode.

9. The earphone device according to claim 7, wherein The earphone device further includes: a battery device integrated with the inner shell component; wherein the force sensor patch is further attached to a portion of the surface of the battery device and is configured as a gravity sensing circuit to detect a sudden acceleration or deceleration of the battery device, thereby sensing a sudden acceleration or deceleration of the earphone device.

10. A headphone device, characterized in that, Comprising: a printed circuit board and a force sensor patch; the force sensor patch is adhered to a specific electrode on the printed circuit board to be coupled to an audio processor provided on the printed circuit board through the specific electrode; the force sensor patch is disposed between a portion of the outer shell component of the earphone device and a portion of the inner shell component of the earphone device and is used to detect a user pressure applied to the portion of the outer shell component; the inner shell component is disposed in the outer shell component and integrated with the printed circuit board; the force sensor patch includes: a top conductive layer portion located at the top surface; an intermediate dielectric layer portion; a compressible conductive portion coupled to the bottom of the top conductive layer portion; and a bottom conductive layer portion coupled to the bottom of the intermediate dielectric layer portion; Wherein the compressible conductive part is adhered to the second electrode of the printed circuit board, and the bottom conductive layer part is adhered to the first electrode of the printed circuit board.

11. The earphone device according to claim 10, characterized in that, The first electrode of the printed circuit board is an induction electrode, and the second electrode of the printed circuit board is a ground electrode.

12. The earphone device according to claim 10, wherein, The earphone device further includes: A compressible gasket disposed between the top conductive layer part and the part of the housing member to preload pressure.

13. The earphone device according to claim 10, characterized in that, The earphone device further includes: A battery device integrated with the inner housing member; Wherein the force sensor patch is further attached to a part of the surface of the battery device and is configured as a gravity sensing circuit to detect a sudden acceleration or deceleration of the battery device, thereby sensing a sudden acceleration or deceleration of the earphone device.

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