Substrate processing device and substrate processing equipment

Abstract

An embodiment of the present invention provides a substrate processing device and a substrate processing equipment, which can reduce damage and particles caused by impact generated when objects come into contact. The substrate processing device according to the embodiment of the present invention includes: a process chamber, including a first body and a second body that are combined with each other to form a processing space inside; a clamping component that clamps the first body and the second body; and an anti-friction component installed in a groove formed in a contact area where the clamping component contacts the first body or the second body. The substrate processing device according to the embodiment of the present invention is equipped with an anti-friction component installed in a groove formed in a contact area where the first body and the second body contact the locking component, so that damage and particles caused by impact generated during contact can be reduced.

Description

Technical Field

[0001] The present invention relates to a substrate processing device, and more particularly to a substrate processing device for preventing damage due to friction between objects in a semiconductor manufacturing equipment for processing a substrate under a high temperature and high pressure environment. Background Art

[0002] Semiconductor (or display) manufacturing process is a process for manufacturing semiconductor elements on a substrate (e.g., wafer), including exposure, evaporation, etching, ion implantation, cleaning, etc. In particular, there are various organic and inorganic foreign matter on the substrate. Therefore, in order to improve the yield, it is very important to effectively remove the foreign matter on the substrate.

[0003] In order to remove foreign matter, a cleaning process using a processing liquid (cleaning liquid) is mainly used. The cleaning process can be performed by supplying the processing liquid onto or behind the substrate while rotating the spin chuck supporting the substrate, and a wetting process using a wetting liquid and a drying process using a drying gas are performed after the cleaning process.

[0004] The drying process is a process for drying the wetting liquid remaining on the substrate. The wetting liquid on the substrate is replaced with an organic solvent such as isopropyl alcohol (IPA) having a lower surface tension than the wetting liquid, and then the organic solvent is removed. However, as the distance between patterns formed on the substrate becomes smaller, a pattern leaning phenomenon occurs in which the patterns are brought closer due to the organic solvent remaining in the space between the patterns.

[0005] Therefore, recently, a process of removing the organic solvent remaining on the substrate using supercritical fluid is adopted, and the supercritical treatment process is performed under a high temperature and high pressure environment. A substrate processing device that realizes such a high temperature and high pressure environment to process the substrate is adopted. When a structure in which two bodies are combined with each other is adopted in order to form a high temperature and high pressure environment, damage and particles caused by friction between the objects are generated. Summary of the invention

[0006] Therefore, embodiments of the present invention provide a substrate processing apparatus capable of reducing damage and particles caused by impact generated when objects come into contact with each other.

[0007] The problems to be solved by the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned can be clearly understood by those skilled in the art from the following description.

[0008] According to an embodiment of the present invention, a substrate processing device includes: a process chamber, including a first body and a second body that are combined with each other to form a processing space inside; a clamping component that clamps the first body and the second body; and an anti-friction component that is installed in a groove formed in a contact area where the clamping component contacts the first body or the second body.

[0009] In an embodiment of the present invention, the groove may include a first main body groove formed in the first main body and a second main body groove formed in the second main body.

[0010] In an embodiment of the present invention, the groove may include a first clamping groove formed in a region of the clamping member corresponding to the first body and a second clamping groove formed in a region of the clamping member corresponding to the second body.

[0011] In one embodiment of the present invention, the anti-friction component may be composed of at least one of polyetheretherketone (PEEK; poly etherether keton), polyimide (PI; polyimide), polyamide (poly-aramid), polyethylene terephthalate (PET; Polyethylene terephthalate), zirconia (zirconia), SiC, SiN, and alumina.

[0012] In one embodiment of the present invention, the anti-friction component may be composed of a metal body with a surface treated with a resin coating or a diamond-like coating (DLC).

[0013] In one embodiment of the present invention, the surface area of ​​the anti-friction component may be smaller than the surface area of ​​the groove.

[0014] In one embodiment of the present invention, a certain interval may be formed between the anti-friction member and the side wall of the groove, and the certain interval may be set to be larger than the deformation amount caused by the pressure applied to the anti-friction member.

[0015] In one embodiment of the present invention, the anti-friction component may be more protruding than the peripheral portion of the groove.

[0016] In one embodiment of the present invention, a through hole may be formed in the anti-friction component, and a fastening component may be fastened to the contact area through the through hole, thereby fixing the anti-friction component.

[0017] According to another embodiment of the present invention, a substrate processing device includes: a first body, which is provided in a chamber shape with an opening portion formed on one side; a second body, which is provided in a shape corresponding to the opening portion and forms a processing space for the substrate by combining with the opening portion; a locking component, which fixes the second body and the first body; and an anti-friction component, which is installed in a groove formed in a contact area where the locking component contacts the second body.

[0018] The substrate processing equipment according to the embodiment of the present invention includes: a substrate loading part for loading and delivering a substrate; a substrate conveying part for conveying the substrate; a first process processing unit for supplying a cleaning liquid for removing foreign matter remaining on the substrate to the substrate, a wetting liquid for removing the cleaning liquid to the substrate, and an organic solvent for drying the wetting liquid to the substrate; and a second process processing unit for drying the organic solvent remaining on the substrate. The second process processing unit includes: a process chamber including a first body and a second body combined with each other to form a processing space inside; a fluid supply part for supplying fluid to the processing space; a temperature adjustment part for adjusting the temperature of the processing space; a clamping part for clamping the first body and the second body; and an anti-friction part installed in a groove formed for the contact area where the first body and the second body contact the clamping part. Here, the side wall of the groove and the side surface of the anti-friction part are configured not to contact each other.

[0019] The substrate processing apparatus according to the embodiment of the present invention includes an anti-friction component installed in a groove formed in a contact area where the first body and the second body contact the clamping component (or the locking component), thereby reducing damage and particles caused by impact generated during contact.

[0020] The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structure of a substrate processing apparatus is shown.

[0022] Figures 2 to 6 An example of a substrate processing apparatus for drying a wetting liquid on a substrate using a supercritical fluid and a workflow of the substrate processing apparatus are shown.

[0023] Figures 7 to 9 The structure of a substrate processing apparatus according to an embodiment of the present invention is schematically shown.

[0024] Fig.10 A main body into which a friction preventing member is inserted in a substrate processing apparatus according to an embodiment of the present invention is illustrated.

[0025] Fig.11 as well as Fig.12 is a cross-sectional view of a main body in a state where an anti-friction member is inserted according to an embodiment of the present invention.

[0026] Figures 13 to 16 Another example of a substrate processing apparatus to which the friction preventing member is applied according to the embodiment of the present invention is shown.

[0027] Figures 17 to 19 A substrate processing apparatus to which an anti-friction member is applied according to another embodiment of the present invention is shown.

[0028] Fig. 20 as well as Fig.21 A substrate processing apparatus to which an anti-friction member is applied according to yet another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0030] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the entire specification.

[0031] In addition, among the multiple embodiments, the same reference numerals are used for components having the same structure and only a representative embodiment is described, and in the remaining embodiments, only the structure different from the representative embodiment is described.

[0032] Throughout the specification, when it is stated that a part is "connected (or coupled)" to another part, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other components placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may be included rather than excluded.

[0033] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the relevant technology, and will not be ideally or excessively interpreted as formal meanings unless explicitly defined in this application.

[0034] Figure 1 1 shows a schematic structure of a substrate processing apparatus 1. The substrate processing apparatus 1 includes an indexing unit 10 and a process processing unit 20.

[0035] The indexing unit 10 includes a loading port 120 and an indexing chamber 140. Figure 1As shown, the loading port 120, the index chamber 140, and the process unit 20 may be arranged in a row. Hereinafter, the direction in which the loading port 120, the index chamber 140, and the process unit 20 are arranged is referred to as the first direction 12. Furthermore, when viewed from above, the direction perpendicular to the first direction 12 is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0036] The carrier 18 containing the substrate W is placed in the loading port 120 . A plurality of loading ports 120 may be provided, and the loading ports 120 are arranged in a row along the second direction 14 . Figure 1 4 loading ports 120 are provided. However, the number of loading ports 120 can be increased or decreased according to the process efficiency and occupied space of the process processing unit 20. The carrier 18 can use a front opening unified pod (FOUP).

[0037] The index chamber 140 is located between the loading port 120 and the process treatment unit 20. The index chamber 140 has a rectangular parallelepiped shape including a front plate, a rear plate, and two side plates, and an index robot 144 is provided inside the index chamber 140 for transferring the substrate W between the carrier 18 placed in the loading port 120 and the load lock chamber 220. Although not shown, the index chamber 140 may include a controlled air flow system such as vents and a laminar flow system in order to prevent particles from flowing into the internal space.

[0038] The index track 142 is provided in parallel with the second direction 14 in its length direction. The index robot 144 is arranged on the index track 142, and moves linearly in the second direction 14 along the index track 142. The index robot 144 has a base 144a, a robot body 144b and an index arm 144c. The base 144a is configured to be movable along the index track 142. The robot body 144b is coupled to the base 144a. The robot body 144b is provided on the base 144a so as to be movable along the third direction 16. In addition, the robot body 144b is provided on the base 144a so as to be rotatable. The index arm 144c is coupled to the robot body 144b, and is provided so as to be movable forward and backward relative to the robot body 144b. A plurality of index arms 144c are provided, and are provided so as to be independently driven. The index arms 144c are stacked and arranged in a state of being spaced apart from each other along the third direction 16. A portion of the index arm 144c may be used when transferring the substrate W from the process unit 20 to the carrier 18, and another portion may be used when transferring the substrate W from the carrier 18 to the process unit 20. This can prevent particles generated from the substrate W before the process from being attached to the substrate W after the process when the index robot 144 transfers the substrate W in and out.

[0039] The process section 20 may include a load lock chamber 220, a transport chamber 240, a first process unit 260, and a second process unit 280. The transport chamber 240 may be configured such that its length direction is parallel to the first direction 12. The first process unit 260 may be configured on one side of the transport chamber 240 and the second process unit 280 may be configured on the other side along the second direction 14. In addition, the first process unit 260 and the second process unit 280 may be configured to be stacked on each other.

[0040] The load lock chamber 220 is disposed between the index chamber 140 and the transport chamber 240. The load lock chamber 220 provides a space for temporarily loading the substrate W before transferring the substrate W between the transport chamber 240 and the index chamber 140. The load lock chamber 220 provides a slot (not shown) for placing the substrate W therein, and a plurality of slots (not shown) are provided in a manner that they are spaced apart from each other along the third direction 16. The load lock chamber 220 may be provided in a form in which the surface facing the index chamber 140 and the surface facing the transport chamber 240 are open respectively. On the other hand, the index chamber 140, the load lock chamber 220, and the main robot 244 may be collectively referred to as a substrate transport unit.

[0041] The transport chamber 240 can transport the substrate W between the load lock chamber 220, the first process unit 260, and the second process unit 280. A guide rail 242 and a main robot 244 may be provided in the transport chamber 240. The guide rail 242 is configured so that its length direction is parallel to the first direction 12. The main robot 244 is disposed on the guide rail 242 and is configured to be able to move linearly along the first direction 12 on the guide rail 242.

[0042] Hereinafter, a structure for transferring the substrate W is defined as a transfer unit. As an example, the transfer unit may include a transfer chamber 240 and an index chamber 140. In addition, the transfer unit may include a main robot 244 and an index robot 144 provided in the transfer chamber 240.

[0043] The first process unit 260 and the second process unit 280 can sequentially perform processes on a substrate W. For example, the substrate W can be subjected to a chemical process, a wetting process, and a primary drying process in the first process unit 260, and a secondary drying process in the second process unit 280. In this case, the primary drying process may be implemented by an organic solvent, and the secondary drying process may be implemented by a supercritical fluid. The organic solvent may be isopropyl alcohol (IPA) liquid, and the supercritical fluid may be carbon dioxide (CO 2 ). Different from this, one drying process may be omitted in the first process treatment unit 260.

[0044] That is, the first process treatment unit 260 can supply a cleaning liquid for removing foreign matter remaining on the substrate W to the substrate W once, then supply a wetting liquid (inflow: pure water) for removing the cleaning liquid to the substrate W twice, and then supply an organic solvent for drying the wetting liquid to the substrate W three times. After that, the substrate W is transported to the second process treatment unit 280 through the transport unit. The second process treatment unit 280 supplies a fluid for drying the organic solvent remaining on the substrate W, and forms the pressure and temperature inside the processing space into a high temperature / high pressure environment to keep the fluid in a supercritical state. That is, the second process treatment unit 280 dries the organic solvent remaining on the substrate W in a supercritical state, thereby preventing process defects such as pattern tilt.

[0045] According to one embodiment, the organic solvent may be isopropyl alcohol (IPA), and the fluid may be carbon dioxide (CO 2 ), the second process treatment unit 280 maintains the carbon dioxide in a supercritical state to dry the isopropyl alcohol on the substrate W.

[0046] Hereinafter, an embodiment of the present invention applied to a substrate processing apparatus provided as a part of the second process processing unit 280 is described. A substrate processing apparatus 400 for performing a secondary drying process of a substrate W is provided in the second process processing unit 280. The substrate processing apparatus 400 performs a drying process on the substrate W having residual organic solvent. The substrate processing apparatus 400 can perform a drying process on the substrate W using a supercritical fluid.

[0047] Figures 2 to 6 An example of a substrate processing apparatus for drying a wetting liquid on a substrate using a supercritical fluid and a workflow of the substrate processing apparatus are shown. Figures 2 to 6 The substrate processing apparatus 400 includes a shell 402, a process chamber 410, a substrate supporting unit 440, a lifting component 450, a heating component 460, a cutting component 480, an exhaust unit 470, a fluid supply unit 490, a clamping component 500, a moving component 550 and a controller (not shown).

[0048] The housing 402 includes a frame 404 and a middle plate 406. The frame 404 is provided in a cylindrical shape having a space inside. For example, the frame 404 may be provided in a rectangular parallelepiped shape. A through hole 405 is formed on the upper surface of the frame 404 through which a fluid can flow.

[0049] The middle plate 406 is located in the frame 404. The middle plate 406 divides the interior of the frame 404 into an upper space 408a and a lower space 408b. The middle plate 406 may be provided in a hollow plate shape. The process chamber 410 and the clamping member 500 may be provided in the upper space 408a, and the lifting member 450 may be provided in the lower space 408b. The moving member 550 may be located above the housing 402.

[0050] The process chamber 410 forms a processing space 412 therein for processing the substrate W. The process chamber 410 seals the processing space 412 from the outside while processing the substrate W. The process chamber 410 includes a second body 420 , a first body 430 , and a sealing member 414 .

[0051] For example, the second body 420 may be provided in a substantially cylindrical shape. The second body 420 may be lifted and moved toward the upper space 408a and the lower space 408b of the frame 404 by the lifting member 450. A lower supply port 422 and an exhaust port 426 are formed in the bottom surface of the second body 420. The lower supply port 422 functions as a flow path for supplying a supercritical fluid to the processing space 412.

[0052] The first body 430 is combined with the second body 420 to form a processing space 412 inside. The first body 430 is located above the second body 420. The first body 430 is located in the upper space 408a of the shell 402. The first body 430 is coupled to the ceiling surface of the frame 404 through a buffer component 435. The side ends of the first body 430 are provided as steps. The first body 430 is provided so that the center portion above is set to a shape higher than the edge portion. For example, the first body 430 can be provided as a roughly cylindrical shape. An upper supply port 432 is formed in the first body 430. The upper supply port 432 serves as a flow path for supplying supercritical fluid to the processing space 412. According to one example, the first body 430 and the second body 420 can each be provided by a metal material. The upper supply port 432 and the lower supply port 422 can be collectively referred to as a fluid supply portion.

[0053] According to an embodiment of the present invention, in the first body 430 and the second body 420 , the anti-friction member 730 may be installed in a groove formed in a contact area with the clamping member 500 . Figures 2 to 6 The anti-friction member 730 is shown as being mounted on the first body 430 and the second body 420. On the other hand, the anti-friction member 730 may be mounted on the clamp member 500.

[0054] The sealing component 414 can seal the gap between the first body 430 and the second body 420. The sealing component 414 is located between the first body 430 and the second body 420. The sealing component 414 has an annular ring shape. For example, the sealing component 414 can be provided by an O-ring 414. The sealing component 414 is provided on the lower end surface of the first body 430 or the upper end surface of the second body 420. This embodiment illustrates that the sealing component 414 is provided on the upper end surface of the second body 420. A sealing groove for inserting the sealing component 414 is formed on the upper end surface of the second body 420. A portion of the sealing component 414 is inserted into the sealing groove, and another portion protrudes from the sealing groove. The sealing component 414 can be provided by an elastic material.

[0055] The substrate supporting unit 440 supports the substrate W in the processing space 412. The substrate supporting unit 440 supports the substrate W such that a processing surface of the substrate W faces upward.

[0056] The lifting member 450 adjusts the relative position between the first body 430 and the second body 420. The lifting member 450 is lifted so that either the first body 430 or the second body 420 is closer to or farther from the other. The lifting member 450 lifts either the first body 430 or the second body 420 so that the process chamber 410 moves to an open position or a closed position. Here, the open position is a position where the first body 430 and the second body 420 are separated from each other, and the closed position is a position where the first body 430 and the second body 420 are close to and in contact with each other. That is, in the open position, the processing space 412 is open to the outside, and in the closed position, the processing space 412 is sealed relative to the outside.

[0057] Herein, it is described that the lifting member 450 lifts the second body 420 in the lower space 408b, and the position of the first body 430 is fixed. Alternatively, the second body 420 may be fixed, and the first body 430 may be lifted and lowered relative to the second body 420. In this case, the lifting member 450 may be located in the upper space 408a.

[0058] The lifting component 450 includes a support plate 452, a lifting shaft 454 and a driver 456. The support plate 452 supports the second body 420 in the lower space 408b. The second body 420 is fixedly coupled to the support plate 452. The support plate 452 is provided in a circular plate shape. The support plate 452 is provided to have a diameter larger than the hollow. Thus, the lower end of the second body 420 is also located in the lower space 408b in the closed position. The lifting shaft 454 supports the bottom surface of the support plate 452 in the lower space 408b. The lifting shaft 454 is fixedly coupled to the support plate 452. The lifting shaft 454 can be provided in plurality. The lifting shaft 454 can be arranged in a circumferential direction. The driver 456 lifts each lifting shaft 454. The driver 456 is provided in plurality and is coupled to the lifting shaft 454 in a one-to-one correspondence. If the driver 456 is provided with a driving force, the second body 420 and the lifting shaft 454 are lifted and moved, and the first body 430 and the second body 420 move to the closed position where the processing space is closed. If the driving force of the driver 456 is released in the closed position, the first body 430 and the second body 420 can remain in the closed position. Each driver 456 provides a driving force in the same manner, or releases a driving force in the same manner. Thus, the lifting shaft 454 is located at the same height during the lifting process, and the support plate 452 and the second body 420 can be lifted and lowered while maintaining a horizontal state. For example, the driver 456 can be a cylinder or a motor.

[0059] Alternatively, if the driving force of the driver 456 is released in the closed position, the second body 420 and the lifting shaft 454 move downward, and the first body 430 and the second body 420 can move to the open position to open the processing space.

[0060] The heating member 460 heats the processing space 412. The heating member 460 heats the supercritical fluid supplied into the processing space 412 to a temperature above the critical temperature to maintain the supercritical fluid state. The heating member 460 may include a plurality of heaters. On the other hand, the heating member 460 may be referred to as a temperature adjustment unit.

[0061] The heating component 460 is provided in a strip or rod shape having a length direction parallel to each other. The heating component 460 has a length direction perpendicular to the direction in which the clamps 510 and 520 move. For example, the heating component 460 has a length direction parallel to the direction in which each body 420 and 430 moves. In this way, since the side of each body 420 and 430 is clamped, the heating component 460 cannot be inserted from the side of each body 420 and 430. It can be embedded in at least one wall provided in the first body 430 and the second body 420. For example, the heater can receive power from the outside to generate heat. In this embodiment, it is described that the heating component 460 is provided in the first body 430, but it can be provided in each of the first body 430 and the second body 420. In addition, the heating component 460 may not be provided in the first body 430 but provided in the second body 420.

[0062] The cutting member 480 includes a cutting plate 482 and a support platform 484. The cutting plate 482 is located between the lower supply port 422 and the substrate support unit 440. The cutting plate 482 is provided in a circular plate shape. The cutting plate 482 has a diameter smaller than the inner diameter of the second body 420. When viewed from above, the cutting plate 482 has a diameter that completely blocks the lower supply port 422 and the exhaust port 426. For example, the cutting plate 482 can be provided with a diameter corresponding to or larger than the diameter of the substrate W. The support platform 484 supports the cutting plate 482. The support platform 484 is provided in plurality and arranged along the circumferential direction of the cutting plate 482. The respective support platforms 484 are arranged at a certain interval from each other.

[0063] The exhaust unit 470 discharges the fluid of the processing space 412. The process byproducts generated in the processing space 412 are discharged through the exhaust unit 470. The discharge can be natural discharge or forced discharge. In addition, the exhaust unit 470 can adjust the pressure of the processing space 412 while discharging the process byproducts. The exhaust unit 470 includes an exhaust line 472 and a pressure measuring component 474. The exhaust line 472 is connected to the exhaust port 426. The exhaust valve 476 provided in the exhaust line 472 can adjust the exhaust volume of the processing space 412. The pressure measuring component 474 is provided in the exhaust line 472 to measure the pressure of the exhaust line 472. The pressure measuring component 474 is located upstream of the exhaust valve 476 in the exhaust direction. Through the exhaust unit 470, the processing space 412 can be decompressed to normal pressure or a pressure corresponding to the outside of the process chamber 410.

[0064] The fluid supply unit 490 supplies the processing fluid to the processing space 412. The processing fluid is supplied in a supercritical state by critical temperature and critical pressure. The fluid supply unit 490 includes an upper supply line 492 and a lower supply line 494. The upper supply line 492 is connected to the upper supply port 432. The processing fluid is supplied to the processing space 412 via the upper supply line 492 and the upper supply port 432 in sequence. An upper valve 493 is configured in the upper supply line 492. The upper valve 493 opens and closes the upper supply line 492. The lower supply line 494 connects the upper supply line 492 and the lower supply port 422 to each other. The lower supply line 494 branches from the upper supply line 492 and is connected to the lower supply port 422. That is, the processing fluid supplied from each of the upper supply line 492 and the lower supply line 494 can be the same type of fluid. The processing fluid is supplied to the processing space 412 via the lower supply line 494 and the lower supply port 422 in sequence. A lower valve 495 is provided in the lower supply line 494. The lower valve 495 opens and closes the lower supply line 494.

[0065] According to one example, the processing fluid may be supplied from the lower supply port 422 opposite to the non-processing surface of the substrate W, and then the processing fluid may be supplied from the upper supply port 432 opposite to the processing surface of the substrate W. Therefore, the processing fluid may be supplied to the processing space 412 through the lower supply line 494, and then supplied to the processing space 412 through the upper supply line 492. This is to prevent the processing fluid supplied initially from being supplied to the substrate W in a state where the critical pressure or critical temperature has not been reached.

[0066] The clamping member 500 clamps the first body 430 and the second body 420 in the closed position. Thus, even if the pressure in the processing space rises during the process, it is possible to prevent a gap from being generated between the first body 430 and the second body 420. In addition, while the process chamber 410 is clamped by the clamping member 500, the driving force of the driver 456 is released. Thus, it is possible to prevent the driver 456 from being damaged by a strong force applied to the driver 456 for a long period of time.

[0067] The clamping member 500 includes a first clamp 510 and a second clamp 520. The first clamp 510 and the second clamp 520 are located at the side of the process chamber 410. According to one example, the first clamp 510 and the second clamp 520 are respectively arranged to face each other across the process chamber 410. The first clamp 510 and the second clamp 520 are respectively provided in a shape surrounding the process chamber 410. The first clamp 510 and the second clamp 520 each form a clamp groove on the inner side facing the process chamber 410. The edge portion of the first body 430 and the edge portion of the second body 420 located in the closed position can be inserted into the clamp groove. The clamping member 500 can move to a locked position or an unlocked position. Here, the locked position is defined as a position where the first clamp 510 and the second clamp 520 are close to each other and clamp the first body 430 and the second body 420, and the unlocked position is defined as a position where the first clamp 510 and the second clamp 520 are separated from the first body 430 and the second body 420. The first clamp 510 and the second clamp 520 are provided to be combined with each other in the locked position to have an annular ring shape. For example, it can be provided that any vertical cross section of the first clamp 510 and the second clamp 520 has a "C" or The other vertical section is symmetrical with any vertical section based on the vertical axis.

[0068] The moving part 550 moves the clamping part 500 to the locked position and the unlocked position. The moving part 550 moves the clamping part 500 in a direction perpendicular to the moving direction of the process chamber 410. The moving part 550 includes a guide rail 560, a bracket 570 and a driving part 580. The guide rail 560 is located outside the housing 402. The guide rail 560 is arranged adjacent to the upper space 408a where the first body 430 is located. The guide rail 560 is arranged on the upper side of the housing 402. The guide rail 560 has a length direction perpendicular to the moving direction of the process chamber 410. The guide rail 560 is provided in a plurality, each having the same length direction. According to one example, the guide rail 560 is provided in the same number as the through hole 405. The guide rail 560 has a length direction parallel to the through hole 405. When viewed from above, the guide rail 560 and the through hole 405 are arranged to overlap. The bracket 570 fixes the guide rail 560 and the clamping part 500 to each other. The number of brackets 570 provided is the same as that of the guide rails 560. According to one example, when viewed from above, the first clamp 510 is connected to the guide rail 560 located on one side, and the second clamp 520 is connected to the guide rail located on the other side. The driving member 580 drives the guide rail 560 to move the clamping member 500 to the locked position or the unlocked position along the length direction of the guide rail 560.

[0069] The controller controls the lifting component 450 and the moving component 550. The controller controls the lifting component 450 to move the process chamber 410 to the closed position or the open position, and controls the moving component 550 to move the clamping component 500 to the locked position or the unlocked position. According to one example, if the process chamber 410 moves from the open position to the closed position, the controller can control the clamping component 500 to move from the unlocked position to the locked position. If the process chamber 410 is closed by the clamping component 500, the controller can control the lifting component 450 to release the driving force of the driver 456.

[0070] Figures 2 to 6 FIG. 2 shows the steps of processing and sending out the substrate W after the substrate W is placed in the substrate processing device (second processing unit 280). Figure 2 In this way, when the second body 420 is lowered and in the open state, the substrate W is placed and placed on the substrate supporting unit 440. Figure 3 In this way, the second body 420 is raised by the lifting member 450 and the first body 430 and the second body 420 are in contact, thereby sealing the processing space 412. Figure 4 In this way, the clamping member 500 clamps the first body 430 and the second body 420, supplies the processing fluid to the processing space 412, and supplies heat energy to the processing space 412 through the heating member 460. If a certain level of pressure and temperature is formed, a supercritical fluid is formed inside the processing space 412, and a processing process based on the supercritical fluid is performed. If the supercritical processing process is completed, Figure 5 In this way, the clamping member 500 moves to the clamping unlocking position, and then Figure 6 Then, the second body 420 descends and the substrate W can be sent out to the outside.

[0071] like Figures 2 to 6 As shown, the clamping member 500 contacts the first body 430 and the second body 420 by horizontal movement, and pressurizes the first body 430 and the second body 420 in a direction opposite to the pressure inside the processing space 412 to bring them close.

[0072] In order to keep the inside of the processing space 412 in a supercritical state, it is necessary to clamp the first body 430 and the second body 420 with a force greater than the internal pressure. At this time, friction occurs at the position where the first body 430 and the second body 420 contact the clamping part 500, which may generate particles. In particular, when the first body 430, the second body 420, and the clamping part 500 are formed of metal materials, fatal metallic particles are generated on the substrate W, which may cause poor process. A method of attaching a film to the area where the first body 430 and the second body 420 contact the clamping part 500 can be considered, but the film may fall off during the movement of the first body 430 and the second body 420, and there is a risk of contamination due to the adhesive used to attach the film.

[0073] Therefore, an embodiment of the present invention installs a pad-shaped anti-friction component 730 in a groove formed in the contact area where the first body 430 and the second body 420 contact the clamping component 500, thereby reducing damage and particles caused by the contact between the first body 430 and the second body 420 and the clamping component 500.

[0074] On the other hand, compared with the case of the attached film, the pad-shaped anti-friction component 730 has a long life due to the low possibility of component damage and poor adhesion. In addition, the assembly position is structurally determined, so it has the advantage of being able to be repeatedly set at the same position even without a separate assembly fixture.

[0075] As a result, by using the pad-shaped anti-friction member 730, the cost and time for maintaining the substrate processing apparatus can be reduced, thereby improving the overall equipment operating rate. Various embodiments of the substrate processing apparatus to which the anti-friction member 730 is applied are described below.

[0076] Figures 7 to 9 The structure of a substrate processing apparatus according to an embodiment of the present invention is schematically shown.

[0077] According to an embodiment of the present invention, a substrate processing device includes: a process chamber 410 including a first body 430 and a second body 420 that are combined with each other to form a processing space inside; a clamping component 500 that clamps the first body 430 and the second body 420 so that the first body 430 and the second body 420 are close to each other; and an anti-friction component 730 installed in a groove formed in a contact area where the first body 430 and the second body 420 are in contact with each other in the clamping component 500.

[0078] Figure 7The figure shows a case where body grooves 424 and 434 are formed in the first body 430 and the second body 420, respectively, and the anti-friction member 730 is inserted into the body grooves 424 and 434. According to an embodiment of the present invention, the grooves for installing the anti-friction member 730 include the first body groove 434 formed in the first body 430 and the second body groove 424 formed in the second body 420.

[0079] Figure 8 The figure shows a case where a first clamping groove 532 formed in the clamping member 500 at an area in contact with the first body 430 and a second clamping groove 534 formed in the clamping member 500 at an area in contact with the second body 420 are formed, and the anti-friction member 730 is inserted into the first clamping groove 532 and the second clamping groove 534. According to an embodiment of the present invention, the groove for installing the anti-friction member 730 may include the first clamping groove 532 formed in the clamping member 500 at an area corresponding to the first body 430 and the second clamping groove 534 formed in the clamping member 500 at an area corresponding to the second body 420.

[0080] Fig. 9 The first body 430, the second body 420 and the clamping member 500 are all grooved to install the anti-friction member. Fig. 9 As shown, the anti-friction member may be inserted into the first body groove 434 formed in the first body 430 , the second body groove 424 formed in the second body 420 , the first clamping groove 532 and the second clamping groove 534 formed in the clamping member 500 .

[0081] According to an embodiment of the present invention, the anti-friction component 730 can be composed of at least one of polyetheretherketone (PEEK; poly ether etherketon), polyimide (PI; polyimide), polyamide (poly-aramid), polyethylene terephthalate (PET; Polyethylene terephthalate), zirconia, SiC, SiN, and alumina.

[0082] In addition, the anti-friction member 730 may be formed of a metal body with a surface treated with a resin coating or a diamond-like coating (DLC).

[0083] According to an embodiment of the present invention, the anti-friction component 730 may be composed of a plurality of anti-friction pads. Fig.10As shown, the anti-friction component 730 installed in the groove of the first body 430 can be composed of four anti-friction pads. When a single circular pad is formed, the first body 430 needs to be separated as a whole to replace the anti-friction pad. Fig.10 When the anti-friction pad is formed in a plurality of pieces, the anti-friction pad can be replaced without separating the first body 430 , so the anti-friction pad can be replaced more easily.

[0084] On the other hand, the anti-friction component 730 may be composed of one anti-friction pad or may be composed of 2, 3, 4 or other anti-friction pads in various forms.

[0085] Fig.11 as well as Fig.12 2 is a cross-sectional view of a main body in a state where the friction preventing member 730 is inserted according to an embodiment of the present invention.

[0086] According to an embodiment of the present invention, a through hole is formed in the anti-friction component 730, and the fastening component 750 is fastened to the contact area through the through hole, so that the anti-friction component 730 can be fixed. Fig.11 as well as Fig.12 As shown, the anti-friction component 730 is inserted into the first body groove 434 formed in the first body 430 , and the anti-friction component 730 is fixed to the first body 430 by the fastening component 750 .

[0087] On the other hand, the anti-friction member 730 may also be fixed to the first body 430 by an adhesive applied to the bottom surface 434A of the first body groove 434 .

[0088] According to an embodiment of the present invention, a certain interval g may be formed between the anti-friction member 730 and the side wall 434B of the first body groove 434. That is, the surface area of ​​the anti-friction member 730 may be configured to be smaller than the surface area of ​​the first body groove 434. For example, considering that pressure acts on the contact area between the clamping member 500 and the first body 430 due to the pressure inside the processing space 412, and the anti-friction member 730 is deformed due to the pressure, a certain interval g may be formed between the anti-friction member 730 and the side wall 434B of the first body groove 434. Thus, the certain interval g may be set to be larger than the deformation amount caused by the pressure applied to the anti-friction member 730.

[0089] In addition, the anti-friction member 730 may be configured to protrude from the periphery of the first main body groove 434. Considering that the anti-friction member 730 is deformed horizontally due to pressure, the anti-friction member 730 is configured to protrude by a certain height t so that the anti-friction function can be performed even if deformed.

[0090] The above-mentioned anti-friction component 730 can be constructed as follows: Figures 2 to 6A portion of a substrate processing apparatus 400 is shown. The substrate processing apparatus 400 according to an embodiment of the present invention may include: a process chamber 410 including a first body 430 and a second body 420 combined with each other to form a processing space 412 therein; a fluid supply unit for supplying fluid to the processing space 412; a temperature adjustment unit (heating unit 460) for adjusting the temperature of the processing space 412; a clamping unit 500 for clamping the first body 430 and the second body 420 so that the first body 430 and the second body 420 are close to each other; and an anti-friction unit 730 installed in a groove formed for the first body 430 and the second body 420 at a contact area where the clamping unit 500 contacts.

[0091] On the other hand, the above-mentioned substrate processing device 400 including the friction prevention member 730 may be provided as a part of the substrate processing apparatus 1 . For example, the substrate processing device 400 may be included in the second process unit 280 .

[0092] The substrate processing equipment 1 according to the embodiment of the present invention comprises: a loading port 120 for placing and delivering a substrate W; a substrate conveying unit for conveying the substrate W; a first process unit 260 for supplying a processing liquid to the substrate W for processing; and a second process unit 280 for drying the processing liquid remaining on the substrate W.

[0093] The second process treatment unit 280 may include: a process chamber 410 including a first body 430 and a second body 420 that are combined with each other to form a processing space 412 inside; a fluid supply part that supplies fluid to the processing space 412; a temperature adjustment part (heating part 460) that adjusts the temperature of the processing space 412; a clamping part 500 that clamps the first body 430 and the second body 420 so that the first body 430 and the second body 420 are close to each other; and an anti-friction part 730 installed in a groove formed in a contact area where the first body 430 and the second body 420 are in contact with each other in the clamping part 500.

[0094] On the other hand, as described above, the side wall 434B of the groove and the side surface of the anti-friction member 730 may be configured so as not to contact each other. Fig.11 In that way, a certain interval g may be formed between the anti-friction member 730 and the sidewall 434B of the first body groove 434 .

[0095] Figures 13 to 16 Another example of a substrate processing apparatus to which the friction preventing member is applied according to the embodiment of the present invention is shown.

[0096] Reference Figures 13 to 16, including a first body 1410 provided in a chamber shape with an opening formed on one side, and a second body 1425 provided in a shape corresponding to the opening and forming a processing space for a substrate W by combining with the opening. A substrate supporting unit 1420 for supporting the substrate W is provided in the second body 1425, and the second body 1425 can be moved in a horizontal direction by a driving device and combined with the first body 1410. In addition, a processing space is formed inside by combining the first body 1410 and the second body 1425, and a locking member 1440 for fixing the first body 1410 and the second body 1425 is provided. On the other hand, as Fig.13 as well as Fig.14 In this way, after the substrate supporting unit 1420 supporting the substrate W moves horizontally and enters the first body 1410 , the first body 1410 and the second body 1425 are clamped by the lifting and lowering of the locking member 1440 .

[0097] Afterwards, if Fig.15 In this way, when the processing space is sealed, the fluid is supplied through the fluid supply parts 1430A and 1430B and heat is applied to the processing space through the temperature adjustment part, thereby forming a high temperature and high pressure environment. If the process is completed under the high temperature and high pressure environment, the fluid can be discharged through the fluid discharge part 1435, and the locking part 1440 descends to send out the substrate W.

[0098] According to an embodiment of the present invention, an anti-friction member 1450 may be formed at a contact region where the second body 1425 and the locking member 1440 contact each other. As described above, the anti-friction member 1450 may be installed in a groove formed at the contact region.

[0099] According to one embodiment of the present invention, Fig.15 In this way, the anti-friction member 1450 can be installed in the groove formed in the contact area of ​​the locking member 1440. Fig.16 In that way, the anti-friction member 1450 may be installed in the groove formed in the contact area of ​​the second body 1425 .

[0100] According to an embodiment of the present invention, the anti-friction component 1450 may be composed of at least one of polyetheretherketone (PEEK; poly ether etherketon), polyimide (PI; polyimide), polyamide (poly-aramid), polyethylene terephthalate (PET; Polyethylene terephthalate), zirconia (zirconia), SiC, SiN, and alumina. In addition, the anti-friction component 1450 may be composed of a metal body with a surface subjected to resin coating or DLC treatment.

[0101] According to an embodiment of the present invention, a certain interval may be formed between the anti-friction member 1450 and the sidewall of the groove. Here, the interval between the anti-friction member 1450 and the groove may be set to be larger than the deformation amount caused by the pressure applied to the anti-friction member 1450. In addition, the anti-friction member 1450 may protrude from the peripheral portion of the groove.

[0102] According to an embodiment of the present invention, a through hole is formed in the anti-friction component 1450 , and the fastening component is fastened to the contact area (the second body 1425 or the locking component 1440 ) through the through hole, so that the anti-friction component 1450 can be fixed to the second body 1425 or the locking component 1440 .

[0103] Figures 17 to 19 A substrate processing device using an anti-friction component according to another embodiment of the present invention is shown. Figures 2 to 10 The illustrated embodiment is a case where the first body 430 and the second body 420 are clamped together by the clamping member 500 so as not to be opened. However, in order to simplify the device configuration, the first body 430 and the second body 420 may be combined without a clamping device and the first body 430 and the second body 420 may be kept from opening each other by the lifting member 450 (hydraulic pressure of the cylinder). In this case, Figures 17 to 19 In that way, the anti-friction member 730 may be provided at a contact area where the first body 430 and the second body 420 contact each other.

[0104] For example, Fig.17 In this way, the anti-friction member 730 can be installed in the groove formed in the first body 430 located above. Fig.18 In this way, the anti-friction member 730 can be installed in the groove formed in the second body 420 located below. Fig.19 In this way, grooves may be formed in the first body 430 and the second body 420 respectively to mount the anti-friction member 730 .

[0105] Fig. 20 as well as Fig.21 FIG. 2 shows a substrate processing device according to another embodiment of the present invention that uses an anti-friction component. Figures 7 to 12 Unlike the described embodiment in which a groove is formed in the central portion of the first body 430, the second body 420 or the clamping part 500 and the anti-friction part 730 is inserted into the groove formed in the central portion, a groove may be formed in the corner portion of the first body 430, the second body 420 or the clamping part 500 and the anti-friction part 730 may be inserted into the groove located at the corner portion.

[0106] For example, Fig. 20In this way, grooves may be formed in the corners of the clamping member 500 that are in contact with the first body 430 and the second body 420, and the anti-friction member 730 may be installed in the grooves of the corners. Fig.21 In this way, grooves may be formed at corners of the first body 430 and the second body 420 at the portions in contact with the clamping member 500 , and the anti-friction member 730 may be mounted in the grooves at the corners.

[0107] This embodiment and the drawings attached to this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of rights of the present invention.

[0108] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, but rather to the appended claims. All concepts that are equivalent to or equivalently modified to the claims belong to the scope of the concept of the present invention.

Claims

1. A substrate processing device, comprising: The process chamber includes a first body and a second body which are combined with each other to form a processing space inside; A clamping member, clamping the first body and the second body; as well as an anti-friction component installed in a groove formed in a contact area of ​​the clamping component with the first body or the second body, A through hole is formed in the anti-friction component, and a fastening component is fastened to the contact area through the through hole, thereby fixing the anti-friction component. The anti-friction member protrudes more than the peripheral portion of the groove and the fastening member, A certain space is formed between the anti-friction member and the side wall of the groove.

2. The substrate processing apparatus according to claim 1, wherein: The grooves include a first body groove formed in the first body and a second body groove formed in the second body.

3. The substrate processing apparatus according to claim 1, wherein: The grooves include a first clamping groove formed in the clamping member at a region corresponding to the first body and a second clamping groove formed in the clamping member at a region corresponding to the second body.

4. The substrate processing apparatus according to claim 1, wherein: The anti-friction component is composed of at least one of polyetheretherketone, polyimide, polyamide, polyethylene terephthalate, zirconium oxide, SiC, SiN, and alumina.

5. The substrate processing apparatus according to claim 1, wherein: The anti-friction component is composed of a metal body with a surface treated with a resin coating or a diamond-like coating.

6. The substrate processing apparatus according to claim 1, wherein: The surface area of ​​the anti-friction member is configured to be smaller than the surface area of ​​the groove.

7. The substrate processing apparatus according to claim 6, wherein: The certain interval is set to be larger than the amount of deformation caused by the pressure applied to the friction prevention member.

8. A substrate processing device, comprising: A first body provided in a chamber shape with an opening formed on one side; A second body is provided in a shape corresponding to the opening portion and forms a processing space for the substrate by combining with the opening portion; A locking component, fixing the second body and the first body; as well as an anti-friction component installed in a groove formed in a contact area where the locking component contacts the second body, A through hole is formed in the anti-friction component, and a fastening component is fastened to the contact area through the through hole, thereby fixing the anti-friction component. The anti-friction member protrudes more than the peripheral portion of the groove and the fastening member, A certain space is formed between the anti-friction member and the side wall of the groove.

9. The substrate processing apparatus according to claim 8, wherein: The groove is formed in the second body, The anti-friction component is installed in the groove of the second body.

10. The substrate processing apparatus according to claim 8, wherein: The groove is formed in the locking member at a region corresponding to the second body, The anti-friction component is installed in the groove of the locking component.

11. The substrate processing apparatus according to claim 8, wherein: The anti-friction component is composed of at least one of polyetheretherketone, polyimide, polyamide, polyethylene terephthalate, zirconium oxide, SiC, SiN, and alumina.

12. The substrate processing apparatus according to claim 8, wherein: The anti-friction component is composed of a metal body with a surface treated with a resin coating or a diamond-like coating.

13. The substrate processing apparatus according to claim 8, wherein: The surface area of ​​the anti-friction member is configured to be smaller than the surface area of ​​the groove.

14. The substrate processing apparatus according to claim 13, wherein: The certain interval is set to be larger than the amount of deformation caused by the pressure applied to the friction prevention member.

15. A substrate processing device, comprising: Substrate loading unit, for placing and delivering substrates; A substrate conveying unit, for conveying the substrate; a first process treatment unit, supplying a cleaning liquid for removing foreign matter remaining on the substrate to the substrate, supplying a wetting liquid for removing the cleaning liquid to the substrate, and supplying an organic solvent for drying the wetting liquid to the substrate; as well as The second process unit dries the organic solvent remaining on the substrate, The second process unit comprises: The process chamber includes a first body and a second body which are combined with each other to form a processing space inside; a fluid supplying part, for supplying fluid to the processing space; A temperature regulating unit, for regulating the temperature of the processing space; a clamping member for clamping the first body and the second body; and an anti-friction component installed in a groove formed in a contact area of ​​the clamping component with respect to the first body and the second body, The side wall of the groove is configured so as not to contact the side surface of the anti-friction component. A through hole is formed in the anti-friction component, and a fastening component is fastened to the contact area through the through hole, thereby fixing the anti-friction component. The anti-friction member protrudes more than the peripheral portion of the groove and the fastening member, A certain space is formed between the anti-friction member and the side wall of the groove.

16. The substrate processing apparatus according to claim 15, wherein: The organic solvent is isopropyl alcohol, and the fluid is carbon dioxide. The second process unit is configured to maintain the carbon dioxide in a supercritical state to dry the isopropyl alcohol on the substrate.

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