Automatic tin plating method, device and computer equipment for PCB board card

Abstract

The application provides an automatic tin plating method and device for a PCB card and a computer device. A control system acquires a PCB solder layer map, and then determines a layout map of a solder pad position according to the PCB solder layer map. The layout map represents the distribution position and distribution size of the solder pad position on the PCB solder layer map. The control system adjusts the distribution arrangement of a tin plating structure according to the layout map, and controls the adjusted tin plating structure to perform tin plating on the PCB card, thereby meeting the requirements of subsequent processes. The application determines the layout map of the solder pad position by analyzing the PCB solder layer map, and then adjusts the distribution arrangement of the tin plating structure according to the layout map of the solder pad position, and then performs tin plating on the PCB card. Therefore, a fixed steel mesh does not need to be manufactured for the PCB card, and the production cost and production cycle are effectively reduced.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to an automatic soldering method, apparatus and computer equipment for PCB boards. Background Technology

[0002] Flexible printed circuit boards (FPCs) are characterized by high wiring density, light weight, and thinness, and are mainly used in many products such as mobile phones, laptops, and digital cameras. The surface mount technology (SMT) process for FPCs mainly includes three basic steps: solder paste printing, mounting, and reflow soldering. Solder paste printing refers to printing solder paste onto the solder pads of the circuit board (PCB) using a stencil (i.e., a pre-defined pattern). Each type of PCB requires a unique stencil for soldering; stencils cannot be shared between different types of PCBs, resulting in high stencil wastage and low reuse rate, significantly increasing production costs. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides an automatic soldering method, apparatus, and computer device for PCB boards.

[0004] To achieve the above objectives, this application provides an automatic soldering method for PCB boards, applied to a soldering equipment, wherein the soldering equipment includes a soldering structure, and the method includes:

[0005] Obtain the PCB solder pad layer map;

[0006] The layout diagram of the pad positions is determined based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0007] Adjust the distribution and arrangement of the tin-coating structure according to the layout diagram;

[0008] The adjusted tinning structure is used to tin the PCB board.

[0009] This application also provides an automatic soldering device for PCB boards, applied to soldering equipment, the soldering equipment including a soldering structure, the device comprising:

[0010] The acquisition module is used to acquire the PCB solder panel layer map;

[0011] The analysis module is used to determine the layout diagram of the pad positions based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0012] The adjustment module is used to adjust the distribution and arrangement of the tin-plating structure according to the layout diagram;

[0013] The tinning module is used to control the adjusted tinning structure to perform tinning on the PCB board.

[0014] This application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of any of the methods described above.

[0015] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of any of the methods described above.

[0016] This application provides an automatic soldering method, apparatus, and computer device for PCB boards. The control system acquires the PCB solder layer map and then determines the layout of the solder pads based on the PCB solder layer map. This layout map represents the distribution position and size of the solder pads on the PCB solder layer map. The control system adjusts the distribution and arrangement of the soldering structures according to the layout map and controls the adjusted soldering structures to perform soldering on the PCB board to meet the requirements of subsequent processes. This application determines the layout of the solder pads by analyzing the PCB solder layer map, and then adjusts the distribution and arrangement of the soldering structures according to the layout map before performing soldering on the PCB board. This eliminates the need to manufacture a fixed stencil for the PCB board, effectively reducing production costs and production cycle. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the automatic soldering method steps for a PCB board in one embodiment of this application;

[0018] Figure 2 This is a block diagram of the overall structure of the automatic soldering device for a PCB board in one embodiment of this application;

[0019] Figure 3 This is a schematic block diagram of the structure of a computer device according to an embodiment of this application.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] Reference Figure 1 This application provides an automatic soldering method for PCB boards in one embodiment, applied to a soldering equipment, the soldering equipment including a soldering structure, and the method comprising:

[0023] S1: Obtain the PCB solder layer map;

[0024] S2: Determine the layout of the pad positions based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0025] S3: Adjust the distribution and arrangement of the tin-plating structure according to the layout diagram;

[0026] S4: The adjusted tinning structure is used to tin the PCB board.

[0027] In this embodiment, the operator inputs the PCB pad layer map corresponding to the PCB board requiring tinning into the control system of the tinning equipment; alternatively, the operator pre-stores multiple PCB pad layer maps in the control system's database, and each PCB pad layer map is associated with a corresponding PCB board model. Before tinning, the control system can retrieve the corresponding PCB pad layer map based on the PCB board model input by the operator, eliminating the need to re-import new PCB pad layer maps each time, thus improving production efficiency and reducing the operator's workload. The control system identifies the shape of the PCB board through the PCB pad layer map and determines the distribution position and size of each pad on the PCB board based on the pad positions marked on the PCB pad layer map. Combining the shape of the PCB board with the distribution position and size of each pad, a layout map of the pad positions requiring tinning is generated. The tinning equipment is equipped with a tinning structure, which can be a tin spraying device composed of multiple tin spray guns with adjustable distribution positions. The control system generates a solder spray gun matrix diagram based on the layout of the solder pads, representing the distribution of each solder spray gun. Then, the PCB board is moved below the solder spraying device, and the control system arranges the solder spray guns according to the matrix diagram, ensuring that each gun corresponds to a solder pad on the PCB board. Finally, the control system directs the arranged solder spray guns to directly apply solder to the PCB board, achieving soldering. In this embodiment, the layout of the solder pads is obtained through PCB pad diagram analysis, and a solder spray gun matrix diagram is generated based on this diagram. This ensures that the solder spray guns, arranged according to the matrix diagram, correspond to the solder pads on the PCB board. The soldering process is completed by directly applying solder to the PCB board, eliminating the need for a custom stencil. This reduces production costs and increases production efficiency (saving on stencil manufacturing time).

[0028] Furthermore, the tinning structure is a tin spraying device, which consists of multiple tin spraying guns. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0029] S301: Generate the solder spray gun matrix diagram according to the layout diagram;

[0030] S302: Move the PCB board to below the solder spraying device and control the solder spraying guns to be arranged and distributed according to the solder spraying gun matrix diagram.

[0031] In this embodiment, the soldering structure deployed on the soldering equipment is a solder spraying device, which consists of multiple solder spraying guns. The distribution position and solder spraying amount of each gun can be adjusted as needed. The control system deploys the distribution position and solder spraying amount of each solder spraying gun on the solder spraying device according to the layout diagram of the solder pads on the PCB board (different shapes and sizes of solder pads correspond to different solder spraying amounts), ensuring that each solder pad corresponds to one solder spraying gun, generating a solder spraying gun matrix diagram. The soldering equipment includes a conveyor belt, on which the PCB board is placed and transported to the area below the solder spraying device. The control system controls the solder spraying guns to be distributed and arranged according to the solder spraying gun matrix diagram. Specifically, each solder spraying gun is assigned a unique number (e.g., solder spraying gun A, solder spraying gun B, solder spraying gun C, etc.), and the solder spraying gun matrix diagram records the unique number, distribution position, and corresponding solder spraying amount of each gun. Therefore, the control system can move the corresponding solder spray gun to its designated position according to the solder spray gun matrix pattern using the robotic arm corresponding to each gun, based on the gun's unique identification number. After the solder spray guns have been moved and arranged, the system controls each gun to apply solder to the PCB board according to its corresponding solder amount on the solder spray gun matrix pattern, thus applying solder to the PCB board. In this embodiment, the solder spraying device can directly apply solder to the PCB board based on the solder pad layout and the generated solder spray gun matrix pattern, eliminating the need to manufacture a stencil corresponding to the PCB board. This significantly improves production efficiency (saving the stencil manufacturing cycle) and reduces production costs (saving the stencil manufacturing cost). Furthermore, it is flexible in operation, generating corresponding solder spray gun matrix patterns based on different types of PCB solder layer patterns, resulting in high reusability and energy conservation.

[0032] Furthermore, the soldering equipment includes a conveyor belt, the PCB board is placed on the conveyor belt, and the step of controlling the soldering guns to be arranged and distributed according to the soldering gun matrix pattern includes:

[0033] S3021: Obtain the current layout of the PCB board on the conveyor belt;

[0034] S3022: Based on the length-width correspondence between the PCB board layout and the PCB soldering board layer diagram, adjust the distribution position of the solder spraying device relative to the PCB board so that the length-width correspondence between the PCB board layout, the PCB soldering board layer diagram and the solder spraying gun matrix diagram is consistent.

[0035] S3023: After the distribution positions are adjusted, the solder spray guns on the solder spraying device are arranged and distributed according to the solder spray gun matrix diagram.

[0036] In this embodiment, after the PCB board moves to the area below the solder spraying device via the conveyor belt, the control system acquires the current placement layout of the PCB board on the conveyor belt through scanning or imaging. This placement layout represents the relative angular relationship between the PCB board and the direction of travel of the conveyor belt (e.g., the length direction of the PCB board is parallel to the direction of travel of the conveyor belt, or the width direction of the PCB board is parallel to the direction of travel of the conveyor belt, or the PCB board is placed at an angle on the conveyor belt, with a certain angle between the length direction and / or width direction of the PCB board and the direction of travel of the conveyor belt). Based on the length-width correspondence between the PCB board placement layout and the PCB pad layer pattern, the control system adjusts the distribution position of the solder spraying device relative to the PCB board, ensuring that the length-width correspondence between the PCB board placement layout, the PCB pad layer pattern, and the solder spraying gun matrix pattern is consistent. For example, the length direction of the PCB board is parallel to the direction of travel of the conveyor belt, the length and width of the PCB pad layer pattern correspond to the PCB board, and the solder spraying gun matrix pattern is generated based on the PCB pad layer pattern. Therefore, the control system adjusts the solder spraying device so that the length of the outer contour of the solder spraying gun matrix pattern is parallel to the direction of the conveyor belt's travel, thus ensuring that the outer contour of the solder spraying gun matrix pattern corresponds to the length and width of the PCB board. The control system then arranges the solder spraying guns on the solder spraying device according to the solder spraying gun matrix pattern, ensuring that the position of each solder spraying gun corresponds to the pad positions on the PCB board, preventing misalignment and improving the accuracy of soldering on the PCB board and overall production quality.

[0037] Furthermore, the tinning structure includes a stencil assembler, which comprises several steel bars arranged longitudinally and transversely. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0038] S303: Generate a steel bar matrix sequence according to the layout diagram;

[0039] S304: Control the steel bars on the steel mesh assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh.

[0040] Preferably, the soldering structure further includes a solder paste printer, and the controlled and adjusted soldering structure performs soldering on the PCB board in the following steps:

[0041] S305: Cover the PCB board with the matrix splicing steel mesh;

[0042] S306: Control the solder paste printer to print solder paste on the matrix splicing stencil, thereby tinning the PCB board.

[0043] In another embodiment, the soldering structure of the soldering equipment includes a stencil assembler and a solder paste printer. The stencil assembler consists of n*n steel strips arranged horizontally and vertically, each strip bearing a unique identifier recorded by the control system. This identifier is used to control the corresponding strip's extension and retraction movements. The solder paste printer is a standard, existing model and will not be described in detail here. The control system simulates and adjusts the movement strokes (including extension and retraction) of each steel strip on the stencil according to the layout of the pads on the PCB board, generating a steel strip matrix sequence. Then, the control system controls each steel strip to extend and / or retract according to the unique identifier marked in the steel strip matrix sequence, moving the corresponding strokes to ensure the generated matrix stencil corresponds to the pre-simulated steel strip matrix sequence. The control system then covers the generated matrix stencil onto the PCB board and controls the solder paste printer to print solder paste onto the matrix stencil, thus soldering the PCB board.

[0044] Preferably, if the layout of the pads is complex (e.g., a large number of pads, various shapes, etc.), and the stencil assembler cannot generate the stencil matrix sequence corresponding to the layout in one go, the layout can be split as needed. Only a partial stencil matrix sequence corresponding to a part of the layout can be generated each time, and a matrix splicing stencil can be generated according to the partial stencil matrix sequence. The PCB board corresponding to that part of the layout can be tinned. After multiple splicings, the tinning process of the entire PCB board can be completed (for example, if the layout is divided into 4 parts, only one part can be tinned each time, and a total of 4 times are needed to complete the complete tinning process of the PCB board).

[0045] This embodiment generates a matrix splicing stencil by adjusting the steel bars according to the layout diagram of the corresponding solder pad positions. It can be flexibly adjusted when facing different types of PCB boards, realizing the reuse of the stencil and effectively reducing production costs. At the same time, the matrix splicing stencil can be generated on the spot before the soldering process, without the need for production by a special stencil manufacturer, which greatly shortens the production cycle and improves production efficiency.

[0046] Furthermore, the layout diagram includes the opening position, opening size, and opening shape of each of the solder pads; the steel bar matrix sequence includes a unique identifier and movement stroke corresponding to each steel bar; and the step of controlling the steel bars on the stencil assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​stencil includes:

[0047] S3041: Control each of the steel bars to extend and retract according to the motion stroke corresponding to its own unique identifier, and generate the matrix splicing steel mesh corresponding to the opening position, opening size and opening shape of each of the solder pads.

[0048] In this embodiment, the layout diagram of the pad positions includes the opening position, opening size, and opening shape of each pad position on the PCB board. The steel strip matrix sequence generated according to the layout diagram includes a unique identifier and movement stroke for each steel strip. The control system controls the corresponding steel strip to extend or retract according to the corresponding movement stroke based on the unique identifier of the steel strip recorded in the steel strip matrix sequence, so that after the steel strips are spliced, a matrix spliced ​​steel mesh corresponding to the opening position, opening size, and opening shape of each pad position is generated. Specifically, the outward-facing end of the steel strip is provided with teeth. The steel mesh assembler also includes a drive motor and a gear. The gear is set on the drive shaft of the drive motor, and the gear meshes with the teeth of the steel strip (that is, the steel strip part with teeth is equivalent to a rack, and the rack meshes with the gear). Each steel strip corresponds to a single drive motor and gear. When it is necessary to control the steel strip to extend or retract, the drive motor rotates forward or reverse, and the gear on the drive shaft of the drive motor meshes with the teeth at the end of the steel strip, thereby driving the steel strip to extend or retract. Preferably, the gears corresponding to adjacent steel bars are staggered (for example, the initial position of the gear on the first steel bar is at the end of the steel bar, and the initial position of the gear on the second steel bar is 5mm away from the end of the steel bar, and the steel bars in the same direction have the same length), to avoid collisions and interference between adjacent gears due to being too close together. In this embodiment, the control system controls the orderly extension and retraction of each steel bar through a unique identifier, thereby generating a matrix spliced ​​steel mesh that fits the specifications of the welding pad position (opening position, opening size, and opening shape). It is flexible in adjustment, reusable, and has excellent environmental performance.

[0049] Furthermore, the steel mesh assembler includes an upper steel bar array, a middle steel bar array, and a lower steel bar array, which are stacked sequentially from top to bottom.

[0050] The outer contour dimensions of the upper steel bar array, the middle steel bar array, and the lower steel bar array decrease sequentially.

[0051] The upper steel bar array, the middle steel bar array, and the lower steel bar array are all composed of several steel bars arranged in a longitudinal and transverse manner, and each steel bar is provided with a unique identifier;

[0052] The upper steel bar array is used to configure the outer area of ​​the matrix spliced ​​steel mesh;

[0053] The middle layer steel bar array is used to configure the inner perimeter area of ​​the matrix spliced ​​steel mesh;

[0054] The lower layer steel bar array is used to fill the gaps formed when the upper layer steel bar array and / or the middle layer steel bar array are configured with the matrix splicing steel mesh.

[0055] In this embodiment, the steel mesh assembler preferably includes an upper steel bar array, a middle steel bar array, and a lower steel bar array, which are stacked sequentially from top to bottom. The outer contour dimensions of the upper, middle, and lower steel bar arrays decrease sequentially, resembling an inverted tower shape, converging layer by layer from top to bottom. Each of the upper, middle, and lower steel bar arrays consists of n*n steel bars arranged longitudinally and transversely (i.e., a single layer of steel bar array consists of n*n steel bars arranged longitudinally and transversely; the value of n in different layers of steel bar arrays can be the same or different, depending on actual needs, and is not specifically limited here). Each steel bar is assigned a unique identifier so that the control system can select the corresponding steel bar for telescopic movement based on the unique identifier when forming a matrix splicing steel mesh. When generating a matrix spliced ​​steel mesh, the upper layer steel bar array is used to configure the outer area of ​​the matrix spliced ​​steel mesh, that is, the upper layer steel bar array splices to form the outer area of ​​the matrix spliced ​​steel mesh; the middle layer steel bar array is used to configure the inner area of ​​the matrix spliced ​​steel mesh, that is, the middle layer steel bar array splices to form the inner area of ​​the matrix spliced ​​steel mesh; the lower layer steel bar array is used to fill the gaps formed when the upper layer steel bar array and / or the middle layer steel bar array form the matrix spliced ​​steel mesh, that is, the lower layer steel bar array exists as spare steel bars, and when there are no gaps, the lower layer steel bar array does not move at all and remains in its original state. In this embodiment, the distinction between the outer and inner regions of the matrix splicing steel mesh is based on the length and width of the outer contour of the matrix splicing steel mesh. For example, if the length and width of the outer contour of the matrix splicing steel mesh are 8cm and 4cm respectively, then the length and width of the inner region of the matrix splicing steel mesh are 4cm and 2cm respectively. The distance between the length side of the inner region and the length side of the outer contour of the matrix splicing steel mesh on the same side is 1cm, and the distance between the width side of the inner region and the width side of the outer contour of the matrix splicing steel mesh on the same side is 2cm. The area of ​​the matrix splicing steel mesh excluding the inner region is the outer region. The steel mesh assembler in this embodiment includes an upper layer steel bar array, a middle layer steel bar array, and a lower layer steel bar array that converge from top to bottom. Each layer of steel bar array can complement each other when forming the matrix splicing steel mesh, thereby enabling the steel mesh assembler to generate a matrix splicing steel mesh with complex pad positions (e.g., a large number and shape types of pad positions).

[0056] Reference Figure 2 In one embodiment of this application, an automatic soldering device for PCB boards is also provided, which is applied to a soldering equipment. The soldering equipment includes a soldering structure, and the device includes:

[0057] Module 1 is used to acquire the PCB solder panel layer map;

[0058] Analysis module 2 is used to determine the layout diagram of the pad positions based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0059] Adjustment module 3 is used to adjust the distribution and arrangement of the tin-on structure according to the layout diagram;

[0060] Tinning module 4 is used to control the adjusted tinning structure to perform tinning on the PCB board.

[0061] Furthermore, the tinning structure is a tin spraying device, which consists of multiple tin spraying guns. The adjustment module 3 includes:

[0062] The first generation unit is used to generate a solder spray gun matrix diagram according to the layout diagram.

[0063] The moving unit is used to move the PCB board to a position below the solder spraying device and control the solder spraying guns to be arranged and distributed according to the solder spraying gun matrix diagram.

[0064] Furthermore, the soldering equipment includes a conveyor belt, the PCB board is placed on the conveyor belt, and the moving unit includes:

[0065] A sub-unit is used to acquire the current layout of the PCB board on the conveyor belt;

[0066] The adjustment subunit is used to adjust the distribution position of the tin spraying device relative to the PCB board according to the length-width correspondence between the PCB board layout and the PCB soldering layer diagram, so that the length-width correspondence between the PCB board layout, the PCB soldering layer diagram and the tin spraying gun matrix diagram is consistent.

[0067] The arrangement subunit is used to control the arrangement and distribution of each of the solder spray guns on the solder spraying device according to the solder spray gun matrix diagram after the distribution position is adjusted.

[0068] Furthermore, the tinning structure includes a stencil assembler, which comprises several steel bars arranged longitudinally and transversely. The adjustment module 3 further includes:

[0069] The second generation unit is used to generate a steel bar matrix sequence according to the layout diagram.

[0070] The control unit is used to control the steel bars on the steel mesh assembler to be arranged and distributed according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh.

[0071] Preferably, the tinning structure further includes a solder paste printer, and the tinning module 4 includes:

[0072] A covering unit is used to cover the PCB board with the matrix splicing steel mesh;

[0073] The printing unit is used to control the solder paste printer to print solder paste on the matrix splicing stencil, thereby tinning the PCB board.

[0074] Furthermore, the layout diagram includes the opening position, opening size, and opening shape of each of the solder pads; the steel bar matrix sequence includes a unique identifier and movement stroke corresponding to each of the steel bars; and the control unit includes:

[0075] The motion subunit is used to control each of the steel bars to extend and retract according to the motion stroke corresponding to its own unique identifier, so as to generate the matrix splicing steel mesh corresponding to the opening position, opening size and opening shape of each of the solder pads.

[0076] Furthermore, the steel mesh assembler includes an upper steel bar array, a middle steel bar array, and a lower steel bar array, which are stacked sequentially from top to bottom.

[0077] The outer contour dimensions of the upper steel bar array, the middle steel bar array, and the lower steel bar array decrease sequentially.

[0078] The upper steel bar array, the middle steel bar array, and the lower steel bar array are all composed of several steel bars arranged in a longitudinal and transverse manner, and each steel bar is provided with a unique identifier;

[0079] The upper steel bar array is used to configure the outer area of ​​the matrix spliced ​​steel mesh;

[0080] The middle layer steel bar array is used to configure the inner perimeter area of ​​the matrix spliced ​​steel mesh;

[0081] The lower layer steel bar array is used to fill the gaps formed when the upper layer steel bar array and / or the middle layer steel bar array are configured with the matrix splicing steel mesh.

[0082] In this embodiment, each module, unit, and subunit in the automatic soldering device is used to perform each step in the automatic soldering method for the PCB board described above. The specific implementation process is not described in detail here.

[0083] This embodiment provides an automatic soldering device for PCB boards. The control system acquires the PCB solder layer map and then determines the layout of the solder pads based on the PCB solder layer map. This layout map represents the distribution position and size of the solder pads on the PCB solder layer map. The control system adjusts the distribution and arrangement of the soldering structures according to the layout map and controls the adjusted soldering structures to perform soldering on the PCB board to meet the requirements of subsequent processes. This application determines the layout of the solder pads by analyzing the PCB solder layer map, and then adjusts the distribution and arrangement of the soldering structures according to the layout map before performing soldering on the PCB board. This eliminates the need to manufacture a fixed stencil for the PCB board, effectively reducing production costs and production cycle.

[0084] Reference Figure 3 This application also provides a computer device, which may be a server, and its internal structure may be as follows: Figure 3 As shown. The computer device includes a processor, memory, network interface, and database connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database stores data such as PCB soldering layer diagrams. The network interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements an automatic tinning method for PCB boards, applied to a tinning equipment, which includes a tinning structure.

[0085] The processor executes the following steps for the automatic soldering method on the PCB board:

[0086] S1: Obtain the PCB solder layer map;

[0087] S2: Determine the layout of the pad positions based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0088] S3: Adjust the distribution and arrangement of the tin-plating structure according to the layout diagram;

[0089] S4: The adjusted tinning structure is used to tin the PCB board.

[0090] Furthermore, the tinning structure is a tin spraying device, which consists of multiple tin spraying guns. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0091] S301: Generate the solder spray gun matrix diagram according to the layout diagram;

[0092] S302: Move the PCB board to below the solder spraying device and control the solder spraying guns to be arranged and distributed according to the solder spraying gun matrix diagram.

[0093] Furthermore, the soldering equipment includes a conveyor belt, the PCB board is placed on the conveyor belt, and the step of controlling the soldering guns to be arranged and distributed according to the soldering gun matrix pattern includes:

[0094] S3021: Obtain the current layout of the PCB board on the conveyor belt;

[0095] S3022: Based on the length-width correspondence between the PCB board layout and the PCB soldering board layer diagram, adjust the distribution position of the solder spraying device relative to the PCB board so that the length-width correspondence between the PCB board layout, the PCB soldering board layer diagram and the solder spraying gun matrix diagram is consistent.

[0096] S3023: After the distribution positions are adjusted, the solder spray guns on the solder spraying device are arranged and distributed according to the solder spray gun matrix diagram.

[0097] Furthermore, the tinning structure includes a stencil assembler, which comprises several steel bars arranged longitudinally and transversely. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0098] S303: Generate a steel bar matrix sequence according to the layout diagram;

[0099] S304: Control the steel bars on the steel mesh assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh.

[0100] Preferably, the soldering structure further includes a solder paste printer, and the controlled and adjusted soldering structure performs soldering on the PCB board in the following steps:

[0101] S305: Cover the PCB board with the matrix splicing steel mesh;

[0102] S306: Control the solder paste printer to print solder paste on the matrix splicing stencil, thereby tinning the PCB board.

[0103] Furthermore, the layout diagram includes the opening position, opening size, and opening shape of each of the solder pads; the steel bar matrix sequence includes a unique identifier and movement stroke corresponding to each steel bar; and the step of controlling the steel bars on the stencil assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​stencil includes:

[0104] S3041: Control each of the steel bars to extend and retract according to the motion stroke corresponding to its own unique identifier, and generate the matrix splicing steel mesh corresponding to the opening position, opening size and opening shape of each of the solder pads.

[0105] One embodiment of this application also provides a computer-readable storage medium storing a computer program thereon. When the computer program is executed by a processor, it implements an automatic soldering method for a PCB board, applied to a soldering device. The soldering device includes a soldering structure, and the automatic soldering method for the PCB board specifically includes:

[0106] S1: Obtain the PCB solder layer map;

[0107] S2: Determine the layout of the pad positions based on the PCB soldering layer diagram, wherein the layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram;

[0108] S3: Adjust the distribution and arrangement of the tin-plating structure according to the layout diagram;

[0109] S4: The adjusted tinning structure is used to tin the PCB board.

[0110] Furthermore, the tinning structure is a tin spraying device, which consists of multiple tin spraying guns. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0111] S301: Generate the solder spray gun matrix diagram according to the layout diagram;

[0112] S302: Move the PCB board to below the solder spraying device and control the solder spraying guns to be arranged and distributed according to the solder spraying gun matrix diagram.

[0113] Furthermore, the soldering equipment includes a conveyor belt, the PCB board is placed on the conveyor belt, and the step of controlling the soldering guns to be arranged and distributed according to the soldering gun matrix pattern includes:

[0114] S3021: Obtain the current layout of the PCB board on the conveyor belt;

[0115] S3022: Based on the length-width correspondence between the PCB board layout and the PCB soldering board layer diagram, adjust the distribution position of the solder spraying device relative to the PCB board so that the length-width correspondence between the PCB board layout, the PCB soldering board layer diagram and the solder spraying gun matrix diagram is consistent.

[0116] S3023: After the distribution positions are adjusted, the solder spray guns on the solder spraying device are arranged and distributed according to the solder spray gun matrix diagram.

[0117] Furthermore, the tinning structure includes a stencil assembler, which comprises several steel bars arranged longitudinally and transversely. The step of adjusting the distribution and arrangement of the tinning structure according to the layout diagram includes:

[0118] S303: Generate a steel bar matrix sequence according to the layout diagram;

[0119] S304: Control the steel bars on the steel mesh assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh.

[0120] Preferably, the soldering structure further includes a solder paste printer, and the controlled and adjusted soldering structure performs soldering on the PCB board in the following steps:

[0121] S305: Cover the PCB board with the matrix splicing steel mesh;

[0122] S306: Control the solder paste printer to print solder paste on the matrix splicing stencil, thereby tinning the PCB board.

[0123] Furthermore, the layout diagram includes the opening position, opening size, and opening shape of each of the solder pads; the steel bar matrix sequence includes a unique identifier and movement stroke corresponding to each steel bar; and the step of controlling the steel bars on the stencil assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​stencil includes:

[0124] S3041: Control each of the steel bars to extend and retract according to the motion stroke corresponding to its own unique identifier, and generate the matrix splicing steel mesh corresponding to the opening position, opening size and opening shape of each of the solder pads.

[0125] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media provided in this application and in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual-speed SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0126] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, first object, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, first object, or method. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, first object, or method that includes that element.

[0127] The above description is only a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An automatic soldering method for PCB boards, characterized in that, Applied to a soldering equipment, the soldering equipment including a soldering structure, the method includes: Obtain the PCB solder pad layer map; The layout diagram of the pad positions is determined according to the PCB soldering layer diagram. The layout diagram represents the distribution position and size of the pad positions on the PCB soldering layer diagram. The layout diagram includes the opening position, opening size and opening shape of each pad position. A tinning structure matrix diagram is generated according to the layout diagram, and the tinning structures are distributed and arranged according to the tinning structure matrix diagram. The tinning structure matrix diagram is a tin spray gun matrix diagram or a steel bar matrix sequence, and the tinning structure is a tin spray device or a stencil assembler. The tin spray device consists of multiple tin spray guns, and the stencil assembler includes several steel bars arranged in a longitudinal and transverse manner. The adjusted tinning structure is used to tin the PCB board. If the tinning structure is a solder spraying device, the PCB board needs to be moved below the solder spraying device. If the tinning structure is a stencil assembler, the generated matrix splicing stencil needs to be covered on the PCB board.

2. The automatic soldering method for PCB boards according to claim 1, characterized in that, When the tinning structure is a tin spraying device, the step of generating a tinning structure matrix diagram according to the layout diagram and controlling the tinning structure to be distributed and arranged according to the tinning structure matrix diagram includes: According to the layout diagram, a corresponding solder spray gun matrix diagram is generated; The PCB board is moved below the solder spraying device, and the solder spraying guns are arranged and distributed according to the solder spraying gun matrix diagram.

3. The automatic soldering method for PCB boards according to claim 2, characterized in that, The soldering equipment includes a conveyor belt, the PCB board is placed on the conveyor belt, and the step of controlling the solder spray guns to be arranged and distributed according to the solder spray gun matrix pattern includes: Obtain the current layout of the PCB board on the conveyor belt; Based on the length-width correspondence between the PCB board layout and the PCB soldering board layer diagram, the distribution position of the solder spraying device relative to the PCB board is adjusted so that the length-width correspondence between the PCB board layout, the PCB soldering board layer diagram, and the solder spraying gun matrix diagram is consistent. After the distribution positions are adjusted, the solder spray guns on the solder spraying device are arranged and distributed according to the solder spray gun matrix diagram.

4. The automatic soldering method for PCB boards according to claim 1, characterized in that, The step of adjusting the distribution and arrangement of the tin-plating structure according to the layout diagram includes: Based on the layout diagram, a corresponding steel bar matrix sequence is generated; The steel bars on the steel mesh assembler are arranged and distributed according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh.

5. The automatic soldering method for PCB boards according to claim 4, characterized in that, The tinning structure also includes a solder paste printer, and the controlled and adjusted tinning structure performs the tinning process on the PCB board, including: The matrix splicing steel mesh is covered on the PCB board; The solder paste printer is controlled to print solder paste onto the matrix splicing stencil, thereby tinning the PCB board.

6. The automatic soldering method for PCB boards according to claim 4, characterized in that, The steel bar matrix sequence includes a unique identifier and movement stroke for each steel bar. The step of controlling the steel bars on the steel mesh assembler to arrange and distribute them according to the steel bar matrix sequence to generate a matrix spliced ​​steel mesh includes: Each of the steel bars is controlled to extend and retract according to the movement stroke corresponding to its own unique identifier, thereby generating a matrix splicing steel mesh corresponding to the opening position, opening size and opening shape of each of the solder pads.

7. The automatic soldering method for PCB boards according to claim 4, characterized in that, The steel mesh assembler includes an upper steel bar array, a middle steel bar array, and a lower steel bar array, which are stacked sequentially from top to bottom. The outer contour dimensions of the upper steel bar array, the middle steel bar array, and the lower steel bar array decrease sequentially. The upper steel bar array, the middle steel bar array, and the lower steel bar array are all composed of several steel bars arranged in a longitudinal and transverse manner, and each steel bar is provided with a unique identifier; The upper steel bar array is used to configure the outer area of ​​the matrix spliced ​​steel mesh; The middle layer steel bar array is used to configure the inner perimeter area of ​​the matrix spliced ​​steel mesh; The lower layer steel bar array is used to fill the gaps formed when the upper layer steel bar array and / or the middle layer steel bar array are configured with the matrix splicing steel mesh.

8. An automatic soldering device for PCB boards, characterized in that, Applied to a soldering equipment, the soldering equipment includes a soldering structure, and the device includes: The acquisition module is used to acquire the PCB solder panel layer map; The parsing module is used to determine the layout of the pad positions based on the PCB soldering layer map. The layout map represents the distribution position and size of the pad positions on the PCB soldering layer map. The layout map includes the opening position, opening size and opening shape of each pad position. An adjustment module is used to generate a tinning structure matrix diagram according to the layout diagram, and to control the tinning structure to be distributed and arranged according to the tinning structure matrix diagram; wherein, the tinning structure matrix diagram is a tin spray gun matrix diagram or a steel bar matrix sequence, the tinning structure is a tin spray device or a stencil assembler, the tin spray device is composed of multiple tin spray guns, and the stencil assembler includes several steel bars arranged in a longitudinal and transverse manner; The tinning module is used to control the adjusted tinning structure to tin the PCB board. If the tinning structure is a tin spraying device, the PCB board needs to be moved under the tin spraying device. If the tinning structure is a stencil assembler, the generated matrix splicing stencil needs to be covered on the PCB board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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