Antenna packaging structure with horizontal radiation direction and preparation method

Abstract

The present invention provides an antenna packaging structure with a horizontal radiation direction and a preparation method. The preparation method includes the following steps: providing a supporting substrate to form a separation layer; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, electrically connected to a metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, and the antenna radiates in a horizontal direction; forming a plastic encapsulation material layer to plastic encapsulate the antenna array layer; removing the supporting substrate and the separation layer; forming a solder ball bump on the surface of the rewiring layer away from the antenna array layer and electrically connected to the metal wire layer; and attaching a chip to the solder ball bump. The present invention designs the antenna to be a structure that radiates in a horizontal direction, and the antenna height does not need to be very high, thereby reducing the height of the plastic encapsulation layer covering the antenna layer, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, because the antenna has a large expansion space in the horizontal direction, the antenna structure can be flexibly designed according to the device requirements, which helps to improve the device performance.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging technology, and in particular to an antenna packaging structure with a horizontal radiation direction and a preparation method thereof. Background Art

[0002] With the advent of the 5G communication and artificial intelligence era, the amount of data that chips used in such related fields need to transmit and process at high speed is increasing, and the demand for mobile Internet and the Internet of Things is becoming stronger and stronger. The miniaturization and multi-functionality of electronic terminal products have become a major trend in industrial development. How to integrate and package different types of high-density chips together to form a powerful system with low volume and power consumption has become a major challenge in the field of advanced semiconductor chip packaging.

[0003] Fan-out packaging technology can integrate multiple chips and has better performance than substrate-based system-level packaging. The industry is generally optimistic about the application of fan-out packaging technology in the future 5G RF front-end chip integration packaging. Fan-out wafer level packaging (FOWLP) combines the advantages of fan-out packaging and wafer level packaging technology, which can fully meet people's needs for multi-function, high performance, high energy efficiency, low cost and small size of electronic devices. It has become one of the most promising packaging technologies to meet the needs of electronic devices for mobile and network applications.

[0004] To further reduce the device area, the antenna has been integrated into the fan-out wafer-level packaging structure. However, the prior art usually only adopts the antenna design in the vertical radiation direction. Due to the process limit of the molding thickness, the antenna design is more difficult, which hinders the further miniaturization of the device. Summary of the invention

[0005] In view of the shortcomings of the prior art mentioned above, the purpose of the present invention is to provide an antenna packaging structure with a horizontal radiation direction and a preparation method, which is used to solve the problem that the fan-out packaging structure in the prior art only adopts an antenna design with a vertical radiation direction, and the design of the antenna is more difficult due to the process limitation of the plastic packaging thickness.

[0006] To achieve the above-mentioned object and other related objects, the present invention provides a method for preparing an antenna packaging structure in a horizontal radiation direction, comprising the following steps:

[0007] Providing a supporting substrate, and forming a separation layer on the supporting substrate;

[0008] forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer and a metal wire layer located in the dielectric layer and on the surface of the dielectric layer;

[0009] An antenna array layer is formed on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, the antennas radiate in a horizontal direction; the antenna includes a plurality of first metal sheets extending in a first direction and a plurality of second metal sheets extending in a second direction, the plurality of first metal sheets are arranged in parallel and spaced apart, the plurality of second metal sheets are arranged in parallel and spaced apart, and two ends of the second metal sheets are respectively connected to the first metal sheets; the first direction is not parallel to the second direction;

[0010] forming a plastic packaging material layer, wherein the plastic packaging material layer plastic packages the antenna array layer;

[0011] removing the supporting substrate and the separation layer;

[0012] Forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, wherein the solder ball bumps are electrically connected to the metal wire layer;

[0013] A chip is attached onto the solder bumps.

[0014] Optionally, after removing the supporting substrate and the separation layer, the method further includes forming an opening in the dielectric layer, wherein the opening exposes the metal wire layer, and the solder ball bump is formed in the opening.

[0015] Optionally, there are two of each of the first metal sheet and the second metal sheet, and the first direction and the second direction are perpendicular to each other.

[0016] Optionally, the supporting substrate includes a glass substrate; the separation layer includes a release layer and a protective layer, the release layer is formed on the surface of the supporting substrate, and the protective layer is formed on the surface of the release layer facing away from the supporting substrate; the release layer includes a combination of one or more of a carbon material layer, a resin material layer and an organic material layer, and the protective layer includes a polyimide layer.

[0017] Optionally, after forming the rewiring layer, the step of forming an under-bump metallization layer on the surface of the rewiring layer is also included, the under-bump metallization layer is electrically connected to the metal wire layer, and the antenna array layer is formed on the surface of the under-bump metallization layer and is electrically connected to the under-bump metallization layer.

[0018] The present invention also provides an antenna packaging structure in a horizontal radiation direction, the antenna packaging structure in the horizontal radiation direction includes: a rewiring layer, the rewiring layer has a first surface and a second surface relative to each other, the rewiring layer includes a dielectric layer and a metal wire layer located in the dielectric layer and on the surface of the dielectric layer; an antenna array layer, located on the first surface of the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, and the antennas radiate in a horizontal direction; the antenna includes a plurality of first metal sheets extending in a first direction and a plurality of second metal sheets extending in a second direction, the plurality of first metal sheets are arranged in parallel and spaced apart, the plurality of second metal sheets are arranged in parallel and spaced apart, and the two ends of the second metal sheets are respectively connected to the first metal sheets; the first direction is not parallel to the second direction; a plastic encapsulation material layer, located on the first surface of the rewiring layer, and plastic encapsulating the antenna array layer; a solder ball bump, located on the second surface of the rewiring layer, and electrically connected to the metal wire layer; a chip, electrically connected to the solder ball bump.

[0019] Optionally, the antenna packaging structure in the horizontal radiation direction further includes an under-bump metal layer, which is located on the second surface of the rewiring layer, and two ends of the under-bump metal layer are electrically connected to the metal wire layer and the solder ball bump, respectively.

[0020] Optionally, the horizontal radiation direction antenna structure further includes a bottom filling layer, and the bottom filling layer is located between the chip and the solder ball bumps.

[0021] Optionally, there are two of each of the first metal sheet and the second metal sheet.

[0022] Optionally, the first direction and the second direction are perpendicular to each other.

[0023] As described above, the antenna packaging structure and preparation method for the horizontal radiation direction of the present invention designs the antenna to be a structure that radiates in the horizontal direction, and the antenna height does not need to be very high, thereby reducing the height of the plastic encapsulation layer of the plastic encapsulated antenna layer, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, because the antenna has a large expansion space in the horizontal direction, the antenna structure can be flexibly designed according to the device requirements, which helps to improve the device performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 An exemplary manufacturing process flow chart of a manufacturing method of an antenna packaging structure with a horizontal radiation direction provided by the present invention is shown.

[0025] Figure 2 to Figure 10 Display as Figure 1 The schematic diagram of the exemplary structure presented in each step of the preparation process of the preparation process, wherein: Fig.10Also shown is an exemplary cross-sectional structural schematic diagram of the antenna packaging structure in the horizontal radiation direction provided by the present invention.

[0026] Component number description

[0027] 11 Support substrate

[0028] 12 Release layer

[0029] 13. Protective layer

[0030] 14 Dielectric layer

[0031] 141 Opening

[0032] 15 Metal Wire Layer

[0033] 16 Antenna

[0034] 161 First Metal Sheet

[0035] 162 Second Metal Sheet

[0036] 17 Plastic packaging material layer

[0037] 18 solder ball bumps

[0038] 19 Chip

[0039] 20 Under Bump Metallurgy DETAILED DESCRIPTION

[0040] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0041] For example, when describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic view is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0042] For ease of description, spatial relational terms such as "under", "below", "below", "below", "above", "on", etc. may be used herein to describe the relationship between an element or feature shown in the drawings and other elements or features. It will be understood that these spatial relational terms are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intervening layers. In the description of numerical ranges in this specification, unless otherwise specified, the endpoint values ​​are included.

[0043] In the context of the present application, a structure in which a first feature is described as being "above" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0044] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0045] The antenna structure of the existing fan-out wafer-level package usually only adopts a single vertical radiation direction design. In order to improve the antenna performance, it is usually necessary to ensure that the antenna has a certain height, which makes the plastic encapsulation material layer of the plastic encapsulation antenna have to be made very thick to ensure that the antenna is completely encapsulated. However, the existing plastic encapsulation material layer has a thickness process limit, which limits the design of the antenna. Therefore, the present invention proposes an improvement measure.

[0046] Specifically, Figure 1 As shown, the present invention provides a method for preparing an antenna packaging structure in a horizontal radiation direction, comprising the following steps:

[0047] S1: providing a supporting substrate 11, forming a separation layer on the supporting substrate 11, and obtaining a structure reference Figure 2 and Figure 3 As shown;

[0048] S2: forming a rewiring layer on the separation layer, wherein the rewiring layer includes a dielectric layer 14 and a metal wire layer 15 located in the dielectric layer 14 and on the surface of the dielectric layer 14. The obtained structure is as follows Figure 4 As shown;

[0049] S3: forming an antenna array layer on the rewiring layer, the antenna array layer being electrically connected to the metal wire layer 15 (the metal wire layer being used as an antenna feeder); the antenna array layer comprising a plurality of antennas 16 arranged in an array, the antennas 16 radiating in a horizontal direction; the antenna 16 comprising a plurality of first metal sheets 161 extending in a first direction and a plurality of second metal sheets 162 extending in a second direction, the plurality of first metal sheets 161 being arranged in parallel and spaced apart, the plurality of second metal sheets 162 being arranged in parallel and spaced apart, and the two ends of the second metal sheets 162 being respectively connected to the first metal sheets 161; the first direction is not parallel to the second direction, and the obtained structure reference Figure 5 and Figure 7 As shown;

[0050] S4: forming a plastic packaging material layer 17, wherein the plastic packaging material layer 17 plastic packages the antenna array layer, and the obtained structure is referenced Figure 6 As shown;

[0051] S5: removing the supporting substrate 11 and the separation layer, the obtained structure is as follows Figure 8 As shown;

[0052] S6: forming a solder ball bump 18 on the surface of the rewiring layer away from the antenna array layer, wherein the solder ball bump 18 is electrically connected to the metal wire layer 15, and the obtained structure is as follows: Fig. 9 As shown;

[0053] S7: The chip 19 is placed on the solder bump 18, and the obtained structure is as follows Fig.10 shown.

[0054] The antenna of the present invention is designed to radiate in the horizontal direction (i.e., radiate along the side of the package body), and the antenna height does not need to be very high, thereby reducing the height of the plastic encapsulation layer of the plastic encapsulation antenna layer, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, because the antenna has a large expansion space in the horizontal direction, the antenna structure can be flexibly designed according to the device requirements, which helps to improve the device performance.

[0055] As the name implies, the supporting substrate 11 plays a supporting role to avoid defects such as bending and deformation during the device preparation process. As an example, the supporting substrate includes but is not limited to glass substrates, silicon substrates, sapphire substrates, ceramic substrates, metal substrates and other materials with a certain hardness and not prone to bending and deformation. In this embodiment, a transparent substrate such as a glass substrate is preferred, which helps to irradiate UV light from the back of the supporting substrate 11 when peeling off the separation layer so that the supporting substrate 11 can be peeled off from the separation layer. Before preparing the separation layer, the supporting substrate 11 can be cleaned and dried.

[0056] In one example, the separation layer includes a release layer 12 and a protective layer 13, wherein the release layer 12 is formed on the surface of the support substrate 11, and the protective layer 13 is formed on the surface of the release layer 12 away from the support substrate 11, and is used to protect the release layer 12. Of course, in other examples, the separation layer may also be provided with only the release layer 12. In a further example, the release layer 12 includes but is not limited to a combination of one or more of a carbon material layer, a resin material layer and an organic material layer, and the protective layer 13 includes but is not limited to a polyimide layer. For example, the support substrate 11 is a transparent substrate such as a glass substrate, and the release layer 12 is a UV resin layer. When the support substrate 11 is subsequently peeled off, the release layer 12 can be irradiated from the back of the support substrate 11 to make it fall off, thereby achieving peeling. The release layer 12 can also be an LTHC light-to-heat conversion layer. In the subsequent steps, the LTHC light-to-heat conversion layer can be heated based on a laser or other method to separate the support substrate 11 from the LTHC light-to-heat conversion layer, thereby reducing the difficulty of the peeling process and preventing device damage. The method for forming the release layer 12 and the protective layer 13 can be determined according to their materials, for example, they can be selected from spin coating, spray coating, direct attachment and the like.

[0057] As an example, the material of the dielectric layer 14 includes but is not limited to a combination of one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphorus silicon glass, fluorine-containing glass, and other high-K dielectric materials; the material of the metal wire layer 15 includes but is not limited to a combination of one or more of metals such as gold, silver, copper, and aluminum. The method of forming the dielectric layer 14 is not limited to a vapor deposition method, and the method of forming the metal wire layer 15 is not limited to a combination of one or more of methods such as sputtering, electroplating, and chemical plating. In one example, the process of forming the metal wiring layer includes: first forming the dielectric layer 14 on the separation layer, then using a photolithography process to form an opening corresponding to the metal wire layer 15 in the dielectric layer 14, and then forming a metal material layer in the opening and on the surface of the dielectric layer 14 to form the metal wire layer 15. Both the dielectric layer 14 and the metal wire layer 15 can be a single-layer or multi-layer structure, but it is necessary to ensure that the metal wire layers 15 of different layers are electrically connected to each other.

[0058] In one example, after forming the rewiring layer, the method further includes forming an under bump metallurgy (UBM) layer 20 on the surface of the rewiring layer, wherein the under bump metallurgy layer 20 is electrically connected to the metal wire layer 15, and the antenna array layer is formed on the surface of the under bump metallurgy layer 20 and is electrically connected to the under bump metallurgy layer 20. The under bump metallurgy layer 20 may be a single layer or a multilayer structure, and the method for forming the under bump metallurgy layer 20 includes but is not limited to a combination of one or both of a sputtering method and an electroplating method. For example, in one example, the under bump metallurgy layer 20 includes a chromium layer, a chromium-copper (50% to 50%) layer and a copper layer from bottom to top, and a very thin gold layer may be provided on the surface of the under bump metallurgy layer 20 to prevent oxidation of the copper layer. A diffusion layer may also be provided at the bottom of the under bump metallurgy layer 20, such as a lead-tin alloy layer, and a low eutectic compound or other components may also be selected according to different application requirements to achieve better electrical contact between the under bump metallurgy layer 20 and the metal wire layer 15.

[0059] As an example, forming the antenna array layer may include the steps of:

[0060] An antenna metal layer is formed on the rewiring layer by a method including but not limited to a sputtering method or an electroplating method, wherein the material of the antenna metal layer includes but is not limited to a single metal such as gold, silver, copper, or a metal alloy;

[0061] Coating a photoresist layer on the antenna metal layer, and exposing and developing the photoresist layer to define the position and shape of the antenna 16 in the antenna metal layer;

[0062] The antenna metal layer is etched to form the antenna array layer.

[0063] In one example, if Figure 7 As shown, there are two first metal sheets 161 and second metal sheets 162, and the first direction and the second direction are perpendicular to each other. The first metal sheet 161 and the second metal sheet 162 both extend in the horizontal direction (the length extending in the horizontal direction is greater than the height extending in the longitudinal direction), that is, the surfaces with relatively large surface areas (in this embodiment, the surface is a rectangular surface) of both are perpendicular to the horizontal plane (and the width of the surface parallel to the horizontal plane is very small, for example, less than 5000nm), the first metal sheet 161 as an array has the function of guiding and amplifying electromagnetic waves, and the second metal sheet 162 plays the role of radiating electromagnetic waves, which radiates electromagnetic waves outward in the horizontal direction when working, and the plastic packaging material located between the metal sheets plays the role of a propagation medium to transmit the electromagnetic waves radiated from the surface of the second metal sheet 162 in the horizontal direction (for example Figure 7Since the antenna radiates in the horizontal direction, the antenna height does not need to be very high, and the thickness of the corresponding plastic packaging material layer can also be reduced, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, the extended length of the antenna is only limited by the length of the device substrate. For example, if the device substrate is a 300mm silicon wafer, the extended length of the antenna in the horizontal direction can be greatly expanded, which helps to further improve the antenna performance. Of course, in other examples, the antenna can also adopt other structures, which are not strictly limited.

[0064] As an example, the method of forming the molding material layer 17 includes but is not limited to a combination of one or more of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the material of the molding material layer 17 may include a combination of one or more of polyimide, silicone and epoxy resin. After the molding material layer 17 is formed, the molding material layer 17 may be planarized by grinding or polishing to facilitate subsequent processes.

[0065] After the plastic encapsulation material layer 17 is formed, the support base 11 and the separation layer are removed by one or more methods including but not limited to grinding, laser irradiation, heating, etc., depending on the materials of the support base 11 and the separation layer. If the aforementioned protective layer is formed, the protective layer can be removed simultaneously in this step.

[0066] In one example, after removing the support substrate 11 and the separation layer, the step of forming an opening 141 in the dielectric layer 14 is also included, wherein the opening 141 exposes the metal wire layer 15, and the solder ball bump 18 is formed in the opening 141. For example, the opening 141 is formed by laser etching, and then the solder ball bump 18 is formed in the opening 141 by ball mounting, which helps to further ensure good electrical contact between the solder ball bump 18 and the metal wire layer 15. The material of the solder ball bump 18 includes, but is not limited to, tin, gold, copper, or an alloy of tin, gold, and copper.

[0067] As an example, the die bond method including but not limited to instant high temperature mechanical compression welding can be used to weld the chip 19 to the solder ball bump 18. The chip 19 includes but is not limited to various active and passive components, such as power devices, resistors, capacitors, etc. The chip 19 can be single or multiple.

[0068] In one example, before or after forming the chip 19, a bottom filling layer may be formed between the solder ball bump 18 and the chip 19 to provide good protection for the chip 19 and the solder ball bump 18. For example, after attaching the chip 19, a sealing epoxy layer may be formed between the chip 19 and the solder ball bump 18 by using a method including but not limited to a capillary filling method. Or before attaching the chip 19, a bottom filling layer may be formed between the surface of the solder ball bump 18 and the solder ball bump 18, and then laser etching may be used to form openings in the bottom filling layer to expose the solder ball bump 18, and then the chip 19 may be soldered to the surface of the solder ball bump 18 through these openings.

[0069] The present invention also provides an antenna packaging structure in a horizontal radiation direction, which can be prepared by the method described in any of the above schemes, so the above introduction to the antenna packaging structure can be quoted in full here, and for the purpose of brevity, it is not repeated as much as possible. Of course, the antenna packaging structure can also be prepared based on other methods, which will not be elaborated here one by one.

[0070] Specifically, Fig.10 As shown, the antenna packaging structure in the horizontal radiation direction includes: a rewiring layer, the rewiring layer has a first surface and a second surface relative to each other, the rewiring layer includes a dielectric layer 14 and a metal wire layer 15 located in the dielectric layer 14 and on the surface of the dielectric layer 14; an antenna array layer, located on the first surface of the rewiring layer, the antenna array layer is electrically connected to the metal wire layer 15; the antenna array layer includes a plurality of antennas 16 arranged in an array, such as arranged in multiple rows and columns (such as a 2X2 array arrangement) or in a straight line (that is, a single row and multiple columns arrangement or a multi-row single column arrangement), which helps to improve the antenna performance; the antenna 16 radiates in the horizontal direction; the antenna 16 includes It includes a plurality of first metal sheets 161 extending along a first direction and a plurality of second metal sheets 162 extending along a second direction, wherein the plurality of first metal sheets 161 are arranged in parallel and spaced apart, and the plurality of second metal sheets 162 are arranged in parallel and spaced apart, and both ends of the second metal sheets 162 are respectively connected to the first metal sheets 161; the first direction is not parallel to the second direction; a plastic encapsulation material layer 17 is located on the first surface of the rewiring layer, and plastic encapsulates the antenna array layer (it can be completely or partially covered); a solder ball bump 18 is located on the second surface of the rewiring layer, and is electrically connected to the metal wire layer 15; a chip 19 is electrically connected to the solder ball bump 18.

[0071] As an example, the dielectric layer 14 includes but is not limited to a combination of any one or more of an epoxy resin layer, a silicone layer, a PI layer (polyimide layer), a PBO layer (polyphenylene benzoxazole layer), a BCB layer (benzocyclobutene layer), a silicon oxide layer, a phosphosilicate glass layer, and a fluorine-containing glass layer; the metal wire layer 15 includes but is not limited to a combination of one or more of metal layers such as a gold layer, a silver layer, a copper layer, and an aluminum layer.

[0072] As an example, the material of the antenna 16 includes but is not limited to single metal or metal alloy such as gold, silver, copper, etc.

[0073] In one example, the antenna package structure in the horizontal radiation direction further includes an under-bump metallization layer 20, the under-bump metallization layer 20 is located on the second surface of the rewiring layer, and two ends thereof are respectively electrically connected to the metal wire layer 15 and the solder ball bump 18. In one example, the under-bump metallization layer 20 includes a chromium layer, a chromium-copper (50% to 50%) layer, and a copper layer from bottom to top.

[0074] In an example, the horizontal radiation direction antenna 16 structure further includes a bottom filling layer, and the bottom filling layer is located between the chip 19 and the solder ball bumps 18 .

[0075] As an example, the first metal sheet 161 and the second metal sheet 162 are both two. And as an example, the first direction and the second direction are perpendicular. The surfaces of the first metal sheet 161 and the second metal sheet 162 perpendicular to the horizontal plane are rectangular surfaces, and the areas of the surfaces are much larger than the areas of the surfaces parallel to the horizontal plane. Or it can also be described as that the first metal sheet 161 and the second metal sheet 162 both include a first surface and a second surface perpendicular to each other, the first surface is a surface parallel to the horizontal plane and the second surface is a surface perpendicular to the horizontal plane, and the area of ​​the second surface is larger than the area of ​​the first surface. That is, the first metal sheet 161 and the second metal sheet 162 are both thin plates, and the lengths of both are larger than their height and width.

[0076] By arranging the antenna to radiate in the horizontal direction, the design of the antenna is not limited by the thickness of the plastic packaging process, thereby improving the flexibility of the antenna design.

[0077] In summary, the present invention provides an antenna packaging structure with a horizontal radiation direction and a preparation method, the preparation method comprising the steps of: providing a supporting substrate, forming a separation layer on the supporting substrate; forming a rewiring layer on the separation layer, the rewiring layer comprising a dielectric layer and a metal wire layer located in the dielectric layer and on the surface of the dielectric layer; forming an antenna array layer on the rewiring layer, the antenna array layer being electrically connected to the metal wire layer; the antenna array layer comprising a plurality of antennas arranged in an array, the antenna radiating in a horizontal direction; the antenna comprising a plurality of first metal sheets extending in a first direction and a plurality of second metal sheets extending in a second direction, the plurality of first metal sheets being arranged in parallel and spaced apart, the plurality of second metal sheets being arranged in parallel and spaced apart, and the two ends of the second metal sheets being respectively connected to the first metal sheets; the first direction is not parallel to the second direction; forming a plastic encapsulation material layer, the plastic encapsulation material layer encapsulating the antenna array layer; removing the supporting substrate and the separation layer; forming a solder ball bump on the surface of the rewiring layer away from the antenna array layer, the solder ball bump being electrically connected to the metal wire layer; and attaching a chip to the solder ball bump. The present invention designs the antenna to be a structure that radiates in the horizontal direction, and the antenna height does not need to be very high, thereby reducing the height of the plastic sealing layer of the plastic sealing antenna layer, which helps to increase the antenna frequency and further reduce the size of the device. At the same time, because the antenna has a large expansion space in the horizontal direction, the antenna structure can be flexibly designed according to the device requirements, which helps to improve the device performance.

[0078] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for preparing an antenna packaging structure with a horizontal radiation direction, characterized in that: The following steps are involved: Providing a supporting substrate, and forming a separation layer on the supporting substrate; forming a rewiring layer on the separation layer, wherein the rewiring layer comprises a dielectric layer and a metal wire layer located in the dielectric layer and on the surface of the dielectric layer; An antenna array layer is formed on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, the antennas radiate in a horizontal direction; the antenna includes a plurality of first metal sheets extending in a first direction and a plurality of second metal sheets extending in a second direction, the plurality of first metal sheets are arranged in parallel and spaced apart, the plurality of second metal sheets are arranged in parallel and spaced apart, and two ends of the second metal sheets are respectively connected to the first metal sheets; the first direction is not parallel to the second direction; forming a plastic packaging material layer, wherein the plastic packaging material layer plastic packages the antenna array layer; removing the supporting substrate and the separation layer; Forming solder ball bumps on a surface of the rewiring layer away from the antenna array layer, wherein the solder ball bumps are electrically connected to the metal wire layer; A chip is attached onto the solder bumps.

2. The method for preparing the antenna packaging structure in the horizontal radiation direction according to claim 1, characterized in that: After removing the supporting substrate and the separation layer, the method further includes forming an opening in the dielectric layer, wherein the opening exposes the metal wire layer, and the solder ball bump is formed in the opening.

3. The method for preparing the antenna packaging structure in the horizontal radiation direction according to claim 1, characterized in that: There are two of each of the first metal sheet and the second metal sheet, and the first direction and the second direction are perpendicular to each other.

4. The method for preparing the antenna packaging structure in the horizontal radiation direction according to claim 1, characterized in that: The supporting substrate includes a glass substrate; the separation layer includes a release layer and a protective layer, the release layer is formed on the surface of the supporting substrate, and the protective layer is formed on the surface of the release layer facing away from the supporting substrate; the release layer includes a combination of one or more of a carbon material layer, a resin material layer and an organic material layer, and the protective layer includes a polyimide layer.

5. The method for preparing the antenna packaging structure in the horizontal radiation direction according to claim 1, characterized in that: After forming the rewiring layer, the step of forming an under-bump metallization layer on the surface of the rewiring layer is also included, wherein the under-bump metallization layer is electrically connected to the metal wire layer, and the antenna array layer is formed on the surface of the under-bump metallization layer and is electrically connected to the under-bump metallization layer.

6. An antenna packaging structure with a horizontal radiation direction, characterized in that: The antenna packaging structure in the horizontal radiation direction includes: A rewiring layer, the rewiring layer having a first surface and a second surface opposite to each other, the rewiring layer comprising a dielectric layer and a metal wire layer located in the dielectric layer and on the surface of the dielectric layer; An antenna array layer, located on the first surface of the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas arranged in an array, the antennas radiate in a horizontal direction; the antenna includes a plurality of first metal sheets extending in a first direction and a plurality of second metal sheets extending in a second direction, the plurality of first metal sheets are arranged in parallel and spaced apart, the plurality of second metal sheets are arranged in parallel and spaced apart, and both ends of the second metal sheets are connected to the first metal sheets respectively; the first direction is not parallel to the second direction; there are two first metal sheets and two second metal sheets; A plastic packaging material layer, located on the first surface of the rewiring layer and plastic packaging the antenna array layer; A solder ball bump is located on the second surface of the rewiring layer and is electrically connected to the metal wire layer; A chip electrically connected to the solder ball bumps; and A bottom filling layer is located between the chip and the solder ball bumps.

7. The antenna packaging structure with horizontal radiation direction according to claim 6, characterized in that: The antenna packaging structure in the horizontal radiation direction further includes an under-bump metal layer, which is located on the second surface of the rewiring layer, and has two ends electrically connected to the metal wire layer and the solder ball bump, respectively.

8. The antenna packaging structure in a horizontal radiation direction according to any one of claims 6 to 7, characterized in that: The first direction and the second direction are perpendicular to each other.

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