A single-head four-swing-arm crystal bonding device for semiconductor crystal bonding machine

Abstract

The present invention relates to the field of semiconductor packaging technology, and specifically to a single-head four-swing-arm crystal bonding device for a semiconductor crystal bonding machine, comprising a substrate, a bracket arranged on the top of the substrate, a swing arm unit and a pressing piece; a rotating motor is arranged on the top of the bracket, a rotating shaft is arranged in the axial direction of the output shaft of the rotating motor, and a four-claw frame is integrally formed at the bottom end of the rotating shaft; at least two or more groups of swing arm units are coupled to the circumference of the four-claw frame; the bracket includes a main bracket plate and side plates arranged at both ends; by arranging four groups of swing arm units, the running trajectories of the four groups of swing arm units are respectively that the first group is sucking crystals, the third group opposite to the first group is solidifying crystals, the second group is preparing to suck crystals, and the fourth group opposite to the second group is preparing to solidify crystals. The above is the work performed simultaneously by the four groups of swing arm units, which greatly improves the efficiency of semiconductor crystal bonding.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, in particular to a single-head four-swing-arm crystal bonding device for a semiconductor crystal bonding machine. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins are used to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit; then the independent chips are packaged and protected with a plastic shell, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after the incoming inspection, test and packaging processes, and finally put into storage for shipment;

[0003] Die bonding is also called die bonding or chip mounting. Die bonding is the process of bonding the chip to the designated area of ​​the bracket through colloid (generally conductive glue or insulating glue for LED) to form a thermal or electrical path to provide conditions for subsequent wire bonding.

[0004] In the existing technology, a single-head single-swing mode is generally used to suck the wafer, and then the sucked wafer is placed in a specified area of ​​the bracket. The wafer is only fixed by one swing arm, resulting in low efficiency of wafer fixing, which cannot meet the requirements of existing semiconductor packaging. Summary of the invention

[0005] In view of the problem that the single-head single-swing arm crystal bonding in the prior art has low efficiency and cannot meet the existing semiconductor packaging production needs, the present invention provides a single-head four-swing arm crystal bonding device for a semiconductor crystal bonding machine.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] A single-head four-swing-arm crystal bonding device for a semiconductor crystal bonding machine, comprising a substrate, a bracket arranged on the top of the substrate, a swing-arm unit and a pressing member;

[0008] A rotating motor is arranged on the top of the bracket, a rotating shaft is arranged in the axial direction of the output shaft of the rotating motor, and a four-claw frame is integrally formed on the bottom end of the rotating shaft;

[0009] At least two groups of swing arm units are coupled to the periphery of the four-claw frame;

[0010] The bracket includes a main bracket plate and side plates arranged at both ends;

[0011] A rotating member is arranged inside the main bracket plate;

[0012] The rotating member comprises an outer ring and an inner ring arranged inside the outer ring;

[0013] The swing arm unit comprises a connecting block, a sliding block, a swing arm member connected to the sliding block, and a vacuum suction nozzle arranged at the end of the swing arm member, wherein the sliding block is slidably connected to the inner side of the connecting block;

[0014] A return spring A is provided between the connecting block and the sliding block;

[0015] A straw placement tube is arranged outside the rotating shaft, a vacuum straw is arranged inside the straw placement tube, and two ends of the vacuum straw are respectively located at the top of the straw placement tube and outside the mounting frame;

[0016] Two sets of drive units are arranged at the rear end of the side plate;

[0017] The driving unit comprises a driving motor and a cam arranged at the front end of the output shaft of the driving motor, wherein the two sets of driving motors rotate in opposite directions;

[0018] The pressing member comprises a pressing arm and a pressing head integrally arranged on the top of the pressing arm, a fixed shaft is arranged inside the pressing head, a roller is movably connected to the outer side of the middle of the fixed shaft at a position corresponding to the cam, the pressing arm and the side plate are both provided with fixing columns, and a return spring B is arranged between the two fixing columns;

[0019] A pulley is arranged on the inner side of the top of the sliding block at a position corresponding to the lower pressing arm.

[0020] Wherein, a coupling is arranged between the output shaft and the rotating shaft of the rotating motor.

[0021] The outer ring is fixedly connected to the main support plate, and the inner ring is rotatably connected to the outer ring, so as to form a bearing to reduce the friction resistance of the rotating shaft.

[0022] Wherein, a mounting frame is integrally connected to the bottom of the inner ring, and the mounting frame is fixedly connected to the connecting block.

[0023] Wherein, a guide rail is fixedly installed on the front outer wall of the side plate, a slider is slidably connected to the outer side of the guide rail, and the slider is fixedly installed inside the lower pressure arm.

[0024] Wherein, the lower pressing arm is J-shaped.

[0025] Beneficial effects of the present invention:

[0026] (1) The present invention discloses a single-head four-swing-arm semiconductor crystal bonding device, which is equipped with four groups of swing-arm units. The operation trajectories of the four groups of swing-arm units are as follows: the first group is sucking crystals, the third group opposite to the first group is bonding crystals, the second group is preparing to suck crystals, and the fourth group opposite to the second group is preparing to bond crystals. The above operations are performed simultaneously by the four groups of swing-arm units, which greatly improves the efficiency of semiconductor crystal bonding.

[0027] (2) The single-head four-swing-arm crystal bonding device of a semiconductor crystal bonding machine described in the present invention, by setting a driving unit, the two driving units have opposite directions, which can help the swing-arm units located in the same straight line to complete the work of crystal suction and crystal bonding at the same time, thereby further improving the efficiency of crystal bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0029] Figure 1 A schematic front view of the structure of a single-head four-swing-arm semiconductor die bonding device provided by the present invention;

[0030] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure;

[0031] Figure 3 for Figure 2 A schematic diagram of the local enlarged structure at point A in the middle;

[0032] Figure 4 It is a schematic diagram of the connection structure between the swing arm unit, the rotating member and the straw placement cylinder;

[0033] Figure 5 It is a schematic diagram of the positional relationship between the outer ring, the inner ring and the swing arm unit;

[0034] Figure 6 for Figure 5 A schematic diagram of the local enlarged structure at B in the middle;

[0035] Figure 7 It is a schematic diagram of the connection structure between the inner ring, the connecting block, the rotating shaft, the four-claw frame and the mounting frame;

[0036] Figure 8 It is a schematic diagram of the connection structure between the lower pressure arm, side plate, slider and guide rail.

[0037] In the figure: 1. base plate; 2. rotating motor; 3. bracket; 301. main bracket plate; 302. side plate; 303. guide rail; 4. driving unit; 401. driving motor; 402. cam; 5. swing arm unit; 501. connecting block; 502. vacuum suction nozzle; 503. swing arm member; 504. sliding block; 505. pulley; 6. pressing member; 601. pressing arm; 602. roller; 603. pressing head; 604. fixed shaft; 605. slider; 7. fixing column; 8. reset spring B; 9. coupling; 10. rotating member; 101. outer ring; 102. inner ring; 103. rotating shaft; 104. mounting frame; 105. four-claw frame; 11. straw placement tube; 12. vacuum suction pipe; 13. reset spring A. DETAILED DESCRIPTION

[0038] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0039] like Figure 1 As shown, a semiconductor die bonder single-head four-swing-arm die bonder of the present invention comprises a substrate 1, a bracket 3 arranged on the top of the substrate 1, a swing-arm unit 5 and a pressing member 6;

[0040] Among them, Figure 1 and Figure 4-7 As shown, a rotating motor 2 is arranged on the top of the bracket 3, a rotating shaft 103 is arranged in the axial direction of the output shaft of the rotating motor 2, and a four-claw frame 105 is integrally formed at the bottom end of the rotating shaft 103; at least two groups of swing arm units 5 are coupled to the circumference of the four-claw frame 105; the bracket 3 includes a main bracket plate 301 and side plates 302 arranged at both ends; a rotating member 10 is arranged on the inner side of the main bracket plate 301; the swing arm unit 5 includes a connecting block 501, a sliding block 504, a swing arm member 503 connected to the sliding block 504, and a vacuum suction nozzle 502 arranged at the end of the swing arm member 503, wherein the sliding block 504 is slidably connected to the inner side of the connecting block 501; a reset spring A13 is arranged between the connecting block 501 and the sliding block 504; a straw placement tube 11 is arranged on the outer side of the rotating shaft 103, a vacuum straw 12 is arranged in the straw placement tube 11, and the two ends of the vacuum straw 12 are respectively located at the top of the straw placement tube 11 and the outside of the mounting frame 104;

[0041] The vacuum suction nozzle 502 arranged on the swing arm unit 5 is connected to the exhaust port of the vacuum pump through the vacuum suction pipe 12 (not shown in the figure). The vacuum pump is used to generate negative pressure at the suction nozzle of the vacuum suction nozzle 502 arranged at the end of the swing arm member 503 to suck the wafer on the wafer plate, and then the output shaft of the rotating motor 2 is used to drive the rotating shaft 103 to rotate. The four-claw frame 105 at the bottom end of the rotating shaft 103 drives the four groups of swing arm units 5 on the surrounding side to rotate to the specified area, and then the operation of the vacuum pump is stopped, so that the wafer on the suction nozzle of the vacuum suction nozzle 502 falls into the specified area, and then the wafer is bonded by the colloid, that is, the process of crystal bonding is completed, and the crystal bonding efficiency is improved by the four groups of swing arm units 5;

[0042] Among them, Figure 1-3 and Figure 8 As shown, two groups of driving units 4 are arranged at the rear end of the side plate 302; the driving unit 4 includes a driving motor 401 and a cam 402 arranged at the front end of the output shaft of the driving motor 401, and the two groups of driving motors 401 rotate in opposite directions; the pressing member 6 includes a pressing arm 601, a pressing head 603 integrally arranged at the top of the pressing arm 601, a fixed shaft 604 is arranged on the inner side of the pressing head 603, a roller 602 is movably connected with the middle outer side of the fixed shaft 604 at a position corresponding to the cam 402, a fixing column 7 is arranged on the pressing arm 601 and the side plate 302, and a return spring B8 is arranged between the two fixing columns 7; a guide rail 303 is fixedly installed on the outer wall of the front side of the side plate 302, a slider 605 is slidably connected to the outer side of the guide rail 303, and the slider 605 is fixedly installed inside the pressing arm 601; a pulley 505 is arranged on the inner side of the top of the sliding block 504 at a position corresponding to the pressing arm 601; the pressing arm 601 is J-shaped; using two driving Unit 4 completes the crystal absorbing and solidifying process of the swing arm unit 5 located in a straight line, and the driving motor 401 drives the cam 402 fixedly connected to the outer wall of the output shaft to rotate, and the large circle part of the cam 402 rotates and presses down on the roller 602, and the roller 602 is fixedly connected to the lower pressing arm 601 through the fixed shaft 604, so the lower pressing arm 601 moves downward, and the bottom end of the lower pressing arm 601 is connected with the sliding block 504, and the sliding block 504 is also provided with a pulley 505 to reduce the friction resistance between the two, and the sliding block 504 slides downward in the connecting block 501. Since the two groups of driving units 4 have opposite directions, the swing arm units 5 located in the same straight line complete the crystal absorbing and solidifying process at the same time, and the remaining two groups of swing arm units 5 are in the action of preparing for crystal absorbing and preparing for solidifying, wherein the swing arm 503 and the lower pressing arm 601 are reset by the reset spring A13 and the reset spring B8;

[0043] Among them, Figure 4As shown, the rotating member 10 includes an outer ring 101 and an inner ring 102 disposed inside the outer ring 101; the outer ring 101 is fixedly connected to the main support plate 301, and the inner ring 102 is rotatably connected to the outer ring 101 to form a bearing to reduce the friction resistance of the rotating shaft 103;

[0044] The straw placement tube 11 is fixedly sleeved on the outside of the rotating shaft 103, and the bottom end of the straw placement tube 11 is fixedly sleeved with the bottom of the inner ring 102. The opening of the inner ring 102 is wide at the top and narrow at the bottom, which is convenient for placing the vacuum straw 12, and can be fixedly connected with the straw placement tube 11. When the rotating shaft 103 drives the straw placement tube 11 to rotate, the inner ring 102 and the outer ring 101 rotate relative to each other, which can reduce friction resistance, so as to increase the service life of the equipment;

[0045] Among them, Figure 4 As shown, a coupling 9 is provided between the output shaft of the rotating motor 2 and the rotating shaft 103, and the coupling 9 is used to transmit the output shaft rotation torque and direction of the rotating motor 2 to the rotating shaft 103, so as to drive the four sets of swing arm units 5 to rotate;

[0046] Among them, Figure 7 As shown, a mounting frame 104 is integrally connected to the bottom of the inner ring 102 , and the mounting frame 104 is fixedly connected to the connecting block 501 , thereby increasing the fixing strength of the connecting block 501 .

[0047] Working principle: when in use, first, the driving motor 401 on the driving unit 4 drives the large circular part of the cam 402 to press down, so that the lower pressing arm 601 in the lower pressing member 6 moves downward, and the lower pressing arm 601 moves downward to make the sliding block 504 slide in the connecting block 501, so that the swing arm member 503 is pressed down, and the vacuum suction nozzle 502 set at the end of the swing arm member 503 is pressed down. Since the vacuum suction nozzle 502 is set on the swing arm unit 5, through the through connection between the vacuum suction pipe 12 and the vacuum suction nozzle 502, the vacuum pump is used to generate negative pressure at the suction nozzle of the vacuum suction nozzle 502 to suck the wafer on the wafer disk to complete the crystal suction operation, and then the rotating motor 2 is rotated to transfer the wafer to the designated area, and then the wafer is fixed by the downward pressing operation to complete the crystal fixing operation, so that the operation trajectory of the four groups of swing arm units is that the first group is sucking the crystal, the third group opposite to the first group is fixing the crystal, the second group is preparing to suck the crystal, and the fourth group opposite to the second group is preparing to fix the crystal.

[0048] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor die bonder with a single head and four swing arms, characterized in that: It comprises a base plate (1), a bracket (3) arranged on the top of the base plate (1), a swing arm unit (5) and a pressing member (6); A rotating motor (2) is arranged on the top of the bracket (3); a rotating shaft (103) is arranged in the axial direction of the output shaft of the rotating motor (2); and a four-claw frame (105) is integrally formed at the bottom end of the rotating shaft (103); Four groups of swing arm units (5) are coupled to the circumferential side of the four-claw frame (105); The support (3) comprises a main support plate (301) and side plates (302) arranged at both ends; A rotating member (10) is provided inside the main support plate (301); The rotating member (10) comprises an outer ring (101) and an inner ring (102) arranged inside the outer ring (101); The swing arm unit (5) comprises a connecting block (501), a sliding block (504), a swing arm member (503) connected to the sliding block (504), and a vacuum suction nozzle (502) arranged at the end of the swing arm member (503), wherein the sliding block (504) is slidably connected to the inner side of the connecting block (501); A return spring A (13) is provided between the connecting block (501) and the sliding block (504); A straw placement tube (11) is arranged outside the rotating shaft (103), a vacuum straw (12) is arranged inside the straw placement tube (11), and two ends of the vacuum straw (12) are respectively located at the top of the straw placement tube (11) and outside the mounting frame (104); Two groups of drive units (4) are arranged at the rear end of the side plate (302), and the pressing member (6) is arranged below each of the two groups of drive units (4); The driving unit (4) comprises a driving motor (401) and a cam (402) arranged at the front end of an output shaft of the driving motor (401), wherein the two sets of driving motors (401) rotate in opposite directions; The pressing member (6) comprises a pressing arm (601), a pressing head (603) integrally arranged on the top of the pressing arm (601), a fixed shaft (604) being arranged on the inner side of the pressing head (603), a roller (602) being movably connected to the outer side of the middle part of the fixed shaft (604) at a position corresponding to the cam (402), a fixing column (7) being arranged on the pressing arm (601) and the side plate (302), and a return spring B (8) being arranged between the two fixing columns (7); A pulley (505) is provided on the inner side of the top of the sliding block (504) at a position corresponding to the lower pressing arm (601); The outer ring (101) is fixedly connected to the main support plate (301), and the inner ring (102) is rotatably connected to the outer ring (101), so as to form a bearing to reduce the friction resistance of the rotating shaft (103); A mounting frame (104) is integrally connected to the bottom of the inner ring (102), and the mounting frame (104) is fixedly connected to the connecting block (501); A guide rail (303) is fixedly mounted on the front outer wall of the side plate (302), a slider (605) is slidably connected to the outer side of the guide rail (303), and the slider (605) is fixedly mounted inside the lower pressure arm (601).

2. The semiconductor die bonder with a single head and four swing arms according to claim 1, characterized in that: A coupling (9) is provided between the output shaft of the rotating motor (2) and the rotating shaft (103).

3. The semiconductor die bonder single-head four-swing-arm die bonder according to claim 1, characterized in that: The lower pressing arm (601) is J-shaped.

Images