A high-voltage-resistant rectifier tube and its manufacturing process

Abstract

The present application relates to a high-voltage resistant rectifier tube and its manufacturing process, belonging to the field of semiconductor technology. It includes a housing, a solder pad and a chip disposed within the housing. Solder pads are provided on both sides of the chip. A lead is provided on the side of the solder pad facing away from the chip. The lead penetrates through the side wall of the housing and is bent along the side wall of the housing towards the bottom of the housing. The manufacturing process includes: positioning the chip and the solder pad, welding the chip, the solder pad and the lead, injection molding and encapsulation, removing the surplus material, bending and forming the lead, and tin plating the lead. By providing a receiving groove for the lead to bend and turn into the housing, the present application reduces the occupied space of the lead on the housing and increases the area of the remaining weldable parts on the circuit board, thus having the advantage of improving the space utilization rate of the rectifying components on the circuit board.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly relates to a high-voltage rectifier diode and a manufacturing process thereof. Background Art

[0002] At present, a rectifier diode, that is, a diode, generally conducts a relatively large current. By utilizing the unidirectional conductivity of the diode, an alternating current with alternating directions can be converted into a pulsating direct current in a single direction. And with the gradual increase in requirements for components, batches of high-voltage rectifier diodes have been gradually produced.

[0003] Related technologies such as a low-power rectifier component and a manufacturing method thereof adopting a ball mounting process disclosed in the patent publication number CN105914197A. The rectifier component includes a plastic-encapsulated epoxy resin. A lead frame A and a lead frame B located below the lead frame A are arranged inside the plastic-encapsulated epoxy resin. A chip is welded on the lower surface of the lead frame A with the positive electrode of the chip facing downwards. A conductive ball is arranged on the upper surface of the lead frame B corresponding to the position of the chip, and the conductive ball is in point contact with the positive electrode point of the chip to form a current path.

[0004] For the above related technologies, the inventor found that: when the rectifier component is welded to a circuit board with a relatively high integration degree, since the lead frame A and the lead frame B are located on both sides of the plastic-encapsulated epoxy resin, the rectifier component occupies a relatively large space on the circuit board, resulting in less area of the remaining weldable part on the circuit board, and thus the space utilization rate of the rectifier component on the circuit board is relatively low. Summary of the Invention

[0005] In order to improve the space utilization rate of the rectifier component on the circuit board, the purpose of the present application is to provide a high-voltage rectifier diode and a manufacturing process thereof.

[0006] On the one hand, a high-voltage rectifier diode provided by the present application adopts the following technical solution:

[0007] A high-voltage rectifier diode includes a housing, a solder pad and a chip arranged inside the housing. Solder pads are arranged on both sides of the chip. Leads are arranged on the side of the solder pad facing away from the chip. After passing through the side wall of the housing, the leads are bent along the side wall of the housing towards the bottom of the housing.

[0008] By adopting the above technical solution, when the rectifier component is welded to a circuit board with a relatively high integration degree, the solder pad and the chip are welded inside the housing, and the leads are bent on the housing, so that the leads are bent to the bottom wall of the housing. When the housing is welded to the circuit board, the leads can be hidden at the bottom of the housing for welding. The space occupied by the leads on the housing is reduced, and the area of the remaining weldable part on the circuit board is increased, thereby improving the space utilization rate of the rectifier component on the circuit board.

[0009] Optionally, a receiving groove for embedding the lead after bending is formed at the bottom of the housing.

[0010] By adopting the above technical solution, when the housing is welded to the circuit board, the lead is bent into the receiving groove of the housing to receive the lead at the bottom of the housing into the receiving groove, reducing the occupied space of the lead at the bottom of the housing, thereby further reducing the occupied volume of the lead on the housing.

[0011] On the other hand, the present application also provides a manufacturing process for a high-voltage rectifier tube, including a high-voltage rectifier tube, and comprising the following steps:

[0012] Step S1: The chip is adsorbed by a chuck and positioned on the pre-welding pad, and then the solder pads are adsorbed and placed on both sides of the chip.

[0013] Step S2: Then the solder pads are pre-welded in the pre-welding pad by passing through a soldering furnace, and after welding, the leads are welded to the solder pads on both sides of the chip.

[0014] Step S3: The welded chip, solder pads, and leads are subjected to semi-finished product injection molding and encapsulation until solidified and formed.

[0015] Step S4: The injection-molded semi-finished product is placed in a processing device to remove the surplus material on both sides adjacent to the leads on the plastic-sealed housing.

[0016] Step S5: Then, the processing device is used to form the leads of the injection-molded and encapsulated finished product by cutting and bending the leads, and the leads are bent into the receiving groove.

[0017] Step S6: Tin plating is performed on the leads of the formed finished product.

[0018] By adopting the above technical solution, when manufacturing a high-voltage rectifier tube, multiple chips are adsorbed by a chuck through vibration screening to adsorb a single chip and position it on the pre-welding pad for positioning and fixing the single chip, and then the solder pads are adsorbed by a chuck and placed on both sides of the chip. After fixing, the chip and solder pads on the pre-welding pad are pre-welded, and after welding, the leads are welded to the solder pads on both sides of the chip to complete the welding of the chip, solder pads, and leads. Then, the welded chip, solder pads, and leads are subjected to semi-finished product injection molding and encapsulation, so that the chip, solder pads, and leads are externally plastic-sealed into a housing until the housing is cooled and solidified and formed, and at this time, the leads extend linearly on both sides of the housing. The solidified and formed housing is placed in a processing device so that the leads are located in the processing device, and the surplus material on both sides of the housing is removed by the processing device to clean and flatten both sides of the housing leads. Then, the leads are bent by the processing device to bend the leads to the bottom of the housing so that the leads are bent into the receiving groove to reduce the occupied volume of the leads on the housing. Finally, tin plating is performed on the bent and formed leads to facilitate welding the housing to the circuit board, thereby realizing the manufacture of the rectifier tube.

[0019] Optionally, the processing device includes a frame, a processing table disposed below the frame, a processing groove is formed on the processing table for placing the housing and the lead wire, a manipulator and a lifting assembly for controlling the lifting of the manipulator are provided on the frame, the manipulator is used to extend into the receiving groove to clamp the housing and then slide down into the processing groove, and pressing rods are further provided on the frame on both sides of the manipulator, and the pressing rods are used to press the lead wire on the housing sliding upward to bend into the receiving groove.

[0020] By adopting the above technical solution, when performing unexpected removal and lead wire bending on the housing, the housing is inverted so that the manipulator extends into the receiving groove to clamp the housing to clamp the housing above the processing table. Then the lifting assembly drives the manipulator to slide down and place the clamped housing into the processing groove. The horizontal lead wire rotates to the vertical after being abutted by the processing table, and then the lifting assembly drives the manipulator to clamp the housing and slide upward, so that the housing drives the lead wire that has rotated to the vertical to slide upward and abut against the pressing rod. Furthermore, the pressing rod presses the upper end of the lead wire to rotate the upper end of the lead wire into the receiving groove, so that the lead wire extends beyond the upper end of the housing and rotates to the horizontal into the receiving groove, and the lead wire is rotated along the housing into the receiving groove, reducing the occupied volume outside the housing. Therefore, by providing the processing table, the manipulator and the pressing rod, the lead wire is bent once after being abutted when the housing moves downward, and is bent again after being abutted by the pressing rod when the housing moves upward, so that the lead wire is bent along the housing into the receiving groove, thereby facilitating the reduction of the volume of the lead wire on the housing.

[0021] Optionally, the lifting assembly includes a fixed cylinder disposed on the frame, a lifting column slidably disposed in the fixed cylinder, and a cylinder disposed on the frame for driving the lifting column to slide in the vertical direction. The manipulator is disposed at the lower end of the lifting column, and the lifting column slides above the processing table.

[0022] By adopting the above technical solution, when driving the manipulator to drive the housing to move up and down, the cylinder drives the lifting column to slide in the fixed cylinder and drives the manipulator to slide up and down together with the lifting column, so as to facilitate the manipulator to clamp the housing to move up and down, thereby facilitating the up and down sliding of the housing in the processing groove.

[0023] Optionally, the pressing rod includes a support rod connected to the frame and a pressing rod hinged to one end of the support rod away from the frame. The pressing rod is inclined towards the direction close to the manipulator and abuts against the lead wire.

[0024] By adopting the above technical solution, when the manipulator drives the housing to move upward, the lead on the housing is in a vertically upward state at this time. Then the manipulator moves upward in the processing groove, and the housing drives the lead to move upward with the manipulator, so that the upward moving lead is abutted by the abutting rod. So that the abutting rod presses the lead that has rotated to the vertical to the horizontal direction, causing the lead to bend into the receiving groove, so as to realize that after the manipulator drives the housing to move upward, the lead is pressed and bent by the abutting rod into the receiving groove, thereby facilitating the lead to be bent into the receiving groove again.

[0025] Optionally, a transmission rod is connected to one end of the abutting rod close to the support rod. The transmission rod rotates on both sides of the fixed cylinder. Two sides of the lifting column are fixedly connected with abutting blocks. A sliding groove for the abutting blocks to extend and slide is formed on the fixed cylinder. The abutting blocks are used to abut the transmission rod to drive the abutting rod to rotate towards the manipulator and bend the lead into the receiving groove.

[0026] By adopting the above technical solution, when bending the lead into the receiving groove, the lifting column drives the manipulator for clamping the housing to move upward, and also drives the abutting blocks to move upward at the same time. So that the abutting blocks abut and rotate the transmission rod, driving the transmission rod to rotate towards the direction close to the housing, so that the transmission rod abuts the lead to bend into the receiving groove, realizing the automatic rotation of the transmission rod and the abutting rod. Therefore, by arranging the transmission rod and the abutting blocks, the abutting blocks drive the transmission rod to rotate as they move upward with the lifting column, and then drive the abutting rod to rotate towards the direction close to the housing to bend the lead into the receiving groove, so as to facilitate the automatic rotation of the abutting rod driven by the upward movement of the lifting column.

[0027] Optionally, cutting blades are arranged on both sides of the processing groove. The cutting blades are located on both sides of the housing adjacent to the lead. The cutting blades are used to cut the surplus material formed by plastic sealing on the housing.

[0028] By adopting the above technical solution, when the lifting column drives the manipulator for clamping the housing to move downward, the manipulator clamps the housing and slides into the processing groove, so that the cutting blades slide past the two sides of the housing, so as to cut the surplus material on the two sides of the housing adjacent to the lead, thereby facilitating the cutting of the surplus material formed by plastic sealing the housing.

[0029] Optionally, a support block slides in the processing groove. A first spring is arranged on the bottom wall of the support block. The lower end of the first spring is arranged at the bottom of the processing groove. During the process of the abutting block abutting the lead to bend it into the receiving groove, the first spring always abuts the support block against the bottom of the housing.

[0030] By adopting the above technical solution, when the manipulator clamps the housing and slides it into the processing groove, the bottom of the housing presses against the support block, compressing the first spring. The cutting blade cuts the surplus material on the housing until the lead wire bends to a vertical state. Then the manipulator clamps the housing and moves it upward. During the upward movement, the first spring always abuts against the support block to support the bottom of the housing, so that after the abutting rod rotates, the vertical lead wire can be pushed to a bent state. Therefore, by setting the support block and the first spring, and using the elastic force of the first spring acting on the support block, during the upward movement of the housing, the support block always supports the bottom of the housing, reducing the detachment of the housing from the manipulator when the abutting rod pushes the lead wire to bend, thereby enhancing the stability of the housing on the manipulator when the lead wire bends.

[0031] Optionally, a ratchet rack is provided on the abutting block, the ratchet teeth on the ratchet rack are inclined obliquely upward, a locking tooth that is downwardly inserted into the ratchet rack is provided at one end of the transmission rod away from the abutting rod, the ratchet rack can slide past the locking tooth after sliding downward, and slide upward to drive the locking tooth and the transmission rod to rotate. A second spring for abutting and driving the transmission rod to rotate downward is provided on the frame.

[0032] By adopting the above technical solution, when the lifting column drives the manipulator for clamping the housing to move downward, the lifting column drives the abutting block to move downward, and then drives the ratchet rack to move downward. The ratchet rack slides past the locking tooth on the transmission rod, so that the abutting rod is in a state away from the manipulator. Until the lifting column drives the manipulator for clamping the housing to move upward, driving the ratchet rack on the abutting block to move upward, so that the locking tooth is inserted into the ratchet rack and drives the transmission rod to rotate upward to compress the second spring, and then drives the abutting rod to rotate toward the housing. With the upward movement of the lifting column, the abutting rod pushes the lead wire into the receiving groove, so that after the housing moves upward in the processing groove, the lead wire is pushed and turns into the receiving groove. Until after the manipulator puts down the housing, the lifting column drives the manipulator to move upward again, so that the ratchet rack abuts against the transmission rod to compress the second spring, so that while the abutting rod can continue to rotate, it is convenient for the ratchet rack to slide past the locking tooth, so that the ratchet rack moves upward to the initial position. Therefore, by setting the ratchet rack, the locking tooth, and the second spring, when the ratchet rack slides downward with the lifting column, it slides past the locking tooth, and when it slides upward, the locking tooth is inserted into the ratchet rack and moves upward with the ratchet rack. Under the elastic force of the second spring, when the ratchet rack slides upward past the locking tooth and resets, the transmission rod can still drive the locking tooth to be inserted into the ratchet rack, so that it is convenient for the ratchet rack to move upward to drive the transmission rod to rotate and then continue to move upward back to the initial position.

[0033] In summary, the present application includes at least one of the following beneficial technical effects:

[0034] 1. By providing a receiving groove for the lead wire to bend and turn into the housing, the occupied space of the lead wire on the housing is reduced, and the area of the remaining solderable parts on the circuit board is increased, thereby improving the space utilization rate of the rectifying components on the circuit board;

[0035] 2. By setting up the processing table, the manipulator and the pressing rod, after the housing moves downward, the lead wire is bent once by abutting, and after the housing moves upward, it is bent again after being abutted by the pressing rod, so that the lead wire is bent along the housing into the receiving groove, thereby facilitating the reduction of the volume of the lead wire on the housing;

[0036] 3. By setting up the transmission rod and the abutting block, the abutting block drives the transmission rod to rotate as it moves upward along the lifting column, and then drives the abutting rod to rotate towards the housing, so as to bend the lead wire into the receiving groove, thereby facilitating the automatic rotation of the abutting rod driven by the upward movement of the lifting column;

[0037] 4. By setting up the support block and the first spring, with the elastic force of the first spring acting on the support block, during the upward movement of the housing, the support block always supports the bottom of the housing, reducing the detachment of the housing from the manipulator when the abutting rod abuts and bends the lead wire, thereby enhancing the stability of the housing on the manipulator when the lead wire is bent;

[0038] 5. By setting up the ratchet rack, the locking tooth, and the second spring, when the ratchet rack slides upward past the locking tooth and resets, the transmission rod can still drive the locking tooth to engage into the ratchet rack, thereby facilitating the upward movement of the ratchet rack to drive the transmission rod to rotate and then continue to move upward back to the initial position. Description of the Drawings

[0039] Figure 1 It is a schematic cross-sectional view of a rectifier tube according to an embodiment of the present application.

[0040] Figure 2 It is a schematic overall structure view of a processing device according to an embodiment of the present application.

[0041] Figure 3 It is a schematic cross-sectional view for showing a processing groove according to an embodiment of the present application.

[0042] Figure 4 It is a process flow chart of manufacturing a rectifier tube according to an embodiment of the present application.

[0043] Description of the reference numerals: 1, housing; 11, chip; 12, solder pad; 13, lead wire; 14, receiving groove; 2, frame; 21, support rod; 22, abutting rod; 23, transmission rod; 231, second spring; 232, locking tooth; 3, processing table; 31, processing groove; 32, cutting blade; 33, support block; 34, first spring; 4, lifting assembly; 41, fixed cylinder; 411, sliding groove; 42, lifting column; 43, cylinder; 44, abutting block; 45, ratchet rack; 5, manipulator. Detailed Description of the Embodiment

[0044] The following further elaborates on the present application in conjunction with the attached Figures 1-4 for a more detailed description.

[0045] An embodiment of the present application discloses a high-voltage resistant rectifier tube.

[0046] Reference Figure 1

[0047] Figure 1 Reference Figure 1

[0048] The embodiment of the present application also discloses a processing device.

[0049] Reference Figure 1 and Figure 2

[0050] Figure 2 Reference

[0051] Figure 1 Figure 2 Reference and

[0052] Figure 3

[0052] Reference Figure 3, a support block 33 slides vertically in the processing groove 31. A first spring 34 is fixedly connected to the bottom wall of the support block 33. One end of the first spring 34 away from the support block 33 is fixedly connected to the bottom of the processing groove 31. The elastic force of the first spring 34 acts on the support block 33 to support the housing 1 and eject the housing 1 from the processing groove 31.

[0053] Refer to Figure 3 , pressing rods are fixedly connected to the frame 2 on both sides of the fixed cylinder 41. The pressing rods include a support rod 21 fixedly connected to the frame 2, a pressing rod 22 hinged to the end of the support rod 21 away from the frame 2, and a transmission rod 23 fixedly connected to the end of the pressing rod 22 close to the support rod 21.

[0054] Refer to Figure 1 and Figure 3 , the pressing rod 22 is inclined and bent towards the manipulator 5 so that after the transmission rod 23 rotates upward, it drives the pressing rod 22 to rotate towards the manipulator 5, facilitating the pressing rod 22 to push the lead 13 to rotate horizontally and then turn into the receiving groove 14. A second spring 231 is fixedly connected to the transmission rod 23. One end of the second spring 231 away from the transmission rod 23 is fixedly connected to the frame 2. The elastic force of the second spring 231 acts on the transmission rod 23, driving the transmission rod 23 to rotate downward and causing the pressing rod 22 to rotate away from the manipulator 5.

[0055] Refer to Figure 1 and Figure 3 , two abutting blocks 44 are fixedly connected to both sides of the lifting column 42 facing the transmission rod 23. A sliding groove 411 for the abutting blocks 44 to extend and slide is formed on the fixed cylinder 41. One end of the abutting block 44 extending out of the fixed cylinder 41 is fixedly connected with a ratchet rack 45. The teeth of the ratchet rack 45 extend obliquely upward. A locking tooth 232 is integrally formed at the end of the transmission rod 23. The locking tooth 232 extends obliquely downward into the ratchet rack 45. So that the ratchet rack 45 can slide past the locking tooth 232 when sliding downward without driving the transmission rod 23. When the ratchet rack 45 moves upward, it meshes with the locking tooth 232, enabling the upward moving ratchet rack 45 to drive the transmission rod 23 to rotate upward. Further driving the pressing rod 22 to rotate towards the manipulator 5 to push the lead 13 that has rotated vertically to the horizontal and bend the lead 13 into the receiving groove 14. During the process of the pressing rod 22 pushing the lead 13 to bend into the receiving groove 14, the first spring 34 always acts on the support block 33 to support the housing 1.

[0056] The implementation principle of the processing device in the embodiment of the present application is as follows: When processing the encapsulated rectifier tube, the manipulator 5 is used to extend into the receiving groove 14 to clamp the housing 1, and then the air cylinder 43 is started to drive the lifting column 42 to slide down, so as to drive the housing 1 to slide into the processing groove 31, and then the surplus material is cut off, and the lead 13 is bent to be vertical. At the same time, the ratchet rack 45 slides over the locking teeth 232 on the transmission rod 23, and the housing 1 slides into the processing groove 31 to drive the support block 33 to slide down, so that the first spring 34 is compressed. Until the air cylinder 43 drives the lifting column 42 and the manipulator 5 to move upward, the housing 1 has been moved upward in the processing groove 31, and the elastic force of the first spring 34 acts on the support block 33 to always support the housing 1. After the ratchet rack 45 moves upward and meshes with the locking teeth 232, it drives the abutting rod 22 to rotate towards the manipulator 5, so that when the housing 1 moves upward in the processing groove 31, the abutting rod 22 abuts against the lead 13 and bends it into the receiving groove 14. Until after the housing 1 slides out of the processing groove 31, the abutting rod 22 abuts against the lead 13 and the bending is completed. Then the manipulator 5 releases the processed housing 1, and the air cylinder 43 drives the lifting column 42 to continue to slide upward, so that the ratchet rack 45 drives the locking teeth 232 and the transmission rod 23 to continue to rotate upward, so that the abutting rod 22 can continue to rotate towards the manipulator 5. Until the ratchet rack 45 slides over the transmission rod 23 and slides back to the initial position, so as to facilitate the processing of the next rectifier tube.

[0057] The embodiment of the present application also discloses a manufacturing process for a high-voltage-resistant rectifier tube, which uses the processing device to cut surplus material and bend the lead 13 of the high-voltage-resistant rectifier tube. Refer to Figure 3 and Figure 4 , and includes the following steps:

[0058] The chip 11 is adsorbed by a suction cup and then placed on the pre-welding pad, so that the chip 11 is vertically positioned on the pre-welding pad. Similarly, the solder pad 12 is adsorbed by a suction cup and then placed on both sides of the chip 11, and the solder pad 12 is also closely attached to both sides of the chip 11. After being positioned on the pre-welding pad, the solder pad 12 is connected to a welding furnace in the pre-welding pad for pre-welding to weld the solder pad 12 to the chip 11. After welding, the lead 13 is welded to the solder pads 12 on both sides of the chip 11 by using the welding furnace, and then the welded chip 11, solder pad 12, and lead 13 are taken out of the pre-welding pad and transferred to an injection molding tooling to perform semi-finished product injection molding encapsulation on the welded chip 11, solder pad 12, and lead 13 until it is cured and formed, so as to form a housing 1 that wraps the chip 11 and the solder pad 12, and the lead 13 extends horizontally from both sides of the housing 1, and a receiving groove 14 on the housing 1 is left.

[0059] Then, the processed device is used to clamp the formed housing 1 and the lead 13 for processing, with the receiving groove 14 on the housing 1 facing upward, so as to cut the surplus material of the housing 1. And the lead 13 is bent twice on the housing 1, so that the lead 13 is bent close to the side wall of the housing 1 to a vertical state. Then it is bent to a horizontal state and embedded into the receiving groove 14, so that the lead 13 of the injection-molded and encapsulated finished product is cut and bent into shape. Finally, the bent lead 13 is tinned. The surplus material removal of the housing 1 formed by injection molding and the bending of the lead 13 are carried out synchronously, reflecting the integration of the rectifier tube processing, thereby improving the processing efficiency of the rectifier tube.

[0060] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A manufacturing process of a high-voltage resistant rectifier tube, characterized in that: It includes the following steps: Step S1: After being adsorbed by a chuck, the chip (11) is positioned on the pre-pad, and then the solder pads (12) are adsorbed and placed on both sides of the chip (11). Step S2: Then, the solder pads (12) are pre-soldered in the pre-pad by passing through a soldering furnace. After soldering, the leads (13) are soldered to the solder pads (12) on both sides of the chip (11). Step S3: The soldered chip (11), solder pads (12), and leads (13) are semi-finished injection molded and encapsulated until cured and formed. Step S4: The injection molded semi-finished product is placed in a processing device to remove the surplus material on both sides of the plastic housing (1) adjacent to the leads (13). Step S5: Then, the processing device is used to cut and bend the feet of the leads (13) of the injection molded and encapsulated finished product, and bend the leads (13) into the receiving grooves (14). Step S6: The semi-finished product leads (13) after forming are tinned. The processing device includes a frame (2) and a processing table (3) arranged below the frame (2). A processing groove (31) for placing the housing (1) and the leads (13) is provided on the processing table (3). A manipulator (5) and a lifting assembly (4) for controlling the lifting of the manipulator (5) are provided on the frame (2). The manipulator (5) is used to extend into the receiving groove (14) to clamp the housing (1) and then slide down into the processing groove (31). Pressure rods are also provided on both sides of the manipulator (5) on the frame (2). The pressure rods are used to press the leads (13) on the housing (1) sliding upward to be bent into the receiving groove (14).

2. The manufacturing process of a high-voltage resistant rectifier tube according to claim 1, characterized in that: The lifting assembly (4) includes a fixed cylinder (41) arranged on the frame (2), a lifting column (42) sliding in the fixed cylinder (41), and a cylinder (43) arranged on the frame (2) to drive the lifting column (42) to slide in the vertical direction. The manipulator (5) is arranged at the lower end of the lifting column (42), and the lifting column (42) slides above the processing table (3).

3. The manufacturing process of a high-voltage resistant rectifier tube according to claim 2, characterized in that: The pressure rod includes a support rod (21) connected to the frame (2) and a pressure rod (22) hinged to one end of the support rod (21) away from the frame (2). The pressure rod (22) is inclined towards the direction close to the manipulator (5) and abuts against the lead (13).

4. The manufacturing process of a high-voltage resistant rectifier tube according to claim 3, characterized in that: A transmission rod (23) is connected to one end of the pressure rod (22) close to the support rod (21). The transmission rod (23) rotates on both sides of the fixed cylinder (41). Pressure blocks (44) are fixedly connected to both sides of the lifting column (42). A sliding groove (411) for the pressure blocks (44) to extend and slide is provided on the fixed cylinder (41). The pressure blocks (44) are used to push the transmission rod (23) to drive the pressure rod (22) to rotate towards the manipulator (5) and bend the lead (13) into the receiving groove (14).

5. The manufacturing process of a high-voltage resistant rectifier tube according to claim 1, wherein: Cutting blades (32) are provided on both sides of the processing groove (31). The cutting blades (32) are located on both sides of the housing (1) adjacent to the leads (13). The cutting blades (32) are used to cut the surplus material formed by plastic encapsulation on the housing (1).

6. The manufacturing process of a high-voltage resistant rectifier tube according to claim 4, characterized in that: A support block (33) is slidably disposed in the processing groove (31), a spring (34) is disposed on the bottom wall of the support block (33), and a lower end of the spring (34) is disposed at the bottom of the processing groove (31). When the abutting block (44) abuts the lead wire (13) to bend to the receiving groove (14), the spring (34) always abuts the support block (33) to abut the bottom of the housing (1).

7. The manufacturing process of a high-voltage resistant rectifier tube according to claim 4, characterized in that: The abutting block (44) is provided with a ratchet bar (45), the ratchet teeth on the ratchet bar (45) are inclined upward, and one end of the transmission rod (23) away from the abutting rod (22) is provided with a locking tooth (232) which is downwardly engaged in the ratchet bar (45), and the ratchet bar (45) can slide over the locking tooth (232) after sliding downward, and slide upward to drive the locking tooth (232) and the transmission rod (23) to rotate, and the frame (2) is provided with a second spring (231) for abutting the transmission rod (23) to rotate downward.

8. A high-voltage resistant rectifier tube, which is made by the manufacturing process of the high-voltage resistant rectifier tube as described in any one of claims 1-7, and is characterized in that: The invention comprises a shell (1), a welding piece (12) and a chip (11) arranged in the shell (1), wherein welding pieces (12) are arranged on both sides of the chip (11), and a lead (13) is arranged on the side of the welding piece (12) facing away from the chip (11), and the lead (13) passes through the side wall of the shell (1) and is bent along the side wall of the shell (1) toward the bottom of the shell (1).

9. The high-voltage resistant rectifier tube according to claim 8, wherein: The bottom of the housing (1) is provided with a receiving groove (14) for the lead wire (13) to be bent and embedded therein.

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