Chip heat dissipation packaging structure and electronic device

Abstract

The application provides a chip heat dissipation packaging structure and electronic equipment, and relates to the technical field of heat dissipation, so as to solve the problem that the heat transfer path is long, the heat transfer thermal resistance is large, the chip heat dissipation efficiency is reduced, and the working performance of the chip is affected. The chip heat dissipation packaging structure comprises a first bearing part and a packaging shell having a containing space after assembly. The first surface of the chip is arranged on the first bearing part, and the flexible heat dissipation component is arranged on the second surface of the chip. When the chip heat dissipation packaging structure is in an assembled state, the flexible heat dissipation component abuts against the inner surface of the packaging shell. The vertical height of the containing space is defined as the containing height, the first total vertical height corresponding to the part of the flexible heat dissipation component on the chip and the chip is equal to the containing height. When the chip heat dissipation packaging structure is in a split state, the second total vertical height corresponding to the part of the flexible heat dissipation component on the chip and the chip is greater than the containing height. The application also provides an electronic equipment comprising the chip heat dissipation packaging structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a chip heat dissipation packaging structure and an electronic device. BACKGROUND

[0002] With the development of semiconductor technology, the performance of semiconductor chips is continuously improved. At present, the power applied to the chip is continuously increasing, at which time the power consumption and heat generation of the chip are also continuously increasing. Based on this, the chip needs to be cooled to avoid the situation that the chip fails due to too high temperature.

[0003] In the prior art, the chip is usually cooled by immersion liquid cooling or traditional external circulation liquid cooling. Since the immersion liquid cooling and the traditional external circulation liquid cooling both use thermal interface materials and heat sinks, the heat transfer path is generally chip-thermal interface material-packing tube shell-heat sink.

[0004] However, the heat transfer path in the heat dissipation mode provided by the prior art is relatively long. At this time, it will cause a large heat transfer thermal resistance, reduce the heat dissipation efficiency of the chip, and further affect the working performance of the chip. SUMMARY

[0005] The purpose of the present application is to provide a chip heat dissipation packaging structure and an electronic device for reducing the heat transfer thermal resistance and improving the heat dissipation efficiency of the chip in the case of shortening the heat transfer path, so as to ensure the working performance of the chip.

[0006] In order to achieve the above purpose, the present application provides the following technical scheme:

[0007] In a first aspect, the present application provides a chip heat dissipation packaging structure, which comprises a packaging shell, a first bearing member, a chip and a flexible heat dissipation assembly. The packaging shell has an inlet and an outlet, the inlet is used for introducing cooling medium, and the outlet is used for discharging cooling medium. The first bearing member has a containing space after being assembled with the packaging shell. The chip has opposite first and second surfaces, and the first surface is arranged on the bearing surface of the first bearing member. The flexible heat dissipation assembly is arranged on at least the second surface of the chip. When the chip heat dissipation packaging structure is in an assembled state, the flexible heat dissipation assembly abuts against the inner surface of the packaging shell, and the inlet and the outlet are communicated through the flexible heat dissipation assembly. The vertical height of the containing space is defined as the containing height, and the first total vertical height corresponding to the part of the flexible heat dissipation assembly on the chip is equal to the containing height. When the chip heat dissipation packaging structure is in a split state, the second total vertical height corresponding to the part of the flexible heat dissipation assembly on the chip is greater than the containing height.

[0008] Compared with the prior art, in the chip heat dissipation packaging structure provided by the application, the flexible heat dissipation assembly is arranged on at least the second surface of the chip, that is, the flexible heat dissipation assembly directly contacts the chip. In addition, when the chip heat dissipation packaging structure is in the assembled state, the flexible heat dissipation assembly abuts against the inner surface of the packaging shell, and the inlet and the outlet are communicated through the flexible heat dissipation assembly. Therefore, the cooling medium can enter the flexible heat dissipation assembly from the inlet and directly or indirectly contact the chip, and then be discharged from the outlet, so as to form a flow path. When the chip generates heat, the cooling medium in the flexible heat dissipation assembly can absorb the heat, and the cooling medium with a high temperature can be discharged through the outlet arranged on the packaging shell. Based on this, not only can the temperature of the surface of the chip be reduced to achieve heat dissipation of the chip, but also the heat transmission path is shortened to reduce the heat transfer resistance, thereby improving the heat dissipation efficiency of the chip and ensuring the working performance of the chip.

[0009] In addition, when the chip heat dissipation packaging structure is in the assembled state, the total vertical height of the part of the flexible heat dissipation assembly on the chip corresponding to the chip is equal to the accommodation height. When the chip heat dissipation packaging structure is in the disassembled state, the total vertical height of the part of the flexible heat dissipation assembly on the chip corresponding to the chip is greater than the accommodation height. As can be seen from the above, when the chip heat dissipation packaging structure is in the assembled state, the flexible heat dissipation assembly and the chip can be sealed in the accommodation space. In addition, when the chip heat dissipation packaging structure is in the assembled state, the flexible heat dissipation assembly deforms. At this time, not only can the cooling medium introduced through the inlet flow only in the accommodation space, but also the cooling medium can be prevented from leaking to the position outside the chip heat dissipation packaging structure, thereby ensuring the safety of the devices and structures outside the chip heat dissipation packaging structure and improving the reliability of the chip heat dissipation packaging structure. At the same time, since the flexible heat dissipation assembly can deform and the flexible heat dissipation assembly and the chip are in soft contact, the situation that the stress applied by the flexible heat dissipation assembly to the chip is too large to cause damage to the chip during the assembly process can be avoided, thereby ensuring the safety of the chip and the yield of the chip heat dissipation packaging structure.

[0010] Further, since the chip heat dissipation packaging structure only includes the packaging shell, the first bearing member, the chip and the flexible heat dissipation assembly, the chip heat dissipation packaging structure not only has a simple structure and is easy to manufacture, but also is convenient for workers to quickly assemble and disassemble, thereby saving working time. Further, when a component in the chip heat dissipation packaging structure is damaged, the chip heat dissipation packaging structure can be safely and quickly disassembled to replace and repair the damaged component. At this time, not only can the working time be saved, but also the overall scrapping of the chip heat dissipation packaging structure can be avoided.

[0011] In an implementation, the flexible heat dissipation assembly is further arranged in the circumferential direction of the chip, and the flexible heat dissipation assembly has opposite first and second surfaces. In the assembled state of the chip heat dissipation package structure, the first surface of the flexible heat dissipation assembly abuts against the inner surface of the package shell, and the second surface of the flexible heat dissipation assembly abuts against the bearing surface of the second bearing member and the second surface of the chip, respectively.

[0012] In the above technical solution, the flexible heat dissipation assembly abuts against the inner surface of the package shell and the bearing surface of the first bearing member, respectively, and the flexible heat dissipation assembly "covers" the chip, and the chip is used in the space formed by the flexible heat dissipation assembly and the first bearing member. At this time, the cooling working medium can only flow in the closed flow channel formed by the flexible heat dissipation assembly and the chip, or the cooling working medium can only flow in the space formed by the flexible heat dissipation assembly and the first bearing member. Based on this, the range of the cooling working medium flow can be controlled to avoid the cooling working medium from contacting other structures (such as electrical interfaces) on the first bearing member, thereby further ensuring the safety of other structures on the first bearing member and the reliability and safety of the chip heat dissipation package structure.

[0013] In an implementation, the flexible heat dissipation assembly includes a second bearing member and a flow guiding unit. The second bearing member has a hollow region. The flow guiding unit is connected to the second bearing member and located in the hollow region, and in the assembled state of the chip heat dissipation package structure, the flow guiding unit has a flow passage with the second surface of the chip and abuts against the inner surface of the package shell. The flow guiding unit includes a plurality of first flow guiding members and second flow guiding members alternately arranged, and each first flow guiding member and each second flow guiding member have an open end and a closed end. The open end of the first flow guiding member is in communication with the inlet, and the open end of the second flow guiding member is in communication with the outlet.

[0014] In the above technical solution, the cooling working medium first enters the flow channel of the first flow guiding member through the inlet, and it should be understood that the initial temperature of the cooling working medium is relatively low at this time, for example, it can be less than or equal to the initial temperature of the chip. Then, the cooling working medium entering the flow channel of the first flow guiding member directly or indirectly contacts the second surface of the chip. At this time, the heat generated by the chip is continuously conducted to the cooling working medium to reduce the temperature of the chip itself. Moreover, the flow guiding unit has a flow passage with the second surface of the chip. At this time, the cooling working medium absorbing heat can flow into the flow channel of the second flow guiding member. Moreover, the open end of the second flow guiding member is in communication with the outlet, and based on this, the cooling working medium absorbing heat of the chip can flow to the outlet through the open end of the second flow guiding member, so as to discharge the cooling working medium with a high temperature from the containing space, and further conduct the heat generated by the chip to the outside to achieve heat dissipation of the chip.

[0015] In an implementation, when the second surface of the chip is a plane, the flow guiding unit is arranged apart from the second surface of the chip to form the flow passage.

[0016] In an implementation, the flow passage includes a plurality of grooves opened on the second surface of the chip, and the corresponding flow guiding directions of the grooves are not completely same or different from the corresponding flow guiding directions of the flow guiding unit.

[0017] In the case of adopting the above technical solution, since the flow passage includes a plurality of grooves opened on the second surface of the chip, the contact area of the cooling working medium with the second surface of the chip can be increased, that is, the effective heat dissipation area can be increased, and the heat dissipation efficiency of the chip can be improved. Since the corresponding flow guiding directions of the grooves are not completely same or different from the corresponding flow guiding directions of the flow guiding unit, the cooling working medium entering the grooves through the flow channel of the first flow guiding unit diffuses to both sides along the opening direction of the grooves while absorbing the heat of the chip. Then, the cooling working medium flows out of the flow channel of the second flow guiding unit to take away the heat. Since the flow channel of the second flow guiding unit is located on one side of the flow channel of the first flow guiding unit, the cooling working medium only needs to flow through a part of the distance (for example, the width distance of the first flow guiding unit) along the opening direction of the grooves to flow out of the flow channel of the second flow guiding unit. Compared with the prior art, which needs to flow from the starting end to the ending end of the grooves along the length direction of the grooves to conduct the heat, the utilization rate of the cooling working medium is improved, the flow time of the cooling working medium that has absorbed the heat in the flexible heat dissipation assembly is shortened, and the probability of weakening the heat absorption capacity of the cooling working medium due to the temperature rise is reduced. Based on this, the temperature difference of the chip can be ensured to be small, and most or all of the heat generated by the chip can be conducted to reduce the temperature of the chip. In addition, the selectivity of the opening shape of the grooves is increased, which can adapt to different application scenarios and expand the application range.

[0018] In combination with the above two different cases of the second surface of the chip, it can be seen that the chip heat dissipation packaging structure provided by the application can be applied to chips of different shapes, and the application range is expanded.

[0019] In an implementation, the grooves are straight line grooves, zigzag grooves or arc line grooves.

[0020] In an implementation, the chip includes a plurality of support columns, and the plurality of support columns are arranged in an array on the second surface of the chip.

[0021] In an implementation, the flexible heat dissipation assembly is an insulating flexible heat dissipation assembly.

[0022] In the actual use process, the first bearing piece has a plurality of electrical interfaces. When the chip heat dissipation packaging structure is in an assembled state, a part of the electrical interfaces abut against the insulating flexible heat dissipation assembly. At this time, when the electrical interfaces are damaged and leak electricity, the insulating flexible heat dissipation assembly can play a blocking role, avoiding electrical connection between the electrical interfaces and the packaging shell made of metal material, or avoiding electrical connection between the electrical interfaces and the cooling working medium, thereby avoiding the occurrence of the leakage or short circuit, and further improving the safety and reliability of the chip heat dissipation packaging structure. In addition, when the electrical interfaces are located outside the space formed by the insulating flexible heat dissipation assembly and the first bearing piece, if the cooling working medium only flows in the space formed by the flexible heat dissipation assembly and the first bearing piece. At this time, the electrical interfaces and the cooling working medium can be isolated, avoiding electrical connection between the electrical interfaces and the cooling working medium, thereby avoiding the occurrence of the leakage or short circuit, and further improving the safety and reliability of the chip heat dissipation packaging structure.

[0023] In an implementation manner, the material of the insulating flexible heat dissipation assembly is one or more of polydimethylsiloxane, glass fiber and elastomer.

[0024] In the above technical solution, the material is easy to obtain, which can reduce the difficulty of obtaining the material of the insulating flexible heat dissipation assembly. In addition, the selectivity of the material of the insulating flexible heat dissipation assembly is increased, so that the insulating flexible heat dissipation assembly can adapt to different application scenarios, thereby expanding the application range of the chip heat dissipation packaging structure.

[0025] In a second aspect, the application further provides an electronic device. The electronic device comprises the chip heat dissipation packaging structure described in the above technical solution.

[0026] Compared with the prior art, the electronic device provided by the application has the same beneficial effects as the chip heat dissipation packaging structure of the first aspect, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0027] The accompanying drawings, which are included to provide a further understanding of the application, form a part of the application and, along with the specification, serve to explain the application. The illustrative embodiments of the application and their descriptions serve to explain the application without unduly limiting it. In the drawings:

[0028] Figure 1 It is an exploded schematic view of the chip heat dissipation packaging structure in the embodiment of the application;

[0029] Figure 2 It is a first assembly schematic view of the chip heat dissipation packaging structure in the embodiment of the application;

[0030] Figure 3 It is a second assembly schematic view of the chip heat dissipation packaging structure in the embodiment of the application;

[0031] Figure 4 is a top view of the flexible heat dissipation assembly in the embodiment of the present application;

[0032] Figure 5 is a bottom view of the flexible heat dissipation assembly in the embodiment of the present application;

[0033] Figure 6 is a schematic diagram of the flow of the cooling medium in the chip heat dissipation packaging structure.

[0034] Reference signs:

[0035] 1 - packaging shell, 10 - inlet, 11 - outlet;

[0036] 2 - first carrier, 3 - chip, 30 - groove;

[0037] 4 - flexible heat dissipation assembly, 40 - second carrier, 400 - entry slot, 401 - collection slot;

[0038] 41 - drainage unit, 410 - first drainage member, 411 - second drainage member;

[0039] H1 - containing height, H2 - first total vertical height;

[0040] 5 - electrical interface, 6 - containing space. DETAILED DESCRIPTION

[0041] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects more clearly, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited. The meaning of "several" is one or more, unless otherwise explicitly and specifically limited.

[0043] In the description of the present application, it is to be understood by those skilled in the art that the terms "upper", "lower", "front", "back", "left", "right" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0044] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0045] To solve the above technical problems, in a first aspect, the embodiments of the present application provide a chip heat dissipation packaging structure. Referring to Figures 1 to 3 , the chip heat dissipation packaging structure can include: a packaging shell 1, a first bearing member 2, a chip 3 and a flexible heat dissipation assembly 4. The packaging shell 1 has an inlet 10 for introducing cooling working medium and an outlet 11 for discharging cooling working medium. The first bearing member 2 has a containing space 6 after being assembled with the packaging shell 1. The chip 3 has opposite first and second surfaces, and the first surface is arranged on the bearing surface of the first bearing member 2. The flexible heat dissipation assembly 4 is arranged at least on the second surface of the chip 3. When the chip heat dissipation packaging structure is in an assembled state, the flexible heat dissipation assembly 4 abuts against the inner surface of the packaging shell 1, and the inlet 10 and the outlet 11 are communicated through the flexible heat dissipation assembly 4. The vertical height of the containing space 6 is defined as a containing height H1, and the first total vertical height H2 of the part of the flexible heat dissipation assembly 4 located on the chip 3 corresponding to the chip 3 is equal to the containing height H1. When the chip heat dissipation packaging structure is in a split state, the second total vertical height H2 of the part of the flexible heat dissipation assembly 4 located on the chip 3 corresponding to the chip 3 is greater than the containing height H1. Figures 1 to 3

[0046] Referring to Figures 1 to 3 , the material and the like of the above-mentioned packaging shell 1 and the first bearing member 2 can be selected according to actual conditions, which are not specifically limited here. For example, the material of the above-mentioned packaging shell 1 can be metal, acrylic, resin, nylon, etc., and the first bearing member 2 can be a PCB (Printed Circuit Board). In actual use, a plurality of electrical interfaces 5 are arranged on the above-mentioned first bearing member 2 for connection with other electronic components. ​

[0047] Referring to Figure 1 The package shell 1 has an inlet 10 and an outlet 11. Exemplarily, two through holes are formed on the package shell 1 along the thickness direction of the package shell 1, one of which is the inlet 10 and the other is the outlet 11.

[0048] The first surface of the chip can be arranged on the bearing surface of the first bearing member in various ways, such as welding. The flexible heat dissipation assembly can be arranged on the second surface of the chip in various ways, such as bonding.

[0049] Referring to Figures 1 to 3 In the chip heat dissipation package structure provided by the embodiment of the present application, the flexible heat dissipation assembly 4 is arranged on the second surface of the chip 3, i.e. the flexible heat dissipation assembly 4 directly contacts the chip 3. Moreover, when the chip heat dissipation package structure is in an assembled state, the flexible heat dissipation assembly 4 abuts against the inner surface of the package shell 1, and the inlet 10 and the outlet 11 are communicated through the flexible heat dissipation assembly 4. Therefore, the cooling medium can enter the flexible heat dissipation assembly 4 from the inlet 10 and directly or indirectly contact the chip 3, and then be discharged from the outlet 11, thereby forming a flow path. When the chip 3 generates heat, the cooling medium in the flexible heat dissipation assembly 4 can absorb the heat, and the cooling medium with a high temperature can be discharged through the outlet 11 arranged on the package shell 1. That is, the cooling medium exchanges heat with the chip 3 in a forced convection manner. Based on this, not only can the temperature of the surface of the chip 3 be reduced to achieve heat dissipation of the chip 3, but also the heat transfer path is shortened to reduce the heat transfer thermal resistance (i.e. the chip 3-package shell 1 and chip 3-environment thermal resistance is reduced), thereby improving the heat dissipation efficiency of the chip 3 and ensuring the working performance of the chip 3.

[0050] Referring to Figures 1 to 3In addition, when the chip heat dissipation packaging structure is in the assembled state, the total vertical height of the part of the flexible heat dissipation assembly 4 on the chip 3 corresponding to the chip 3 is equal to the accommodation height H1. When the chip heat dissipation packaging structure is in the disassembled state, the second total vertical height of the part of the flexible heat dissipation assembly 4 on the chip 3 corresponding to the chip 3 is greater than the accommodation height H1. As can be seen from the above, when the chip heat dissipation packaging structure is in the assembled state, the flexible heat dissipation assembly 4 and the chip 3 can be sealed in the accommodation space 6. Moreover, when the chip heat dissipation packaging structure is in the assembled state, the flexible heat dissipation assembly 4 deforms. At this time, not only can the cooling working medium introduced through the inlet 10 only circulate in the accommodation space 6, but also the cooling working medium can be prevented from leaking to a position outside the chip heat dissipation packaging structure, thereby ensuring the safety of devices and structures outside the chip heat dissipation packaging structure and improving the reliability of the chip heat dissipation packaging structure. At the same time, since the flexible heat dissipation assembly 4 can deform and the flexible heat dissipation assembly 4 and the chip 3 are in soft contact, the situation that the chip 3 is damaged due to excessive stress applied by the flexible heat dissipation assembly 4 to the chip 3 during assembly can be avoided, thereby ensuring the safety of the chip 3 and the yield of the chip heat dissipation packaging structure.

[0051] Referring to Figure 1 Further, since the above chip heat dissipation packaging structure only includes the packaging shell 1, the first bearing member 2, the chip 3 and the flexible heat dissipation assembly 4, the chip heat dissipation packaging structure not only has a simple structure and is easy to manufacture, but also is convenient for workers to quickly assemble and disassemble, thereby saving working time. Further, when a component in the chip heat dissipation packaging structure is damaged, the chip heat dissipation packaging structure can be safely and quickly disassembled to replace and repair the damaged component. At this time, not only can working time be saved, but also the overall scrapping of the chip heat dissipation packaging structure can be avoided.

[0052] As a possible implementation manner, referring to Figures 1 to 3 The flexible heat dissipation assembly 4 is further arranged in the circumferential direction of the chip 3, and the flexible heat dissipation assembly 4 has opposite first and second faces. When the chip heat dissipation packaging structure is in the assembled state, the first face of the flexible heat dissipation assembly 4 abuts against the inner surface of the packaging shell 1, and the second face of the flexible heat dissipation assembly 4 abuts against the second face of the chip 3 and the bearing face of the first bearing member 2, respectively.

[0053] Referring to Figures 1 to 3The flexible heat dissipation assembly 4 is in abutment with the inner surface of the packaging shell 1 and the bearing surface of the first bearing member 2, respectively, and the flexible heat dissipation assembly 4 "covers" the chip 3, and the chip 3 is located in the space formed by the flexible heat dissipation assembly 4 and the first bearing member 2. At this time, the cooling working medium can only flow in the closed flow channel formed by the flexible heat dissipation assembly 4 and the chip 3, or the cooling working medium can only flow in the space formed by the flexible heat dissipation assembly 4 and the first bearing member 2. Based on this, the range of the cooling working medium flow can be controlled to avoid the cooling working medium from contacting other structures (such as the electrical interface 5 and the like) on the first bearing member 2, further ensuring the safety of other structures on the first bearing member 2 and the reliability and safety of the chip heat dissipation packaging structure.

[0054] The following will be described by taking two possible position connection relationships as examples. It should be understood that the following description is only for understanding and is not used for specific definition.

[0055] Example one, see Figure 2 The first surface (the outer top surface) and the left and right outer side surfaces of the flexible heat dissipation assembly are in abutment with the inner surface of the packaging shell 1. It should be understood that, due to the deformation of the flexible heat dissipation assembly in the assembly process, the second surface of the flexible heat dissipation assembly can be divided into a bottom surface, an inner top surface and left and right inner side surfaces. Based on this, the flexible heat dissipation assembly is also arranged in the circumferential direction of the chip 3, and the second surface of the flexible heat dissipation assembly is in abutment with the second surface of the chip 3 and the bearing surface of the first bearing member 2, respectively. It can be understood that the bottom surface of the flexible heat dissipation assembly is in abutment with the bearing surface of the first bearing member 2, the inner top surface of the flexible heat dissipation assembly is in abutment with the second surface of the chip 3, and the left and right inner side surfaces of the flexible heat dissipation assembly are in abutment with the side surface of the chip 3.

[0056] Example two, the first surface (the outer top surface) and the left and right outer side surfaces of the flexible heat dissipation assembly are in abutment with the inner surface of the packaging shell. It should be understood that, due to the deformation of the flexible heat dissipation assembly in the assembly process, the second surface of the flexible heat dissipation assembly can be divided into a bottom surface, an inner top surface and left and right inner side surfaces. Based on this, the flexible heat dissipation assembly is also arranged in the circumferential direction of the chip, and the second surface of the flexible heat dissipation assembly is in abutment with the second surface of the chip and the bearing surface of the first bearing member, respectively. It can be understood that the bottom surface of the flexible heat dissipation assembly is in abutment with the bearing surface of the first bearing member, the inner top surface of the flexible heat dissipation assembly is in abutment with the second surface of the chip, and the left and right inner side surfaces of the flexible heat dissipation assembly have a gap with the side surface of the chip.

[0057] In another example, only the first surface (the outer top surface) of the flexible heat dissipation assembly is in abutment with the inner surface of the packaging shell 1, and the left and right outer side surfaces of the flexible heat dissipation assembly have a gap with the inner surface of the packaging shell 1 (see Figure 3). It should be understood that, due to the deformation of the flexible heat dissipation assembly during the assembly process, the second surface of the flexible heat dissipation assembly can be divided into a bottom surface, an inner top surface, and left and right inner side surfaces. Based on this, the flexible heat dissipation assembly 4 is also arranged in the circumferential direction of the chip 3, and the abutment of the second surface of the flexible heat dissipation assembly with the second surface of the chip 3 and the bearing surface of the first bearing member 2 can be understood as the abutment of the bottom surface of the flexible heat dissipation assembly with the bearing surface of the first bearing member 2, the abutment of the inner top surface of the flexible heat dissipation assembly with the second surface of the chip 3, and the abutment or the gap between the left and right inner side surfaces of the flexible heat dissipation assembly and the side surface of the chip 3.

[0058] As a possible implementation, see Figure 2 , Figure 4 and Figure 5 , the above-mentioned flexible heat dissipation assembly 4 can include a second bearing member 40 and a flow guide unit 41. The second bearing member 40 has a hollow region. The flow guide unit 41 is connected with the second bearing member 40 and located in the hollow region. When the chip heat dissipation package structure is in the assembled state, the flow guide unit 41 has a flow passage with the second surface of the chip 3 and abuts against the inner surface of the package shell 1. Among them, the flow guide unit 41 includes a plurality of first flow guide members 410 and second flow guide members 411 which are alternately distributed. Each first flow guide member 410 and each second flow guide member 411 has an open end and a closed end. The open end of the first flow guide member 410 is in communication with the inlet 10, and the open end of the second flow guide member 411 is in communication with the outlet 11.

[0059] See Figure 2 , Figure 4 and Figure 5 , the cooling medium first enters the flow channel of the first flow guide member 410 through the inlet 10. It should be understood that, at this time, the initial temperature of the cooling medium is relatively low, for example, it can be less than or equal to the initial temperature of the chip 3. Then, the cooling medium entering the flow channel of the first flow guide member 410 directly or indirectly contacts the second surface of the chip 3. At this time, the heat generated by the chip 3 is continuously conducted to the cooling medium to reduce the temperature of the chip 3 itself. Since the flow guide unit 41 has a flow passage with the second surface of the chip 3. At this time, the cooling medium that absorbs heat can flow into the flow channel of the second flow guide member 411. Again, since the open end of the second flow guide member 411 is in communication with the outlet 11, based on this, the cooling medium that absorbs the heat of the chip 3 can flow to the outlet 11 through the open end of the second flow guide member 411, so as to discharge the cooling medium with a high temperature from the containing space, and further conduct the heat generated by the chip 3 to the outside to achieve heat dissipation of the chip 3.

[0060] For example, see Figure 4, a bearing plate with a certain thickness is selected, and the material at the center position of the bearing plate is removed along the length direction of the bearing plate to form a hollow area. Then, grooves are formed on both sides of the hollow area, and the two grooves are named as the entering groove 400 and the collecting groove 401 for later description. Thus, the second bearing piece 40 is formed. Then, the drainage unit 41 is arranged in the hollow area.

[0061] Referring to Figure 2 When the chip heat dissipation packaging structure is in the assembled state, the left and right inner sides of the second bearing piece 40 abut against the side surface of the chip 3, the outer top surface of the second bearing piece 40 abuts against the inner surface of the packaging shell 1, and the bottom surface of the second bearing piece 40 abuts against the bearing surface of the first bearing piece 2. The drainage unit 41 abuts against the inner surface of the packaging shell 1 and the second surface of the chip 3, respectively.

[0062] Referring to Figure 4 The shapes of the first drainage piece 410 and the second drainage piece 411 are both n-shaped structures, and the shape of the drainage unit 41 is a snake shape. In the accompanying drawings, the shapes of one first drainage piece 410 and one second drainage piece 411 are highlighted by thick lines for the convenience of observing the drawings. Figure 1 The above-mentioned drainage unit 41 has the following two possible implementation cases for the flow of the cooling working medium, and it should be understood that the following description is only for understanding and is not used for specific definition.

[0063] Example one, the first drainage piece and the second drainage piece can be hollow structures or solid structures, but the cooling working medium only flows in the gap between the n-shaped structures.

[0064] Example two, the first drainage piece and the second drainage piece are both hollow pipes, and the cooling working medium not only flows in the gap between the n-shaped structures, but also flows in the pipes.

[0065] The above-mentioned chip heat dissipation packaging structure can be applied to various different shapes of the second surface of the chip, and the following two possible cases are described as examples. It should be understood that the following description is only for understanding and is not used for specific definition.

[0066] In an optional way, when the second surface of the chip is a plane, the drainage unit is arranged in a spaced manner with the second surface of the chip to form a flow channel.

[0067] For example, the thickness values of the drainage unit at different positions can be set according to actual conditions, so that when the chip heat dissipation packaging structure is in the assembled state, there is a gap between the drainage unit and the second surface of the chip to form a flow channel. Alternatively, some grooves are formed on the side opposite to the chip of the drainage unit.

[0068] In another optional way, referring to Figure 1The flow channel can include a plurality of grooves 30 formed on the second surface of the chip 3, and the corresponding flow directions of the grooves 30 are not completely same or different from the corresponding flow directions of the flow units 41.

[0069] Referring to Figure 1 Since the flow channel includes a plurality of grooves 30 formed on the second surface of the chip 3, the contact area between the cooling medium and the second surface of the chip 3 can be increased, that is, the effective heat dissipation area can be increased, and the heat dissipation efficiency of the chip 3 can be improved. Since the corresponding flow directions of the grooves 30 are not completely same or different from the corresponding flow directions of the flow units 41. At this time, the cooling medium entering the grooves 30 through the flow channel of the first flow unit 410 diffuses to both sides along the direction in which the grooves 30 are formed, and at the same time, the cooling medium absorbs the heat of the chip 3. Then, the cooling medium flows out of the flow channel of the second flow unit 411, taking away the heat. Since the flow channel of the second flow unit 411 is located on one side of the flow channel of the first flow unit 410, at this time, the cooling medium only needs to flow through a part of the distance (for example, the width distance of the first flow unit 410) along the direction in which the grooves 30 are formed to flow out of the flow channel of the second flow unit 411. Compared with the prior art, which needs to flow from the start to the end of the groove along the length direction of the groove to conduct the heat, the utilization rate of the cooling medium is improved, the time of the cooling medium that has absorbed heat to flow in the flexible heat dissipation assembly 4 is shortened, and the probability of the cooling medium's heat absorption ability being weakened due to the temperature rise is reduced. Based on this, it can be ensured that the temperature difference of the chip 3 is small, and then it can be ensured that most or all of the heat generated by the chip 3 is conducted away, so as to reduce the temperature of the chip 3. In addition, the selection of the shape of the grooves 30 is increased, so that it can adapt to different application scenarios and expand its application range.

[0070] In combination with the above two different cases of the second surface of the chip, it can be seen that the chip heat dissipation packaging structure provided by the application can be applied to chips of different shapes, thereby expanding the application range.

[0071] In an optional manner, the grooves are straight-line grooves, zigzag grooves or arc grooves.

[0072] In the embodiment of the application, referring to Figures 1 to 6The aforementioned drainage unit 41 has drainage directions including the drainage direction of the first drainage member 410 (direction A) and the drainage direction of the second drainage member 411 (direction B), and these two drainage directions are consistent. The aforementioned groove 30 is a straight groove formed along the length of the chip 3, and the drainage direction corresponding to the straight groove is perpendicular to the drainage direction corresponding to the drainage unit 41. At this time, on the one hand, when the cooling medium passes through the flow channel (i.e., the gap between the n-shaped structures) of the first drainage member 410, it can sequentially enter multiple vertically distributed grooves 30. Based on this, not only can the contact area between the cooling medium and the second surface of the chip 3 be increased, thereby increasing the effective heat dissipation area and improving the heat dissipation efficiency of the chip 3, but the pressure loss in the flow channel is also reduced, thereby reducing the pumping power and saving energy. On the other hand, since the drainage direction corresponding to the straight groove is perpendicular to the drainage direction corresponding to the drainage unit 41, it can be seen that both the first drainage member 410 and the second drainage member 411 are set along the width direction of the chip 3. The cooling medium, after entering the groove 30 along direction A through the flow channel of the first guide member 410, diffuses to both sides along the opening direction of the groove 30 (i.e., Figure 6 (The direction pointed to by the double-headed arrow in the diagram) Simultaneously, the cooling medium absorbs heat from chip 3. Afterwards, the cooling medium flows out along direction B from the channel of the second guide member 411, carrying away the heat. During this process, since the channel of the second guide member is located on one side of the channel of the first guide member, the cooling medium only needs to flow along the length of the groove for a distance approximately equal to the width of the first guide member to flow out from the channel of the second guide member. Compared to the prior art where heat needs to be conducted from the beginning to the end of the groove 30 along its length, this method improves the utilization rate of the cooling medium, shortens the time the absorbed cooling medium flows within the flexible heat dissipation component 4, and reduces the probability of its heat absorption capacity weakening due to increased cooling medium temperature. Based on this, it can be ensured that the temperature difference at various points on chip 3 is small, thereby ensuring that most or all of the heat generated by chip 3 is conducted away, thus reducing the temperature of chip 3.

[0073] As one possible implementation, the chip may include multiple support pillars arranged in an array on the second surface of the chip. In this case, the flexible heat dissipation component may consist only of the second carrier, or it may include both the second carrier and the current-draining unit. It should be understood that the shape, material, height, etc., of the support pillars can be selected according to actual conditions and are not specifically limited here.

[0074] It should be understood that the aforementioned grooves and support pillars can be formed by processing the chip using methods such as mechanical scribing, laser etching, plasma etching, DRIE (Deep Reactive Ion Etching), reactive ion etching, and chemical etching.

[0075] As one possible implementation, the aforementioned flexible heat dissipation component can be an insulated flexible heat dissipation component.

[0076] In practical use, the first carrier 2 has multiple electrical interfaces 5. When the chip heat dissipation packaging structure is in the assembled state, a portion of these electrical interfaces 5 abut against the insulated flexible heat dissipation component. Figures 1 to 6 (Not shown in the image). In this case, when the electrical interface 5 is damaged and leaks current, the insulating flexible heat dissipation component can act as a barrier, preventing electrical connection between the electrical interface 5 and the metal packaging shell 1, or between the electrical interface 5 and the cooling medium, thereby preventing leakage or short circuits and further improving the safety and reliability of the chip heat dissipation packaging structure. Additionally, see... Figure 3 When the electrical interface 5 is located outside the space formed by the insulating flexible heat dissipation component and the first carrier 2, the cooling medium only flows within the space formed by the flexible heat dissipation component and the first carrier 2. In this case, the electrical interface 5 and the cooling medium can be isolated, avoiding electrical connection between the electrical interface 5 and the cooling medium, thereby preventing leakage or short circuits and further improving the safety and reliability of the chip heat dissipation packaging structure.

[0077] In one alternative approach, the aforementioned insulated flexible heat dissipation component can be made of one or more of polydimethylsiloxane (PDMS), glass fiber, and elastomer. These materials are readily available, reducing the difficulty of obtaining the materials for the insulated flexible heat dissipation component. Furthermore, this increases the material selectivity of the insulated flexible heat dissipation component, allowing it to adapt to different application scenarios and thus expanding the applicability of chip heat dissipation packaging structures. Of course, the material of the insulated flexible heat dissipation component can also be aerogel or cross-linked polyethylene, etc.

[0078] The aforementioned cooling medium can be a liquid or a gas. As one possible implementation, the cooling medium is one or more of deionized water, electronic fluorinated liquid, and liquid metal. This increases the selectivity of the cooling medium, allowing the chip heat dissipation packaging structure to adapt to different application scenarios, thereby expanding the applicability of the chip heat dissipation packaging structure.

[0079] Since the cooling medium is a liquid, choosing a heat dissipation component made of a flexible material allows the assembled chip heat dissipation package structure to form a watertight structure.

[0080] The following describes the working principle of the chip heat dissipation packaging structure using one possible implementation as an example. It should be understood that the following description is for comprehension purposes only and is not intended to limit the specific implementation.

[0081] See Figures 1 to 6After the chip heat dissipation packaging structure is assembled, cooling medium is introduced into the inlet groove 400 of the flexible heat dissipation component 4 through the inlet 10 of the packaging shell 1. Then, the cooling medium simultaneously enters from the inlet groove 400 along direction A into the gaps between multiple n-shaped first guide members, and then enters the multiple grooves 30 formed on the second surface of the chip 3 through these gaps. The cooling medium, after entering the grooves 30 through the gaps between the n-shaped first guide members, diffuses to both sides along the opening direction of the grooves 30 (i.e.,...). Figure 6 (The direction pointed to by the double-headed arrow in the image) while the cooling medium absorbs heat from chip 3. Then, the heat-absorbing cooling medium flows along direction B into the gap between the n-shaped second guide members, and finally collects in the collection groove 401, before being discharged from the outlet 11 of the package housing 1. It should be understood that since the flow channel of the second guide member 411 is located on one side of the flow channel of the first guide member 410, the cooling medium only needs to flow along the length of the groove for a distance approximately equal to the width of the first guide member 410 to flow out from the flow channel of the second guide member 411.

[0082] Secondly, embodiments of the present invention also provide an electronic device. This electronic device includes the chip heat dissipation packaging structure described in the above-described technical solution.

[0083] The beneficial effects of the electronic device provided in the embodiments of the present invention are the same as those of the chip heat dissipation packaging structure in the first aspect, and will not be repeated here.

[0084] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0085] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A chip heat dissipation package structure, characterized in that, The chip heat dissipation package structure comprises: a package shell having an inlet and an outlet; the inlet is used for entering a cooling working medium, and the outlet is used for discharging the cooling working medium; a first carrier having a containing space after being assembled with the package shell; a chip having opposite first and second surfaces, the first surface being arranged on a bearing surface of the first carrier; a flexible heat dissipation assembly arranged at least on the second surface of the chip; when the chip heat dissipation package structure is in an assembled state, the flexible heat dissipation assembly abuts against an inner surface of the package shell, and the inlet and the outlet are communicated through the flexible heat dissipation assembly; a vertical height of the containing space is defined as a containing height, a first total vertical height of a part of the flexible heat dissipation assembly located on the chip corresponding to the chip is equal to the containing height; when the chip heat dissipation package structure is in a split state, a second total vertical height of the part of the flexible heat dissipation assembly located on the chip corresponding to the chip is greater than the containing height.

2. The chip heat dissipation package structure of claim 1, wherein, The flexible heat dissipation assembly is further arranged in a circumferential direction of the chip, and the flexible heat dissipation assembly has opposite first and second surfaces; when the chip heat dissipation package structure is in the assembled state, the first surface of the flexible heat dissipation assembly abuts against the inner surface of the package shell, and the second surface of the flexible heat dissipation assembly abuts against the second surface of the chip and a bearing surface of the first carrier, respectively.

3. The chip heat dissipation package structure of claim 1, wherein, The flexible heat dissipation assembly comprises: a second carrier having a hollow region; a flow guide unit connected with the second carrier and located in the hollow region; when the chip heat dissipation package structure is in the assembled state, the flow guide unit has a flow passage with the second surface of the chip and abuts against the inner surface of the package shell; wherein the flow guide unit comprises a plurality of first flow guide members and second flow guide members alternately distributed, each of the first flow guide members and the second flow guide members has an open end and a closed end; the open end of the first flow guide member is communicated with the inlet, and the open end of the second flow guide member is communicated with the outlet.

4. The chip heat dissipation package structure of claim 3, wherein, When the second surface of the chip is a plane, the flow guide unit is arranged in a spaced manner with the second surface of the chip to form the flow passage.

5. The chip heat dissipation package structure of claim 3, wherein, The flow passage comprises a plurality of grooves opened on the second surface of the chip, and a corresponding flow direction of the grooves is not completely the same as or different from a corresponding flow direction of the flow guide unit.

6. The chip heat dissipation package structure of claim 5, wherein, The grooves are straight-line grooves, zigzag grooves or arc-line grooves.

7. The chip heat dissipating package structure according to any one of claims 1 to 3, wherein, The chip comprises a plurality of support columns arranged in an array on the second surface of the chip.

8. The chip heat dissipating package structure of claim 2, wherein, The flexible heat dissipation assembly is an insulating flexible heat dissipation assembly.

9. The chip heat dissipation package structure of claim 8, wherein, The material of the insulating flexible heat dissipation assembly is one or more of polydimethylsiloxane, glass fiber and elastomer.

10. An electronic device, comprising: The chip heat dissipation package structure comprises any one of claims 1 to 9.

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