substrate

Abstract

A substrate according to an embodiment includes an insulating layer in which a crystal grain extending in a first direction is formed, and a circuit pattern disposed on the insulating layer, wherein the insulating layer includes an upper surface and a plurality of outer lateral surfaces, the plurality of outer lateral surfaces including a first outer lateral surface extending in the same first direction as the first direction of the crystal grain formed in the insulating layer, and a second outer lateral surface extending in a second direction different from the first direction and not including the first outer lateral surface, the first outer lateral surface having a first surface roughness, and the second outer lateral surface having a second surface roughness different from the first surface roughness.

Description

Technical Field

[0001] This embodiment relates to a substrate, and more specifically, to a substrate having a three-dimensional shape. Background Technology

[0002] Typically, with the proliferation of mobile devices, the intelligence of everyday products such as automobiles is accelerating, thus creating a growing demand for electronic circuit systems suitable for various product shapes.

[0003] In particular, the implementation of electronic circuit systems applicable to various product groups requires the development of printed circuit boards suitable for various product shapes. However, traditionally, there has been no development of printed circuit board (PCB) process technology based on flexible substrates that can be customized to respond to the shape of three-dimensional objects.

[0004] However, traditional polyimide-based flexible printed circuit boards (FPCBs) are merely bent and three-dimensionally connected. However, for attachment to wearable or three-dimensional (3D) devices intended for contact with the human body, the materials and electrodes must be stretchable when bent, and furthermore, they need to ensure the ability to freely change shape.

[0005] In other words, developing a multilayer flexible printed circuit board (FPCB) capable of supporting complex information processing in the development of wearable electronic devices, which are seen as a future business opportunity, is crucial. However, the FPCBs used in traditional mobile devices are a combination of rigid multilayer printed circuit boards (PCBs) and flexible interconnect circuitry. Nevertheless, to prepare for the next generation of wearable devices that require more natural deformation, there is an urgent need to develop a high-performance multilayer flexible printed circuit board (FPCB) that can deform even in three-dimensional shapes. Summary of the Invention

[0006] Technical issues

[0007] The embodiment provides a substrate and a method for manufacturing the same, which can be manufactured into a three-dimensional thermoformed substrate using a directional support frame and can be easily separated from the manufactured substrate.

[0008] It should be understood that the technical objectives to be achieved by the embodiments are not limited to the technical topics described above, and other technical topics not mentioned will be obvious to those skilled in the art to which the embodiments described below pertain.

[0009] Technical solution

[0010] The substrate according to an embodiment includes: an insulating layer in which grains extending along a first direction are formed; and a circuit pattern disposed on the insulating layer; wherein the insulating layer includes an upper surface and a plurality of outer surfaces; wherein the plurality of outer surfaces includes: a first outer surface extending along a first direction identical to the first direction of the grains formed in the insulating layer; and a second outer surface extending along a second direction different from the first direction and not including the first outer surface, wherein the first outer surface has a first surface roughness, and wherein the second outer surface has a second surface roughness different from the first surface roughness.

[0011] In addition, the insulating layer comprises a polymer having a nematic structure.

[0012] In addition, the insulating layer includes LCP (liquid crystal polymer) or HDPE (high density polyethylene).

[0013] In addition, the shape of the grains exposed through the first outer surface is different from the shape of the grains exposed through the second outer surface.

[0014] Additionally, the first outer surface includes a first portion having a first surface roughness and a second portion having a second surface roughness.

[0015] In addition, carbon is exposed on at least a portion of the second outer surface.

[0016] In addition, the substrate also includes at least one device disposed on the circuit pattern.

[0017] In addition, the substrate also includes a protective layer disposed on the insulating layer and covering the surface of the insulating layer and the surface of the circuit pattern.

[0018] In addition, the insulating layer includes at least one flat region and at least one curved region that bends and extends from the flat region.

[0019] In addition, the curved region includes a first curved region that curves from one end of the flat region and a second curved region that curves from the other end of the flat region, wherein the first curved region and the second curved region have different curvature angles.

[0020] In addition, the insulating layer includes a first flat region and a second flat region, and the first flat region and the second flat region are located on different planes.

[0021] On the other hand, the method for manufacturing a substrate according to an embodiment includes: preparing a support frame in which grains extending along a first direction are formed; forming a circuit pattern on a substrate region of the support frame; forming a protective layer covering the circuit pattern on the substrate region of the support frame; forming an anchor by removing at least a portion of an outer region of the substrate region of the support frame; thermoforming the support frame and the circuit pattern disposed on the substrate region; and separating the substrate including the support frame and the circuit pattern located on the substrate region from the anchor by providing shear stress to one end of the anchor, wherein the outer region of the substrate region includes a first outer region extending along a first direction that is the same as the direction of the grains and a second outer region extending along a second direction that is different from the first direction, and wherein the anchor is formed by laser processing or cutting the second outer region to form the anchor in the first outer region.

[0022] In addition, the support frame includes polymers with nematic structures.

[0023] In addition, the support frame includes LCP (liquid crystal polymer) or HDPE (high density polyethylene).

[0024] Additionally, the outer surface of the support frame constituting the separated substrate includes: a first outer surface extending along a first direction that is the same as the direction of the grain and corresponding to a first outer region; and a second outer surface extending along a second direction that is different from the first direction and corresponding to a second outer region, wherein the first outer surface has a first surface roughness and the second outer surface has a second surface roughness that is different from the first surface roughness.

[0025] In addition, the shape of the grains exposed through the first outer surface is different from the shape of the grains exposed through the second outer surface.

[0026] Additionally, the first outer surface includes a first portion having a first surface roughness and a second portion having a second surface roughness.

[0027] In addition, the method of manufacturing the substrate also includes attaching at least one device onto the circuit pattern and providing a protective layer to cover the device.

[0028] Beneficial effects

[0029] According to an embodiment, a substrate is manufactured using a support frame with a constant orientation throughout the region, and the support frame is laser-processed to form anchors around the substrate. In this case, anchors can be formed only to separate the area on the support frame where the manufactured substrate is formed. At this time, the side surface of the anchor contacts the outer surface of the substrate. Then, when the 3D molding process of the substrate is completed, the interface between the anchor and the outer surface of the substrate is cut to separate the substrate.

[0030] In this embodiment, the side surface of the anchor connected to the outer side of the substrate extends along a first direction. In this case, the first direction corresponding to the extension direction of the anchor's side surface can correspond to the orientation of the support frame. That is, the support frame is a polymer with a nematic structure, where molecules are aligned in a specific direction, thus forming grains in the support frame corresponding to the direction of molecular alignment. Therefore, when forming the anchor, the portion of the outer side of the substrate except for the portion having the same extension direction as the support frame is laser-processed, so the anchor is formed only on the outer side of the substrate having the same extension direction as the support frame. Therefore, in this embodiment, the substrate can be easily separated by providing shear stress to the interface without performing alignment processes or additional laser or cutting processes for separating the substrate.

[0031] In addition, in the embodiments, after multiple modular products that require three-dimensional molding are formed on the support frame, anchors can be used to separate the modular products. Therefore, it is suitable for large-scale production of 3D molding and the molding difficulty can be reduced by reducing the residual stress that may be generated due to the support frame. Attached Figure Description

[0032] Figure 1 and Figure 2 This is a diagram used to illustrate the manufacturing process of a substrate with a three-dimensional shape according to a comparative example.

[0033] Figure 3 This is a cross-sectional view of the substrate according to the first embodiment.

[0034] Figure 4 and Figure 5 yes Figure 3 The diagram shows a plan view of the substrate.

[0035] Figure 4 When Figure 3 A plan view of the substrate when the grain direction of the supporting frame (insulating layer) is longitudinal.

[0036] Figure 5 Is when Figure 3 A plan view of the substrate when the grain direction of the supporting frame (insulating layer) is horizontal.

[0037] Figure 6 yes Figure 4 A perspective view of the insulating layer shown.

[0038] Figure 7 It is shown Figure 4 A plan view of the first modified example of the substrate shown. Figure 8 It is shown Figure 4 A plan view of a second modified example of the substrate shown.

[0039] Figures 9 to 17 This is a cross-sectional view showing a method for manufacturing a substrate according to an exemplary embodiment, arranged in process order. Detailed Implementation

[0040] In the following description, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings. However, regardless of the reference numerals, the same or similar parts will be indicated by the same reference numerals, and repeated descriptions will be omitted. The component suffixes "module" and "part" used in the following description are given or combined only for ease of writing the specification, and they themselves have no distinguishing meaning or function. Furthermore, in describing the embodiments disclosed in this specification, detailed descriptions of related known technologies will be omitted when it is determined that such detailed descriptions unnecessarily obscure the spirit of the embodiments disclosed in this specification. Moreover, the drawings are only for the purpose of facilitating understanding of the embodiments disclosed in this specification. The scope of the technology disclosed in this specification is not limited by the drawings and should be understood to include all modifications, equivalents, and substitutions falling within the spirit and scope of the invention.

[0041] It should be understood that although the terms "first," "second," etc., may be used in this document to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0042] It should be understood that when a component is referred to as "connected" or "joined" to another component, it can be directly connected or joined to the other component, or there may be intermediate components. Conversely, when a component is referred to as "directly connected" or "directly joined" to another component, there are no intermediate components.

[0043] Unless the context clearly indicates otherwise, singular expressions include plural expressions.

[0044] It will be further understood that the terms “comprising” or “having” as used herein specify the presence of the said feature, integer, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0045] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0046] Figure 1 and Figure 2 This is a diagram used to illustrate the manufacturing process of a substrate with a three-dimensional shape according to a comparative example.

[0047] refer to Figure 1 In (a) and (b), the substrate in the comparative example includes a first region 10 and a second region 20.

[0048] The second region 20 of the substrate is the actual product area, and the first region 10 is the area outside the actual product area.

[0049] Therefore, in the comparative example, a process is required to separate the second region 20 by removing the first region 10 from the entire area of ​​the substrate.

[0050] The manufacturing process of the comparative example substrate is briefly described as follows: a carrier frame is prepared, and a substrate including a first region 10 and a second region 20 is formed by forming a circuit pattern on the prepared carrier frame, attaching electronic devices, and forming a protective layer. Then, when forming the substrate, a thermoforming process is performed on the second region 20 to manufacture the shape of the second region 20 corresponding to the actual product into the required three-dimensional shape.

[0051] Then, when manufacturing the three-dimensional shaped substrate, a process is performed to separate the second region 20 from the three-dimensional shaped substrate. In this case, in the three-dimensional shaped substrate manufactured by thermoforming, the cutting points for separating the second region 20 are not all arranged on the same plane. Therefore, in the comparative example, a technology is needed that can separate the second region 20 by cutting at various heights. In addition, as mentioned above, substrate movement may occur during the cutting process, so a precise alignment technology that can accurately locate the interface between the first region 10 and the second region 20 is needed.

[0052] At this time, as Figure 1 As shown in (a), the cutting process of Comparative Example 1 is performed using a laser. However, as mentioned above, not all cutting points are located on the same plane, so there is a problem that the laser must be focused according to the height of each cutting point during the laser process.

[0053] In addition, such as Figure 2 In the second comparative example (b), a fixture equipped with a blade instead of a laser can be used to separate the second region 20. In this case, the problem present in the first comparative example can be solved by adjusting the height when using a fixture. However, as mentioned above, in order to separate only the second region 20 on the substrate, a fixture equipped with a small blade with a size of less than 200 μm is required, and the alignment accuracy error range must be less than ±50 μm, thus resulting in a reduction in productivity.

[0054] On the other hand, refer to Figure 2 In (a) and (b), as in the third comparative example, the laser process is performed preferentially before the thermoforming process, thereby allowing the second region 20 to be separated with all cutting points located on the same plane. Furthermore, in the third comparative example, as... Figure 2As shown in (c), when the second region 20 is separated, a separate thermoforming process is performed only on the second region 20. In this case, multiple second regions 20 can be formed on the substrate. In other words, when one second region 20 is referred to as a sample, multiple different samples are typically generated simultaneously on a single support frame. However, when a cutting process is performed first before thermoforming as described above, an additional process is required during the cutting process to hold multiple samples, and there is a problem of reduced mobility between the processes of multiple samples. In addition, when the thermoforming process is performed with only the second region 20 separated, the size of the separated second region 20 is very small, making it difficult to thermoform the second region 20 into the desired three-dimensional shape.

[0055] Therefore, the embodiments provide a substrate and a method for manufacturing the same, which can simplify the manufacturing process and reduce manufacturing costs without causing problems in the manufacturing process of substrates with three-dimensional shapes.

[0056] Figure 3 This is a cross-sectional view of the substrate according to the first embodiment. Figure 4 and Figure 5 yes Figure 3 The diagram shows a plan view of the substrate. Figure 4 Is when Figure 3 A plan view of the substrate when the grain direction of the supporting framework (insulating layer) is longitudinal. Figure 5 Is when Figure 3 A plan view of the substrate when the grain direction of the supporting frame (insulating layer) is horizontal.

[0057] Reference Figure 3 The substrate 100 includes an insulating layer 110, a circuit pattern 120 disposed on the insulating layer 110, a device 130 disposed on the circuit pattern 120, and a protective layer 140 disposed on the insulating layer 110 to cover the circuit pattern 120 and the device 130.

[0058] The insulating layer 110 can be a base material used to manufacture the substrate. Preferably, the insulating layer 110 can be part of a support frame used to manufacture the substrate. That is, the support frame (described later) can include a first region corresponding to the insulating layer 110 of the substrate 100 and a second region other than the first region. In addition, with the circuit pattern 120, device 130 and protective layer 140 sequentially disposed on the support frame, a cutting process for separating the first region can be performed to manufacture the substrate.

[0059] Grains can be formed in the insulating layer 110. Preferably, the insulating layer 110 can have a nematic structure. A nematic structure can refer to a state in which all molecules have the same and constant orientation. Therefore, due to the nematic structure, grains can be formed in the insulating layer 110 to correspond to the orientation of the molecules.

[0060] Preferably, the insulating layer 110 may be a polymer belonging to the class of p-hydroxybenzoic acid (benzoic acid having OH at the para position) and a monomer-based crystalline aromatic polyester based on p-hydroxybenzoic acid and related monomers.

[0061] Preferably, the insulating layer 110 may comprise a polymeric material, such as vectron (a product obtained by melt spinning vectra) or Kevlar.

[0062] For example, the insulating layer 110 can be an anisotropic film of at least one of LCP (liquid crystal polymer) and HDPE (high-density polyethylene), but is not limited thereto. In other words, since the insulating layer 110 has a nematic structure, it can be any of a variety of films containing polymer materials in which the molecules are arranged in one and the same orientation.

[0063] Therefore, the insulating layer 110 can have the property of being cut along the grain by shear stress applied along the grain direction.

[0064] Circuit pattern 120 is disposed on insulating layer 110. Circuit pattern 120 may be disposed on insulating layer 110 to transmit electrical signals. However, the embodiments are not limited to this, and a layer corresponding to circuit pattern 120 may be formed on insulating layer 110, which may perform heat dissipation or signal shielding functions instead of electrical signal transmission functions.

[0065] The circuit pattern 120 can be formed from a metallic material with high electrical conductivity. Therefore, the circuit pattern 120 can be formed from at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Alternatively, the circuit pattern 120 can be formed from a paste or solder paste comprising at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Preferably, the circuit pattern 120 can be formed from copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0066] The circuit pattern 120 can be formed using additive processes, subtractive processes, modified semi-additive processes (MSAP), and semi-additive processes (SAP) which are common printed circuit board manufacturing processes; detailed descriptions of these processes are omitted here.

[0067] Device 130 can be attached to circuit pattern 120. Device 130 can be determined according to the application to which substrate 100 is used.

[0068] Device 130 can be a passive device. For example, device 130 can be a passive device such as wiring, resistors, and chips. Device 130 can also be an active device. For example, device 130 can be an active device such as a multiplexer, an application-specific integrated circuit (ASIC), or a wireless communication module. In addition, device 130 may include optical devices (such as lenses or waveguides), magnetic devices, and electrochemical devices (such as batteries or enzyme sensors).

[0069] The protective layer 140 is disposed on the insulating layer 110.

[0070] The protective layer 140 may be disposed on the insulating layer 110 to protect the exposed surfaces of the insulating layer 110, the circuit pattern 120, and the device 130. Therefore, the height of the protective layer 140 may be greater than the height of the device 130, so the circuit pattern 120 and the device 130 may be embedded in the protective layer 140, but is not limited thereto.

[0071] Therefore, the protective layer 140 may comprise an epoxy acrylate-based resin. For example, the protective layer 140 may comprise a resin, curing agent, photoinitiator, pigment, solvent, filler, additive, acrylic monomer, etc. However, the embodiments are not limited thereto, and the protective layer 140 may be any of a solder resist (SR), a cover layer, and a polymer material.

[0072] Meanwhile, the substrate 100 has a three-dimensional shape. For example, the substrate 100 may include flat regions configured to be flat and curved regions extending from the flat regions and bending into a specific curvature. For example, the substrate 100 may include multiple flat regions, and the multiple flat regions may be located on different planes. For example, the heights of the multiple flat regions included in the substrate 100 may be different from each other. In addition, the substrate 100 may include multiple curved regions, and the curvatures or bending angles of the multiple curved regions may be different from each other.

[0073] like Figure 3 As shown, substrate 100 may include a first flat region FR1, a second flat region FR2, a third flat region FR3, a first curved region BR1, a second curved region BR2, a third curved region BR3, and a top surface. In this case, the first flat region FR1, the second flat region FR2, the third flat region FR3, the first curved region BR1, the second curved region BR2, and the top surface included in substrate 100 are described based on the protective layer 140 of substrate 100. However, when using the insulating layer 110 of substrate 100 as a reference, the position of each region may be different from that of the substrate 100. Figure 3 The differences shown are different.

[0074] The height of one end of each of the first flat region FR1, the second flat region FR2, and the third flat region FR3 can be the same as the height of the other end facing that end. That is, the first flat region FR1, the second flat region FR2, and the third flat region FR3 can have a planar shape.

[0075] The first flat region FR1, the second flat region FR2, and the third flat region FR3 can be disposed on different planes. For example, the first flat region FR1 and the second flat region FR2 can be disposed on the same plane. For example, the upper surfaces of the first flat region FR1 and the second flat region FR2 can be disposed on the same plane. For example, the first flat region FR1 and the third flat region FR3 can be disposed on different planes. For example, the upper surfaces of the first flat region FR1 and the third flat region FR3 can be located on different planes. For example, the upper surface of the first flat region FR1 can be positioned below the upper surface of the second flat region FR2. For example, the second flat region FR2 and the third flat region FR3 can be disposed on different planes. For example, the upper surfaces of the second flat region FR2 and the third flat region FR3 can be located on different planes. For example, the upper surface of the second flat region FR2 can be positioned below the upper surface of the third flat region FR3. However, the embodiments are not limited to this; the number of flat regions can be varied depending on the application to which the substrate 100 is applied, and the position of the upper surface of each flat region can also be varied.

[0076] Meanwhile, the curved region can be located between multiple flat regions in the substrate 100. The curved region allows the substrate 100 to have a three-dimensional shape.

[0077] The first curved region BR1 may extend from one end of the first flat region FR1. The first curved region BR1 may be curved at a predetermined curvature or angle. For example, the heights of one end and the other end of the first curved region BR1 may be different. For example, the height of one end of the first curved region BR1 may be lower than the height of the other end.

[0078] The second curved region BR2 may extend from one end of the second flat region FR2. For example, the second curved region BR2 may extend inward from one end of the second flat region FR2. The second curved region BR2 may bend from one end of the second flat region FR2 with a predetermined curvature or angle. For example, the heights of one end and the other end of the second curved region BR2 may be different. For example, the height of one end of the second curved region BR2 may be higher than the height of the other end of the second curved region BR2.

[0079] The third curved region BR3 can extend from the other end of the second flat region FR2. Alternatively, the third curved region BR3 can extend from one end of the third flat region FR3. Preferably, the third curved region BR3 can be positioned between the other end of the second flat region FR2 and one end of the third flat region FR3. The third curved region BR3 can be curved at a predetermined curvature or angle from both ends of the second flat region FR2 and the third flat region FR3. For example, the heights of one end and the other end of the third curved region BR3 can be different. For example, the height of one end of the third curved region BR3 can be lower than the height of the other end.

[0080] Simultaneously, an opening region OR can be formed between the first bending region BR1 and the second bending region BR2. The opening region OR can be a through-hole passing through the upper and lower surfaces of the substrate 100. For example, the protective layer 140, the circuit pattern 120, and the insulating layer 110 may not be provided on the opening region OR. For example, the planar shape of the substrate 100 may have a rectangular shape, wherein the opening, such as the opening region OR, is formed in the center.

[0081] Meanwhile, the substrate 100 may include an outer surface. An outer surface refers to a side surface located outside the substrate 100, and may include, for example, the outer surface of the insulating layer 110 and the outer surface of the protective layer 140 of the substrate 100. In this case, the entire area of ​​the outer surface of the protective layer 140 may have a uniform surface roughness.

[0082] Meanwhile, based on the grain orientation of the insulating layer 110, the outer surface of the insulating layer 110 may include a region having a first surface roughness and a region having a second surface roughness, wherein the second surface roughness has a second roughness different from the first roughness.

[0083] For example, the insulating layer 110 may include a plurality of outer surfaces that are divided relative to the edge portion of the substrate 100 to correspond to the shape of the substrate 100.

[0084] For example, such as Figure 4 As shown, the insulating layer 110 includes a first outer surface 111 located on the left side relative to the upper surface, a second outer surface 112 located on the right side, a third outer surface 113 located on the upper side, and a fourth outer surface 114 located on the lower side.

[0085] In this configuration, the plurality of outer surfaces constituting the insulating layer 110 may extend in different directions. For example, the first outer surface 111 may extend in a first direction. For example, the first outer surface 111 may extend in a longitudinal direction. The second outer surface 112 may extend in the same first direction as the first outer surface 111. For example, the second outer surface 112 may extend in the same longitudinal direction as the first outer surface 111. The third outer surface 113 may extend in a second direction different from the first outer surface 111 and the second outer surface 112. For example, the third outer surface 113 may extend in a second direction substantially perpendicular to the first direction. For example, the third outer surface 113 may extend in a horizontal direction. The fourth outer surface 114 may extend in the same second direction as the third outer surface 113. For example, the fourth outer surface 114 may extend in a horizontal direction.

[0086] That is, the insulating layer 110 may include a first outer surface 111 and a second outer surface 112 that are arranged facing each other and extending along a first direction or a longitudinal direction. In addition, the insulating layer 110 may include a third outer surface 113 and a fourth outer surface 114 that are arranged facing each other between the first outer surface 111 and the second outer surface 112 and extending along a second direction perpendicular to the first direction or the horizontal direction.

[0087] In this case, at least a portion of the outer surface corresponding to the grain direction of the insulating layer 110 may have a different surface roughness than the other portions.

[0088] In other words, the outer surface of the insulating layer 110 can be formed using different processes for each region, so the outer surface of the insulating layer 110 can have a surface roughness corresponding to the process performed.

[0089] Preferably, a portion of the outer surface of the insulating layer 110 can be formed by cutting using laser processing, while the remaining portion can be formed by cutting using shear stress. At this point, the cutting of a portion of the outer surface of the insulating layer 110 by laser processing has been described; however, this is only an example, and a portion of the outer surface can also be cut using a cutting stage other than a laser. The laser-processed portion of the outer surface will be described below.

[0090] Therefore, the portion formed by laser processing can have a first surface roughness. Conversely, the portion formed by shear stress cutting can have a second surface roughness different from the first surface roughness.

[0091] In other words, the portion formed by laser processing can be formed by laser firing. Therefore, carbon may be exposed on the outer surface formed by the laser. Furthermore, the outer surface formed by the laser can have a first surface roughness corresponding to the laser conditions.

[0092] Furthermore, the portion formed by shear stress is the part that is torn or fractured due to shear stress applied by the fixture. For example, the portion formed by shear stress is the part that is torn or fractured within the grains as shear stress is applied along the grain direction of the insulating layer 110. Therefore, the portion formed by shear stress can have a different second surface roughness than the portion formed by laser. In addition, unlike the portion formed by laser, the portion formed by shear stress does not have carbon residue on the surface. Moreover, the grains of the insulating layer 110 in the portion formed by shear stress can be exposed differently than in the portion formed by laser. That is, the grains of the insulating layer 110 in the portion formed by laser are damaged, so the grains of the insulating layer 110 are not exposed or the grain direction cannot be checked. However, the portion formed by shear stress is the part that is torn by shear stress applied in the grain direction, and the grains of the insulating layer 110 can be exposed in this portion, so the grain direction of the insulating layer 110 can be confirmed.

[0093] In this case, the portion formed by laser and the portion formed by shear stress can be determined by the grain orientation of the insulating layer 110.

[0094] For example, the portion formed by laser can be an outer surface extending in a direction different from the grain direction of the insulating layer 110.

[0095] like Figure 4 As shown, grains are formed in the insulating layer 110 along a first direction or a longitudinal direction. Furthermore, the first outer surface 111 and the second outer surface 112 of the insulating layer 110 extend along a first direction that is the same as the grain direction of the insulating layer 110. Additionally, the third outer surface 113 and the fourth outer surface 114 of the insulating layer 110 extend along a second direction that is different from the grain direction of the insulating layer 110.

[0096] Therefore, the third outer surface 113 and the fourth outer surface 114 can be portions formed by laser processing. Thus, the entire region C of the third outer surface 113 can be formed by laser, and therefore can have a first surface roughness. Similarly, the entire region D of the fourth outer surface 114 can be formed by laser, and therefore can have a first surface roughness corresponding to that of the third outer surface 113.

[0097] Meanwhile, the first outer surface 111 and the second outer surface 112 extend along a first direction that is the same as the grain direction of the insulating layer 110. Therefore, the first outer surface 111 and the second outer surface 112 can be formed by applying shear stress using a fixture.

[0098] Therefore, the first outer surface 111 may have a different surface roughness than the third outer surface 113 and the fourth outer surface 114. For example, the first outer surface 111 and the second outer surface 112 may have a second surface roughness that is less than the first surface roughness of the third outer surface 113 and the fourth outer surface 114.

[0099] In this case, in the first embodiment, the entire region A of the first outer surface 111 can have a second surface roughness. Similarly, the entire region B of the second outer surface 112 can also have a second surface roughness. In other words, in the first embodiment, the entire region A of the first outer surface 111 can be formed by cutting the insulating layer 110 along the grain direction using shear stress applied by a jig. Likewise, the entire region B of the second outer surface 112 can be formed by cutting the insulating layer 110 along the grain direction using shear stress applied by a jig.

[0100] However, when the area where the insulating layer 110 is cut along the grain direction due to shear stress becomes larger, the process time increases, and damage may be inflicted on other parts of the substrate 100 during the grain-direction cutting process. Therefore, in the second embodiment, based on the size of the first outer surface 111, the shear stress applied by the jig forms only a portion A1 and A2 of the entire region A of the first outer surface 111, and the remaining portions A3, A4, and A5 are formed by laser processing. Similarly, based on the size of the second outer surface 112, the shear stress applied by the jig forms only a portion B1 and B2 of the entire region B of the second outer surface 112, and the remaining portions B3, B4, and B5 are formed by laser processing.

[0101] For example, portions A1 and A2 of the first outer surface 111 and portions B1 and B2 of the second outer surface 112 enable the substrate 100 to be fixed to the support frame during the thermoforming process of the substrate 100. Therefore, portions A1 and A2 of the first outer surface 111 and portions B1 and B2 of the second outer surface 112 can be determined based on the dimensions that enable the substrate 100 to be fixed to the support frame.

[0102] Therefore, the first outer surface 111 in the embodiment may include a first portion A1 and a second portion A2, the first portion A1 and the second portion A2 being areas torn by shear stress applied by the fixture and having a second surface roughness. Additionally, the first outer surface 111 may include a third portion A3, a fourth portion A4, and a fifth portion A5, the third portion A3, the fourth portion A4, and the fifth portion A5 being areas laser-cut and having a first surface roughness different from the second surface roughness.

[0103] Additionally, the second outer surface 112 in the embodiment may include a first portion B1 and a second portion B2, which are areas torn by shear stress applied by the fixture and have a second surface roughness. Furthermore, the second outer surface 112 may include a third portion B3, a fourth portion B4, and a fifth portion B5, which are areas laser-cut and have a first surface roughness different from the second surface roughness.

[0104] Simultaneously, before the thermoforming of the substrate 100, i.e., while the entire area of ​​the substrate 100 is flat, the entire area C of the third outer side 113, the entire area D of the fourth outer side 114, the third portion A3, the fourth portion A4, and the fifth portion A5 of the first outer side 111, and the third portion B3, the fourth portion B4, and the fifth portion B5 of the second outer side 112 are formed. Furthermore, after the thermoforming of the substrate 100, i.e., while the substrate 100 has a three-dimensional shape, the first portion A1 and the second portion A2 of the first outer side 111, and the first portion B1 and the second portion B2 of the second outer side 112 are formed.

[0105] Figure 6 yes Figure 4 A perspective view of the insulating layer shown.

[0106] like Figure 6 As shown, in this embodiment, prior to the thermoforming process, the remaining portions A3, A4, A5, B3, B4, B5, C, and D, excluding at least a portion A1, A2, B1, and B2 extending in the same direction as the grain direction, are cut by laser processing based on the grain direction of the insulating layer 110. Furthermore, after the thermoforming process, at least a portion of the outer surface extending in the same direction as the grain direction that was not removed by the laser is cut by applying shear stress along the grain direction.

[0107] Meanwhile, in another embodiment, with Figure 4 Unlike the first direction, the grains of insulating layer 110 can be along a second direction, such as... Figure 5 As shown.

[0108] In this case, the third outer surface 113 and the fourth outer surface 114 of the insulating layer 110 extend along a second direction that is the same as the grain direction of the insulating layer 110. In addition, the first outer surface 111 and the fourth outer surface 112 of the insulating layer 110 extend along a second direction that is different from the grain direction of the insulating layer 110.

[0109] Therefore, the first outer surface 111 and the second outer surface 112 can be formed by laser processing. Thus, the entire region A of the first outer surface 111 can be formed by laser, and therefore can have a first surface roughness. Similarly, the entire region B of the second outer surface 112 can be formed by laser, and therefore can have a first surface roughness corresponding to that of the first outer surface 111.

[0110] Meanwhile, the third outer surface 113 and the fourth outer surface 114 extend along a second direction that is the same as the grain direction of the insulating layer 110. Therefore, the third outer surface 113 and the fourth outer surface 114 can be formed by shear stress applied by a fixture.

[0111] However, as referenced Figure 4 As described, the entire area of ​​the third outer surface 113 and the fourth outer surface 114 can be formed by shear stress, or only a portion of it can be formed by shear stress.

[0112] For example, portions C1 and C2 of the third outer surface 113 and portions D1 and D2 of the fourth outer surface 114 enable the substrate 100 to be fixed to the support frame during the thermoforming process of the substrate 100. Therefore, portions C1 and C2 of the third outer surface 113 and portions D1 and D2 of the fourth outer surface 114 can be determined based on the dimensions that enable the substrate 100 to be fixed to the support frame.

[0113] Therefore, the third outer surface 113 in the embodiment may include a first portion C1 and a second portion C2, the first portion C1 and the second portion C2 being areas torn by shear stress applied by the fixture and having a second surface roughness. Additionally, the third outer surface 113 may include a third portion C3, a fourth portion C4, and a fifth portion C5, the third portion C3, the fourth portion C4, and the fifth portion C5 being areas laser-cut and having a first surface roughness different from the second surface roughness.

[0114] Additionally, the fourth outer surface 114 in the embodiment may include a first portion D1 and a second portion D2, the first portion D1 and the second portion D2 being areas torn by shear stress applied by the fixture and having a second surface roughness. Furthermore, the fourth outer surface 114 may include a third portion D3, a fourth portion D4, and a fifth portion D5, the third portion D3, the fourth portion D4, and the fifth portion D5 being areas laser-cut and having a first surface roughness different from the second surface roughness.

[0115] Simultaneously, before the thermoforming of the substrate 100, i.e., while the entire area of ​​the substrate 100 is flat, the entire area A of the first outer side 111, the entire area B of the second outer side 112, the third portion C3, the fourth portion C4, and the fifth portion C5 of the third outer side 113, and the third portion D3, the fourth portion D4, and the fifth portion D5 of the fourth outer side 114 are formed. Furthermore, after the thermoforming of the substrate 100, i.e., while the substrate 100 has a three-dimensional shape, the first portion C1 and the second portion C2 of the third outer side 113, and the first portion D1 and the second portion D2 of the fourth outer side 114 are formed.

[0116] As described above, prior to the thermoforming process, the remaining portion of the insulating layer 110, except for at least a portion of the outer surface extending in the same direction as the grain direction of the embodiment, is cut by laser processing based on the grain direction of the insulating layer 110. Furthermore, after the thermoforming process, at least a portion of the outer surface extending in the same direction as the grain direction of the embodiment that was not removed by the laser is cut by applying shear stress along the grain direction.

[0117] According to an embodiment, a substrate is manufactured using a support frame with a constant orientation throughout the region, and the support frame is laser-processed to form anchors around the substrate. In this case, the anchors can be formed only to separate the area on the support frame where the manufactured substrate is formed. At this time, the side surface of the anchor contacts the outer surface of the substrate. Then, when the 3D molding process of the substrate is completed, the interface between the anchor and the outer surface of the substrate is cut to separate the substrate.

[0118] In this embodiment, the side surface of the anchor connected to the outer side of the substrate extends along a first direction. In this case, the first direction corresponding to the extension direction of the anchor's side surface can correspond to the orientation of the support frame. That is, the support frame is a polymer with a nematic structure, where molecules are aligned in a specific direction, thus forming grains in the support frame corresponding to the direction of molecular alignment. Therefore, when forming the anchor, the portion of the outer side of the substrate except for the portion having the same extension direction as the support frame is laser-processed, so the anchor is formed only on the outer side of the substrate having the same extension direction as the support frame. Therefore, in this embodiment, the substrate can be easily separated by providing shear stress to the interface without performing alignment processes or additional laser or cutting processes for separating the substrate.

[0119] In addition, in the embodiments, after multiple modular products that require three-dimensional molding are formed on the support frame, anchors can be used to separate the modular products. Therefore, it is suitable for large-scale production of 3D molding and the molding difficulty can be reduced by reducing the residual stress that may be generated due to the support frame.

[0120] Furthermore, various modifications to the substrate according to the embodiments will be described below.

[0121] Figure 7 It is shown Figure 4 A plan view of the first modified example of the substrate shown. Figure 8 It is shown Figure 4 A plan view of a second modified example of the substrate shown.

[0122] Figure 4 The substrate in the middle has a square planar shape.

[0123] Alternatively, such as Figure 7 As shown, the planar shape of the substrate 200 can be circular. Preferably, the planar shape of the substrate 200 can be a circular shape with a constant curvature throughout, and has a linear shape in portions A1' and B1' extending along the direction corresponding to the grains of the insulating layer. In fact, the planar shape of the substrate 200 can be an elliptical shape in which portions A1' and B1' are straight lines.

[0124] The substrate may include an insulating layer 210 and a circuit pattern 220 disposed on the insulating layer 210. In addition, although not shown in the figure, at least one element may be disposed on the circuit pattern 220.

[0125] Meanwhile, portions A1' and B1' extending along the same direction as the grain direction of the insulating layer 210 on the outer surface of the insulating layer 210 have the second surface roughness as described above. Additionally, portions other than A1' and B1' have the first surface roughness as described above.

[0126] like Figure 7 As shown, the planar shape of the substrate in the first modified example is elliptical, so the entire region A1' and B1' of the outer side extending in the same direction as the grains of the insulating layer can have a second surface roughness.

[0127] Alternatively, such as Figure 8 As shown, the planar shape of the substrate 300 can be L-shaped.

[0128] The substrate may include an insulating layer 310 and a circuit pattern 220 disposed on the insulating layer 310. Additionally, at least one device 330 may be disposed on the circuit pattern 320. Furthermore, although not shown in the figures, a protective layer (not shown) may be disposed on the insulating layer 310.

[0129] Meanwhile, the insulating layer 310 may include an upper surface 311 and a first outer surface 312, a second outer surface 313, a third outer surface 314, a fourth outer surface 315, a fifth outer surface 316 and a sixth outer surface 317.

[0130] In this configuration, the first outer surface 312, the second outer surface 313, and the fourth outer surface 314 may extend along a first direction corresponding to the grain direction of the insulating layer 310. Additionally, the third outer surface 314, the fifth outer surface 315, and the sixth outer surface 316 may extend along a second direction different from the grain direction of the insulating layer 310.

[0131] Therefore, the first outer surface 312, the second outer surface 313, and the fourth outer surface 314 may include portions having the second surface roughness as described above. That is, the first portion E1, the second portion E2, the third portion E3, the fourth portion E4, the fifth portion E5, and the sixth portion E6 included in the first outer surface 312, the second outer surface 313, and the fourth outer surface 314 may have the second surface roughness.

[0132] In addition, the remaining portions of the first outer surface 312, the second outer surface 313, and the fourth outer surface 314, excluding the first portion E1, the second portion E2, the third portion E3, the fourth portion E4, the fifth portion E5, and the sixth portion E6, may have a first surface roughness that is different from the second surface roughness.

[0133] In the following, a method for manufacturing a substrate according to an embodiment will be described.

[0134] Figures 9 to 17 This is a cross-sectional view showing a method for manufacturing a substrate according to an exemplary embodiment, arranged in process order.

[0135] First, refer to Figure 9 A support frame 110 is prepared, which constitutes the insulating layer 110 of the substrate 100 and serves as the basis for manufacturing the substrate. At this time, the insulating layer 110 is part of the support frame, therefore, the insulating layer 110 and the support frame 110 are given the same reference numerals.

[0136] Grains can be formed within the support frame 110. Preferably, the support frame 110 can have a nematic structure. A nematic structure can refer to a state in which all molecules have the same and constant orientation. Therefore, due to the nematic structure, grains can be formed within the support frame 110 to correspond to the orientation of the molecules.

[0137] Preferably, the support frame 110 can be a polymer belonging to the class of p-hydroxybenzoic acid (benzoic acid having OH at the para position) and a monomer-based crystalline aromatic polyester based on p-hydroxybenzoic acid and related monomers.

[0138] Preferably, the support frame 110 may comprise a polymer material, such as vectron (a product obtained by melt spinning vectra) or Kevlar.

[0139] For example, the support frame 110 can be an anisotropic film of at least one of LCP (liquid crystal polymer) and HDPE (high-density polyethylene), but is not limited thereto. In other words, since the support frame 110 has a nematic structure, it can be any of a variety of films containing polymer materials in which the molecules are arranged in one and the same orientation.

[0140] Therefore, the load-bearing frame 110 can have the property of cutting along the grain by shear stress applied along the grain direction.

[0141] Next, as Figure 10 As shown, a circuit pattern 120 is formed on the support frame 110.

[0142] The circuit pattern 120 can be disposed on the support frame 110 to transmit electrical signals. However, the embodiments are not limited to this, and a layer corresponding to the circuit pattern 120 can be formed on the insulating layer 110, which can perform heat dissipation or signal shielding functions instead of electrical signal transmission functions.

[0143] The circuit pattern 120 can be formed from a metallic material with high electrical conductivity. Therefore, the circuit pattern 120 can be formed from at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Alternatively, the circuit pattern 120 can be formed from a paste or solder paste comprising at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Preferably, the circuit pattern 120 can be formed from copper (Cu), which has high electrical conductivity and is relatively inexpensive.

[0144] The circuit pattern 120 can be formed using additive processes, subtractive processes, modified semi-additive processes (MSAP), and semi-additive processes (SAP) which are common printed circuit board manufacturing processes; detailed descriptions of these processes are omitted here.

[0145] Next, as Figure 11 As shown, a device mounting process can be performed to attach device 130 to circuit pattern 120. Device 130 can be determined according to the application to which substrate 100 is applied.

[0146] Device 130 can be a passive device. For example, device 130 can be a passive device such as wiring, resistors, and chips. Device 130 can also be an active device. For example, device 130 can be an active device such as a multiplexer, an application-specific integrated circuit (ASIC), or a wireless communication module. In addition, device 130 may include optical devices (such as lenses or waveguides), magnetic devices, and electrochemical devices (such as batteries or enzyme sensors).

[0147] When the device is attached, a protective layer 140 is formed on the support frame 110.

[0148] A protective layer 140 may be disposed on the support frame 110 to protect the exposed surfaces of the support frame 110 corresponding to the substrate area, circuit pattern 120, and device 130. Therefore, the height of the protective layer 140 may be greater than the height of the device 130, so the circuit pattern 120 and device 130 may be embedded in the protective layer 140, but is not limited thereto.

[0149] Therefore, the protective layer 140 may comprise an epoxy acrylate-based resin. For example, the protective layer 140 may comprise a resin, curing agent, photoinitiator, pigment, solvent, filler, additive, acrylic monomer, etc. However, the embodiments are not limited thereto, and the protective layer 140 may be any of a solder resist (SR), a cover layer, and a polymer material.

[0150] Next, as Figure 12 As shown, an opening region OR is formed through the upper and lower surfaces of the support frame 110.

[0151] The upper surface can be selectively formed depending on the application to which the substrate is applied, and its shape can also be selectively changed.

[0152] Next, as Figure 13 As shown, a process of sorting the substrates formed on the upper surface of the support frame 110 can be performed for each unit.

[0153] In other words, such as Figure 14 As shown, not only can a substrate corresponding to one unit be manufactured on a support frame 110, but multiple substrates corresponding to multiple different units can also be manufactured simultaneously.

[0154] Therefore, the process of sorting each substrate corresponding to each unit can be performed by laser processing the outer area of ​​each unit.

[0155] In this case, in the embodiments, laser processing can be performed only on the remaining areas except for some regions, rather than on the entire outer area of ​​each unit.

[0156] For example, in one embodiment, an anchor 100A capable of supporting each unit is formed on the support frame 110 by removing a portion of the outer region of each unit. The anchor 100A is part of the support frame 110. In this case, the anchor 100A may have a shape in which the width gradually increases from one end to the other. For example, the anchor 100A may have a trapezoidal shape. In this case, the anchor 100A includes an end opposite to the end that contacts the exterior of each substrate portion, and the width may gradually increase from one end to the other.

[0157] At this time, the support frame 110 may include a first substrate portion 100 corresponding to the first unit, a second substrate portion 200 corresponding to the second unit, and a third substrate portion 300 corresponding to the third unit.

[0158] Furthermore, the anchor 100A in the embodiment can be formed in the outer region of the first substrate portion 100, the second substrate portion 200 and the third substrate portion 300 by continuing the process of removing the remaining parts except for the anchor 100A.

[0159] Preferably, the first anchor 110A1, the second anchor 110A2, the third anchor 110A3, and the fourth anchor 110A4 can be formed on the outer side of the first substrate portion 100. Additionally, the fifth anchor 110A5 and the sixth anchor 110A6 can be formed on the outer side of the second substrate portion 200. Furthermore, the seventh anchor 110A7, the eighth anchor 110A8, the ninth anchor 110A9, the tenth anchor 110A10, the eleventh anchor 110A11, and the twelfth anchor 110A12 can be formed on the outer side of the third substrate portion 300.

[0160] In this configuration, the first anchor 110A1 to the twelfth anchor 110A12 can be disposed in the outer region of each substrate portion corresponding to the grain direction of the support frame 110. In other words, the outer region of the substrate portion can include a first region extending in the same direction as the grain direction of the support frame 110 and a second region other than the first region. Furthermore, the first anchor 110A1 to the twelfth anchor 110A12 can be formed only in the first region, excluding the second region. Moreover, the first anchor 110A1 to the twelfth anchor 110A12 can be formed over the entire first region, and unlike the first anchor, they can be formed only over a portion of the first region.

[0161] Next, as Figure 15 As shown, in the state of forming the first anchor 110A1 to the twelfth anchor 110A12, each substrate portion is thermoformed into a three-dimensional shape corresponding to the application.

[0162] Next, as Figure 16 As shown, clamps 400 are used to apply shear stress to the anchors of each substrate to separate each substrate from the support frame 110.

[0163] At this time, as Figure 17As shown, the clamp 400 does not apply a constant shear stress in the height direction (H) at a 90-degree angle to the bottom of the anchor, but instead rises diagonally in the height direction to apply shear stress (F). Each anchor 100A includes one end 110A' and the other end 110A'". Furthermore, the clamp 400 does not simultaneously apply shear stress to the entire area of ​​the lower surface of the anchor 100A, but preferentially contacts one end 110A' to preferentially apply shear stress (F) to that end 110A', thus providing shear stress sequentially in the direction of the other end 110A'".

[0164] Each substrate portion manufactured in this manner may include an outer surface. An outer surface refers to a side surface located outside the substrate 100; for example, the substrate 100 may include the outer surface of an insulating layer 110 and the outer surface of a protective layer 140. In this case, the entire area of ​​the outer surface of the protective layer 140 may have a uniform surface roughness. Here, the insulating layer 110 is part of the support frame 110 and may refer to a portion of the support frame 110 that constitutes each substrate portion within the entire area of ​​the support frame 110.

[0165] Meanwhile, based on the grain orientation of the insulating layer 110, the outer surface of the insulating layer 110 may include a region with a first surface roughness and a region with a second surface roughness, the second surface roughness being different from the first roughness. In this case, the portion with the first surface roughness is the portion removed by laser processing, and the portion with the second surface roughness is the portion where the anchor is located.

[0166] According to an embodiment, a substrate is manufactured using a support frame with a constant orientation throughout the region, and the support frame is laser-processed to form anchors around the substrate. In this case, the anchors can be formed only to separate the area on the support frame where the manufactured substrate is formed. At this time, the side surface of the anchor contacts the outer surface of the substrate. Then, when the 3D molding process of the substrate is completed, the interface between the anchor and the outer surface of the substrate is cut to separate the substrate.

[0167] In this embodiment, the side surface of the anchor connected to the outer side of the substrate extends along a first direction. In this case, the first direction corresponding to the extension direction of the anchor's side surface can correspond to the orientation of the support frame. That is, the support frame is a polymer with a nematic structure, where molecules are aligned in a specific direction, thus forming grains in the support frame corresponding to the molecular alignment direction. Therefore, when forming the anchor, the portion of the outer side of the substrate except for the portion having the same extension direction as the support frame is laser-processed, so the anchor is formed only on the outer side of the substrate having the same extension direction as the support frame. Therefore, in this embodiment, the substrate can be easily separated by providing shear stress to the interface without performing alignment processes or additional laser or cutting processes for separating the substrate.

[0168] In addition, in the embodiments, after multiple modular products that require three-dimensional molding are formed on the support frame, anchors can be used to separate the modular products. Therefore, it is suitable for large-scale production of 3D molding and the molding difficulty can be reduced by reducing the residual stress that may be generated due to the support frame.

[0169] The features, structures, and effects described in the above embodiments are included in at least one embodiment, and are not necessarily limited to one embodiment. Furthermore, those skilled in the art to which this invention pertains may combine or modify the features, structures, and effects described in each embodiment with respect to other embodiments. Therefore, anything relating to such combinations and variations should be interpreted as being included within the scope of the embodiments.

[0170] The above description mainly focuses on the embodiments, but these are merely examples and do not limit the invention. Those skilled in the art will understand that various modifications and applications, not shown above, can be made without departing from the basic characteristics of these embodiments. For example, the various components specifically shown in the embodiments can be implemented through modifications. Furthermore, differences related to these modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

1. A substrate, comprising: An insulating layer having grains extending along a first horizontal direction; as well as The circuit pattern is set on the insulating layer. The insulating layer includes an upper surface and an outer surface extending from the upper surface and disposed circumferentially along the upper surface. Wherein, the outer surface of the insulating layer includes: The first outer surface and the second outer surface face each other in a second horizontal direction perpendicular to the first horizontal direction; and The third and fourth outer surfaces are connected to the first and second outer surfaces and face each other in the first horizontal direction. Each of the first outer surface and the second outer surface includes a first portion having a first surface roughness and a second portion having a second surface roughness different from the first surface roughness. Wherein, the first portion of the first outer side and the first portion of the second outer side overlap each other along the second horizontal direction.

2. The substrate according to claim 1, wherein, The insulating layer comprises a polymer material having grains disposed along the first horizontal direction.

3. The substrate according to claim 2, wherein, The insulating layer comprises a polymer having a nematic structure.

4. The substrate according to claim 2, wherein, The insulating layer comprises liquid crystal polymer, i.e., LCP, or high-density polyethylene, i.e., HDPE.

5. The substrate according to claim 2, wherein, The grains of the polymer material are exposed through the first outer side to the fourth outer side of the insulating layer.

6. The substrate according to claim 5, wherein, The grains of the polymer material exposed through the first and second outer surfaces have different shapes than the grains of the polymer material exposed through the third and fourth outer surfaces.

7. The substrate according to claim 5, wherein, The orientation of the grains of the polymer material exposed through the first and second outer surfaces is different from the orientation of the grains of the polymer material exposed through the third and fourth outer surfaces.

8. The substrate according to claim 1, wherein, Each of the third outer surface and the fourth outer surface has the second surface roughness in its entirety.

9. The substrate according to claim 1, wherein, At least a portion of each of the second portion of the first outer surface, the second portion of the second outer surface, the third outer surface, and the fourth outer surface is provided with carbon.

10. The substrate according to claim 1, further comprising: At least one device is disposed on the circuit pattern.

11. The substrate according to claim 1, further comprising: A protective layer is disposed on the insulating layer and covers the surface of the insulating layer and the surface of the circuit pattern.

12. The substrate according to claim 1, wherein, The insulating layer includes a flat region and a curved region that bends vertically from the flat region.

13. The substrate according to claim 12, wherein, The curved region includes: A first curved region, curving from one end of the flat region along the vertical direction at a first inclination; and The second curved region bends from the other end of the flat region along the vertical direction at a second inclination different from the first inclination.

14. The substrate according to claim 12, wherein, The flat region includes a first flat region and a second flat region, and the curved region is disposed between the first flat region and the second flat region. The first flat region and the second flat region are located on different planes.

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