Method for forming grooves in a metal surface
By using a multi-step laser etching method and an adaptive optics system to precisely process grooves on metal surfaces, the problem of low processing efficiency of CNC milling machines has been solved, achieving efficient and precise groove forming, which is suitable for mass production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LCFC HEFEI ELECTRONICS TECH
- Filing Date
- 2026-03-12
- Publication Date
- 2026-06-05
AI Technical Summary
In existing technologies, CNC milling machines for machining grooves in metal casings suffer from problems such as low efficiency, high energy consumption, inability to machine sharp corners, high material consumption, and high product defect rate, making them difficult to adapt to large-scale, high-efficiency production.
A multi-step laser etching method is employed, which involves adjusting laser parameters, including pulse width, peak power, and repetition frequency, and combining them with an adaptive optics system to precisely process grooves on metal surfaces. This includes basic depth, depth finishing, and edge optimization, and high-precision control is achieved using a single-mode fiber laser and an adaptive optics system.
It achieves efficient and precise metal surface grooving, improves processing efficiency, reduces energy consumption, and ensures the verticality and surface roughness of the grooves, making it suitable for mass production.
Smart Images
Figure CN122142552A_ABST
Abstract
Description
Technical Field
[0001] This application relates to metal surface groove forming technology, and more particularly to a method for forming metal surface grooves. Background Technology
[0002] Metallization of electronic product casings has become widespread, effectively improving product performance and aesthetics, and allowing for the placement of markings (such as product trademarks and warning labels) on the metal surface. To ensure consistent product appearance, grooves can be pre-formed on the metal casing, and a glossy layer can be applied within these grooves to prevent markings from protruding from the metal surface and ensure overall flatness.
[0003] When forming grooves, CNC milling is a common solution. Grooves are milled into the metal shell using CNC machining. However, this process has obvious shortcomings: such as low processing efficiency, high power consumption, and inability to process grooves with sharp corners. It also has problems such as large material consumption, easy liquid contamination, high product defect rate, and high overall unit production cost, making it difficult to adapt to the needs of large-scale and efficient production. Summary of the Invention
[0004] To address at least the above-mentioned technical problems existing in the prior art, this application provides a method for forming grooves on a metal surface.
[0005] This application provides a method for forming a metal surface trench, used to form a trench with a predetermined shape on a metal surface. The method includes: a laser operating with a first parameter to perform laser etching on the metal surface to remove a portion of the material on the metal surface, thereby forming a basic depth of the trench; the laser performing laser etching on the bottom of the trench with a second parameter to remove a portion of the material at the bottom of the trench, thereby processing the trench to a predetermined depth; and the laser performing laser etching on the sidewalls of the trench with a third parameter to remove protruding structures on the sidewalls of the trench; wherein the pulse width value in the first parameter is greater than the pulse width values in the second and third parameters.
[0006] In some embodiments, the method further includes: acquiring surface parameter information of the trench sidewalls and / or bottom, and adjusting the frequency pulse width, peak power and repetition frequency of the laser according to the surface parameter information, so as to control the surface parameter information within a set range.
[0007] In some embodiments, the surface parameter information includes surface roughness information; the setting range of the surface roughness information is less than or equal to 0.8 micrometers.
[0008] In some embodiments, the method further includes: determining the movement path of the laser based on the shape of the trench; establishing a matching relationship between corner delay, on-time delay, off-time delay, end delay, and jump delay based on the geometric features of the movement path and the on / off timing of the laser; and configuring the on / off timing of the laser with the goal of the actual laser energy application position of the laser coinciding with the trajectory of the movement path.
[0009] In some embodiments, the method further includes: performing basic depth, set depth processing, or removal of protrusion structures on the metal surface, the bottom of the trench, and / or the sidewalls of the trench by multiple laser etching operations to achieve the basic depth of the trench, the depth of the trench, or the removal of protrusion structures.
[0010] In some embodiments, the laser includes a single-mode fiber laser; the beam quality factor of the single-mode fiber laser is less than or equal to 1.2.
[0011] In some embodiments, the laser further includes an adaptive optics system comprising a wavefront sensor and a deformable mirror; the adaptive optics system is used to correct wavefront distortion of the laser beam of the single-mode fiber laser.
[0012] In some embodiments, the pulse width of the laser beam emitted by the laser ranges from 10 nanoseconds to 800 nanoseconds.
[0013] In some embodiments, the peak power of the laser beam emitted by the laser is 2 kW to 20 kW.
[0014] In some embodiments, the laser beam emitted by the laser has a spot diameter ranging from 0.004 mm to 0.02 mm.
[0015] This application provides a method for forming grooves on a metal surface. First, a basic depth of groove is formed on the metal surface. Then, the groove is further refined according to design requirements, processing it to a predetermined depth. Finally, the edges of the groove are optimized, removing protruding structures and improving its flatness. A three-step laser etching method is used to form the groove on the metal surface. In different steps, by adjusting the laser parameters, refined processing can be achieved, such as increasing the peak power of the laser beam. Short pulse widths are used for depth processing, while long pulse widths are used for fine-tuning. This technical solution, through multi-step laser etching, ensures processing efficiency while simultaneously guaranteeing the perpendicularity, surface roughness, shape, and dimensional accuracy of the groove. Attached Figure Description
[0016] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings. Several embodiments of this application are illustrated in the drawings by way of example and not limitation, in which:
[0017] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
[0018] Figure 1 A schematic flowchart of a metal surface trench forming method provided in an embodiment of this application; Figure 2 This is a graph showing the relationship between quality factor and roughness in the metal surface trench forming method provided in the embodiments of this application; Figure 3 The graph shows the relationship between pulse width, peak power, and material removal rate in the metal surface trench forming method provided in the embodiments of this application. Detailed Implementation
[0019] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0020] This application provides a method for forming grooves on a metal surface, which is used to form grooves with a set shape on a metal surface. Taking a laptop as an example, a groove is formed on the surface of the metal shell to serve as a logo. This method for forming grooves on a metal surface is different from the single laser etching forming in the prior art, and can effectively ensure the processing quality of the grooves.
[0021] The following provides a detailed description of each step of the metal surface trench forming method provided in the embodiments of this application.
[0022] like Figure 1 As shown, this application provides a method for forming grooves on a metal surface. Through multiple steps, grooves of a predetermined shape are formed on the surface of a metal material. The predetermined shape can be understood as a pre-designed outline shape of the groove. The method includes the following steps: Step S10: Trench Forming. The laser performs laser etching on the metal surface with the first parameter to remove part of the material on the metal surface, thereby forming the basic depth of the trench. In step S10, the "rough machining" operation of the trench is performed. Under the action of the first parameter, the laser completes the processing of the shape and basic depth of the trench.
[0023] For example, the depth of the groove ranges from 0.01 mm to 0.5 mm. The basic depth processing can be understood as moving the laser along a set path. The depth of the groove formed by the laser is slightly less than the set groove depth. For example, if the set depth of the groove is 0.5 mm, the basic depth of the groove can be processed to 0.4 mm during step S10. The remaining part is completed in subsequent steps.
[0024] In step S10, the first parameters of the laser include laser etching rate, laser etching power, laser etching frequency, and pulse width. High energy accumulation with long pulse width can be used to quickly form trenches with a basic depth on the metal surface.
[0025] Step S20: Trench depth processing. The laser performs laser etching on the bottom of the trench using the second parameter to remove part of the material at the bottom of the trench, thereby processing the trench to a set depth. Step S20 can be understood as fine processing of the bottom of the trench, processing the trench to a set depth and achieving a certain degree of flatness.
[0026] If the set depth of the groove is 0.5 mm, the groove depth is processed to 0.4 mm during step S10. In step S20, the bottom of the groove is finely processed until the groove depth is 0.5 mm. During fine processing, the depth and flatness of the bottom of the groove are increased.
[0027] In step S20, the second parameters of the laser include laser etching speed, laser etching power, laser etching frequency, and pulse width. Compared with the first parameter, the second parameter uses a short pulse width to reduce the influence of temperature on the trench. The faster laser etching speed can shorten the dwell time of the laser at the same position, making the total energy of a single point controllable. The laser etching frequency is slightly lower than the laser etching frequency of the first parameter, resulting in a more uniform distribution of laser points, which is conducive to precise control of depth consistency.
[0028] Step S30: Trench edge optimization. The laser performs laser etching on the sidewalls of the trench using a third parameter to remove the protruding structures on the trench sidewalls. During the edge optimization process, after the fine processing of the bottom of the trench is completed, the sidewalls, bends, or corners of the trench are further finely processed. During the processing in steps S10 and S20, there are protruding structures on the sidewalls (making the sidewalls uneven), which affects the flatness of the trench sidewalls. By optimizing the edges with the third parameter using a laser, a trench with flat sidewalls is obtained.
[0029] In step S30, the third parameter of the laser includes laser etching speed, laser etching power, laser etching frequency, and pulse width. The pulse width of the third parameter is smaller than the pulse width of the first parameter and slightly larger than the pulse width of the second parameter. This reduces the influence of temperature on the trench and ensures the precision of the processing. The laser etching speed of the third parameter is the smallest, which can extend the dwell time of the laser edge and ensure processing accuracy. In addition, it can be combined with laser switching timing control to control the timing of the laser switching delay and calibrate the laser timing control (see the description below for specific methods) to make the edge transition of the trench more natural.
[0030] In the technical solution of this application, the method for forming grooves on a metal surface optimizes the processing steps of the grooves and the laser beam parameters of each step, while simultaneously optimizing the laser structure. Specifically: A single-mode fiber laser and an adaptive optics system were used to control the quality factor M² to ≤1.2, approaching the characteristics of a fundamental Gaussian beam. Specifically, the single-mode fiber laser was ytterbium-doped (Yb³⁺). + A single-mode fiber with a core diameter ≤10μm and a numerical aperture (NA) ≤0.12 is used as the gain medium. A 976nm single-mode laser diode (LD) is used as the pump source. The pump light is injected into the gain fiber through a fiber combiner. A fiber Bragg grating (FBG) is used as the resonant cavity mirror. A pair of FBGs are used as a high reflector (HR) and an output coupler (OC), respectively. The output end is connected to an aspherical collimating lens (Thorlabs C230TME-B) with a focal length of 8mm. The collimated beam diameter is about 2mm.
[0031] The adaptive optics system includes a wavefront sensor (Shack-Hartmann type) and a deformable mirror. The wavefront sensor has a microlens array with a spacing of 150 μm and a charge-coupled device (CCD) with a resolution of 1280×1024. The laser beam is sampled to the sensor via a beam splitter. The beam splitter sampling can be interpreted as extracting a portion of the beam from the main laser beam as a probe beam for wavefront detection without affecting the transmission and application of the main beam. The microlens array divides the wavefront into sub-regions to discretize the incident wavefront into multiple sub-apertures, enabling distributed measurement of the wavefront slope and providing raw data for wavefront reconstruction. The CCD detects the displacement of each sub-spot, calculates the wavefront slope, reconstructs the wavefront phase map, and obtains the aberration distribution. This provides the spatial distribution, aberration type, and magnitude of the wavefront distortion, providing a basis for the correction of the deformable mirror and achieving accurate wavefront correction. The deformable mirror is driven by piezoelectric ceramics. For example, the deformable mirror contains 37 independently controllable piezoelectric ceramic actuators, forming 37 channels with a surface shape adjustment range of ±5μm. The deformable mirror receives data from a wavefront sensor, and the control unit calculates the voltage of each channel. Based on the aberration distribution measured by the wavefront sensor, the control unit calculates the required driving voltage for each channel and applies it to the piezoelectric ceramic, causing a slight deformation. This causes a corresponding deformation of the deformable mirror surface, compensating for the wavefront distortion of the incident laser. The entire closed-loop circuit of detection → calculation → driving → correction completes at least 100 full iterations per second. The control algorithm of the adaptive optics system is based on PID (Proportional-Integral-Derivative) + Zernike polynomial fitting. Zernike polynomials are used to decompose aberrations (such as defocus, astigmatism, and coma). The PID adjusts the voltage of each channel in real time. The objective function is M²≤1.2, i.e.:
[0032] Where D0 is the beam waist width, λ is the wavelength, and n is the refractive index of the medium. By adjusting the resonant cavity parameters (such as cavity length and output coupling mirror curvature) and the collimating lens group (adjusting the distance between two or more lenses and the overall axial position), higher-order mode oscillations are suppressed, the far-field divergence angle is reduced, and energy is ensured to be concentrated and uniformly distributed, thereby achieving rapid material removal (high energy density) and smooth texture (low thermal diffusion). For example, sidewall thermal damage can be reduced, and texture roughness can be reduced by 40%.
[0033] like Figure 2 As shown, the correlation between the laser beam quality factor (M²) and the surface roughness (Ra) after processing is demonstrated. The two measured points correspond to the positions of M²≈1.1 and M²≈1.2, respectively. The roughness values are in complete agreement with the trend of the theoretical curve, which verifies the rationality of the quality factor setting.
[0034] In this embodiment, a MOPA (Master Oscillator Power Amplifier) structure is adopted. The seed source of the MOPA structure uses a distributed feedback laser diode (DFB-LD) with a wavelength of 1064 nm, a pulse width adjustable within the range of 10–800 ns, and a repetition frequency of 1–100 kHz. The modulator uses an electro-optic modulator (EOM) based on lithium niobate (LiNbO3) crystal, with a half-wave voltage of 5 V and a bandwidth of 200 MHz. The preamplifier uses a single-mode ytterbium-doped fiber amplifier (YDFA) with a pump power of 10 W and a gain of 20 dB. The main amplifier uses double-clad ytterbium-doped fiber (DC-YDF) with a core diameter of 25 μm, a pump power of 500 W, and a gain of 30 dB. Thermal management employs a water-cooled heat sink and a thermoelectric cooler. By combining the Cooler and TEC, the temperature control accuracy can reach ±0.1℃.
[0035] Based on the MOPA structure, the pulse width can be continuously adjusted from 10 to 800 ns. The short pulse width range (10-200 ns) is used for fine engraving (low thermal effect), while the long pulse width range (200-800 ns) is used for deep engraving (high energy accumulation).
[0036] In this embodiment, several key measures are taken to enhance and protect peak power: Highly doped fiber is used, with ytterbium doping concentration increased to ≥1000ppm and core absorption coefficient increased to ≥3dB / m, effectively improving energy extraction efficiency and achieving higher output at the same pump power; a (6+1)×1 pump combiner, specifically a fiber combiner with six pump ports, one signal port, and one output port, can couple multiple pump lasers and signal light into the gain fiber, increasing pump light injection power and achieving higher energy conversion; an optical isolator with ≥30dB isolation and a 90:10 beam splitter are added at the output end to prevent reflected light feedback from damaging the laser and to achieve power monitoring through beam splitting; a closed-loop control method combining TEC (thermal energy cooler) and water cooling is used to adjust the heat dissipation power in real time according to the output power, maintaining the fiber temperature stably at 20±2℃ and avoiding thermally induced mode instability.
[0037] By optimizing the fiber doping concentration and pump source efficiency, the peak power was increased to 20kW while ensuring laser safety. The high peak power (20kW) combined with the short pulse width (10ns) enables micron-level material removal precision. By combining a dynamic cooling system (such as thermoelectric cooling) and a redundant optical path design (multi-stage mirror beam splitting), crystal and fiber damage was avoided, extending the laser lifetime by 50%.
[0038] In this embodiment, the trench forming, trench depth processing, and / or trench edge optimization steps can be completed through multiple laser etching processes to achieve the basic depth of the trench, the processing of the set depth, and the removal of protruding structures. That is, the metal surface trench forming method mainly includes steps S10 to S30, and each step is not limited to a single laser etching; multiple laser etching processes can also be used to complete the corresponding steps.
[0039] In different laser etching operations, the parameters of the laser may not be exactly the same. For example, when performing the trench forming step, the basic depth of the trench is processed by multiple laser etchings. During multiple laser etchings, the first parameter can be finely adjusted for trench depth information, but it is still within the overall range of the first parameter.
[0040] In this embodiment of the application, the method for forming metal surface trenches further includes: collecting surface parameter information of the trench sidewalls and / or bottom, and adjusting the pulse width, peak power and repetition frequency of the laser according to the surface parameter information, so as to adjust the surface parameter information within a set range, thereby achieving parameter coordinated control.
[0041] For example, surface parameter information includes surface roughness information; the setting range for surface roughness information is less than or equal to 0.8 micrometers.
[0042] For example, the operation flow of the parameter collaborative control model is as follows: First, input the processing requirements, including depth D, roughness Ra, and material type (such as 6061 aluminum); then call the model library, according to the formula v=k1·(P peak / τ)+k2·f+k3·M 2 With Ra = k4·τ + k5·v + k6·P peak Calculations are performed, where k1 to k6 are material correlation coefficients, which are related to the thermal properties and optical absorption characteristics of the processed material, and are used to establish a quantitative mapping relationship between processing parameters and depth and roughness; where: pulse width τ refers to the duration of a single laser pulse; peak power P peak The pulse width τ refers to the instantaneous maximum power of a single pulse; the frequency f refers to the number of laser pulse repetitions per unit time; the scanning speed v refers to the speed at which the laser moves relative to the material surface; and the pulse width τ and peak power P are also mentioned. peakFrequency f and scanning speed v are key process parameter combinations automatically matched and output by the parameter collaborative control model based on processing depth, surface roughness, and material properties. During processing, a confocal sensor monitors the depth and roughness in real time, enabling dynamic adjustment of parameters. By adjusting the parameter combination in real time, the processing speed is increased by more than 30% while ensuring a roughness Ra ≤ 0.8 μm.
[0043] like Figure 3 As shown, the effect of peak power on material removal rate under different laser pulse widths is illustrated: the horizontal axis represents peak power (unit: W), the vertical axis represents material removal rate (unit: mm³ / s), and the three curves correspond to three laser pulse widths of 10ns, 100ns, and 500ns, respectively. Figure 3 As shown, the material removal rate increases linearly with the increase of peak power. At the same peak power, the longer the laser pulse width, the higher the material removal rate. For example, when the peak power is 20W, the removal rate corresponding to a 500ns pulse width is close to 20mm³ / s, a 100ns pulse width is about 10mm³ / s, and a 10ns pulse width is only about 4mm³ / s. As can be seen from the figure, both the laser pulse width and the peak power have a significant impact on the material removal efficiency, and a longer pulse width and a higher peak power help to improve the material removal rate.
[0044] In this embodiment of the application, by optimizing the design of the laser optical path, the diameter of the laser beam emitted by the laser is in the range of 0.004 mm to 0.02 mm.
[0045] In this embodiment of the application, the method for forming grooves on a metal surface further includes: determining the moving path of the laser according to the shape of the groove. The shape of the groove is preset. Different types of grooves have different moving paths, including linear movement, arc movement, or corner movement.
[0046] Based on the geometric features of the movement path and the laser switching timing of the laser, a matching relationship is established between corner delay, light-on delay, light-off delay, end delay, and jump delay. Based on the geometric features of the movement path and the laser switching response characteristics, various delay parameters are matched and jointly optimized to ensure that the laser emission / light-off timing is precisely synchronized with the movement position, ensuring that the laser energy application position completely coincides with the preset movement trajectory, thereby improving the processing positioning accuracy and morphology quality.
[0047] For example, the corner delay range is 0 to 500 microseconds, the light-on delay range is -300 to 100 microseconds, the light-off delay range is 0 to 400 microseconds, the end delay range is -100 to 100 microseconds, and the jump delay range is 10 to 20,000 microseconds.
[0048] For example, by combining the above parameter ranges for actual timing matching: when the laser scan processes to a corner of the path, to avoid overburning at the corner due to asynchronous motion deceleration and laser response, a corner delay of 100μs can be set at the direction switching point; to ensure accurate laser emission at the moment of motion initiation and to compensate for the response lag between motion and the laser, a laser-on delay of -50μs is configured to enable the laser to turn on in advance; at the end of a single processing trajectory, to avoid over-etching at the endpoint due to laser-off lag, a laser-off delay of 150μs is set; to ensure accurate trajectory completion, an end delay of 20μs is configured; when the laser jumps to the next processing area during an empty stroke, a jump delay of 5000μs is set to prevent accidental laser emission during the jump. Through the coordinated configuration and matching of the above delay parameters within their reasonable ranges, precise synchronization between the laser switching timing and the motion path can be achieved.
[0049] In this embodiment, by using a continuous gapless filling path calculation algorithm and optimizing the corner delay, light-on delay, light-off delay, end delay, and jump delay between the laser and the execution system, the accuracy and efficiency of laser processing can be effectively improved.
[0050] The following describes the metal surface groove forming method provided in this embodiment of the invention in detail, taking the surface processing of markings on a laptop casing as an example. If the laptop casing is made of aluminum alloy or aluminum-magnesium alloy, the method will be described in detail.
[0051] After the metal casing has completed its initial processing, it enters the trenching process, which uses laser etching to form the trench. The laser etching process is mainly divided into three stages.
[0052] The first stage is used to process the groove to the basic depth, not the final depth. The laser etching speed is set to 1200-1400mm / s. A medium speed allows the laser energy to fully act on the material, forming the basic depth of the logo. The laser etching power is maintained at 80-90%. High power provides sufficient energy to meet the energy requirements of deep carving. The laser etching frequency is 55-70KHz. The high frequency brings higher pulse density, improving processing efficiency and depth uniformity. The Q-switching pulse width is 400-600ns. The longer pulse width allows energy to be fully deposited inside the material, adapting to the processing requirements of basic deep carving. The laser-on delay is 0μs, and the laser will start in time with the scan to ensure the integrity of the beginning of the line. The laser-off delay is 140-180μs, which extends the laser off time to avoid missing segments or broken lines at the end. The end delay is 0μs, and the laser stops outputting immediately after the trajectory ends, without generating excess energy. The corner delay is 40-60μs, which briefly replenishes energy at the corner to prevent uneven depth at the corner position due to speed changes.
[0053] The second stage is used for fine processing of the bottom of the trench, processing the trench to the final depth. The laser etching speed is increased to 1800-2200mm / s. The high speed can shorten the dwell time of the laser at a single point and precisely control the correction depth. The laser etching power is still 80-90%, and the high power ensures sufficient energy support for depth correction. The laser etching frequency is 40-60KHz. The medium and low frequency makes the pulse distribution more uniform and improves the consistency of the overall depth. The Q-switching pulse width is 80-120ns. The short pulse width has a small heat-affected zone and can finely correct the depth deviation after the first-order processing. The light-on delay is 0μs, and the laser accurately matches the scanning trajectory to ensure that the corrected lines are aligned with the original trajectory. The light-off delay is 140-180μs to maintain the integrity of the line ending and avoid the occurrence of breakpoints during the correction process. The end delay is 0μs, and the light stops as soon as the trajectory ends, with no additional energy residue. The corner delay is 40-60μs to ensure the consistency of the depth correction effect at the corner and prevent the problem of local being too shallow or too deep.
[0054] The third stage is used for edge optimization of the trenches, removing protruding structures (ridges) from the sidewalls of the trenches. The laser etching speed is reduced to 300-600 mm / s, and the low speed extends the dwell time of the laser at the edge, achieving fine edge polishing; the laser etching power is 80-90%, with high power meeting the energy requirements for edge optimization; the laser etching frequency is 20-40 kHz, with low frequency allowing for a larger pulse interval, avoiding overburning and burrs at the edges due to excessive energy; the Q-switching pulse width is 160-2... 40ns, a medium-short pulse width that balances processing precision and edge shaping effect; -100~-160μs on-light delay, negative delay allows the laser to start early, making the edge lines transition more naturally and eliminating harsh interfaces; 80-100μs off-light delay, shortening the laser off time, further avoiding edge overheating and burr formation; 0μs end delay, the laser stops immediately after the trajectory ends, with no excess energy output; 40-60μs corner delay, finely polishing corner edges, making the corners more rounded and burr-free.
[0055] This application provides a method for forming grooves on a metal surface. First, a basic depth of groove is formed on the metal surface. Then, the groove is further refined according to design requirements, processing it to a predetermined depth. Finally, the edges of the groove are optimized, removing protruding structures and improving its flatness. A three-step laser etching method is used to form the groove on the metal surface. In different steps, by adjusting the laser parameters, refined processing can be achieved, such as increasing the peak power of the laser beam. Short pulse widths are used for depth processing, while long pulse widths are used for fine-tuning. This technical solution, through multi-step laser etching, ensures processing efficiency while simultaneously guaranteeing the perpendicularity, surface roughness, shape, and dimensional accuracy of the groove.
[0056] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.
[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0058] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for forming grooves on a metal surface, characterized in that, The method for forming grooves of a predetermined shape on a metal surface includes: The laser operates with a first parameter to perform laser etching on the metal surface, removing part of the material on the metal surface to form the basic depth of the trench; The laser performs laser etching on the bottom of the trench using a second parameter to remove part of the material at the bottom of the trench, thereby processing the trench to a set depth; The laser performs laser etching on the sidewall of the trench using a third parameter to remove the protruding structure on the sidewall of the trench. Wherein, the pulse width value in the first parameter is greater than the pulse width values in the second parameter and the third parameter.
2. The method for forming metal surface grooves according to claim 1, characterized in that, The method further includes: Surface parameter information of the trench sidewalls and / or bottom is collected, and the frequency pulse width, peak power and repetition frequency of the laser are adjusted according to the surface parameter information to control the surface parameter information within a set range.
3. The method for forming metal surface grooves according to claim 2, characterized in that, The surface parameter information includes surface roughness information; The surface roughness information is set within a range of less than or equal to 0.8 micrometers.
4. The method for forming metal surface trenches according to claim 1, characterized in that, The method further includes: The movement path of the laser is determined according to the shape of the trench; Based on the geometric features of the moving path and the switching timing of the laser, a matching relationship is established between corner delay, light-on delay, light-off delay, end delay, and jump delay. The switching timing of the laser is configured with the goal of the actual laser energy application position of the laser coinciding with the trajectory of the moving path.
5. The method for forming metal surface grooves according to claim 1, characterized in that, The method further includes: The basic depth, set depth processing, or removal of protruding structures of the trench is achieved by multiple laser etching operations on the metal surface, the bottom of the trench, and / or the sidewalls of the trench.
6. The method for forming metal surface grooves according to any one of claims 1 to 5, characterized in that, The laser includes a single-mode fiber laser; The beam quality factor of the single-mode fiber laser is less than or equal to 1.
2.
7. The method for forming metal surface grooves according to claim 6, characterized in that, The laser also includes an adaptive optics system, which includes a wavefront sensor and a deformable mirror. The adaptive optics system is used to correct the wavefront distortion of the laser beam from the single-mode fiber laser.
8. The method for forming metal surface grooves according to any one of claims 1 to 5, characterized in that, The laser beam emitted by the laser has a pulse width ranging from 10 nanoseconds to 800 nanoseconds.
9. The method for forming metal surface grooves according to any one of claims 1 to 5, characterized in that, The laser beam emitted by the laser has a peak power of 2 kilowatts to 20 kilowatts.
10. The method for forming metal surface grooves according to any one of claims 1 to 5, characterized in that, The laser beam emitted by the laser has a spot diameter ranging from 0.004 mm to 0.02 mm.