A semiconductor production scheduling method, system and device

Abstract

The application discloses a semiconductor production scheduling method, system and device, the method comprises determining the minimum slot number in the running wafer group; according to the minimum slot number in the running wafer group, the slot corresponding to each wafer in the running wafer group is reordered from the wafer chuck corresponding to the minimum slot number; the running wafer group after reordering. Through the machine control system and the machine automation control program system, the priority use path of each wafer chuck is dynamically adjusted, and then the wafer chuck of each wafer is accurately controlled, finally the intelligent wafer extraction logic is realized, the risk of wafer group missing the running chuck can be effectively reduced, and the product precision performance is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a semiconductor production scheduling method, system and device. BACKGROUND

[0002] Most of the current exposure equipment uses two chucks to run wafers. After the wafer is put into the exposure machine, the chuck extraction sequence of the first or any subsequent exposure layer (PH Layer) is random, which will cause chuck swap abnormalities when the machine extracts wafers according to the slot sequence, thereby affecting the machine capacity.

[0003] The current wafer extraction sequence follows the wafer slot sequence: the number of machine slot numbers is generally greater than or equal to 25, numbered as slot #01->25, and the machine is instructed to execute the wafer extraction according to the slot number sequence.

[0004] Most exposure equipment has two wafer extraction modes: according to the sequence of EAP (Equipment Automation Program, machine automation control program): the machine executes wafer extraction according to the machine automation control program command and runs the chuck in sequence, which is prone to more frequent chuck empty exchange, resulting in low product production efficiency; the machine according to the sequence of EQP (Equipment, machine): the machine executes wafer extraction according to the sequence of its own program setting corresponding to the specific chuck information of the wafer, which is prone to chuck swap misplacement or loss (Lot MissRun Chuck Error). SUMMARY

[0005] The present application relates to the technical field of semiconductor technology, and in particular to a semiconductor production scheduling method, system and device.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0007] According to some disclosed embodiments, the present application discloses a semiconductor production scheduling method, which comprises:

[0008] determining the minimum slot number in the running wafer group;

[0009] reordering the slots corresponding to each wafer in the running wafer group according to the minimum slot number, starting from the wafer chuck corresponding to the minimum slot number;

[0010] running the reordered wafer group.

[0011] According to some disclosed embodiments, the determining the minimum slot number in the running wafer group comprises,

[0012] determining the minimum slot number in the first or Nth running wafer group, wherein N is greater than 1.

[0013] According to some disclosed embodiments, the determining the minimum slot number in the first running wafer group comprises,

[0014] When determining the first running wafer group, the minimum slot number is directly found in the first wafer group.

[0015] According to some disclosed embodiments, when determining the first running wafer group, the minimum slot number is directly found in the first wafer group, comprising,

[0016] determining the initial slot number corresponding to each wafer in the running wafer group, wherein the each wafer has a corresponding chuck value;

[0017] determining the minimum slot number in the running wafer group according to the initial slot number corresponding to each wafer in the running wafer group.

[0018] According to some disclosed embodiments, the determining the minimum slot number in the Nth running wafer group comprises,

[0019] When determining the Nth running wafer group, the minimum slot number in the Nth wafer group is determined according to the wafer chuck value corresponding to the last slot in the N-1th wafer group.

[0020] According to some disclosed embodiments, the determining the minimum slot number in the Nth wafer group according to the wafer chuck value in the N-1th wafer group comprises,

[0021] determining the odd or even number of the wafer chuck value corresponding to the minimum slot in the Nth wafer group according to the odd or even number of the wafer chuck value corresponding to the last slot in the N-1th wafer group.

[0022] According to some disclosed embodiments, the odd or even number of the wafer chuck value corresponding to the last slot in the N-1th wafer group is obtained by a bubble algorithm.

[0023] According to some disclosed embodiments, the reordering the slots corresponding to each wafer in the running wafer group according to the minimum slot number, starting from the wafer chuck corresponding to the minimum slot number, comprises,

[0024] After the chuck is idle, the slots corresponding to each wafer in the running wafer group are dynamically sorted by the hill sort, starting from the smallest slot number in the running wafer group.

[0025] According to some disclosed embodiments, the dynamic sorting includes,

[0026] For the running wafer group, the slot numbers corresponding to each wafer are dynamically sorted, starting from the smallest slot number in the running wafer group; or / and,

[0027] For the switching process between the N-1th wafer group and the Nth wafer group, the slot numbers corresponding to each wafer in the Nth wafer group are dynamically sorted, starting from the smallest slot number in the Nth wafer group, where N is greater than 1.

[0028] According to some disclosed embodiments, the dynamic sorting of the slots corresponding to each wafer in the running wafer group by the hill sort, starting from the smallest slot number in the running wafer group, includes the following steps,

[0029] According to the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group, the slot numbers corresponding to each wafer in the running wafer group are dynamically sorted for the first time, and the first wafer picking operation is performed;

[0030] After the first wafer picking operation is performed, the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group after the first wafer picking operation is determined;

[0031] According to the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group after the first wafer picking operation, the slot numbers corresponding to each wafer in the running wafer group after the first wafer picking operation are dynamically sorted for the second time, and the second wafer picking operation is performed;

[0032] After the second wafer picking operation is performed, the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group after the second wafer picking operation is determined;

[0033] According to the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group after the second wafer picking operation, the slot numbers corresponding to each wafer in the running wafer group after the second wafer picking operation are dynamically sorted for the third time, and the fourth wafer picking operation is performed;

[0034] The wafer picking operation is repeated until each wafer in the wafer group is picked.

[0035] According to some disclosed embodiments, the dynamic sorting of the slot numbers corresponding to each wafer in the Nth wafer group during the switching process between the N-1th wafer group and the Nth wafer group also includes the following steps,

[0036] after the wafer in the running wafer group is completed,

[0037] determining whether the wafer chuck value of the last wafer in the running wafer group is odd or even; and determining whether the wafer chuck value corresponding to the minimum slot number in the next running wafer group is odd or even according to whether the wafer chuck value of the last wafer in the running wafer group is odd or even.

[0038] According to some disclosed embodiments, the second aspect of the present application discloses a semiconductor production scheduling system, which comprises,

[0039] a determining unit configured to determine a minimum slot number in a running wafer group;

[0040] a sorting unit configured to sort the slots corresponding to each wafer in the running wafer group according to the minimum slot number in the running wafer group, starting from the wafer chuck corresponding to the minimum slot number;

[0041] a running unit configured to run the wafer group after the sorting.

[0042] According to some disclosed embodiments, the determining of the minimum slot number in the running wafer group comprises,

[0043] the determining unit finds the minimum slot number in the first wafer group or the Nth wafer group, wherein N is greater than 1;

[0044] when the running wafer group is determined to be the first wafer group, the determining unit directly determines the minimum slot number in the first wafer group;

[0045] when the running wafer group is determined to be the Nth wafer group, the determining unit determines whether the wafer chuck value corresponding to the minimum slot number in the Nth wafer group is odd or even according to whether the wafer chuck value corresponding to the last slot in the (N-1)th wafer group is odd or even.

[0046] According to some disclosed embodiments, the sorting of the wafer chucks in the running wafer group according to the minimum slot number in the running wafer group, starting from the wafer chuck corresponding to the minimum slot number, comprises,

[0047] the sorting unit sorts the slot numbers corresponding to each wafer in the running wafer group dynamically through the Hill sorting before each wafer extraction operation according to whether the wafer chuck corresponding to the minimum slot number in the running wafer group is odd or even, after the host table chuck is idle.

[0048] According to some disclosed embodiments, the third aspect of the present application discloses a semiconductor production scheduling device, a semiconductor production scheduling device, the semiconductor production scheduling device comprises: a machine table automation control device and a machine table control device, the machine table automation control device and the machine table control device are built-in control program, the control program is used to realize the semiconductor production scheduling method.

[0049] The technical effects and advantages of the present application are as follows:

[0050] The present application dynamically adjusts the priority use path of each wafer chuck through the TCS (Tool Control System) and EAP (Equipment Automation Program) system, and then accurately controls each wafer chuck, finally realizes intelligent wafer extraction logic, which can effectively reduce the risk of wafer set missing running chuck, improve product precision performance; At the same time, effectively improve Chuck SWAP (Chuck exchange), and then improve the production capacity, reduce the production cost, improve the efficiency of the product, increase the profit.

[0051] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or will be learned by practice of the present application. The objects and other advantages of the present application can be realized and obtained by the structure indicated in the specification, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0052] Figure 1 A production scheduling method flow chart in an embodiment of the present application;

[0053] Figure 2 A production scheduling system diagram in an embodiment of the present application;

[0054] Figure 3 Chuck running process schematic diagram in an embodiment of the present application;

[0055] Figure 4 In the case of EQP sorting in an embodiment of the present application, the wafer extraction logic random wafer extraction flow schematic diagram of the chuck following the order of wafer slot;

[0056] Figure 5 In the case of EQP sorting in an embodiment of the present application, the wafer extraction logic random wafer extraction flow schematic diagram of the chuck following the order of wafer slot;

[0057] Figure 6 In the case of EQP sorting combined with EAP sorting in an embodiment of the present application, the wafer extraction flow schematic diagram of the chuck;

[0058] Figure 7This is a schematic diagram of chuck extraction in one embodiment of this application, where EQP sorting is combined with EAP sorting.

[0059] Figure 8 This is a schematic diagram illustrating a chuck error that occurs when the entire wafer stack is running under EQP sorting in one embodiment of this application.

[0060] Figure 9 This is a schematic diagram illustrating the risks of enabling Chuck Swap (chuck swap) prevention and Miss Run Chuck (chuck swap misalignment or loss) when EQP sorting is combined with EAP sorting in one embodiment of the application. Detailed Implementation

[0061] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0062] To address the shortcomings of existing technologies, this application discloses a semiconductor production scheduling method that effectively reduces the risk of Lot Miss Run Chuck Error (LOCLE error), improves product accuracy, and effectively reduces the number of Chuck Empty Swaps, thereby increasing product efficiency and profits. Therefore, the semiconductor production scheduling method proposed in this application includes: determining the smallest slot number in the running wafer group; reordering the slots corresponding to each wafer in the running wafer group, starting from the wafer chuck corresponding to the smallest slot number, based on the smallest slot number in the running wafer group; and running the reordered wafer group.

[0063] Before each wafer extraction operation, the method in this application intelligently sorts the chuck information corresponding to each wafer (WaferID) in each extraction operation according to the machine's rules, so that the machine's chuck is in a state of continuous exchange operation for a long time, thereby minimizing the problem of chuck swap abnormalities.

[0064] In some embodiments of this application, combined with Figure 1It can be known that, in the embodiments of the present application, the operator creates a job program according to time; a certain wafer group (Lot) is moved to a machine table; a TCS task is transferred to create a multi-process job; a machine control subsystem determines whether a current running wafer group is a predetermined first wafer group; when it is determined that the wafer group is the first wafer group, a minimum slot number is directly found in the first wafer group by using a hill algorithm; when it is determined that the wafer group is not the first wafer group, when the Nth wafer group is determined to be run, a minimum slot number in the Nth wafer group is determined according to a wafer chuck value corresponding to a last slot in the (N-1)th wafer group, wherein N is greater than 1. After the minimum slot number is found, an EAP sends a sorting instruction to an EQP, and the EQP runs a wafer chuck according to the sorting instruction sent by the EAP.

[0065] In some embodiments of the present application, when it is determined that the first wafer group is run, a minimum slot number in the first wafer group is directly found, including determining an initial slot number corresponding to each wafer in the wafer group, wherein each wafer has a corresponding chuck value; and determining a minimum slot number in the wafer group according to the initial slot number corresponding to each wafer in the wafer group.

[0066] In some embodiments of the present application, the minimum slot number in the Nth wafer group is determined according to the wafer chuck value in the (N-1)th wafer group, including determining an even or odd number of a wafer chuck value corresponding to a minimum slot in the Nth wafer group according to an even or odd number of a wafer chuck value corresponding to a last slot in the (N-1)th wafer group. The even or odd number of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group is obtained by using a bubble algorithm.

[0067] In some embodiments of the present application, when it is calculated that the wafer chuck value corresponding to the last slot in the (N-1)th wafer group is odd, it can be determined that a wafer chuck value corresponding to a first wafer in the Nth wafer group is even, and a program finds a minimum slot number corresponding to each wafer with an even chuck value in the Nth wafer group, so as to determine a minimum slot in the Nth wafer group. Similarly, when it is calculated that the wafer chuck value corresponding to the last slot in the (N-1)th wafer group is even, it can be determined that the wafer chuck value corresponding to the first wafer in the Nth wafer group is odd, and the program finds a minimum slot number corresponding to each wafer with an odd chuck value in the Nth wafer group, so as to determine the minimum slot in the Nth wafer group.

[0068] The exposure machine (IMMERSION Scanner) adopted in the embodiments of the present application is currently used for two chuck interactive operation of wafers, and the chucks are named as chuck 1 (chuck 1) and chuck 2 (chuck 2), wherein the size and structure of the chuck 1 and the chuck 2 are completely same, and after the wafer (Wafer) enters the exposure machine, the wafer is extracted in the order of the chuck of the first or subsequent photolithography layer (PH Layer), which is random, so that the chuck exchange (Chuck SWAP) exception occurs when the machine is extracted according to the slot (Slot), and the machine throughput loss (Throughput Loss) is affected.

[0069] The machine automation control program of the exposure machine finds the minimum slot number in the first wafer group or the Nth wafer group in operation, wherein N is greater than 1; when the wafer group in operation of the machine automation control program is the Nth wafer group (N is greater than 1), the slot corresponding to the wafer chuck value of the last extraction in the N-1th wafer group in operation is calculated by the bubble method, and the chuck is 1 or 2; the wafer chuck value of the first extraction in the Nth wafer group is determined as 2 or 1 according to the wafer chuck value corresponding to the last slot in the N-1th wafer group in operation, so that the minimum slot number in the Nth wafer group is found in the slot corresponding to the wafer chuck value of 2 or 1, that is, the minimum slot in the Nth wafer group.

[0070] When the wafer chuck value of the last extraction in the N-1th wafer group in operation is 1, the wafer chuck value corresponding to the minimum slot number in the Nth wafer group is 2; when the wafer chuck value in the N-1th wafer group is 2, the wafer chuck corresponding to the minimum slot number in the Nth wafer group is 1.

[0071] In some embodiments of the present application, the wafer chuck corresponding to the minimum slot number is reordered according to the wafer chuck corresponding to the minimum slot number, including, after the chuck is idle, the wafer chuck corresponding to the minimum slot number in the running wafer group is reordered before each extraction operation, so as to ensure the priority use path of each wafer chuck, and then accurately control the wafer chuck of each wafer, finally realize the intelligent extraction logic, effectively improve the Chuck SWAP (Chuck SWAP), and then improve the production capacity and reduce the production cost.

[0072] wherein, the dynamic sorting of the slot corresponding to each wafer in the running wafer group by the hill sort includes, for the running wafer group, the dynamic sorting of the slot corresponding to each wafer from the smallest slot number in the running wafer group; or, for the switching process between the N-1th wafer group and the Nth wafer group, the dynamic sorting of the slot corresponding to each wafer in the Nth wafer group from the smallest slot number in the Nth wafer group, wherein N is greater than 1 and is a constant.

[0073] In some embodiments of the present application, the EAP can give an instruction to the machine according to the odd or even of the chuck corresponding to the smallest slot number. The reordering of the slot corresponding to each wafer in the running wafer group from the smallest slot number, starting from the odd or even of the wafer chuck corresponding to the smallest slot number, includes that the machine automation control program sends a sorting command starting from the odd or even of the wafer chuck corresponding to the smallest slot number to the main machine; after the main machine is idle, the machine automation control program dynamically sorts the slot number corresponding to each wafer from the smallest slot number by the hill sort method.

[0074] In some embodiments of the present application, after determining the smallest slot number in the running wafer group, the machine control subsystem or the machine automation control program dynamically adjusts the priority use path of each wafer chuck by the hill sort method after the chuck is idle, and dynamically sorts the slot number corresponding to each wafer chuck in the running wafer group from the smallest slot number.

[0075] wherein, the TCS / EAP (machine control program or machine automation control program) dynamically adjusts the priority use path of each wafer chuck (Wafer Chuck) by the hill sort algorithm; the machine automation control program determines the initial slot number corresponding to the initial chuck value of each wafer when the chuck value corresponding to the smallest slot number found in the running wafer group is 1, and performs secondary dynamic sorting on the initial slot number corresponding to all wafers in the running wafer group by the hill sort method before generating each job to the main machine, thereby determining the secondary dynamically sorted chuck value corresponding to all wafers in the running wafer group; according to the chuck value (Chuck Value) corresponding to the wafer after the secondary dynamic sorting of each wafer group, the machine automation control program performs tertiary or multiple dynamic sorting before generating each wafer extraction job to the main machine until all wafer extraction jobs in the running wafer group are completed.

[0076] In some embodiments of the present application, the EAP can give an instruction to the machine according to the odd or even of the chuck corresponding to the smallest slot number. The reordering of the slot corresponding to each wafer in the running wafer group from the smallest slot number, starting from the odd or even of the wafer chuck corresponding to the smallest slot number, includes that the machine automation control program sends a sorting command starting from the odd or even of the wafer chuck corresponding to the smallest slot number to the main machine; after the main machine is idle, the machine automation control program dynamically sorts the slot number corresponding to each wafer from the smallest slot number by the hill sort method.

[0077] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the running wafer group, the slot number corresponding to each wafer in the running wafer group is dynamically sorted for the first time, and the first wafer picking operation is performed;

[0078] After the first wafer picking operation, the odd and even number of the wafer chuck corresponding to the minimum slot number in the running wafer group after the first wafer picking is determined;

[0079] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the running wafer group after the first wafer picking, the slot number corresponding to each wafer in the running wafer group after the first wafer picking is dynamically sorted for the second time, and the second wafer picking operation is performed;

[0080] After the second wafer picking operation, the odd and even number of the wafer chuck corresponding to the minimum slot number in the running wafer group after the second wafer picking is determined;

[0081] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the running wafer group after the second wafer picking, the slot number corresponding to each wafer in the running wafer group after the second wafer picking is dynamically sorted for the third time, and the fourth wafer picking operation is performed;

[0082] The wafer picking operation is repeated until the wafer picking of each wafer in the wafer group is completed.

[0083] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the Nth wafer group, the slot number corresponding to each wafer in the Nth wafer group is dynamically sorted for the first time, and the first wafer picking operation is performed;

[0084] After the first wafer picking operation, the odd and even number of the wafer chuck corresponding to the minimum slot number in the Nth wafer group after the first wafer picking is determined;

[0085] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the Nth wafer group after the first wafer picking, the slot number corresponding to each wafer in the Nth wafer group after the first wafer picking is dynamically sorted for the second time, and the second wafer picking operation is performed;

[0086] After the second wafer picking operation, the odd and even number of the wafer chuck corresponding to the minimum slot number in the Nth wafer group after the second wafer picking is determined;

[0087] According to the odd and even number of the wafer chuck corresponding to the minimum slot number in the Nth wafer group after the second wafer picking, the slot number corresponding to each wafer in the Nth wafer group after the second wafer picking is dynamically sorted for the third time, and the fourth wafer picking operation is performed;

[0088] The wafer picking operation is repeated until the wafer picking of each wafer in the wafer group is completed;

[0089] After the wafer in the running wafer group is extracted, the odd or even number of the wafer chuck value of the last wafer extraction in the running wafer group is determined; according to the odd or even number of the wafer chuck value of the last wafer extraction in the running wafer group, the even or odd number of the wafer chuck value corresponding to the minimum slot in the next running wafer group is determined, and the above-mentioned procedure is recycled again.

[0090] The application further discloses a semiconductor production scheduling system, as shown in the figure, the system comprises a determination unit for determining the minimum slot number in a running wafer group; a sorting unit for reordering the slot corresponding to each wafer in the running wafer group according to the minimum slot number in the running wafer group, starting from the wafer chuck corresponding to the minimum slot number; and a running unit for running the re-ordered wafer group. Figure 2

[0091] In some embodiments of the application, the determination unit is used to find the minimum slot number in the first wafer group or the Nth wafer group, wherein N is greater than 1; when it is determined that the running wafer group is the first wafer group, the determination unit is used to directly determine the minimum slot number in the first wafer group; when it is determined that the running wafer group is the Nth wafer group, the determination unit is used to determine the even or odd number of the wafer chuck value corresponding to the minimum slot number in the Nth wafer group according to the even or odd number of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group.

[0092] In some embodiments of the application, the determination unit is used to determine the minimum slot number in the Nth wafer group according to the wafer chuck value in the (N-1)th wafer group, comprising: the determination unit is used to determine the even or odd number of the wafer chuck value corresponding to the first slot in the Nth wafer group according to the even or odd number of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group; and the determination unit is used to determine the even or odd number of the wafer chuck value corresponding to the minimum slot number in the Nth wafer group.

[0093] In some embodiments of the application, the reordering of the wafer chuck in the running wafer group according to the minimum slot number in the running wafer group, starting from the wafer chuck corresponding to the minimum slot number, comprises: after the disk of the host table card is idle, the sorting unit reorders the wafer chuck according to the even or odd number of the wafer chuck corresponding to the minimum slot number in the running wafer group, and before each wafer extraction operation, the slot number corresponding to each wafer in the running wafer group is dynamically reordered by the Hill sorting.

[0094] ​This application also discloses a semiconductor production scheduling device, which includes: a machine automation control device and a machine control device, wherein the machine automation control device and the machine control device have a built-in control program, and the control program is used to implement the above-mentioned semiconductor production scheduling method.

[0095] By utilizing the technical solution described above, Chuck SWAP can be effectively improved, thereby increasing productivity. The technical solution of this invention will be further explained below with reference to specific embodiments. To more clearly illustrate the technical solutions in the embodiments of this disclosure or in the conventional art, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0096] The embodiment of this application uses an imaging scanner, combined with... Figure 3 It is known that current exposure machines use two chucks to interactively run the wafers. These chucks are named Chuck 1 and Chuck 2. Chuck 1 and Chuck 2 are identical in size and structure, with the light source and scribe lines located directly above the chucks. After photolithography is completed on the wafer in Chuck 2, Chuck 2 and Chuck 1 are chuck swapped. Currently, the wafer extraction sequence of the machine follows the wafer slot sequence, and wafers are extracted in the order of slot number #01->25.

[0097] like Figure 4 As shown, during the wafer extraction process of a certain wafer group, if the Sorting Chuck Dedication of a certain PH Layer (photolithography layer) machine uses chuck1 for the same wafer when lithography the first and second layers, since the wafer extraction order corresponding to the chuck is set by the EQP (machine) classification, and the extraction order follows the wafer slot sequence, and the chuck value corresponding to the wafer slot is random, it cannot be completely guaranteed that all the chucks used for each intermediate lithography layer operation are chuck1 when lithography N layers of this wafer.

[0098] In some embodiments of this application, such as Figure 5 As shown, for each wafer group, there are many chuck information entries corresponding to the wafers. Each wafer corresponds to one chuck value. The chucks corresponding to odd-numbered slots #1, 3, 5...11 include chuck 1 and chuck 2; the chucks corresponding to even-numbered slots #2, 4, 6...12 include chuck 1, chuck 1, and chuck 2.Figure 5 It is known that the current wafer slot order is disordered. According to the current EQP chip extraction logic, chip extraction according to the order of the wafer slot numbers sorted by EQP can easily cause chuck swap misalignment or loss.

[0099] like Figure 6 As shown, during the wafer extraction process of a certain wafer group, if the machine needs to be sorted and extracted for a certain PH Layer (lithography layer) to ensure that the chuck used for each lithography layer is always the same, the machine must be reprogrammed according to the currently available chucks. Since only machines with EAP (Engineering, Propagation, and Automation) sorting can ensure that the same chuck is used for each wafer extraction, EAP determines the chuck value used for the first wafer in the first lithography layer, finds the smallest slot number in the running wafer group, and reorders the wafer chucks in the running wafer group starting from the wafer chuck corresponding to the smallest slot number; combined with... Figure 6 It is known that, to ensure that chuck 1 is used for the same wafer during the first, second, ... Nth lithography layers, under EQP classification, EAP needs to notify the machine (EQP) of the previous wafer chuck information before each chuck unloads, so as to ensure that chuck 1 and chuck 2 interact during the wafer extraction process, thereby ensuring that each wafer is processed using the same chuck. When operating the first wafer group, the machine automation control program directly determines the smallest slot number in the first wafer group using the Shell sort method; when operating the Nth wafer group (N > 1), the machine automation control program calculates the wafer chuck corresponding to the last slot in the (N-1)th wafer group, which is chuck 1 or 2; based on the wafer chuck value corresponding to the last slot in the (N-1)th wafer group, the chuck corresponding to the smallest slot number in the Nth wafer group is determined to be chuck 2 or 1.

[0100] In some embodiments of this application, the order of using the 1st layer chuck is to ensure that the same chuck is used for each layer, thereby improving the product alignment accuracy and helping to improve yield.

[0101] In some embodiments of this application, combined with Figure 7 Wafer extraction follows the actual chuck running sequence: First, import the incoming wafer group information, i.e., input... Figure 5The chuck, slot information corresponding to all wafers in the wafer group shown; the machine control device (TCS) or EAP determines whether the current running wafer group is the predetermined first wafer group: when it is determined that the wafer group is the predetermined first wafer group, then the wafer slot of the first wafer group is directly sorted, and the smallest slot number is found; or when it is determined that the wafer group is not the first wafer group, that is, the running wafer group is the Nth wafer group, the determining unit determines the parity of the wafer chuck value corresponding to the last slot in the N-1th wafer group, and determines the parity of the wafer chuck value corresponding to the smallest slot number in the Nth wafer group.

[0102] Then, the machine control device (TCS) or the EAP machine automation control program dynamically adjusts the priority use path of each wafer chuck in the running wafer group before each wafer extraction operation according to the chuck value corresponding to the smallest slot number in the running wafer group: according to Figure 7 As can be seen, the EAP machine automation control program analyzes the wafer group (Lot incoming) imported, and the wafer extraction order of the chucks corresponding to slot #3 and slot #4, slot #9 and slot #10 is abnormal compared with others, which is not the interactive replacement of chuck 1 and chuck 2. After EAP sorting, the wafer extraction order of slot #3 and slot #4 is exchanged, and the wafer extraction order of slot #9 and slot #10 is exchanged, so as to ensure that the wafer extraction order of the chucks is the interactive replacement of chuck 1 and chuck 2.

[0103] In some embodiments of the present application, according to Figure 7 , after the wafer running of the current wafer group is completed, the EAP machine automation control program can estimate the actual wafer chuck usage information of the EQP wafer extraction sorting machine in advance, and make a virtual record of the system information. The EAP machine automation control program determines the parity of the wafer chuck value corresponding to the first slot in the Nth wafer group according to the parity of the wafer chuck value corresponding to the last slot in the N-1th wafer group, and determines the smallest slot number in the Nth wafer group.

[0104] In some embodiments of the present application, according to Figure 7 As can be seen, the EAP machine automation control program calculates the value of the wafer chuck corresponding to the last slot in the imported wafer group after EAP sorting as 2; according to the value of the wafer chuck corresponding to the last slot in the imported wafer group after EAP sorting as 2, the chuck corresponding to the smallest slot number in the next running wafer group is determined as 1, and the slots corresponding to other wafers in the wafer group are numbered by Hill sorting according to the determined chuck corresponding to the smallest slot number as 1.

[0105] In some embodiments of this application, when the chuck running on the machine in the previous operation is the same as the chuck running in the next wafer set, it may result in the entire wafer set's chuck being missed, such as... Figure 8 As shown, according to the EQP (machine) sequence, the machine corresponds to the specific chuck information of the wafer run according to its own settings. The chuck value of the last wafer set run on the machine is chuck 1. When the chuck value of the next wafer set's smallest slot (slot #1) is also chuck 1, according to the EQP chip extraction logic, the machine will directly start chip extraction from slot #1. The chuck 1 corresponding to slot #1 is the same as the chuck corresponding to the last chip extraction of the previous batch of wafer sets. Therefore, it directly leads to the entire wafer set chuck exchange being misaligned or lost (MissRun Chuck).

[0106] In some embodiments of this application, combined with Figure 9 It is known that, following the EAP (Automatic Processing Program) sequence, the machine executes wafer extraction and Run Chuck sequentially according to the EAP instructions. For machines using EQP (Electronic EQP) sequencing for wafer extraction, the chuck used in the previous wafer set run was chuck 1. When the chuck value for the next pre-defined wafer set's smallest slot (slot #1) is also chuck 1, the machine can use extraction logic that adds EAP to the EQP sequence. This allows the machine to identify the chuck corresponding to slot #2 and use slot #2 as the smallest slot number, directly starting extraction from slot #2, thus resolving the problem of incorrect wafer set chuck extraction. Combined with... Figure 9 As can be seen, in some embodiments of the present invention, the chuck correspondence of the first wafer is adjusted promptly after wafer extraction to activate the Chuck SWAP prevention function and mitigate the risk of Miss RunChuck (chuck misalignment or loss). Specifically, when the chuck previously used by the machine's EQP is the same as the chuck used by the next wafer group (chuck 1), the user sets and activates the Chuck SWAP prevention function. The system then adjusts the chuck function of the first wafer in a timely manner through R2R (Run To Run) + EAP (Equipment Automation Program between Wafer Groups). The machine executes wafer extraction and sequential Run Chuck according to the EAP instructions, effectively improving Chuck SWAP and thus increasing throughput.

[0107] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor production scheduling method, characterized in that, The method includes: Determine the minimum slot number in the operating wafer set, where each wafer in the wafer set has a corresponding chuck value; Based on the smallest slot number in the running wafer group, starting from the wafer chuck corresponding to the smallest slot number, the slots corresponding to each wafer in the running wafer group are reordered. The reordering of the slots corresponding to each wafer in the running wafer group specifically includes: after the chuck is idle, starting from the smallest slot number in the running wafer group, the slots corresponding to each wafer in the running wafer group are dynamically sorted using Shell sort. Run the reordered wafer set.

2. The semiconductor production scheduling method according to claim 1, characterized in that, The determination of the minimum slot number in the operating wafer set includes... Determine the smallest slot number in the first wafer set or the Nth wafer set in operation, where N is greater than 1.

3. The semiconductor production scheduling method according to claim 2, characterized in that, The minimum slot number in the first wafer set to be determined includes... When it is determined to run the first wafer set, the smallest slot number is found directly in the first wafer set.

4. The semiconductor production scheduling method according to claim 3, characterized in that, When determining to run the first wafer set, directly find the smallest slot number within the first wafer set. Determine the initial slot number corresponding to each wafer in the first wafer group to be run; The minimum slot number in the running wafer set is determined based on the initial slot number corresponding to each wafer in the first running wafer set.

5. The semiconductor production scheduling method according to claim 2, characterized in that, The determination of the minimum slot number in the Nth wafer set includes... When it is determined that the Nth wafer group is to be run, the smallest slot number in the Nth wafer group is determined according to the wafer chuck value corresponding to the last slot in the (N-1)th wafer group.

6. The semiconductor production scheduling method according to claim 5, characterized in that, The step of determining the minimum slot number in the Nth wafer group based on the wafer chuck value in the (N-1)th wafer group includes... Based on the odd or even number of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group, determine the even or odd number of the wafer chuck value corresponding to the smallest slot in the Nth wafer group.

7. The semiconductor production scheduling method according to claim 6, characterized in that, The odd or even number of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group is obtained by bubble sort algorithm.

8. The semiconductor production scheduling method according to claim 1, characterized in that, The dynamic sorting includes, For the same wafer set, starting from the smallest slot number in the wafer set, the slot numbers corresponding to each wafer are dynamically sorted; or ... During the switching process between the (N-1)th wafer group and the Nth wafer group, starting from the smallest slot number in the Nth wafer group, the slot numbers corresponding to each wafer in the Nth wafer group are dynamically sorted, where N is greater than 1.

9. The semiconductor production scheduling method according to claim 1, characterized in that, Starting with the smallest slot number in the running wafer set, the slots corresponding to each wafer in the running wafer set are dynamically sorted using Shell sort. Includes the following steps, Based on the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group, the slot numbers corresponding to each wafer in the running wafer group are dynamically sorted for the first time, and the first wafer extraction operation is performed. After the first wafer extraction operation, determine whether the wafer chuck corresponding to the smallest slot number in the running wafer group after the first wafer extraction is odd or even. Based on the odd or even number of the wafer chuck corresponding to the smallest slot number in the wafer group after the first wafer extraction, the slot numbers corresponding to each wafer in the wafer group after the first wafer extraction are dynamically sorted a second time, and a second wafer extraction operation is performed. After the second wafer extraction operation, determine whether the wafer chuck corresponding to the smallest slot number in the running wafer group after the second wafer extraction is odd or even. Based on the odd or even number of the wafer chuck corresponding to the smallest slot number in the wafer group after the second wafer extraction, the slot numbers corresponding to each wafer in the wafer group after the second wafer extraction are dynamically sorted for the third time, and the fourth wafer extraction operation is performed. This process of wafer extraction is repeated until every wafer in the wafer set has been extracted.

10. The semiconductor production scheduling method according to claim 8, characterized in that, During the switching process between the (N-1)th wafer group and the Nth wafer group, the dynamic sorting of the slot numbers corresponding to each wafer in the Nth wafer group further includes the following steps. After the wafers in the running wafer set are extracted, Determine whether the chuck value of the last wafer pull in the running wafer group is odd or even; based on whether the chuck value of the last wafer pull in the running wafer group is odd or even, determine whether the chuck value of the smallest slot in the next running wafer group is even or odd.

11. A semiconductor production scheduling system, characterized in that, The semiconductor production scheduling system includes, A determining unit is used to determine the minimum slot number in the operating wafer group, wherein each wafer in the wafer group has a corresponding chuck value; The sorting unit is used to reorder the slots corresponding to each wafer in the running wafer group according to the smallest slot number in the running wafer group, starting from the wafer chuck corresponding to the smallest slot number. The reordering of the slots corresponding to each wafer in the running wafer group specifically includes: after the chuck is idle, starting from the smallest slot number in the running wafer group, dynamically sorting the slots corresponding to each wafer in the running wafer group using Shell sort. The running unit is used to run the reordered wafer set.

12. The semiconductor production scheduling system according to claim 11, characterized in that, The determining unit is used to determine the smallest slot number in the operating wafer set, including, The determining unit is used to find the minimum slot number in the first or Nth wafer group of the operation, where N is greater than 1; When it is determined that the wafer set being operated is the first wafer set, the determination unit is used to directly determine the minimum slot number in the first wafer set; When it is determined that the running wafer group is the Nth wafer group, the determining unit is used to determine the even or odd value of the wafer chuck value corresponding to the smallest slot number in the Nth wafer group based on the odd or even value of the wafer chuck value corresponding to the last slot in the (N-1)th wafer group.

13. The semiconductor production scheduling system according to claim 11, characterized in that, The sorting unit is used to reorder the wafer chucks in the running wafer group according to the smallest slot number, starting from the wafer chuck corresponding to the smallest slot number. The sorting unit is used to dynamically sort the slot numbers corresponding to each wafer in the running wafer group before each wafer extraction job, starting from the smallest slot number, after the host chuck is idle. The sorting unit is based on the odd or even number of the wafer chuck corresponding to the smallest slot number in the running wafer group.

14. A semiconductor production scheduling device, characterized in that, The semiconductor production scheduling equipment includes: a machine automation control device and a machine control device, wherein the machine automation control device and the machine control device have a built-in control program, and the control program is used to implement the semiconductor production scheduling method according to any one of claims 1-10.

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