Power modulation management compact and its preparation method

Abstract

The application is suitable for the technical field of microwave radio frequency power tube and module assembly, and provides a power modulation management block and a preparation method thereof. The block comprises a block cover plate, power management circuit components, a power management circuit board, a capacitor, a MOS tube, a capacitor circuit board, a MOS tube circuit board and a block shell. A plurality of screw holes for fixing the power modulation management block are arranged on the outer side of the block shell, a protrusion for supporting and grounding the power management circuit board is arranged on the inner side of the block shell, a power tube fixing cavity for fixing the power tube is arranged at the lower part of the block shell, and the block cover plate is located above the block shell. The application can solve the problem of excessively large modulation circuit volume, can also realize the fixation of the power device, and effectively improves the working reliability and miniaturization of the power module.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of microwave radio frequency power tube and module assembly, and particularly relates to a power supply modulation management block and a preparation method thereof. BACKGROUND

[0002] At present, a traditional power module adopts a layout mode in which a power tube bias circuit and a power supply management circuit are in the same plane. Due to the fact that a power supply function part occupies a large area, the size of the module is obviously large. For the use of the power module in a whole machine, a smaller volume can realize higher integration, which is beneficial to the miniaturization of the assembly. The traditional power supply management part includes PCB board wiring and capacitors, resistors, modulation chips and voltage stabilizing chips. The size of the power supply management part is difficult to be further compressed. Meanwhile, the MOS tube in the modulation circuit will accumulate a large amount of heat under the working condition of high voltage and large duty cycle, and a heat dissipation carrier (such as AlN) needs to be provided outside the circuit board to dissipate heat, so that the size of the power supply part is difficult to realize miniaturization. SUMMARY

[0003] Embodiments of the application provide a power supply modulation management block and a preparation method thereof to solve the problem of large volume of the modulation circuit and realize the miniaturization of the module.

[0004] The application is implemented by the following technical solutions:

[0005] In a first aspect, the embodiments of the application provide a power supply modulation management block, which comprises a block cover plate, power supply management circuit components, a power supply management circuit board, a capacitor, a MOS tube, a capacitor circuit board, a MOS tube circuit board and a block shell.

[0006] The power supply management circuit components, the power supply management circuit board, the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board are placed in the block shell, and the vertical sequence from top to bottom is: a power supply management part and a capacitor and MOS tube part; the power supply management part comprises the power supply management circuit components and the power supply management circuit board; the capacitor and MOS tube part comprises the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board.

[0007] The block shell is provided with a plurality of screw holes outside for fixing the power supply modulation management block, the block shell is provided with a protrusion inside for supporting and grounding the power supply management circuit board, the lower part of the block shell is provided with a power tube fixing cavity for fixing the power tube, and the block cover plate is located above the block shell.

[0008] In combination with the first aspect, in some possible implementation manners, the height of the block shell part corresponding to the power supply management part is 3.5 mm.

[0009] In some possible implementation manners of the first aspect, the height of the shell part corresponding to the capacitor and MOS tube part is 3.7 mm.

[0010] In some possible implementation manners of the first aspect, two opposite side wall holes are arranged on the side surface of the shell part corresponding to the power management part, and the distance from the bottom of the side wall hole to the upper surface of the power management circuit board is 0.05 mm.

[0011] In some possible implementation manners of the first aspect, the power management circuit board, the capacitor circuit board and the MOS tube circuit board are fixed in the shell part by sintering or bonding.

[0012] In some possible implementation manners of the first aspect, the power management circuit board, the capacitor circuit board and the MOS tube circuit board are connected by wires.

[0013] In some possible implementation manners of the first aspect, the height of the power tube fixing cavity is 3.9 mm, and a safety distance of at least 0.1 mm is arranged between the top end of the power tube fixing cavity and the top end of the power tube packaging shell.

[0014] In the second aspect, the embodiment of the present application provides a preparation method of a power modulation management block, which comprises the following steps: dividing a piece of metal material into two parts of preparation material, pressing the first part of preparation material to obtain a block cover plate; performing groove processing on the second part of preparation material to obtain a block shell; performing hole digging operation on the block shell to obtain two opposite side wall holes and a plurality of screw holes; sequentially performing nickel plating and gold plating operations on the surface of the block shell; fixing the capacitor circuit board and the MOS tube circuit board in the block shell after the nickel plating and gold plating operations are completed by sintering or bonding; pasting the capacitor and the MOS tube on the capacitor circuit board and the MOS tube circuit board by means of soldering and mounting process technology, and connecting the circuit board and the MOS tube circuit board with the first end of a plurality of wires; fixing the power management circuit board on the block shell after the nickel plating and gold plating operations are completed by sintering or bonding; pasting the power management circuit components on the power management circuit board by means of soldering and mounting process technology, and connecting the power management circuit board with the second end of the plurality of wires.

[0015] In some possible implementation manners of the second aspect, the thickness of the nickel layer after nickel plating is 3 μm-11 μm.

[0016] In some possible implementation manners of the second aspect, the thickness of the gold layer after gold plating is 1 μm-5 μm.

[0017] It can be understood that the beneficial effects of the above-mentioned second aspect can be referred to the related description in the above-mentioned first aspect, which will not be described herein again.

[0018] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0019] The application solves the problem of too large size of the modulation circuit by designing the power management circuit components, the power management circuit board, the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board in a longitudinal arrangement, and the power tube fixing cavity also plays a fixing role on the power tube.

[0020] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present specification. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is a perspective view of the shell of the power modulation management block provided by an embodiment of the present application;

[0023] Figure 2 is a front view of the shell of the power modulation management block provided by an embodiment of the present application;

[0024] Figure 3 is a top view of the shell of the power modulation management block provided by an embodiment of the present application;

[0025] Figure 4 is a left view of the shell of the power modulation management block provided by an embodiment of the present application;

[0026] Figure 5 is a flowchart of the preparation method of the power modulation management block provided by an embodiment of the present application. DETAILED DESCRIPTION

[0027] In the following description, specific details are set forth in order to provide a thorough understanding of embodiments of the present application. However, persons skilled in the art will understand that embodiments of the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary details.

[0028] It should be understood that the word “comprise” or variations such as “comprises” or “comprising”, when used in this specification and in the accompanying claims, specify the presence of stated features, integers, steps, or components but do not preclude the presence or addition of one or more other features, integers, steps, components, or groups thereof.

[0029] It should also be understood that the term “and / or” when used in the specification and in the following claims is to be interpreted as “one or the other or both” and / or “any combination of the items in the list.

[0030] As used in this specification and claims, the terms “if’ and “when” can be interpreted to mean “upon” or “in response to a determination” or “in response to a detection” depending on the context. Similarly, the phrase “if it is determined” or “if [a described condition or event] is detected” can be interpreted to mean “upon a determination” or “in response to a determination” or “upon detecting [a described condition or event]” or “in response to detecting [a described condition or event]”, depending on the context.

[0031] In addition, the terms “first”, “second”, “third”, etc. as used in the description of the specification and the appended claims are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0032] Reference in the specification to “one embodiment” or “some embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases “in one embodiment”, “in some embodiments”, “in other embodiments”, “in additional embodiments”, etc. in various places in the specification are not necessarily all referring to the same embodiment, although they can. The terms “comprise”, “comprises”, “comprising”, “include”, “includes”, “including” and the like are synonymous with “containing” or “comprising”, unless otherwise indicated. The use of the terms “comprise”, “comprises”, “comprising”, “include”, “includes”, “including” and the like are not intended to exclude other features, integers, steps, operations, elements, components, and / or groups thereof.

[0033] The embodiments of the application provide a power modulation management block, which comprises a block cover plate, a power management circuit component, a power management circuit board, a capacitor, a MOS tube, a capacitor circuit board, a MOS tube circuit board and a block shell.

[0034] The power management circuit component, the power management circuit board, the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board are placed in the pressing block shell, and the sequence from top to bottom in the longitudinal direction is: the power management part and the capacitor and MOS tube part; the power management part comprises: the power management circuit component and the power management circuit board; the capacitor and MOS tube part comprises: the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board.

[0035] Specifically, as shown in Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , the pressing block shell 101 is provided with a plurality of screw holes 102 outside for fixing the power modulation management pressing block, the pressing block shell 101 is provided with a protrusion 103 inside for supporting and grounding the power management circuit board, the pressing block shell 101 has a power tube fixing cavity 104 at the lower part for fixing the power tube, and the pressing block cover plate is located above the pressing block shell 101.

[0036] Specifically, the pressing block shell 101 is further provided with a screw hole 105 for fixing the pressing block cover plate.

[0037] Exemplarily, the height H1 of the part of the pressing block shell 101 corresponding to the power management part is 3.5mm.

[0038] Exemplarily, the height H2 of the part of the pressing block shell 101 corresponding to the capacitor and MOS tube part is 3.7mm.

[0039] Exemplarily, the side of the pressing block shell 101 corresponding to the power management part is provided with two opposite side wall holes 106, and the distance from the bottom of the side wall hole 106 to the upper surface of the power management circuit board is 0.05mm.

[0040] Exemplarily, the power management circuit board, the capacitor circuit board and the MOS tube circuit board are fixed in the pressing block shell 101 by sintering or bonding.

[0041] Exemplarily, the power management circuit board, the capacitor circuit board and the MOS tube circuit board are connected by wires.

[0042] Exemplarily, the height H3 of the power tube fixing cavity 104 is 3.9mm, and a safety distance of at least 0.1mm is provided between the top end of the power tube fixing cavity 104 and the top end of the power tube packaging shell.

[0043] Figure 5 is a schematic flowchart of the preparation method of the power modulation management pressing block provided in an embodiment of the present application, and the detailed description of the preparation method of the power modulation management pressing block is as follows with reference to Figure 5

[0044] ​Step 501, a piece of metal material is divided into two parts to prepare materials, and the first part of the prepared material is pressed to obtain a cover plate.

[0045] Step 502, the second part of the prepared material is subjected to a slotting process to obtain a shell.

[0046] Specifically, the size of the shell needs to be determined according to the size of the power tube and the circuit design.

[0047] Step 503, the shell is subjected to a hole digging operation to obtain two opposite side wall holes and a plurality of screw holes.

[0048] Step 504, the surface of the shell is subjected to nickel plating and gold plating in sequence.

[0049] For example, the thickness of the nickel layer after nickel plating is 3-11 μm.

[0050] For example, the thickness of the gold layer after gold plating is 1-5 μm.

[0051] Specifically, the plated surface is smooth and flat, and there is no peeling, blistering or discoloration phenomenon on the plated surface under the condition of heat preservation for 30 minutes in a mixture of nitrogen and hydrogen at 300°C.

[0052] Step 505, the capacitor circuit board and the MOS tube circuit board are fixed in the shell after the nickel plating and gold plating operation by sintering or bonding.

[0053] Step 506, the capacitor and the MOS tube are attached to the capacitor circuit board and the MOS tube circuit board by soldering and mounting process technology, and the circuit board and the MOS tube circuit board are connected to the first end of the plurality of wires.

[0054] Step 507, the power management circuit board is fixed on the shell after the nickel plating and gold plating operation by sintering or bonding.

[0055] Step 508, the power management circuit components are attached to the power management circuit board by soldering and mounting process technology, and the power management circuit board is connected to the second end of the plurality of wires.

[0056] The above power modulation management compact preparation method solves the problem of excessive size of the modulation circuit by designing the power management circuit components, the power management circuit board, the capacitor, the MOS tube, the capacitor circuit board and the MOS tube circuit board in a vertical arrangement, and the power tube fixing cavity also plays a fixing role for the power tube. In addition, the power modulation management compact of the present application is easy to process and assemble, and improves the efficiency of actual production and use

[0057] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0058] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can refer to the relevant description of other embodiments.

[0059] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A power modulation management pressure block, characterized in that, The power modulation management pressure block includes: a pressure block cover plate, power management circuit components, a power management circuit board, capacitors, MOSFETs, a capacitor circuit board, a MOSFET circuit board, and a pressure block housing; The power management circuit components, the power management circuit board, the capacitor, the MOSFET, the capacitor circuit board, and the MOSFET circuit board are placed inside the pressure block housing, and the vertical order from top to bottom is: power management section and capacitor and MOSFET section; the power management section includes: the power management circuit components and the power management circuit board; the capacitor and MOSFET section includes: the capacitor, the MOSFET, the capacitor circuit board, and the MOSFET circuit board; The outer side of the pressure block housing is provided with multiple screw holes for fixing the power modulation management pressure block, the inner side of the pressure block housing is provided with a protrusion for supporting and grounding the power management circuit board, the lower part of the pressure block housing has a power tube fixing cavity for fixing the power tube, and the pressure block cover plate is located above the pressure block housing; wherein, the size of the pressure block housing is determined according to the size of the power tube; The height of the power transistor fixing cavity is 3.9 mm, and a safety distance of at least 0.1 mm is provided between the top of the power transistor fixing cavity and the top of the power transistor packaging shell. The height of the pressure block housing portion corresponding to the power management section is 3.5mm; The height of the pressure block housing portion corresponding to the capacitor and MOSFET portion is 3.7mm.

2. The power modulation management block as described in claim 1, characterized in that, The side of the pressure block housing corresponding to the power management section has two facing side wall holes, and the bottom of the side wall holes is 0.05mm away from the upper surface of the power management circuit board.

3. The power modulation management block as described in claim 1, characterized in that, The power management circuit board, the capacitor circuit board, and the MOSFET circuit board are fixed inside the pressure block housing by sintering or bonding.

4. The power modulation management block as described in claim 1, characterized in that, The power management circuit board, the capacitor circuit board, and the MOSFET circuit board are connected by wires.

5. A method for preparing a power modulation management pressure block, characterized in that, The method for preparing a power modulation management block as described in any one of claims 1 to 4 comprises: A piece of metal material is divided into two parts for preparation, and the first part of the preparation material is pressed to obtain a press cover plate. The second batch of preparation material was grooved to obtain a compressed shell; The housing of the pressure block is drilled to obtain two opposite side wall holes and multiple screw holes; The surface of the pressure block housing is sequentially plated with nickel and then with gold. The capacitor circuit board and the MOSFET circuit board are fixed in the pressure block housing after the nickel plating and gold plating operations are completed by sintering or bonding. The capacitor and MOSFET are surface-mounted onto the capacitor circuit board and MOSFET circuit board using soldering and mounting technology. The circuit board and MOSFET circuit board are connected to the first end of multiple wires. The power management circuit board is fixed to the pressure block housing after nickel plating and gold plating by sintering or bonding. The power management circuit components are surface-mounted onto the power management circuit board using soldering and mounting technology, and the power management circuit board is connected to the second end of the multiple wires.

6. The method for preparing the power modulation management block as described in claim 5, characterized in that, The thickness of the nickel plating layer is 3μm~11μm.

7. The method for preparing the power modulation management block as described in claim 5, characterized in that, The thickness of the gold plating layer is 1μm to 5μm.

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