Organic light-emitting device using organic light-emitting diodes

Abstract

The present invention relates to an organic light-emitting device using an organic light-emitting diode. By replacing grid-shaped auxiliary lines with linear shapes, the lighting device achieves an improved aperture ratio. Furthermore, a high-resistance conductive layer is formed over the entire surface to control overcurrent caused by short circuits, and island-shaped anodes are formed in the light-emitting region to reduce resistance in the pixel, thereby preventing a decrease in brightness.

Description

[0001] This application is a divisional application of the Chinese patent application entitled "Lighting device using organic light-emitting diodes" and application number 201910604746.6. Patent application 201910604746.6 is an invention patent application submitted to the China Patent Office on July 5, 2019 under the Paris Treaty.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of Korean Patent Application No. 10-2018-0085280 filed on July 23, 2018, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0004] The present disclosure relates to a light emitting device, and more particularly to a light emitting device using an organic light emitting diode. Background Art

[0005] Fluorescent lamps or incandescent lamps are currently used as lighting devices. Incandescent lamps have a good color rendering index (CRI), but very low energy efficiency. Fluorescent lamps have good energy efficiency, but have a low CRI and contain mercury, which causes environmental problems.

[0006] CRI is a quantitative measure of a light source's ability to faithfully display the colors of various objects compared to an ideal or natural light source. Sunlight has a CRI of 100.

[0007] To overcome these problems with existing lighting devices, light-emitting diodes (LEDs) have recently been proposed as lighting devices. LEDs are made of inorganic luminescent materials and have the highest luminous efficiency in the red wavelength range. This efficiency decreases towards the green wavelength range, which has the highest luminous factor. Therefore, when combining red, green, and blue LEDs to emit white light, the luminous efficiency decreases.

[0008] As another alternative, lighting devices using organic light-emitting diodes (OLEDs) are being developed. In lighting devices using OLEDs, an anode made of ITO is formed on a glass substrate. Then, an organic layer and a cathode are formed on the anode, and a passivation layer and a laminate film are formed thereon.

[0009] A disadvantage of such an organic light emitting diode lighting device is that when a short circuit occurs due to particles in a pixel, the overall brightness of the pixel and the panel decreases due to a drop in current. Summary of the Invention

[0010] An object of the present disclosure is to provide a light emitting device using an organic light emitting diode that prevents the existing problem that the overall brightness of a panel is reduced when a short circuit occurs.

[0011] Another object of the present disclosure is to provide a light emitting device using an organic light emitting diode that prevents this problem without compromising an aperture ratio.

[0012] The objects of the present disclosure are not limited to the above objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0013] According to one aspect of the present disclosure, there is provided a lighting device using an organic light-emitting diode, including: a conductive layer provided on a substrate; auxiliary lines arranged in a linear shape on the conductive layer; an anode provided in each of pixels between the auxiliary lines and made of a conductive material having a resistance lower than that of the conductive layer; a passivation layer provided on the auxiliary lines; an organic layer and a cathode provided in a light-emitting region of the substrate in which the passivation layer is provided; and a metal film provided in the light-emitting region of the substrate.

[0014] According to another aspect of the present invention, a lighting device using an organic light-emitting diode is provided, comprising: a conductive layer provided on a substrate; auxiliary lines arranged in a linear shape on the conductive layer; an anode provided in each pixel between the auxiliary lines and made of a conductive material having a lower resistance than that of the conductive layer; a passivation layer provided on the auxiliary lines; an organic layer and a cathode provided in a light-emitting region of the substrate, where the passivation layer is provided; and a metal film provided in the light-emitting region of the substrate. Current differences caused by the positions of the pixels in the panel are compensated for by adjusting the distance between the auxiliary lines and the anode in each pixel.

[0015] Additional details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0016] According to an exemplary embodiment of the present disclosure, by using a conductive layer having high resistance, the short reduction pattern and the vertical auxiliary line can be eliminated, thereby increasing the light emitting area. As a result, the brightness can be improved.

[0017] In addition, according to an exemplary embodiment of the present disclosure, the life of the lighting device may be extended by increasing the aperture ratio.

[0018] The effects according to the present disclosure are not limited to the above-exemplified contents, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a cross-sectional view illustrating an example of a lighting device using an organic light emitting diode according to a first exemplary embodiment of the present disclosure.

[0021] Figure 2 is a plan view illustrating an example of a lighting device using an organic light emitting diode according to a first exemplary embodiment of the present disclosure.

[0022] Figure 3 The lighting device according to the first exemplary embodiment is arranged along Figure 2 A cross-sectional view taken along line II′.

[0023] Figure 4A and Figure 4B It shows Figure 2 An enlarged view of a portion of the lighting device shown in FIG.

[0024] Figures 5A to 5C is a plan view schematically illustrating a lighting device using an organic light emitting diode according to a second exemplary embodiment of the present disclosure.

[0025] Figure 6 FIG. 1 is a diagram showing a lighting device using an organic light emitting diode according to a second exemplary embodiment. Figure 5A A cross-sectional view taken along line II-II′.

[0026] 7A to 7C is a cross-sectional view illustrating an example of a stack structure of organic layers according to an exemplary embodiment of the present disclosure.

[0027] Figure 8 It shows that according to Figure 5A FIG. 1 is a view of a portion of a light emitting area in a lighting device using an organic light emitting diode according to a second exemplary embodiment shown in FIG.

[0028] Figure 9 is a plan view illustrating a portion of a light emitting area in a lighting device using an organic light emitting diode according to a third exemplary embodiment of the present disclosure.

[0029] 10A to 10F is used to show the manufacturing Figure 5A FIG. 1 is a plan view showing a method for a lighting device using an organic light emitting diode according to a second exemplary embodiment.

[0030] Figures 11A to 11F is used to show the manufacturing Figure 6 FIG. 2 is a cross-sectional view showing a method for a lighting device using an organic light emitting diode according to a second exemplary embodiment. DETAILED DESCRIPTION

[0031] The advantages and features of the present disclosure and the methods for achieving the advantages and features will become clear by reference to the exemplary embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only as examples so that those skilled in the art can fully understand the disclosure and scope of the present disclosure. Therefore, the present disclosure will be limited only by the scope of the appended claims.

[0032] The shapes, sizes, ratios, angles, quantities, etc. shown in the drawings for describing the exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, the same reference numerals generally represent the same elements. In addition, in the following description of the present disclosure, detailed descriptions of known related arts may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including," "having," and "consisting of" used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only." Unless expressly stated otherwise, any reference to the singular may include the plural.

[0033] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0034] When terms such as "on," "above," "below," and "beside" are used to describe the positional relationship between two parts, one or more parts may be located between the two parts unless these terms are used together with the term "immediately" or "directly."

[0035] When an element or layer is referred to as being “on” another element or layer, the other layer or element can be directly on the other element or interposed therebetween.

[0036] Although the terms "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below may be the second component in the technical concept of the present disclosure.

[0037] Throughout the specification, like reference numerals generally refer to like elements.

[0038] The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present disclosure is not limited to the size and thickness of the illustrated components.

[0039] The features of the various embodiments of the present disclosure may be partially or completely coupled or combined with each other and may be interlocked and operated in various technical ways, and the embodiments may be performed independently of each other or in association with each other.

[0040] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0041] Figure 1 is a cross-sectional view illustrating an example of a lighting device using an organic light emitting diode according to a first exemplary embodiment of the present disclosure.

[0042] Figure 2 is a plan view illustrating an example of a lighting device using an organic light emitting diode according to a first exemplary embodiment of the present disclosure.

[0043] Figure 3 FIG. 1 is a diagram showing a lighting device according to a first exemplary embodiment. Figure 2 A cross-sectional view taken along line II′ in FIG.

[0044] Figure 4A and Figure 4B It shows Figure 2 An enlarged view of a portion of the light emitting area is shown in FIG. Figure 4B It shows Figure 4A A magnified image of a single pixel.

[0045] According to an exemplary embodiment of the present disclosure, a lighting device using an organic light emitting diode made of an organic material is provided, rather than a lighting device using an inorganic light emitting diode made of an inorganic material.

[0046] Organic light-emitting diodes (OLEDs) made of organic light-emitting materials exhibit better green and red light emission efficiencies than inorganic LEDs. Furthermore, because OLEDs have wider emission peaks for red, green, and blue light than inorganic LEDs, their CRI is improved, resulting in the light emitted from the lighting device becoming more like sunlight.

[0047] In the following description, as an example, a flexible lighting device is described as a lighting device according to an exemplary embodiment of the present disclosure. However, it should be understood that the present disclosure can also be applied to typical lighting devices.

[0048] Reference Figures 1 to 4A and Figure 4B The lighting device 100 using an organic light emitting diode according to the first exemplary embodiment of the present disclosure may include an organic light emitting diode unit 101 generating surface light emission, and an encapsulation unit 102 for encapsulating the organic light emitting diode unit 101 .

[0049] An external light extraction layer 145 may also be provided under the organic light emitting diode unit 101 to increase haze. However, it should be understood that the present disclosure is not limited thereto, and the external light extraction layer may be eliminated.

[0050] The external light extraction layer 145 may be formed by dispersing scattering particles such as TiO 2 in a resin, and may be attached under the substrate 110 through an adhesive layer (not shown).

[0051] The organic light emitting diode unit 101 may include an organic light emitting diode disposed on a substrate 110, and an internal light extraction layer 146 may be further disposed between the substrate 110 and the organic light emitting diode. However, it should be understood that the present disclosure is not limited thereto, and the internal light extraction layer may be eliminated.

[0052] A planarization layer (not shown) may be further disposed on the internal light extraction layer 146 .

[0053] Specifically, refer to Figure 3 The lighting device 100 according to the exemplary embodiment of the present disclosure may include: a light emitting area EA, where light is actually emitted and output to the outside; and pad areas PA1 and PA2, where pad electrodes 127 and 128 are respectively connected to external devices to apply signals to the light emitting area EA.

[0054] The pad regions PA1 and PA2 are not covered by the sealing means of the metal film 170 and / or the protective film 175 and thus can be electrically connected to an external device through the pad electrodes 127 and 128, respectively. Therefore, in addition to the pad regions PA1 and PA2, the metal film 170 and / or the protective film 175 can be attached to the entire surface of the emission area EA of the substrate 110. However, it should be understood that the present disclosure is not limited thereto.

[0055] That is, the passivation layer 115, the organic layer 130, and the cathode 126 are not formed in the pad areas PA1 and PA2 outside the emission area EA, so the pad electrodes 127 and 128 may be exposed to the outside. Although not shown in the drawings, a second passivation layer of an organic material and a third passivation layer of an inorganic material may be further formed in the emission area EA to cover the organic layer 130 and the cathode 126. However, it should be understood that the present disclosure is not limited thereto.

[0056] A portion of the passivation layer 115 on the second pad electrode 128 in the emission area EA may be removed so that a contact hole 114 may be formed to expose the second pad electrode 128. Thus, the cathode 126 may be electrically connected to the second pad electrode 128 through the contact hole 114.

[0057] The pad areas PA1 and PA2 may be located outside the emission area EA. Figure 2 In the illustrated example, the second pad area PA2 is located between the first pad areas PA1, but the present disclosure is not limited thereto.

[0058] in addition, Figure 2The example in which the pad areas PA1 and PA2 are located only on one outer side of the emission area EA is shown, but the present disclosure is not limited thereto. In other embodiments, the pad areas PA1 and PA2 may be located on both outer sides of the emission area EA. In addition, according to another exemplary embodiment of the present disclosure, the first pad area PA1 may be located on one outer side of the emission area EA, and the second pad area PA2 may be located on the other side of the emission area EA.

[0059] The organic light emitting diode unit 101 will be described in detail. An anode 116 and a cathode 126 are provided on a substrate 110, and an organic layer 130 is provided between the anode 116 and the cathode 126 to form an organic light emitting diode (OLED).

[0060] In addition, the organic light emitting diode unit may further include an auxiliary line 111 for supplementing the conductivity of the anode 116 ; and a passivation layer 115 for preventing a short circuit between the anode 116 and the cathode 126 .

[0061] In the lighting device 100 having the above-described structure, when current is applied to the anode 116 and the cathode 126 of the organic light emitting diode, the organic layer 130 emits light through the emission area EA.

[0062] The substrate 110 may be made of transparent glass or a flexible polymer material.

[0063] The anode 116 may provide holes to the organic layer 130, and the cathode 126 may provide electrons to the organic layer 130. However, it should be understood that the present disclosure is not limited thereto. The anode 116 and the cathode 126 may have different functions.

[0064] The anode 116 may be formed of indium tin oxide (TO) or indium zinc oxide (IZO), which are transparent metal oxide materials having a high work function and high conductivity to facilitate injection of holes into the organic layer 130 .

[0065] The anode 116 may be divided into a first anode 116 a in the light emitting region 105 and a second anode 116 b in the non-light emitting region except the light emitting region 105 .

[0066] The second anode 116b may be disposed on the auxiliary line 111 to cover the auxiliary line 111. The first anode 116a may be formed in the light emitting region 105 defined by the auxiliary line 111 in a grid form.

[0067] The cathode 126 may be made of a conductive material having a low work function to facilitate injection of electrons into the organic layer 130. Examples of the material of the cathode 126 may include metals such as magnesium (Mg), calcium (Ca), sodium (Na), titanium (Ti), indium (In), yttrium (Y), lithium (Li), gadolinium (Gd), aluminum (Al), silver (Ag), tin (Sn), and lead (Pb), or alloys thereof.

[0068] The organic layer 130 may be composed of a single stack structure including a red organic light-emitting layer, a multi-stack tandem structure including a plurality of red organic light-emitting layers, or a multi-stack tandem structure including red / green organic light-emitting layers and a sky blue organic light-emitting layer. However, it should be understood that the organic layer 130 of the present disclosure is not limited to the above structure and may adopt various structures.

[0069] The organic layer 130 may further include an electron injection layer and a hole injection layer for injecting electrons and holes into the organic light-emitting layer, respectively, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the organic light-emitting layer, respectively, and a charge generation layer for generating charges such as electrons and holes.

[0070] When current is applied to the anode 116 and the cathode 126, electrons are injected from the cathode 126 into the organic layer 130, while holes are injected from the anode 116 into the organic layer 130. Thereafter, excitons are generated in the organic layer 130. As the excitons decay, light is generated, which is equal to the energy difference between the lowest unoccupied molecular orbital (LUMO) and the highest occupied molecular orbital (HOMO).

[0071] Light generated in the organic layer 130 may travel upward (top emission) or downward (bottom emission) depending on the transmittance and reflectance of the anode 116 and the cathode 126 .

[0072] For example, when anode 116 is a transparent electrode and cathode 126 is a reflective electrode, light generated in organic layer 130 is reflected by cathode 126 and transmitted through anode 116, thereby emitting through the bottom of organic light-emitting diode unit 101. In other words, organic light-emitting diode unit 101 is a bottom-emitting type. However, it should be understood that the present disclosure is not limited to this. When anode 116 is a reflective electrode and cathode 126 is a transparent electrode, organic light-emitting diode unit 101 may be a top-emitting type.

[0073] A buffer layer (not shown) may be provided under the anode 116 to block moisture and air from penetrating through the substrate 110 and the internal light extraction layer 146. To this end, the buffer layer 240 may be composed of a single layer of an inorganic material such as silicon oxide (SiOx) and silicon nitride (SiNx) or a composite layer of an inorganic material and an organic material, as needed.

[0074] The internal light extraction layer 146 may be disposed between the substrate 110 and the buffer layer to improve efficiency in extracting light generated from the organic light emitting device to the outside.

[0075] Internal light extraction layer 146 can enhance internal light scattering and surface roughness by embedding titanium dioxide (TiO2) particles in a resin, thereby improving light extraction efficiency. For example, internal light extraction layer 146 can be inkjet coated to a thickness of 450 nm, and the diameter of the TiO2 particles can be in the range of 200 nm to 300 nm. It should be noted that these specific values ​​can vary depending on the design of lighting device 100.

[0076] A planarization layer may be disposed on the internal light extraction layer 146 to compensate for surface roughness of the internal light extraction layer 146 and improve reliability of the organic light emitting diode unit 101 .

[0077] The planarization layer is formed by embedding zirconium oxide particles in a resin and can compensate for the surface roughness of the internal light extraction layer 146. As an example, the planarization layer can be formed by inkjet coating so that it has a thickness of 150 nm, and the diameter of the zirconium oxide particles can be 50 nm. It should be noted that these specific values ​​can vary depending on the design of the lighting device 100.

[0078] The encapsulation unit 102 may cover the organic light emitting diode unit 101 and block external influences to protect the organic light emitting diode unit 101. The encapsulation unit 102 may include an adhesive layer 160 in contact with the cathode 126, a metal film 170 in contact with the adhesive layer 160, and a protective film 175 attached to the metal film 170.

[0079] The adhesive layer 160 may be implemented as a pressure sensitive adhesive (PSA) for attaching the metal film 170 to the organic light emitting diode unit 101. The thickness of the adhesive layer 160 may be about 30 μm. However, it should be understood that the present disclosure is not limited thereto, and the thickness may vary according to the design choice of the lighting device 100.

[0080] The metal film 170 is provided on the adhesive layer 160 and serves to maintain the rigidity of the lighting device 100. To this end, the metal film 170 may be formed of copper (Cu) with a thickness of approximately 20 μm. However, it should be understood that the present disclosure is not limited thereto, and the thickness may vary according to the design choice of the lighting device 100.

[0081] A protective film 175 may be provided on the metal film 170 to absorb external impacts and thereby protect the lighting device 100. To this end, the protective film 175 may be implemented as a polyethylene terephthalate (PET) polymer film having a thickness of approximately 100 μm. However, it should be understood that the present disclosure is not limited thereto, and the protective film 175 may be modified according to the design of the lighting device 100.

[0082] Incidentally, in the lighting device 100 using an organic light emitting diode, when a short circuit occurs between the anode 116 and the cathode 126 due to particles, a current drop occurs across the entire panel, so that the overall brightness of the short-circuited panel and pixels may decrease.

[0083] In view of the foregoing, in the lighting device 100 according to the first exemplary embodiment of the present disclosure, a short-circuit reduction pattern SR is formed on the anode 116, to which current is supplied, in each pixel by forming a narrow path. The short-circuit reduction pattern SR is covered with a passivation layer 115 to prevent short circuits throughout the entire panel. In other words, the short-circuit reduction pattern SR surrounds the light-emitting area 105 of each pixel. By adding a resistor to each pixel in this manner, the current that would otherwise flow in a short circuit is limited.

[0084] However, as the short-circuit reduction pattern SR is added to each pixel, the total aperture ratio is reduced by about 8.5% compared to the existing device. That is, as the short-circuit reduction pattern SR is added to the boundary of the light-emitting area 105, the minimum margin of the passivation layer 115 covering the short-circuit reduction pattern SR increases, resulting in a decrease in the aperture ratio.

[0085] In view of the above, according to the second and third exemplary embodiments of the present disclosure, the auxiliary lines are formed in a line shape instead of a grid shape, and a high-resistance conductive layer is formed on the entire surface of the substrate to replace the function of the short-circuit reduction pattern. By doing so, the aperture ratio can be improved.

[0086] Furthermore, according to the second and third exemplary embodiments of the present disclosure, an island-shaped anode is additionally formed only in the light emitting region to reduce resistance, thereby preventing luminance from being reduced due to a conductive layer having high resistance.

[0087] Figures 5A to 5C is a plan view schematically illustrating a lighting device using an organic light emitting diode according to a second exemplary embodiment of the present disclosure.

[0088] Figure 5B is a plan view of a lighting device from which an organic layer, a cathode, and an encapsulation unit are partially removed. Figure 5C is a plan view of a lighting device from which an organic layer, a cathode, and an encapsulation unit are completely removed.

[0089] Figure 6 FIG. 1 is a diagram showing a lighting device using an organic light emitting diode according to a second exemplary embodiment. Figure 5A A cross-sectional view taken along line II-II′.

[0090] According to an exemplary embodiment of the present disclosure, a lighting device uses an organic light emitting diode made of an organic material. In a lighting device using an organic light emitting diode, a TFT for driving may not be provided in each pixel.

[0091] As described above, the lighting device using the organic light emitting diode according to the second exemplary embodiment of the present disclosure may include an organic light emitting diode unit generating surface light emission, and an encapsulation unit encapsulating the organic light emitting diode unit.

[0092] An external light extraction layer may also be provided under the organic light emitting diode unit to increase haze. However, it should be understood that the present disclosure is not limited thereto, and the external light extraction layer may be eliminated.

[0093] The external light extraction layer 145 may be formed by dispersing scattering particles such as TiO 2 in a resin, and may be attached under the substrate through an adhesive layer.

[0094] The organic light emitting diode unit may include an organic light emitting diode disposed on a substrate, and an internal light extraction layer may be further disposed between the substrate and the organic light emitting diode. However, it should be understood that the present disclosure is not limited thereto, and the internal light extraction layer may be eliminated.

[0095] A planarization layer may also be provided on the internal light extraction layer.

[0096] In particular, refer to Figures 5A to 5C and Figure 6 , the lighting device 200 according to the second exemplary embodiment of the present disclosure may include: a light emitting area EA, in which light is actually emitted and output to the outside; and pad areas PA1 and PA2, in which pad electrodes 227 and 228 are respectively connected to external devices to apply signals to the light emitting area EA.

[0097] The pad regions PA1 and PA2 are not covered by the sealing means of the metal film 270 and / or the protective film 275 and can therefore be electrically connected to an external device via the pad electrodes 227 and 228, respectively. The pad electrodes 227 and 228 can be exposed to the outside through the openings OP1 and OP2, respectively. Therefore, the metal film 270 and / or the protective film 275 can be attached to the entire surface of the emission area EA of the substrate 210, excluding the pad regions PA1 and PA2. However, it should be understood that the present disclosure is not limited thereto.

[0098] Specifically, the organic layer 230 and cathode 226 are not formed in the pad areas PA1 and PA2 outside the emission area EA, and the passivation layer 215 is partially removed to form openings OP1 and OP2. Therefore, the pad electrodes 227 and 228 can be exposed to the outside through the openings OP1 and OP2. Although not shown in the drawings, a second passivation layer of an organic material and a third passivation layer of an inorganic material can also be formed in the emission area EA to cover the organic layer 230 and cathode 226. However, it should be understood that the present disclosure is not limited to this.

[0099] In addition, a portion of the passivation layer 215 on the second pad electrode 228 in the emission area EA may be removed so that a contact hole 214 for exposing the second pad electrode 228 may be formed.

[0100] The pad areas PA1 and PA2 may be located outside the emission area EA. Figure 5A In the example shown in FIG. 5C , the second pad area PA2 is located between the first pad areas PA1 , but the present disclosure is not limited thereto.

[0101] in addition, Figures 5A to 5C The example in which the pad areas PA1 and PA2 are located only on one outer side of the emission area EA is shown, but the present disclosure is not limited thereto. In other embodiments, the pad areas PA1 and PA2 may be located on both outer sides of the emission area EA. In addition, according to another exemplary embodiment of the present disclosure, the first pad area PA1 may be located on one outer side of the emission area EA, and the second pad area PA2 may be located on the other side of the emission area EA.

[0102] Next, the organic light emitting diode unit will be described in detail: an anode 216 and a cathode 226 are provided on the substrate 210, and an organic layer 230 is provided between the anode 216 and the cathode 226 to form an organic light emitting diode.

[0103] In addition, the organic light emitting diode unit may further include an auxiliary line 211 for supplementing the conductivity of the anode 216 ; and a passivation layer 215 for preventing a short circuit between the anode 216 and the cathode 226 .

[0104] In the lighting device 200 having the above-described structure, when current is applied to the anode 216 and the cathode 226 of the organic light emitting diode, the organic layer 230 emits light through the emission area EA.

[0105] The substrate 210 may be made of transparent glass or a flexible polymer material.

[0106] The buffer layer 240 may be disposed on the substrate 210. However, it should be understood that the present disclosure is not limited thereto.

[0107] On the buffer layer 240 , the conductive layer 213 having high resistance according to the second exemplary embodiment may be disposed.

[0108] The conductive layer 213 may be made of a material having a 4 Ω / □ to 10 5 Made of transparent conductive material with high resistance of Ω / □.

[0109] The conductive layer 213 may include a first conductive layer 213a disposed in the emission area EA and the first pad area PA1, and a second conductive layer 213b disposed in the second pad area PA2. The first conductive layer 213a and the second conductive layer 213b may be separated from each other in the emission area EA.

[0110] The conductive layer 213 having a high resistance can limit the current flowing in a short circuit, so the short circuit reduction pattern according to the first exemplary embodiment of the present disclosure can be eliminated. In addition, the auxiliary line 211 has a line shape instead of the existing grid shape, so the aperture ratio can also be improved. In addition, since the vertical auxiliary lines used to form the non-luminous area in the pixel can be eliminated, the luminous area can be significantly widened. The auxiliary line 211 may include a plurality of first auxiliary lines 211a in the horizontal direction and a second auxiliary line 211b in the vertical direction connected between the ends of the first auxiliary lines 211a. However, it should be understood that the present disclosure is not limited to this. The auxiliary line 211 according to some exemplary embodiments of the present disclosure may not include the second auxiliary line 211b.

[0111] In addition, in the lighting device 200 according to the second exemplary embodiment, a plurality of connection lines 219; 219a, 219b, and 219c are provided on its edge so that the first pad electrode 227 is connected to the auxiliary line 211, so that current is supplied vertically and horizontally to improve brightness uniformity. For example, the connection lines 219; 219a, 219b, and 219c may include: a first connection line 219a for connecting between the first pad electrode 227 and the first auxiliary line 211a located on the upper side to supply current from above; a second connection line 219b for connecting between the first pad electrode 227 and the second auxiliary lines 211b located on the left and right sides to supply current from the left and right sides; and a third connection line 219c for connecting between the first pad electrode 227 and the first auxiliary line 211a located on the lower side to supply current from below.

[0112] Connection lines 219; 219a, 219b, and 219c may be formed on the first conductive layer 213a.

[0113] The connection lines 219; 219a, 219b, and 219c may be made of the same material and in the same layer as the anode 216. However, it should be understood that the present disclosure is not limited thereto.

[0114] First and second auxiliary pad electrodes 217 and 218 made of the same material as the auxiliary line 211 may be further disposed under the first and second pad electrodes 227 and 228. However, it should be understood that the present disclosure is not limited thereto.

[0115] In addition, according to the second and third exemplary embodiments of the present disclosure, the island-shaped anode 216 is additionally formed in the light emitting region to reduce the resistance of the light emitting region, thereby preventing the brightness from being reduced due to the conductive layer having high resistance.

[0116] As described above, the anode 216 may provide holes to the organic layer 230, and the cathode 226 may provide electrons to the organic layer 230. However, it should be understood that the present disclosure is not limited thereto. The anode 216 and the cathode 226 may have different functions.

[0117] The anode 216 may be formed of indium tin oxide (TO) or indium zinc oxide (IZO), which are transparent metal oxide materials having a high work function and higher conductivity than the conductive layer 213 to facilitate injection of holes into the organic layer 230 .

[0118] The anode 216 according to the second exemplary embodiment may be formed in a substantially rectangular island shape to define a light-emitting region. That is, the region where the anode 216 and the cathode 226 overlap each other may be defined as a light-emitting region where light is generated in the organic layer 230 disposed between the anode 216 and the cathode 226. However, it should be understood that the present disclosure is not limited thereto.

[0119] The cathode 226 may be made of a conductive material having a low work function to facilitate injection of electrons into the organic layer 230. Examples of the material of the cathode 226 may include metals such as magnesium (Mg), calcium (Ca), sodium (Na), titanium (Ti), indium (In), yttrium (Y), lithium (Li), gadolinium (Gd), aluminum (Al), silver (Ag), tin (Sn), and lead (Pb), or alloys thereof.

[0120] The organic layer 230 may be formed of a single stack structure including a red organic light-emitting layer, a multi-stack tandem structure including a plurality of red organic light-emitting layers, or a multi-stack tandem structure including red / green organic light-emitting layers and a sky-blue organic light-emitting layer. However, it should be understood that the organic layer 230 of the present disclosure is not limited to the above structures and may adopt various structures.

[0121] 7A to 7C is a cross-sectional view illustrating an example of a stack structure of organic layers according to an exemplary embodiment of the present disclosure.

[0122] Specifically, Figure 7A A single stack of organic layers 230 is shown, Figure 7B The organic layer 230 includes a double stack tandem structure. Figure 7C An organic layer 230 is shown having a tandem structure including three stacks.

[0123] Reference Figure 7A The organic layer 230 may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, an organic light emitting layer EML, an electron transport layer ETL, and an electron injection layer EIL, which are sequentially stacked on one another.

[0124] The hole injection layer HIL is an organic layer that helps inject holes from the anode 216 into the organic light-emitting layer EML. The hole injection layer HIL may be made of a material including at least one selected from the group consisting of HAT-CN (dipyrazino[2,3-f:2′,3′-h]quinoxaline-2,3,6,7,10,11-hexacarbonitrile), CuPc (copper phthalocyanine), F4-TCNQ (2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-quinodimethane), and NPD (N,N′-bis(naphthalen-1-yl)-N,N′-bis(phenyl)-2,2′-dimethylbenzidine), but is not limited thereto.

[0125] The hole transport layer (HTL) is an organic layer that helps transfer holes from the hole injection layer (HIL) to the organic light-emitting layer (EML). The hole transport layer (HTL) may be made of a material including at least one selected from the group consisting of NPD (N,N′-bis(naphthalene-1-yl)-N,N′-bis(phenyl)-2,2′-dimethylbenzidine), TPD (N,N′-bis-(3-methylphenyl)-N,N′-bis(phenyl)-benzidine), s-TAD (2,2′,7,7′-tetrakis(N,N-dimethylamino)-9,9-spirofluorene), and MTDATA (4,4′,4″-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine), but is not limited thereto.

[0126] The electron blocking layer (EBL) is an organic layer that prevents electrons injected into the organic light-emitting layer (EML) from overflowing into the hole transport layer (HTL). By inhibiting the movement of electrons, the electron blocking layer (EBL) can improve the bonding of holes and electrons in the organic light-emitting layer (EML), thereby increasing the luminous efficiency of the organic light-emitting layer (EML). The electron blocking layer (EBL) can be made of the same material as the hole transport layer (HTL). While the hole transport layer (HTL) and the electron blocking layer (EBL) can be formed as separate layers, the present disclosure is not limited thereto. The hole transport layer (HTL) and the electron blocking layer (EBL) can be formed as a single piece.

[0127] In the organic light emitting layer EML, holes supplied from the anode 216 and electrons supplied from the cathode 226 are recombined to generate excitons. A region where the excitons are generated may be referred to as a light emitting region or a recombination region.

[0128] The organic light emitting layer (EML) may be disposed between the hole transport layer (HTL) and the electron transport layer (ETL) and may include a material that may emit light of a specific color. The organic light emitting layer (EML) may include a material that may emit red light.

[0129] The organic light emitting layer EML may have a host-dopant system in which a light emitting dopant material is doped into a host material occupying a large weight ratio so that the light emitting dopant material has a small weight ratio.

[0130] The organic light-emitting layer (EML) may include a plurality of host materials or a single host material. The organic light-emitting layer (EML) including the plurality of host materials or the single host material may be doped with a red phosphorescent dopant material. That is, the organic light-emitting layer (EML) may be a red light-emitting layer, and the wavelength of light emitted from the organic light-emitting layer (EML) may be in the range of approximately 600 nm to 660 nm.

[0131] The red phosphorescent dopant material is a substance capable of emitting red light. The EL spectrum of light emitted from the organic light emitting layer EML doped with the red phosphorescent dopant material may have a peak at or near a red wavelength.

[0132] The red phosphorescent dopant material can be formed from a material including, but not limited to, at least one of the following: iridium (Ir) ligand complexes, including Ir(ppy)3(facial tris(2-phenylpyridine)iridium), PIQIr(acac)(bis(1-phenylisoquinolinato)iridium acetylacetonate), PQIr(acac)(bis(1-phenylquinolinato)iridium acetylacetonate), PQIr(tris(1-phenylquinolinato)iridium), Ir(piq)3(tris(1-phenylisoquinolinato)iridium) and Ir(piq)2(acac)(bis(1-phenylisoquinolinato)(acetylacetonate)iridium), PtOEP(octaethylporphyrin platinum) PBD:Eu(DBM)3(Phen) and perylene.

[0133] The electron transport layer ETL receives electrons from the electron injection layer EIL and transports the provided electrons to the organic light emitting layer EML.

[0134] In addition, the electron transport layer ETL may function as a hole blocking layer HBL, which may suppress leakage of holes that do not participate in recombination in the organic light emitting layer EML.

[0135] The electron transport layer ETL may be made of, but not limited to, at least one selected from the group consisting of: Liq (8-hydroxyquinoline lithium), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4- triazole), TAZ (3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), and BAlq (bis(2-methyl-8-quinolinolato)-4-(phenylphenol)aluminum).

[0136] The electron injection layer (EIL) facilitates electron injection from the cathode 226 to the organic light emitting layer (EML). The EIL may be made of, but is not limited to, a material including at least one of alkali metals or alkaline earth metals in ion form, such as LiF, BaF2, and CsF.

[0137] According to the structure and characteristics of the lighting device 200 using the organic light emitting diode, the electron injection layer EIL and the electron transport layer ETL may be eliminated.

[0138] Reference Figure 7B The organic layer 230 may include a first stack body ST1 including a first organic light emitting layer EML1, a second stack body ST2 including a second organic light emitting layer EML2, and a charge generation layer CGL disposed between the first stack body ST1 and the second stack body ST2.

[0139] The first stack ST1 may include an electron injection layer EIL, a first electron transport layer ETL1, a first organic light-emitting layer EML1, a first electron blocking layer EBL1, and a first hole transport layer HTL1. The second stack ST2 may include a second electron transport layer ETL2, a second organic light-emitting layer EML2, a second electron blocking layer EBL2, a second hole transport layer HTL2, and a hole injection layer HIL. The functions and configurations of the layers have been described above.

[0140] The charge generation layer CGL may be disposed between the first stack ST1 and the second stack ST2. The charge generation layer CGL may provide charges to the first stack ST1 and the second stack ST2 to balance charges between the first stack ST1 and the second stack ST2.

[0141] The charge generation layer CGL may include an n-type charge generation layer N-CGL and a p-type charge generation layer P-CGL. The n-type charge generation layer N-CGL may be in contact with the second electron transport layer ETL2. The p-type charge generation layer P-CGL may be disposed between the n-type charge generation layer N-CGL and the first hole transport layer HTL1. Although the charge generation layer CGL may be formed of multiple layers including the n-type charge generation layer N-CGL and the p-type charge generation layer P-CGL, the present disclosure is not limited thereto. The charge generation layer CGL may be composed of a single layer.

[0142] The n-type charge generation layer N-CGL can inject electrons into the first stack ST1. The n-type charge generation layer N-CGL may include an n-type dopant material and an n-type host material. The n-type dopant material may be a metal from Group I or Group II of the periodic table, an organic material into which electrons can be injected, or a mixture thereof. For example, the n-type dopant material may be an alkali metal or an alkaline earth metal. That is, the n-type charge generation layer N-CGL may be made of (but not limited to) an alkali metal such as lithium (Li), sodium (Na), potassium (K), and cesium (Cs), or an alkaline earth metal such as magnesium (Mg), strontium (Sr), barium (Ba), and radium (Ra). For example, the n-type host material may be made of, but not limited to, Alq3 (tris(8-hydroxyquinoline)aluminum), Liq (8-hydroxyquinoline-lithium), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-diol), or a metal capable of transferring electrons. triazole), TAZ (3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), spiro-PBD and BAlq (bis(2-methyl-8-quinolinolato)-4-(phenylphenol)aluminum), SAlq, TPBi (2,2′,2″-(1,3,5-phenyltriyl)-tris(1-phenyl-1-H-benzimidazole), Oxadiazole, triazole, phenanthroline, benzo The invention is made of at least one material selected from the group consisting of azole and benzothiazole.

[0143] The p-type charge generation layer P-CGL can inject holes into the second stack ST2. The p-type charge generation layer P-CGL may include a p-type dopant material and a p-type host material. The p-type dopant material may be made of, but is not limited to, a metal oxide, an organic material such as tetrakis(fluoro)-tetrakis(cyano)quinodimethane (F4-TCNQ), HAT-CN (hexaazatriphenylene-hexanitrile), and hexaazatriphenylene, or a metal material such as V2O5, MoOx, and WO3. The p-type host material may be made of a material capable of transporting holes, including but not limited to at least one of NPD (N,N-dinaphthyl-N,N′-diphenylbenzidine) (N,N′-bis(naphthalene-1-yl)-N,N′-bis(phenyl)-2,2′-dimethylbenzidine), TPD (N,N′-bis-(3-methylphenyl)-N,N′-bis-(phenyl)-benzidine) and MTDATA (4,4′,4-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine).

[0144] Reference Figure 7C The organic layer 230 may include: a first stack body ST1, which includes a first organic light-emitting layer EML1; a second stack body ST2, which includes a second organic light-emitting layer EML2; a third stack body ST3, which includes a third organic light-emitting layer EML3; a first charge generation layer CGL1 arranged between the first stack body ST1 and the second stack body ST2; and a second charge generation layer CGL2 arranged between the second stack body ST2 and the third stack body ST3.

[0145] The first stack ST1 may include an electron injection layer EIL, a first electron transport layer ETL1, a first organic light-emitting layer EML1, a first electron blocking layer EBL1, and a first hole transport layer HTL1. The second stack ST2 may include a second electron transport layer ETL2, a second organic light-emitting layer EML2, a second electron blocking layer EBL2, and a second hole transport layer HTL2. The third stack ST3 may include a third electron transport layer ETL3, a third organic light-emitting layer EML3, a third electron blocking layer EBL3, a third hole transport layer HTL3, and a hole injection layer HIL. The functions and configurations of each layer have been described above.

[0146] The first charge generation layer CGL1 may include a first n-type charge generation layer N-CGL1 and a first p-type charge generation layer P-CGL1. The first n-type charge generation layer N-CGL1 may be in contact with the second electron transport layer ETL2. The first p-type charge generation layer P-CGL1 may be disposed between the first n-type charge generation layer N-CGL1 and the first hole transport layer HTL1.

[0147] The second charge generation layer CGL2 may include a second n-type charge generation layer N-CGL2 and a second p-type charge generation layer P-CGL2. The second n-type charge generation layer N-CGL2 may be in contact with the third electron transport layer ETL3. The second p-type charge generation layer P-CGL2 may be disposed between the second n-type charge generation layer N-CGL2 and the second hole transport layer HTL2. The functions and configurations of the first and second charge generation layers CGL1 and CGL2 are the same as described above.

[0148] The first organic light-emitting layer EML1 and the third organic light-emitting layer EML3 may be red-green organic light-emitting layers, and the wavelength of light emitted from the first organic light-emitting layer EML1 and the third organic light-emitting layer EML3 may be in the range of about 520 nm to 580 nm. In addition, the second organic light-emitting layer EML2 is a sky blue light-emitting layer, and the wavelength of light emitted from the second organic light-emitting layer EML2 may be in the range of about 450 nm to 480 nm.

[0149] As described above, when current is applied between the anode 216 and the cathode 226, electrons are injected from the cathode 226 into the organic layer 230, while holes are injected from the anode 216 into the organic layer 230. Thereafter, excitons are generated in the organic layer 230. As the excitons decay, light is generated, which is equal to the energy difference between the lowest unoccupied molecular orbital (LUMO) and the highest occupied molecular orbital (HOMO).

[0150] Light generated in the organic layer 230 may travel upward (top emission) or downward (bottom emission) according to the transmittance and reflectance of the conductive layer 213 , the anode 216 , and the cathode 226 .

[0151] For example, when the conductive layer 213 and the anode 216 are transparent electrodes and the cathode 226 is a reflective electrode, light generated in the organic layer 230 is reflected by the cathode 226 and transmitted through the conductive layer 213 and the anode 216, so that the light is emitted through the bottom of the organic light-emitting diode unit 101. In other words, the organic light-emitting diode unit is a bottom-emitting type. However, it should be understood that the present disclosure is not limited to this. When the conductive layer 213 and the anode 216 are reflective electrodes and the cathode 226 is a transparent electrode, the organic light-emitting diode unit 101 can be a top-emitting type.

[0152] Return to reference Figures 5A to 5C and Figure 6, the conductive layer 213 according to the second exemplary embodiment of the present disclosure can also serve as an internal light extraction layer. Therefore, a buffer layer 240 can be provided below the conductive layer 213. The buffer layer 240 can block moisture and air from penetrating through the substrate 210. To this end, the buffer layer 240 can be formed of a single layer of an inorganic material such as silicon oxide (SiOx) and silicon nitride (SiNx). If desired, the buffer layer 240 can be formed of a composite layer of an inorganic material and an organic material.

[0153] For example, the roughness of the surface of the conductive layer 213 in contact with the buffer layer 240 may be increased, thereby improving the efficiency of extracting light generated from the organic light emitting diode to the outside. However, it should be understood that the present disclosure is not limited thereto.

[0154] The encapsulation unit may cover the organic light emitting diode unit 101 and block external influences to protect the organic light emitting diode unit 101. The encapsulation unit 102 may include an adhesive layer 260 contacting the cathode 226, a metal film 270 contacting the adhesive layer 260, and a protective film 275 attached to the metal film 270.

[0155] The adhesive layer 260 may be implemented as a pressure sensitive adhesive (PSA) for attaching the metal film 270 to the organic light emitting diode unit 101. The thickness of the adhesive layer 260 may be about 30 μm. However, it should be understood that the present disclosure is not limited thereto, and the thickness may vary according to the design choice of the lighting device 200.

[0156] The metal film 270 is provided on the adhesive layer 260 and serves to maintain the rigidity of the lighting device 200. To this end, the metal film 270 may be formed of copper (Cu) with a thickness of approximately 20 μm. However, it should be understood that the present disclosure is not limited thereto, and the thickness may vary according to the design choice of the lighting device 200.

[0157] A protective film 275 may be provided on the metal film 270 to absorb external impacts and thereby protect the lighting device 200. To this end, the protective film 275 may be implemented as a polyethylene terephthalate (PET) polymer film having a thickness of approximately 100 μm. However, it should be understood that the present disclosure is not limited thereto, and the protective film 275 may be modified according to the design of the lighting device 200.

[0158] Incidentally, according to the second exemplary embodiment of the present disclosure, even if a short circuit occurs between the anode 216 and the cathode 226 due to particles, the conductive layer 213 having high resistance is formed on the entire surface of the substrate 210 , thereby preventing the short circuit in the entire panel.

[0159] That is, the conductive layer 213 having high resistance is formed on the entire surface of the substrate 210 so that resistance is added to the entire panel, thereby limiting current flowing in a short circuit.

[0160] Figure 8 It shows that according to Figure 5A FIG. 1 is a view of a portion of a light emitting area in a lighting device using an organic light emitting diode according to a second exemplary embodiment shown in FIG.

[0161] Reference Figure 8 In the lighting device 200 according to the second exemplary embodiment, the auxiliary lines are formed in a line shape instead of a grid shape, and a high-resistance conductive layer is formed on the entire surface of the substrate to replace the function of the short-circuit reduction pattern. By doing so, the aperture ratio can be improved.

[0162] In addition, in the lighting device 200 according to the second exemplary embodiment of the present disclosure, an island-shaped anode 216 is additionally formed in the light-emitting region 205, which is not covered by the passivation layer 215 to reduce resistance, thereby preventing the brightness from being reduced by the high-resistance conductive layer 213. By forming the anode 216 into an island shape, when a short circuit occurs in a pixel due to particles, only the pixel is extinguished.

[0163] That is, the anode 216 is provided in an island shape in each of the pixels between the first auxiliary lines 211 a and may be made of a conductive material having a lower resistance than that of the conductive layer 213 .

[0164] The conductive layer 213 having high resistance between the first auxiliary line 211a and the anode 216 can be used as a current path, so that the short reduction pattern can be omitted. Therefore, the aperture ratio can be increased due to the width of the short reduction pattern.

[0165] In addition, since the vertical auxiliary lines between the island-shaped anodes 216 are removed, the aperture ratio can be increased due to the width of the vertical auxiliary lines.

[0166] As a result, it can be seen that the opening ratio is improved to about 95.3%, which is about 13.4% higher than that of the first exemplary embodiment (ie, about 81.9%).

[0167] For example, the distance D2 between the island-shaped anodes 216 may be reduced to 4 μm or less. However, to implement a short reduction pattern, the distance D1 between the first auxiliary line 211a and the anode 216 may be greater than the distance D2. However, it should be understood that the present disclosure is not limited thereto.

[0168] As described above, by using the high resistance conductive layer 213, the short reduction pattern and the vertical auxiliary line can be eliminated, and the light emitting area 205 can be increased, thereby preventing the brightness from being reduced.

[0169] In addition, according to the exemplary embodiment of the present disclosure, by increasing the aperture ratio, the lifespan of the lighting device may be improved.

[0170] Return to reference Figures 1 to 8 , the anode 216 thus formed can extend to the first pad area PA1 on one outer side of the light emitting region to form a first pad electrode 227. A second pad electrode 228 electrically insulated from the anode 216 can be formed in the second pad area PA2. That is, the second pad electrode 228 can be provided in the same layer as the anode 216 and can be spaced apart and electrically isolated from the anode 216. In addition, the first conductive layer 213a below the first pad electrode 227 and the second conductive layer 213b below the second pad electrode 228 can also be electrically insulated from each other.

[0171] For example, in Figures 5A to 5C In the embodiment, the first conductive layer 213a may be formed substantially in a rectangular shape, in which an upper center portion is removed to form a concave portion, and the second conductive layer 213b may be disposed in the concave portion. However, it should be understood that the present disclosure is not limited thereto.

[0172] The auxiliary line 211 and the first auxiliary pad electrode 217 are respectively disposed in the emission area EA and the first pad area PA1 of the substrate 210 and may be electrically connected to each other through the first conductive layer 213 a and the connection line 219 .

[0173] Anode 216 and conductive layer 213 are made of a transparent conductive material and have the advantage of transmitting emitted light, but have the disadvantage of high electrical resistance compared to opaque metals. Therefore, when manufacturing a lighting device 200 having a large area, the current applied to the wide light-emitting area is unevenly distributed due to the relatively large electrical resistance. This uneven current distribution causes uneven brightness of the light emitted from lighting device 200.

[0174] To overcome this, a plurality of first auxiliary lines 211a made of an opaque conductive material are arranged in a linear shape across the entire light-emitting area EA, and perpendicular second auxiliary lines 211b are provided at both ends. As a result, a uniform current is applied to the anode 216 of the entire light-emitting area 205 of the light-emitting area EA, enabling the lighting device 200, which has a larger area, to emit light with uniform brightness.

[0175] The auxiliary line 211 may be made of a metal having good electrical conductivity (e.g., Al, Au, Cu, Ti, W, Mo, or alloys thereof). The auxiliary line 211 may have a double-layer structure of an upper auxiliary line and a lower auxiliary line. However, the present disclosure is not limited thereto. The auxiliary line 211 may be composed of a single layer.

[0176] The passivation layer 215 may be stacked in a portion of the pad regions PA1 and PA2 and the emission region EA of the substrate 210. The passivation layer 215 may be removed in the emission region 205 so that it is formed into a line shape to cover the auxiliary lines 211 arranged in a line shape. However, it should be understood that the present disclosure is not limited thereto.

[0177] The passivation layer 215 disposed in the emission area EA may cover the auxiliary line 211 and may maintain a predetermined distance from the anode 216. In particular, the passivation layer 215 in the emission area EA surrounds the auxiliary line 211 to reduce a level difference of the auxiliary line 211, so that various layers to be formed in subsequent processes can be reliably formed without being broken.

[0178] The passivation layer 215 may be made of an inorganic material such as SiOx and SiNx. However, the passivation layer 215 may be made of an organic material such as photo-acryl, or may be made of a multilayer of an inorganic material and an organic material.

[0179] The organic layer 230 and the cathode 226 may be disposed on the anode 216 and the passivation layer 215 disposed on the substrate 210. A portion of the passivation layer 215 on the second pad electrode 228 located in the emission area EA may be removed so that a contact hole 214 may be formed to expose the second pad electrode 228. The cathode 226 may be electrically connected to the second pad electrode 228 thereunder through the contact hole 214.

[0180] Since the passivation layer 215 is disposed on the auxiliary lines 211 in the emission area EA, the organic layer 230 above the auxiliary lines 211 does not contact the auxiliary lines 211, so that no organic light emitting diodes are formed above the auxiliary lines 211. In other words, in the emission area EA, organic light emitting diodes are formed only in the emission areas 205 having a substantially rectangular shape, for example, between the line-shaped auxiliary lines 211.

[0181] Although not shown in the drawings, a second passivation layer and a third passivation layer may be disposed on the substrate 210 on which the cathode 226 is formed.

[0182] The second passivation layer is formed to cover the organic layer 230 and the cathode 226 in the emission area EA, and may prevent moisture from penetrating into the organic layer 230 in the emission area EA.

[0183] In other words, according to an exemplary embodiment of the present disclosure, in addition to the sealing means of the adhesive layer 260 and the metal film 270, the second passivation layer and the third passivation layer are also formed to cover the organic layer 230 and the cathode 226 in the light-emitting area EA, so that moisture can be prevented from penetrating into the organic layer 230 that actually emits and outputs light of the lighting device 200.

[0184] The second passivation layer may be made of an organic material such as photopropylene. The third passivation layer may be made of an inorganic material such as SiOx and SiNx. However, it should be understood that the present disclosure is not limited thereto.

[0185] An encapsulant may be disposed on the third passivation layer and may include epoxy compounds, acrylate compounds, acrylic compounds, and the like.

[0186] As described above, in the first pad area PA1 of the substrate 210, the first pad electrode 227 electrically connected to the anode 216 can be exposed to the outside through the first opening OP1. In the second pad area PA2 of the substrate 210, the second pad electrode 228 electrically connected to the cathode 226 through the contact hole 214 can be exposed to the outside through the second opening OP2. Therefore, the first pad electrode 227 and the second pad electrode 228 are electrically connected to an external power source to apply current to the anode 216 and the cathode 226, respectively.

[0187] An adhesive layer 260 such as a pressure sensitive adhesive (PSA) may be provided on the third passivation layer, and a metal film 270 may be provided on the adhesive layer 260 so that the metal film 270 is attached to the third passivation layer. As a result, the lighting device 200 may be sealed.

[0188] The sealing arrangement of adhesive layer 260 and metal film 270 may be attached such that the second passivation layer and the third passivation layer are adequately covered.

[0189] In addition, the metal film 270 may be attached to the entire surface of the emission area EA of the substrate 210 except for the pad areas PA1 and PA2 .

[0190] The adhesive layer 260 may be formed of a photocurable adhesive or a thermosetting adhesive.

[0191] Although the anodes 216 in the respective pixels of the lighting device 200 according to the second exemplary embodiment of the present disclosure have substantially the same size, the present disclosure is not limited thereto. According to a third exemplary embodiment of the present disclosure, different pixels may have anodes of different sizes or different distances between the anodes and the auxiliary lines. The third exemplary embodiment of the present disclosure will be described below.

[0192] The lighting device according to the third exemplary embodiment of the present disclosure is substantially the same as the lighting device according to the second exemplary embodiment except for the size of an anode; therefore, redundant description will be omitted.

[0193] Figure 9 is a plan view illustrating a portion of a light emitting area in a lighting device using an organic light emitting diode according to a third exemplary embodiment of the present disclosure.

[0194] Reference Figure 9 In the lighting device according to the third exemplary embodiment, the first auxiliary lines 311a are formed in a linear shape rather than a grid shape, and similarly to the first exemplary embodiment, a high-resistance conductive layer 313 is formed to replace the short-circuit reduction pattern. This improves the aperture ratio.

[0195] Furthermore, in the lighting device according to the third exemplary embodiment of the present disclosure, an island-shaped anode 316 is additionally formed in the light-emitting region 305, which is not covered by the passivation layer 315 to reduce resistance, thereby preventing a decrease in brightness due to the high-resistance conductive layer. By forming the anode 316 into an island shape, when a short circuit occurs in a pixel due to particles, only that pixel is turned off.

[0196] The conductive layer 313 having high resistance between the first auxiliary line 311a and the anode 316 may serve as a current path, thereby forming a short reduction pattern. Therefore, an aperture ratio may be increased due to the width of the short reduction pattern.

[0197] In addition, since the vertical auxiliary lines between the island-shaped anodes 316 are removed, the aperture ratio can be increased due to the width of the vertical auxiliary lines.

[0198] For example, the distance D2 between the island anodes 316 may be reduced to 4 μm or less. However, to implement a short reduction pattern, the distances d1, d2, and d3 between the first auxiliary line 311a and the anode 316 may be greater than the distance D2. However, it should be understood that the present disclosure is not limited thereto.

[0199] As described above, by using the high resistance conductive layer 313, the short reduction pattern and the vertical auxiliary line can be eliminated, and the light emitting area 305 can be increased, thereby preventing the brightness from being reduced.

[0200] In addition, according to the exemplary embodiments of the present disclosure, the life of the lighting device may be extended by increasing the aperture ratio.

[0201] In addition, according to the third exemplary embodiment of the present disclosure, different pixels have different distances between the first auxiliary line 311a and the anode 316 (ie, anodes 316 of different sizes), thereby canceling out current differences caused by the positions of the pixels in the panel. Figure 9 In the illustrated example, the distances d1 , d2 , and d3 between the first auxiliary line 311 a and the anode 316 become larger from one side to the other side of the panel, but the present disclosure is not limited thereto.

[0202] As described above, according to an exemplary embodiment of the present disclosure, brightness uniformity is compensated by connecting the first pad electrode to the auxiliary line 311a by means of a plurality of connecting lines to provide current from above, below, left and right. However, there may also be slight differences in the current between pixels in a row (and / or between pixels in different columns). For example, the pixels located on the left and right sides of a row are closer to the connecting line than the pixels located in the center and are therefore less affected by the current drop. Therefore, in order to increase brightness uniformity, the distance between the first auxiliary line 311a and the anode 316 can be increased from the pixel located in the center to the pixel located at the left and right edges. The distance between the first auxiliary line 311a and the anode 316 can be gradually increased.

[0203] Hereinafter, a method for manufacturing a lighting device according to the second exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Since the lighting device according to the third exemplary embodiment of the present disclosure is substantially the same as the lighting device according to the second exemplary embodiment of the present disclosure except for the size of the anode, the method for manufacturing the lighting device according to the second exemplary embodiment can be similarly applied to manufacturing the lighting device according to the third exemplary embodiment.

[0204] 10A to 10F Is used to show the manufacturing Figure 5A 1 is a plan view of a method for a lighting device using an organic light emitting diode according to a second exemplary embodiment shown in FIG.

[0205] Figures 11A to 11F is used to sequentially show the manufacturing Figure 6 sectional view of a method of a lighting device using an organic light emitting diode according to a second exemplary embodiment is shown in FIG.

[0206] Reference Figure 10A and Figure 11A , a buffer layer 240 may be formed on the entire surface of the substrate 210 including the light emitting region and the pad region. However, it should be understood that the present disclosure is not limited thereto, and the buffer layer 240 may be eliminated.

[0207] The substrate 210 may be made of transparent glass or a flexible polymer material.

[0208] The buffer layer 240 can block moisture and air from penetrating through the substrate 210. The buffer layer 240 can be formed of a single layer of an inorganic material such as silicon oxide (SiOx) and silicon nitride (SiNx). If necessary, the buffer layer 240 can be composed of a composite layer of an inorganic material and an organic material.

[0209] Subsequently, a conductive layer 213 may be formed on the buffer layer 240 formed on the substrate 210 .

[0210] The conductive layer 213 may be made of a material having a 4 Ω / □ to 10 5 Made of transparent conductive material with high resistance of Ω / □.

[0211] The conductive layer 213 may include a first conductive layer 213a disposed in the light emitting region and the first pad region, and a second conductive layer 213b disposed on the second pad region. The first conductive layer 213a and the second conductive layer 213b may be separated from each other in the light emitting region.

[0212] For example, the first conductive layer 213a may be formed substantially in a rectangular shape, in which an upper center portion is removed to form a recess, and the second conductive layer 213b may be disposed in the recess. However, it should be understood that the present disclosure is not limited thereto.

[0213] By the conductive layer 213 having high resistance, the current flowing in the short circuit can be restricted, so that the short reduction pattern can be removed.

[0214] For example, the surface roughness of the conductive layer 213 in contact with the buffer layer 240 can be increased to improve the efficiency of extracting light generated from the organic light emitting diode to the outside. In this case, the conductive layer 213 according to the second exemplary embodiment can be used as an internal light extraction layer. However, it should be understood that the present disclosure is not limited thereto.

[0215] Then, refer to Figure 10B and Figure 11B A metal such as Al, Au, Cu, Ti, W, and Mo, or an alloy thereof, is deposited on the conductive layer 213 and etched. By doing so, the auxiliary line 211 and the first and second auxiliary pad electrodes 217 and 218 can be formed as a single layer or multiple layers in the light emitting region and the first and second pad regions.

[0216] For example, the auxiliary line 211 may include a plurality of first auxiliary lines 211a in the horizontal direction and second auxiliary lines 211b in the vertical direction connected between the ends of the first auxiliary lines 211a. However, it should be understood that the present disclosure is not limited thereto. According to some exemplary embodiments of the present disclosure, the auxiliary line 211 may not include the second auxiliary line 211b.

[0217] Thus, according to the second exemplary embodiment, the first auxiliary line 211a is formed in a line shape instead of a grid shape, and a high resistance conductive layer is formed to replace the function of the short reduction pattern. By doing so, the aperture ratio can be improved.

[0218] First and second auxiliary pad electrodes 217 and 218 made of the same material as the auxiliary line 211 may be formed on the substrate 210 in the first and second pad regions. However, it should be understood that the present disclosure is not limited thereto.

[0219] Next, refer to Figure 10C and Figure 11C , a transparent low-resistance conductive layer is stacked on the entire substrate 210 .

[0220] Subsequently, the transparent low-resistance conductive layer is selectively etched to form the anode 216 and the first and second pad electrodes 227 and 228 in the light emitting region and the first and second pad regions.

[0221] The anode 216 may be formed of indium tin oxide (ITO) or indium zinc oxide (IZO), which are transparent metal oxide materials having a high work function and higher conductivity than the conductive layer 213 to facilitate hole injection into the organic layer.

[0222] As an example, the anode 216 may be defined as a rectangular island shape to define a light emitting area. However, it should be understood that the present disclosure is not limited thereto.

[0223] For example, the distance D2 between the island-shaped anodes 216 may be reduced to 4 μm or less. However, to implement a short reduction pattern, the distance D1 between the first auxiliary line 211a and the anode 216 may be greater than the distance D2. However, it should be understood that the present disclosure is not limited thereto.

[0224] The anode 216 thus formed may extend to the first pad region on the outer side of the light emitting region to form a first pad electrode 227, and a second pad electrode 228 electrically insulated from the anode 216 may be formed in the second pad region. That is, the second pad electrode 228 may be provided in the same layer as the anode 216 and may be spaced apart and electrically isolated from the anode 216. In addition, the first conductive layer 213a below the first pad electrode 227 and the second conductive layer 213b below the second pad electrode 228 may also be electrically insulated from each other.

[0225] Although the anodes 216 disposed in the respective pixels have the same size according to the second exemplary embodiment, the present disclosure is not limited thereto. In some embodiments, the size of the anode or the distance between the anode and the auxiliary line may vary from pixel to pixel.

[0226] In addition, a plurality of connection lines 219; 219a, 219b, and 219c may be provided along the edges of the first pad electrode 227 and the second pad electrode 228, so that the first pad electrode 227 is connected to the auxiliary line 211, thereby supplying current vertically and horizontally to improve brightness uniformity. For example, the connection lines 219; 219a, 219b, and 219c may include: a first connection line 219a for connecting between the first pad electrode 227 and the first auxiliary line 211a located on the upper side to supply current from above; a second connection line 219b for connecting between the first pad electrode 227 and the second auxiliary lines 211b located on the left and right sides to supply current from the left and right sides; and a third connection line 219c for connecting between the first pad electrode 227 and the first auxiliary line 211a located on the lower side to supply current from below.

[0227] Connection lines 219; 219a, 219b, and 219c may be formed on the first conductive layer 213a.

[0228] The connection lines 219; 219a, 219b, and 219c may be made of the same material and in the same layer as the anode 216. However, it should be understood that the present disclosure is not limited thereto.

[0229] Then, refer to Figure 10D and Figure 11D , an inorganic material such as SiNx and SiOx or an organic material such as photo-acryl is provided on the entire substrate 210 .

[0230] Subsequently, the inorganic material or the organic material is etched to form a passivation layer 215 on the upper and side portions of the auxiliary line 211 in the light-emitting area and the first and second pad areas, and a contact hole 214 for exposing a portion of the second pad electrode 228, and a first opening OP1 and a second opening OP2 for opening a portion of the first pad electrode 227 and the second pad electrode 228 can be formed.

[0231] The passivation layer 215 covers the auxiliary line 211 but is not formed in the light emitting area where light actually exits. The passivation layer 215 surrounds the auxiliary line 211 to reduce the level difference through the auxiliary line 211 so that various layers to be formed in subsequent processes can be reliably formed without breakage.

[0232] Therefore, in the first pad area PA1 of the substrate 210, the first pad electrode 227 electrically connected to the anode 216 can be exposed to the outside through the first opening OP1. In the second pad area PA2 of the substrate 210, the second pad electrode 228 electrically connected to the cathode 226 through the contact hole 214 can be exposed to the outside through the second opening OP2.

[0233] Then, refer to Figure 10E and Figure 11E , an organic layer 230 made of an organic material and a cathode 226 made of a metal may be formed in the light emitting region of the substrate 210 .

[0234] Specifically, the organic layer 230 made of an organic material may be formed in the light emitting region of the substrate 210 .

[0235] The organic layer 230 may be formed of a single stacked structure including a red organic light-emitting layer, a multi-stacked cascade structure including a plurality of red organic light-emitting layers, or a multi-stacked cascade structure including a red / green organic light-emitting layer and a sky blue organic light-emitting layer. However, it should be understood that the organic layer 230 of the present disclosure is not limited to the above structure and may adopt various structures. The organic layer 230 may include an electron injection layer and a hole injection layer for injecting electrons and holes into the organic light-emitting layer, respectively, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the organic light-emitting layer, respectively, and a charge generation layer for generating charges such as electrons and holes.

[0236] Specifically, the cathode 226 made of metal may be formed in the light emitting region of the substrate 210 to cover the organic layer 230 .

[0237] The cathode 226 may be electrically connected to the second pad electrode 228 thereunder through the contact hole 214 .

[0238] Cathode 226 may be made of a metal such as magnesium, calcium, sodium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver, tin, and lead, or alloys thereof.

[0239] The anode 216 , the organic layer 230 , and the cathode 226 in the light emitting region may form an organic light emitting diode.

[0240] Since the passivation layer 215 is disposed on the auxiliary line 211 in the light emitting region, the organic light emitting diode is not formed over the auxiliary line 211 .

[0241] Although not shown in the drawings, a second passivation layer made of an organic material may be formed in the light emitting region of the substrate 210 to cover the organic layer 230 and the cathode 226. However, it should be understood that the present disclosure is not limited thereto.

[0242] As described above, the second passivation layer is formed to cover the organic layer 230 and the cathode 226 in the light emitting region, and may prevent moisture from penetrating into the organic layer 230 in the light emitting region.

[0243] The organic layer 230 , the cathode 226 , and the second passivation layer may be formed through an in-line process by a roll-to-roll apparatus, but is not limited thereto.

[0244] Subsequently, a third passivation layer may be formed in the light emitting region of the substrate 210 to cover the second passivation layer. However, it should be understood that the present disclosure is not limited thereto.

[0245] The third passivation layer may be formed by another roll-to-roll apparatus.

[0246] The third passivation layer may be made of an inorganic material such as SiOx and SiNx. However, it should be understood that the present disclosure is not limited thereto.

[0247] An encapsulant may be further provided on the third passivation layer, and the encapsulant may include epoxy compounds, acrylate compounds, acrylic compounds, and the like.

[0248] Then, refer to Figure 10F and Figure 11F , an adhesive layer 260 may be formed on the substrate 210 in the light emitting region by applying a light curing adhesive or a thermosetting adhesive. Then, the metal film 270 is placed thereon and the adhesive layer 260 is cured, thereby attaching the metal film 270 thereon.

[0249] The first and second pad regions are not covered by the sealing means of the metal film 270 and may be electrically connected to the outside through the first and second pad electrodes 227 and 228 .

[0250] Subsequently, a protective film 275 may be attached to the entire surface of the substrate 210 in the light emitting region, excluding the first pad region and the second pad region, thereby completing the lighting device.

[0251] Exemplary embodiments of the present disclosure may also be described as follows:

[0252] According to one aspect of the present disclosure, a lighting device using an organic light-emitting diode is provided. The lighting device using the organic light-emitting diode includes: a conductive layer provided on a substrate; auxiliary lines arranged in a linear shape on the conductive layer; an anode provided in each pixel between the auxiliary lines and made of a conductive material having a lower resistance than that of the conductive layer; a passivation layer provided on the auxiliary lines; an organic layer and a cathode provided in a light-emitting region of the substrate in which the passivation layer is provided; and a metal film provided in the light-emitting region of the substrate.

[0253] The conductive layer may include a first conductive layer disposed in the light emitting region and the first pad area of ​​the substrate, and a second conductive layer disposed in the second pad area of ​​the substrate, and the first conductive layer may be insulated from the second conductive layer.

[0254] The conductive layer may be formed of a 4 Ω / □ to 10 5 Made of transparent conductive material with a resistance of Ω / □.

[0255] The auxiliary lines may include a plurality of first auxiliary lines arranged in a line shape in one direction, and second auxiliary lines provided in another direction and connecting ends of the first auxiliary lines to each other.

[0256] The lighting device using an organic light emitting diode may further include a first auxiliary pad electrode arranged in the first pad area; and a second auxiliary pad electrode arranged in the second pad area, wherein the first auxiliary pad electrode and the second auxiliary pad electrode may be arranged in the same layer as the auxiliary line and made of the same material.

[0257] The lighting device using an organic light emitting diode may further include a first pad electrode disposed in the first pad region; and a second pad electrode disposed in the second pad region, wherein the first pad electrode and the second pad electrode may be disposed in the same layer and made of the same material as the anode.

[0258] The first and second auxiliary pad electrodes may be disposed on the first and second conductive layers, respectively.

[0259] The first auxiliary pad electrode and the second auxiliary pad electrode may be disposed under the first pad electrode layer and the second pad electrode layer, respectively.

[0260] The lighting device using the organic light emitting diode may further include a connection line disposed on the first conductive layer to connect the first pad electrode with the auxiliary line.

[0261] The connecting lines may include: a first connecting line for connecting between the first pad electrode and the first auxiliary line located on the upper side to supply current from above; a second connecting line for connecting between the first pad electrode and the second auxiliary lines located on the left and right sides to supply current from the left and right sides; and a third connecting line for connecting between the first pad electrode and the first auxiliary line located on the lower side to supply current from below.

[0262] The connecting wire may be provided on the same layer as the anode and made of the same material as the anode.

[0263] The passivation layer may cover the first auxiliary line and may maintain a predetermined distance from the anode.

[0264] A distance between the anode and the further anode may be smaller than a distance between the first auxiliary line and the anode.

[0265] According to another aspect of the present disclosure, a lighting device using an organic light-emitting diode is provided. The lighting device using the organic light-emitting diode includes: a conductive layer provided on a substrate; auxiliary lines arranged in a linear shape on the conductive layer; an anode provided in each pixel between the auxiliary lines and made of a conductive material having a lower resistance than that of the conductive layer; a passivation layer provided on the auxiliary lines; an organic layer and a cathode provided in a light-emitting region of the substrate where the passivation layer is formed; and a metal film provided in the light-emitting region of the substrate, wherein a current difference caused by the position of the pixel in the panel is compensated by adjusting the distance between the auxiliary lines and the anode in each pixel.

[0266] The distance between the auxiliary wires and the anodes may increase from one side of the panel to the other.

[0267] The distance between the auxiliary line and the anode may become larger from the pixel located at the center portion toward the pixels located at the left and right edges, and wherein the distance gradually increases from the center portion to the left and right edges.

[0268] The present disclosure also relates to the following aspects.

[0269] 1. A light-emitting device using an organic light-emitting diode, comprising:

[0270] a conductive layer disposed on the substrate;

[0271] an auxiliary line arranged in a line shape on the conductive layer;

[0272] an anode disposed in each of the pixels between the auxiliary lines and made of a conductive material having a lower resistance than that of the conductive layer;

[0273] a passivation layer disposed on the auxiliary line;

[0274] An organic layer and a cathode disposed in a light emitting region of the substrate where the passivation layer is disposed; and

[0275] A metal film is provided in the light emitting region of the substrate.

[0276] 2. The device according to item 1, wherein the conductive layer comprises a first conductive layer provided in the light emitting region and the first pad region of the substrate, and a second conductive layer provided in the second pad region of the substrate, and

[0277] The first conductive layer is insulated from the second conductive layer.

[0278] 3. The device according to item 1, wherein the conductive layer is made of a 4 Ω / □ to 10 5 Made of transparent conductive material with a resistance of Ω / □.

[0279] 4. The device according to item 1, wherein the auxiliary lines include a plurality of first auxiliary lines arranged in a line shape in one direction, and second auxiliary lines provided in another direction and connecting ends of the first auxiliary lines to each other.

[0280] 5. The device according to item 2 further includes: a first auxiliary pad electrode, which is arranged in the first pad area; a second auxiliary pad electrode, which is arranged in the second pad area, wherein the first auxiliary pad electrode and the second auxiliary pad electrode are arranged in the same layer as the auxiliary line and are made of the same material.

[0281] 6. The device according to item 5 further includes: a first pad electrode, which is arranged in the first pad area; a second pad electrode, which is arranged in the second pad area, wherein the first pad electrode and the second pad electrode are arranged in the same layer as the anode and are made of the same material.

[0282] 7. The apparatus of clause 5, wherein the first auxiliary pad electrode and the second auxiliary pad electrode are provided on the first conductive layer and the second conductive layer, respectively.

[0283] 8. The apparatus of clause 6, wherein the first auxiliary pad electrode and the second auxiliary pad electrode are disposed below a first pad electrode and a second pad electrode layer, respectively.

[0284] 9. The apparatus according to item 6, further comprising: a connection line provided on the first conductive layer to connect the first pad electrode and the auxiliary line.

[0285] 10. A device according to item 9, wherein the connecting line includes: a first connecting line for connecting between the first pad electrode and the first auxiliary line located on the upper side to provide current from above; a second connecting line for connecting between the first pad electrode and the second auxiliary lines located on the left and right sides to provide current from the left and right sides; and a third connecting line for connecting between the first pad electrode and the first auxiliary line located on the lower side to provide current from below.

[0286] 11. The device according to item 9, wherein the connecting line is provided on the same layer as the anode and is made of the same material.

[0287] 12. The device according to item 4, wherein the passivation layer covers the first auxiliary line and maintains a predetermined distance from the anode.

[0288] 13. A device according to item 4, wherein the distance between the anode and another anode is smaller than the distance between the first auxiliary line and the anode.

[0289] 14. A light-emitting device using an organic light-emitting diode, comprising:

[0290] a conductive layer disposed on the substrate;

[0291] an auxiliary line arranged in a line shape on the conductive layer;

[0292] an anode disposed in each of the pixels between the auxiliary lines and made of a conductive material having a lower resistance than that of the conductive layer;

[0293] a passivation layer disposed on the auxiliary line;

[0294] An organic layer and a cathode are provided in a light emitting region of the substrate where the passivation layer is provided; and

[0295] a metal film disposed in the light emitting region of the substrate,

[0296] The current difference caused by the position of the pixel in the panel is compensated by adjusting the distance between the anode and the auxiliary line in each of the pixels.

[0297] 15. The device according to item 14, wherein the distance between the auxiliary line and the anode increases from one side of the panel to the other side.

[0298] 16. A device according to item 14, wherein the distance between the auxiliary line and the anode increases from pixels located in the center portion toward pixels located in the left and right edges, and wherein the distance gradually increases from the center portion to the left and right edges.

[0299] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the following claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

Claims

1. An organic light-emitting device using an organic light-emitting diode, comprising: an organic light emitting diode unit on the substrate; an encapsulation unit covering the organic light emitting diode unit and used for encapsulating the organic light emitting diode unit; as well as an external light extraction layer disposed below the substrate; and The organic light emitting diode unit includes an anode, a cathode and an organic layer disposed between the anode and the cathode; The organic light emitting device further comprises a passivation layer disposed above the substrate, and The anode is separated from the passivation layer and is not covered by the passivation layer. 2 . The organic light emitting device according to claim 1 , wherein the organic light emitting diode unit is displaced inside the substrate, and the external light extraction layer is displaced outside the substrate. 3 . The organic light emitting device according to claim 1 , wherein the external light extraction layer is formed by dispersing scattering particles in a resin. The organic light-emitting device according to claim 3 , wherein the scattering particles comprise TiO 2 . The organic light-emitting device according to claim 1 , wherein the external light extraction layer is attached under the substrate through an adhesive layer. 6 . The organic light emitting device of claim 1 , wherein the organic light emitting diode unit comprises an organic light emitting diode disposed over the substrate and an internal light extraction layer. The organic light emitting device according to claim 6 , wherein the internal light extraction layer is displaced between the substrate and the organic light emitting diode.

8. The organic light-emitting device according to claim 1, wherein the encapsulation unit comprises: a binder layer in contact with the cathode; a metal film on and in contact with the adhesive layer; as well as A protective film is over and attached to the metal film. 9 . The organic light emitting device according to claim 8 , wherein the adhesive layer is implemented as a pressure sensitive adhesive (PSA) for attaching the metal film to the organic light emitting diode unit.

10. The organic light-emitting device according to claim 1, further comprising: a conductive layer disposed above the substrate; an auxiliary line arranged in a line shape on the conductive layer; as well as An island-shaped anode is provided in each of the pixels between the auxiliary lines and is made of a conductive material having a lower resistance than that of the conductive layer.

11. The organic light-emitting device according to claim 10, wherein the conductive layer comprises a first conductive layer disposed in the light-emitting region and the first pad region of the substrate, and a second conductive layer disposed in the second pad region of the substrate, and The first conductive layer and the second conductive layer are separated from each other in the light emitting area. 12 . The organic light emitting device according to claim 10 , wherein the auxiliary lines include a plurality of first auxiliary lines arranged in a line shape in a horizontal direction, and second auxiliary lines provided in a vertical direction and connecting ends of the first auxiliary lines to each other. 13 . The organic light emitting device of claim 10 , wherein different pixels have different distances between the auxiliary line and the anode.

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