Rack systems for housing electronic equipment

Abstract

A rack system for housing electronic equipment includes an immersion shell configured to provide a housing for the electronic equipment. The immersion shell includes a first wall and a second wall. The first wall and the second wall define a device for controlling deformation of the immersion shell, so that when immersion cooling liquid is introduced into the immersion shell, the device for controlling deformation limits the deformation of the immersion shell.

Description

Technical Field

[0001] The present disclosure generally relates to a rack system, and more particularly to a rack system for housing electronic equipment. Background Art

[0002] Electronic devices such as servers, storage devices, computer disks, etc. are traditionally concentrated in rack structures. Large data centers and other large computing infrastructures may contain thousands of rack structures to support thousands or even tens of thousands of electronic devices.

[0003] Electronic devices installed in rack structures consume a lot of power and generate a lot of heat. Cooling requirements are important in such rack structures. Some electronic devices, such as processors, generate so much heat that without cooling, the electronic device may fail within seconds.

[0004] Forced air cooling is traditionally used to dissipate the heat generated by electronic equipment mounted in a rack structure. Air cooling requires the use of powerful fans, providing space between the electronic equipment for placing heat sinks and allowing sufficient airflow, and is generally not very efficient.

[0005] With further development, liquid cooling techniques are increasingly being used as an effective and cost-effective solution to maintain a safe operating temperature of electronic equipment installed in rack structures, such as using water cooling techniques, immersion cooling techniques, such as using dielectric immersion cooling with liquid.

[0006] However, it should be noted that when using immersion cooling technology, dielectric immersion cooling fills the immersion housing with liquid, which provides a housing for the electronic equipment in the rack structure. This causes deformation of the immersion housing and, therefore, may cause inconvenience when performing operations of loading (racking) or unloading (de-racking) the immersion housing to the rack structure. Using heavy or thick materials to add rigidity to the structure of the immersion housing would be expensive and require the use of a more rigid rack structure.

[0007] As mentioned above, attention is paid to designing an efficient immersion housing for the frame structure to reduce the inconveniences mentioned above.

[0008] The subject matter discussed in the background section should not be considered to be prior art simply because it is mentioned in the background section. Similarly, problems mentioned in the background section or related to the subject matter in the background section should not be considered to have been previously recognized in the prior art. The subject matter in the background section merely represents different approaches. Summary of the invention

[0009] The embodiments of the present disclosure have been developed based on the developer's recognition of the shortcomings associated with the prior art.

[0010] In particular, such disadvantages may include: (1) deformation of the immersion shell due to the introduction of the immersion cooling liquid; (2) inconvenience in performing operations of loading the immersion shell into the rack structure or unloading the immersion shell from the rack structure; and / or (3) inefficient space utilization of the space in the rack structure.

[0011] According to a broad aspect of the present disclosure, there is provided a rack system for housing electronic equipment, comprising:

[0012] An immersion housing is configured to provide a housing for an electronic device, wherein:

[0013] The immersion housing comprises: a first wall; and a second wall opposite to the first wall,

[0014] The first wall and the second wall define means for controlling deformation of the immersion shell, so that when immersion cooling liquid is introduced into the immersion shell, the means for controlling deformation limits the deformation of the immersion shell so that the immersion shell remains capable of being loaded into and unloaded from a frame structure that receives the immersion shell.

[0015] According to some embodiments of the present disclosure, in the frame structure, at least one of the first wall and the second wall is defined by: a first surface position P1 when at least one of the first wall and the second wall is not subjected to a pressure P; and a second surface position P2 when at least one of the first wall and the second wall is subjected to a pressure P, wherein the pressure P is generated by introducing an immersion cooling liquid into the immersion shell.

[0016] According to some embodiments of the present disclosure, in the frame structure, the first surface position P1 and the second surface position P2 are defined relative to the outer mold line of the first wall and the outer mold line of the second wall.

[0017] According to some embodiments of the present disclosure, in the frame structure, the first surface position P1 defines an inward curvature relative to the outer mold line.

[0018] According to some embodiments of the present disclosure, in the frame structure, in response to the pressure P, the second surface position P2 of at least one of the first wall and the second wall moves by a predetermined distance Δd relative to the first surface position P1 .

[0019] According to some embodiments of the present disclosure, in the frame structure, the first surface position P1 is located 2 mm to 5 mm away from the outer mold line.

[0020] According to some embodiments of the present disclosure, in the frame structure, the inward curved portion is selected from the following: an inward linear folded curved portion, an inward diamond point folded curved portion, a concave curved portion, and a combination thereof.

[0021] According to some embodiments of the present disclosure, in a frame structure, the first wall and the second wall define a reinforcing member, which is connected to the first wall and the second wall, so that when liquid for immersion cooling is introduced into the immersion shell, the reinforcing member reduces deformation of the immersion shell by offsetting the first wall and the second wall toward the inner side of the immersion shell.

[0022] According to some embodiments of the present disclosure, in the frame structure, the reinforcement member is located at one or more of: outside the first wall and the second wall; inside the first wall and the second wall; and embedded in the first wall and the second wall.

[0023] According to some embodiments of the present disclosure, in the frame structure, the reinforcement members are arranged in a one-dimensional manner or a two-dimensional manner.

[0024] According to some embodiments of the present disclosure, in the frame structure, reinforcement members coupled to the first wall are arranged parallel to each other, and reinforcement members coupled to the second wall are arranged parallel to each other.

[0025] According to some embodiments of the present disclosure, in the frame structure, the reinforcement members are arranged in a grid-type structure.

[0026] According to some embodiments of the present disclosure, in the frame structure, each of the reinforcement members includes at least one metal strip.

[0027] According to some embodiments of the present disclosure, in the rack structure, the immersion housing further includes a detachable frame configured to hold the electronic device.

[0028] According to some embodiments of the present disclosure, in the rack structure, the immersion housing further includes an opening, wherein the opening is used for inserting the electronic device and for introducing the liquid for immersion cooling.

[0029] According to some embodiments of the present disclosure, in the rack structure, the immersion housing further comprises a spiral convection coil, wherein the spiral convection coil is configured to cool the immersion cooling liquid.

[0030] According to some embodiments of the present disclosure, in the rack structure, the spiral convection coil is fluidly coupled to a liquid coolant inlet / outlet conduit to facilitate the flow of circulating cooling liquid within the spiral convection coil, optionally, the circulating cooling liquid is water, and the immersion cooling liquid is a dielectric immersion cooling liquid.

[0031] According to some embodiments of the present disclosure, in the rack structure, the immersion housing has additional openings to facilitate the routing of cables from the power distribution unit to the electronic equipment.

[0032] According to some embodiments of the present disclosure, in the rack structure, the electronic device is one or more of the following: a computing device, a server, and a power system.

[0033] According to some embodiments of the present disclosure, in the frame structure, the immersion housing is constructed of aluminum.

[0034] According to some embodiments of the present disclosure, in the frame structure, the immersion housings are vertically stacked in the frame structure.

[0035] According to some embodiments of the present disclosure, in the rack structure, the immersion housing includes a plurality of immersion housings.

[0036] According to some embodiments of the present disclosure, in a rack structure, a plurality of immersion shells are vertically stacked and arranged in parallel in the rack structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Other features and advantages of the present disclosure will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0038] Figure 1 shows a perspective view of a rack system for housing rack-mount components according to various non-limiting embodiments of the present disclosure;

[0039] Figure 2 shows another perspective view of a rack system according to various non-limiting embodiments of the present disclosure;

[0040] Figure 3 shows a perspective view of a rack mount assembly according to various non-limiting embodiments of the present disclosure;

[0041] Figures 4 to 6 shows perspective views of different non-limiting examples of pre-deformed immersion shells according to various non-limiting embodiments of the present disclosure;

[0042] Fig. 7A and Figure 7B shows a two-dimensional view of an immersion housing 400 before and after a dielectric immersion cooling liquid is introduced into the immersion housing according to various embodiments of the present disclosure;

[0043] Figures 8 to 10 perspective views showing different non-limiting examples of immersion housings with reinforcement members according to various non-limiting embodiments of the present disclosure; and

[0044] Figure 11 to Figure 12 The deformation strength of an immersion housing filled with a dielectric immersion cooling liquid is shown.

[0045] It should be understood that throughout the drawings and corresponding descriptions, like features are indicated by like reference numerals. In addition, it should be understood that the drawings and subsequent descriptions are for illustrative purposes only, and the present disclosure does not limit the scope of the claims. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0046] The present disclosure is intended to address at least some of the deficiencies of the current technology. In particular, the present disclosure describes a rack system for housing electronic equipment.

[0047] Unless otherwise defined or indicated by the context, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the described embodiments belong.

[0048] In the context of this specification, unless otherwise expressly provided, the terms "first", "second", "third", etc. are used as adjectives only to enable the nouns modified to be distinguished from each other, rather than to describe any specific relationship between these nouns. Thus, for example, it should be understood that the use of the terms "first processor" and "third processor" is not intended to imply any specific order, type, chronology, hierarchy or ranking (for example) between the servers themselves / between, nor is their use (by itself) intended to imply that any "second server" must exist in any given case. In addition, as discussed in other contexts herein, reference to a "first" element and a "second" element does not exclude that the two elements are the same actual real elements. Thus, for example, in some cases, the "first" server and the "second" server can be the same software and / or hardware, and in other cases, they can be different software and / or hardware.

[0049] It should be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly or indirectly connected or coupled to the other element or to intervening elements that may exist. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between...", "adjacent" versus "immediately adjacent", etc.).

[0050] In the context of this specification, when an element is referred to as being “associated with” another element, without limiting the scope of the present disclosure, in some embodiments, the two elements may be directly or indirectly linked, related, connected, coupled, or the second element employs the first element, etc.

[0051] The terms used herein are intended only to describe specific representative embodiments and are not intended to limit the present technology. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It should be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0052] The implementations of the present technology each have at least one of the above-mentioned purposes and / or aspects, but do not necessarily have all of the above-mentioned purposes and / or aspects. It should be understood that some aspects of the present technology resulting from attempts to achieve the above-mentioned purposes may not meet the purposes and / or may meet other purposes not specifically described herein.

[0053] The examples and conditional language described herein are primarily intended to help readers understand the principles of the present technology, rather than to limit its scope to such specifically recorded examples and conditions. It should be understood that a person skilled in the art may design various arrangements that, although not explicitly described or shown herein, still embody the principles of the present technology and are included within the spirit and scope of the present disclosure.

[0054] In addition, as an aid to understanding, the following description may describe a relatively simplified implementation of the present technology. As will be appreciated by those skilled in the art, various implementations of the present technology may have greater complexity.

[0055] In some cases, useful examples that are considered to be modifications of the present technology may also be set forth. This is merely to aid understanding, and is likewise not intended to limit the scope of the present technology or set forth the limits of the present technology. These modifications are not an exhaustive list, and other modifications may be made by those skilled in the art, while nonetheless such modifications remain within the scope of the present technology. Furthermore, where examples of modifications are not set forth, it should not be construed that modifications are impossible and / or that what is described is the only way to implement this element of the present technology.

[0056] In addition, all statements describing the principles, aspects, and implementations of the present technology, as well as specific examples thereof, are intended to include both structural and functional equivalents thereof, whether they are currently known or developed in the future. Thus, for example, it will be understood by those skilled in the art that any block diagram herein represents a conceptual diagram of an illustrative circuit that embodies the principles of the present technology. Similarly, it should be understood that any flow chart, flow diagram, state transition diagram, pseudocode, etc., represents various processes that can be substantially represented in a computer-readable medium, and is therefore executed by a computer or processor, whether or not the computer or processor explicitly displays it.

[0057] In the context of this specification, when an element is referred to as an electronic device, the element may include, but is not limited to: servers including blade servers; disk arrays / storage device systems; storage device area networks; network attached storage devices; storage device communication systems; workstations; routers; telecommunications infrastructure / switches; wired communication devices, optical communication devices, and wireless communication devices; battery processor devices; printers; power supplies; displays; optical devices; instrumentation systems including handheld systems; military electronics, etc. Many concepts will be described and illustrated herein as applied to computer server arrays. However, it should be recognized that the concepts described herein can also be used in other electronic devices.

[0058] With this knowledge in place, the present disclosure is directed to addressing at least some of the deficiencies of the current technology. In particular, the present disclosure describes a rack system for housing electronic equipment.

[0059] Figure 1 A perspective view of a rack system 100 for housing a rack mount assembly 104 according to various non-limiting embodiments of the present disclosure is shown. As shown, the rack system 100 may include a rack structure 102, rack mount assemblies 104, liquid cooling inlet ducts 106, and liquid cooling outlet ducts 108.

[0060] Figure 2 1 shows another perspective view of a rack system 100 according to various non-limiting embodiments of the present disclosure. As shown, the rack system 100 may also include a power distribution unit 110, a switch 112, and a liquid coolant inlet / outlet connector 114. It should be noted that the rack system 100 may include other components, such as heat exchangers, cables, pumps, etc. However, for simplicity, the rack system 100 is shown in FIG. Figure 1 and Figure 2 These components are omitted. Figure 1 and Figure 2The rack structure 102 may include a shelf 103 for accommodating one or more rack-mount components 104. In certain non-limiting embodiments, the one or more rack-mount components 104 may be loaded on the shelf 103 in a vertical position.

[0061] Figure 3 A perspective view of a rack mount assembly 104 according to various non-limiting embodiments of the present disclosure is shown. As shown, the rack mount assembly 104 can include an immersion housing 116 and a removable frame 118. The removable frame 118 can hold an electronic device 120 and can be immersed in the immersion housing 116.

[0062] It is expected that the electronic device 120 may generate a large amount of heat. To this end, the rack system 100 may use a mechanism for cooling the electronic device 120 to prevent damage to the electronic device 120. To this end, in certain non-limiting embodiments, immersion cooling liquid may be introduced into the immersion housing 116. In addition, a removable frame 118 including the electronic device 120 may be immersed in the immersion housing 116. In certain non-limiting embodiments, the immersion cooling liquid and the removable frame 118 may be introduced into the immersion housing 116 via an opening 122 at the top of the immersion housing 116. In certain non-limiting embodiments, the removable frame 118 may be attached to the immersion housing 116 in a sealed configuration. In other embodiments, the removable frame 118 may be attached to the immersion housing 116 in an unsealed configuration.

[0063] In certain non-limiting embodiments, the immersion cooling liquid can be a dielectric immersion cooling liquid. All electronic and thermally active components associated with the electronic device 120 can be immersed in the dielectric immersion cooling liquid. The dielectric cooling liquid can directly contact the electronic and thermally active components associated with the electronic device 120. Therefore, the immersion housing 116 can be used as a container for containing the electronic device 120 and the dielectric immersion cooling liquid. The dielectric immersion cooling liquid can cool the electronic device 120.

[0064] Dielectric immersion cooling liquids that may be used in various embodiments may include, but are not limited to, Fluorinert TM FC-3283, Fluorinert TM FC-43, Silicone Oil 20, Silicone Oil 50, Sobyean Oil, S5 X (Shell), SmartCoolant (Sumber), ThermaSafe R TM (Engineering Fluids), Novec TM7100, etc. It should be noted that any suitable dielectric immersion cooling may be employed in various non-limiting embodiments, so long as the dielectric immersion cooling liquid is capable of providing insulation between the various electronic and thermally active components associated with the electronic device 120 as well as the ability to cool these components.

[0065] In certain non-limiting embodiments, the immersion housing 116 may also include a convection inducing structure for cooling / inducing convection in the dielectric immersion liquid. By way of non-limiting example, the convection inducing structure may be a spiral convection coil 124 attached to the removable frame 118. The spiral convection coil 124 may be fluidly coupled to the liquid cooling inlet duct 106 and the liquid cooling outlet duct 108 via the liquid coolant inlet / outlet connector 114. The spiral convection coil 124 may allow the flow of circulating cooling liquid. The circulating cooling liquid may cool the dielectric immersion cooling system by convection. Thus, the cooling mechanism of the electronic device 120 is made a hybrid cooling mechanism.

[0066] In addition, electronic device 120 can be connected to power distribution unit 110 and switch 112 via power and network cables (not shown) to facilitate powering electronic device 120 through switch 112 and facilitating communication between electronic device 120 and external devices (not shown) through switch 112.

[0067] As previously described, a dielectric immersion cooling liquid may be introduced into the immersion housing 116 for cooling the electronic device 120. The dielectric immersion cooling liquid may exert some pressure P on the wall of the immersion housing 116. This may cause outward deformation (i.e., expansion and / or bulging) of the immersion housing 116. The outward deformation may affect the operation of loading the immersion housing 116 on the shelf 103 and the operation of unloading the immersion housing 116 from the shelf 103. Therefore, the immersion housing 116 may be difficult to remove from the rack structure 102. The deformation may also affect the proper space utilization of the rack structure 102. By way of example, if a shelf 103 is designed to accommodate 16 empty immersion housings 116, however, due to the deformation of the immersion housing 116, the shelf 103 may now accommodate a smaller number of filled immersion housings 116.

[0068] As described above, in various non-limiting embodiments of the present disclosure, the immersion shell 116 may be defined with a device for controlling the deformation of the immersion shell 116, so that when the immersion cooling liquid is introduced into the immersion shell 116, the device for controlling the deformation can limit the deformation of the immersion shell 116, so that the immersion shell 116 can still be loaded into the rack structure 102 (such as the rack structure 102) that receives the immersion shell 116. Figure 1 ) and being able to unload the immersion housing 116 from the frame structure 102.

[0069] In certain non-limiting embodiments, the immersion housing 116 may be pre-deformed to counter the effects of deformation caused by the introduction of the dielectric immersion cooling liquid. Figures 4 to 6 200 , 300 , and 400 , respectively, are perspective views of different non-limiting examples of pre-deformed immersion shells according to various non-limiting embodiments of the present disclosure. Figures 4 to 6 In the views of FIG. 1 , the pre-deformation of the immersion shells ( 200 , 300 , and 400 , respectively) is exaggerated for illustrative purposes.

[0070] Each of the immersion housings (200, 300, and 400) may include: a first wall (202, 302, and 402, respectively); a second wall (204, 304, and 404, respectively) opposite the first wall (202, 302, and 402, respectively); a third side wall (203, 303, and 403); a fourth wall (205, 305, and 405) and an opening (210, 310, and 410). The dielectric immersion cooling liquid and the electronic device 120 may be introduced into the immersion housing (200, 300, and 400) via the opening (210, 310, and 410). In certain non-limiting embodiments, the immersion housing (200, 300, and 400) may be constructed of any suitable metal, such as aluminum, steel, galvanized steel, stainless steel, copper, and the like.

[0071] It should be noted that the structural details discussed below for the first wall (202, 302, and 402) and the second wall (204, 304, and 404) may be equally applicable to the third side wall (203, 303, and 403) and the fourth wall (205, 305, and 405).

[0072] The dielectric immersion cooling liquid introduced into the immersion housing (200, 300, and 400) can exert a pressure P on the first wall (202, 302, and 402) and the second wall (204, 304, and 404). In certain non-limiting embodiments, the first wall (202, 302, and 402) and the second wall (204, 304, and 404) can be designed in the following manner: the first wall (202, 302, and 402) and the second wall (204, 304, and 404) define: a first surface position P1 when the first wall (202, 302, and 402) and the second wall (204, 304, and 404) are not subjected to the pressure P; and a second surface position P2 when the first wall (202, 302, and 402) and the second wall (204, 304, and 404) are subjected to the pressure P. It should be noted that the pressure P may be generated by introducing the immersion cooling liquid into the immersion housing (200, 300, and 400).

[0073] Fig. 7A and Figure 7B A two-dimensional view of an immersion housing 400 is shown before and after a dielectric immersion cooling liquid is introduced into the immersion housing according to various embodiments of the present disclosure. Fig. 7A A first surface position P1 of the first wall 402 and the second wall 404 is shown without any dielectric immersion cooling liquid in the immersion housing 400 . Figure 7B A second surface position P2 of the first wall 402 and the second wall 404 is shown when a dielectric immersion cooling liquid may be introduced into the immersion housing 400. The dielectric immersion cooling liquid may exert a pressure P on the first wall 402 and the second wall 404. To this end, the first wall 402 and / or the second wall 404 may be moved toward the second mode line 406-2 and the third mode line 406-3, respectively, by a predetermined distance Δd.

[0074] It should be noted that although Fig. 7A and Figure 7B A two-dimensional cross-sectional view of the immersion housing 400 is shown, however, similar concepts may also be applied to the immersion housing 200 and the immersion housing 300 without limiting the scope of the present disclosure.

[0075] Back to Figures 4 to 6In certain non-limiting embodiments, the first surface position P1 may represent an initial position of the first wall (202, 302, and 402) and / or the second wall (204, 304, and 404) before the dielectric immersion cooling liquid is introduced into the immersion housing (200, 300, and 400). Moreover, the second surface position P2 may represent a final position of the first wall (202, 302, and 402) and the second wall (204, 304, and 404) after the dielectric immersion cooling liquid is introduced into the immersion housing (200, 300, and 400).

[0076] In certain non-limiting embodiments, the first surface position P1 and the second surface position P2 can be defined relative to an outer mold line, such as the first mold line (206-1, 306-1, and 406-1), the second mold line (206-2, 306-2, and 406-2), the third mold line (206-3, 306-3, and 406-3), and the fourth mold line (206-4, 306-4, and 406-4) associated with the immersion shell (200, 300, and 400).

[0077] In certain non-limiting embodiments, the first surface position P1 may be located inside the outer mold line, and depending on the pressure P applied by the dielectric immersion cooling liquid, the second surface position P2 may be located on the inner side of the outer mold line, or the second surface position P2 may be aligned with the outer mold line. In other words, the outer mold line may define the extent to which the first wall (202, 302, and 402) and the second wall (204, 304, and 404) may deform. It is acceptable for the second surface position P2 to bulge slightly beyond the outer mold line, as long as the second surface position P2 bulging slightly does not affect the loading and unloading of the immersion housing (200, 300, and 400) into and from the rack.

[0078] In certain non-limiting embodiments, in response to the pressure P, the second surface position P2 may include moving at least one of the first wall (202, 302, and 402) and the second wall (204, 304, and 404) from the first surface position P1 to the outer mold line by a predetermined distance Δd. Therefore, compared with the case of the first surface position P1, at least one of the first wall (202, 302, and 402) and the second wall (204, 304, and 404) is substantially straight at the second surface position P2. It can be noted that when at the second surface position P2, at least one of the first wall (202, 302, and 402) and the second wall (204, 304, and 404) may not be completely straight; at least one of the first wall and the second wall may still be slightly offset inward; at least one of the first wall and the second wall may even be slightly offset outward, as long as at least one of the first wall and the second wall does not hinder the operation of loading into the rack or unloading from the rack. A person of ordinary skill in the art will be able to determine the appropriate shape and structure of the immersion shell (200, 300, and 400) based on the size of the immersion shell, the materials used in its construction, the thickness of the materials, and the expected weight of the immersion cooling liquid. The predetermined distance Δd can be within the distance from the outer mold line to the first surface position P1. In certain non-limiting embodiments, the first surface position P1 can be located 2 mm to 5 mm from the outer mold line.

[0079] In certain non-limiting embodiments, the first surface position P1 can define an inward curvature of the first wall (202, 302, and 402) relative to the outer mold line and / or an inward curvature of the second wall (204, 304, and 404) relative to the outer mold line. It should be noted that in different non-limiting embodiments, different inward curvatures can be accommodated by the first wall (202, 302, and 402) and / or the second wall (204, 304, and 404). By way of example without limiting the scope of the present disclosure, Figure 4 An immersion housing 200 is shown, wherein a first surface location P1 may define inward linear foldcurvatures (208-1 and 208-2), Figure 5 An immersion housing 300 is shown in which a first surface location P1 may define an inwardly directed diamond point fold bend (308-1 and 308-2), Figure 6 An immersion housing 400 is shown where the first surface position P1 may define a concave curvature (408-1 and 408-2). It should be noted that any suitable inward curvature may be employed in various non-limiting embodiments of the present disclosure, so long as the second surface position P2 remains substantially within the outer mold line when the pressure P is applied.

[0080] Therefore, by means of the first surface position P1 and the inwardly curved portion, the immersion housing (200, 300, and 400) can limit deformation (e.g., expansion) due to the pressure P applied by the dielectric immersion cooling liquid. Therefore, the immersion housing (200, 300, and 400) can be kept loaded into the rack structure 102 in an efficient manner. And the operation of unloading the immersion housing (200, 300, and 400) from the rack can be performed without causing any inconvenience.

[0081] It should be noted that even in the absence of dielectric immersion cooling liquid, the immersion housing ( 200 , 300 , and 400 ) may have sufficient interior space to allow for insertion of the electronic device 120 .

[0082] Figures 8 to 10 Perspective views of different non-limiting examples of immersion housings ( 500 , 600 , and 700 , respectively) having reinforcement members are shown in accordance with various non-limiting embodiments of the present disclosure.

[0083] Each of the immersion housings (500, 600, and 700) may include: a first wall (502, 602, and 702, respectively); a second wall (504, 604, and 704, respectively) opposite the first wall (502, 602, and 702, respectively); and an opening (508, 608, and 708). The dielectric immersion cooling liquid and the electronic device 120 may be inserted into the immersion housing (500, 600, and 700) via the opening (508, 608, and 708). In certain non-limiting embodiments, the immersion housing (500, 600, and 700) may be constructed of any suitable metal, such as aluminum, steel, galvanized steel, stainless steel, copper, and the like.

[0084] It should be noted that the immersion housing (500, 600 and 700) may include other walls (such as Figures 8 to 10 As shown in FIG. 1 , the structural details discussed below for the first wall ( 502 , 602 , and 702 ) and the second wall ( 504 , 604 , and 704 ) may also be applied to the other walls of the immersion housing ( 500 , 600 , and 700 ).

[0085] In certain non-limiting embodiments, in addition to or in lieu of the inward bend previously discussed, the first wall (502, 602, and 702) and the second wall (504, 604, and 704) may define reinforcing members (506, 606, and 706, respectively) connected to the first wall (502, 602, and 702) and the second wall (504, 604, and 704). The reinforcing members (506, 606, and 706) may be coupled in such a manner that, when a dielectric immersion cooling liquid is introduced into the immersion housing (500, 600, and 700), the reinforcing members (506, 606, and 706) reduce deformation of the immersion housing (500, 600, and 700) by biasing the first wall (502, 602, and 702) and the second wall (504, 604, and 704) toward the inside of the immersion housing (500, 600, and 700).

[0086] It should be noted that although Figures 8 to 10 In some non-limiting embodiments, the reinforcing members (506, 606, and 706) are shown as being externally coupled to the first wall (502, 602, and 702) and the second wall (504, 604, and 704), but the reinforcing members (506, 606, and 706) may be internally coupled to the first wall (502, 602, and 702) and the second wall (504, 604, and 704). In some other non-limiting embodiments, the reinforcing members (506, 606, and 706) may be embedded in the first wall (502, 602, and 702) and the second wall (504, 604, and 704). For simplicity, such embodiments are not shown.

[0087] In certain non-limiting embodiments, Figures 8 to 10 As shown, the reinforcing members (506, 606 and 706) can be arranged in a one-dimensional manner. It should be noted that although the reinforcing members (506, 606 and 706) have been shown as being arranged horizontally, in other non-limiting embodiments, the reinforcing members (506, 606 and 706) can be arranged vertically.

[0088] In certain non-limiting embodiments, the reinforcement members (506, 606, and 706) coupled to the first wall (502, 602, and 702) can be arranged parallel to each other, and the reinforcement members (not shown) coupled to the second wall (504, 604, and 704) can be arranged parallel to each other.

[0089] In certain non-limiting embodiments, the reinforcing members (506, 606, and 706) can be arranged in a two-dimensional manner. In other words, the reinforcing members (506, 606, and 706) can be arranged vertically and horizontally. As an example, the reinforcing members (506, 606, and 706) can be arranged in a grid-type arrangement structure. In another non-limiting embodiment, the reinforcing members (506, 606, and 706) can be arranged in an angular orientation. It should be noted that the manner in which the reinforcing members (506, 606, and 706) are arranged should not limit the scope of the present disclosure.

[0090] In certain non-limiting embodiments, each of the reinforcement members (506, 606, and 706) includes at least one metal strip. As examples, the metal strips may be made of aluminum, steel, galvanized steel, stainless steel, copper, etc. Fig. 9 As shown, each of the reinforcement members 606 may include a metal strip, and a plurality of reinforcement members 606 may be coupled to the first wall 602 . Fig.10 Another example is shown in which each of the reinforcement members 706 may include a set of three metal strips, and a plurality of reinforcement members 706 may be coupled to the first wall 702 .

[0091] Figure 11 to Figure 12 The intensity of deformations of the immersion housing 600 and the immersion housing 700 are shown respectively. In particular, Fig.11 A modified immersion housing 800 corresponding to the immersion housing 600 filled with a dielectric immersion cooling liquid is shown. Fig.12 A modified immersion housing 900 corresponding to the immersion housing 700 filled with a dielectric immersion cooling liquid is shown.

[0092] Therefore, by means of the reinforcing members (506, 606, and 706), the immersion housings (500, 600, and 700) can limit deformation due to the pressure P applied by the dielectric immersion cooling liquid. Therefore, the immersion housings (500, 600, and 700) can be kept loaded in the rack structure 102 in an efficient manner. Moreover, the operation of unloading the immersion housings (200, 300, and 400) from the rack can be performed without any inconvenience.

[0093] It should also be understood that although the embodiments presented herein have been described with reference to specific features and structures, it is apparent that various modifications and combinations may be made without departing from the present disclosure. Therefore, the specification and drawings should be simply viewed as illustrations of the implementations or embodiments discussed and the principles thereof as defined by the appended claims, and are intended to cover any and all modifications, variations, combinations or equivalents falling within the scope of the present disclosure.

Claims

1. A rack system (100) for accommodating electronic equipment (120), the rack system (100) comprising: An immersion housing (200, 300, 400) is configured to provide a housing for the electronic device (120), wherein: The immersion housing (200, 300, 400) comprises: a first wall (202, 302, 402); and a second wall (204, 304, 404) opposite to the first wall (202, 302, 402), Features: The first wall (202, 302, 402) and the second wall (204, 304, 404) define an inwardly curved portion, the inwardly curved portion being used to control deformation of the immersion shell (200, 300, 400), so that when immersion cooling liquid is introduced into the immersion shell (200, 300, 400), the inwardly curved portion for controlling deformation limits deformation of the immersion shell (200, 300, 400), so that the immersion shell (200, 300, 400) can be loaded into and unloaded from a rack structure (102) that receives the immersion shell (200, 300, 400), wherein at least one of the first wall (202, 302, 402) and the second wall (204, 304, 404) defines: a first surface position (P1) when at least one of the first wall and the second wall is not subjected to a pressure (P); and a second surface position (P2) when at least one of the first wall and the second wall is subjected to a pressure (P), the pressure (P) being generated by introducing the immersion cooling liquid into the immersion housing (200, 300, 400); and The first surface location (P1) defines an inward bend relative to an outer mold line (206-1, 206-2, 206-3, 206-4, 306-1, 306-2, 306-3, 306-4, 406-1, 406-2, 406-3, 406-4).

2. The rack system (100) according to claim 1, wherein: The first surface position (P1) and the second surface position (P2) are defined relative to the outer mold lines (206-1, 206-2, 206-3, 206-4, 306-1, 306-2, 306-3, 306-4, 406-1, 406-2, 406-3, 406-4) of the first wall (202, 302, 402) and the second wall (204, 304, 404).

3. The rack system (100) according to claim 1 or 2, wherein: The pole on the first surface location (P1) is located 2 mm to 5 mm inward from the outer mold line (206-1, 206-2, 206-3, 206-4, 306-1, 306-2, 306-3, 306-4, 406-1, 406-2, 406-3, 406-4).

4. The rack system (100) according to claim 1, wherein: The inward curved portion is selected from: an inward linear folded curved portion (208-1, 208-2), an inward diamond point folded curved portion (308-1, 308-2), a concave curved portion (408-1, 408-2) and a combination thereof.

5. The rack system (100) according to claim 1 or 2, wherein: In response to the pressure (P), the second surface position of the first wall (202, 302, 402) moves a predetermined distance Δd relative to the first surface position of the first wall, and / or the second surface position of the second wall (204, 304, 404) moves a predetermined distance Δd relative to the first surface position of the second wall.

6. The rack system (100) according to claim 1 or 2, wherein: The immersion housing also includes a removable frame (118) configured to hold the electronic device (120).

7. The rack system according to claim 1 or 2, wherein: The immersion housing further comprises an opening (210, 310, 410, 508, 608, 708) for inserting the electronic device (120) and for introducing the immersion cooling liquid.

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