Heat dissipation device and industrial computer

Abstract

The application provides a heat dissipation device and an industrial computer, the heat dissipation device comprises a heat dissipation shell, a radiator, a heat conduction pad, a cover plate and a case groove plate, the case groove plate is H-shaped in cross section, the heat dissipation shell is installed on one side of the case groove plate close to an industrial computer case, the cover plate is installed on the other side of the case groove plate away from the industrial computer case, and the radiator and the heat conduction pad are located between the heat dissipation shell and the cover plate; the radiator is fixed on the heat dissipation shell, the radiator is located on the heat dissipation shell and faces the CPU and the GPU, the radiator is composed of a plurality of scales of heat dissipation materials connected in sequence, the heat conduction pad is in the shape of a Chinese character 'K', the convex surface of the heat conduction pad is close to the heat dissipation surface of the radiator, and the flat surface of the heat conduction pad covers the whole heat dissipation shell; and the cover plate is designed to be hollow. The application reduces the volume of the heat dissipation device and improves the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of industrial computers, and in particular to a heat dissipation device and an industrial computer. BACKGROUND

[0002] With the continuous development of the industry, industrial computers are increasingly used in the industry. With the large use of industrial computers, the market demand for industrial computers equipped with independent graphics cards is increasing, which greatly promotes the demand for installing independent graphics card box computers in the industry. However, since the box computer is installed with an independent graphics card, the CPU (Central Processing Unit) and GPU (Graphics Processing Unit) will generate a large amount of heat, and therefore how to handle the heat dissipation problem of different power consumption CPUs and GPUs becomes the key to the application.

[0003] At present, there are more and more products in the industry that install independent GPUs. For products that need to install different power consumption CPUs and GPUs at the same time, the common heat dissipation method is to build different heat dissipation paths to respectively lead out the heat of the two. This often leads to a larger product size, which is not convenient to use in many space-limited occasions; the product has more parts and a higher cost; and the installation steps are relatively complicated, which affects the production and maintenance efficiency. SUMMARY

[0004] The present application provides a heat dissipation device and an industrial computer, which mainly aims to reduce the size of the heat dissipation device and improve the heat dissipation efficiency.

[0005] In a first aspect, the present application provides a heat dissipation device for an industrial computer, comprising a heat dissipation shell, a heat sink, a heat-conducting pad, a cover plate and a case slot plate, wherein the case slot plate is in the shape of H in cross section, the heat dissipation shell is installed on one side of the case slot plate close to the industrial computer case, the cover plate is installed on the other side of the case slot plate away from the industrial computer case, and the heat sink and the heat-conducting pad are located between the heat dissipation shell and the cover plate.

[0006] The heat sink is fixed on the heat dissipation shell, the heat sink is located at a position on the heat dissipation shell opposite to the CPU and the GPU, the heat sink is composed of a plurality of scales of heat dissipation materials connected in sequence, the heat-conducting pad is in the shape of a Chinese character 'K', the convex surface of the heat-conducting pad is in close contact with the heat dissipation surface of the heat sink, and the flat surface of the heat-conducting pad covers the entire heat dissipation shell.

[0007] The cover plate is designed in a hollow manner.

[0008] Preferably, one end of the case slot plate is provided with an air inlet, a suction fan is installed in the air inlet, the other end of the case slot plate is provided with an air outlet, an exhaust fan is installed in the air outlet, and the air inlet and the air outlet are located at two opposite corners of H.

[0009] Preferably, a controller is further included, an input end of the controller is connected with the CPU or the GPU of the industrial computer, a first output end of the controller is connected with the suction fan, and a second output end of the controller is connected with the exhaust fan, wherein the controller is used to read the CPU temperature or the GPU temperature of the industrial computer, if the CPU temperature or the GPU temperature is greater than a preset temperature threshold, the first output end is controlled to be conducted with the suction fan, so that the suction fan starts to work, and the second output end is controlled to be conducted with the exhaust fan, so that the exhaust fan starts to work.

[0010] Preferably, a first clamping groove and a second clamping groove are installed on the case slot plate, a first clamping block is installed on the heat dissipation shell, and a second clamping block is installed on the cover plate, the heat dissipation shell is clamped to the first clamping groove through the first clamping block, and the cover plate is clamped to the second clamping groove through the second clamping block.

[0011] Preferably, the heat-conducting pad includes a first heat-conducting pad and a second heat-conducting pad, the first heat-conducting pad is used to dissipate heat of the CPU, and the second heat-conducting pad is used to dissipate heat of the GPU.

[0012] Preferably, the first heat-conducting pad and the second heat-conducting pad are heat-conducting gels.

[0013] Preferably, the heat dissipation material of the heat sink is an aluminum alloy.

[0014] Preferably, the surface of the heat sink is coated with a graphene composite material.

[0015] In the second aspect, an embodiment of the present application provides an industrial computer, which includes the heat dissipation device for an industrial computer provided in the first aspect.

[0016] The heat dissipation device and industrial computer provided by the embodiment of the present application, the heat dissipation device is composed of a heat dissipation shell, a heat radiator, a heat conduction pad, a cover plate and a case groove plate, the case groove plate is used to provide support for the whole heat dissipation device, the heat radiator and the cover plate are respectively installed on two surfaces of the case groove plate, the heat conduction pad and the cover plate are installed between the heat radiator and the cover plate, and the heat conduction pad serves as the main heat dissipation device of the heat dissipation device, the heat radiator is close to the CPU and the GPU, so that the heat generated by the CPU and the GPU during the working process can be dissipated by the heat radiator, and the heat can be conducted out through the heat conduction pad. In the embodiment of the present application, the heat radiator is located at a partial position of the heat dissipation shell, the heat conduction pad is in the shape of a Chinese character "K", and a penetrating heat dissipation method is formed. Experiments prove that the penetrating heat dissipation method can greatly shorten the heat dissipation path and improve the heat dissipation performance, and the penetrating heat dissipation method has higher heat dissipation efficiency than the traditional heat dissipation method. In addition, the heat dissipation shell, the heat radiator, the heat conduction pad, the cover plate and the case groove plate in the embodiment of the present application have small volumes, so the volume of the heat dissipation device is also reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structural schematic view of the heat dissipation device for the industrial computer provided by the embodiment of the present application is shown in the figure.

[0018] Figure 2 A structural schematic view of the heat radiator in the embodiment of the present application is shown in the figure.

[0019] Figure 3 A structural schematic view of the case groove plate in the embodiment of the present application is shown in the figure. BRIEF DESCRIPTION OF DRAWINGS:

[0021] 1, heat dissipation shell; 2, heat radiator;

[0022] 3, heat conduction pad; 4, cover plate;

[0023] 5, case groove plate; 6, industrial computer case;

[0024] 7, suction fan; 8, exhaust fan;

[0025] 9, dust screen.

[0026] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0027] It should be understood that the specific embodiments described herein are merely intended to explain the present application, and are not intended to limit the present application.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] Figure 1 This is a schematic diagram of a heat dissipation device for an industrial control computer provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the heat dissipation device includes: a heat dissipation shell 1, a heat sink 2, a thermal pad 3, a cover plate 4, and a chassis slot plate 5. The chassis slot plate 5 has an H-shaped cross-section. The heat dissipation shell 1 is installed on the side of the chassis slot plate 5 closest to the industrial control chassis 6. The cover plate 4 is installed on the side of the chassis slot plate 5 away from the industrial control chassis 6. The heat sink 2 and the thermal pad 3 are located between the heat dissipation shell 1 and the cover plate 4. The heat sink 2 is fixed to the heat dissipation shell 1 and is located on the heat dissipation shell 1 directly opposite the CPU and GPU. The heat sink 2 is composed of several scale-like heat dissipation materials connected sequentially. The thermal pad 3 is convex in shape, with its convex surface tightly against the heat dissipation surface of the heat sink 2. The flat surface of the thermal pad 3 covers the entire heat dissipation shell 1. The cover plate 4 has a hollow design.

[0031] The heat dissipation device in this embodiment of the invention comprises several parts, including a heat dissipation shell 1, a heat sink 2, a thermal pad 3, a cover plate 4, and a chassis slot plate 5. Figure 1As a cross section schematic view of the heat dissipation device of the embodiment of the present application, the cross section of the case groove plate 5 is H-shaped, the case groove plate 5 is a three-dimensional H-shaped, the case groove plate 5 is used to support the whole heat dissipation device, the heat dissipation shell 1 is installed on the case groove plate 5 near one side of the industrial computer, the cover plate 4 is installed on the case groove plate 5 away from the industrial computer, the heat radiator 2 and the heat conduction pad 3 are installed between the heat dissipation shell 1 and the cover plate 4. The case groove plate 5 is made of a material with high hardness, the H-shaped can increase the stability and will not occupy too much space, thereby reducing the volume of the whole heat dissipation device; the heat dissipation shell 1 and the cover plate 4 are made of a material with good heat dissipation performance, used to increase the heat dissipation efficiency of the heat dissipation device, in the embodiment of the present application, the heat dissipation shell 1, the cover plate 4 and the case groove plate 5 form a rectangular heat dissipation device, which can further enhance the supporting force and stability of the heat dissipation device; and combined with the heat dissipation performance of the heat dissipation shell 1 and the cover plate 4, the heat dissipation device still has good heat dissipation performance under the condition of ensuring that the heat dissipation device has small volume.

[0032] In addition, in the embodiment of the present application, the heat radiator 2 is fixed on the heat dissipation shell 1, the heat dissipation shell 1 is made of a material with good heat dissipation performance, and the heat dissipation shell 1 is distributed with dense through holes for heat dissipation when the CPU and GPU work. Figure 2 As a structural schematic view of the heat radiator in the embodiment of the present application, as shown in Figure 2 The heat radiator 2 is formed in a scale shape according to the heat dissipation material, the heat radiator 2 is made in an integral scale shape, which can increase the contact area of the heat radiator 2 and the air, improve the heat dissipation efficiency, and will not occupy additional space, therefore, the scale-shaped heat radiator 2 can ensure to improve the heat dissipation efficiency under the premise of the same volume. Finally, the heat conduction pad 3 in the embodiment of the present application is in a convex shape, the convex part of the heat conduction pad 3 is close to the heat dissipation surface of the heat radiator 2, the other side of the heat conduction pad 3, that is, the relatively flat part covers the cross section of the whole case groove plate 5, the heat conduction pad 3 can spread the heat generated by the CPU and GPU to the whole cross section of the case groove plate 5, spread the heat generation point to the heat dissipation surface, because the heat dissipation cross-sectional area is much larger than the area of the heat generation point, therefore, the embodiment of the present application can accelerate the heat dissipation. Research shows that the setting mode of the heat radiator 2 and the heat conduction pad 3 is a penetrating air cooling heat dissipation mode, compared with the traditional heat dissipation mode of separately dissipating the heat of the CPU and GPU, the penetrating air cooling heat dissipation mode can dissipate the heat generated by the GPU and GPU when working through one heat radiator 2, will not increase additional parts and volume space, thereby increasing the use occasions of the heat dissipation device, and will not affect the maintenance efficiency of the industrial computer. The heat dissipation device is packaged by the cover plate 4 to prevent the heat dissipation device from being damaged due to collision during movement or transportation, and can contain the internal components of the heat dissipation device; in addition, the cover plate 4 is also designed in a hollow manner, which can prevent the heat dissipation device from being damaged due to collision during movement or transportation, and can contain the internal components of the heat dissipation device; in addition, the cover plate 4 is also designed in a hollow manner, Figure 1It can be seen that a plurality of through holes are arranged on the cover plate 4, and the circles in the figure represent the through holes, so that the heat generated by the industrial computer during operation can be conveniently dissipated to the air.

[0033] It should be noted that the heat dissipation device in the embodiment of the present application can adapt to different power consumption CPUs and GPUs, and can also adapt to different sizes of CPUs and GPUs. When the size of the GPU and the GPU changes, the size of the heat sink 2 can be changed accordingly.

[0034] The heat dissipation device and the industrial computer provided by the embodiment of the present application are composed of a heat dissipation shell 1, a heat sink 2, a heat conduction pad 3, a cover plate 4 and a case slot plate 5. The case slot plate 5 is used to provide support for the entire heat dissipation device. The heat sink 2 and the cover plate 4 are respectively installed on two faces of the case slot plate 5. The heat conduction pad 3 is installed between the heat sink 2 and the cover plate 4, and serves as the main heat dissipation component of the heat dissipation device. The heat sink 2 is close to the CPU and the GPU. In this way, the heat generated by the CPU and the GPU during operation can be dissipated by the heat sink 2, and the heat can be conducted out through the heat conduction pad 3. In the embodiment of the present application, the heat sink 2 is located at a partial position of the heat dissipation shell 1, and the heat conduction pad 3 is in the shape of a Chinese character "N". The heat dissipation method is a penetrating type. Experiments have proved that the penetrating type heat dissipation method can greatly shorten the heat dissipation path and improve the heat dissipation performance. The penetrating type heat dissipation method has higher heat dissipation efficiency than the traditional heat dissipation method. In addition, the heat dissipation shell 1, the heat sink 2, the heat conduction pad 3, the cover plate 4 and the case slot plate 5 in the embodiment of the present application have relatively small volumes, thereby reducing the volume of the heat dissipation device.

[0035] On the basis of the above-mentioned embodiment, preferably, one end of the case slot plate 5 is provided with an air inlet, and an air suction fan 7 is installed in the air inlet. The other end of the case slot plate 5 is provided with an air outlet, and an air exhaust fan 8 is installed in the air outlet. The air inlet and the air outlet are located at two opposite corners of H.

[0036] Figure 3 The structure of the case slot plate in the embodiment of the present application is shown in FIG. 5. Figure 3 As shown in FIG. 5, the left lower corner of the case slot plate 5 is provided with an air inlet, and an air suction fan 7 is arranged at the air inlet. The air suction fan 7 has the characteristics of low power consumption, large air volume, stable operation, long service life, high efficiency, automatic opening and closing of the louver, waterproof, dustproof and beauty. The right upper corner opposite to the air suction fan 7 is provided with an air outlet, and an air exhaust fan 8 is arranged at the air outlet. The air exhaust fan 8 has the characteristics of super-large air duct, super-large air blade diameter, super-large air exhaust volume, super-low energy consumption, low rotation speed and low noise. Through the cooperation of the air suction fan 7 and the air exhaust fan 8, the air flow can be accelerated during the operation of the GPU and the CPU, so as to achieve rapid heat dissipation. The positions of the air inlet and the air outlet in the embodiment of the present application can be determined according to actual conditions, and the embodiment of the present application does not make specific limitations on this.

[0037] On the basis of the above-mentioned embodiments, preferably, a controller is further included, an input end of the controller is connected with a CPU or a GPU of the industrial computer, a first output end of the controller is connected with the suction fan 7, and a second output end of the controller is connected with the exhaust fan 8, wherein the controller is used to read the CPU temperature or the GPU temperature of the industrial computer, and if the CPU temperature or the GPU temperature is greater than a preset temperature threshold, the first output end is controlled to be turned on to make the suction fan 7 start working, and the second output end is controlled to be turned on to make the exhaust fan 8 start working.

[0038] Specifically, the heat dissipation device in the embodiment of the present application further includes a controller, an input end of the controller is electrically connected with the CPU or the GPU of the industrial computer, and is used to read the real-time temperature of the CPU or the GPU, and if it is found that the real-time temperature is greater than a preset temperature threshold, it indicates that the real-time temperature of the CPU or the GPU is too high and needs to be cooled down quickly. In the embodiment of the present application, a first output end and a second output end of the controller are electrically connected with the suction fan 7 and the exhaust fan 8 respectively, when the first output end is turned on, the suction fan 7 starts working, and when the second output end is turned on, the exhaust fan 8 starts working. Therefore, when the real-time temperature is greater than the preset temperature threshold, the first output end and the second output end are both turned on, and the suction fan 7 and the exhaust fan 8 start working to increase the air flow speed, thereby accelerating the heat dissipation. When the real-time temperature is not greater than the preset temperature threshold, it indicates that the heat dissipation efficiency of the current heat dissipation device can meet the current demand, and the first output end and the second output end are disconnected, so that the suction fan 7 and the exhaust fan 8 are in a non-working state, thereby saving the power consumption of the industrial computer. It should be noted that the controller can be an analog circuit composed of resistors, capacitors and switches, or a digital circuit composed of temperature sensors and comparators, or a single-chip microcomputer or other programmable logic devices, and the specific type can be determined according to the actual situation, and the embodiment of the present application does not make specific limitation. The preset temperature threshold can be set according to actual experience, and the embodiment of the present application does not make specific limitation.

[0039] In the embodiment of the present application, the suction fan 7 and the exhaust fan 8 are controlled by the controller, when the temperature of the GPU or the CPU of the industrial computer is too high, the suction fan 7 and the exhaust fan 8 are turned on to increase the air flow efficiency, thereby improving the heat dissipation efficiency of the heat dissipation device. Moreover, the suction fan 7 and the exhaust fan 8 are only turned on when the temperature of the GPU or the CPU of the industrial computer is too high, so that the power consumption of the industrial computer is not increased, and the power consumption can be saved.

[0040] On the basis of the above-mentioned embodiment, preferably, the chassis slot plate 5 is provided with a first clamping slot and a second clamping slot, the heat dissipation shell 1 is provided with a first clamping block, the cover plate 4 is provided with a second clamping block, the heat dissipation shell 1 is clamped to the first clamping slot through the first clamping block, and the cover plate 4 is clamped to the second clamping slot through the second clamping block.

[0041] Specifically, the chassis slot plate 5 is provided with a first clamping slot and a second clamping slot, the heat dissipation shell 1 is provided with a first clamping block, the cover plate 4 is provided with a second clamping block, the heat dissipation shell 1 is clamped to the first clamping slot through the first clamping block, thereby realizing the connection of the heat dissipation shell 1 and the chassis slot plate 5, and the cover plate 4 is clamped to the second clamping slot through the second clamping block, thereby realizing the connection of the cover plate 4 and the chassis slot plate 5. In the embodiment of the present application, springs are arranged in the first clamping block and the second clamping block, when the first clamping block needs to be clamped into the first clamping slot, the volume of the end of the first clamping block is reduced by compressing the spring in the first clamping block, so that the first clamping block can be inserted into the first clamping slot, after being inserted into the first clamping slot, the spring relaxes, so that the volume of the first clamping block increases, and the first clamping block is tightly clamped in the first clamping slot. The principle of clamping the second clamping block into the second clamping slot is the same, which will not be described here in detail.

[0042] On the basis of the above-mentioned embodiment, preferably, the heat-conducting pad 3 comprises a first heat-conducting pad and a second heat-conducting pad, the first heat-conducting pad is used for heat dissipation of the CPU, and the second heat-conducting pad is used for heat dissipation of the GPU.

[0043] Specifically, in the heat dissipation device of the real industrial computer, due to the influence of the positions of the CPU and the GPU, it is generally difficult to use a heat-conducting pad to simultaneously dissipate heat from the two components, therefore, the heat-conducting pad in the embodiment of the present application comprises a first heat-conducting pad and a second heat-conducting pad, the first heat-conducting pad is arranged on the side of the CPU, and is mainly used for heat dissipation of the CPU, the second heat-conducting pad is arranged on the side of the GPU, and is mainly used for heat dissipation of the GPU.

[0044] On the basis of the above-mentioned embodiment, preferably, the first heat-conducting pad and the second heat-conducting pad are heat-conducting gels.

[0045] Specifically, in the heat dissipation device of the actual industrial computer, the traditional heat conduction pad is relatively hard, and it is difficult to adapt the heat dissipation device to other size CPUs or CPUs after the heat dissipation device is used to dissipate heat for a certain size CPU or CPU. Therefore, in order to expand the application range of the heat dissipation device, the heat conduction gel is used as the first heat conduction pad and the second heat conduction pad in the embodiment of the application. The heat conduction gel is a kind of gap filling heat conduction material, which is made of silica gel composite heat conduction filler through stirring, mixing and packaging. The heat conduction gel has the advantages of convenient use and strong plasticity. The high heat conduction gel is paste-shaped and will not dry and viscous. The product size limitation does not need to be specially considered during development, and flexible planning can be achieved.

[0046] On the basis of the above embodiment, preferably, the heat dissipation material of the heat sink 2 is aluminum alloy.

[0047] Specifically, the heat dissipation material of the heat sink 2 in the embodiment of the application is aluminum alloy, which has the advantages of good heat dissipation performance, light weight and small size.

[0048] On the basis of the above embodiment, preferably, the surface of the heat sink 2 is coated with graphene composite material.

[0049] Research shows that spraying graphene composite material on the surface of the heat sink 2 can increase the heat dissipation efficiency of the heat sink 2 by about 20%, and the graphene spraying process has good electrically conductive contact performance and safety performance, which has application advantages in similar heat dissipation products.

[0050] On the basis of the above embodiment, preferably, the dust screen 9 is arranged at the four corners of the case slot plate 5.

[0051] In the embodiment of the application, the dust screen 9 is arranged at the four corners of the case slot plate 5, which can reduce the entry of dust.

[0052] The embodiment of the application also provides an industrial computer, which comprises the heat dissipation device as described above. The industrial computer is an industrial control computer. By installing the heat dissipation device on the industrial computer, the heat dissipation performance of the industrial computer can be improved, and the application range of the industrial computer can be improved.

[0053] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional units and modules is exemplified, and in actual application, the above functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above.

[0054] The above-described embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A heat dissipation device for an industrial control computer, characterized in that, The device includes a heat dissipation shell, a heat sink, a thermal pad, a cover plate, and a chassis slot plate. The chassis slot plate has an H-shaped cross-section. The heat dissipation shell is installed on the side of the chassis slot plate closest to the industrial control computer chassis. The cover plate is installed on the side of the chassis slot plate away from the industrial control computer chassis. The heat sink and the thermal pad are located between the heat dissipation shell and the cover plate. The heat sink is fixed on the heat sink housing and is located on the heat sink housing directly opposite the CPU and GPU. The heat sink is composed of several scale-like heat dissipation materials connected in sequence. The thermal pad is convex in shape, with the convex surface of the thermal pad in close contact with the heat dissipation surface of the heat sink, and the flat surface of the thermal pad covering the entire heat sink housing. The cover plate has a hollow design. One end of the chassis slot plate is provided with an air inlet, and the other end of the chassis slot plate is provided with an air outlet. The air inlet and the air outlet are located at two opposite corners of H.

2. The heat dissipation device for an industrial control computer according to claim 1, characterized in that, An exhaust fan is installed inside the air inlet, and an exhaust fan is installed inside the air outlet.

3. The heat dissipation device for an industrial control computer according to claim 2, characterized in that, It also includes a controller, the input of which is connected to the CPU or GPU of the industrial computer, the first output of which is connected to the exhaust fan, and the second output of which is connected to the exhaust fan. The controller is used to read the CPU temperature or GPU temperature of the industrial computer. If the CPU temperature or GPU temperature is greater than a preset temperature threshold, it controls the first output to be connected to the exhaust fan so that the exhaust fan starts working, and controls the second output to be connected to the exhaust fan so that the exhaust fan starts working.

4. The heat dissipation device for an industrial control computer according to claim 1, characterized in that, The chassis slot plate is equipped with a first slot and a second slot, the heat sink is equipped with a first block, and the cover plate is equipped with a second block. The heat sink is connected to the first slot via the first block, and the cover plate is connected to the second slot via the second block.

5. The heat dissipation device for an industrial control computer according to claim 1, characterized in that, The thermal pad includes a first thermal pad and a second thermal pad. The first thermal pad is used to dissipate heat from the CPU, and the second thermal pad is used to dissipate heat from the GPU.

6. The heat dissipation device for an industrial control computer according to claim 5, characterized in that, The first thermal pad and the second thermal pad are thermally conductive gels.

7. The heat dissipation device for an industrial control computer according to claim 1, characterized in that, The heat dissipation material of the radiator is aluminum alloy.

8. The heat dissipation device for an industrial control computer according to claim 7, characterized in that, The surface of the radiator is coated with graphene composite material.

9. The heat dissipation device for an industrial control computer according to any one of claims 1 to 8, characterized in that, Dustproof nets are installed at the four corners of the chassis slot plate.

10. An industrial control computer, characterized in that, Includes the heat dissipation device for industrial control computers as described in any one of claims 1 to 9.

Images