Conductive paste, electronic component, and laminated ceramic capacitor

Abstract

The present invention provides a conductive paste that reduces the number of protrusions present in a dried film. The conductive paste of the present invention contains conductive powder, ceramic powder, a dispersing agent, a binder resin, and an organic solvent, wherein the dispersing agent contains 0.01 to 4 parts by mass of an amino acid-based dispersing agent represented by general formula (1) and 0.01 to 4 parts by mass of an amine-based dispersing agent represented by general formula (2) per 100 parts by mass of the conductive powder.

Description

TECHNICAL FIELD

[0001] The present application relates to a conductive paste, an electronic component, and a multilayer ceramic capacitor. BACKGROUND

[0002] With miniaturization and high performance of electronic devices such as mobile phones, digital devices, and the like, miniaturization and high capacity of electronic components including multilayer ceramic capacitors and the like are also desired. A multilayer ceramic capacitor has a structure in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked, and miniaturization and high capacity can be achieved by thinning the dielectric layers and the internal electrode layers.

[0003] For example, a multilayer ceramic capacitor can be manufactured as follows. First, a conductive paste for internal electrodes is printed (applied) on the surface of a dielectric green sheet containing a dielectric powder such as barium titanate (BaTi03) and a binder resin in a prescribed electrode pattern, and dried to form a dried film. Next, the dried film and the dielectric green sheet are stacked in an alternating manner, and integrated by heat press bonding to form a press-bonded body. The press-bonded body is cut, and after a de-binder treatment in an oxidizing atmosphere or an inert atmosphere, firing is performed to obtain a fired chip. Next, a paste for external electrodes is applied to both ends of the fired chip, and after firing, nickel plating or the like is performed on the surface of the external electrodes, thereby obtaining a multilayer ceramic capacitor.

[0004] Generally, a conductive paste for forming internal electrode layers contains a conductive powder, a ceramic powder, a binder resin, and an organic solvent. In addition, in order to improve the dispersibility of the conductive powder and the like, a dispersant is sometimes contained in the conductive paste. With the thinning of the internal electrode layers in recent years, there is a tendency for the conductive powder to be made smaller in particle size. In the case where the particle size of the conductive powder is small, the specific surface area of the particle surface becomes large, and thus the surface activity of the conductive powder (metal powder) becomes high, the dispersibility decreases, and the powders easily agglomerate, thereby forming agglomerates. If agglomerates are present in the conductive paste, a convex portion due to the agglomerates is formed in the internal electrode layer, and this convex portion sometimes penetrates the green sheet to cause a short-circuit failure.

[0005] For example, in Patent Document 1, it is described that a nickel powder having an average particle diameter of 0.2 μm or less is used in order to suppress a short-circuit failure. Thus, even if agglomerates are generated, a convex portion of the internal electrode layer is not easily formed, and thus a short-circuit failure that penetrates the green sheet can be reduced. In addition, in Patent Document 1, it is described that by filtering the conductive paste using a filter having a mesh size of 5 μm or less, agglomerated particles of the nickel powder can be removed, and thus the smoothness of the printed internal electrode layer can be obtained, and a short-circuit failure that penetrates can be reduced.

[0006] PRIOR ART DOCUMENTS

[0007] Patent Literature

[0008] Patent Literature 1: Japanese Patent Application Laid-Open (JP-A) No. 2005-197019 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] However, in the multilayer ceramic capacitor using the conventional conductive paste, along with the thinning of the electrode pattern, the short-circuit failure of the multilayer ceramic capacitor sometimes increases, resulting in a problem of reduction in reliability.

[0011] According to the research by the inventors of the present application, it has been found, for example, as described in the above Patent Literature 1, that in the manufacturing process of the conductive paste, even if the average particle diameter of the nickel powder used is set to 2 μm or less or the conductive paste is filtered using a filter, the short-circuit failure of the multilayer ceramic capacitor cannot be sufficiently suppressed.

[0012] Accordingly, as a result of further research by the inventors of the present application, it has been newly found that one of the main causes of the above problems accompanying the thinning of the electrode pattern is a minute protrusion generated on the dried film after the conductive paste is printed.

[0013] That is, when a considerable number of protrusions exist on the dried film, in the manufacturing of the multilayer ceramic capacitor, at the time of alternately stacking the dried film and the dielectric green sheet or at the time of reducing the film thickness after the stacking, penetration to the adjacent layer due to the minute protrusion sometimes occurs, resulting in reduction in reliability such as short-circuit failure of the multilayer ceramic capacitor.

[0014] In addition, according to the research by the inventors of the present application, it has been found that the generation of the above minute protrusion is difficult to detect in the evaluation of the roughness of the ordinary dried film.

[0015] The present application is based on the above insight, and aims to provide a conductive paste in which the number of protrusions existing on a dried film is reduced.

[0016] MEANS FOR SOLVING THE PROBLEMS

[0017] In the first mode of the present application, a conductive paste is provided, which contains a conductive powder, a ceramic powder, a dispersing agent, a binder resin, and an organic solvent, wherein the dispersing agent contains 0.01 parts by mass or more and 4 parts by mass or less of an amino acid-based dispersing agent represented by the following General Formula (1) and 0.01 parts by mass or more and 4 parts by mass or less of an amine-based dispersing agent represented by the following General Formula (2) with respect to 100 parts by mass of the conductive powder.

[0018] [Chemical Formula 1]

[0019]

[0020] (wherein, in the general formula (1), R1 represents a chain hydrocarbon group having 10 to 20 carbon atoms.)

[0021]

Chemical 2

[0022] R2-NH2... (2)

[0023] (wherein, in the general formula (2), R2 represents a chain hydrocarbon group having 12 to 22 carbon atoms.)

[0024] Further, preferably, the dispersant further contains an amine-based dispersant represented by the following general formula (3) in an amount of 0.01 parts by mass or more and 4 parts by mass or less with respect to 100 parts by mass of the electrically conductive powder, and the electrically conductive paste contains the electrically conductive powder in an amount of 40% by mass or more and 60% by mass or less with respect to the entire electrically conductive paste.

[0025]

Chemical 3

[0026]

[0027] (wherein, in the general formula (3), R3 represents an alkyl group, an alkenyl group, or an alkynyl group having 8 to 16 carbon atoms, R4 represents an oxyethylene group, an oxypropylene group, or a methylene group, R5 represents an oxyethylene group or an oxypropylene group, R4 and R5 can be the same or different. In addition, the N atom in formula (3) is not directly bonded to the O atoms in R4 and R5, and Y is a number of 0 to 2, and Z is a number of 1 to 2.)

[0028] Further, preferably, in the general formula (1), R1 represents a straight chain hydrocarbon group having 10 to 20 carbon atoms. Further, preferably, the dispersant is contained in an amount of 0.01% by mass or more and 4% by mass or less with respect to the entire electrically conductive paste. Further, preferably, the electrically conductive powder contains a metal powder selected from at least one of Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof. Further, preferably, the average particle diameter of the electrically conductive powder is 0.05 μm or more and 1.0 μm or less. Further, preferably, the ceramic powder contains a perovskite-type oxide. Further, preferably, the average particle diameter of the ceramic powder is 0.01 μm or more and 0.5 μm or less. Further, preferably, the binder resin contains at least one of a cellulose-based resin, an acrylic-based resin, and a butyral-based resin. Further, preferably, the above-described electrically conductive paste is used for an internal electrode of a multilayer ceramic component.

[0029] In the second aspect of the present application, there is provided an electronic component formed using the above-described electrically conductive paste.

[0030] In a third aspect of the present application, there is provided a laminated ceramic capacitor having at least a laminate of a dielectric layer and an internal electrode, the internal electrode being formed using the above-described conductive paste.

[0031] Effects of the Invention

[0032] The conductive paste according to the present application has a small number of minute protrusions on a dried film after printing. Therefore, the conductive paste according to the present application can be suitably used, for example, for a thin-film electrode. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a perspective view and a cross-sectional view of a laminated ceramic capacitor according to the present embodiment. DETAILED DESCRIPTION

[0034] The conductive paste according to the present embodiment contains a conductive powder, a ceramic powder, a dispersant, a binder resin, and an organic solvent. Hereinafter, each component will be described in detail.

[0035] (Conductive Powder)

[0036] The conductive powder is not particularly limited, and a metal powder can be used, for example, a powder selected from one or more of Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof can be used. Among them, from the viewpoints of conductivity, corrosion resistance, and cost, a powder of Ni or an alloy thereof is preferred. As the Ni alloy, for example, an alloy of Ni with at least one or more elements selected from the group consisting of Mn, Cr, Co, Al, Fe, Cu, Zn, Ag, Au, Pt, and Pd (Ni alloy) can be used. The content of Ni in the Ni alloy is, for example, 50% by mass or more, and preferably 80% by mass or more. In addition, in order to suppress the generation of a large amount of gas due to the thermal decomposition of the binder resin during the debinding process, the Ni powder can contain S in an amount of several hundred ppm.

[0037] The average particle diameter of the conductive powder is preferably 0.05 μm or more and 1.0 μm or less, and more preferably 0.1 μm or more and 0.5 μm or less. In the case where the average particle diameter of the conductive powder is within the above range, the paste for internal electrodes of a laminated ceramic capacitor for thin-filmization can be suitably used, and for example, the smoothness of the dried film and the dried film density can be improved. The average particle diameter is a value obtained based on observation by a scanning electron microscope (SEM), and is an average value obtained by measuring the particle diameters of a plurality of particles one by one from an image obtained by observing with the SEM at a magnification of 10,000 times.

[0038] The content of the conductive powder is preferably 30% by mass or more and less than 70% by mass, more preferably 40% by mass or more and 60% by mass or less, relative to the total amount of the conductive paste. When the content of the conductive powder is within the above range, the conductivity and dispersibility are excellent.

[0039] (Ceramic powder)

[0040] The ceramic powder is not particularly limited, and for example, in the case of a paste for internal electrodes of a multilayer ceramic capacitor, a publicly known ceramic powder can be appropriately selected depending on the type of the multilayer ceramic capacitor to be applied. As the ceramic powder, for example, a perovskite-type oxide containing Ba and Ti can be cited, and barium titanate (BaTi03) is preferable.

[0041] As the ceramic powder, a ceramic powder containing barium titanate as a main component and containing an oxide as a subcomponent can be used. As the oxide, an oxide composed of one or more selected from Mn, Cr, Si, Ca, Ba, Mg, V, W, Ta, Nb, and a rare earth element can be cited. In addition, as the ceramic powder, for example, a ceramic powder of a perovskite-type oxide ferroelectric in which Ba atoms and Ti atoms of barium titanate (BaTi03) are substituted with other atoms such as Sn, Pb, Zr, or the like can also be cited.

[0042] As the ceramic powder in the paste for internal electrodes, a powder of the same composition as the dielectric ceramic powder constituting a dielectric green sheet of a multilayer ceramic capacitor can be used. Thereby, the generation of cracks due to shrinkage mismatch at the interface between the dielectric layer and the internal electrode layer in the sintering process can be suppressed. As such a ceramic powder, in addition to the above-mentioned perovskite-type oxide containing Ba and Ti, for example, oxides such as ZnO, ferrite, PZT, BaO, AI2O3, Bi2O3, R (rare earth element) 2O3, Ti02, Nd203, and the like can be cited. Furthermore, one kind of ceramic powder can be used, or two or more kinds can be used.

[0043] The average particle diameter of the ceramic powder is, for example, in the range of 0.01 μm or more and 0.5 μm or less, and preferably in the range of 0.01 μm or more and 0.3 μm or less. By making the average particle diameter of the ceramic powder within the above range, in the case of using as a paste for internal electrodes, a sufficiently thin and uniform internal electrode can be formed. The average particle diameter is a value obtained based on observation by a scanning electron microscope (SEM), and is an average value obtained by measuring the particle diameters of a plurality of particles one by one from an image obtained by observing at a magnification of 50,000 times by SEM.

[0044] The content of the ceramic powder is preferably 1 part by mass or more and 30 parts by mass or less, more preferably 3 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass of the conductive powder.

[0045] The content of the ceramic powder is preferably 1 mass% or more and 20 mass% or less, more preferably 5 mass% or more and 20 mass% or less, relative to the total amount of the conductive paste. When the content of the ceramic powder is within the above range, the conductivity and dispersibility are excellent.

[0046] (Binder resin)

[0047] As the binder resin, there is no particular limitation, and a publicly known resin can be used. As the binder resin, for example, cellulose-based resins such as methyl cellulose, ethyl cellulose, ethyl hydroxyethyl cellulose, nitro cellulose, and the like, acrylic resins, vinyl acetal-based resins such as polyvinyl butyral, and the like can be exemplified. Among them, from the viewpoints of solubility in a solvent, combustibility, and the like, it is preferable to contain ethyl cellulose. In addition, in the case of use as a paste for internal electrodes, from the viewpoint of improving the adhesion strength to a dielectric green sheet, a vinyl acetal-based resin can be contained, or a vinyl acetal-based resin alone can be used. The binder resin can be used singly or two or more kinds can be used.

[0048] The binder resin can be, for example, a cellulose-based resin and a vinyl acetal-based resin. In the case where a cellulose-based resin and a vinyl acetal-based resin are contained in the conductive paste, there is a tendency that the number of protrusions on the dried film decreases. The content ratio of the cellulose-based resin to the vinyl acetal-based resin is not particularly limited, and for example, cellulose-based resin: vinyl acetal-based resin = 10 to 90: 90 to 10 (weight ratio, the total of the cellulose-based resin and the vinyl acetal-based resin is 100), preferably 30 to 70: 70 to 30.

[0049] In addition, the weight average molecular weight Mw of the vinyl acetal-based resin is not particularly limited, and for example, 20,000 or more and 200,000 or less, preferably 30,000 or more and 150,000 or less. When the weight average molecular weight Mw is within the above range, in the case of use in the conductive paste, the dispersibility of the conductive powder and the like is excellent, and it is possible to form an appropriate paste viscosity and reduce the number of protrusions on the dried film.

[0050] The content of the binder resin is preferably 1 mass part or more and 10 mass parts or less, more preferably 1 mass part or more and 8 mass parts or less, relative to 100 mass parts of the conductive powder.

[0051] The content of the binder resin is preferably 0.5 mass% or more and 10 mass% or less, more preferably 1 mass% or more and 6 mass% or less, relative to the total amount of the conductive paste. When the content of the binder resin is within the above range, the conductivity and dispersibility are excellent.

[0052] (Organic solvent)

[0053] As the organic solvent, there is no particular limitation, and a publicly known organic solvent capable of dissolving the above-mentioned binder resin can be used. As the organic solvent, for example, acetic acid ester solvents such as dihydroterpineol acetate, isobornyl acetate, isobornyl propionate, isobornyl butyrate, and isobornyl isobutyrate, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, terpene solvents such as terpineol and dihydroterpineol, hydrocarbon solvents such as tridecane, nonane, and cyclohexane, and the like can be exemplified. Furthermore, the organic solvent can be used singly or two or more kinds can be used.

[0054] The content of the organic solvent is preferably 40 parts by mass or more and 100 parts by mass or less, and more preferably 65 parts by mass or more and 95 parts by mass or less, with respect to 100 parts by mass of the electrically conductive powder. In the case where the content of the organic solvent is within the above-mentioned range, the electrical conductivity and dispersibility are excellent.

[0055] The content of the organic solvent is preferably 20% by mass or more and 60% by mass or less, and more preferably 35% by mass or more and 55% by mass or less, with respect to the total amount of the electrically conductive paste. In the case where the content of the organic solvent is within the above-mentioned range, the electrical conductivity and dispersibility are excellent.

[0056] (Dispersant)

[0057] The electrically conductive paste according to the present embodiment contains a dispersant. In addition, the dispersant contains an amino acid-based dispersant (amino acid-based surfactant) represented by the following general formula (1) and an amine-based dispersant (amine-based surfactant) represented by the following general formula (2). The amine-based dispersant represented by the general formula (2) is a primary amine.

[0058] Chem. 4

[0059]

[0060] In the above-mentioned general formula (1), R1 represents a chain hydrocarbon group having 10 to 20 carbon atoms. In addition, R1 preferably represents a straight chain hydrocarbon group having 10 to 20 carbon atoms.

[0061] Chem. 5

[0062] R2-NH2... (2)

[0063] In the above-mentioned general formula (2), R2 represents a chain hydrocarbon group having 12 to 22 carbon atoms. In addition, R2 can represent a straight chain hydrocarbon group having 12 to 22 carbon atoms, and can be a straight chain alkenyl group, or can have a double bond.

[0064] As described above, the inventors of the present application newly found that one of the main causes of the above-mentioned problems accompanying the thinning of the electrode pattern is a protrusion generated on the dried film after printing the conductive paste. Furthermore, based on this insight, the inventors of the present application further found that, particularly in the conductive paste containing the amino acid-based dispersant represented by the above-mentioned general formula (1), there is a tendency that the protrusion is easily formed on the dried film, and that by combining the above-mentioned dispersant, the number of the protrusions present on the dried film after printing the conductive paste can be reduced.

[0065] Here, the protrusion on the dried film refers to a convex portion (protrusion) formed on the dried film, and specifically refers to a protrusion having a size of 5 μm or more in the long axis direction (the longest diameter) when the dried film obtained by coating and drying after filtering the obtained conductive paste using a filter is observed from the upper surface.

[0066] Further, the inventors of the present application analyzed the components inside the protrusion (convex portion), and found that an organic substance is present. For example, in the above-mentioned patent document 1, it is described that the agglomerates are removed by filtering the conductive paste using a filter. However, in the case where the protrusion (agglomerate) due to the organic substance is present in the conductive paste, even if the filtering using the filter as described in the patent document 1 is performed, since the agglomerate has softness, the agglomerate larger than the mesh of the filter also passes through, and thus it is difficult to reduce the number of the protrusions on the dried film. The detailed mechanism of the generation of the protrusion containing the organic substance inside on the dried film is not clear, but for example, the following mechanism can be considered.

[0067] For example, it is considered that in the case where the dispersant contains the amino acid-based dispersant represented by the general formula (1), the amino acid-based dispersant reacts with other components in the conductive paste, and generates a compound that is not soluble in the conductive paste, as a result of which the protrusion is generated on the dried film after printing and drying the conductive paste.

[0068] In addition, as described later, in the case where the amino acid-based dispersant represented by the general formula (1) and the amine-based dispersant represented by the general formula (3) are contained, the amino acid-based dispersant reacts with the amine-based dispersant, and it is also possible that a compound that is not soluble in the conductive paste is generated. For example, in the case where the conductive paste contains only the amino acid-based dispersant represented by the general formula (1) and the amine-based dispersant represented by the general formula (3) as the dispersants, there is a tendency that the more the content of the amine-based dispersant represented by the general formula (3) increases, the more the number of the protrusions on the dried film increases (see the conductive pastes of Comparative Example 1 and Comparative Example 2 described later).

[0069] Further, in the conductive paste according to the present embodiment, by containing the amine-based dispersant represented by General Formula (2), the number of protrusions on the dried film can be reduced. The reason for this is not clear, but it is thought that, for example, the amine-based dispersant represented by General Formula (2) suppresses the reaction of the amino acid-based dispersant represented by General Formula (1) with other components, suppresses the generation of insoluble compounds, or reacts with the amino acid-based dispersant represented by General Formula (1) and other components to increase the solubility of the product, the product does not exist in the form of a lump, and thus the number of protrusions on the dried film is reduced.

[0070] In the conductive paste, 0.01 parts by mass or more and 4 parts by mass or less, preferably 0.02 parts by mass or more and 3 parts by mass or less, and more preferably 0.03 parts by mass or more and 2 parts by mass or less, of the amino acid-based dispersant represented by General Formula (1) are contained with respect to 100 parts by mass of the conductive powder. In addition, 0.03 parts by mass or more and 0.6 parts by mass or less of the amino acid-based dispersant represented by General Formula (1) described above can be contained, or 0.1 parts by mass or more and 0.6 parts by mass or less can be contained.

[0071] In the case where the amino acid-based dispersant represented by General Formula (1) is contained in the above range, the dried film density can be increased. In addition, in the case where the amino acid-based dispersant is increased within the above range, for example, in the case where 0.1 parts by mass or more and 2 parts by mass or less, and preferably 0.1 parts by mass or more and 1.5 parts by mass or less, of the amino acid-based dispersant are contained with respect to 100 parts by mass of the conductive powder, the dried film density and the surface roughness can be increased.

[0072] Further, in the case where the content of the amino acid-based dispersant represented by General Formula (1) exceeds 2 parts by mass with respect to 100 parts by mass of the conductive powder, the drying properties are deteriorated, and thus after the conductive paste is printed on a dielectric green sheet and dried, an undried dried film is formed, and at the time of lamination, the chip shape is sometimes deteriorated and the number of protrusions on the dried film is increased, which can cause the destruction of the internal electrode layer and the like.

[0073] The amino acid-based dispersant represented by General Formula (1) can be used by selecting an amino acid-based dispersant satisfying the above-described characteristics from among commercially available products, for example. In addition, the above-described amino acid-based dispersant can be manufactured in a manner satisfying the above-described characteristics using a publicly known manufacturing method.

[0074] In the conductive paste, the content of the amine-based dispersant represented by General Formula (2) is preferably 0.01 parts by mass or more and 4 parts by mass or less, more preferably 0.02 parts by mass or more and 3 parts by mass or less, and even more preferably 0.04 parts by mass or more and 2 parts by mass or less, relative to 100 parts by mass of the conductive powder, and can also be 0.1 parts by mass or more and 1 part by mass or less. When the content of the amine-based dispersant represented by General Formula (2) is within the above range, the dispersibility can be improved, and the protrusions of the dried film can be effectively suppressed. When the content of the amine-based dispersant represented by General Formula (2) is more than the above range, the drying properties deteriorate, and thus, after the conductive paste is printed on a dielectric green sheet and dried, an un-dried dried film is formed, which can cause the chip shape to deteriorate and the protrusions of the dried film to increase due to the destruction of the internal electrode layer or the like at the time of lamination.

[0075] In addition, when the conductive paste contains both the amino acid-based dispersant represented by General Formula (1) and the amine-based dispersant represented by General Formula (2), the content of the amine-based dispersant represented by General Formula (2) can be 0.1 times or more and 3 times or less, 0.5 times or more and 2.5 times or less, or 0.8 times or more and 1.5 times or less, relative to the content of the amino acid-based dispersant represented by General Formula (1) in terms of mass ratio.

[0076] In addition, as described later, when the conductive paste contains the amino acid-based dispersant represented by General Formula (1), the amine-based dispersant represented by General Formula (2), and the amine-based dispersant represented by General Formula (3), the content of the amine-based dispersant represented by General Formula (2) can be 0.1 times or more and 3 times or less, 0.2 times or more and 2 times or less, or 0.3 times or more and 1.5 times or less, relative to the total content of the amino acid-based dispersant represented by General Formula (1) and the amine-based dispersant represented by General Formula (3) in terms of mass ratio.

[0077] Further, the dispersant can be composed of the amino acid-based dispersant represented by General Formula (1) and the amine-based dispersant represented by General Formula (2), and can also contain a dispersant other than these.

[0078] For example, when only the amino acid-based dispersant represented by General Formula (1) and the amine-based dispersant represented by General Formula (2) are contained as the dispersant, R2is preferably a group having 15 to 22 carbon atoms. In this case, the content of the amine-based dispersant represented by General Formula (2) can be 0.8 times or more and 1.5 times or less, relative to the content of the amino acid-based dispersant represented by General Formula (1) in terms of mass ratio.

[0079] The conductive paste according to the present embodiment can further contain the amine-based dispersant represented by General Formula (3) as the dispersant.

[0080] [Chemical 6]

[0081]

[0082] In the above general formula (3), R3 represents an alkyl group, an alkenyl group, or an alkynyl group having 8 to 16 carbon atoms, R4 represents an oxyethylene group, an oxypropylene group, or a methylene group, and R5 represents an oxyethylene group or an oxypropylene group. In addition, R4 and R5 can be the same or different. Furthermore, the N atom in general formula (3) is not directly bonded to the O atoms in R4 and R5, and Y is a number of 0 to 2, and Z is a number of 1 to 2.

[0083] The amine-based dispersant represented by general formula (3) is a tertiary amine or a secondary amine, and has a structure in which an amine group is bonded to one or two oxyalkylene groups.

[0084] In the case where the amine-based dispersant represented by general formula (3) is contained together with the amino acid-based dispersant represented by general formula (1) and the amine-based dispersant represented by general formula (2), the resulting conductive paste is also excellent in printability when forming a thin-film electrode, and the electrode pattern of an electronic component such as a multilayer ceramic capacitor formed using the conductive paste has a uniform width and thickness and is excellent in pattern precision.

[0085] In general formula (3), R3 represents an alkyl group, an alkenyl group, or an alkynyl group having 8 to 16 carbon atoms. In the case where the number of carbon atoms in R3 is in the above range, the powder in the conductive paste has sufficient dispersibility, and the solubility in a solvent is excellent. In addition, R3 is preferably a linear hydrocarbon group.

[0086] In general formula (3), R4 represents an oxyethylene group, an oxypropylene group, or a methylene group, and R5 represents an oxyethylene group or an oxypropylene group. In addition, R4 and R5 can be the same or different. Furthermore, the N atom in general formula (2) is not directly bonded to the O atoms in R4 and R5, Y is a number of 0 to 2, and Z is a number of 1 to 2.

[0087] For example, in general formula (3), in the case where R4 is an oxyalkylene group represented by -AO-, and Y is 1 to 2, the O atom in the terminal oxyalkylene group is bonded to the H atom adjacent to (R4) Y . In addition, in the case where R4 is a methylene group, (R4) Y is represented by -(CH2) Y . In the case where Y is 1 to 2, a methyl group (-CH3) or an ethyl group (-CH2-CH3) is formed by bonding to the adjacent H atom. In addition, in the case where R5 is an oxyalkylene group represented by -AO-, the O atom in the terminal oxyalkylene group is bonded to the H atom adjacent to (R5) Z .

[0088] In general formula (3), in the case where Y is 0, the above amine-based dispersant is a compound having -R3, one hydrogen group, and -(R5) Za secondary amine of H. For example, in the case where Y is 0 and Z is 2, the above-mentioned amine-based dispersant is a secondary amine composed of -(AO)2H in which any one of an alkyl group, an alkenyl group, or an alkynyl group having 8 to 16 carbon atoms, a hydrogen group, a vinyloxy group, and a propenyloxy group is bonded to the element H.

[0089] Further, in the general formula (3), in the case where Y is 1, the above-mentioned amine-based dispersant is a secondary amine having -R3, -R4H, and -(R5) Z a tertiary amine of H. Further, in the case where Y is 2, the above-mentioned amine-based dispersant is a tertiary amine having -R3, -(AO)2H or -C2H5 in which a vinyloxy group, a propenyloxy group, or an ethylene group as -(R4)2H is bonded to the element H, and -(R5) Z a tertiary amine of H.

[0090] In the conductive paste, with respect to 100 parts by mass of the conductive powder, 0.01 parts by mass or more and 4 parts by mass or less of the amine-based dispersant represented by the general formula (3) can be contained, preferably 0.02 parts by mass or more and 2.5 parts by mass or less, more preferably 0.03 parts by mass or more and 2 parts by mass or less, and also 0.05 parts by mass or more and 0.6 parts by mass or less can be contained. In the case where the amine-based dispersant represented by the general formula (3) is contained within the above-mentioned range, the viscosity change with time can be suppressed, and the viscosity stability can be improved.

[0091] Further, in the case where the conductive paste does not contain the amine-based dispersant represented by the general formula (2) and contains only the amino acid-based dispersant represented by the general formula (1) and the amine-based dispersant represented by the general formula (3), there is a tendency that the more the content of the amine-based dispersant represented by the general formula (3) is increased, the more the viscosity stability and the dispersibility are improved but the number of protrusions on the dried film is also increased. However, in the conductive paste according to the present embodiment, by containing the amine-based dispersant represented by the general formula (2), even in the case where the amine-based dispersant represented by the general formula (3) is contained in a relatively large amount (for example, in the case where 0.5 parts by mass or more, or 0.6 parts by mass or more is contained with respect to 100 parts by mass of the conductive powder), the viscosity stability and the dispersibility can be improved, and the generation of protrusions on the dried film can be suppressed.

[0092] Further, in the case where the content of the amine-based dispersant represented by the general formula (3) exceeds 2 parts by mass, since the dryability is deteriorated, after the conductive paste is printed on a dielectric green sheet and dried, an un-dried dried film is formed, and at the time of lamination, the internal electrode layer is damaged, and the like, the shape of the chip is sometimes deteriorated, and the number of protrusions on the dried film is increased.

[0093] The amine-based dispersant represented by the general formula (3) can be used by selecting an amine-based dispersant satisfying the above-mentioned characteristics from among commercially available products, for example. Further, the above-mentioned amine-based dispersant can be manufactured in a manner satisfying the above-mentioned characteristics by using a conventionally known manufacturing method.

[0094] In the conductive paste, the content of the dispersant as a whole is preferably 0.01 parts by mass or more and 5 parts by mass or less, more preferably 0.04 parts by mass or more and 3 parts by mass or less, and can also be 0.2 parts by mass or more and 2 parts by mass or less, with respect to 100 parts by mass of the conductive powder. With the content of the dispersant in the above range, the viscosity of the conductive paste can be adjusted to an appropriate range, and the sheet erosion and the peeling failure of the dielectric green sheet can be suppressed.

[0095] In addition, the content of the dispersant as a whole is preferably 4% by mass or less with respect to the total amount of the conductive paste. The upper limit of the content of the dispersant is preferably 3% by mass or less, more preferably 2% by mass or less, and can also be 1% by mass or less. The lower limit of the content of the dispersant is not particularly limited, and is, for example, 0.01% by mass or more, preferably 0.05% by mass or more, and can also be 0.1% by mass or more. With the content of the dispersant in the above range, the viscosity of the conductive paste can be adjusted to an appropriate range, and the sheet erosion and the peeling failure of the dielectric green sheet can be suppressed.

[0096] Further, the conductive paste can contain a dispersant other than the above-described amino acid-based dispersant and the amine-based dispersant, within a range that does not hinder the effects of the present application. As the dispersant other than the above, for example, an acid-based dispersant including a higher fatty acid, a high-molecular surfactant, or the like, a cationic dispersant other than the acid-based dispersant, a nonionic dispersant, an amphoteric surfactant, a high-molecular dispersant, or the like can be contained. In addition, one or two or more of these dispersants can be used in combination.

[0097] (Conductive paste)

[0098] The method for producing the conductive paste according to the present embodiment is not particularly limited, and a conventionally known method can be used. For example, the conductive paste of the present embodiment can be produced by preparing the above-described components, and stirring and kneading the components using a three-roll mill, a ball mill, a mixer, or the like. At this time, if the dispersant is applied to the surface of the conductive powder in advance, the conductive powder does not agglomerate, and can be sufficiently dispersed, and the surface of the conductive powder is covered with the dispersant, so that a uniform conductive paste can be easily obtained. In addition, the conductive paste can also be produced by dissolving the binder resin in an organic solvent for a carrier to produce an organic carrier, and then adding the conductive powder, the ceramic powder, the organic carrier, and the dispersant to an organic solvent for a paste, and stirring and kneading the mixture.

[0099] In addition, in the organic solvent, as the organic solvent for the carrier, in order to make the affinity of the organic carrier good, it is preferable to use the same organic solvent as the organic solvent for the slurry for adjusting the viscosity of the conductive slurry. The content of the organic solvent for the carrier is, for example, 5 parts by mass or more and 80 parts by mass or less, with respect to 100 parts by mass of the conductive powder. In addition, the content of the organic solvent for the carrier is preferably 10% by mass or more and 40% by mass or less, with respect to the entire amount of the conductive slurry.

[0100] Next, preferred properties of the conductive slurry according to the present embodiment will be described.

[0101] [Dry film density: DFD]

[0102] The density (DFD) of the dry film obtained by drying after printing the conductive slurry is preferably more than 4.8 g / cm 3 More preferably, it is 5.0 g / cm 3 Further preferably, it is 5.2 g / cm 3 Particularly preferably, it is 5.4 g / cm 3 or more.

[0103] [Surface roughness of dry film]

[0104] When a dry film of 20 mm square and 1 to 3 μm in film thickness is produced by screen printing the conductive slurry and drying it at 120°C for 1 hour in the atmosphere, the surface roughness Ra (arithmetic mean roughness) is preferably 0.10 μm or less, can be 0.07 μm or less, and can be 0.06 μm or less. In addition, the lower limit of the surface roughness Ra (arithmetic mean roughness) is preferably flat surface and is not particularly limited, but is preferably a value more than 0 and a smaller value is better.

[0105] [Number of protrusions of dry film]

[0106] The number of protrusions on the dry film produced using the conductive slurry is preferably 100 or less, more preferably 50 or less, and further preferably 20 or less. When the number of protrusions of the dry film is in the above range, short-circuiting failure of an electronic component such as a multilayer ceramic capacitor formed using the conductive slurry can be suppressed.

[0107] • Production conditions of dry film

[0108] On a glass substrate of 2 inches square and 1 mm in thickness, the conductive paste filtered with a filter having a width of 1.5 cm, a length of 4 cm, and a mesh of 6 μm was applied with a spatula at a thickness of 35 μm, and dried at 120°C for 10 minutes to obtain a dried film. In addition, using an optical microscope, the entire surface (width 1.5 cm x length 4 cm) of the applied film was observed using a lens of x 10, the number of protrusions of 5 μm or more in size in plan view was counted, and the number of protrusions on the dried film was calculated.

[0109] The conductive paste can be suitably used in electronic components such as multilayer ceramic capacitors. The multilayer ceramic capacitor has a dielectric layer formed using a dielectric green sheet and an internal electrode layer formed using the conductive paste.

[0110] For the multilayer ceramic capacitor, the dielectric ceramic powder contained in the dielectric green sheet and the ceramic powder contained in the conductive paste are preferably powders of the same composition. The multilayer ceramic capacitor manufactured using the conductive paste of the present embodiment can suppress sheet material erosion and peeling failure of the green sheet even when the thickness of the green sheet is, for example, 3 μm or less.

[0111] [Electronic Component]

[0112] Hereinafter, embodiments of electronic components and the like according to the present application will be described with reference to the drawings. In the drawings, sometimes, representation is appropriately performed in a schematic manner, and the scale is appropriately changed. In addition, the position, direction, and the like of the components are appropriately described with reference to the XYZ orthogonal coordinate system shown in, for example, FIG. 1. In the XYZ orthogonal coordinate system, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction (up-down direction). Figure 1

[0113] Figure 1 Figure 1 A in FIG. 1 and B in FIG. 2 are views of a multilayer ceramic capacitor 1 as one example of the electronic component according to the embodiments. The multilayer ceramic capacitor 1 has a laminate 10 in which dielectric layers 12 and internal electrode layers 11 are alternately stacked, and external electrodes 20.

[0114] Hereinafter, a manufacturing method of the multilayer ceramic capacitor using the above-described conductive paste will be described. First, the conductive paste is printed on the dielectric layer composed of the dielectric green sheet and dried to form a dried film. By stacking a plurality of dielectric layers having the dried film on the upper surface by pressure bonding, and then performing firing to integrate, a ceramic laminate 10 (laminate 10) in which the internal electrode layers 11 and the dielectric layers 12 are alternately stacked is prepared. Thereafter, the multilayer ceramic capacitor 1 is manufactured by forming a pair of external electrodes 20 at both end portions of the ceramic laminate 10. Hereinafter, a more detailed description will be given.​​

[0115] First, a green sheet as an unfired ceramic sheet is prepared. As the green sheet, for example, a green sheet formed by coating a slurry for a dielectric layer obtained by adding an organic binder such as polyvinyl butyral and a solvent such as terpineol to prescribed ceramic raw material powders such as barium titanate, etc. on a support film such as a PET film into a sheet shape and drying to remove the solvent, etc. can be listed. Further, the thickness of the dielectric layer composed of the green sheet is not particularly limited, but from the viewpoint of the demand for miniaturization of the multilayer ceramic capacitor, it is preferably 0.05 μm or more and 3 μm or less.

[0116] Next, a plurality of sheet materials having dried films formed by printing (coating) the above-described conductive slurry on one face of the green sheet according to a publicly known method such as a screen printing method and drying is prepared. Further, from the viewpoint of the demand for thinning of the internal electrode layer 11, the thickness of the conductive slurry (dried film) after printing is preferably 1 μm or less after drying.

[0117] Next, the green sheet is peeled off from the support film, and after being stacked in a manner that the dielectric layer composed of the green sheet and the dried film formed on one face of the dielectric layer are alternately arranged, a multilayer body (pressure bonded body) is obtained by a heating and pressure treatment. Further, it can also be configured that a green sheet for protection not coated with the conductive slurry is further arranged on both faces of the multilayer body (pressure bonded body).

[0118] Next, after the multilayer body (pressure bonded body) is cut into a prescribed size to form a green chip, the green chip is subjected to a debinding treatment, and is fired in a reducing atmosphere, whereby a ceramic multilayer body 10 is manufactured. Further, the atmosphere in the debinding treatment is preferably an air or N2 gas atmosphere. The temperature at the time of the debinding treatment is, for example, 200°C or more and 400°C or less. In addition, the holding time of the above-described temperature at the time of the debinding treatment is preferably 0.5 hours or more and 24 hours or less. In addition, the firing is performed in a reducing atmosphere in order to suppress oxidation of the metal used in the internal electrode layer, and the temperature at the time of the firing of the multilayer body (pressure bonded body) is, for example, 1000°C or more and 1350°C or less, and the holding time of the temperature at the time of the firing is, for example, 0.5 hours or more and 8 hours or less.

[0119] By performing firing of the green chip, the organic binder in the green chip is completely removed, and the ceramic raw material powder is fired to form the ceramic dielectric layer 12. In addition, the organic carrier in the dried film is removed, and the nickel powder or the alloy powder having nickel as a main component is sintered or fused to be integrated, thereby forming the internal electrode, and further forming the ceramic laminate 10 in which the dielectric layer 12 and the internal electrode layer 11 are alternately laminated in multiple layers. Further, from the viewpoint of improving reliability by bringing oxygen into the inside of the dielectric layer and suppressing reoxidation of the internal electrode, annealing treatment can be performed on the ceramic laminate 10 after firing.

[0120] Then, by providing a pair of external electrodes 20 to the prepared ceramic laminate 10, a multilayer ceramic capacitor 1 is manufactured. For example, the external electrode 20 has an external electrode layer 21 and a plating layer 22. The external electrode layer 21 is electrically connected to the internal electrode layer 11. Further, as a material of the external electrode 20, for example, copper, nickel, or an alloy thereof can be appropriately used. Further, the electronic component is not limited to the multilayer ceramic capacitor, and can be an electronic component other than the multilayer ceramic capacitor.

[0121] Example

[0122] Hereinafter, the present application is described in detail based on examples and comparative examples, but the present application is not limited to any of the examples.

[0123] [evaluation method]

[0124] (Number of protrusions of conductive paste)

[0125] The conductive paste was prepared, filtered using a filter having a mesh size of 6 μm, and then applied to a glass substrate having a size of 2 inches square and a thickness of 1 mm using an applicator to a thickness of 35 μm, a width of 1.5 cm, and a length of 4 cm. The dried film was dried at 120°C for 10 minutes to prepare a sample (dried film). Thereafter, the entire surface (1.5 cm x 4 cm) of the obtained dried film was observed from above using an optical microscope manufactured by Olympus with a lens of x 10, and the number of protrusions having a size (length in the longest axis direction) of 5 μm or more was counted. Further, the smaller the number of protrusions, the more preferable.

[0126] (Dried film density DFD)

[0127] The prepared conductive paste was placed on a PET film, and extended to a length of about 100 mm using an applicator having a width of 50 mm and a gap of 125 μm. The obtained PET film was dried at 120°C for 40 minutes to form a dried body, and the dried body was cut into four pieces in a size of 2.54 cm (1 inch) square. On the basis of peeling the PET film, the thickness and weight of the dried film of each of the four pieces were measured, and the dried film density (average value) was calculated.

[0128] (Surface roughness)

[0129] A conductive paste prepared by screen printing on a heat-resistant tempered glass of 2.54 cm (1 inch) square was dried in the atmosphere at 120°C for 1 hour, thereby producing a dried film of 20 mm square and 1 to 3 μm in thickness. The surface roughness Ra (arithmetic average roughness) of the produced dried film was measured based on the standard of JIS B0601-2001.

[0130] (Comprehensive evaluation)

[0131] As the comprehensive evaluation of the dried film, the case where the number of projections was 20 or less and the surface roughness Ra was 0.1 μm or less was evaluated as "O", the case where the number of projections was more than 20 and 99 or less and the surface roughness Ra was 0.1 μm or less was evaluated as "Δ", and the case where the number of projections was more than 100 and / or the surface roughness Ra was more than 0.1 μm was evaluated as "X".

[0132] [Materials used]

[0133] (Conductive powder)

[0134] As the conductive powder, a Ni powder (SEM average particle diameter: 0.2 μm) was used.

[0135] (Ceramic powder)

[0136] As the ceramic powder, barium titanate (BaTiO3; SEM average particle diameter: 0.10 μm) was used.

[0137] (Binder resin)

[0138] As the binder resin, an ethyl cellulose resin (EC resin) and / or a polyvinyl butyral resin (PVB resin) was used. Further, the binder resin was prepared as a binder resin dissolved in isobutyl acetate (organic solvent) as a carrier.

[0139] (Dispersant)

[0140] The following dispersants were used.

[0141] (1) As the dispersant a, an amino acid-based dispersant represented by R1= C 17 H 33 (a straight-chain hydrocarbon group) in the above general formula (1) was used.

[0142] (2) As the dispersant b, an amine-based dispersant represented by R2= C 18 H 35 (a straight-chain hydrocarbon group) in the above general formula (2) was used.

[0143] (3) As a dispersant b2, use R2=C in the above general formula (2). 12 H 25 Amine dispersants represented by (straight-chain hydrocarbon groups).

[0144] (4) As a dispersant c, use R3 = C in the above general formula (3). 12 H 25 The amine dispersants are shown as R4=C2H4O, R5=C2H4O, Y=1, and Z=1.

[0145] (Organic solvents)

[0146] As organic solvents, isobornyl acetate (IBA) or terpineol (TPO) are used.

[0147] [Example 1]

[0148] A conductive slurry was prepared by mixing the following materials in a 100% by weight ratio: 50% by weight conductive powder, 10% by weight ceramic powder, 3% by weight binder resin in a carrier composed of ethyl cellulose resin and polyvinyl butyral resin (ethyl cellulose resin: polyvinyl butyral resin = 60:40 (weight ratio)), 0.62% by weight dispersant in the proportions shown in Table 1, and an organic solvent. The surface roughness and number of protrusions of the dried film of the prepared conductive slurry were evaluated using the above method. The evaluation results are shown in Table 1.

[0149] [Examples 2-12, Comparative Examples 1-3]

[0150] Except for changing the dispersant content to the amounts shown in Table 1, a conductive slurry was prepared under the same conditions as in Example 1. The prepared conductive slurry was used to evaluate surface roughness and the number of protrusions using the methods described above. The evaluation results are shown in Table 1.

[0151] Furthermore, in the table, the "parts by mass" indicating the content of each dispersant is a proportion relative to 100 parts by mass of the conductive powder. Additionally, in the table, the "% by mass" indicating the content of each dispersant is a proportion relative to 100% by mass of the conductive slurry.

[0152]

[0153] [Examples 13-16, Comparative Example 3, Comparative Example 4]

[0154] An electrically conductive paste was produced under the same conditions as in Example 1, except that the kinds and amounts of the materials were set to those shown in Table 2. Using the produced electrically conductive paste, the surface roughness and the number of projections and the like were evaluated by the above-described methods. The evaluation results are shown in Table 2. In addition, Comparative Example 3 in Table 2 is the same as Comparative Example 3 in Table 1 (shown for comparison).

[0155]

[0156] [Results of Evaluation]

[0157] As shown in Table 1, in the electrically conductive pastes of the Examples containing the amino acid-based dispersant a, the amine-based dispersant b, and the amine-based dispersant c, the surface roughness Ra (arithmetic average roughness) of the dried film was 0.10 μm or less, and the number of projections of the dried film was 100 or less. In addition, in the electrically conductive pastes of the Examples, the dried film density (DFD) was 5.5 g / cm 3 As described above, excellent dispersibility was exhibited.

[0158] On the other hand, in the electrically conductive pastes of Comparative Examples 1 to 3 not containing the amine-based dispersant b, the number of projections of the dried film increased, as compared with Example 1, Example 4, and Example 7, which were produced under the same conditions except that the amine-based dispersant b was not contained. In addition, in the electrically conductive paste of Comparative Example 2, since the content of the amine-based dispersant c was small, although the number of projections of the dried film somewhat decreased, the surface roughness Ra of the dried film exceeded 0.10 μm. In addition, in the electrically conductive paste of Comparative Example 3, since the content of the dispersant as a whole was sufficiently large, although the surface roughness Ra of the dried film was 0.10 μm or less, a large number of projections were generated on the dried film.

[0159] In addition, as shown in Table 2, in the electrically conductive pastes of Examples 13 to 16 containing the amino acid-based dispersant a and the amine-based dispersant b or b2, the surface roughness Ra of the dried film was also exhibited to be 0.10 μm or less, and the number of projections of the dried film was 100 or less. In particular, in the electrically conductive paste of Example 16 containing the ethyl cellulose resin (EC) and the polyvinyl butyral resin (PVB) as the binder resin, the number of projections of the dried film further decreased, as compared with the electrically conductive paste of Example 15 (binder resin: only EC).

[0160] On the other hand, in the electrically conductive paste of Comparative Example 4 containing only the amino acid-based dispersant a, the surface roughness Ra of the dried film exceeded 0.10 μm, and a large number of projections were generated on the dried film.

[0161] Furthermore, the technical scope of the present application is not limited to the modes described in the above-described embodiments and the like. One or more of the components described in the above-described embodiments and the like can be omitted at times. In addition, the components described in the above-described embodiments and the like can be appropriately combined. In addition, the disclosure of all documents cited in the above-described embodiments and the like is incorporated herein by reference as part of the disclosure, to the extent permitted by law. In addition, the contents of Japanese Patent Application No. 2020-036584, which is a Japanese patent application, are incorporated herein by reference as part of the disclosure, to the extent permitted by law.

[0162] Explanation of Reference Signs

[0163] 1 Multilayer ceramic capacitor

[0164] 10 Ceramic multilayer body

[0165] 11 Internal electrode layer

[0166] 12 Dielectric layer

[0167] 20 External electrode

[0168] 21 External electrode layer

[0169] 22 Plating layer

Claims

1. A conductive paste comprising conductive powder, ceramic powder, dispersant, binder resin, and organic solvent, characterized in that, The dispersant contains an amino acid-based dispersant of general formula (1) in an amount of 0.01 to 4 parts by weight relative to 100 parts by weight of the conductive powder, an amine-based dispersant of general formula (2) in an amount of 0.01 to 4 parts by weight relative to 100 parts by weight of the conductive powder, and an amine-based dispersant of general formula (3) in an amount of 0.3 to 4 parts by weight relative to 100 parts by weight of the conductive powder. The content of the amine-based dispersant of general formula (2) is 0.1 to 3 times by weight relative to the total content of the amino acid-based dispersant of general formula (1) and the amine-based dispersant of general formula (3). 【Chemistry 1】 In general formula (1), R1 represents a straight-chain hydrocarbon group with 10 to 20 carbon atoms. 【Chemistry 2】 In general formula (2), R2 represents a chain hydrocarbon group with 12 to 22 carbon atoms. 【Transformation 3】 In general formula (3), R3 represents an alkyl, alkenyl or alkynyl group with 8 to 16 carbon atoms, R4 represents vinyl oxide, propenyl oxide or methylene oxide, and R5 represents vinyl oxide or propenyl oxide. R4 and R5 may be the same or different. In addition, the N atom in formula (3) is not directly bonded to the O atom in R4 and R5, and Y is a number of 0 to 2 and Z is a number of 1 to 2.

2. The conductive paste according to claim 1, characterized in that, The dispersant further contains an amine dispersant of the following general formula (3) in an amount of 0.5 to 4 parts by mass relative to 100 parts by mass of the conductive powder, and the conductive slurry contains the conductive powder in an amount of 40% to 60% by mass relative to the total conductive slurry.

3. The conductive paste according to claim 1 or 2, characterized in that, The dispersant contains 0.01% to 4% by mass relative to the conductive slurry as a whole.

4. The conductive paste according to claim 1 or 2, characterized in that, The conductive powder contains at least one metal powder selected from Ni, Pd, Pt, Au, Ag, Cu, and alloys thereof.

5. The conductive paste according to claim 1 or 2, characterized in that, The conductive powder has an average particle size of 0.05 μm to 1.0 μm.

6. The conductive paste according to claim 1 or 2, characterized in that, The ceramic powder contains perovskite oxide.

7. The conductive paste according to claim 1 or 2, characterized in that, The ceramic powder has an average particle size of 0.01 μm to 0.5 μm.

8. The conductive paste according to claim 1 or 2, characterized in that, The adhesive resin contains at least one of cellulose resin, acrylic resin, and butyral resin.

9. The conductive paste according to claim 1 or 2, characterized in that, The conductive paste is used for the internal electrodes of the laminated ceramic component.

10. An electronic component, characterized in that, The electronic component is formed using the conductive paste according to any one of claims 1 to 9.

11. A multilayer ceramic capacitor, characterized in that, The multilayer ceramic capacitor has at least a multilayer body formed by stacking a dielectric layer and an internal electrode, wherein the internal electrode is formed using the conductive paste of claim 9.

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