Device including a multi-directional antenna in substrates coupled by a flexible interconnection

Abstract

A device includes: a first substrate including a first antenna; an integrated device coupled to the first substrate; an encapsulation layer located over the first substrate and the integrated device; a second substrate including a second antenna; and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

Description

[0001] Priority Claim

[0002] This patent application claims the priority of U.S. Non - Patent Application No. 16 / 810,621, titled "DEVICE COMPRISING MULTI - DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS", filed on March 5, 2020, assigned to the assignee of this application, and incorporated herein by reference in its entirety. Technical Field

[0003] Various features relate to devices having antennas, but more particularly to a device including multi - directional antennas in substrates coupled through flexible interconnects. Background Art

[0004] Figure 1 An illustration shows a package 100 including a substrate 102 and a die 103. The die 103 is coupled to the substrate 102. The substrate 102 includes a dielectric layer 120 and a plurality of interconnects 122. The substrate 102 further includes a first antenna 150 and a second antenna 160. Both the first antenna 150 and the second antenna 160 are embedded in the substrate 102. The first antenna 150 is defined by a first plurality of interconnects 152, and the second antenna 160 is defined by a second plurality of interconnects 162. Both the first antenna 150 and the second antenna 160 point in the same direction, which may limit the overall performance of the package 100 because signals may come from different directions. There has been a continuing need to provide packages with improved transmission and reception performance. Summary of the Invention

[0005] Various features relate to devices having antennas, but more particularly to a device including multi - directional antennas in substrates coupled through flexible interconnects.

[0006] One example provides a device, comprising: a first substrate including a first antenna; an integrated device coupled to the first substrate; an encapsulation layer located over the first substrate and the integrated device; a second substrate including a second antenna; and a flexible connection coupled to the first substrate and the second substrate.

[0007] Another example provides an apparatus, comprising: a first substrate including a first antenna; an integrated device coupled to the first substrate; a component for encapsulation located over the first substrate and the integrated device; a second substrate including a second antenna; and a component for flexible connection coupled to the first substrate and the second substrate.

[0008] Another example provides a method for manufacturing a device. The method provides a substrate including a first antenna and a second antenna. The method removes portions of the substrate to define (i) a first substrate including the first antenna, (ii) a second substrate including the second antenna, and (iii) a flexible connection coupled to the first substrate and the second substrate. The method couples an integrated device to the substrate. The method forms an encapsulation layer over the substrate and the integrated device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] When taken in conjunction with the accompanying drawings, various features, properties, and advantages will become apparent from the following detailed description, in which like reference numerals throughout identify corresponding parts.

[0010] Figure 1 A cross-sectional view of a package including a substrate is illustrated, where an antenna is embedded in the substrate.

[0011] Figure 2 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0012] Figure 3 A cross-sectional view of an exemplary first substrate including a flexible connection and an embedded antenna is illustrated.

[0013] Figure 4 A cross-sectional view of an exemplary second substrate including a flexible connection and an embedded antenna is illustrated.

[0014] Figure 5 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0015] Figure 6 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0016] Figure 7 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0017] Figure 8 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0018] Figure 9 A cross-sectional view of an exemplary device including a substrate is illustrated, each substrate having an embedded antenna, where the substrates are coupled by a flexible connection.

[0019] Figure 10A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0020] Figure 11 A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0021] Figure 12 A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0022] Figure 13 A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0023] Figure 14 A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0024] Figure 15 A view illustrating an exemplary configuration of a first substrate coupled to a second substrate by a flexible connection.

[0025] FIG. 16 (including Figures 16A to 16F ) illustrates an exemplary sequence for manufacturing a device that includes a number of substrates each having an embedded antenna.

[0026] Figure 17 An exemplary flow chart of a method for manufacturing a device that includes a number of substrates each having an embedded antenna.

[0027] Figure 18 Illustrates various electronic devices in which the dies, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages described herein may be integrated. Detailed Description

[0028] In the following description, specific details are given to provide a thorough understanding of the various aspects of the present disclosure. However, one of ordinary skill in the art will understand that the various aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams to avoid obscuring the various aspects in unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail so as not to obscure the various aspects of the present disclosure.

[0029] The present disclosure describes a device, comprising: a first substrate including a first antenna; an integrated device coupled to the first substrate; an encapsulation layer located over the first substrate and the integrated device; a second substrate including a second antenna; and a flexible connection coupled to the first substrate and the second substrate. The flexible connection is embedded in the first substrate and the second substrate. The first antenna may be embedded in the first substrate. The second antenna may be embedded in the second substrate. The first antenna may be configured to face a first antenna direction. The second antenna may be configured to face a second antenna direction different from the first antenna direction. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield may be formed over a side surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield. By using multi-directional antennas and shielding various components of the device and / or the package, the devices described in the present disclosure may provide an antenna device or an antenna-in-package (AiP) with a smaller form factor and / or provide better performance (e.g., better transmission and reception performance). The device and / or the AiP may include a radio frequency (RF) package.

[0030] Exemplary device including substrates with multi-directional antennas and flexible connections

[0031] Figure 2 FIG. shows a cross-sectional view of a device 200 including a package 202, a package 204, and a flexible connection 206. As will be further described below, the device 200 includes multi-directional antennas that contribute to improving the performance of the device 200. The device 200 may include an antenna-in-package (AiP). The device 200 may include a radio frequency (RF) package. The device 200 may be configured to provide wireless fidelity (WiFi) communication and / or cellular communication (e.g., 2G, 3G, 4G, 5G). The device 200 may be configured to support Global System for Mobile Communications (GSM), Universal Mobile Telecommunications System (UMTS), and / or Long Term Evolution (LTE). The device 200 may be configured to transmit and receive signals with different frequencies and / or communication protocols.

[0032] The package 202 (e.g., the first package) includes a substrate 220 (e.g., the first substrate), one or more integrated devices (e.g., 222, 224), one or more passive devices (e.g., 226, 228), an encapsulation layer 210, and a shield 230. The substrate 220 includes one or more dielectric layers 221 and a plurality of interconnects 223. The integrated devices may include dies (e.g., processor dies, memory dies). As will be further described below, some of the plurality of interconnects 223 may be configured as one or more antennas.

[0033] The package 204 (e.g., the second package) includes a substrate 240 (e.g., the second substrate), one or more integrated devices (e.g., 242), one or more passive devices (e.g., 246), an encapsulation layer 270, and a shield 250. The substrate 240 includes one or more dielectric layers 241 and a plurality of interconnects 243. The integrated devices may include dies (e.g., a processor die, a memory die). As will be further described below, some of the plurality of interconnects 243 may be configured as one or more antennas (e.g., at least one interconnect from the plurality of interconnects 243 may define at least one antenna).

[0034] The package 202 is coupled to the package 204 via a flexible connection 206. Thus, the flexible connection 206 may be coupled to the package 202 (e.g., the first package) and the package 204 (e.g., the second package). The flexible connection 206 may be embedded in the package 202 and the package 204. The flexible connection 206 includes at least one dielectric layer 260 and at least one interconnect 262. The at least one dielectric layer 260 may include polyimide or liquid crystal polymer. The flexible connection 206 may be configured to electrically couple the package 202 and the package 204. The flexible connection 206 may be configured to allow different currents (e.g., signals, power, ground) to propagate between the package 202 and the package 204. For example, the flexible connection 206 may include (i) at least one first interconnect configured for signals (e.g., input / output signals), (ii) at least one second interconnect configured for power, and (iii) at least one third interconnect configured for ground. The flexible connection 206 is bendable such that the package 204 may be positioned at an angle with respect to the package 202, and vice versa. The flexible connection 206 may be a component for a flexible connection. Although not shown, the flexible connection 206 may include a covering protective material or be covered by a protective material. In at least some embodiments, the flexible connection 206 may be configured to be bendable up to 180 degrees without breaking. Thus, for example, components of the flexible connection 206 such as the at least one dielectric layer 260 and the at least one interconnect 262 may be bent up to 180 degrees without causing damage, cracks, and / or breaks in the flexible connection 206. Various embodiments of the flexible connection 206 may be bendable to different degrees. For example, in at least some embodiments, the flexible connection 206 may be configured to be bendable up to 90 degrees without breaking and / or cracking. In at least some embodiments, the flexible connection 206 may be configured to be bendable at least 10 degrees (or more) without breaking and / or cracking. The term “flexible” may mean that a component (i) is bendable at least 10 degrees (or more) without breaking and / or cracking, and / or (ii) is bendable up to 180 degrees without breaking and / or cracking.

[0035] As Figure 2As shown, package 202 is positioned relative to package 204 such that the antenna direction of package 202 faces a first direction (e.g., along the X direction, Y direction, Z direction), and the antenna direction of package 204 faces a second direction different from the first direction (e.g., along the Y direction, Y direction, Z direction). For example, package 202 may include a first antenna that includes a first antenna direction, and package 204 may include a second antenna that includes a second antenna direction. This configuration and / or other configurations may allow device 200 to provide better transmission and / or reception performance because the various antennas are aligned in multiple different directions rather than just in one direction.

[0036] Figure 3 A close-up cross-sectional view of package 202 of device 200 is illustrated. As Figure 3 shown, package 202 includes a substrate 220, integrated devices 222, integrated devices 224, passive devices 226, passive devices 228, an encapsulation layer 210, and a shield 230. Substrate 220 includes one or more dielectric layers 221 and a plurality of interconnects 223 (e.g., traces, pads, vias). The one or more dielectric layers 221 may include prepreg, Ajinomoto Build-up Film (ABF), polyimide, and / or combinations thereof. Substrate 220 includes a first surface (e.g., top surface) and a second surface (e.g., bottom surface). Integrated devices 222, integrated devices 224, passive devices 226, and passive devices 228 are coupled to the first surface of substrate 220. Encapsulation layer 210 is located above the first surface of substrate 220 such that encapsulation layer 210 encapsulates integrated devices 222, integrated devices 224, passive devices 226, and passive devices 228. Encapsulation layer 210 may include a mold, resin, and / or epoxy resin. Encapsulation layer 210 may be a component for encapsulation. Shield 230 is formed on and located above the outer surface of encapsulation layer 210 and one or more surfaces of substrate 220. For example, shield 230 may be formed on and located above the first surface and / or side surface of substrate 220. Shield 230 includes an electromagnetic interference (EMI) shield. Shield 230 may be a component for shielding (e.g., a component for EMI shielding).

[0037] As mentioned above, substrate 220 includes a plurality of interconnects 223, some of which may be configured to operate as one or more antennas. Figure 3Illustrated are antennas (e.g., 350a, 350b, 350c, 350d) formed in substrate 220. The antennas (e.g., 350a, 350b, 350c, 350d) can be embedded antennas formed based on interconnections from multiple interconnections 223. The antennas (e.g., 350a, 350b, 350c, 350d) can be located (e.g., embedded) in substrate 220 such that the antennas (e.g., 350a, 350b, 350c, 350d) face the second surface (e.g., bottom surface) of substrate 220. The direction in which the second surface of substrate 220 faces can be considered the antenna direction (e.g., first antenna direction) of the antennas (e.g., 350a, 350b, 350c, 350d). The antennas (e.g., 350a, 350b, 350c, 350d) can be electrically coupled to one or more of the integrated devices (e.g., 222, 224) via multiple interconnections 223.

[0038] Figure 3 Also illustrated is a flexible connection 206 coupled to substrate 220. The flexible connection 206 can be embedded in substrate 220. The flexible connection 206 can be considered part of substrate 220. The flexible connection 206 includes at least one dielectric layer 260 and at least one interconnection 262. The at least one dielectric layer 260 can be part of at least one dielectric layer 221 of substrate 220. The at least one interconnection 262 can be coupled to the multiple interconnections 223. The at least one dielectric layer 260 and the at least one interconnection 262 can be flexible and / or bendable.

[0039] Figure 4 Illustrated is a close-up cross-sectional view of the package 204 of the device 200. As Figure 4 shown, the package 204 includes a substrate 240, an integrated device 242, a passive device 246, an encapsulation layer 270, and a shield 250. The substrate 240 includes one or more dielectric layers 241 and multiple interconnections 243 (e.g., traces, pads, vias). The substrate 240 includes a first surface (e.g., top surface) and a second surface (e.g., bottom surface). The integrated device 242 and the passive device 246 are coupled to the first surface of the substrate 240. The encapsulation layer 270 is located above the first surface of the substrate 240 such that the encapsulation layer 270 encapsulates the integrated device 242 and the passive device 246. The encapsulation layer 270 can include a mold, a resin, and / or an epoxy resin. The encapsulation layer 270 can be a component for encapsulation. The shield 250 is formed on and located above the outer surface of the encapsulation layer 270 and one or more surfaces of the substrate 240. For example, the shield 250 can be formed on and located above the first surface and / or the side surface of the substrate 240. The shield 250 includes an electromagnetic interference (EMI) shield. The shield 250 can be a component for the shield (e.g., a component for the EMI shield).

[0040] As mentioned above, substrate 240 includes a plurality of interconnects 243, some of which may be configured to operate as one or more antennas. Figure 4 Illustrated are antennas (e.g., 450a, 450b, 450c, 450d) formed in substrate 240. The antennas (e.g., 450a, 450b, 450c, 450d) may be embedded antennas formed based on interconnects from the plurality of interconnects 243. The antennas (e.g., 450a, 450b, 450c, 450d) may be located (e.g., embedded) in substrate 240 such that the antennas (e.g., 450a, 450b, 450c, 450d) face a second surface (e.g., bottom surface) of substrate 240. The direction in which the second surface of substrate 240 faces may be considered the antenna direction (e.g., second antenna direction) of the antennas (e.g., 450a, 450b, 450c, 450d). The antennas (e.g., 450a, 450b, 450c, 450d) may be electrically coupled to one or more of the integrated devices (e.g., 222, 224, 242) via the plurality of interconnects 243.

[0041] Figure 4 Also illustrated is a flexible connection 206 coupled to substrate 240. The flexible connection 206 may be embedded in substrate 240. The flexible connection 206 may be considered part of substrate 240. The flexible connection 206 includes at least one dielectric layer 260 and at least one interconnect 262. The at least one dielectric layer 260 may be part of at least one dielectric layer 241 of substrate 240. The at least one interconnect 262 may be coupled to the plurality of interconnects 243.

[0042] As will be further described below, substrate 220 and / or substrate 240 may include interconnects configured as external input / output (I / O) terminals, which allows substrate 220 and / or substrate 240 to be coupled to external components. Moreover, as will be further described below, substrate 220, substrate 240, and flexible connection 206 may be manufactured simultaneously as part of the same substrate.

[0043] Examples of devices including a substrate with a multi-directional antenna have been described, and various other examples of devices including a substrate with a multi-directional antenna are further illustrated and described below.

[0044] Exemplary device including a substrate with a multi-directional antenna and a flexible connection

[0045] Figure 5A cross-sectional view of a device 500 including a package 202, a package 504, and a flexible connection 206 is illustrated. The package 202 and the flexible connection 206 of the device 500 are similar to the package 202 and the flexible connection 206 of the device 200, and thus may include components similar to those of the package 202 and the flexible connection 206 of the device 200. The package 202 of the device 500 includes a connector 550 coupled to a substrate 22,0. The connector 550 may be coupled to a plurality of interconnects 223. The connector 550 may be configured as an external input / output (I / O) terminal of the package 202.

[0046] Figure 5 It is illustrated that the package 504 is coupled to the package 202 via the flexible connection 206. The package 504 is similar to the package 204 of the device 200, and thus may include components similar to those of the package 204 of the device 200. One difference between the package 504 and the package 204 is that the package 504 does not include an integrated device. The package 504 includes a substrate 240 and antennas (e.g., 450a, 450b, 450c, 450d). The antennas (e.g., 450a, 450b, 450c, 450d) may be coupled (e.g., electrically coupled) to the package 202 via the flexible connection 206.

[0047] Figure 6 A cross-sectional view of a device 600 including a package 202, a package 604, and a flexible connection 206 is illustrated. The package 202 and the flexible connection 206 of the device 600 are similar to the package 202 and the flexible connection 206 of the device 200, and thus may include components similar to those of the package 202 and the flexible connection 206 of the device 200.

[0048] Figure 6 It is illustrated that the package 604 is coupled to the package 202 via the flexible connection 206. The package 604 is similar to the package 204 of the device 200, and thus may include components similar to those of the package 204 of the device 200. One difference between the package 604 and the package 204 is that the package 604 does not include an integrated device. The package 604 includes a substrate 240 and antennas (e.g., 450a, 450b, 450c, 450d). The antennas (e.g., 450a, 450b, 450c, 450d) may be coupled (e.g., electrically coupled) to the package 202 via the flexible connection 206. The substrate 240 of the package 604 further includes a plurality of interconnects 650 (e.g., a land pad array) configured as external input / output (I / O) terminals of the substrate 240. Thus, in some embodiments, the antennas (e.g., 450a, 450b, 450c, 450d) may be coupled to external components (e.g., an integrated device) via the plurality of interconnects 650. The plurality of interconnects 650 may be considered a part of the plurality of interconnects 243.

[0049] Figure 7 A cross-sectional view of a device 700 including a package 202, a package 204, and a flexible connection 206 is illustrated. The package 202 and the flexible connection 206 of the device 700 are similar to the package 202 and the flexible connection 206 of the device 200, and thus may include components similar to those of the package 202 and the flexible connection 206 of the device 200. The package 202 includes a plurality of solder interconnects 750 coupled to a plurality of interconnects 223. The plurality of solder interconnects 750 may enable the package 202 to be coupled to external components.

[0050] Figure 8 A cross-sectional view of a device 800 including a package 202, a package 804, and a flexible connection 206 is illustrated. The package 202 and the flexible connection 206 of the device 800 are similar to the package 202 and the flexible connection 206 of the device 200, and thus may include components similar to those of the package 202 and the flexible connection 206 of the device 200. The package 202 includes a plurality of interconnects 850 (such as a landing pad array) coupled to a plurality of interconnects 223. The plurality of interconnects 850 may enable the package 202 to be coupled to external components. The plurality of interconnects 850 may be considered part of the plurality of interconnects 223.

[0051] Figure 8 It is illustrated that the package 804 is coupled to the package 202 through the flexible connection 206. The package 804 is similar to the package 204 of the device 200, and thus may include components similar to those of the package 204 of the device 200. The package 804 includes a plurality of interconnects 860 (such as a landing pad array) coupled to a plurality of interconnects 243. The plurality of interconnects 860 may enable the package 804 to be coupled to external components.

[0052] Figure 9 A cross-sectional view of a device 900 including a package 902, a package 904, and a flexible connection 206 is illustrated. The package 902 and the flexible connection 206 of the device 900 are similar to the package 202 and the flexible connection 206 of the device 200, and thus may include components similar to those of the package 202 and the flexible connection 206 of the device 200. The package 902 includes integrated devices (such as 222, 224, 922) and passive devices (such as 226, 228) coupled to a substrate 220. An encapsulation layer 210 may be substantially over a first surface of the substrate 220. The encapsulation layer 210 may encapsulate the integrated devices (such as 222, 224, 922) and the passive devices (such as 226, 228). A shield 230 may be formed over an outer surface of the encapsulation layer 210 and a portion of the substrate 220.

[0053] Figure 9Illustrated is that package 904 is coupled to package 902 via flexible connection 206. Package 904 is similar to package 204 of device 200, and thus may include components similar to those of package 204 of device 200. Package 904 includes substrate 240, substrate 940, integrated device 242, passive device 246, encapsulation layer 270, and shield 250. Integrated device 242 and passive device 246 are coupled to substrate 940. Substrate 940 may include one or more dielectric layers and a plurality of interconnects. Integrated device 242 and passive device 246 are coupled to substrate 240 via substrate 940. Encapsulation layer 270 may encapsulate integrated device 242, passive device 246, and substrate 940. Shield 250 may be located on the outer surface of encapsulation layer 270.

[0054] Different embodiments may couple substrates in different ways via flexible connection 206. Figures 10 to 15 Illustrated are various configurations and arrangements of substrates coupled via a flexible connection. Figure 10 Illustrated is an example of device 1000 including substrate 220, substrate 240, and flexible connection 206, where substrate 220 and substrate 240 are coupled to flexible connection 206 along the length of substrate 220 and the length of substrate 240.

[0055] Figure 11 Illustrated is an example of device 1100 including substrate 220, substrate 240, and flexible connection 206, where substrate 220 and substrate 240 are coupled to flexible connection 206 along the width of substrate 220 and the width of substrate 240. Flexible connection 206 may be considered a part of substrate 220 and substrate 240.

[0056] Figure 12 Illustrated is an example of device 1200 including substrate 220, substrate 240, and flexible connection 206, where substrate 220 and substrate 240 are coupled to flexible connection 206 along the width of substrate 220 and the length of substrate 240.

[0057] Figure 13 Illustrated is an example of device 1300 including substrate 220, substrate 240, and flexible connection 206, where substrate 220 and substrate 240 are coupled to flexible connection 206 along the width of substrate 220 and the length of substrate 240 such that substrate 220 and substrate 240 form a T shape.

[0058] In some embodiments, more than two substrates may be coupled together via a number of flexible connections. Figure 14Illustrated is an example of a device 1400 including a substrate 220, substrates 240a, 240b, flexible connections 206a and 206b, where the substrate 220 and the substrate 240a are coupled to the flexible connection 206a along the width of the first side of the substrate 220 and the length of the substrate 240a. Additionally, the substrate 220 and the substrate 240b are coupled to the flexible connection 206b along the width of the second side of the substrate 220 and the length of the substrate 240b. The flexible connection 206a can be considered as part of the substrate 220 and the substrate 240a. The flexible connection 206b can be considered as part of the substrate 220 and the substrate 240b.

[0059] Figure 15 Illustrated is an example of a device 1500 including a substrate 220, substrates 240a, 240b, flexible connections 206a and 206b, where the substrate 220 and the substrate 240a are coupled to the flexible connection 206a along the width of the first side of the substrate 220 and the length of the substrate 240a. Additionally, the substrate 220 and the substrate 240b are coupled to the flexible connection 206b along the length of the second side of the substrate 220 and the length of the substrate 240b. The flexible connection 206a can be considered as part of the substrate 220 and the substrate 240a. The flexible connection 206b can be considered as part of the substrate 220 and the substrate 240b.

[0060] Different embodiments may use substrates with different sizes and shapes. Different embodiments may include different numbers of substrates, different numbers of flexible connections, which are coupled along different surfaces of the substrates. The relative angles between different substrates can vary and are not limited to a perpendicular angle. The relative positions and / or angles between substrates can be in the range of 0 to 360 degrees. Thus, the positions, shapes, sizes, angles of the illustrated substrates are merely exemplary. Moreover, various components (such as integrated devices, passive devices), (multiple) encapsulation layers, and / or (multiple) shields can be coupled to the substrates and / or formed on the substrates.

[0061] Various configurations and arrangements of devices including multi-directional antennas have been described, and the sequence for manufacturing devices including multi-directional antennas will be further described below.

[0062] Exemplary sequence for manufacturing a device including substrates with multi-directional antennas and flexible connections

[0063] Figure 16 (including Figures 16A to 16F ) illustrates an exemplary sequence for providing or manufacturing a device including a number of substrates with multi-directional antennas. In some embodiments, Figures 16A to 16F the sequence of Figure 2device 200 or any device described in the present disclosure (e.g., 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500).

[0064] It should be noted that Figures 16A to 16F sequences may combine one or more stages to simplify and / or clarify the sequence for providing or manufacturing a device. In some embodiments, the order of the processes may be changed or modified. In some embodiments, one or more processes may be replaced or substituted without departing from the spirit of the present disclosure.

[0065] As Figure 16A shown, Stage 1 illustrates the state after the carrier 1600 is provided. Carrier 1600. The carrier 1600 may include a tape, a wafer, and / or a substrate.

[0066] Stage 2 illustrates the state after a plurality of dielectric layers 1610 and a plurality of interconnects 1612 (e.g., traces, pads, vias) are formed on the carrier 1600. A deposition process may be used to form the dielectric layers 1610. Forming the plurality of interconnects 1612 may include forming a seed layer, performing a lithography process, an electroplating process, a stripping process, and / or an etching process. In some embodiments, the deposition, lithography process, electroplating process, stripping process, and / or etching process may be performed iteratively.

[0067] Stage 3 illustrates the state after the dielectric layer 1620 is formed on the dielectric layers 1610 and the plurality of interconnects 1612. A deposition process may be used to form the dielectric layer 1620.

[0068] Stage 4 illustrates the state after the cavity 1621 is formed in the dielectric layer 1620. An etching process may be used to form the cavity.

[0069] As Figure 16B shown, Stage 5 illustrates the state after the plurality of interconnects 1622 are formed on the cavity 1621 and the dielectric layer 1620. The plurality of interconnects 1622 may include traces, pads, and / or vias. Forming the plurality of interconnects 1622 may include forming a seed layer, performing a lithography process, an electroplating process, a stripping process, and / or an etching process.

[0070] Stage 6 illustrates the state after the dielectric layer 1630 and the plurality of interconnects 1632 are formed on the dielectric layer 1620 and the plurality of interconnects 1622. A deposition process may be used to form the dielectric layer 1630. Forming the plurality of interconnects 1632 may include forming a seed layer, performing a lithography process, an electroplating process, a stripping process, and / or an etching process.

[0071] Stage 7 illustrates the state after forming dielectric layer 1640 over dielectric layer 1630. A deposition process can be used to form dielectric layer 1640.

[0072] As Figure 16C shown, stage 8 illustrates the state after forming a plurality of interconnects 1642 over dielectric layer 1640. Forming the plurality of interconnects 1642 can include forming cavities in dielectric layer 1640. Forming the plurality of interconnects 1642 can include forming a seed layer, performing a lithography process, an electroplating process, a lift-off process, and / or an etching process. Note that some of the interconnects from the plurality of interconnects 1642, 1632, and / or 1622 can be used to form antennas (e.g., 350a, 450a) of the substrate.

[0073] Stage 9 illustrates the state after forming dielectric layer 1650 over dielectric layer 1640 and / or the plurality of interconnects 1642. A deposition process can be used to form dielectric layer 1650.

[0074] Stage 10 illustrates the state after decoupling carrier 1600 from substrate 1670. Substrate 1670 can include dielectric layers (e.g., 1610, 1620, 1630, 1640, 1650) and a plurality of interconnects (e.g., 1612, 1622, 1632, 1642). Examples of processes for fabricating substrate 1670 include semi-additive process (SAP) and modified semi-additive process (mSAP). However, different embodiments can fabricate substrate 1670 differently.

[0075] As Figure 16D shown, stage 11 illustrates the state after a sawing process is used to remove a portion of substrate 1670. An etching process, a mechanical process, and / or a laser process can be used to remove a portion of substrate 1670. The removed portion of substrate 1670 can include one or more dielectric layers. The sawing process can leave a portion of substrate 1670 that exposes and / or defines flexible connection 206. Flexible connection 206 can include at least one dielectric layer 260 and at least one interconnect 262. The at least one dielectric layer 260 can be formed from at least one of the dielectric layers (e.g., 1610, 1620, 1630, 1640, 1650). The at least one interconnect 262 can be formed from at least one of the interconnects (e.g., 1612, 1622, 1632, 1642). The sawing process can also define two substrates (e.g., substrate 220, substrate 240) that can be coupled together by flexible connection 206.

[0076] Stage 12 illustrates the state after the components are coupled to the substrate 1670. Specifically, integrated devices (such as 222, 224, 242) and passive devices (such as 226, 228, 246) are coupled to the first surface of the substrate 1670. In some embodiments, pick and place operations can be used to couple the integrated devices and / or passive devices. The integrated devices and / or passive devices can be coupled to the substrates 220 and 240 through solder interconnects.

[0077] As Figure 16E shown, stage 13 illustrates the state after the encapsulation layers 210 and 270 are formed over the integrated devices and passive devices. In some embodiments, one encapsulation layer or separate encapsulation layers can be formed over the integrated devices and / or passive devices. The encapsulation layers 210 and 270 can be disposed over the substrates 220 and 240 by using a transfer molding process, a sheet molding process, or a liquid molding process. In some embodiments, the encapsulation layers 210 and 270 can be considered part of the same encapsulation layer.

[0078] Stage 14 illustrates the state after the shields 230 and 250 are formed. The shield 230 is formed over the encapsulation layer 210 coupled to the substrate 220. The shield 250 is formed over the encapsulation layer 270 coupled to the substrate 240. A sputtering process can be used to form the shield 230 and / or the shield 250. The shield 230 can be formed on and located over the outer surface of the encapsulation layer 210 and / or the surface (such as a side surface) of the substrate 220. The shield 250 can be formed on and located over the outer surface of the encapsulation layer 270 and / or the surface (such as a side surface) of the substrate 240. In some embodiments, a protective material can be disposed or formed over the flexible connection 206.

[0079] As Figure 16F shown, stage 15 illustrates the state after the flexible connection 206 is bent such that the substrate 220 is aligned in such a way that the antenna direction of the substrate 220 and the (multiple) antennas in the substrate 220 face a first direction (such as a first antenna direction), and the substrate 240 is aligned in such a way that the antenna direction of the substrate 240 and the (multiple) antennas in the substrate 240 face a second direction different from the first direction (such as a second antenna direction). Note that the flexible connection 206 can be flexible or bent in any number of ways and at any number of angles. Note that stages 13, 14, and / or 15 can illustrate that the device 200 includes the packages 202, 204, and the flexible connection 206.

[0080] Exemplary flowchart of a device including a substrate with a multi-directional antenna and a flexible connection

[0081] In some embodiments, manufacturing a device including a plurality of substrates having multi-directional antennas includes a number of processes. Figure 17 FIG. illustrates an exemplary flowchart of method 1700 for providing or manufacturing a device including a plurality of substrates having multi-directional antennas. In some embodiments, Figure 17 method 1700 can be used to provide or manufacture the Figure 2 device 200 described in the present disclosure. However, method 1700 can be used to provide or manufacture any device described in the present disclosure (e.g., 300, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500).

[0082] It should be noted that, for the purpose of simplifying and / or clarifying the method for providing or manufacturing a device including a plurality of substrates having multi-directional antennas, Figure 17 the sequence may combine one or more processes. In some embodiments, the order of the processes can be changed or modified.

[0083] The method forms (at 1705) a substrate (e.g., 1670) including at least one dielectric layer (e.g., 221) and interconnects (e.g., 223). Some interconnects can form one or more antennas in the substrate. The manufacturing of the substrate can include a lamination process and an electroplating process. Examples of processes for manufacturing the substrate include semi-additive process (SAP) and modified semi-additive process (mSAP). However, different embodiments may manufacture the substrate in different ways. Figures 16A to 16C Stages 1 to 10 of FIG. illustrate an example of manufacturing a substrate that can include an antenna (e.g., an embedded antenna).

[0084] The method removes (at 1710) a portion of the substrate (e.g., 1670) to expose and / or define a flexible connection 206 between a first substrate (e.g., 220) and a second substrate (e.g., 240). An etching process, a mechanical process, and / or a laser process can be used to remove the portion of the substrate 1670. The removed portion of the substrate includes at least one dielectric layer. In some embodiments, at least one metal layer (e.g., an interconnect) can be removed. Figure 16D Stage 11 of FIG. illustrates an example of the portion of the substrate that has been removed to form the flexible connection 206.

[0085] The method couples (at 1715) the integrated device(s) (e.g., 222, 224, 242) and / or the passive device(s) (e.g., 226, 228, 246) to a first surface of at least one substrate (e.g., 220, 240). Solder interconnects can be used to couple the integrated device(s) and / or the passive device(s) to the substrate. A reflow process can be used to couple the integrated device and the passive device to the substrate. Figure 16DStage 12 illustrates an example of (a plurality of) integrated devices and / or (a plurality of) passive devices coupled to at least one substrate.

[0086] The method encapsulates (in 1720) (a plurality of) integrated devices and (a plurality of) passive devices using at least one encapsulation layer (such as 210, 270). For example, encapsulation layer 210 may be provided such that encapsulation layer 210 encapsulates integrated devices and / or passive devices located on the substrate. Different embodiments may provide encapsulation layer 210 on the substrate using various processes. For example, encapsulation layer 210 may be disposed on the substrate using a transfer molding process, a sheet molding process, or a liquid molding process. Figure 16E Stage 13 illustrates an example of at least one encapsulation layer formed on at least one substrate.

[0087] The method forms (in 1725) shields (such as 230, 250) on top of the encapsulation layer (such as 210, 270) and on the sides of substrates 220 and 240. Shield 212 may include one or more metal layers (such as (a plurality of) patterned metal layers). Shield 212 may be configured to operate as an electromagnetic interference (EMI) shield. Electroplating processes, chemical vapor deposition (CVD) processes, physical vapor deposition (PVD) processes, sputtering processes, and / or spraying may be used to form the shield. Figure 16E Stage 14 illustrates an example of a shield formed on top of the encapsulation layer and / or the substrate.

[0088] The method bends (in 1730) a flexible connection (such as 206) to position substrate 240 relative to substrate 220 such that substrate 220 faces a first antenna direction and substrate 240 faces a second antenna direction different from the first antenna direction. Figure 16F Stage 15 illustrates an example of bending a flexible connection that couples two substrates. In some embodiments, the method may provide a protective material around flexible connection 206.

[0089] Exemplary electronic devices

[0090] Figure 18 Illustrates various electronic devices that may be integrated with any one of the above devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package-on-package (PoP), system-in-package (SiP), or system-on-chip (SoC). For example, a mobile phone device 1802, a laptop computer device 1804, a fixed location terminal device 1806, a wearable device 1808, or an automobile 1810 may include device 1800 described herein. For example, device 1800 may be any device and / or integrated circuit (IC) package described herein.Figure 18 The illustrated devices 1802, 1804, 1806, and 1808, as well as vehicle 1810, are merely exemplary. Other electronic devices may also be characterized as device 1800, including but not limited to a set of devices (e.g., electronic devices) including mobile devices, handheld personal communication system (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS)-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed-location data units such as meter reading devices, communication devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions or any combination thereof.

[0091] Figures 2 to 15 One or more of the illustrated components, processes, features, and / or functions of 16A to 16F and / or 17 to 18 may be rearranged and / or combined into a single component, process, feature, or function, or implemented in several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that Figures 2 to 15 16A to 16F and / or 17 to 18 and their corresponding descriptions in the present disclosure are not limited to dies and / or ICs. In some embodiments, Figures 2 to 15 16A to 16F and / or 17 to 18 and their corresponding descriptions may be used to fabricate, create, provide, and / or produce devices and / or integrated devices. In some embodiments, a device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat sink device, and / or an interposer.

[0092] Note that the drawings in the present disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some instances, the drawings may not be drawn to scale. In some instances, not all components and / or parts may be shown for clarity. In some instances, the positions, locations, sizes, and / or shapes of the various parts and / or components in the drawings may be exemplary. In some embodiments, the various components and / or parts in the drawings may be optional.

[0093] The term "exemplary" is used herein to mean "serving as an example, instance, or illustration". Any embodiment or aspect described herein as "exemplary" is not necessarily to be construed as more preferred or advantageous than other aspects of the disclosure. Similarly, the term "aspects" does not require that all aspects of the disclosure include the discussed feature, advantage, or mode of operation. The term "coupled" is used herein to refer to a direct or indirect coupling between two objects. For example, if object A physically contacts object B, and object B contacts object C, then objects A and C can still be considered to be coupled to each other—even if they do not physically contact each other directly. The term "electrically coupled" can mean that two objects are directly or indirectly coupled together such that an electric current (e.g., a signal, power supply, ground) can propagate between the two objects. The two objects that are electrically coupled may or may not have an electric current propagating between them. The use of the terms "first", "second", "third", and "fourth" (and / or anything higher than fourth) is arbitrary. Any component described can be the first, second, third, or fourth. For example, a component referred to as the second component can be the first component, the second component, the third component, or the fourth component. The term "enclose" means that an object can partially enclose or fully enclose another object. It is also noted that the term "above" as used herein in the context of one component being above another component can be used to mean that the component is on top of and / or within another component (e.g., on the surface of the component or embedded within the component). Thus, for example, a first component above a second component can mean (1) the first component is above the second component but does not directly contact the second component, (2) the first component is on the second component (e.g., on its surface), and / or (3) the first component is within (e.g., embedded within) the second component. The term "about 'value X'" or "about value X" as used in the present disclosure means within 10% of 'value X'. For example, a value of about 1 or approximately 1 will mean a value within the range of 0.9 to 1.1.

[0094] In some embodiments, an interconnect is an element or component of a device or package that allows or facilitates an electrical connection between two points, elements, and / or components. In some embodiments, an interconnect can include traces, vias, pads, pillars, redistribution metal layers, and / or under-bump metallization (UBM) layers. In some embodiments, an interconnect is a conductive material that can be configured to provide a circuit path for a signal (e.g., a data signal), ground, or power supply. An interconnect can be part of a circuit. An interconnect can include more than one element or component. An interconnect can be defined by one or more interconnects. Different embodiments can use different processes and / or sequences to form an interconnect. In some embodiments, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spraying, and / or an electroplating process can be used to form an interconnect.

[0095] Moreover, it should be noted that the various disclosures contained herein may be described as processes, which are depicted as flowcharts, operational diagrams, structural diagrams, or block diagrams. Although a flowchart may describe operations as a sequential process, many operations may be performed in parallel or concurrently. Additionally, the order of operations may be rearranged. A process terminates when its operations are completed.

[0096] Without departing from the present disclosure, the various features of the present disclosure described herein may be implemented in different systems. It should be noted that the foregoing aspects of the present disclosure are merely examples and should not be construed as limiting the present disclosure. The description of the various aspects of the present disclosure is intended to be illustrative and not to limit the scope of the claims. Accordingly, the teachings can be readily applied to other types of devices, and many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

1. A device, comprising: A first substrate, including a first antenna; An integrated device, coupled to the first substrate; An encapsulation layer, located above the first substrate and the integrated device, wherein the encapsulation layer encapsulates the integrated device; A second substrate, including a second antenna; A flexible connection, coupled to the first substrate and the second substrate; And A shield, coupled to (i) a surface of the encapsulation layer and (ii) side surfaces of the first substrate above and below where the flexible connection is embedded in the first substrate.

2. The device according to claim 1, wherein the flexible connection is configured to be bendable 180 degrees.

3. The device according to claim 1, Wherein the shield is configured as an electromagnetic interference (EMI) shield.

4. The device according to claim 1, wherein the flexible connection includes: At least one dielectric layer; At least one interconnect; A protective material, covering the flexible connection.

5. The device according to claim 4, wherein the at least one dielectric layer and the at least one interconnect of the flexible connection extend into the first substrate and the second substrate.

6. The device according to claim 1, Wherein the first antenna is embedded in the first substrate, Wherein the first substrate is configured to face the direction of the first antenna, Wherein the second antenna is embedded in the second substrate, and Wherein the second substrate is configured to face the direction of the second antenna.

7. The device according to claim 1, wherein the first substrate and the integrated device form a first package for the device.

8. The device according to claim 7, wherein the first package includes an antenna in package (AiP).

9. The device according to claim 1, further comprising: A second integrated device, coupled to the second substrate; A second encapsulation layer, located above the second substrate and the second integrated device, wherein the second encapsulation layer encapsulates the second integrated device; A second shield, coupled to (i) a surface of the second encapsulation layer and (ii) side surfaces of the second substrate.

10. The device according to claim 1, wherein the device is incorporated into a specific device selected from the group consisting of: an audio - video player, a navigation device, a communication device, and a device in a motor vehicle.

11. An apparatus, comprising: A first substrate, including a first antenna; An integrated device, coupled to the first substrate; A component for encapsulation, located above the first substrate and the integrated device, wherein the component for encapsulation encapsulates the integrated device; A second substrate, including a second antenna; A component for flexible connection, coupled to the first substrate and the second substrate, wherein the component for flexible connection is embedded in the first substrate and the second substrate; And A component for shielding, which is coupled to (i) the surface of the component for encapsulation and (ii) the side surfaces of the first substrate above and below the location where the component for flexible connection is embedded in the first substrate, wherein the component for shielding is configured as a component for electromagnetic interference (EMI) shielding.

12. The apparatus according to claim 11, wherein the component for flexible connection is configured to be bendable by 180 degrees.

13. The apparatus according to claim 11, wherein the component for flexible connection comprises: At least one dielectric layer; At least one interconnect; A protective material covering the component for flexible connection.

14. The apparatus according to claim 13, wherein the at least one dielectric layer and the at least one interconnect of the component for flexible connection extend into the first substrate and the second substrate.

15. The apparatus according to claim 11, wherein the first antenna is embedded in the first substrate, wherein the first substrate is configured to face the direction of the first antenna, wherein the second antenna is embedded in the second substrate, and wherein the second substrate is configured to face the direction of the second antenna.

16. The apparatus according to claim 11, wherein the first substrate and the integrated device form a first package for the apparatus.

17. The apparatus according to claim 16, wherein the first package comprises an antenna in package (AiP).

18. The apparatus according to claim 11, further comprising: A second integrated device, which is coupled to the second substrate; and A component for second encapsulation, which is located above the second substrate and the second integrated device.

19. The apparatus according to claim 11, wherein the apparatus is incorporated into a device selected from the group consisting of: an audio-video player, a navigation device, a communication device, and a device in a motor vehicle.

20. A method for manufacturing a device, comprising: Providing a substrate including a first antenna and a second antenna; Removing portions of the substrate to define (i) a first substrate including the first antenna, (ii) a second substrate including the second antenna, and (iii) a flexible connection embedded in and coupled to the first substrate and the second substrate; Coupling an integrated device to the first substrate; Forming an encapsulation layer over the first substrate and the integrated device; and Forming a shielding member, which is coupled to (i) the surface of the encapsulation layer and (ii) the side surfaces of the first substrate above and below the location where the flexible connection is embedded in the first substrate.

21. The method according to claim 20, wherein the shielding member comprises an electromagnetic interference (EMI) shielding member.

22. The method according to claim 20, wherein the first antenna is embedded in the first substrate, wherein the first substrate faces the direction of the first antenna, wherein the second antenna is embedded in the second substrate, and wherein the second substrate faces the direction of the second antenna.

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