A method and apparatus for continuous laser micro-perforation

Abstract

The present application belongs to the technical field of laser drilling, and relates to a continuous laser micro-hole drilling method and device. The continuous laser micro-hole drilling method comprises the following steps: obtaining a drilling type and multi-layer drilling parameters of a workpiece to be processed; and boosting a trigger end of a laser from a low level to a high level according to the multi-layer drilling parameters, so as to control the laser to continuously emit laser to each layer of the workpiece to be processed through a galvanometer scanning system, and complete micro-hole processing according to the drilling type and corresponding drilling parameters. The continuous laser micro-hole drilling device and method boost the trigger end of the laser from the low level to the high level, so as to control the laser to continuously emit laser to each layer of the workpiece to be processed, omit the scanning step of the scanning galvanometer between layers, shorten the drilling time, avoid the influence of poor scanning galvanometer repeatability on the processed micro-hole, and improve the quality of the processed hole.

Description

Technical Field

[0001] This invention relates to the field of laser drilling technology, and in particular to a method and apparatus for continuous laser micro-hole drilling. Background Technology

[0002] With the continuous progress and development of human society, and the increasing maturity and popularization of 5G communication technology, people's demand for information access has become increasingly diverse and incremental. Consequently, electronic devices centered around communication equipment will inevitably develop rapidly towards miniaturization, lightweighting, high speed, and multi-functionality. At the same time, the electronic components within these devices are required to be more highly integrated and faster. Therefore, PCBs carrying semiconductor devices must also become more finely detailed, multi-layered, and high-density.

[0003] Conventional mechanical drilling is limited by its efficiency (typically, PCB designs require tens of thousands to hundreds of thousands of micro-blind vias or micro-through vias per sheet) and the quality of the holes produced. Furthermore, during mechanical drilling, when the drill bit diameter is 0.2mm or less, problems such as tool breakage are prone to occur. Therefore, mechanical drilling is clearly unsuitable for processing such high-density micro-blind vias and micro-through vias on PCBs, leading to the development of laser drilling technology.

[0004] When laser drilling is used to process micro-blind holes and micro-through holes, common laser drilling equipment typically employs a "window-opening then hole-scanning" approach. This means that a first layer of parameters is used to create a circular opening in the copper surface of the material to be processed, followed by a second layer of parameters for deeper drilling. In contrast, scanning galvanometers, when processing the surface layer, use a spiral, double spiral, or circular scanning method to drill the first layer of holes, and then use a second layer of parameters to drill a second layer of holes within the area of ​​the first layer. This method requires the scanning galvanometer to travel a longer path when drilling a single hole, resulting in a longer drilling time. In addition, in existing laser drilling devices, the scanning galvanometer needs to swing along a path during the process of opening a circular opening on the copper surface using the previous layer of parameters. After completing the first layer of drilling, the scanning galvanometer jumps to the next layer of parameters to perform the second layer of drilling. However, there is a problem with the repeatability accuracy of the scanning galvanometer's movement between processing the previous layer of drilling and the next layer of drilling. If the repeatability accuracy of the scanning galvanometer is poor, then the position of the holes processed in the two layers will be deviated when processing one layer of parameters and another layer of parameters, which will seriously affect the quality of the processed holes. Summary of the Invention

[0005] The purpose of this invention is to solve the technical problems of long drilling time and difficulty in guaranteeing the quality of the drilled holes produced by existing laser drilling devices.

[0006] To address the aforementioned technical problems, embodiments of the present invention provide a continuous laser micro-hole drilling method, employing the following technical solution:

[0007] The continuous laser micro-hole drilling method includes the following steps:

[0008] Obtain the drilling type and multi-layer drilling parameters of the workpiece to be processed;

[0009] According to the multi-layer drilling parameters, the trigger terminal of the laser is boosted from low level to high level to control the laser to continuously emit laser light to each layer of the workpiece through the galvanometer scanning system, and complete the micro-hole processing according to the drilling type and corresponding drilling parameters.

[0010] Furthermore, the drilling parameters include laser power and light emission time; the step of completing micro-hole processing according to the drilling type and corresponding drilling parameters includes:

[0011] When the drilling type is a blind hole, the motion execution system controls the worktable to move so that the laser emitted by the galvanometer scanning system can be focused onto the workpiece to be processed on the worktable.

[0012] The system receives the processing file, determines the drilling position of the workpiece to be processed based on the processing file, and controls the laser to emit a laser with a first laser power and a first emission time to the first layer of the drilling position of the workpiece to be processed through the galvanometer scanning system, based on the first layer drilling parameters in the multi-layer drilling parameters.

[0013] Based on the drilling parameters of the second layer in the multi-layer drilling parameters, the laser is controlled to emit a laser with a second laser power and a second emission time to the second layer of the workpiece to be drilled through the galvanometer scanning system, wherein the first laser power is greater than the second laser power and the first emission time is less than the second emission time.

[0014] Furthermore, the step of completing the micro-hole processing according to the drilling type and corresponding drilling parameters includes:

[0015] When the drilling type is a through hole, the motion execution system controls the worktable to move so that the laser emitted by the galvanometer scanning system can be focused onto the front of the workpiece to be processed on the worktable.

[0016] The system receives the processing file, determines the drilling position of the workpiece to be processed based on the processing file, and controls the laser to emit the corresponding drilling parameters of each layer to the drilling position on the front side of the workpiece to be processed through the galvanometer scanning system, so as to complete the drilling of micro-holes on the front side of the workpiece.

[0017] The workpiece to be processed is flipped so that the laser emitted by the galvanometer scanning system can be focused onto the reverse side of the workpiece on the worktable;

[0018] The machining file is horizontally mirrored. Based on the horizontally mirrored machining file, the drilling positions on the reverse side of the workpiece are determined. According to the multi-layer drilling parameters, the laser is controlled to emit the corresponding drilling parameters of each layer to the drilling positions on the reverse side of the workpiece through the galvanometer scanning system, so as to complete the through hole machining of the workpiece.

[0019] Furthermore, the step of receiving the processing document and determining the drilling position of the workpiece to be processed based on the processing document includes:

[0020] Receive processing files and convert their format.

[0021] When the processing file contains target positioning holes, mark the target positioning holes in the processed file after file conversion;

[0022] The machining file after conversion is analyzed to determine the drilling position of the workpiece and the deflection path of the galvanometer.

[0023] Furthermore, the multi-layer drilling parameters are a set of drilling parameters for each layer of the workpiece to be processed, and the steps of obtaining the drilling type and multi-layer drilling parameters of the workpiece to be processed include:

[0024] A mapping table is pre-entered for the attributes of various workpieces and the drilling parameters of each layer of the workpieces under different drilling types. The attributes include thickness and material.

[0025] The thickness and material of each layer of the workpiece to be processed are obtained, and the drilling parameters of each layer of the workpiece to be processed are obtained through a pre-stored mapping table. The drilling parameters include laser power and light emission time.

[0026] After the steps of obtaining the drilling type and multi-layer drilling parameters of the workpiece to be processed, the method further includes:

[0027] The thickness of the workpiece to be processed on the worktable is detected by an automatic thickness measurement system. The confocal focal length of the laser is adjusted according to the thickness of the workpiece and the multi-layer drilling parameters. The galvanometer in the CCD camera and galvanometer scanning system is calibrated.

[0028] Furthermore, the step of boosting the trigger terminal of the laser from a low level to a high level according to the multi-layer drilling parameters to control the laser to continuously emit continuous laser light to each layer of the workpiece through the galvanometer scanning system includes:

[0029] According to the multi-layer drilling parameters, the laser is controlled to emit a Gaussian beam into the galvanometer scanning system. The Gaussian beam is shaped into a flat-top beam by the beam shaper in the galvanometer scanning system.

[0030] After being shaped, the flat-top beam is split into a first optical path and a second optical path by the beam splitter in the galvanometer scanning system. The first optical path and the second optical path emit lasers with corresponding drilling parameters for each layer to the drilling position of the workpiece to be processed, so as to perform biaxial drilling on the workpiece to be processed.

[0031] Furthermore, the light source emitted by the laser is an infrared laser, and the wavelength of the infrared laser is 1030nm or 1064nm.

[0032] To address the aforementioned technical problems, embodiments of the present invention provide a continuous laser micro-hole drilling device, which includes: a control system, a laser, and a galvanometer scanning system;

[0033] The laser is used to emit laser light;

[0034] The galvanometer scanning system is used to focus the laser emitted by the laser onto the workpiece to be processed;

[0035] The control system is used to acquire the drilling type and multi-layer drilling parameters of the workpiece to be processed, and according to the multi-layer drilling parameters, to boost the trigger terminal of the laser from a low level to a high level, so as to control the laser to continuously emit continuous laser light to each layer of the workpiece to be processed through the galvanometer scanning system, and complete the micro-hole processing according to the drilling type and corresponding drilling parameters.

[0036] Furthermore, the galvanometer scanning system includes a beam shaper disposed in the output optical path of the laser, which is used to shape the Gaussian beam emitted by the laser into a flat-top beam.

[0037] Furthermore, the galvanometer scanning system includes a beam splitter, which is disposed in the output optical path of the laser. The beam splitter is used to divide the output optical path of the laser into a first optical path and a second optical path. The galvanometer scanning system performs laser drilling on the workpiece to be processed through the first optical path and the second optical path respectively.

[0038] Compared with the prior art, the continuous laser micro-hole drilling device and method provided in the embodiments of the present invention have the following advantages:

[0039] This continuous laser micro-hole drilling method raises the trigger voltage of the laser from low to high level to control the laser to emit continuous laser light to each layer of the workpiece. After drilling micro-holes in the previous layer of the workpiece, the laser can continue to emit light to drill micro-holes in the next layer to complete the micro-hole processing. This eliminates the scanning step of the scanning galvanometer between layers, realizes continuous laser emission for micro-hole drilling, greatly shortens the drilling time, avoids the impact of poor repeatability of the scanning galvanometer on the processed micro-holes, and improves the quality of the processed holes.

[0040] This continuous laser micro-drilling device includes a control system, a laser, and a galvanometer scanning system. The control system continuously emits laser light onto each layer of the workpiece according to multi-layer drilling parameters. After drilling a micro-hole in one layer of the workpiece, the device continues to emit light to drill the next layer. The laser continues to emit light until the drilling process according to the multi-layer drilling parameters is completed. This continuous laser micro-drilling device eliminates the oscillation of the scanning galvanometer when drilling a single hole, saving the time spent by the scanning galvanometer traveling the path during drilling, thus improving processing efficiency. It also avoids the impact of the scanning galvanometer's repeatability accuracy on the drilling quality. Attached Figure Description

[0041] To more clearly illustrate the solutions in this invention, a brief introduction to the accompanying drawings used in the description of the embodiments will be provided below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort. Wherein:

[0042] Figure 1 This is a flowchart of the steps of a continuous laser micro-hole drilling method in one embodiment of the present invention;

[0043] Figure 2 When the drilling type is blind hole, Figure 1 Flowchart of step S200;

[0044] Figure 3 When the drill type is through hole, Figure 1 Flowchart of step S200;

[0045] Figure 4 This is a schematic diagram of the internal structure of a continuous laser micro-hole drilling device in one embodiment of the present invention;

[0046] Figure 5 yes Figure 4 A magnified view of a section at point A in the middle;

[0047] Figure 6 yes Figure 4 A schematic diagram of the external structure of a continuous laser drilling device;

[0048] Figure 7 yes Figure 4 Schematic diagram of the optical path design of the scanning galvanometer system in a continuous laser drilling device;

[0049] Figure 8 This is a schematic diagram of a blind hole formed on a workpiece using a continuous laser micro-hole drilling method in one embodiment;

[0050] Figure 9This is a schematic diagram of a through hole formed on a workpiece using a continuous laser micro-hole drilling method in one embodiment;

[0051] Figure 10 This is an image of an example of a blind hole formed on a workpiece using existing drilling methods;

[0052] Figure 11 This is an image of an example of a blind hole formed on a workpiece using a continuous laser micro-hole drilling method in one embodiment.

[0053] The labels in the attached diagram are as follows:

[0054] 110. Laser; 200. Galvanometer scanning system; 201. First lens group; 202. Second lens group; 203. Third lens group; 204. Left first reflecting mirror; 205. Left second reflecting mirror; 206. Left fourth lens group; 207. Left shutter; 208. Left third reflecting mirror; 209. Left fourth reflecting mirror; 210. Fifth reflecting mirror; 211. Left galvanometer; 212. Right first reflecting mirror; 213. Right fourth lens group; 214. Right shutter; 215. Right second reflecting mirror; 216. Right third reflecting mirror; 217. Right fourth reflecting mirror; 218. Right galvanometer;

[0055] 300. Motion positioning system; 400. Workbench; 500. Vision positioning system; 600. Power monitoring system; 700. Automatic thickness measurement system; 800. Automatic loading and unloading system; 900. Dust extraction and adsorption system. Detailed Implementation

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. For example, terms such as “length,” “width,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate orientations or positions based on the orientations or positions shown in the accompanying drawings and are for ease of description only, and should not be construed as limiting the technical solution.

[0057] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion; the terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects, rather than to describe a particular order.

[0058] In the description and claims of this invention and the foregoing drawings, when an element is referred to as "fixed to," "mounted to," "disposed on," or "connected to" another element, it can be located directly or indirectly on that other element. For example, when an element is referred to as "connected to" another element, it can be directly or indirectly connected to that other element.

[0059] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0060] It should be noted that the continuous laser micro-hole drilling device and the continuous laser micro-hole drilling method use lasers to perform high-density drilling on printed circuit boards (PCBs), and are suitable for processing holes with small diameters (such as 20μm-180μm).

[0061] This invention provides a continuous laser micro-hole drilling method, such as... Figures 1 to 3 As shown, the continuous laser micro-hole drilling method of the present invention includes the following steps:

[0062] Step S100: Obtain the drilling type and multi-layer drilling parameters of the workpiece to be processed.

[0063] Step S200: According to the multi-layer drilling parameters, the trigger terminal of the laser is boosted from low level to high level to control the laser to continuously emit laser light to each layer of the workpiece through the galvanometer scanning system, and the micro-hole processing is completed according to the drilling type and corresponding drilling parameters.

[0064] Compared to existing technologies, this continuous laser micro-hole drilling method has at least the following advantages: This method controls the laser to continuously emit laser light according to multi-layer drilling parameters. After drilling a micro-hole in the previous layer of the workpiece, the laser continues to emit light to drill a micro-hole in the next layer. The continuous light emission between the previous and next layer drilling parameters avoids the jump delay between layer parameters of the scanning galvanometer at a micro-hole location. In this method, the laser does not need a scanning galvanometer to perform windowing in conjunction with other scanning processes when drilling the first layer of holes; instead, it directly uses a multi-layer continuous drilling method to process the micro-holes. This saves the time spent by the scanning galvanometer in scanning and windowing the first layer of the workpiece, achieving continuous laser light emission for micro-hole drilling, greatly shortening the drilling time, and avoiding the impact of galvanometer repeatability accuracy on drilling quality, thus ensuring the quality of the processed holes.

[0065] The drilling parameters include laser power and light emission time; the drilling type of the workpiece to be processed includes blind holes and through holes. Depending on the drilling type of the workpiece, step S200 can employ different processing methods.

[0066] In one embodiment, such as Figure 2 As shown, when the drilling type is a blind hole, step S200 specifically includes:

[0067] Step S210: Control the motion execution system to move the worktable so that the laser emitted by the galvanometer scanning system can be focused onto the workpiece to be processed on the worktable.

[0068] Step S220: Receive the processing file, determine the drilling position of the workpiece to be processed according to the processing file, and control the laser to emit a laser with a first laser power and a first emission time to the first layer of the drilling position of the workpiece to be processed through the galvanometer scanning system according to the first layer drilling parameters in the multi-layer drilling parameters.

[0069] Step S230: According to the drilling parameters of the second layer in the multi-layer drilling parameters, control the laser to emit a laser with a second laser power and a second emission time to the second layer of the workpiece to be drilled through the galvanometer scanning system, wherein the first laser power is greater than the second laser power and the first emission time is less than the second emission time.

[0070] Among them, when the drilling type of the workpiece to be processed is a blind hole (blind hole such as...) Figure 8 As shown, the laser performs continuous multi-layer laser drilling on only one side of the workpiece.

[0071] Currently, the workpieces to be processed are generally composed of two copper layers with a composite material layer sandwiched in between, that is, the workpiece to be processed consists of three layers: the first and third layers are copper layers, and the second layer is a composite material layer.

[0072] Since the absorption rate of laser light varies among different layers of the workpiece, better drilling results can be achieved by setting the laser power of the emitted laser separately, and the preset drilling depth can be achieved by setting the laser emission time.

[0073] In this embodiment, when the drilling type of the workpiece to be processed is a blind hole, the first laser power is greater than the second laser power, and the first light-emitting time is less than the second light-emitting time. This is because the second composite material layer (glass fiber and resin) is more sensitive to infrared lasers compared to the first and third copper layers. Therefore, a high-power laser is needed to break the copper on the surface of the first layer, and then a laser with a lower power than the drilling parameters of the first layer is used to clean the second composite material layer. Furthermore, because the laser beam changes from Gaussian to flat-top beam after passing through the beam shaper, the beam energy becomes more uniform. A low-power laser with a uniform beam spot causes less damage to the underlying copper (damage within 2μm), and may even not damage the underlying layer at all. Therefore, the second light-emitting time can be set to a long laser irradiation time to completely clean the glass fiber and resin at the micro-hole location. When processing blind holes, compared with blind holes formed by existing micro-hole drilling methods (such as...),... Figure 10 Compared to the previous embodiment, this embodiment uses drilling parameters where the first laser power is greater than the second laser power and the first light emission time is less than the second light emission time to perform laser processing, resulting in a smaller bottom angle α of the blind hole (e.g., as shown). Figure 8 and Figure 11 As shown, the quality of the drilling is further improved, which is beneficial to the subsequent electroplating process, and there is no need to worry about the base copper being damaged.

[0074] In this embodiment, when the drilling type of the workpiece to be processed is a blind hole, for a workpiece with a plate thickness of 200μm, a surface copper thickness of 1.5μm, and a composite material layer thickness of 30μm, the first laser power can be set to 15W-100W, the second laser power can be set to 5W-75W, the first light emission time can be set to 30μs-160μs, and the second light emission time can be set to 50μs-200μs. This allows the ratio of the upper and lower diameters of the processed blind hole to be between 75% and 80%.

[0075] In one embodiment, such as Figure 3 As shown, when the drilling type is a through hole, step S200 specifically includes:

[0076] Step S210: Control the motion execution system to move the worktable so that the laser emitted by the galvanometer scanning system can be focused onto the front of the workpiece to be processed on the worktable.

[0077] Step S220: Receive the processing file, determine the drilling position of the workpiece to be processed according to the processing file, and control the laser to emit the corresponding drilling parameters of each layer to the drilling position on the front side of the workpiece to be processed through the galvanometer scanning system according to the multi-layer drilling parameters, so as to complete the drilling of micro-holes on the front side of the workpiece to be processed.

[0078] Step S230: Flip the workpiece to be processed so that the laser emitted by the galvanometer scanning system can be focused onto the reverse side of the workpiece on the worktable.

[0079] Step S240: The processing file is mirrored. The drilling position on the reverse side of the workpiece is determined according to the mirrored processing file. According to the multi-layer drilling parameters, the laser is controlled to emit the corresponding drilling parameters of each layer to the drilling position on the reverse side of the workpiece through the galvanometer scanning system to complete the through hole processing of the workpiece.

[0080] Understandably, when the drilling type of the workpiece to be processed is a through hole (such as a through hole), Figure 9 As shown, the laser performs continuous multi-layer laser drilling on the front and back sides of the workpiece. The drilling position on the back side of the workpiece is determined by the processing file after mirroring, so that the drilling position on the front side of the workpiece corresponds to the drilling position on the back side of the workpiece, thereby forming a through hole.

[0081] Specifically, when the drilling type of the workpiece to be processed is a through hole, assuming the height of the workpiece to be processed is h and the width is w, the coordinates of the hole to be drilled on the front side of the workpiece to be processed are determined as P(x0,y0) according to the processing file. After the processing file is horizontally mirrored, the coordinates of the hole to be drilled on the back side of the workpiece to be processed are determined as P(w-x0,y0) according to the horizontally mirrored processing file, so that the hole to be drilled on the front side of the workpiece to be processed corresponds to the hole to be drilled on the back side of the workpiece to be processed, so as to form a through hole through the workpiece to be processed.

[0082] After processing the machining file using a horizontal mirroring method, continuous multi-layer laser drilling is performed on the reverse side of the workpiece according to the multi-layer drilling parameters. In actual machining, when the copper layer thickness on the front and back of the workpiece is the same, the drilling parameters for both sides are the same, and the same set of multi-layer drilling parameters can be used when drilling on both sides. When the copper layer thickness on the front and back of the workpiece is different, different multi-layer drilling parameters can be used for drilling on the front and back sides.

[0083] By employing a continuous laser micro-hole drilling method, when drilling holes in the copper layer on the front side of the workpiece, it is not necessary to use a galvanometer to scan and open the first layer. That is, the diameter of the first hole drilled on the front side of the workpiece is equal to the size of the laser spot. Similarly, when drilling holes in the copper layer on the back side of the workpiece, scanning and opening are not required. The diameter of the first hole drilled on the back side of the workpiece is equal to the size of the laser spot. Combined with horizontal mirroring, the diameters at both ends of the through-hole are made equal, avoiding the problem of uneven electroplating flow rates and bubble formation caused by different diameters at both ends of the through-hole when the electroplating solution flows through the front and back sides of the workpiece. The continuous laser micro-hole drilling method provided by this invention can improve the quality of through-hole processing and also improve the quality of subsequent electroplating processes.

[0084] In this embodiment, the step S220 of receiving the processing file and determining the drilling position of the workpiece to be processed according to the processing file includes:

[0085] Step S221: Receive the processing file and convert the processing file to a different format.

[0086] Step S222: When the processing file has target positioning holes, mark the target positioning holes in the processing file after file conversion.

[0087] Step S223: Analyze the converted machining file to determine the drilling position of the workpiece and the deflection path of the galvanometer.

[0088] In step S221, the workpiece to be processed is converted into a format suitable for the system to read, thus ensuring the confidentiality of the processing file. Specifically, step S221 converts the original DXF format file into a Prg or Ex2 format document.

[0089] Specifically, in step S222, when converting the processing file to a new format, the target positioning hole and other processing holes in the workpiece to be processed can be identified. When the processing file contains a target positioning hole, the target positioning hole is distinguished from other processing holes, and the target positioning hole is used as the drilling position of the workpiece to be processed in the processing file, thereby determining the drilling position of the workpiece to be processed. At the same time, the deflection path of the galvanometer is determined according to each drilling position on the processing file, thereby optimizing the processing path and improving processing efficiency.

[0090] In this embodiment, the multi-layer drilling parameters are composed of the drilling parameters of each layer of the workpiece to be processed, and step S100 specifically includes:

[0091] Step S110: Pre-enter a mapping table of the attributes of various workpieces and the drilling parameters of each layer of the workpiece under different drilling types. The attributes include thickness and material.

[0092] Step S120: Obtain the thickness and material of each layer of the workpiece to be processed, and obtain the drilling parameters of each layer of the workpiece to be processed through a pre-stored mapping table. The drilling parameters include laser power and light emission time.

[0093] After the steps of obtaining the drilling type and multi-layer drilling parameters of the workpiece to be processed, the method further includes:

[0094] Step S130: The thickness of the workpiece to be processed on the worktable is detected by the automatic thickness measurement system. The confocal focal length of the laser is adjusted according to the thickness of the workpiece and the multi-layer drilling parameters. The galvanometer in the CCD camera and galvanometer scanning system is calibrated.

[0095] Specifically, based on specific experiments, the drilling effect of laser on workpieces with different properties under different drilling parameters can be obtained. A mapping table is established by mapping the different drilling parameters to the drilling effects of various workpiece properties under different drilling types, and this mapping table is pre-entered into the system. By inputting the properties of each layer of the workpiece, the system can obtain the drilling parameters of each layer of the workpiece according to the pre-stored mapping table, and then the drilling parameters of each layer are combined to form multi-layer drilling parameters.

[0096] For example, when you input the drilling type of the workpiece to be processed, and input the board thickness of the workpiece to be processed as 200μm, the surface copper thickness as 1.5μm, the thickness of the intermediate composite material layer as 30μm, and set the drilling depth as 20μm, you can obtain the drilling parameters of the surface copper layer and the drilling parameters of the composite material layer through the mapping table.

[0097] Specifically, step S130 involves adjusting the confocal focal length of the laser to focus it onto the workpiece on the worktable. The CCD camera and the galvanometer in the galvanometer scanning system are calibrated to ensure the CCD camera error is within 2μm and the galvanometer error in the galvanometer scanning system is within 10μm, thereby improving the drilling accuracy.

[0098] In this embodiment, step S200 specifically further includes:

[0099] Step S223: According to the multi-layer drilling parameters, control the laser to emit a Gaussian beam to the galvanometer scanning system. The Gaussian beam is shaped into a flat-top beam by the beam shaper in the galvanometer scanning system.

[0100] In step S224, the shaped flat-top beam is split into a first optical path and a second optical path by the beam splitter in the galvanometer scanning system. The first optical path and the second optical path emit lasers with corresponding drilling parameters for each layer to the drilling position of the workpiece to be processed, so as to perform biaxial drilling on the workpiece to be processed.

[0101] In this embodiment, compared with the hole drilled by the traditional drilling method (such as...), Figure 10 Compared to the effect shown), converting a Gaussian beam into a flat-top beam via a beam shaper makes the beam energy more uniform, achieving uniform drilling. Furthermore, using a flat-top beam for blind hole machining reduces damage to the copper at the bottom of the hole and avoids the problem of a large bottom angle α when machining blind holes (e.g., ...). Figure 11 (As shown). Using a flat-top beam for micro-hole drilling can reduce the upper and lower hole diameter ratio. In this embodiment, the upper hole diameter ratio can be achieved in the range of 75%-80%, which improves the drilling quality and pass rate.

[0102] The first optical path and the second optical path are used to process their respective axes, which can realize dual-axis scanning processing of the galvanometer scanning system on the X and Y axes, thus improving processing efficiency.

[0103] In this embodiment, the light source emitted by the laser is an infrared laser with a wavelength of 1030nm or 1064nm. Using an infrared laser with a wavelength of 1030nm or 1064nm allows for direct drilling without the need for browning or blackening the workpiece, reducing the number of steps and saving costs. Furthermore, it can process holes with diameters ranging from 20μm to 180μm, making it suitable for processing holes with a wider range of diameters and thus having a broad application range.

[0104] In one embodiment, after step S200, the continuous laser micro-hole drilling method further includes:

[0105] In step S300, the hole formation effect is detected by using the upper surface hole detection and slicing detection methods.

[0106] This invention also provides a continuous laser micro-hole drilling device, such as... Figures 4 to 7 As shown, the continuous laser micro-drilling device includes a control system, a laser 110, and a galvanometer scanning system 200; the laser 110 is used to emit laser light; the galvanometer scanning system 200 is used to focus the laser light emitted by the laser 110 onto the workpiece to be processed;

[0107] The control system is used to acquire the drilling type and multi-layer drilling parameters of the workpiece to be processed, and according to the multi-layer drilling parameters, to boost the trigger terminal of the laser 110 from low level to high level, so as to control the laser 110 to continuously emit continuous laser light to each layer of the workpiece to be processed through the galvanometer scanning system 200, and complete the micro-hole processing according to the drilling type and corresponding drilling parameters.

[0108] Compared with existing technologies, this continuous laser micro-hole drilling device has at least the following advantages: The device controls the laser 110 to continuously emit laser light through the galvanometer scanning system 200 to each layer of the workpiece according to multi-layer drilling parameters. After drilling a micro-hole in one layer of the workpiece, the laser 110 continues to emit light to drill the next layer, enabling continuous drilling between layers. The laser 110 continuously emits laser light until the drilling of the multi-layer drilling parameters is completed. This continuous laser micro-hole drilling device eliminates the oscillation of the scanning galvanometer when drilling each layer, saving time spent on the path traveled by the scanning galvanometer during drilling, and also avoiding the impact of the repeatability accuracy of the scanning galvanometer on the drilling quality.

[0109] In one embodiment, the control system further includes a laser control module, which is configured to boost the trigger terminal of the laser 110 from a low level to a high level according to the multi-layer drilling parameters, so as to trigger the laser 110 to continuously emit laser light. The laser 110 includes a trigger terminal, and the laser control module is connected to the trigger terminal of the laser 110. Upon receiving the multi-layer drilling parameters, the laser control module boosts the voltage at the trigger terminal of the laser 110 according to the multi-layer drilling parameters to continuously trigger the laser 110 to emit laser light. The laser control module enables the laser 110 to remain in a triggered state after the laser emission of the previous layer of drilling parameters is completed, and to continuously emit laser light according to the next layer of drilling parameters.

[0110] Specifically, after receiving the multi-layer laser parameters from the control system, the laser control module boosts the trigger terminal of the laser 110 from a low level to a high level based on the multi-layer drilling parameters. Since the laser 110 requires a high-level trigger to emit light, the laser control module can change the analog voltage between the upper and lower layer parameters, so that the trigger terminal of the laser 110 always maintains the received signal at a high level. The laser 110 will continuously emit all the pulses under the multi-layer drilling parameters, thereby realizing continuous micro-drilling of the workpiece to be processed.

[0111] In this embodiment, the laser control module, through software and circuit design, increases the analog voltage at its output terminal. When switching from the first layer drilling parameters to the second layer drilling parameters, the output terminal of the laser control module connected to the laser 110 remains at a high level, ensuring uninterrupted switching of the laser 110 between layer parameters. The laser control module is a boost device capable of changing the analog voltage between one layer drilling parameter and another.

[0112] In existing technology, the trigger end of laser 110 only receives one high-level signal. After receiving a high-level signal, laser 110 emits only one layer of drilling parameters. After emitting the pulse of one layer of drilling parameters, the high-level signal received by the trigger end of laser 110 is interrupted until a high-level signal is received again, resulting in a delay. This causes the laser to jump when switching drilling parameters, thus forming a laser interruption. It is impossible to achieve continuous laser emission for drilling micro-holes with multiple parameters. Generally, the number of holes processed in PCB boards ranges from tens of thousands to hundreds of thousands. If this type of laser drilling device is used, the overall delay required by the scanning galvanometer to switch between the parameters of the previous layer will be very large, resulting in a time-consuming and inefficient processing process. The continuous laser micro-hole drilling device provided by this invention, by setting a laser control module, ensures that laser 110 remains in a triggered state during the switching of drilling parameters between layers, thereby achieving continuous laser emission of multiple drilling parameters for continuous micro-hole drilling of the workpiece. In this embodiment, the switching delay between layer parameters of the scanning galvanometer is eliminated when processing multi-layer drilling parameters, thus achieving more efficient drilling processing.

[0113] In one embodiment, such as Figure 4 As shown, the galvanometer scanning system 200 is disposed on the output optical path of the laser 110. The control system is used to acquire the processing file, determine the drilling position of the workpiece to be processed and the deflection path of the galvanometer according to the processing file, and send the drilling position of the workpiece to be processed and the deflection path of the galvanometer to the galvanometer scanning system 200. The galvanometer scanning system 200 focuses the laser on the drilling position of the workpiece to be processed according to the drilling position of the workpiece to be processed and the deflection path of the galvanometer to perform drilling.

[0114] In one embodiment, the galvanometer scanning system 200 includes a beam shaper disposed in the output optical path of the laser 110, the beam shaper being used to shape the Gaussian beam emitted by the laser 110 into a flat-top beam.

[0115] In one embodiment, the galvanometer scanning system 200 includes a beam splitter disposed on the output optical path of the laser 110. The beam splitter divides the output optical path of the laser 110 into a first optical path and a second optical path. The galvanometer scanning system 200 performs laser drilling on the workpiece through the first and second optical paths respectively. The first and second optical paths cooperate to achieve dual-axis laser processing. In this embodiment, the beam splitter is disposed on the output optical path of the beam shaper. The beam splitter divides the shaped flat-top beam into a first optical path and a second optical path.

[0116] In this embodiment, as Figures 4 to 7 As shown, the galvanometer scanning system 200 includes a first lens group 201, a second lens group 202, a third lens group 203, and a scanning module arranged sequentially along the laser optical path. The second lens group 202 is a beam shaper used to shape the Gaussian beam into a flat-top beam; the third lens group 203 is a beam splitter used to split the shaped flat-top beam into p-polarized light and s-polarized light, wherein the p-polarized light forms a first optical path through the beam splitter, and the s-polarized light forms a second optical path through the beam splitter; the first lens group 201 includes a half-wave plate, which, together with a wave plate motor, rotates the polarized light in the output optical path of the laser 110. The output optical path of the laser 110 rotates after passing through the first lens group 201, so that the two beams formed after being split by the beam splitter are balanced, thereby ensuring that the processing power of the two beams falling on the worktable 400 after passing through the scanning module is basically the same.

[0117] The scanning module includes a left scanning module and a right scanning module. The left scanning module is arranged along the first optical path and includes a left first reflector 204, a left second reflector 205, a left fourth lens group 206, a left shutter 207, a left third reflector 208, a left fourth reflector 209, a left fifth reflector 210, and a left galvanometer 211 arranged sequentially along the first optical path. The right scanning module is arranged along the second optical path and includes a right first reflector 212, a right fourth lens group 213, a right shutter 214, a right second reflector 215, a right third reflector 216, a right fourth reflector 217, and a right galvanometer 218.

[0118] The left fourth lens group 206 and the right fourth lens group 213 are motorized beam expanders. These beam expanders adjust the magnification to change the size of the laser spot emitted by the laser 110. By changing the spot size, holes of different diameters can be drilled. Additionally, the laser divergence angle can be adjusted using the motorized beam expanders to achieve confocal drilling, meeting the needs of different hole diameters. The left and right shutters 207 and 214 prevent light leakage from the laser 110 or other improper operations from damaging the worktable 400 surface. The left and right shutters 207 and 214 can be opened independently. When the continuous laser micro-drilling device is in operation, the left and right shutters 207 and 214 automatically open to ensure normal drilling of the workpiece by the first and second optical paths. When the continuous laser micro-drilling device stops drilling, the left and right shutters 207 and 214 remain closed.

[0119] In one embodiment, the control system further includes a mirror module connected to the galvanometer scanning system 200. The mirror module performs horizontal mirroring of the machining file and sends the mirrored machining file to the galvanometer scanning system 200. The galvanometer scanning system 200 focuses a laser onto the drilling position on the reverse side of the workpiece according to the mirrored machining file. The mirror module performs coordinate transformation on the drilling positions in the machining file using software, mirroring the left and right portions of the drilling positions around the micro-center of the vertical central axis of the machining file, thereby achieving horizontal mirroring of the machining file.

[0120] Specifically, when this continuous laser micro-drilling device needs to form through holes on a workpiece, it can drill micro-holes on both the front and back sides of the workpiece. The galvanometer scanning system 200 drills micro-holes on the front side of the workpiece according to the drilling position information. After drilling on the front side, the workpiece is flipped over manually or by an automatic loading / unloading system. Then, the mirror module mirrors the processing file on the front side. Based on the mirrored processing file, the galvanometer scanning system 200 focuses the laser on the drilling position on the back side of the workpiece, thus drilling micro-holes on the back side. The drilling positions on the front and back sides of the workpiece correspond, forming a through hole. This continuous laser micro-drilling device, through the mirror module, ensures that the drilling positions on both sides of the workpiece remain consistent. Drilling on both sides at the same location forms a through hole (e.g., ...). Figure 9 (As shown).

[0121] When machining through holes, the depth of the micro-hole on one side of the workpiece should preferably be half the thickness of the workpiece. After drilling one side of the workpiece using multi-layer drilling parameters, the workpiece is flipped over, and then drilling is performed on the other side using the same multi-layer drilling parameters, thus forming a through hole. Both the drilling position information and the workpiece are equipped with targets, which ensures that after the workpiece is flipped over, the drilling position information is accurately located by the scanning galvanometer system, allowing the laser emitted by the laser 110 to act on the corresponding drilling positions on both sides of the workpiece.

[0122] In this embodiment, the mirror module enables the continuous laser micro-drilling device to drill a through hole at the same location on both sides of the workpiece. Furthermore, the drilling parameters of the first and second layers remain unchanged during drilling on both sides, ensuring consistent hole diameters on both sides. This avoids the problem of uneven electroplating solution flow rates and bubble formation in the middle of the hole due to inconsistent hole diameters on both sides during subsequent double-sided electroplating. The continuous laser micro-drilling device processes the drilling position information through the mirror module, enabling it to be used for through-hole processing. Simultaneously, the processed through-holes have high quality, improving the quality of subsequent electroplating.

[0123] In one embodiment, the continuous laser micro-drilling device includes a motion positioning system 300, which is connected to a worktable 400. The worktable 400 is correspondingly arranged with the galvanometer scanning system 200. A motion execution system is connected to the worktable 400. The worktable 400 is used to place the workpiece to be processed. The motion execution system is used to receive instructions from the control system and control the worktable 400 to move according to the instructions, so as to move the workpiece to be processed placed on the worktable 400 to the processing area.

[0124] The control system can issue commands to the motion execution system, which in turn controls the movement of the worktable 400 according to the commands, so that the exciter focuses the laser onto the drilling position of the workpiece through the scanning galvanometer system. Specifically, the motion execution system controls the precise movement and positioning of the worktable 400 on the XYZ axes according to the commands of the control system. The worktable 400 corresponds to the galvanometer scanning system 200, so that the workpiece is moved to the processing area and then micro-holes are drilled into it.

[0125] The continuous laser micro-drilling device includes a vision positioning system 500, which includes a charge-coupled device camera (CCD camera). The CCD camera is located at the light output port of the galvanometer scanning system. The vision positioning system 500 is connected to the control system. The CCD camera can acquire positioning point images of the workpiece to be processed. The vision positioning system 500 monitors the accuracy of the positioning point of the workpiece to be processed in real time based on the acquired positioning point images and the drilling position information sent by the control system, and feeds back the monitoring information to the control system.

[0126] In this embodiment, the control system further includes a CCD correction module and a galvanometer correction module. The CCD correction module is connected to the CCD camera, and the galvanometer correction module is connected to the left galvanometer 211 and the right galvanometer 218. The CCD correction module is used to correct the CCD camera, ensuring that the error of the CCD camera is less than 2μm. The galvanometer correction module is used to correct the left galvanometer 211 and the right galvanometer 218, ensuring that the error of the left galvanometer 211 and the right galvanometer 218 is less than 10μm. The CCD camera also performs object capture during the correction process with the left galvanometer 211 and the right galvanometer 218 to ensure the correction effect.

[0127] In this embodiment, the control system further includes a file processing system connected to the galvanometer scanning system 200. The file processing system can perform format conversion and information processing on imported machining files. The machining files include drilling position information. Specifically, the file processing system can convert imported DXF format files to PRG or EX2 format files, providing better confidentiality. When the machining file contains target positioning holes, the file processing system can also distinguish between these holes and other machining holes, marking the target positioning holes in the converted machining file for identification and subsequent processing. The control system can determine the drilling position of the workpiece and the deflection path of the galvanometer based on the parsed converted machining file, optimizing the file path to improve processing efficiency.

[0128] In this embodiment, the laser 110 is a 1030nm or 1064nm infrared laser. Of course, in some embodiments, the 1030nm or 1064nm infrared laser can be replaced with a carbon dioxide (CO2) laser, an ultraviolet (UV) laser, or a green laser. However, due to the spot characteristics of the laser emitted by a CO2 laser, it can only process holes with a diameter of 75μm or larger. Furthermore, bright copper has a low absorption rate for CO2 lasers, preventing direct processing of the copper surface of the workpiece. A browning or blackening treatment of the copper surface of the workpiece is required before drilling, adding an extra step to the processing and making the process more cumbersome. UV lasers, due to limitations and influences in laser power, have low success rates and produce poor hole quality. Green lasers, without additional processing methods, can only process holes of 30μm-70μm. Infrared lasers of 1030nm or 1064nm can directly process and drill holes without browning or blackening the workpiece. This reduces the number of processes, saves costs, and can process holes with diameters ranging from 20μm to 180μm. They are also suitable for processing holes with a wider range of diameters, making them widely applicable.

[0129] In one embodiment, the continuous laser micro-hole drilling device includes a power monitoring system 600, which is connected to the control system. The power monitoring system 600 is used to detect the laser power emitted by the laser 110 in real time and feed the detection result back to the control system.

[0130] In one embodiment, the continuous laser micro-drilling device includes an automatic thickness measurement system 700, which is connected to the control system and correspondingly positioned to the worktable 400. The automatic thickness measurement system 700 can perform multi-point thickness testing on the workpiece to be processed on the worktable 400. Specifically, the automatic thickness measurement system 700 includes a position sensor connected to the control system. The position sensor monitors the thickness of the workpiece and provides real-time feedback of the detected sheet metal thickness data to the control system. The control system receives and displays the thickness data and recalls it during processing to adjust the confocal focal length of the laser.

[0131] In one embodiment, the continuous laser micro-drilling device further includes an automatic loading and unloading system 800, which is connected to the control system. The automatic loading and unloading system 800 can load the workpiece before laser drilling and unload the workpiece after drilling. The automatic loading and unloading system 800 can also flip the workpiece on the worktable. By setting up the automatic loading and unloading system 800, the differences in laser focal length at multiple points on the workpiece caused by uneven placement of the workpiece can be avoided, ensuring that the entire plane of the workpiece falls within the set laser focal length. Simultaneously, it achieves full automation of the laser micro-drilling process, saving manpower and resources and effectively improving processing efficiency.

[0132] In one embodiment, the continuous laser micro-drilling device further includes a dust extraction and adsorption system 900, which is connected to the control system. The dust extraction and adsorption system 900 is used to remove the aerosols generated during laser drilling so that they do not affect the processing of holes in unprocessed areas, thereby ensuring the quality of drilling.

[0133] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A method of continuous laser micro-perforation, characterized in that, The method comprises the following steps: acquiring a drilling type and multi-layer drilling parameters of a workpiece to be processed, the multi-layer drilling parameters being composed of a set of drilling parameters of each layer of the workpiece to be processed; determining a to-be-drilled position and a deflection path of a galvanometer scanning system; boosting a trigger end of a laser from a low level to a high level according to the multi-layer drilling parameters, and keeping the trigger end at the high level; controlling the laser to continuously emit laser light to each layer of the to-be-drilled position of the workpiece to be processed through the galvanometer scanning system, and completing micro-hole processing according to the drilling type and corresponding drilling parameters; the step of completing micro-hole processing according to the drilling type and corresponding drilling parameters comprises: drilling the last layer of the to-be-drilled position according to the drilling parameters of each layer; continuously emitting laser light to drill the next layer of the to-be-drilled position according to the drilling parameters of each layer; wherein the galvanometer scanning system omits swing of the galvanometer scanning system when drilling the last layer and the next layer of the to-be-drilled position, thereby saving time consumed by the path of the galvanometer scanning system when drilling.

2. The method of claim 1, wherein, the drilling parameters comprise laser power and light emission time; and the step of completing micro-hole processing according to the drilling type and corresponding drilling parameters comprises: when the drilling type is a blind hole, controlling a motion execution system to move a workbench so that the laser light emitted by the galvanometer scanning system can be focused on the workpiece to be processed on the workbench; receiving a processing file, determining a to-be-drilled position of the workpiece to be processed according to the processing file, and controlling the laser to emit laser light with a first laser power and a first light emission time to the first layer of the to-be-drilled position of the workpiece to be processed through the galvanometer scanning system according to the first layer drilling parameters in the multi-layer drilling parameters; controlling the laser to emit laser light with a second laser power and a second light emission time to the second layer of the to-be-drilled position of the workpiece to be processed through the galvanometer scanning system according to the second layer drilling parameters in the multi-layer drilling parameters, wherein the first laser power is greater than the second laser power, and the first light emission time is less than the second light emission time.

3. The method of claim 1, wherein, the step of completing micro-hole processing according to the drilling type and corresponding drilling parameters comprises: when the drilling type is a through hole, controlling the motion execution system to move the workbench so that the laser light emitted by the galvanometer scanning system can be focused on the front surface of the workpiece to be processed on the workbench; receiving a processing file, determining a to-be-drilled position of the workpiece to be processed according to the processing file, and controlling the laser to emit corresponding drilling parameters of each layer to the to-be-drilled position of the front surface of the workpiece to be processed through the galvanometer scanning system according to the multi-layer drilling parameters, so as to complete micro-hole processing on the front surface of the workpiece to be processed; turning over the workpiece to be processed so that the laser light emitted by the galvanometer scanning system can be focused on the back surface of the workpiece to be processed on the workbench; performing horizontal mirror image processing on the processing file, determining a to-be-drilled position of the back surface of the workpiece to be processed according to the processing file after the horizontal mirror image processing, and controlling the laser to emit corresponding drilling parameters of each layer to the to-be-drilled position of the back surface of the workpiece to be processed through the galvanometer scanning system according to the multi-layer drilling parameters, so as to complete through hole processing of the workpiece to be processed.

4. The method of claim 2 or 3, wherein the laser beam is a continuous wave laser beam. The receiving the processing file, and determining the to-be-punched position of the workpiece to be processed according to the processing file comprises: receiving the processing file, and performing format conversion on the processing file; when the processing file has a target positioning hole, marking the target positioning hole in the converted processing file; parsing the converted processing file to determine the to-be-punched position of the workpiece to be processed and the deflection path of the galvanometer.

5. The method of claim 1, wherein, The step of obtaining the drilling type and multi-layer punching parameters of the workpiece to be processed comprises: pre-storing a mapping table of attributes of various workpieces to be processed and multi-layer punching parameters of the workpieces to be processed under different drilling types, wherein the attributes include thickness and material; obtaining the thickness and material of each layer of the workpiece to be processed, and obtaining the punching parameters of each layer of the workpiece to be processed through the pre-stored mapping table, wherein the punching parameters include laser power and light-emitting time; After the step of obtaining the drilling type and multi-layer punching parameters of the workpiece to be processed, the method further comprises: detecting the thickness of the workpiece to be processed on the workbench through an automatic thickness measurement system, adjusting the confocal focal length of the laser according to the thickness of the workpiece to be processed and the multi-layer punching parameters, and correcting the galvanometer in the CCD camera and the galvanometer scanning system.

6. The method of claim 1, wherein, The step of raising the trigger end of the laser from a low level to a high level according to the multi-layer punching parameters to control the laser to continuously emit continuous laser to each layer of the workpiece to be processed through the galvanometer scanning system comprises: controlling the laser to emit a Gaussian beam to the galvanometer scanning system according to the multi-layer punching parameters, and shaping the Gaussian beam into a flat-top beam through a beam shaper in the galvanometer scanning system; the shaped flat-top beam is divided into a first light path and a second light path through a beam splitter in the galvanometer scanning system, and the first light path and the second light path respectively emit corresponding punching parameter laser to the to-be-punched position of the workpiece to be processed to perform double-axis punching on the workpiece to be processed.

7. The method of claim 1, wherein, The light source emitted by the laser is infrared laser, and the wavelength of the infrared laser is 1030 nm or 1064 nm.

8. A continuous laser micro-perforating device, characterized by, The continuous laser micro-hole punching device comprises a control system, a laser, and a galvanometer scanning system; the laser is used for emitting laser; the galvanometer scanning system is used for focusing the laser emitted by the laser on the workpiece to be processed; the control system is used for obtaining the drilling type and multi-layer punching parameters of the workpiece to be processed, the multi-layer punching parameters being obtained by a set of punching parameters of each layer of the workpiece to be processed, and for determining the to-be-punched position and the deflection path of the galvanometer scanning system, and for raising the trigger end of the laser from a low level to a high level according to the multi-layer punching parameters, and for keeping the trigger end at a high level to control the laser to continuously emit continuous laser to each layer of the to-be-punched position of the workpiece to be processed through the galvanometer scanning system, and for completing micro-hole processing according to the drilling type and the corresponding punching parameters; The step of completing micro-hole processing according to the drilling type and the corresponding punching parameters comprises: punching the last layer of the to-be-punched position according to the punching parameters of each layer; continuously emitting laser to punch the next layer of the to-be-punched position according to the punching parameters of each layer; The galvanometer scanning system keeps the deflection path unchanged when processing the last layer and the next layer of the to-be-punched position.

9. The apparatus according to claim 8, wherein, The galvanometer scanning system comprises a beam shaper arranged on an outgoing light path of the laser, and the beam shaper is used for shaping the Gaussian beam emitted by the laser into a flat-top beam.

10. The apparatus according to claim 8, wherein The galvanometer scanning system comprises a beam splitter arranged on an outgoing light path of the laser, and the beam splitter is used for dividing the outgoing light path of the laser into a first light path and a second light path, and the galvanometer scanning system performs laser drilling on the workpiece to be processed through the first light path and the second light path respectively.

Images