Burning plate and burning device
By employing multiple wiring systems on the programming board, namely the first wiring system and the second wiring system that transmit different signals respectively, the problem of reduced programming test quality caused by the increase in the number of sockets is solved, and high-quality signal transmission is achieved when the number of sockets increases.
Patent Information
- Application Number
- CN202210223654.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-04-19
- Filing Date
- 2022-03-09
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2042-03-09
AI Technical Summary
As the number of sockets on the programming board increases, the difference in wiring length between the connectors and sockets leads to a decrease in the quality of the programming test.
Multiple cabling systems are employed, including a first cabling system and a second cabling system for transmitting different signals. The first cabling system has a connection method with branch points, while the second cabling system has a connection method without branch points, ensuring that different signals are transmitted through different cabling systems.
Even with an increased number of sockets, the degradation of programming test quality can be effectively suppressed. By optimizing the connection method of the cabling system, signal transmission delay can be reduced and test quality can be improved.
Smart Images

Figure CN115219876B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a burn-in board used in a burn-in test of a device under test (DUT) such as a semiconductor integrated circuit element, and a burn-in apparatus provided with the burn-in board. BACKGROUND
[0002] There is known a burn-in apparatus provided with a burn-in board having a plurality of sockets capable of respectively mounting DUTs, a burn-in chamber that houses the burn-in board and applies a thermal stress to the DUTs, and a burn-in controller that inputs and outputs signals to and from the DUTs via the burn-in board (for example, refer to Patent Literature 1). In the burn-in apparatus, the burn-in board is electrically connected to the burn-in controller by fitting a connector of the burn-in board to a connector of the burn-in chamber.
[0003] PRIOR ART LITERATURE
[0004] PATENT LITERATURE
[0005] Patent Literature 1: Japanese Patent Application Publication No. 2014-025829 SUMMARY
[0006] (PROBLEMS TO BE SOLVED BY THE INVENTION)
[0007] The above-mentioned sockets are connected to drivers possessed by the burn-in controller via the connectors, and signals are inputted / outputted from the drivers to / from the DUTs. Since the number of the drivers is limited, it is necessary to connect the plurality of sockets to the same driver via a wiring system.
[0008] On the other hand, when the number of the sockets mounted on the burn-in board increases, there is a tendency that the difference in the length of the wiring between the connectors and the sockets in the plurality of sockets becomes large. Depending on the kind of the signals inputted / outputted from the burn-in controller to / from the DUTs, there is a case where the difference in the length of the wiring between the sockets affects the quality of the burn-in test.
[0009] Therefore, there is a problem that, in the case where the number of the sockets on the burn-in board increases, if all the wiring systems are set to the same kind of connection mode, depending on the kind of the signals, the quality of the burn-in test is sometimes deteriorated.
[0010] The present application has been made to solve the above-mentioned problems, and has an object to provide a burn-in board and a burn-in apparatus capable of suppressing deterioration of the quality of a burn-in test even in the case where the number of sockets increases.
[0011] (Technical Solution for Solving the Problems)
[0012] [1] The present application provides a burn plate, comprising: a substrate; a plurality of sockets mounted on the substrate; a connector mounted on the substrate; and a plurality of wiring systems provided on the substrate, connecting the plurality of sockets and the connector, the plurality of wiring systems including a first wiring system transmitting a first signal and a second wiring system transmitting a second signal different from the first signal, the first wiring system having a first connection mode different from a second connection mode of the second wiring system.
[0013] [2] In the above application, the first connection mode can be a connection mode having a portion of wiring branched between the connector and the socket and connected to another connector, and the second connection mode can be a connection mode not having a portion of wiring branched between the connector and the socket.
[0014] [3] In the above application, the socket can include first to fourth sockets, and the first wiring system can include: a first main line connected to the connector; first and second sub-lines connected to the first main line at a branching point and connected to the first and third sockets, respectively; a first connection line connecting the first and second sockets; and a second connection line connecting the third and fourth sockets.
[0015] [4] In the above application, the substrate can have a first end portion where the connector is mounted and a second end portion opposite to the first end portion, the first and second sockets can be arranged in a first direction from the first end portion toward the second end portion, the third and fourth sockets can be arranged in the first direction, the first and third sockets can be arranged in a second direction substantially orthogonal to the first direction, and the second and fourth sockets can be arranged in the second direction.
[0016] [5] In the above application, a length of wiring between the branching point and the first socket can be substantially the same as a length of wiring between the branching point and the third socket, and a length of wiring between the branching point and the second socket can be substantially the same as a length of wiring between the branching point and the fourth socket.
[0017] [6] In the above application, the socket can include fifth to seventh sockets, and the second wiring system can include: a second main line connected to the connector and connected to the fifth socket; a third connection line connecting the fifth and sixth sockets; and a fourth connection line connecting the sixth and seventh sockets.
[0018] [7] In the above invention, the substrate may also have a first end on which the connector is mounted and a second end opposite to the first end, and the fifth to seventh sockets are arranged sequentially along a first direction from the first end toward the second end.
[0019] [8] In the above invention, the first socket and the fifth socket may be the same socket, and the second socket and the sixth socket may be the same socket.
[0020] [9] In the above invention, the first signal may include an output signal from the DUT electrically connected to the socket, and the second signal may include an input signal to the DUT.
[0021]
[10] The programming device involved in the present invention is a programming device having the above-described programming board.
[0022] (Invention effect)
[0023] According to the present invention, the programming board includes multiple wiring systems, including a first wiring system for transmitting a first signal and a second wiring system for transmitting a second signal different from the first signal. The first connection method of the first wiring system and the second connection method of the second wiring system are different from each other. That is, in the present invention, the connection methods of the wiring systems are different according to the type of signal. Therefore, in the present invention, even when the number of sockets on the programming board increases, the reduction in the test quality of the programming test can be suppressed. Attached Figure Description
[0024] Figure 1 This is a front view showing the programming apparatus in an embodiment of the present invention.
[0025] Figure 2 This is a block diagram illustrating the system structure of the programming apparatus in an embodiment of the present invention.
[0026] Figure 3 This is a top view schematic diagram showing the wiring system of the programming board in an embodiment of the present invention.
[0027] Figure 4 yes Figure 3 Enlarged view of part IV. Detailed Implementation
[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0029] First, refer to Figure 1 and Figure 2 The overall structure of the burning device 1 in this embodiment will be described. Figure 1is a front view of the burn-in device in the embodiment, Figure 2 is a block diagram showing a system configuration of the burn-in device in the embodiment.
[0030] The burn-in device 1 in the embodiment is a device of a burn-in test for performing screening of initial defects of a DUT such as an IC chip, for the purpose of removal of initial defective products. As shown in Figure 1 and Figure 2 shown, the burn-in device 1 is provided with: a burn-in chamber 11 capable of housing a burn-in board 20; a test power supply 12 that applies a power supply voltage to a DUT 100 (refer to Figure 2 ) mounted on the burn-in board 20; and a burn-in controller 13 that inputs / outputs a signal to the DUT 100.
[0031] The burn-in device 1 performs screening of the DUT 100 by applying a power supply voltage and inputting / outputting a signal to the DUT 100 in a state where thermal stress (for example, -25°C to +125°C) is applied to the DUT 100 mounted on the burn-in board 20 housed in the chamber 11. The DUT 100 in the embodiment is a device of a memory system. In addition, the DUT 100 as a test object is not particularly limited, and for example, can be a device of a logic system and a SoC (System on a chip).
[0032] As shown in Figure 1 , the burn-in chamber 11 has a constant-temperature chamber 111 partitioned by a heat-insulating wall or the like, and a door 112 capable of opening and closing the constant-temperature chamber 111. A plurality of slots 113 for holding the burn-in board 20 are provided in the constant-temperature chamber 111. Each slot 113 has a pair of rails 114 that support both ends of the burn-in board 20. The burn-in board 20 is slid on the rails 114 and is carried into the constant-temperature chamber 111 via the door 112. There are 24 slots 113 in two rows in the constant-temperature chamber 111, and a total of 48 burn-in boards 20 can be housed.
[0033] In addition, in the drawing, one door (the door on the right side in the drawing) is not illustrated, and is illustrated in a state where the constant-temperature chamber 111 is opened. In contrast, the other door 112 (the door on the left side in the drawing) is illustrated in a closed state, and in conjunction therewith, the 24 slots 113 on the left side in the drawing are not illustrated. In addition, the number and arrangement of the slots 113 (i.e., the number of pieces and positional relationship of the burn-in boards 20 housed in the constant-temperature chamber 111) are not limited to the example shown in Figure 1 , and can be arbitrarily set in consideration of test efficiency and the like.
[0034] A connector 115 (refer to Figure 2). The connector 80 of the burn-in board 20 inserted into the slot 113 can be fitted to the connector 115.
[0035] As shown in Figure 2 , the connector 115 is electrically connected to the DUT power supply 12 and the burn-in controller 13. In addition, in Figure 2 , although only one burn-in board 20 is illustrated, in fact, other burn-in boards 20 are also connected to the DUT power supply 12 and the burn-in controller 13 in the same manner.
[0036] Further, as shown in Figure 1 , the burn-in chamber 11 includes an evaporator 116, a heater 117, and a fan 118. The air in the thermostat chamber 111 is circulated by the fan 118 while being cooled by the evaporator 116 or being heated by the heater 117, whereby the temperature adjustment in the thermostat chamber 111 is performed. The operations of such evaporator 116, heater 117, and fan 118 are controlled by the burn-in controller 13.
[0037] The DUT power supply 12 is connected via the above-mentioned connectors 115, 80 in such a manner as to apply a power supply voltage to each DUT 100 on the burn-in board 20, and is controlled by the burn-in controller 13.
[0038] The burn-in controller 13, in addition to the control of the voltage application to the DUT 100, the input / output of the signal to the DUT 100, and the control of the temperature adjustment in the thermostat chamber 111, can judge the DUT in which an abnormal reaction exists in the burn-in test as a defective product, store the serial number of the DUT (for example, a number corresponding to the number of the slot 113 and the position on the burn-in board 20), and feedback the test result.
[0039] Next, the burn-in board 20 in the present embodiment will be described with reference to Figure 3 and Figure 4 . Figure 3 is a plan view schematically showing the wiring system of the burn-in board in the present embodiment, Figure 4 is Figure 3 , and
[0040] As shown in Figure 3 , the burn-in board 20 in the present embodiment is provided with a wiring board 30, a plurality of (320 in the present example) sockets 70A1 to 70P 20 installed to the wiring board 30, and a connector 80 installed to the wiring board 30.
[0041] The sockets 70A1 to 70P 20 can respectively mount the DUT 100. Hereinafter, the sockets 70A1 to 70P 20Collectively referred to as socket 70. Additionally, connector 80 is mounted at one end of the substrate 40 of wiring board 30 (in... Figure 3 The upper edge portion 41, as described above, can be fitted with the connector 115 provided in the burning chamber 11. In addition, the reinforcing plate 20 may also have a reinforcing frame for reinforcing the wiring board 30 and a bottom cover for protecting the back of the wiring board.
[0042] Furthermore, in this embodiment, socket 70A1 corresponds to an example of the "first socket" in this invention; socket 70A2 corresponds to an example of the "second socket" in this invention; socket 70B1 corresponds to an example of the "third socket" in this invention; and socket 70B2 corresponds to an example of the "fourth socket" in this invention. Additionally, in this embodiment, socket 70A1 corresponds to an example of the "fifth socket" in this invention; socket 70A2 corresponds to an example of the "sixth socket" in this invention; and socket 70A3 corresponds to an example of the "seventh socket" in this invention.
[0043] like Figure 4 As shown, each socket 70 has multiple (16 in this example) contacts 71 that make contact with the terminals of the DUT 100. These contacts 71 are arranged in a matrix corresponding to the terminals of the DUT 100. During a programming test, when the DUT 100 is mounted on the socket 70, the contacts 71 make contact with the terminals of the DUT 100, thereby electrically connecting the DUT 100 to the socket 70. Sockets 70A1 to 70P 20 They all have the same structure.
[0044] Furthermore, the number of contacts 71 in the socket 70 is not particularly limited to those described above. Also, the arrangement of the contacts 71 in the socket 70 is not particularly limited to those described above.
[0045] And, as Figure 3 As shown, multiple sockets 70A1 to 70P 20 Arranged in a matrix on the substrate 40 of the wiring board 30.
[0046] More specifically, in this embodiment, there are 20 sockets 70A1 to 70A in the substrate 40. 20 Arranged in a row along the first direction, these sockets are 70A1 to 70A. 20 This forms a socket array 75A. Furthermore, the first direction is the direction within the substrate 40 from the first end 41 toward the second end 42 opposite to the first end 41, corresponding to the -Y direction in the figure. The socket array 75A consists of 20 sockets 70A1 to 70A. 20 They are arranged at equal intervals.
[0047] Similarly, the 20 sockets 70B1 to 70B are arranged along the first direction. 20 Arranged in a row, these sockets 70B1 to 70B 20 This constitutes a socket row 75B. The 20 sockets 70B1 to 70B that constitute this socket row 75B are... 20 They are also arranged at equal intervals. In the same manner, the other 14 socket rows 75C to 75P are each composed of 20 sockets 70 arranged at equal intervals along the first direction.
[0048] Furthermore, these 16 socket rows 75A to 75P are arranged along the second direction. This second direction is substantially orthogonal to the first direction (the -Y direction in the diagram), corresponding to the X direction in the diagram. The socket rows 75A to 75P are arranged at substantially equal intervals.
[0049] Furthermore, the number of sockets 70 mounted on the substrate 40 is not particularly limited to those described above. Additionally, the arrangement of the sockets 70 on the substrate 40 is not particularly limited to those described above.
[0050] In this embodiment, the wiring board 30 is equipped with the aforementioned multiple sockets 70A1 to 70P. 20 Printed wiring boards. For example... Figure 3 As shown, the wiring board 30 includes an electrically insulating substrate 40 and two wiring systems 50a1 to 50h. 10 60a to 60p. In this embodiment, the wiring board 30 is a multi-layer wiring board, and each wiring system 50a1 to 50h... 10 60a to 60p are composed of wiring patterns and conductive paths such as vias formed on the substrate 40.
[0051] In this embodiment, the first wiring system 50a1~50h 10 The connection methods used in the first cabling system 50a1-50h differ from those in the second cabling systems 60a-60p. Here, the connection form / connection topology refers to the electrical connection configuration between the connector 80 and the multiple sockets 70 in the cabling board 30, represented by the connection path (positional relationship of the wiring and branch points) formed by combining the wiring connecting the connector 80 and the multiple sockets 70. Furthermore, the type of connection method can be classified based on the presence or absence of branch points and the location of those branch points. In this embodiment, the first cabling systems 50a1-50h... 10In contrast to the first wiring system 50a1-50h, the second wiring system 60a-60p has a connection mode that does not have a branching point. In addition, the number of types of connection modes of the wiring system possessed by the wiring board 30 is not particularly limited, and the wiring board can have a wiring system of three or more types of connection modes.
[0052] First wiring system 50a1-50h 10 The first wiring system 50a1-50h has substantially the same structure, and therefore the structure of the first wiring system 50a1 will be described below as representative, and the description of the structures of the other first wiring systems 50a2-50h will be omitted. Likewise, the second wiring system 60a-60p has substantially the same structure, and therefore the structure of the second wiring system 60a will be described below as representative, and the description of the structures of the other second wiring systems 60b-60p will be omitted. 10 The first wiring system 50a1-50h has substantially the same structure, and therefore the structure of the first wiring system 50a1 will be described below as representative, and the description of the structures of the other first wiring systems 50a2-50h will be omitted. Likewise, the second wiring system 60a-60p has substantially the same structure, and therefore the structure of the second wiring system 60a will be described below as representative, and the description of the structures of the other second wiring systems 60b-60p will be omitted.
[0053] The first wiring system 50a1 has a connection mode in which the wiring branches between the connector 80 and the socket 70A1 and has a portion connected to the socket 70B1. Specifically, as shown in FIG. 2, the first wiring system 50a1 has a main line 51, sub lines 52, 53, and connection lines 54, 55. In addition, the main line 51, the sub lines 52, 53, and the connection lines 54, 55 are composed of conductive paths such as wiring patterns and through holes formed in the substrate 40. Figure 4
[0054] In addition, the main line 51 in the present embodiment corresponds to an example of the "first main line" in the present application, the sub line 52 in the present embodiment corresponds to an example of the "first sub line" in the present application, the sub line 53 in the present embodiment corresponds to an example of the "second sub line" in the present application, the connection line 54 in the present embodiment corresponds to an example of the "first connection line" in the present application, and the connection line 55 in the present embodiment corresponds to an example of the "second connection line" in the present application.
[0055] The main line 51 is connected at one end thereof to the connector 80. A branching point 511 is provided at the other end of the main line 51, and at the branching point 511, the main line 51 branches into two sub lines 52, 53. One of the sub lines 52 is connected at a front end thereof to the connection line 54 and is also connected to the socket 70A1. Also, the connection line 54 is connected at a front end thereof to the next socket 70A2. Likewise, the other sub line 53 is also connected at a front end thereof to the connection line 55 and is also connected to the socket 70B1. Also, the connection line 55 is connected at a front end thereof to the next socket 70B2.
[0056] That is, in the first wiring system 50al, wiring branches into two between the connector 80 and the sockets 70Al, 70Bl. Also, in the first wiring system 50al, the socket 70Al connected to the one sub-wire 52 and the socket 70A2 arranged side by side with the socket 70Al in the first direction are connected in a daisy chain by the connection line 54. Likewise, in the first wiring system 50al, the socket 70Bl connected to the other sub-wire 53 and the socket 70B2 arranged side by side with the socket 70Bl in the first direction are connected in a daisy chain by the connection line 55.
[0057] In the present embodiment, the length of the sub-wire 52 between the branching point 511 and the socket 70Al and the length of the sub-wire 53 between the branching point 511 and the socket 70Bl are substantially the same. Therefore, the transmission time of the signal of the socket 70Al and the transmission time of the signal of the socket 70Bl are substantially the same.
[0058] Also, the length of the connection line 54 between the socket 70Al and the socket 70A2 and the length of the connection line 55 between the socket 70Bl and the socket 70B2 are substantially the same. Therefore, the total length of the sub-wire 52 and the connection line 54 between the branching point 511 and the socket 70A2 and the total length of the sub-wire 53 and the connection line 55 between the branching point 511 and the socket 70B2 are substantially the same. Therefore, the transmission time of the signal of the socket 70A2 and the transmission time of the signal of the socket 70B2 are substantially the same.
[0059] The first wiring system 50a2 also has the same wiring system as the above-described first wiring system 50al, as shown in FIG. 6, the connector 80 is connected to four sockets 70A3, 70A4, 70B3, 70B4. Figure 3
[0060] Although not particularly shown, the first wiring systems 50a3 to 50a9 also have the same wiring system as the above-described first wiring system 50al, the first wiring system 50a3 connects the connector 80 and four sockets 70A5, 70A6, 70B5, 70B6, the first wiring system 50a4 connects the connector 80 and four sockets 70A7, 70A8, 70B7, 70B8, the first wiring system 50a5 connects the connector 80 and four sockets 70A9, 70A 10 10 11 12 11 12 13 14 13 70B 14 The first cabling system 50a8 connects connector 80 and four sockets 70A. 15 70A 16 70B 15 70B 16 The first cabling system 50a9 connects connector 80 and four sockets 70A. 17 70A 18 70B 17 70B 18 connect.
[0061] First cabling system 50a 10 It also has the same cabling system as the first cabling system 50a1 mentioned above, such as... Figure 3 As shown, connector 80 is connected to four sockets 70A. 19 70A 20 70B 19 70B 20 connect.
[0062] That is, relative to the two rows of sockets 75A and 75B, there are 10 first connection methods 50a1 to 50a that connect four sockets 70 to the connector 80. 10 Similarly, in the other socket rows 75C to 75P, ten first connection methods 50b1 to 50h are provided in every two socket rows. 10 As a result, the programming board 20 of this embodiment has 320 sockets 70A1 to 70P. 20 Equipped with 80 first connection methods 50a1 to 50h 10 .
[0063] In contrast, the second wiring system 60a has connectors 80 and sockets 70A1 to 70A. 20 The connection method for sections that do not have wiring branches. Specifically, such as... Figure 3 and Figure 4 As shown, the second cabling system 60a includes a main line 61a and connecting lines 62a1 to 62a. 19 In addition, the main line 61a and connecting lines 62a1 to 62a 19 It consists of wiring patterns and conductive paths such as vias formed on the substrate 40.
[0064] Furthermore, in this embodiment, the main line 61a corresponds to an example of the "second main line" in the present invention, the connecting line 62a1 in this embodiment corresponds to an example of the "third connecting line" in the present invention, and the connecting line 62a2 in this embodiment corresponds to an example of the "fourth connecting line" in the present invention.
[0065] Main line 61a is connected to connector 80 at one end. The other end of main line 61a is connected to connecting line 62a1 and to socket 70A1. Furthermore, connecting line 62a1 is connected at its leading end to the next connecting line 62a2 and also to the next socket 70A2. Similarly, connecting lines 62a2 to 62a... 18 At its front end and the next connecting line 62a3~62a 19 Connect, and also connect with the next socket 70A3~70A. 19 Connect. And, the final connecting line 62a. 19 Its front end and socket 70A 20 connect.
[0066] That is, in the second wiring system 60a, the connector 80 and the sockets 70A1 to 70A are connected. 20 There are no branches in the wiring between them. In this second wiring system 60a, 20 sockets 70A1 to 70A are arranged in a row along the first direction to form a socket row 75A. 20 Connecting lines 62a1 to 62a 19 They connect to form a chrysanthemum-like chain.
[0067] The second cabling system 60b also has the same cabling system as the second cabling system 60a described above, which includes 20 sockets 70B1 to 70B that constitute the socket row 75B. 20 Connected into a chrysanthemum-like chain. That is, as... Figure 3 and Figure 4 As shown, it includes a main line 61b and connecting lines 62b1 to 62b. 19 The main line 61b is connected to connector 80 at one end. The other end of the main line 61b is connected to connecting line 62b1 and also to socket 70B1. Furthermore, there are 20 sockets 70B1 to 70B... 20 Connecting lines 62b1 to 62b 19 Connect them into a chrysanthemum chain.
[0068] Similarly, the second cabling systems 60c to 60p also have the same cabling system as the second cabling system 60a described above, and each of the second cabling systems 60c to 60p will respectively form 20 sockets 70 in the socket rows 75C to 75P connected in a daisy chain.
[0069] That is, a second wiring system 60a to 60p is provided for each row of sockets 75A to 75P. As a result, the programming board 20 of this embodiment is equipped with 320 sockets 70A1 to 70P. 20 It has 16 secondary cabling systems 60a to 60p.
[0070] Each of the first cabling systems 50a1 to 50h 10Each is connected independently to connector 80. Furthermore, each of the first wiring systems 50a1 to 50h... 10 It connects to different drivers of the programming controller 13 via connector 80. To give an example, it would be like... Figure 3 As shown, the first cabling system 50a1 is connected to the driver 14b, while the other first cabling system 50a2 is connected to a different driver 14c than the driver 14b.
[0071] In addition, such as Figure 4 As shown, the first cabling system 50a1 is connected to the same contact 71a (e.g., the contact 71a located in the 3rd row and 3rd column in the figure) in the contact 71 of the sockets 70A1, 70A2, 70B1, and 70B2. Similarly, the other first cabling systems 50a2 to 50h are connected to the same contact 71a (e.g., the contact 71a located in the 3rd row and 3rd column in the figure). 10 It is also connected to the same contact pin 71a in socket 70.
[0072] Furthermore, via the first wiring system 50a1 to 50h 10 The first signal transmitted between the programming controller 13 and the socket 70 includes both an input signal to the DUT 100 electrically connected to the socket 70 and an output signal output from the DUT 100. Specific examples of such a first signal include signals that include signals for writing data to the DUT 100 and signals for reading data from the DUT 100. This first signal requires a high-quality waveform; the fewer the number of sockets connected to a cabling system, the better the waveform quality. Therefore, in this embodiment, each of the first cabling systems 50a1 to 50h... 10 It only connects to 4 sockets 70.
[0073] Furthermore, the number of branch points in the first wiring system is not limited to one; for example, the first wiring system may also have multiple branch points. Incidentally, since higher signal frequencies have a greater impact on waveform quality, it is preferable to have fewer branch sections.
[0074] Each of the second wiring systems 60a-60p is also independently connected to connector 80. Furthermore, each of the second wiring systems 60a-60p is connected to a different driver of the programming controller 13 via connector 80. For example, as shown... Figure 3 As shown, the second cabling system 60a is connected to driver 14a, and in contrast, other second cabling systems 60b are connected to driver 14d, which is different from driver 14a. Furthermore, drivers 14a and 14d are different from drivers 14b and 14c, which are connected to the aforementioned first cabling systems 50a1 and 50a2.
[0075] In addition, such asFigure 4 As shown, the second wiring system 60a is connected to the contact pins 71b (for example, the contact pin 71b located at row 2, column 2 in the drawing) other than the contact pin 71a connected to the first wiring system 50a described above in the receptacle 70A1 to 70A 20 As shown, the second wiring system 60a is connected to the contact pins 71b (for example, the contact pin 71b located at row 2, column 2 in the drawing) other than the contact pin 71a connected to the first wiring system 50a described above in the receptacle 70A1 to 70A
[0076] Further, the second signal transmitted between the burn-in controller 13 and the receptacle 70 via the second wiring system 60a contains only the input signal input to the DUT 100 electrically connected to the receptacle 70. As a specific example of such a second signal, for example, an address signal, a clock signal, and the like can be exemplified. The second signal does not require a high-quality waveform compared to the first signal described above, and therefore in the present embodiment, each of the second wiring systems 60a to 60p is connected to 20 receptacles 70.
[0077] In addition, the number of receptacles 70 connected by one second wiring system is not particularly limited to that described above, and can be set according to the required waveform quality and the like. For example, it is also possible to connect 5 receptacles 70 in a daisy chain by one second wiring system. Alternatively, it is also possible to connect 10 receptacles 70 in a daisy chain by one second wiring system.
[0078] Although not particularly shown, the contact pins 71 other than the contact pins 71a, 71b described above possessed by the receptacle 70 are also connected to other wiring systems. That is, all of the contact pins 71 possessed by the receptacle 70 are respectively independently connected to wiring systems.
[0079] The other wiring systems can have the same kind of connection as the first or second wiring system described above, or can have a different kind of connection from the first and second wiring systems. For example, the other wiring systems can have a connection having branch points at a position different from the first wiring system described above. The connection of these other wiring systems can be set according to the required waveform quality and the like.
[0080] Here, regarding the input signal, in the case where the burn-in controller 13 has a timing correction function, by calibration of the timing correction function, it is possible to input the input signal to all of the DUTs 100 at the same timing. On the other hand, for the output signal from the DUT 100, it is difficult to make the timing coincide even if the timing correction function is used. Therefore, depending on the length of the wiring between the connector and the receptacle, a transmission delay time of the signal occurs. In addition, there is a tendency that the higher the frequency of the signal, the more significant the problem caused by such a transmission delay time.
[0081] Therefore, in the present embodiment, the connection method of the first wiring system 50a1 to 50h that transmits the first signal including the output signal is set to the first connection method having the branch point 511 as described above. Thereby, even in the case where the number of the sockets 70 on the burn-in board 20 is increased, it is possible to reduce the transmission delay time of the first signal. 10
[0082] If one example is cited, compared to the case where the four sockets 70A1 to 70A4 are connected in a daisy chain as one row as the number of the sockets 70 is increased, by replacing the sockets 70A3, 70A4 with the sockets 70B1, 70B2 close to the connector 80, and connecting the four sockets 70A1, 70A2, 70B1, 70B2 with the first wiring system 50a1 as described above, it is possible to shorten the length of the wiring from the connector 80 to the sockets 70B1, 70B2.
[0083] On the other hand, the second signal does not require a high-quality waveform compared to the first signal, and therefore the connection method of the second wiring system 60a to 60p that transmits the second signal is set to the second connection method not having the branch point as described above. Thereby, by increasing the number of the sockets 70 connected in a daisy chain, it is possible to cope with the increase in the number of the sockets 70 in the process where the number of the drivers is limited.
[0084] Therefore, in the present embodiment, by making the kinds of the connection methods of the wiring systems different depending on the kinds of the signals, even in the case where the number of the sockets 70 is increased, it is possible to achieve the suppression of the reduction in the quality of the burn-in test.
[0085] Further, the above-described embodiments are described in order to easily understand the present application, and are not described in order to limit the present application. Therefore, each element disclosed in the above-described embodiments also includes all design changes or equivalents belonging to the technical scope of the present application.
[0086] For example, the structure of the above-described burn-in apparatus 1 is only one example, and is not particularly limited to the above-described description. For example, the above-described burn-in apparatus 1 is a way of performing the temperature adjustment of the DUT 100 using the constant-temperature chamber 111, but is not particularly limited thereto. For example, the burn-in apparatus 1 can be a way of performing the temperature adjustment of the DUT 100 by bringing a pusher for temperature adjustment into contact with the DUT 100.
[0087] (Explanation of Reference Numerals)
[0088] 1 … Burn-in apparatus
[0089] 11 … Burn-in chamber
[0090] 111 … Constant-temperature chamber
[0091] 112 … Door
[0092] 113 … slot
[0093] 114 … track
[0094] 115 … connector
[0095] 116 … evaporator
[0096] 117 … heater
[0097] 118 … fan
[0098] 12 … test power supply
[0099] 13 … burn controller
[0100] 14a-14d … driver
[0101] 20 … burn plate
[0102] 30 … wiring plate
[0103] 40 … substrate
[0104] 41 … end
[0105] 42 … end
[0106] 50a1-50h 10 … first wiring system
[0107] 51 … main line
[0108] 511 … branch point
[0109] 52, 53 … sub-line
[0110] 54, 55 … connection line
[0111] 60a-60p … second wiring system
[0112] 61a, 61b … main line
[0113] 62a1-62a 19 , 62b1-62b 19 … connection line
[0114] 70, 70A1-70P 20 … socket
[0115] 71, 71a, 71b … contact pin
[0116] 75A-75P … socket column
[0117] 80 … connector
[0118] 100 … DUT
Claims
1. A programming board, characterized in that, have: substrate; Multiple sockets are mounted on the substrate; A connector, which is mounted on the substrate; as well as Multiple wiring systems are disposed on the substrate and connect the multiple sockets to the connectors. The plurality of cabling systems include: A first cabling system that transmits a first signal; and The second cabling system transmits a second signal that is different from the first signal. The first connection method is a connection method in which wiring branches between the connector and the socket and connects to other connectors. The second connection method is a connection method without a portion of wiring branching between the connector and the socket. The socket includes a first socket to a third socket. The first cabling system includes: A first main line, which is connected to the connector; and The first and second auxiliary lines connect to the first main line at the branch point and are respectively connected to the first socket and the third socket. The second cabling system includes: A second main line, which connects to the connector and to the first socket; and A third connecting wire connects the first socket and the second socket.
2. The programming board according to claim 1, characterized in that, The socket also includes a fourth socket. The first cabling system further includes: A first connecting line connects the first socket and the second socket; and The second connecting line connects the third socket and the fourth socket.
3. The programming board according to claim 2, characterized in that, The substrate has: The first end is fitted with the connector; and The second end, on the opposite side of the first end, The first socket and the second socket are arranged along a first direction from the first end toward the second end. The third socket and the fourth socket are arranged along the first direction. The first socket and the third socket are arranged along a second direction that is substantially orthogonal to the first direction. The second socket and the fourth socket are arranged along the second direction.
4. The programming board according to claim 2, characterized in that, The length of the wiring between the branch point and the first socket and the length of the wiring between the branch point and the third socket are substantially the same. The length of the wiring between the branch point and the second socket is substantially the same as the length of the wiring between the branch point and the fourth socket.
5. The programming board according to claim 2, characterized in that, The socket also includes a seventh socket. The second cabling system also includes: A fourth connecting wire connects the second socket and the seventh socket.
6. The programming board according to claim 5, characterized in that, The substrate has: The first end is fitted with the connector; and The second end, on the opposite side of the first end, The first socket, the second socket, and the seventh socket are arranged sequentially along a first direction from the first end toward the second end.
7. The programming board according to claim 1, characterized in that, The first signal includes an output signal from the DUT electrically connected to the socket. The second signal includes the input signal to the DUT.
8. A programming device, characterized in that, The programming device comprises a programming board according to any one of claims 1 to 7.
Citation Information
Patent Citations
Burn-in board and burn-in device
JP2014025829A
Burn-in board and burn-in device
JP2022165234A
Monitored burn-in test apparatus and monitored burn-in test method
US20090287362A1
Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runaway
US6982566B1