A point-to-point switch intelligent sensing device

Abstract

This invention discloses a point-to-point switch quantity intelligent sensing device, including a housing structure, a control processor circuit board disposed within the housing structure, an open-loop radio frequency leakage detection sensing circuit disposed on the control processor circuit board, an access sensor disposed at the front end of the control processor circuit board and connected to the control processor circuit board, a medium detection sensor connected to the access sensor, and an indicator light disposed at the rear end of the control processor circuit board and connected to the control processor circuit board. By designing an integrated, compact, multi-channel point-to-point switch quantity sensing device, it enables multi-medium frequency detection and can measure both conductive and non-conductive liquid and solid media. It can quickly, effectively, and reliably detect both high-dielectric-constant and low-dielectric-constant substances, achieving a wide range of material media adaptability, economic durability, convenient installation, real-time tracking of operating status, and easy maintenance.

Description

Technical Field

[0001] This invention relates to a point-to-point switch intelligent sensing device, and more particularly to a point-to-point switch intelligent sensing device that can quickly and effectively identify and detect various types of solid and liquid material media. Background Technology

[0002] Point-to-point switching sensors are passive signals based on switching outputs, reflecting the on / off state of the device. These signals are transmitted to a PLC industrial controller, representing a method of discontinuous detection. This invention utilizes digital intelligent multi-medium frequency detection technology to convert the state of the medium object in contact with the sensing head (medium detection sensor) into a capacitance change. It is widely used in industrial production processes for measuring and controlling the storage of solids and liquids in various containers.

[0003] Existing technologies suffer from limitations due to their reliance on single detection methods, failing to effectively identify and perform targeted testing on a wide variety of materials and media using a single device. Furthermore, most similar technologies cannot measure media with low dielectric constants, limiting their application scope. The cumbersome calibration process required before use for specific media is also inconvenient for non-professional users. Finally, most existing technologies rely on pure switch signal outputs and lack intelligent digital diagnostic interfaces. Summary of the Invention

[0004] The technical problem this invention aims to solve is to provide a point-to-point intelligent sensing device for switching quantities. This device features rapid and effective identification and detection of various solid and liquid materials. Employing multi-medium frequency detection, it can easily and quickly identify and detect various solid and liquid materials with zero calibration and no human intervention. Simultaneously, it incorporates wireless transmission technology and parallel switching quantity output, achieving data transparency at the last mile and serving as an intelligent diagnostic basis for process control.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: a point-to-point switch quantity intelligent sensing device, the innovation of which is that the point-to-point switch quantity intelligent sensing device includes a housing structure, a control processor circuit board disposed in the housing structure, an open-loop radio frequency leakage detection sensing circuit disposed on the control processor circuit board, an access sensor disposed at the front end of the control processor circuit board and connected to the control processor circuit board, a medium detection sensor connected to the access sensor, and an indicator light disposed at the rear end of the control processor circuit board and connected to the control processor circuit board.

[0006] Preferably, the housing structure includes a front part, a middle part, and a rear part from front to back. The control processor circuit board is located in the front part and the middle part of the housing. The front end of the control processor circuit board is located in the front part of the housing. The indicator light is located in the rear part of the housing. The middle part of the housing is embedded or threaded into the front part of the housing. The rear part of the housing is engaged or threaded into the middle part of the housing.

[0007] Preferably, the front part of the housing includes, from front to back, a container side, a main cavity structure directly connected to the container side, and a fixing interface piece that engages with or is embedded in the main cavity structure, and the middle part of the housing is embedded in or threaded onto the fixing interface piece.

[0008] Preferably, the middle part of the housing is composed of two semi-cylindrical sleeve-shaped first sensor protective covers and second sensor protective covers combined into a complete cylindrical sleeve-shaped structure, and both the first sensor protective covers and the second sensor protective covers are provided with connecting parts that are embedded or threaded onto the fixed interface component.

[0009] Preferably, the tail of the housing is a top cover made of semi-transparent ABS plastic, and the indicator light is located inside the top cover. The indicator light is a 360-degree ring-shaped multi-color LED status indicator component.

[0010] Preferably, the open-loop radio frequency leakage detection sensing circuit includes an open-loop radio frequency leakage detection sensing circuit unit, a filtering unit connected to the open-loop radio frequency leakage detection sensing circuit unit, a transmit signal amplification circuit connected to the filtering unit, a radio frequency oscillation circuit connected to the transmit signal amplification circuit, a frequency modulation voltage control circuit connected to the radio frequency oscillation circuit, an MCU unit connected to the frequency modulation voltage control circuit, a receive signal amplification circuit connected to the MCU unit, and an echo signal monitoring circuit connected to the receive signal amplification circuit, wherein the echo signal monitoring circuit is connected to the open-loop radio frequency leakage detection sensing circuit unit.

[0011] Preferably, the open-loop RF leakage detection sensing circuit unit includes an open-loop RF leakage detection sensing chip, capacitors C11 and C12 respectively connected to the open-loop RF leakage detection sensing chip, a resistor R9 connected in series with capacitor C10, and an inductor L1 connected in series with capacitor C11. After being connected, capacitor C12 and inductor L1 are respectively connected to the filtering unit and the echo signal monitoring circuit. The connection between capacitor C10 and resistor R9 is grounded. The filtering unit includes a resistor R11 and inductor L2 connected in series. The two ends of inductor L2 are grounded through capacitors C12 and C13 respectively. Inductor L2 is connected to the transmit signal amplification circuit.

[0012] Preferably, the transmit signal amplification circuit includes a resistor R11, a capacitor C14, and an integrated circuit U3 connected in series. The integrated circuit U3 is connected to a high potential through a resistor R12 and to a low potential through a capacitor C15. The integrated circuit U3 has a ground terminal and is connected to the radio frequency oscillation circuit. The radio frequency oscillation circuit includes an integrated circuit U4 and a capacitor C16 connected in parallel to the integrated circuit U3. The integrated circuit U4 is connected to a high potential through a resistor R14 and to a low potential through a capacitor C18. The integrated circuit U4 has a ground terminal and is connected to the frequency modulation voltage control circuit.

[0013] Preferably, the frequency modulation voltage control circuit includes a resistor R13, an inductor L3, and a capacitor C19 connected in series. One end of the resistor R13 and one end of the capacitor C19 are respectively connected to the two ends of the radio frequency oscillation circuit. A diode D2 and a diode D3 connected in series are connected in parallel on the inductor L3. The positive terminals of diodes D2 and D3 are both grounded. A connection point connected to the MCU unit is provided between the capacitor C19 and the negative terminal of the diode D3. The MCU processing unit includes a resistor C20 connected to the connection point, an integrated circuit U1A connected to the resistor C20, and a resistor R5 connected to the integrated circuit U1A. The integrated circuit U1A is grounded through a capacitor C27. The integrated circuit U1A and the resistor R5 are grounded through a capacitor C1. The resistor R5 is connected to the receiving signal amplification circuit.

[0014] Preferably, the receiving signal amplification circuit includes an integrated circuit U1B, and the echo signal monitoring circuit includes an echo signal monitoring chip. The echo signal monitoring chip has pins that are connected to the receiving signal amplification circuit through a resistor R8. The resistor R8 and the integrated circuit U1B are grounded through a resistor R7.

[0015] The advantages of this invention are: by designing an integrated, compact, multi-channel point-to-point switching sensing device, it can detect multiple media at multiple frequencies and can measure both conductive and non-conductive liquid and solid media. It can quickly, effectively, and reliably detect both high-dielectric-constant and low-dielectric-constant materials, achieving a wide range of material media adaptability, economy, durability, easy installation, real-time tracking of working status, and convenient maintenance. Attached Figure Description

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0017] Figure 1 This is a schematic diagram of the structure of a point-to-point switch intelligent sensing device according to the present invention.

[0018] Figure 2This is a circuit block diagram of the open-loop radio frequency leakage detection sensing circuit in a point-to-point switch intelligent sensing device of the present invention.

[0019] Figure 3 This is a circuit diagram of an open-loop radio frequency leakage detection sensing circuit in a point-to-point switch intelligent sensing device of the present invention.

[0020] In the diagram: 1-Top cover, 2-First sensor protective cover, 3-Second sensor protective cover, 4-Control processor circuit board, 5-Indicator light, 6-Connecting sensor, 7-Fixed interface component, 8-Main cavity structure, 9-Container side, 10-Media detection sensor, 11-Connection part, 101-Open-loop RF leakage detection sensing unit, 102-Filtering unit, 103-Transmit signal amplification circuit, 104-RF oscillation circuit, 105-Frequency modulation voltage control circuit, 106-MCU unit, 107-Receive signal amplification circuit, 108-Echo signal monitoring circuit. Detailed Implementation

[0021] The point-to-point intelligent sensing device of the present invention includes a housing structure, a control processor circuit board 4 disposed within the housing structure, an open-loop radio frequency leakage detection sensing circuit disposed on the control processor circuit board, an access sensor 6 disposed at the front end of the control processor circuit board and connected to the control processor circuit board, a medium detection sensor 10 connected to the access sensor, and an indicator light 5 disposed at the rear end of the control processor circuit board and connected to the control processor circuit board. The housing structure includes a front part, a middle part, and a rear part of the housing from front to back. The control processor circuit board is located in the front part and the middle part of the housing. The front end of the control processor circuit board is located in the front part of the housing, and the indicator light is located in the rear part of the housing. The middle part of the housing is embedded or threaded into the front part of the housing, and the rear part of the housing is engaged or threaded into the middle part of the housing.

[0022] The front of the housing, from front to back, includes a container side 9, a main cavity structure 8 directly connected to the container side, and a fixing interface 7 that engages or is embedded in the main cavity structure. The middle part of the housing is embedded in or threaded onto the fixing interface. The middle part of the housing consists of two semi-cylindrical sleeve-shaped first sensor protective covers 2 and second sensor protective covers 3 combined into a complete cylindrical sleeve-shaped structure. Both the first and second sensor protective covers are provided with connecting parts 11 that are embedded in or threaded onto the fixing interface. The rear of the housing is a semi-transparent ABS plastic top cover 1, with an indicator light located inside the top cover. The indicator light 5 is a 360-degree ring-shaped, multi-color LED status indicator component.

[0023] like Figure 1As shown, the front end of the point-to-point switch sensing device consists of a medium detection sensor 10, a container side 9, and an access sensor 6. The access sensor 6 is fixed on the control processor circuit board 4, featuring a compact design. The control processor circuit board 4 also incorporates an open-loop radio frequency leakage detection sensing circuit. The control processor circuit board 4 adopts a rigid circuit board structure and is fixed by two identical stainless steel first sensor protective covers 2 and second sensor protective covers 3, which are sealed using laser welding technology, providing a high level of protection. This allows for isolation and protection of the control processor circuit board in complex industrial process environments such as high temperature, high humidity, high pressure, and high dust concentration. The top cover 1 is made of semi-transparent ABS plastic, allowing real-time identification of the 360-degree ring-shaped multi-color LED status indicator component located on the top of the control processor circuit board. Different colored LED status indicators distinguish the operating status of the device, helping users to monitor the status of the sensing device (including normal and abnormal operating states) in real time. The main cavity structure 8 and the fixed interface component 7 constitute the inner cavity of the device. It is made of stainless steel, and the strength of the material is sufficient to ensure that the internal structure of the device remains intact and can be measured stably even when large particles are dropped.

[0024] The aforementioned open-loop radio frequency leakage detection sensing circuit includes an open-loop radio frequency leakage detection sensing circuit unit 101, a filter unit 102 connected to the open-loop radio frequency leakage detection sensing circuit unit, a transmit signal amplification circuit 103 connected to the filter unit, a radio frequency oscillation circuit 104 connected to the transmit signal amplification circuit, a frequency modulation voltage control circuit 105 connected to the radio frequency oscillation circuit, an MCU unit 106 connected to the frequency modulation voltage control circuit, a receive signal amplification circuit 107 connected to the MCU unit, and an echo signal monitoring circuit 108 connected to the receive signal amplification circuit. The echo signal monitoring circuit is connected to the open-loop radio frequency leakage detection sensing circuit unit. Figure 2 As shown, the MCU unit 106 sends a control signal to the frequency modulation voltage control circuit 105, and outputs a controllable voltage signal to the RF oscillation circuit 104. After being amplified by the first-stage transmitting amplifier circuit 103, the RF signal undergoes signal conditioning processing by the filtering unit 102, and is then sent to the open-loop RF leakage detection sensing unit 101 for measurement original signal matching processing. The open-loop RF leakage detection sensing unit 101 sends the feedback signal back to the echo signal monitoring circuit 108. The conditioned and converted voltage signal is processed by the next-stage receiving signal amplification circuit 107, and the feedback signal to be judged is sent back to the MCU unit 106 for valid signal judgment and output. This completes one detection and measurement cycle.

[0025] like Figure 3As shown, the aforementioned open-loop RF leakage detection sensing circuit unit includes an open-loop RF leakage detection sensing chip, capacitors C11 and C12 connected to the open-loop RF leakage detection sensing chip, a resistor R9 connected in series with capacitor C10, and an inductor L1 connected in series with capacitor C11. Capacitor C12 and inductor L1 are connected to the filtering unit and the echo signal monitoring circuit, respectively. Capacitor C10 and resistor R9 are grounded. The filtering unit includes a resistor R11 and inductor L2 connected in series. The two ends of inductor L2 are grounded through capacitors C12 and C13, respectively. Inductor L2 is connected to the transmit signal amplification circuit.

[0026] The aforementioned transmit signal amplification circuit includes a resistor R11, a capacitor C14, and an integrated circuit U3 connected in series. Integrated circuit U3 is connected to a high potential via resistor R12 and to a low potential via capacitor C15. Integrated circuit U3 has a ground terminal and is connected to the radio frequency (RF) oscillation circuit. The RF oscillation circuit includes an integrated circuit U4 and a capacitor C16 connected in parallel to integrated circuit U3. Integrated circuit U4 is connected to a high potential via resistor R14 and to a low potential via capacitor C18. Integrated circuit U4 has a ground terminal and is connected to the frequency modulation voltage control circuit.

[0027] The aforementioned frequency modulation voltage control circuit includes a resistor R13, an inductor L3, and a capacitor C19 connected in series. One end of resistor R13 and one end of capacitor C19 are respectively connected to the two ends of the RF oscillation circuit. A diode D2 and a diode D3 connected in series are connected in parallel with inductor L3. The anodes of diodes D2 and D3 are both grounded. A connection point for connecting to the MCU unit is provided between capacitor C19 and the cathode of diode D3. The MCU processing unit includes a resistor C20 connected to the connection point, an integrated circuit U1A connected to resistor C20, and a resistor R5 connected to integrated circuit U1A. Integrated circuit U1A is grounded through capacitor C27. Integrated circuit U1A and resistor R5 are grounded through capacitor C1. Resistor R5 is connected to the receiving signal amplification circuit.

[0028] The aforementioned receiving signal amplification circuit includes integrated circuit U1B, and the echo signal monitoring circuit includes an echo signal monitoring chip. The echo signal monitoring chip has pins that are connected to the receiving signal amplification circuit through resistor R8. Resistor R8 and integrated circuit U1B are grounded through resistor R7.

[0029] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited to the listed embodiments. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in the present invention, based on the technical solution and concept of the present invention, shall fall within the scope of protection of the present invention.

Claims

1. A point-to-point switch intelligent sensing device, characterized in that: The point-to-point switch intelligent sensing device includes a housing structure, a control processor circuit board disposed within the housing structure, an open-loop radio frequency leakage detection sensing circuit disposed on the control processor circuit board, an access sensor disposed at the front end of the control processor circuit board and connected to the control processor circuit board, a medium detection sensor connected to the access sensor, and an indicator light disposed at the rear end of the control processor circuit board and connected to the control processor circuit board. The housing structure comprises, from front to back, a front housing, a middle housing, and a rear housing. The control processor circuit board is located in the front housing and the middle housing. The front end of the control processor circuit board is located in the front housing. The indicator light is located in the rear housing. The middle housing is embedded in or threaded into the front housing. The rear housing is engaged with or threaded into the middle housing. The open-loop radio frequency leakage detection sensing circuit includes an open-loop radio frequency leakage detection sensing circuit unit, a filtering unit connected to the open-loop radio frequency leakage detection sensing circuit unit, a transmit signal amplification circuit connected to the filtering unit, a radio frequency oscillation circuit connected to the transmit signal amplification circuit, a frequency modulation voltage control circuit connected to the radio frequency oscillation circuit, an MCU unit connected to the frequency modulation voltage control circuit, a receive signal amplification circuit connected to the MCU unit, and an echo signal monitoring circuit connected to the receive signal amplification circuit. The echo signal monitoring circuit is connected to the open-loop radio frequency leakage detection sensing circuit unit.

2. The intelligent sensing device for point-to-point switching quantities as described in claim 1, characterized in that: The front part of the housing includes, from front to back, a container side, a main cavity structure directly connected to the container side, and a fixing interface piece that engages with or is embedded in the main cavity structure. The middle part of the housing is embedded in or threaded onto the fixing interface piece.

3. The intelligent sensing device for point-to-point switching quantities as described in claim 2, characterized in that: The middle part of the housing is composed of two semi-cylindrical sleeve-shaped first sensor protective covers and second sensor protective covers combined into a complete cylindrical sleeve-shaped structure. Both the first sensor protective covers and the second sensor protective covers are provided with connecting parts that are embedded or threaded onto the fixed interface component.

4. The intelligent sensing device for point-to-point switching quantities as described in claim 1, characterized in that: The rear of the housing is a semi-transparent ABS plastic top cover, and the indicator light is located inside the top cover. The indicator light is a 360-degree ring-shaped multi-color LED status indicator component.

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